Introduction to VLSI Physical Design

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1 7 October 2008 1 CAD Algorithms Physical Design Automation of VLSI Systems Mohammad Tehranipoor ECE Department 7 October 2008 2 Physical Design Automation Objectives: Obtain general understanding about IC design process Study design automation Study algorithms Used in designing the layout of a chip Prepare students for exposure to hard CAD problems

Transcript of Introduction to VLSI Physical Design

Page 1: Introduction to VLSI Physical Design

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7 October 2008 1

CAD Algorithms

Physical Design Automation

of VLSI Systems

Mohammad Tehranipoor

ECE Department

7 October 2008 2

Physical Design Automation

� Objectives:

� Obtain general understanding about IC design process

� Study design automation

� Study algorithms

� Used in designing the layout of a chip

� Prepare students for exposure to hard CAD problems

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VLSI Design Cycle

� Large number of components:� The physical design is not practical without the help of computers.

� Optimize requirements for higher performance� Performance relates to speed, power and size.

� Time to market competition:� Makes the use of computer necessary

� Cost:� Using computer makes it cheaper by reducing time-to-market.

System

Specifications Chip

Manual

Automation

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VSLI Design Cycle (Cont.)

� VLSI design cycle can be divided into the following steps:

� System Specification:

� Goals and constraints of the system

� Functionality (what will a system do)

� Performance figures like speed and power

� Technology constraints like size and space (physical dimensions)

� Fabrication technology and design techniques

� Architectural/Functional Design:

� RISC, CISC, # of ALUs, floating point units, number and structure of

pipelines, etc.

� Functional behavior and functional units to match specification

� Functional subunits and relationship among them

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VSLI Design Cycle (Cont.)� Logic Design:

� Implementation of functional subunits using logic representation

� Boolean expressions, finite state machines or schematics.

� Use of standard building blocks like RAM, ROM, PLA, etc.

� Logic design should match functional description.

� Register Transfer Level (RTL) description of subunits.

� RTL is expressed in VHDL or Verilog.

� Circuit Design

� Logic networks or descriptions are converted into electronic circuits.

� Circuit elements are designed to meet specifications.

� Transistors are sized for current capacity and delay requirements.

� Circuit simulation is used to verify the correctness and timing of each

component.

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VSLI Design Cycle (Cont.)

� Physical Design: That’s the focus of our course.

� The circuit representation is converted into a geometric representation.

� Geometric representation of a circuit is called layout.

� The exact details of the layout depends on design rules.

� Design rules are guidelines based on the limitations of the fabrication

process.

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VSLI Design Cycle (Cont.)

CAD Tools:

� Layout synthesis tools are fast but do have area and performance penalties.

� Manual layout is very slow but does have better area and performance.

� Most of the layout of a high performance custom design may be done

using manual design.

� Synopsys, Cadence, Mentor Graphics, Magma, and more

� Note that the objective of VLSI CAD tools are to minimize

the time for each iteration and the total number of iterations,

thus reducing time-to-market.

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VSLI Design Cycle (Cont.)

� Fabrication:

� After layout and verification, the design is ready for

fabrication (called tapeout).

� Layout data is converted into photo-lithographic

masks.

� Testing and Debugging:

� After fabrication, each die is tested.

� The wafer is diced into individual chips.

� Each chip is packaged and tested.

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VLSI Design Cycle

System Specifications

Functional Design

Logic Design

Circuit Design

X=(AB*CD)+ …

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VLSI Design Cycle

Physical Design

Fabrication

Packaging

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New Trends in VLSI Design Cycles

� Increasing Interconnect Delay:

� Interconnect is not scaling at the same rate as the devices.

� Almost 60% of path delay may be due to interconnect.

� Increasing Interconnect Area:

� Almost 30-40% of the area is covered by interconnects in modern designs.R

ela

tive D

ela

y

Technology Node (nm) ITRS2005

Interconnect vs. Gate Delay

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New Trends in VLSI Design Cycles

� Increasing number of Metal Layers:

� To meet the increasing need of interconnect, number of metals is increasing.

� Up to 12 metal layer in the next few years

Many Metal Layers� In nanometer technology designs:

� More silicon area consumed by wires –Miles of Cu wires

� Increasing wire lengths and interconnect defects, i.e. more bridging faults

� Increasing number of vias – Metal layers

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New Trends in VLSI Design Cycles

� Increasing Planning Requirements:

� Physical design considerations have to enter into design at much earlier

phase.

� Synthesis:

� The design time can be reduced if layout can be directly generated from a

higher level description.

� Behavioral Model � Physical Layout

� New tools can support it.

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Physical Design Process

� Physical Design converts circuit description into a geometric

description.

� This description is used to manufacture a chip.

� The input to a physical design cycle is a circuit diagram/netlist

and the output is the layout of the circuit.

� Required Stages:

� Partitioning

� Floorplanning

� Placement

� Routing

� Compaction

� Extraction and Verification (post-layout verification)

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New Trends in Physical Design Process

� Chip Level Signal Planning

� Routing of major signals and buses must be planned from early design

stages, so that the interconnect distances can be minimized.

� Interconnects length directly impact circuit delay and layout area

� OTC Routing

� Over-the-cell (OTC) routing allows routing over blocks and active

areas.

� Reduces the layout area

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Major Challenges

� Crosstalk

CcCs

Cs

Cc

0.35 µm 90 nm

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Cont.

� Power Supply Noise and Temperature

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Cont.

� Power Supply Noise

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Cont.

� Temperature

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Steps of Iterative Design Process

� Synthesis:

� Synthesis derives or improves a representation at any step.

� Behavioral synthesis, logic synthesis and layout synthesis are all

examples at various steps.

� Analysis:

� Analysis ensures that the design representation matches the requirements

at various steps.

� Requirements like area, power dissipation and speed.

� Verification:

� Establishes the correctness of design at any given step.

� Simulation at any step should match specifications.

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Design Process is Iterative

Behavioral

Structural

Synthesis

PNR

Simulation-Based Verification

Simulation-Based Verification

Simulation-Based Verification

Simulation/Emulation-Based

Verification

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Design Styles

Preferred style for mass production, Highly optimized layout, Time can be justified

JC

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Selection of Design Style

� Selection of design styles depends on many factors:

� Type of chip

� High performance, Area, …

� Volume

� Mass production, Medium production volume, …

� Cost

� Company’s budget, Cost of the chip

� Time-to-market

� Last two are dominant.

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Full Custom Design Style

� Circuit partitioned into sub-blocks.

� Blocks can be of any size/shape

� Hierarchical design

� Placement on any location is allowed

� Allows very compact designs

� Difficult automation

� High performance

� The process of automating a full-

custom design style has a much higher

complexity than other restricted styles.

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Standard Cell Design Style

� Design process is somewhat simpler than full-custom design style

� Rectangular cells of same height

� Library based design

� Cells arranged in rows

� Easier automation

� Inherently nonhierarchical

� Lower performance

� Well suited for moderate size designs and medium production volume.

� Logic synthesis uses standard cell design style.

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Standard Cell

� Channel is the space between two rows.

� Feedthrough is the empty cells in a row.

� Feedthroughs are assigned for the interconnections of non-adjacent

cells.

� Standard cell design style takes more area than full custom.

� Along with semiconductor manufacturing advances, standard cell

methodology was responsible for allowing designers to scale ASICs

from comparatively simple single-function ICs (of several thousand

gates), to complex multi-million gate devices (SoC).

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Standard Cell

� 2-input NAND or NOR function is sufficient to form any arbitrary

Boolean function set

� In modern ASIC design, standard cell methodology is practiced with a

sizeable library of cells

� The library contains multiple implementations of the same logic function,

differing in area and speed

� This variety enhances the efficiency of automated synthesis, place and

route tools

� It gives the designer greater freedom to perform implementation tradeoffs

� Area vs Speed vs Power Consumption

� A complete group of standard cell descriptions is commonly called a

technology library.

� The technology library is developed and distributed by the foundry

operator.

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Gate Array Design Style

� A simplification of Standard Cell Design Style

� Gate array design is a manufacturing method in which the diffused layers, i.e.

transistors and other active devices, are predefined and wafers containing such

devices are held in stock prior to metallization, in other words, unconnected

� A regular lattice shaped structure

� Pre-fabricated logic

� Both vertical and Horizontal channels

� Only wiring masks need to be defined

� Rapid fabrication

� Low performance

� Easy automation

� Non-hierarchical structure

� Logic synthesis can use gate array.

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Gate Array

� Photo-lithographic masks are required only for the metal layers� Production cycles are much shorter as metallization is a comparatively

quick process

� Advantages/Disadvantages:

� The steps involved for creating any prefabricated wafer are the same

� Only the last few steps in the fabrication process will be used.

� Cheaper and easier to produce than full-custom and standard cell.

� It offers more area and less time.

� Difficulties in routing the interconnect require migration onto a larger array device with consequent increase in the price

� Pure, logic-only gate array design is rarely implemented by circuit designers today

� FPGA is preferred.

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Gate Array

� Today gate arrays are evolving into

Structured ASICs

� Structured ASICs consist of a large IP

core like a CPU, DSP unit, peripherals,

standard interfaces, integrated memories

SRAM, and a block of reconfigurable

uncommited logic.

� This shift is largely because ASIC

devices are capable of integrating large

blocks of system functionality and

"system on a chip" requires far more

than just logic blocks.

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FPGA Design Style

� Extremely rapid prototyping

� Re-programmable

� Lowest performance

� Easy automation

� Cells and interconnects are pre-fabricated.

� The user simply programs the interconnects.

� Contains programmable logic blocks and interconnects� Logic blocks can be programmed to

perform the function of basic logic gatessuch as AND, and XOR, or more complex combinational functions such as decoders or mathematical functions.

� FPGAs contain FFs

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LUT Programming

Source: Fundamentals of Digital Logic , McGraw Hill 2000

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LUT Programming

3-input LUT

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LUT Programming Sequential

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Comparison of Design Styles

Mass

Production

Volume

Medium

Production

Volume

Medium

Production

Volume

Low

Production

Volume

Production

Volume:

Complexity: High Low

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Physical Design Automation

� Physical design implies “physical realization” of

integrated circuit layout.

� Input to physical design cycle is a circuit design

� Circuit netlist (gate level representation)

� RTL description of the circuit

� Output from this stage is a layout of the circuit

� The task from input to output is accomplished in several design stages,

each addressing specific goals.

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Physical Design Cycle

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Physical Design Cycle

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Physical Design Cycle

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VLSI Design Automation