IPG Photonics’ IX-280-ML ... Page 2 Company & Product Overview IX-280-ML IPG Photonics is...
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Transcript of IPG Photonics’ IX-280-ML ... Page 2 Company & Product Overview IX-280-ML IPG Photonics is...
Applications Features Advantages
f rom the World Leader in F iber Lasers
www.ipgphotonics.com sales.ipgm@ipgphotonics.com
IPG Photonics’ IX-280-ML
Page 2
Company & Product Overview IX-280-ML
IPG Photonics is the world leader in high power fiber
lasers and amplifiers. Founded in 1990, IPG pioneered the
development and commercialization of optical fiber-based lasers
for use in a wide range of venues such as materials processing,
medical, scientific and other advanced applications. Fiber lasers
have revolutionized the industry by delivering superior
performance, reliability and usability at a lower cost of ownership
compared with conventional lasers, allowing end users to increase
productivity and decrease operating costs. IPG is headquartered in
Oxford, MA with additional facilities throughout the world.
The IX-280-ML is a high-precision
laser processing system that maximizes flexibility by
supporting two lasers and beam delivery systems in a
single workstation. The lasers may have independent
beam delivery systems or be configured to have a
coincident delivery point for advanced parts processing.
Applications include R&D, where equipment flexibility is
essential and production processing of parts requiring
both very fine micromachining and
thicker-material machining.
The IX-280-ML lasers and their associated beam delivery systems can be optimized for both tasks, with shared
workstation elements for part positioning, control and automation delivering highly precise machining of
a vast array of materials. For more information about the IX-280-ML,
please contact sales.ipgm@ipgphotonics.com or call 603.518.3200.
IX-280-ML System Overview
IPG Photonics World Headquarters Oxford, MA USA
Leader in Innovation High Speed Sapphire Cutting • Display covers, Lens Covers and Cut-outs for Handheld Devices • Fast Laser Cutting and Fine Feature Beveling
Typical Applications IX-280-ML
Selective Material Removal • Patterning, Stripping and Selective Opening of Polymers such as Parylene
High-Speed Drilling of Ceramics • Device Packaging and Interposer Applications requiring holes
Page 3
Company & Product Overview IX-280-ML
IPG Photonics is the world leader in high power fiber
lasers and amplifiers. Founded in 1990, IPG pioneered the
development and commercialization of optical fiber-based lasers
for use in a wide range of venues such as materials processing,
medical, scientific and other advanced applications. Fiber lasers
have revolutionized the industry by delivering superior
performance, reliability and usability at a lower cost of ownership
compared with conventional lasers, allowing end users to increase
productivity and decrease operating costs. IPG is headquartered in
Oxford, MA with additional facilities throughout the world.
The IX-280-ML is a high-precision
laser processing system that maximizes flexibility by
supporting two lasers and beam delivery systems in a
single workstation. The lasers may have independent
beam delivery systems or be configured to have a
coincident delivery point for advanced parts processing.
Applications include R&D, where equipment flexibility is
essential and production processing of parts requiring
both very fine micromachining and
thicker-material machining.
The IX-280-ML lasers and their associated beam delivery systems can be optimized for both tasks, with shared
workstation elements for part positioning, control and automation delivering highly precise machining of
a vast array of materials. For more information about the IX-280-ML,
please contact sales.ipgm@ipgphotonics.com or call 603.518.3200.
IX-280-ML System Overview
IPG Photonics World Headquarters Oxford, MA USA
Leader in Innovation High Speed Sapphire Cutting • Display covers, Lens Covers and Cut-outs for Handheld Devices • Fast Laser Cutting and Fine Feature Beveling
Typical Applications IX-280-ML
Selective Material Removal • Patterning, Stripping and Selective Opening of Polymers such as Parylene
High-Speed Drilling of Ceramics • Device Packaging and Interposer Applications requiring holes
Page 4
Fiber Laser Options Configur ing the IX-280-ML
Beam Delivery Options Three beam delivery alternatives (below) are available for the IX-280-ML, each with a number of
user-selectable options. Although numerous combinations of laser type and beam delivery systems
are possible, most customers select a thermal cutting/drilling head for the thicker material
processing and either a fixed or scanning beam delivery for the “finer” or higher-precision work.
For many applications it is desirable to have a separate beam
delivery system for each laser, however, for advanced
processing, IPG offers a dual-beam delivery option that brings
both laser sources to the same focal point. The resulting ability
to have two laser beams with different wavelength or energy
characteristics, illuminating the part either simultaneously, or in
a programmed sequence, enables many unique light-material
interactions to be achieved.
Please contact IPG with specific application requirements and/or refer to
individual datasheets for full laser specifications; contact
sales.ipgm@ipgphotonics.com or call 603.518.3200.
The IX-280-ML can be configured with virtually any laser compatible
with micromachining and is most typically supplied with the following:
• IR QCW Lasers for Cutting and Drilling Thicker Materials
including Sapphire, Silicon and Ceramics
• IR, Visible or UV Pulsed Lasers for Patterning
and Micromachining
• UV lasers for Patterning and Machining Polymers
IPG’s laser options allow customers to select based on pulse energy,
emission wavelength and laser power. Cominations of high pulse
energy, high power QCW lasers for thicker material cutting and
drilling, paired with either a short-pulse or short-wavelength laser
for fine machining work are the most popular selections.
IPG’s Micro Cutting Head
Thermal Processing Head Ceramics, Sapphire, Metals
Galvanometer Scanner Machining Complex Shapes with
Example of Dual-beam Delivery
Example of Placement Accuracy
A ceramic microelectronic part was machined with
~ 26,000 features over a period of 8 hours.
To assess overall placement accuracy and tool stability, the
Diametric True Position of ~2,600 holes was measured and
found to be less than 3.1 microns.
System Part-positioning IX-280-ML
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DTP�Error�(microns)
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Precision micromachining requires a highly accurate and repeatable part
positioning system. The IX-280-ML’s foundation is a table and bridge assembly
made of high-density granite that provides mechanical and thermal stability
necessary for accurate fine-feature machining.
Laser sources, their associated beam delivery systems and a stacked
X-Y-Z-Theta stage system mount to the granite base to minimize positional
uncertainty and drift. Once a part is mounted on the chuck, the extended
travel stages position the part under each beam as required, avoiding the
repositioning errors and loading times that are incurred on traditional
single-beam units.
While high levels of positioning accuracy are important for some applications,
others processes are more concerned with controlling costs. The IX-280-ML
offers customers a choice of part-positioning options, allowing the system to be appropriately configured for the task. These selections
include standard and high-precision X-Y stages, mapping correction, manual or motorized, standard and high-precision Z-theta stages
and analogue or digital galvanometers.
Page 5
Fiber Laser Options Configur ing the IX-280-ML
Beam Delivery Options Three beam delivery alternatives (below) are available for the IX-280-ML, each with a number of
user-selectable options. Although numerous combinations of laser type and beam delivery systems
are possible, most customers select a thermal cutting/drilling head for the thicker material
processing and either a fixed or scanning beam delivery for the “finer” or higher-precision work.
For many applications it is desirable to have a separate beam
delivery system for each laser, however, for advanced
processing, IPG offers a dual-beam delivery option that brings
both laser sources to the same focal point. The resulting ability
to have two laser beams with different wavelength or energy
characteristics, illuminating the part either simultaneously, or in
a programmed sequence, enables many unique light-material
interactions to be achieved.
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