Disclosure to Promote the Right To Information

Whereas the Parliament of India has set out to provide a practical regime of right to information for citizens to secure access to information under the control of public authorities, in order to promote transparency and accountability in the working of every public authority, and whereas the attached publication of the Bureau of Indian Standards is of particular interest to the public, particularly disadvantaged communities and those engaged in the pursuit of education and knowledge, the attached public safety standard is made available to promote the timely dissemination of this information in an accurate manner to the public.

इंटरनेट मानक

“!ान $ एक न' भारत का +नम-ण”Satyanarayan Gangaram Pitroda

“Invent a New India Using Knowledge”

“प0रा1 को छोड न' 5 तरफ”Jawaharlal Nehru

“Step Out From the Old to the New”

“जान1 का अ+धकार, जी1 का अ+धकार”Mazdoor Kisan Shakti Sangathan

“The Right to Information, The Right to Live”

“!ान एक ऐसा खजाना > जो कभी च0राया नहB जा सकता है”Bhartṛhari—Nītiśatakam

“Knowledge is such a treasure which cannot be stolen”

“Invent a New India Using Knowledge”

है”ह”ह

IS 193 (2000): Soft Solder [MTD 9: Lead, Zinc, Cadmium,Tin, Antimony and their Alloys]

Is 193:2000

,, -

Wi’Tfbm

~t!Rm-fa-RIR(m gm%wl)

Indian Standard

SOFT SOLDER — SPECIFICATION(FijM Revision)

ICS 77.120.60

0 BIS 2000

BUREAU OF INDIAN STANDARDSMANAK BHAVAN, 9 BAHADUR SHAH ZAFAR MARG

NEW DELHI 110002

Awe 2000 Price Group 2

l.cad, Zinc, Cadmium, Tin, Antimony and Their Alloys Sectional Committee, MTD 9

IXIREWORD

This Indian Standard (Fifth Revision) was adopted by the Bureau of Indian Standards, after the draft finalizedby the Lead, Zinc, Cadmium, Tin, Antimony and Their Alloys Sectional Committee had been approved bythe Metallurgical Engineering Division Council.

Tbc solders are alloys of lead and tin (usually also contain bismuth and small amounts of some otherincta[s) used for joining, to distinguish them from the copper base alloys used in brazing. The upper limitof melting range is about 300°C.

Jn ibis revision a new Grade Sn 15 is included for use in lamp manufacture where it is replacing morecxpcn.slvc grades containing h~gher tin content and clauses on supply of material, chemical composition,l’{)rnl ;md size and sampling have been modified.

l~or tlm purpose of deciding whether a particular requirement of this standard is complied with the finalval UC, observed or calculated, expressing the result of a test or analysis, shall be rounded off in accordancewill] IS 2:1960 ‘Rules for rounding off numerical values (revised)’. The number of significant places retainedin the rounded off value should be the same as that of the specified value in this standard,

AMENDMENT NO. 1 APRIL 2009

TO

IS 193 : 2000 SOFT SOLDER ― SPECIFICATION

( Fifth Revision )

(Page 1, clause 2) ― Insert the following at the appropriate place:

‘IS 11516 : 2005 Soft solder for electronic applications (first revision)’.

(Page 1, Table 1, Grade Sn 65, col 3) ― Substitute ‘0.50’ for ‘0.65’.

(Page 1, Table 1, Grade Sn 60, col 3) ― Substitute ‘0.50’ for ‘0.60’.

(Page 1, Table 1) ― Add the following Note at the end of the Table 1:

‘NOTE ― For any other grades such as Sn 63, Sn 62, see IS 11516.’

(Page 2, Table 2, Grade Sn 95 Sb 5, col 4) ― Substitute ‘0.10 Max’ for ‘0.07 Max’.

(MTD 9)

Reprography Unit, BIS, New Delhi, India

Is 193:2000

Indian Standard

SOFT SOLDER — SPECIFICATION

( Fifth Revision)

1 SCOPE

This standard covers the requirements of non-antimonial and antimortial soft selders for generaluse, solders for use at high temperature and specialapplications.

2 REFERENCES

The following standards contain provisions which[hrough reference in this text, constitute provision01” [his standard. At the time of publication, thecclitions indicated were valid. All standards arestthjcct to revision and parties to agreements basedon this standard are encouraged to investigate the

possibility of applying the most recent editions of(Iw standards indicated below:

1.SNo. Title

{y)~ : I959 Methods of chemical analysisof soft solder

998 Methods of chemical analysis ofsolder (soft and rosin cored):

(Part 1) :1983 Determination of tin andantimony (first revision)

(Part 2): 1983

(Part 3): 1983

1387:1993

Determination of iron, copperand arsenic (f7rst revision)

Determination of cadmium,zinc, aluminium, bismuth andnickel (@t revision)

General requirements for thesupply of’ metallurgicalmaterials (second revision)

3 SUPPLY OF MATERIAL

General requirements relating to supply of materialshall conform to IS 1387.

4 MANUFACIWRE

Soft solder shall be made from virgin metals orclean scrap.

5 CHEMICAL COMPOSITION

5.1 The material shall have the chemicalcomposition given in Tables 1, 2 and 3. Typical uscsand melting range of solders covered in Tables 1and 2 are given in Annex A for information.

Table 1 Tin-Lead Solders for General Use

Grade Non-Antimonial Solders, Percent

Sn Sb PbMu

Sn 65 65?0.5 0.65Sn 60 60 k 0.5 0.60Sn 50 50& 0.5 0.50Ss?45 45* 0.5 0.45

*I

Remainderso 40 40* 0.5 0.40Sn 35 35* 0.5 0.35Sn 30 30* 0.5 0.30Sn 20 20 k 0.5 0.20so 15’) 15*0.5 0.20

Grade Antimonial Solders, Percent

rSn

—-----)Sb Pb

Sn 50 Sb 50* 0.5 2.53.0

Sn 45 Sb 45 k 0.5 2.2-2.7

Sn 40 Sb 40+0.5 2.0-2.4

Sn 32 Sb 32 k 0.5 1.6-1.9

1

RemainderSn 30 Sb 30* 0.5 1.5-1.8

Sn 18 Sb 18*0.5 0.9-1.2

Sn 2 Sb 2 * 0.5 0.2-0.5

1)~hl~ is finding incre=ing use in lamp nlanufacture where it is replacing more expensive grades containing higher tin content.

1

-..

IS 193:2000

Table 2 Solders for Service at High Temperatures

(Clause 5.1)

Grade Percent

,Sn Sb Pb Ag

Sn 95 Sb 5 95* 0.5 4.75-5.25 0.07 Max ().02MaxSn5Ag 1.5 4.75-5.25 0.10 Max Remainder 1.4-1.6Sn5Ag 1.0 4.75-5.25 O.lol’fux Remainder 0.9- 1.1Snl Agl,5 0.75-1.25 O.1OMUX Remainder 1.4-1.6

NOTE — These solders are more difficult to use than those specified in Table 1. Advice should be sought from the supplier in

Ihe choice of solder for a pwticulat use.

---

Table 3 Solders for Special Applications

(Clauses 5.1 and 5.4)

Constituent Grade, Percent

Tin

Antimony, Ma

Arsenic, Max

Iron, Max

Aluminium, Max

Zinc, Max

Cadmium, Ma

Nickel, Mux

Bismuth, Max

Silver, Max

Copper, Max

Lead

Sn 38

38+0

0.06

0.015

0.02

0.001

0.003

0.005

0.002

0.05

0.02

0.05

.5

Sn 2

2 * 0.25

0.06

0.015

0.02

0.001

0.003

0.005

0.0Q2

0.05

0.02

0.05

Remainder

S.2 The material when analyzed by the method

spcci ficd in relevant parts of IS 998 or any othercstahli shed instrumental/chemical method shallcon I’orm to the requirements. In case of dispute, theprocedure given in IS 998 and its relevant partsshal I be the referee method. However when themethod is not given in IS 998 or its relevant parts,[he referee method shall be as agreed to betweenthe purchaser and the manufacturer.

5.3 Impurities

5.3.1 The supplier shall undertake that the material

covered in Tables 1 and 2 does not contain the followingimpurities in excess of the amount stated below:

Element Percent, Max

Arsenic 0.05

Iron 0.02

Copper 0.05

S.3.2 other Impurities

‘I”hc solders shall not contain impurities, such asaluminium, zinc or cadmium in amounts which

injuriously affect the properties of the solder.Solder proved to be faulty in use and found tocontain these impurities shall be rejected.

5.4 For special applications (for example can sideseam soldering on high speed bodymakers) Sn 2 andSn 38 grades as given in Table 3 of non-antimonialsolders may be used.

6 FREEDOM FROM DEFECTS

The material shall be of uniform quality, clean andfree from foreign matter.

7 FORM AND SIZE

Soft solder shall be supplied in one of the followingforms as specified by the purchaser:

a)

b)

c)

-1

Sticks;

Ingots; and

Any other form such as bars, pallets/chips, etc,the mass of which shall be as agreed tobetween the purchaser and the manufacturer.

L

IS 193:2000

8 SAMPLING

8.1 Three ingots shall be selected to representshipment of less than 450 kg, five ingots to

represent 450 kg up to and including 4500 kg, andtcn ingots to represent over 4500 kg.

8.1.1 Saw cuts shall be made entirely across eachpiece at several points not more than 25 mm apartand evenly distributed throughout the length. Nolubricants shall be used for sawing. Sawingsthoroughly mixed shall constitute sample forchemical analysis.

8.1.2 Samples for chemical analysis should be takenin such a way so as to represent entire cross section.No lubricant should be used for preparation ofsample and sample should be thoroughly washedhclore chemical analysis.

9 RETEST

If [he sample prepared under 8 fails to meet therequirements specified under 5, the same sampleshal I be analyzed in duplicate. If both the test results

satisfy the relevant requirements, the lot shall bcaccepted. Should either of the samples fail tocomply with the requirements, the lot representedshall be rejected.

10 MARKING

10.1 Each parcellpackage of solders may be markedwith the following:

a) Cast number,

b) Grade, and

c) Manufacturer’s initials or trade-mark.

10.1.1 The material may also be marked with theStandard Mark.

10.1.2 The use of the Standard Mark is governedby the provision of the Bureuu of Indian StandardsAct, 1986 and the Rules and Regulations made thereunder. The details of the conditions under which thelicence for the use of Standard Mark may be grantedto manufacturers or producers may be obtained fromthe Bureau of Indian Standards.

Is 193:2000

Grade

(1)

Sn 65Sn 60

Sn 50Sn 50 SbSn 45Sn 45 Sb

Sn40Sn 40 Sb

Sn 35

Sn 32 SbSn 30Sn 30 Sb

Srr 20

Sn 18Sb

Sr? 15

,$n 2 Sb

ANNEX A

(Clause 5.1)

Properties and Applications of Solders

(For Information Only)

Melting Range Typical Uses

Solidus‘c

(2)

183183

183185183185

183185

183

185183185

183i 85

i 83

316

236296308309

Liquidus“c

(3)

185188

212204224215

234227

255

243255248

275275

275

322

244310——

(4)

Work requiring low meltingpoints or free running solder,for example, electrical, radioand instrument assemblies andmachines soldering of can andseam

Coppersmith’s and Tinsmith’sbit soldering and generalmachine soldering, for

example, soldering of can endseams

Blowpipe soldering andsoldering of side-seams onhigh- speed body formingmachines. Grade Sn 40 mayalso be used for electrical jointsand is suitable for solderingzinc and zinc plated, galvariizedor cadmium plated metals. Forgeneral soldering work, gradeSn 40 Sb may be used

Blowpipe soldering and

soldering of side-seams onhigh-speed body forming

machines

Wiping of cable and lead pipejoints, and dipping baths andwhere a pasty range is required

Dipping solder for lampmanufacture

do

Soldering of side-seams onhigh speed body formingmachines

For high temperature services

Characteristics

(5)

Lowest melting points 01 theseries

Moderately low melting pointand short melting range

High melting poinl and longmelting range

High melting point and longmelting range

Long melting range

Long melting range

do

High melting point and veryshort plastic range

—SII 95 .%5Sn 5 Ag 1.5Sn5,ig1.0Sn i Ag ].5~<YrEs

! Antimcmial soidcrs are not wri(able for use with zinc or galvanized articles.

2 fWr-autimonial solders are sometimes preferred for machine soldering of containers.

3 Joints ]oade by soft solders specified in this standard me aot generally suitable for service at temperature in excess of 140”C

4

Bureau of Indian Standards

BIS is a statutory institution established under the Bureau of Indian Standards Act, 1986 to promotehmmonious development of the activities of standardization, marking and quality certification of goods andattend ing to connected matters in the country.

Copyright

B IS has the copyright of all its publications. No part of these publications may be reproduced in any for-mwithout the prior permission in writing of BIS. This does not preclude the free use, in [hc course of

implementing the standard, of necessary details, such as symbols and sizes, type or grade designations,Enquiries relating to copyright be addressed to the Director (Publications), BIS.

Review of India Standards

A mcndments are issued to standards as the need arises on the basis of comments. Standards are also reviewedpcri{xlically; a standard along with amendments is reaffirmed when such review indicates that no changesarc needed; if the review indicates that changes are needed, it is taken up for revision. Users of IndianStandards should ascertain that they are in possession of the latest amendments or edition by referring to[hc latest issue of ‘BIS Catalogue’ and ‘Standards: Monthly Additions’.

This Indian Standard has been developed from Doc : No. MTD 9 (4236).

Amendments Issued Since Publication

Amcnci No. Date of Issue Text Affected

BUREAU OF INDIAN STANDARDS

Headquarters :

Manak Bhavan, 9 Bahadur Shah Zafar Marg, New Delhi 110002 Telegrams : Manaksanstha

Telephones :3230131,3233375,3239402 (Common to all offices)

Rc,giona] Offices : Telephone

Ccn[ral :

Easlcl-n :

N(wthcrn :

Soulhcrn :

Wcslcrn :

Brmches :

Manak Bhavan, 9 Bahadur Shah Zafar Marg

{

3237617

NEW DELHI 110002 3233841

I/1 4 C. I. T. Scheme VII M, V. I. P. Road, Kankurgachi

{

3378499, 3378561

CALCUTTA 700054 3378626,3379120

SCO 335-336, Sector 34-A, CHANDIGARH 160022

{

603843602025

C. I. T. Campus, IV Cross Road, CHENNAI 600113

{

2350216,23504422351519,2352315

Manakalaya, E9 MIDC, Marol, Andheri (East)

{

8329295, 8327858

MUMBAI 400093 8327891,8327892

AHMADABAD. BANGALORE. BHOPAL. BHUBANESHWAR. COIMBATORE.FARIDABAD. GHAZIABAD. GUWAHATI. HYDERABAD. JAIPUR. KANPUR.LUCKNOW. NAGPUR. PATNA. PUNE. RAJKOT. THIRUVANANTHAPURAM.

Printed at PRINT’OGRAPH. New Delhi