Introducing Sherlock 5 - DfR Solutions Sherlock 5.0.pdf · Introducing Sherlock 5.0 New features...

2
Introducing Sherlock 5.0 New features make a great software tool even more robust DfR Solutions is committed to keeping Sherlock Automated Design Analysis software the go-to tool for solving critical electronics reliability challenges, and the latest version is the most powerful yet! What’s New in Sherlock 5.0? With new features and refinements, Sherlock 5.0 makes it easier than ever to bring the “real world” to electronics builds for expert users and novices alike. There’s no need to invest thousands of hours of compute time – and that means finding a solution faster. MODELING REGIONS PCB view complexity may involve minute features and multiple layers that could crash typical computer systems. The Modeling Regions feature alleviates that concern: • Click-and-view functionality on any part of the build replaces prior Sherlock tracing modeling • Areas of concern are displayed on-screen in detailed, high resolution and the balance of the board appears in coarser resolution for reference • Users can selectively choose the level of view complexity without relying on a high performance computing system to support modeling, analysis and export • Modeling regions allows users to specify different meshing properties for different PCB areas without increasing overall FEA model complexity HEAT SINKS Attachment points can now be created from mount points for heat sinks, replacing the more complicated process of placing heat sinks on top of the component and/or using assemblies. SIEMENS NX NASTRAN INTEGRATION/SUPPORT To improve our support for aerospace processes, Sherlock now integrates with the NX Nastran FEA engine. Sherlock can export mesh models to NX Nastran in Bulk Data File (BDF) format. PLATED THROUGH HOLE ANALYSIS IMEC Plated Through Hole Fatigue models can now be analyzed with the Sherlock PTH Fatigue calculator in addition to the existing default IPC-TR-579 model. Updated IPC model analysis is also available on Sherlock, which now includes an elastic strain range.

Transcript of Introducing Sherlock 5 - DfR Solutions Sherlock 5.0.pdf · Introducing Sherlock 5.0 New features...

Page 1: Introducing Sherlock 5 - DfR Solutions Sherlock 5.0.pdf · Introducing Sherlock 5.0 New features make a great software tool even more robust DfR Solutions is committed to keeping

IntroducingSherlock 5.0New features make a great software tool even more robustDfR Solutions is committed to keeping Sherlock Automated Design Analysis™ software the go-to tool for solving critical electronics reliability challenges, and the latest version is the most powerful yet!

What’s New in Sherlock 5.0?With new features and refinements, Sherlock 5.0 makes it easier than ever to bring the “real world” to electronics builds for expert users and novices alike. There’s no need to invest thousands of hours of compute time – and that means finding a solution faster.

MODELING REGIONSPCB view complexity may involve minute features and multiple layers that could crash typical computer systems. The Modeling Regions feature alleviates that concern:

• Click-and-view functionality on any part of the build replaces prior Sherlock tracing modeling

• Areas of concern are displayed on-screen in detailed, high resolution and the balance of the board appears in coarser resolution for reference

• Users can selectively choose the level of view complexity without relying on a high performance computing system to support modeling, analysis and export

• Modeling regions allows users to specify different meshing properties for different PCB areas without increasing overall FEA model complexity

HEAT SINKSAttachment points can now be created from mount points for heat sinks, replacing the more complicated process of placing heat sinks on top of the component and/or using assemblies.

SIEMENS NX NASTRAN INTEGRATION/SUPPORTTo improve our support for aerospace processes, Sherlock now integrates with the NX Nastran FEA engine. Sherlock can export mesh models to NX Nastran in Bulk Data File (BDF) format.

PLATED THROUGH HOLE ANALYSISIMEC Plated Through Hole Fatigue models can now be analyzed with the Sherlock PTH Fatigue calculator in addition to the existing default IPC-TR-579 model. Updated IPC model analysis is also available on Sherlock, which now includes an elastic strain range.

Page 2: Introducing Sherlock 5 - DfR Solutions Sherlock 5.0.pdf · Introducing Sherlock 5.0 New features make a great software tool even more robust DfR Solutions is committed to keeping

Solve critical electronics reliability challenges and improve efficiencies with Sherlock 5.0 – the latest in highly functional software from DfR Solutions. For more

information or to request your free trial, contact us today.dfrsolutions.com/software/sherlock-free-trial | 301-474-0607

dfrsolutions.com | 9000 Virginia Manor Road | Suite 290 | Beltsville, MD 20705

Sherlock 5.0 also includes improvements to these existing software features:

• Bent over through hole components now demonstrates staking solutions

• Attached board and components contain refined modeling capabilities

• FEA Model Export allows for models containing elements generated by the Sherlock meshing algorithm to Abaqus and Ansys Mechanical

• Mechanical Parts now creates attachment points for mechanical parts from mount points

• Mechanical Part, Mount Point and Fixture Editors allow for the simultaneous modification of multiple mechanical parts

• Highlight Polygon Editor has more detailed cutouts and mount points

• Lead Modeling filters are available in 2D Layer Viewer to display lead outlines for parts with specific properties enabled

• ODB++ Support offers pick and place file properties dialog for identifying view direction and rotation values

• Potting Regions supports potting through hole parts with 90° bend leads, and also the Ansys Plugin for potting region materials assignment

• Part and Package Editors now gray out inapplicable part properties and tabs instead of completely disabling them so editing can still take place

• Package Library now includes die material package property so default silicon materials settings can be overridden with die-specific materials

Further Refinements

©2016 DfR Solutions