Introduction to TactoTek Injection Molded Structural Electronics - IMSE

8
TactoTek Injection Molded Structural Electronics – IMSE Introduction

Transcript of Introduction to TactoTek Injection Molded Structural Electronics - IMSE

Page 1: Introduction to TactoTek Injection Molded Structural Electronics - IMSE

TactoTek Injection Molded Structural Electronics – IMSEIntroduction

Page 2: Introduction to TactoTek Injection Molded Structural Electronics - IMSE

© TactoTek 2016 | 2

TactoTek designs and produces 3D injection molded structural electronics (IMSE)

TactoTek Solutions

Intelligence and functionality encapsulated within plastic

as thin as 2 mmPrinted circuitry

Printed sensors, controls and antennas

Electronic components

Injection molding

Surface film

Electronics film

Page 3: Introduction to TactoTek Injection Molded Structural Electronics - IMSE

Recognized Leader in Structural Electronics

Founded in 2011

Core BusinessDesign, manufacturing and technology licensing of 3D smart in-mold electronics

Patented TechnologyPatented and patent pending manufacturing processes and applied uses

Design Services To migrate from traditional designs to structural electronics designs

TactoTek locationsOulu (HQ), Germany, Sweden, Switzerland, USA, China, Taiwan, South Korea, Japan

© TactoTek 2016 | 3

Page 4: Introduction to TactoTek Injection Molded Structural Electronics - IMSE

Representative Use Cases

Rigid and flexible designs: wide range of molding materials including PC, ABS, PMMA, and TPUEncapsulated circuitry and electronics deliver design freedom and durability

3D HMI surfacesTactoTek ControlSurface™

Thin flexible wearables & Soft sensor components

Illumination & stylingTactoTek LightStripe™

© TactoTek 2016 | 4

Page 5: Introduction to TactoTek Injection Molded Structural Electronics - IMSE

Example: HMI Control Panel

© TactoTek 2016 | 5

IML film with visual finish

Printed circuitry, capacitive controls, SMD LEDs and ICs on IML film

Injection-molded plastic

Traditional Design Example

Design Properties• Limited design possibilities• Assembly depth: 25+ mm• Multiple discrete components• Multiple electro-mechanical interfaces

TactoTek Structural Electronics Design

Design Properties• Design freedom• Wall thickness: ~3 mm• 50-70% less weight• Single-component solution

Surface plastics (IML film and molded plastic)

Flex for capacitive controls

Light pipes

Full width rigid PCB

Page 6: Introduction to TactoTek Injection Molded Structural Electronics - IMSE

© TactoTek 2016 | 6

TactoTek IMSE Benefits

Light weight

Reduces weight 50-70 % no separate light guides and large PCBs

Space efficientUp to 90% less assembly depth

Design freedom

New feature/function possibilities seamless surfaces

Fast product updatesEasy model-specific versioning single component customization

Durable and reliable Shock and impact resistant, protected from moisture and debris

Faster to service Single part replacement reduces time up to 40 %

Simple assembly30 % savings from fewer parts and electrical connections

Scalable mass production

Standard equipment and known materials

Excellent touch response

Printed touch controls very close to finger

Improved antenna performance

Antenna radiator closer to surface can follow the 3D contour

Page 7: Introduction to TactoTek Injection Molded Structural Electronics - IMSE

© TactoTek 2016 | 7

Page 8: Introduction to TactoTek Injection Molded Structural Electronics - IMSE

Thank you!www.tactotek.com