Joint Undertakings: New opportunities for funding of ...

1IKT

Joint Undertakings: New opportunities for funding of European cooperative ICT projects

Per G. GløersenSINTEF ICT

Microsystems and Nanotechnology

MUT workshop, NTNU, Trondheim 09.05.2008

2IKT

European Technology Platforms

European Technology Platforms (ETPs) have been set up in a number of areas where Europe's competitiveness, economic growth and welfare depend on important research and technological progress in the medium to long term. They bring together stakeholders, under industrial leadership, to define and implement a Strategic Research Agenda (SRA) The ETPs have contributed to the definition of the themes of the Cooperation programme, in particular in research areas of special industrial relevance. The implementation of the SRA will be supported by the Cooperation programme in areas where they constitute true European added value.

http://cordis.europa.eu/technology-platforms/home_en.html

3IKT

ETP: status

Advanced Engineering Materials and Technologies- EuMaTAdvisory Council for Aeronautics Research in Europe - ACARE Embedded Computing Systems - ARTEMISEuropean Construction Technology Platform -ECTP European Nanoelectronics Initiative Advisory Council - ENIACEuropean Rail Research Advisory Council -ERRAC European Road Transport Research Advisory Council - ERTRAC European Space Technology Platform - ESTP European Steel Technology Platform - ESTEP European Technology Platform on Smart Systems Integration - EPoSS Food for Life - Food Forest based sector Technology Platform -Forestry Future Manufacturing Technologies -MANUFUTURE

Future Textiles and Clothing - FTC Global Animal Health - GAH Hydrogen and Fuel Cell Platform - HFP Industrial Safety ETP - IndustrialSafetyInnovative Medicines for Europe - IME Integral Satcom Initiative - ISI Mobile and Wireless Communications - eMobilityNanotechnologies for Medical Applications -NanoMedicineNetworked and Electronic Media - NEM Networked European Software and Services Initiative - NESSI Photonics21 - Photonics Photovoltaics - PhotovoltaicsPlants for the Future - Plants Robotics - EUROP Sustainable Chemistry - SusChemWater Supply and Sanitation Technology Platform - WSSTP Waterborne ETP - Waterborne Zero Emission Fossil Fuel Power Plants - ZEP

N.Lehner, April 29th, 2008 4

2000 20201980

10μm

1μm

100nm

10nm

1nm2040

Beyond CMOS

20601960

Moore’s Law

Radio-Frequency

High-Voltage

MST / MEMS

More than Moore

ENIAC SRA: Technical solutions corresponding toits multi-dimensional technology roadmap

••• 5

ARTEMIS- ETP Strategic Research Agenda

ARTEMIS envisages cross-application solutions

Foun

datio

nal s

cien

ce &

te

chno

logy

Foun

datio

nal s

cien

ce &

te

chno

logy

Res

earc

h D

omai

ns

Application Contexts

IndustrialIndustrial Nomadic Environ-ments

Nomadic Environ-ments

Private SpacesPrivate Spaces

Public Infra-

structure

Public Infra-

structure

Reference Designs & ArchitecturesReference Designs & Architectures

Seamless Connectivity & MiddlewareSeamless Connectivity & Middleware

System Design Methods & ToolsSystem Design Methods & Tools

Common objectives:

Design Efficiency

Ease of Use

High added value

Time to market

Modularity

Safety / Security

Robustness

Competitiveness

Innovation

Cost reduction

Interoperability

Common objectives:

Design Efficiency

Ease of Use

High added value

Time to market

Modularity

Safety / Security

Robustness

Competitiveness

Innovation

Cost reduction

Interoperability

6IKT

EPoSS: Smart Integrated Systems

Integrated smart systems are able to sense and diagnose a situation, communicate and interact with other smart systems, and may be able to predict and therefore able to decide or support decision-making. Such perceptive and cognitive miniaturized systems can be networked, energy-autonomous and implantable.

Protection / Encapsulation

ActCommunicate

Network

Power

DiagnosePredictDecide

Sense


ActCommunicate

Network

Power


Sense


ActCommunicate

Network

Power


Sense

7IKT

Smart Integrated Systems: Value chain and impacted application areas

8IKT

Norwegian industrial ENIAC / EPoSS players (1)Automotive:

Infineon SensoNorAeronautics and aerospace

MemscapNorspaceOSI OptoelectronicsPresens

TelecomIgnisTI ChipconNordic SemiconductorsAtmelEnergy Micro

MedTech and BiochemicalIn vitro

NorchipAxis ShieldGE HealthcareLing VitaeGENOLifeCareAlertisGamma Medica-IdeasBiomolex

In vivoAmersham Health (GE Healthcare)MisonFastGE Vingmed SoundMedistimMemscap

9IKT

Norwegian industrial ENIAC / EPoSS players (2)

Logistics / RFIDTomra (RFID in recycling)Titech Visionsort (recycling of textiles, RFID in food industry)Idex ASA (biometric identification)Sonitor (Real Time Localization Systems in Healthcare)Q-Free (Road-user charging)

10IKT

Joint Technology Initiatives (JTI) and Joint Undertakings (JU)

In a limited number of cases, the scale of a research or technological objective and the resources involved justify setting up long-term public-private partnerships in the form of Joint Technology Initiatives and Joint Undertakings (ref. article 171 in EC Treaty). The JUs, mainly resulting from the work of European Technology Platforms and covering selected aspects of research in their field, will combine private sector investment and national and European public funding, including grant funding from the Research Framework ProgrammeENIAC and ARTEMIS have established the JTIs AENEAS and ARTEMISIA and corresponding JUsEPoSS is about to launch CEPoSS, a project which aims at establishing a JU

••• 11

Implementing a Strategic Research Agenda

Research Council, FP7 CP, Joint Technology Initiative, Eureka, Private

Implementation pathSRA Vision

2020-5/7+years

-5/3 years

-3years

“Upstream”R&D

(Nat’l programmes, FP7)

“Downstream”R&D

(Eureka/nat’l, industry partnerships)

Near-marketR&D

(EIB, …)

• Int’l cooperation (IMS, …)• Skills• Infrastructure needs

• Standards• Access to infrastructures

• Business agreements• Pilots• Market studies• State aid cases

ETP communityof stakeholders

+ + +

••• 12

• Industrially-driven applied research programme incl. application areas• Large initiatives to increase critical mass

• High level of SME participation

• Long term strategic partnerships

• Budget certainty, fast cycle time, decentralisation

• Common approach, common processes and co-funding by MS and Commission towards common goals

• Increased R&D funding

Boosting the competitiveness of EU industry whilst building the European Research Area

Characteristics of ARTEMIS and ENIAC JTIs

••• 13

• Bodies set up by the Community (ref. article 171)• Duration: until 31-12-2017• Seat: Brussels • Members: Industry, European Community, a set of Member

States and Associated Countries• Objectives

– Define and implement a Research Agenda– Support R&D activities (Calls for Proposals)– Promote the public-private partnership (increase investments)– Achieve synergy and coordination with other European R&D– Promote the involvement of SMEs

Joint Undertakings:Implementation of ARTEMIS & ENIAC JTIs

••• 14

ARTEMIS/ENIAC JU: Who is involved ?

EC

Member States

&

Associated

Countries

General Assembly

Steering Board

Governing BoardStrategy and rules of operation, supervision

(Votes: 50% industrial ass. & 50% PA’s)

Industry and Research Committee

Strategic planning

Public Authorities Board

Calls and project selection(Voting rights proportional

to € commitments)Working Groups

Executive DirectorOperations and finances

ResearchIndustry(incl. SME)

••• 15

ENIAC Member States

• Austria, Belgium, Czech Republic, Estonia, France, Germany, Greece, Hungary, Ireland, Italy, the Netherlands, Norway, Poland, Portugal, Spain, Sweden, the United Kingdom

17 Member States

••• 16

Steering Board: 3 SME’s, 9 Corporate members, 3 Research Organisations

AENEAS

Established in Paris (Association under French law)Dual purpose: Continuing ENIAC ETP activities, representing R&D actors in JUConstituency:

Chamber A: SMEs (fee 1000€ per year)Chamber B: Public Research Organisations (1000€)Chamber C: Corporate (5000€/10000€ depending on size)Associates (non-voting, 1000€)

+ variable contribution

••• 17

ARTEMIS Member States

• Austria, Belgium, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Ireland, Italy, the Netherlands, Norway, Portugal, Romania, Slovenia, Spain, Sweden, the United Kingdom

20 Member States

••• 18

Steering Board: 5 SME’s, 15 Large Companies, 5 Research Organisations

Presidium: Nokia, DaimlerChrysler, Philips, STMicroelectronics, Thales

ARTEMISIA

Established in Eindhoven (Association under Dutch law)Dual purpose: Continuing ARTEMIS ETP activities, representing R&D actors in JUConstituency:

Members A: SMEs (fee 1000€ per year)Members B: Public Research Organisations (1000€)Members C: Corporate (5000€/10000€ depending on size)Associates (non-voting, 1000€)

+ variable contribution

••• 19

ENIAC JU Multi-Annual Strategic Plan

More Moore

More than Moore

Heterogeneous Integration

Design Methods & Tools

Equipment & Materials

Beyond CMOS

3. Security &

Safety

1. Health &

Wellness

4. Energy &

Environm

ent

2. Transport & M

obility

6. Infotainment

5. Com

munication

7. Design Methods & Tools

8. Equipment & Materials

Industry priorities for 2013 and beyond

MASP Sub-Programmes


Health & wellness – JU topics

• Body sensors, wireless sensors, sensor networks and RF interfaces for tele-monitoring

• MEMS, NMEMS, bioMEMS and optical components• Nanofluidic sampling and transport for e.g. DNA/protein assay

and automated drug-delivery• Bio-compatible and bio-resistant materials and packages for

portable / in-vitro and implantable / in-vivo applications• Ultra-low power technologies and design, including energy

scavenging systems• Extreme reliability, quality and test on component and system

level under harsh conditions (prediction, EMI, radiation, parasitics)


Transport & mobility – JU topics

• High performance data processing using single- and multi-core components

• Smart power technologies for energy management with integrated processor, memory, power devices and sensors

• High power technologies e.g. for Hybrid Cars based on heterogeneous technologies (e.g. Si, SOI, SiC, GaN )

• Sensor and actuator components and systems based on heterogeneous substrates and functionalities (e.g. Si, SiGe / RF, antennas, optical, energy scavenging)

• Smart packages and high power modules for heterogeneous integration with extended power dissipation

• Reliability, quality and test on component and system level under harsh conditions (prediction, EMI, radiation, parasitics)


Security & safety – JU topics

• Technologies for trusted computing and privacy protection• Specific memories for codes and encryption• New embedded memories for smart cards• Extremely cost efficient components for “affordable security”• Power optimized technologies for attack-resistant data processing• Specific sensors for recognition and identification of individuals,

of situations and of dangerous goods (e.g. camera modules, biometrical sensors, radar)

• Autonomous sensing and communication networks


Energy & environment – JU topics

• Highly cost-effective wafer and chip HV-technologies for improved breakdown / switching / frequency performance and device density

• New materials and production technologies for high power components (e.g. SiC, SOI, GaN, extreme wafer thinning) and new isolation techniques (e.g. selective SOI for HV)

• Innovative silicon / package interconnection technology for improved heat dissipation (e.g. thick Cu metallization)

• Highly efficient thermal management and cooling technologies• Heterogeneous integration on wafer and package level of

sensors, LED, controllers, filters, actuators and power devices• Innovative system design and architecture for (solid-state)

lighting, AC/DC conversion and power drives


Communication – JU topics

• Innovative ultra-low power solutions, including new materials, substrate engineering, digital error correction, and embedded PMUs/ multicore architectures

• Platform-based technologies for highly efficient system design up to 150 GHz, including RFCMOS, BiCMOS, III-V and passives

• Low cost, low power solid state embedded and stand-alone mass storage memory

• Analog / RF / HV extensions at 65 nm and below• Cost-effective SiP and SoC co-optimization and design• Assessment of the limits of classic interconnect schemes and

development of new interconnect technologies (e.g. air gap, 3D, optoelectronic)


Infotainment – JU topics

• Technologies and devices for ambient intelligence environments and human interaction, including sensors and actuators such as MEMS and display drivers

• Ultra low power networks and devices• High-density, low power solid-state memories• Components for high-speed data transmission, compression

and storage systems• Technologies for multi-format encoding / decoding, data

distribution, and digital rights management• Technologies and devices for image and sound capture, analysis,

rendering, and quality improvement


Next steps

• Formulation and publishing of the first call (May 8th 2008)• Consortium building and proposal preparation - several workshops in April

and May:Security and Safety - April 18th; E&M and Manufacturing Science - April 22nd;Transport and Mobility, together with Energy and Environment - April 29th;Design Methods and Tools - May 6th.

• A next – more general workshop will take place in Paris on May 19th

• Search for the ENIAC JU Executive Director• Establishing the ENIAC JU Office in Brussels• Establishing the necessary subcontracts for facilitating the ENIAC JU

operations• Deadline for the first call is September 3rd

••• 27

Focus areas for the ENIAC 2008 and 2009 Calls

SP2. Nanoelectronics for Transport and MobilitySP3. Nanoelectronics for Security and Safety SP4. Nanoelectronics for Energy and Environment SP7. Design Methods and Tools for NanoelectronicsSP8. Equipment and Materials for Nanoelectronics

SP1. Nanoelectronics for Health and WellnessSP5. Nanoelectronics for CommunicationSP6. Nanoelectronics for Infotainment SP7. Design Methods and Tools for NanoelectronicsSP8. Equipment and Materials for Nanoelectronics

2008

2009

••• 28

ENIAC: Priorities for the WP 2008 – Call 1 (1)

• SP2. Nanoelectronics for Transport & Mobility (500 p/y – 25%)- Components and smart systems for assisted driving- Components and smart systems for advanced

engine/exhaust/combustion control- Power/HV electronics and smart systems for hybrid and electrical cars- Fail safe and fault tolerant electronic systems

• SP3. Nanoelectronics for Security & Safety (200 p/y – 10%)- Trusted devices and smart secure portable systems- All-in-one imaging sensors

• SP4. Nanoelectronics for Energy & Environment (400 p/y – 20%)- Intelligent drive control- Efficient power supplies and power management solutions

••• 29

ENIAC: Priorities for the WP 2008 – Call 1 (2)

• SP7. Design Methods & Tools for Nanoelectronics (300 p/y – 15%)- Device, circuit, and system variability and reliability- HW/SW model driven high-level synthesis/flow/reuse/design

• SP8. Equipment & Materials for Nanoelectronics (600 p/y – 30%)- Advanced line operation for European device makers- Lithography process for beyond 32nm manufacturing- Assembling technology for system-in-package

••• 30

ARTEMIS JU Sub-Programmes (1)

• SP1: Methods and Processes for Safety-relevant Embedded Systems– Embedded Systems for enhanced safety and efficiency

• Special relevance for the Transport & Manufacturing sectors

• SP2: Person-centric Health Management– Improved prevention, care, cure and well-being through Embedded

Systems• SP3: Smart Environments and Scalable Digital Services

– New (service / software) architectures for enhanced user experienceof (mobile) media and applications

– Enable the creation of new services that bring the “Ambient Intelligence” experience to the user

• SP4: Efficient Manufacturing and Logistics– Embedded Systems supporting sustainable, competitive, flexible

manufacturing, delivery and support of products over their complete life-cycle

••• 31

ARTEMIS JU Sub-Programmes (2)

• SP5: Computing Environments for Embedded Systems– New architectures and design paradigms for embedded systems– Transversal technology, with positive impact on all ES application domains

• SP6: Security, Privacy and Dependability(in Embedded Systems for Appliances/Networks/Services)– Protect the individual, the supplier and the (data) infrastructure from abuse– Protect the public at large (infrastructure protection)– Transversal technology, with positive impact on all ES application domains

• SP7: Embedded Technology for Sustainable Urban Life– Sustainable delivery of energy and other utilities– Improved energy use through cost-effective and

intelligent embedded systems (smart buildings).

• SP8: Human-centric Design of Embedded Systems– New ways to interact with technology– Easier-to-use, friendly electronics for home, work and play– Improved operator monitoring and control of transport and industrial systems

••• 32

Joint Undertaking:General principle of project financing

– Industrial:• at least 50% in-kind

– Participating States:• national contracts • possibility of cross-border funding

& subcontracting to other JU member participants

– Joint Undertaking:• In addition to

national payments

Total Costs > 6

2

> 3

1

2008-07-18 33

Betingelser for norsk finansiering

Hvem:Norske bedrifter med FoU-virksomhet i Norge

Bransjeforeninger

U&H, Forskningsinstitutter

Forutsatt erklært interesse fra norsk(e) bedrift(er)

Hvordan:Bedrifter må dokumentere planer for sin utnyttelse avprosjektresultater

UHI må angi relevans for norsk industri / norske bedrifter

1,5 mill. € til finansiering av norske deltagereFor hver av utlysningene

2008-07-18 34

Finansiering fra norsk side

Forskningsrådets og EU/JU-finansiering samlet:

50% for bedrifter, etter vurdering opp mot 66,7 % for SMB

66,7% for UHI

Andelene gjelder for prosjektet som helhet

Samme satser for alle typer aktiviteter

Budsjettering og regnskap etter norske regler

Søknad til Forskningsrådet uten omfattende dokumentasjon utover ARTEMIS / ENIAC-søknaden

Flere norske partnere: Felles søknad, én kontrakt med NFR

••• 35

Joint Undertaking funding flow

EC

MASMember &

Associated

States

Project

€ cash forrunning costs

€ cash forrunning costs and R&D

Research

Industry

In-kind for R&D work

€ for R&D€ for R&D

RCN: 1.5 M€ to finance Norwegianparticipants in each of the first calls of

AENEAS and ENIAC

••• 36

Budget of Joint Undertakings2008-2013

• Operating costs– ARTEMISIA/AENEAS: not exceeding 30m or 1% of R&D costs– Commission: not exceeding 10m– Member States and associated countries: in-kind

• Total R&D budget of the initiatives (total R&D costs in projects): – Community (FP7): ARTEMIS up to 410 million €– Community (FP7): ENIAC up to 440 million €– States: > 1.8x Community contribution– R&D actors: in-kind >50% of costs (50% in FP - ~65% in EUREKA)

ARTEMIS ~2.5 billion €, ENIAC ~3.0 billion €

••• 37

Eligibility Criteria (Proposals)

• It is submitted using the ENIAC Proposal Service (EPS)• It is received by the ENIAC JU before the deadline given in the call

text.• It is complete and the following elements are present in the

proposal as requested in the Guide for Applicants:– the administrative forms– the proposal description with all the mandatory sections

• It is submitted in English.• The content of the proposal relates to the topic(s) described in the

Annual Work Programme of the Call.

It must involve at least 3 non-affiliated legal entities established in at least 3 ENIAC member States

Only proposals that satisfy the above eligibility criteria are receivable and will be evaluated by the ENIAC Joint Undertaking.

••• 38

How to produce a proposal

• Build a consortium with minimum 3 independant entititiesfrom 3 ARTEMIS/ENIAC member states

• Propose a collaborative R&D project in scope with theARTEMIS/ENIAC Annual Work Programme (AWP)

• Consult the website (artemis.eu or eniac.eu) for practicalinstructions

• Use the ARTEMIS/ENIAC IT submission tool (not EPSS)• Important documents

– Annual Work Programme (Content, eval. Criteria, JU eligibility)– Guide for applicants (How to produce a proposal)– Call text (National eligibility criteria, National funding, JU

funding)

••• 39

Who can participate and get JU funding

• Legal entities from ARTEMIS/ENIAC Member States

• Legal entities from Member States and Associated Countries to FP7 (Switzerland, Israel, Iceland, Liechtenstein, Turkey, Croatia, the Former Yugoslav Republic of Macedonia, Serbia, Albania and Montenegro)

••• 40

Evaluation

• 4 independent evaluators • Consolidated evaluation report• Selection done by Public Authorities Board (PAB)• Evaluation criteria

– Relevance and contributions to the content and objectives of the Call

– R&D innovation and technical excellence– S&T approach and work plan– Market innovation and impact– Quality of consortium and management

••• 41

JTIs vs. Framework Programme: What’s different?

• Scope• Upstream vs. downstream• Funding rates• Industry – academia balance in consortia

• Public-private partnership approach• One vs. many in governance and decision making• One money pot vs. co-funding• FP has simpler rules

42IKT

Summary

Introduction to European Technology Platforms and Joint Undertakings within ICTEmphasis on ENIAC and EPoSSSources: presentations by

Isabel Vergara, European CommisionNorbert Lehner, Infineon Technologies (member of ENIAC support group)Tron Espeli, Research Council of Norway

More information:ENIAC: www.eniac.euARTEMIS: www.artemis.euEPoSS: http://www.smart-systems-integration.org/publicPresentations can be downloaded from: http://ict.euforskning.no/category/ENIAC.aspx

Joint Undertakings: New opportunities for funding of ...

Documents

Transcript of Joint Undertakings: New opportunities for funding of ...