iPhone 6s Plus Fingerprint Sensor New Design & Package 2015 teardown reverse costing report...

DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners.

© 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 1

Electronic Costing & Technology Experts

www.systemplus.fr21 rue la Nouë Bras de Fer44200 Nantes – France Phone : +33 (0) 240 180 916 email : [email protected]

November 2015 – Version 1 – Written by Elena Barbarini

http://www.systemplus.fr/index.php?lang=ge&page=home.php

http://www.systemplus.fr/index.php?lang=ge&page=home.php

mailto:[email protected]

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iPhone 6S Plus Fingerprint Sensor

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Glossary1. Overview / Introduction 4

– Executive Summary

– Reverse Costing Methodology

2. Company Profile 7– Apple

3. Physical Analysis 9– Synthesis of the Physical Analysis

– iPhone 6s Plus Home Button Disassembly 11

– Home Button Removal

– Home Button Assembly Views

– Home Button Assembly 15

– Home Button Assembly Views

– Gasket & Flex PCB Removed

– Fingerprint Sensor

– Home Button Cross-Section – Sapphire Window

– Home Button Cross-Section – Sensor Packaging

– Fingerprint Sensor Die 32

– Sensor Die View, Dimensions & Marking

– Sensor Die Capacitors

– Sensor Die Delayering

– Sensor Die Bonding & TSV

– Sensor Die Process

– Sensor Cross-Section (Metal Layers, TSV…)

– Sensor Process Characteristics

– Fingerprint Sensor ASIC Die 57

– Sensor Die View, Dimensions & Marking

– Sensor Die Delayering

– Sensor Die Process

– Sensor Cross-Section

– Sensor Process Characteristics

4. Sensor Manufacturing Process 69– Sensor Front-End & TSV Process & Fabrication Unit

– Sensor 3D Packaging Process Flow & Fabrication Unit

– Sensor ASIC Process & Fabrication Unit

– Sensor Packaging Process & Fabrication Unit

5. Cost Analysis 81– Main steps of economic analysis

– Yields Hypotheses

– Sensor 86

– Sensor Front-End, TSV & 3D Packaging Cost

– Sensor Back-End 0 : Probe Test, Thinning & Dicing

– Sensor Wafer Cost

– Sensor Die Cost

– ASIC 96

– ASIC Front-End & Back-End 0

– ASIC Wafer Cost

– ASIC Die Cost

– Sapphire Window 102

– Sapphire Manufacturing & Supply Chain

– Sapphire Window Cost

– Home Button Assembly Cost 107

6. Apple’s iPhone 6 Vs iPhone 6s Fingerprint 1117. Apple’s Vs Samsung’s Vs Huawei’s Fingerprint 115

Contact 118


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• This full reverse costing study has been conducted to provide insight on technology data,

manufacturing cost and selling price of the Apple iPhone 6S Fingerprint Sensor & Home Button

Assembly.

• The new device has the same structure and capacitive technology than the fingerprint of iPhone 5S

and 6, but with significant innovations in term of sensor design, die process and packaging.

• Integrated in the home button, the 12.5x10.9 mm sensor is incorporated within a rectangular

shaped housing composed of a stainless steel ring and an aluminum base. The sensor is protected

by a sapphire window coated with two different materials and supported by innovative assembly

of dies and flex PCB.

• The fingerprint sensor allows it to scan the fingerprint just by pushing the button. The sensor has a

resolution of 10,752 pixels with a pixel density of 500ppi. It uses a capacitive touch technology to

take an image of the fingerprint from the subepidermal layers of the skin.

• The sensor is composed of two dies, one dedicated to the sensing and one containing the logic.

While the ASIC die has a 0.18µm manufacturing process, the sensor die is manufactured with CMOS

65nm technology and it is connected by mean of TSV and wire bonding to the flex PCB.


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Home button disassembly


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• The die marking includes:

NVT8417 – B0

Ⓜ© 2014

ASIC Die Marking


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• We perform the economic analysis of the Sensor IC Front-End with the IC Price+ tool.

• We perform the economic analysis of the Sensor IC WL packaging with the 3D Package CoSim+ tool.


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Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts.

Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated).

These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:

• Consulting and Specific Analysis

– North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.Email: [email protected]

– Japan: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K.Email: [email protected]

– RoW: Jean-Christophe Eloy, President & CEO, Yole DéveloppementEmail: [email protected]

• Report business

– North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.Email: [email protected]

– Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service Email: [email protected]

– Japan & Asia: Takashi Onozawa, Sales Asia & General Manager, Yole K.K.Email: [email protected]

– Korea: Hailey Yang, Business Development Manager, Korean OfficeEmail: [email protected]

– Taiwan/China: Mavis Wang, Business Development Manager, Chinese Office

– Email: [email protected]

• Financial services

– Jean-Christophe Eloy, CEO & PresidentEmail: [email protected]

• General: [email protected]

iPhone 6s Plus Fingerprint Sensor New Design & Package 2015 teardown reverse costing report...

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