Khoo Chun Yong _Presentation.pdf
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Transcript of Khoo Chun Yong _Presentation.pdf
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Interview Session
Self Introduction
Khoo Chun Yong
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Malaysian D.O.B: February 6, 1983 Age: 31 years old Horoscope: Aquarius
Born in Klang The Royal City, Selangor, Malaysia
Raised up in Banting, a small town
Biography
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Universiti Teknologi Malaysia (UTM) Bachelor of Engineering (Hons) (Mechanical -
Materials) Optimization of Duplex Black Chromium Coating
for Solar Applications
Master of Engineering (M.Eng.) by Research (Mechanical)
Fabrication of Laser Crystal for Electro-Optics Application
National Taipei University of Technology (NTUT), Taipei, Taiwan Ph.D., Department of Energy and Refrigerating Air-
Conditioning Engineering Experimental Study on the Moisture Removal of
Wafer Carrier
Educational Background2001
|2006
2006|
2009
2009|
2014
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Languages + Dialects
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Employment History1. Company Name : Center for Cleaning Technology (CCTR), National Taipei University of Technology Position Title : Field Certifier / Third Party Verification Examiner Specialization : Field certification - Biological safety cabinet / Third party verification - Biological safety
laboratory, Hospital, Pharmaceutical, Clean spaces, etc. Industry : Building Services Duration : September 2009 Present Work Description Responsibilities : Perform various performance tests identified in the NSF/ANSI Standard 49
Perform various performance tests identified in the ISO 14644 Standards, Standards/Guidelines published by CDC TW, etc.
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Employment History2. Company Name : Shimano Components (M) Sdn. Bhd. Position Title : Industrial Interns & Junior Engineer Assistant Specialization : Value Engineering (Heat Treatment Low Carbon Steel) Industry : Manufacturing Duration : January 2005 June 2005 Work Description Responsibilities : Perform product failure testing and analysis.
Monitor product quality improvement project. Initiate course information and materials for internal employees job training. Develop work instructions for heat treatment processes of various steel parts.
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Employment History
3. Company Name : Airgate (M) Sdn. Bhd. a. Position Title : Site Supervisor Specialization : Clean Space Industry : Consultation and Construction Duration : March June 2004 Work Description Project Involved : Construction of Spray Paint Production Line (in Ipoh) Responsibilities : Supervise the progress of clean space construction including various performance
testing, rectification of structure defects or uneven finishes checking based on engineering drawing, approval rules and clients notification.
Prepare handover documents for main contractor and client. Involve in the testing and commissioning of at-rest clean space
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Part of My Thesis
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EXPERIMENTAL STUDY ON THE MOISTURE CONTROL IN WAFER CARRIER
PRESENTED BY: KHOO CHUN YONG
GUIDING PROFESSOR: PROF. HU SHIH-CHENGDATE: JULY 31, 2014
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Introduction
Front Opening Unified Pods (FOUPs), the polymeric-based wafer carrier, have three (3) critical performance functions:
1. The FOUP must exhibit precise wafer access for reliable, high throughput wafer transfer.
2. The FOUP must provide secure wafer protection, keeping the wafer isolated from contamination and damage due to mechanical or electrical effects.
3. The FOUP must enable reliable interoperability with process tools and automated material handling systems (AMHS)
(Niebeling, 2000)
10
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Introduction
Moisture inside a FOUP is also a problematic contaminant : More difficult to be expelled than oxygen - ingress of moisture through the wall
surfaces of the polymeric based FOUP. Polarity - moisture adsorbs onto metallic surfaces strongly relative to other
gases, cannot be effectively removed with inert gas purging. Strong hydrogen bonding ability - moisture can attract polar contaminants to the
surface.(Rana et al, 2003 ; Verghese et al.,1999)
11
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Introduction
FEOL Process Impurities
Oxygen Moisture Organic Acid Dopant
Copper seed to plate
interface
X X X
Exposed copper corrosion X X X X
Gate oxide X X X
Hemispherical grained
(HSG) poly-Si
X X X
Ultra shallow junction X X X X
SiGe epitaxy (EPI) X X X
EPI / Pre-EPI X X X
Salicide / contact formation X X X X
Table: Advanced processes (below 45 nm node) with high sensitivity to impurities.
12
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Introduction
Transition of 300 mm towards 450 mm wafer manufacturing, thestringent cleanliness requirement of a 450 mm wafer FOUP includes:
AMC, Oxygen ( 100 ppm), and moisture contents (relative humidity, RH 5%) (ITRS, 2013)
Studies and investigations reported on 450 mm FOUP and other correlated mechanical devices are considered scarce.
Hence, it is believed to be beneficial in studying and developing the state-of-the-art for the associated hardware.
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Objectives
The objectives of the study are as follows:
450 mm PC FOUP To investigate the effect of CDA purging rates on purging efficiency.
300 mm FOUP To investigate the effect of different base materials on purging
efficiency.
14
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Experimental parameters
* Only one Logger was drawn due to the simplification of schematic diagram.
* (5 pieces)
Parameter 300 mm FOUP 450 mm FOUP
Material base PC (alpha version)LCP (alpha version)
Barrier (Commercial)
PC (alpha version)
CDA Flow rate 15 to 105 LPM 30 to 180 LPM
No. of inlets/ outlets
2inlets-2outlets, 2inlets-2outlets,
Purging time 30 minutes 30 minutes
Recovery time 90 minutes 90 minutes*Alpha version: a preview version or an early version of aproduct that under the development status, most likely unstable,but is useful to show what the product will do to a selectedgroup. [Wikipedia]
Moisture Transmitter
WaferDiameter 300 mm 450 mm
Thickness 775 m 925 m
Area 706 cm2 1,589 cm2
Volume 32 L 73.5 L
Weight 125 g 342 g
10 mm Die /Wafer
640 1490
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Results and Discussion
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1. Moisture Depletion in 450 mm PC FOUP
TCRI
TCRI =FOUP Volume (L)
Flow Rate (LPM) X 60 (sec)
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2. Moisture Depletion in 300mm PC FOUP (based on testing conditions)
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19
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20
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Conclusions
For a 450 mm PC FOUP, Higher purging rates of CDA demonstrate favorable moisture
depletion rate within the spaces between wafers in a fully loaded FOUP. - Convection of purging gas : dominant mode of mass transfer in early stage, and - Diffusion of purging gas into the tiny spaces between wafer slots later
21
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Conclusions
For 300 mm FOUPs, Base materials show significant effects on purging efficiency.
Moisture decay trend: PC
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Thank you for your attention.
Q & A
Khoo Chun YongBiography Educational BackgroundLanguages + DialectsEmployment HistoryEmployment HistoryEmployment HistoryPart of My ThesisExperimental Study on the Moisture Control in Wafer CarrierIntroductionIntroduction Introduction Introduction ObjectivesExperimental parametersResults and Discussion1. Moisture Depletion in 450 mm PC FOUP2. Moisture Depletion in 300mm PC FOUP (based on testing conditions) Slide Number 19Slide Number 20ConclusionsConclusionsThank you for your attention.Q & A