June 2017 Alexey Sergeev Application Engineer, Intel · PDF fileAlexey Sergeev Application...

NVM Solutions Group

June 2017

Alexey Sergeev

Application Engineer, Intel NVM Solutions Group

NVM Solutions Group

Legal Disclaimer

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions

marked "reserved" or "undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The information here is subject to change without notice. Do not finalize a design with this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized

errata are available on request.

Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Performance varies depending on system

configuration. No computer system can be absolutely secure. Check with your system manufacturer or retailer or learn more at intel.com.

Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness for a particular purpose, and non-infringement, as well as any

warranty arising from course of performance, course of dealing, or usage in trade.

Tests document performance of components on a particular test, in specific systems. Differences in hardware, software, or configuration will affect actual performance. Consult other sources

of information to evaluate performance as you consider your purchase.

Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit the

referenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflect performance of

systems available for purchase.

Intel, the Intel logo, and Optane are trademarks of Intel Corporation in the U.S. and other countries.

*Other names and brands may be claimed as the property of others.

Copyright © 2017 Intel Corporation. All rights reserved.

66

67NVM SOLUTIONS GROUP 67NVM SOLUTIONS GROUP

The Growth Cycle Opportunity

Memory and storage are at the

center of Intel’s strategy

Strategic position drives an

absolute commitment to

continued innovation

Deep understanding of full data

path means best positioned for

innovation


Cost Delay MORELESSHIGHERLOWER

Intel Technology Innovations Fill the Memory and Storage Gap Performance and Capacity for Every Need

Intel® Optane™

Technology

Higher

performance

Intel 3D NANDTechnology

Lower cost & higher

density

68NVM SOLUTIONS GROUP


Cost Delay MORELESSHIGHERLOWER

Intel® SSDs for the Spectrum of Data Center Needs


Intel® 3D NANDSSDs

Optimize Storage – Transition to

a scalable, built-for SSDs

interface (PCIe*/NVMe*) to

optimize both application

performance and TCO

Modernize Storage - Utilize

legacy infrastructure with SATA-

based SSDs that accelerate

applications and reduce TCO

Intel® Optane™

SSDs

Extend Memory – Gain new

insights from data by

augmenting DRAM to increase

memory pool size or reduce cost

by replacing some of the DRAM

set

Fast Storage and Cache – Break

through storage bottlenecks to

significantly increase scale per

server


Intel Leadership in Flash Cell Technology

1.5µm

1985-1989

1.0µm

0.8µm

0.6µm

1990-1994

0.4µm

0.25µm

1995-1999 2000-2004

0.13µm

0.18µm 90nm 65nm

50nm

45nm

34nm

2005-2009

25nm

20nm

16nm

3D

2010-2014 2016

NOR Flash Memory NAND Flash Memory

30+ years of flash cell scaling experience


Intel 3D NAND Delivers Highest Areal Density

1) Source – Intel. Measured data. Comparing Intel 32 tier TLC NAND die (Pleasant Star) to Samsung 32 tier TLC NAND die.

2) Source: Intel data based on internal analysis. Data regarding representative competitors based on 2017 IEEE International Solid-State Circuits Conference papers citing Samsung Electronics and Western Digital/Toshiba die sizes for 64-stacked 3D

NAND component.

Scale to bigger capacities

Intel 32T/TLC1

2.86Gb/mm

Other 32T/TLC1

2.57Gb/mm

Manufacturing efficiency

>11%Higher areal

density2

More

GBper wafer

AdvantagesR

epla

ce

ment

Gate

Arr

ay

Arr

ay


Intel 3D NAND is Built on a Proven Cell Technology

Discrete chargestorage node

Vertical Floating Gate Flash Cell

Word lines

Isolationbetween cells

Floating gate (cutaway view)

High reliability and strong protection from charge loss


Intel 3D NAND Solutions Reach Across Multiple Segments

*Other names and brands may be claimed as the property of others.

Data Center

High Performance

Intel® SSD DC

P3520 Series

Intel® SSD DC

P3100 Series

Mainstream

Intel® SSD DC

S3520 Series

Embedded

Commercial

Intel® SSD

E 6000p Series

Intel® SSD

E 7000s Series

Clients

Business

Intel® SSD Pro

6000p Series

Consumer

Intel® SSD 600p

Series

75NVM SOLUTIONS GROUP 75

Pairing a new Intel developed controller, unique firmware innovations and disruptive

capacities with Intel 3D NAND, the cloud inspired DC P4500 and DC P4600 have been

designed from the ground up to deliver an all-PCIe* solution enabling highly efficient

storage and caching to help data centers do more per server, minimize service

disruptions and efficiently manage at scale.

NVM Solutions Group 76

MEMOR

YLatency: 1X

Size of Data: 1X

SRAMLatency: ~10X

Size of Data: ~100X

DRAM

Storage

Latency: ~10 Million X

Size of Data: ~10,000X

HDD

Technology claims are based on comparisons of latency, density and write cycling metrics amongst memory technologies recorded on published specifications of in-market memory products against internal Intel specifications.

Latency: ~100,000X


NAND SSD3D XPoint™

Latency: ~100X


3D Xpoint™ MEMORY MEDIABreaks the memory/storage barrier

+


5-8x faster at low Queue

Depths1

Vast majority of applications

generate low QD storage

workloads

1. Common Configuration - Intel 2U PCSD Server (“Wildcat Pass”), OS CentOS 7.2, kernel 3.10.0-327.el7.x86_64, CPU 2 x Intel® Xeon® E5-2699 v4 @ 2.20GHz (22 cores), RAM 396GB DDR @ 2133MHz. Configuration

– Intel® Optane™ SSD DC P4800X 375GB and Intel® SSD DC P3700 1600GB. Performance – measured under 4K 70-30 workload at QD1-16 using fio-2.15.

Breakthrough Performance

Tests document performance of components on a particular test, in specific systems. Differences in hardware, software, or configuration will affect actual performance.


up to 60X better at 99% QoS1

Ideal for critical applications with

aggressive latency requirements

1. Common Configuration - Intel 2U PCSD Server (“Wildcat Pass”), OS CentOS 7.2, kernel 3.10.0-327.el7.x86_64, CPU 2 x Intel® Xeon® E5-2699 v4 @ 2.20GHz (22 cores), RAM 396GB DDR @ 2133MHz. Configuration

– Intel® Optane™ SSD DC P4800X 375GB and Intel® SSD DC P3700 1600GB. QoS – measures 99% QoS under 4K 70-30 workload at QD1 using fio-2.15.

Predictably Fast Service



Responsive Under Load

up to 40X faster

response time

under workload1

Consistently

amazing response

time under load

1. Responsiveness defined as average read latency measured at queue depth 1 during 4k random write workload. Measured using FIO 2.15. Common Configuration - Intel 2U PCSD Server (“Wildcat Pass”), OS CentOS

7.2, kernel 3.10.0-327.el7.x86_64, CPU 2 x Intel® Xeon® E5-2699 v4 @ 2.20GHz (22 cores), RAM 396GB DDR @ 2133MHz. Configuration – Intel® Optane™ SSD DC P4800X 375GB and Intel® SSD DC P3700

1600GB. Latency – Average read latency measured at QD1 during 4K Random Write operations using fio-2.15.



Moving towards a Persistence

Hierarchy

The three different Performance/Capacity Solutionswill work together in future platforms

Sources: “Storage as Fast as the rest of the system” 2016 IEEE 8th International Memory Workshop and measurement, Intel® Optane™ SSD measurements and Intel P3700 measurements, and technology projections


Intel is a Proven and Trusted Supplier

Validated on a massive scale1

1,000s of drives

>5,000 workloads

1,000s of configurations

>1M power cycles

1) Source – Intel Quality and Validation group. Validated beyond JEDED standards.

2) Source – Intel. Actual measurement of percent shipments for all Intel® SSD products that arrive on committed delivery date.

3) Source – Intel. Intel 2015 Customer Excellence Program survey.

Deliveredon time

92% delivery to commit2

Expert post-sales support

Customers rate Intel post-sales

support as world-class3

Worldwide phone, chat, email,

online community support in 11

languages

Platform-wide expertise

NVM Solutions Group

June 2017 Alexey Sergeev Application Engineer, Intel · PDF fileAlexey Sergeev Application...

Documents

Transcript of June 2017 Alexey Sergeev Application Engineer, Intel · PDF fileAlexey Sergeev Application...