Intel Atom™ Processor E3800 Product Family Development Kit ... · Intel® Atom™ Processor E3800...

Document Number: 330218-002

Intel® Atom™ Processor E3800 Product Family Development Kit Based on Intel® Intelligent System Extended (ISX) Form Factor Reference DesignUser Guide

March 2014

Intel® Atom™ Processor E3800 Product Family Development Kit Based on Intel® Intelligent System Extended (ISX) Form Factor Reference DesignUser Guide March 20142 Document Number: 330218-002

Legal Lines and DisclaimersINFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS.Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htm Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. Go to: http://www.intel.com/products/processor%5Fnumber/Intel and the Intel logo are trademarks of Intel Corporation in the U.S. and/or other countries.*Other names and brands may be claimed as the property of others.Copyright © 2014, Intel Corporation. All rights reserved.

http://www.intel.com/design/literature.htm

http://www.intel.com/products/processor%5Fnumber/

Intel® Atom™ Processor E3800 Product Family Development Kit Based on Intel® Intelligent System Extended (ISX) Form Factor Reference DesignMarch 2014 User GuideDocument Number: 330218-002 3

Revision History—Intel® Atom™ E3800 Dev Kit ISX Ref Design

Revision History

Date Revision Description

March 2014 002 Corrected document title to add “Form Factor”

February 2014 001 Initial release

Intel® Atom™ E3800 Dev Kit ISX Ref Design—Contents


Contents

1.0 About This Development Kit ...................................................................................... 61.1 Introduction....................................................................................................... 61.2 Terminology....................................................................................................... 61.3 Development Board Parts .................................................................................... 7

2.0 Getting Started ......................................................................................................... 82.1 Introduction....................................................................................................... 82.2 Before You Begin ................................................................................................ 8

2.2.1 Check the Contents of the Development Kit................................................. 82.2.2 Inspect the Development Board................................................................. 82.2.3 Power-On the Development Kit System....................................................... 9

2.3 Reference Documents.......................................................................................... 9

3.0 Development Kit Overview.......................................................................................103.1 Block Diagram...................................................................................................103.2 Features and Specifications .................................................................................103.3 Power Management States..................................................................................12

4.0 Development Kit Setup ............................................................................................144.1 Introduction......................................................................................................144.2 Layout of the Board, Front Panel, and Back Panel...................................................144.3 Header Pinout Configuration................................................................................18

4.3.1 Development Board Header Pinout ............................................................184.4 Push-Buttons and LED Indicators .........................................................................20

4.4.1 Power-On and Reset Buttons ....................................................................204.4.2 LED Indicators........................................................................................21

4.5 Intel® Atom™ Processor E3800 Product Family Configuration Settings ......................214.5.1 R4A12 — Clear/Keep CMOS Settings .........................................................21

5.0 Flash BIOS Procedure for the Development Kit System ............................................225.1 Introduction......................................................................................................225.2 Required Equipment...........................................................................................225.3 Flash BIOS Procedure.........................................................................................23

6.0 Mechanical Design Information for the Development Kit System..............................316.1 Introduction......................................................................................................316.2 Development Kit System Design and Specification..................................................31

7.0 Disassembly and Reassembly Procedure ..................................................................337.1 Introduction......................................................................................................337.2 Precautions and Safety Handling of the Development Kit System..............................337.3 Development Kit System Disassembly and Reassembly...........................................33

A Development Kit Accessory ......................................................................................37A.1 Thermal Jacket (Optional)...................................................................................37

B Development Kit System Exploded View ..................................................................38


Contents—Intel® Atom™ E3800 Dev Kit ISX Ref Design

Figures1 Block Diagram of the Development Kit ........................................................................ 102 Development Board Top Layer Layout......................................................................... 143 Development Board Bottom Layer Layout.................................................................... 164 Front Panel Layout ................................................................................................... 175 Back Panel Layout.................................................................................................... 176 DediProg Programmer with Test Clip........................................................................... 227 SPI Chip Location..................................................................................................... 238 Attaching the DediProg Test Clip onto the SPI Chip ....................................................... 249 Detecting the DediProg Programmer Device................................................................. 2510 Loading the Raw Binary File....................................................................................... 2611 Processing the Raw Binary File................................................................................... 2712 Completing the Raw Binary File Process ...................................................................... 2813 Verifying the Programming Process ............................................................................ 2914 Completing the Verification Process ............................................................................ 3015 Development Kit System Design ................................................................................ 3216 Development Kit System Screws Removal ................................................................... 3417 Top Cover Removal .................................................................................................. 3518 Development Board Removal..................................................................................... 36

Tables1 Terminology ..............................................................................................................62 List of Development Board Parts ..................................................................................73 Technical Reference Documents ...................................................................................94 Features and Specifications ....................................................................................... 105 Supported SOC Models ............................................................................................. 116 Power Management States Description........................................................................ 127 Development Board Power States............................................................................... 128 Development Board Top Layer Components Description ................................................ 159 Development Board Bottom Components Description .................................................... 1610 Front Panel Components Description........................................................................... 1711 Back Panel Components Description ........................................................................... 1812 SATA Power Header (J1L2)........................................................................................ 1813 LVDS Connector (J4M3) ............................................................................................ 1814 LVDS Backlight Connector (J4M2) .............................................................................. 1915 LVDS Backlight Power Selection Header (J4M1)............................................................ 1916 LVDS Panel Power Selection Header (J4M4) ................................................................. 1917 Serial Port Header (RS485) ....................................................................................... 2018 Serial Port Header (RS232) ....................................................................................... 2019 Push-Buttons Location Table...................................................................................... 2120 LED Indicators Table ................................................................................................ 2121 Development Kit System Specification ........................................................................ 32

§ §


About This Development Kit

1.0 About This Development Kit

1.1 IntroductionThe Intel® Atom™ Processor E3800 Product Family development kit is a dual-channel DDR3L mobility platform. It is designed to support the Intel® Atom™ Processor E3800 product family, formerly known as “Bay Trail SOC.”

The development kit is based on Intel® Intelligent System Extended (ISX) Reference Design. The Intel® ISX uses a new 4.4 × 4.6 inch form factor, a full-featured fanless (chassis cooled) computing platform in the small form factor. The Modular Board Design (MBD) of the Intel® ISX completes the critical signal paths for the processor and the supporting components according to Intel Design Guidelines.

This development kit provides the necessary materials to enable you to customize the board design to suit your requirements. Alternatively, for faster time to market, the board design can be used as-is out of the box.

Note: Dual-channel DDR3L support depends on the SOC SKU. Refer to Table 4 for details.

1.2 Terminology

Table 1. Terminology (Sheet 1 of 2)

Term Definition

BIOS Basic Input Output System

CMOS Refers to the non-volatile configuration memory in the SOC

CPU Central Processing Unit

DDR3L Low Power Double Data Rate Synchronous Dynamic Random Access Memory third generation

GND Signal Ground

HDD Hard Disk Drive

HDMI High Definition Multimedia Interface

LAN Local Area Network

LED Light Emitting Diode

LPC Low Pin Count

LVDS Low-Voltage Differential Signaling

ME Intel Management Engine

OS Operating System

PCB Printed Circuit Board

PCI Peripheral Component Interface

PCIe Peripheral Component Interface Express

PMIC Power Management IC

POST Power-On Self Test

RTC Real Time Clock

S3 “Save to RAM” Sleep State

S5 “Soft Off” Sleep State

SATA Serial - Advanced Technology Attachment


About This Development Kit

1.3 Development Board PartsThe development board includes the following parts listed in Table 2 unless stated otherwise.

SKU Stock Keeping Unit

SLP Sleep

SOC System On Chip

SO-DIMM Small Outline Dual In-Line Memory Module

SPI Serial Peripheral Interface

SSD Solid State Drive

TDP Thermal Design Power

TPM Trusted Platform Module

USB Universal Serial Bus

VCC Used to signify circuit logic voltage

VDDQ Used to signify DIMM logic supply voltage

VID Voltage Identification

VTT Used to signify signal termination voltage

Table 1. Terminology (Sheet 2 of 2)

Term Definition

Table 2. List of Development Board Parts

Development Board Parts Model Quantity

4GB 204-PIN DDR3L NON-ECC Unbuffered SODIMM 78.B2GCY.AT00C 1

mSATA SSD-64G (half-size mPCIe) DEMSM-64GD07SC1DC 1

Antenna (support 3G and WiFi) NB0002-A250/A390 2

Intel WiFi module Intel 6235ANHMW 1

DC Power Brick [email protected] (48W) FSP Technology (FSP084-DMAA1) 1

mPCIe half to full-size extender bracket SC2MPCIEEXT0B1100P 1

3G/WiFi Mini PCIe* card (half-size mPCIe)1

1. Optional and would require a separate order

Option/GTM671W 1


Getting Started

2.0 Getting Started

2.1 IntroductionThis section should be read in its entirety before using the development kit. Verify that all the items listed here are received, and that the development board is functioning by going through the following:

• Check the contents of the development kit

• Inspect the development board for any defects

• Power-on the development board and verify that it is functioning correctly

2.2 Before You BeginIf any of the items are missing or if the development board is damaged, contact your Intel representative before you proceed.

2.2.1 Check the Contents of the Development Kit

The Intel® Atom™ Processor E3800 Product Family development kit contains the following items:

• Intel® Atom™ Processor E3800 Product Family System

• DC Power Brick [email protected] (48W) with US Type Power Cord

• CD containing Windows* 8 Drivers and User Guide

• Safety Flyer

• Quick Start Guide

• China RoHS Declaration

• Wireless Content Letter (WCL)

• Intel® Development Vehicles Terms and Condition

2.2.2 Inspect the Development Board

Check the development board for any damages by setting it on an anti-static surface and inspecting the development board to ensure that the components are not missing, bent, or cracked.

To disassemble the Development Kit System, please refer to Section 7.0, “Disassembly and Reassembly Procedure” on page 33.

Warning: The development board may be damaged if it is not placed on an anti-static surface.


Getting Started

2.2.3 Power-On the Development Kit SystemAfter the development board is free from any visible defects, power-on the development kit system and verify that the system is functioning correctly using the following steps:

1. Connect the supplied DC power brick to the development kit system (only use the DC power brick supplied with the development kit).

2. Press the power button.

3. Press the Delete key as the system boots to enter the BIOS setup screen.

4. Check the time, date, and configuration settings. The default settings should be sufficient for most users.

5. Save and exit the BIOS setup menu if the time and date are correct.

6. The system will reboot and will be ready for OS installation.

Note: The development board can be powered down with one of the following methods:

• Use the Windows Start menu (or equivalent) shutdown option

• Press the power button to begin the power-down process

• If the above does not successfully power off the system, hold down the power button for 7 seconds to asynchronously power off the system (not recommended)

2.3 Reference Documents

Table 3. Technical Reference Documents

Document Description Document Number/Location

Quick Start Guide for the Intel® Atom™ Processor E3800 Product Family development kit 543551

Datasheet for the Intel® Atom™ Processor E3800 Product Family 538136

System Reference Design Schematic and Board File for the Intel® Atom™ Processor E3800 Product Family development kit 543569

BIOS for the Intel® Atom™ Processor E3800 Product Family development kit 543567

User Guide for the Modular Board Design (MBD) 543568


Development Kit Overview

3.0 Development Kit Overview

3.1 Block Diagram

3.2 Features and Specifications

Figure 1. Block Diagram of the Development Kit

Table 4. Features and Specifications (Sheet 1 of 2)

Features Specifications Details

CPUFamily/ModelPackage typeTDP

Intel® Atom™ Processor E3800 Product FamilyFCBGA 1170Maximum up to 10W

Memory

RAM typeMaximum RAM sizeMaximum RAM speedRAM slot

DDR3L (1.35V)8GB1066MT/s21

BIOS SPI modelW25Q64FWSSIG; 64M-bit SOIC-8 serial flash memory

Display

Graphic typeIntegrated audioMaximum resolutionDisplay option

eDP to LVDS converter

IntegratedSupported2560 × 1600 @60Hz1 × Standard HDMI connector1 × Micro HDMI connector/LVDS connector (Muxing)Chrontel CH7511B

Intel® Atom™ Processor E3800

1 x HDMI1 x LVDS/micro HDMI

(Muxing)

1 x USB2.01x micro USB

2.0

1 x USB3.0

mPCIE (full)

mPCIe (half)mSATA SSD

1 x SPIRS232 header

RS485 header

2x DDR3L 1066MT/s Non-ECC SO-DIMM

Realtek ALC892

Wi-Fi +3G

1 x Audio port(line-out/mic)

PMIC

1 x Intel LAN (Springville)

1 x Realtek LAN(RTL8111 G)

SATA + SATA PWR

TPM



StoragemSATA (default)HDD/SSD

Half-size Mini PCIe slotStandard SATA 2.0 connector (optional)2

AudioIntegrated HD Audio Codec Codec modelPort

SupportedRealtek ALC892 1 × 3.5mm jack with line out and mic

USBUSB 3.0USB 2.0

2 × USB 3.0 port2 × USB 2.0 port; 1 × USB 2.0 port (header)

Network

Gigabit LAN portIntel LAN controller model2nd LAN controller model3G + WiFi

2 × RJ45 portSpringville (i210-LM) Realtek (RTL8111G)1 × full-size Mini PCIe slot + 1 × Micro SIM slot

Serial Port COM port header (RS232 and RS485) 2 × COM header

Power Supply Mobile 48W DC power brick 12V @4.0A input DC power

Others

ClocksRTCProcessor VRTPM

Fully integrated clockingBattery-backed real-time clockIDT PMICSLB9635TT; TPM ver 1.2

System Form Factor Dimension System Form Factor 4.64” × 4.84”

PCB Dimensions

Board Form Factor Board Z-height System Z-height PCB layer count

4.4” × 4.6”0.51”0.67”10 layers

1. Available RAM slots depend on the SOC SKU. Atom E3815 and Atom E3825 SOC only support single-channelSODIMM.

2. This feature’s part is not populated on the development kit system.

Table 5. Supported SOC Models

SOC Model Cores Core

Speed L2 Cache DDR3L Speed

Graphics Freq TDP Temp Range ECC

Support

Atom E3845 4 1.91GHz 2MB 1333MT/s 542/

792MHZ 10W -40˚ to 110˚C Yes

Atom E3827 2 1.75GHz 1MB 1333MT/s 542/

792MHZ 8W -40˚ to 110˚C Yes

Atom E3826 2 1.46GHz 1MB 1066MT/s 542/

792MHZ 7W -40˚ to 110˚C Yes

Atom E3825 2 1.33GHz 1MB 1066MT/s 533MHz

(no turbo) 6W -40˚ to 110˚C Yes

Atom E3815 1 1.46GHz 512KB 1066MT/s 400MHz

(no turbo) 5W -40˚ to 110˚C Yes

Celeron N2920 4 1.86GHz 2MB 1066MT/s 311/

844MHZ 7.5W 0˚ to 105˚C No

Table 4. Features and Specifications (Sheet 2 of 2)

Features Specifications Details



3.3 Power Management StatesTable 6 describes the transition rules among the various states.

Note: Transitions among the various states may appear to temporarily transition through the intermediate states. These intermediate transitions and states are not listed in the table.

The different voltages, power well, and activity states for the power nets are shown in Table 7.

Table 6. Power Management States Description

State Description

G0/S0/C0 FULL ON: CPU operating. Individual devices may be shut down to save power. The different CPU operating levels are defined by the Cx states.

G0/S0/Cx Cx State: CPU manages C-state by itself.

G1/S3

Suspend-to-RAM (STR): The system context is maintained in the system DRAM, but the power is shut off to non-critical circuits. Memory is retained, and continues to be refreshed. All external clocks are shut off except for RTC and internal ring oscillator clocks which are still toggling.

G1/S4Suspend-to-Disk (STD): The system context is maintained in the disk. All the power is shut off except for the logic to resume. The S4 and S5 states are treated equally.

G2/S5Soft-Off: The system context is not maintained. All the power is shut off except for the logic to restart. A full system boot is required to restart or wake up. The S4 and S5 states are treated equally.

G3

Mechanical OFF: The system context is not maintained. All the power is shut off except for the RTC. No “waking” events are possible due to the system has no power. This state occurs if the user remove the batteries, turns off a mechanical switch, or if the system’s power supply is at a level that is insufficient to power the “waking” logic. When the system’s power is restored, the transition depends on the state prior to the entry to G3.

Table 7. Development Board Power States (Sheet 1 of 2)

POWER NET VOLTAGE POWER WELL ACTIVITY STATES

V12_A 12V ALWAYS ON S0–S5

V12_SATA 12V CORE S0

V5_A 5V ALWAYS ON S0–S5

V3P3_A 3.3V ALWAYS ON S0–S5




VHDMI 5V CORE S0

V3P3_S 3.3V CORE S0

V1P8_S 1.8V CORE S0

V1P5_S 1.5V CORE S0

V1P35_S 1.35V CORE S0

V1P2_S 1.2V CORE S0

V1P05_S 1.05V CORE S0

V1P0_S 1.0V CORE S0

VNN_S 0.5–1.2V CORE S0



VCC_S 0.5–1.2V CORE S0

VDDQ 1.35V DDR S0–S3

VTT_DDR 0.675V DDR S0

Table 7. Development Board Power States (Sheet 2 of 2)

POWER NET VOLTAGE POWER WELL ACTIVITY STATES


Development Kit Setup

4.0 Development Kit Setup

4.1 IntroductionThis section describes the following:

• Lists the major components and their locations on the development board, front panel, and back panel

• Describes the pinouts of the headers

• Lists the LED indicator locations and the colors for different power states

• Provides the configuration settings for the Intel® Atom™ Processor E3800 Product Family

4.2 Layout of the Board, Front Panel, and Back PanelThe following figures and tables show the development board (top and bottom), front panel, and back panel layout, including the location of each major components with the reference designators.

Figure 2. Development Board Top Layer Layout



Table 8. Development Board Top Layer Components Description

Item Number Description Reference Designator

T1 Intel® Atom™ Processor E3800 Product Family U3C1

T2 GbE controller 2 (RTL8111G) U3A4

T3 TPM (SLB9635TT) U3A5

T4 Audio Codec (ALC892) U4C2

T5 SPI chip U4C1

T6 Non-ECC DDR3L SODIMM connector (CH A) J3D1

T7 Micro SIM slot J2A1

T8 RTC Battery connector J4A1

T9 Chrontel* LVDS converter U1C1

T10 PMIC U2B3

T11 Power jack J4L1

T12 USB 3.0 single connector J4P1

T13 USB 2.0 single connector J1N2

T14 Single port audio jack J1N1

T15Single LAN RJ45 connector 1Single LAN RJ45 connector 2

J1M2J1M1



Figure 3. Development Board Bottom Layer Layout

Table 9. Development Board Bottom Components Description (Sheet 1 of 2)


B1 GbE controller 1 (Springville-i210) U2M1

B2 Mini PCIe connector (full size) J3L1

B3 Mini PCIe connector (half size) J3M1

B4 Non-ECC DDR3L SODIMM connector (CH B) J3P1

B5 Serial Port header (COM 1) J2L1

B6 RS485 header (COM 2) J1L1

B7 SATA 3.0 connector J2L2

B8 SATA power header J1L2

B9 LVDS backlight power selection header J4M1

B10 LVDS backlight connector J4M2

B11 LVDS connector J4M3

B12 LVDS panel power selection header J4M4

B13 Power jack J4L1

B14 Micro HDMI connector J4L2



B15 HDMI connector J4N1

B16 USB 3.0 single connector J4P1

B17 Micro USB connector J4P2

B18 Power button S1P2

B19 Reset button S1P1

B20 USB 2.0 single connector J1N2

B21 Single port audio jack J1N1

B22Single LAN RJ45 connector 1Single LAN RJ45 connector 2

J1M2J1M1

Figure 4. Front Panel Layout

Table 10. Front Panel Components Description


FP1 Power button S1P2

FP2 Reset button S1P1

FP3 USB 2.0 single connector J1N2

FP4 Single port audio jack J1N1

FP5Single LAN RJ45 connector 1Single LAN RJ45 connector 2

J1M2J1M1

Figure 5. Back Panel Layout

Table 9. Development Board Bottom Components Description (Sheet 2 of 2)




4.3 Header Pinout Configuration

4.3.1 Development Board Header Pinout

The following tables list the pinout configuration for the headers, and their corresponding signal names, on the development board.

Table 11. Back Panel Components Description


BP1 Power jack J4L1

BP2 Micro HDMI connector J4L2

BP3 HDMI connector J4N1

BP4 USB 3.0 single connector J4P1

BP5 Micro USB connector J4P2

Table 12. SATA Power Header (J1L2)

Pin Signal Name

1 5V

2 GND

3 GND

4 12V

Table 13. LVDS Connector (J4M3) (Sheet 1 of 2)

Pin Signal Name

1 VDD_BKL

2 CH7511B_PWM

3 VDD_LVDS

4 BKL_EN

5 LVDSA_CLK_CE_N

6 LVDSA_CLK_CE

7 VDD_LVDS

8 GND

9 LVDSA_DATA0_N

10 LVDSA_DATA0

11 LVDSA_DATA1_N

12 LVDSA_DATA1

13 LVDSA_DATA2_N

14 LVDSA_DATA2

15 LVDSA_DATA3_N

16 LVDSA_DATA3

17 GND

18 GND



19 LVDSB_DATA0_N

20 LVDSB_DATA0

21 LVDSB_DATA1_N

22 LVDSB_DATA1

23 LVDSB_DATA2_N

24 LVDSB_DATA2

25 LVDSB_DATA3_N

26 LVDSB_DATA3

27 GND

28 GND

29 LVDSB_CLK_CE_N

30 LVDSB_CLK_CE

Table 14. LVDS Backlight Connector (J4M2)

Pin Signal Name

1 V12_A

2 CH7511B_PWM

3 VDD_BKL

4 GND

Table 15. LVDS Backlight Power Selection Header (J4M1)

Pin Signal Name

2–1 V12_A

2–3 V3P3_S

Table 16. LVDS Panel Power Selection Header (J4M4)

Pin Signal Name

1–3 V5_A

4–3 V12_A

5–3 V3P3_S

Table 13. LVDS Connector (J4M3) (Sheet 2 of 2)

Pin Signal Name



Table 17. Serial Port Header (RS485)

• COM2: J1L1

Table 18. Serial Port Header (RS232)

• COM1: J2L1

4.4 Push-Buttons and LED Indicators

4.4.1 Power-On and Reset Buttons

The development kit system has two push-buttons: POWER and RESET. The POWER button enables or disables power to the entire development kit system causing it to boot or shut down. The RESET button forces the system to warm reset.

The locations of the POWER and RESET buttons are shown in Table 19.

Pin Signal Name

1 GND

2 COM2_CTS_P

3 COM2_RTS_P

4 COM2_RXD_P

5 COM2_RXD_N

6 COM2_CTS_N

7 COM2_RTS_N

8 COM2_TXD_P

9 COM2_TXD_N

10 NC

Pin Signal Name

1 NC

2 COM1_RXD_C

3 COM1_TXD_C

4 NC

5 GND

6 NC

7 COM1_RTS_C_B

8 COM1_CTS_C_B

9 NC

10 NC



4.4.2 LED Indicators

There are two LED indicators in the development kit system: power button LED and standby LED. The power button LED is located at S1P2, while the standby LED is located at DS4L1.

The location, power state, and color of the LED indicators are shown in Table 20.

4.5 Intel® Atom™ Processor E3800 Product Family Configuration Settings

4.5.1 R4A12 — Clear/Keep CMOS Settings

Clearing the contents of the CMOS and all BIOS settings restores the development kit system to factory default values.

Note: R4A12 is open by default.

To restore the BIOS settings:

1. Turn off the development kit system, and unplug the power cord.

2. Short two solder pads at R4A12 for a few seconds using a tweezer or a blue wire (that is, connect pin 1 and pin 2), and then leave it open. Note that these pins are not shorted by default.

3. Turn on the development kit system.

Table 19. Push-Buttons Location Table

Description Reference Designator

Power button S1P2

Reset button S1P1

Table 20. LED Indicators Table

Description Reference Designator Power State Color

Standby LED DS4L1 S3/S4 Yellow

Power button LED S1P2 S0 Blue


Flash BIOS Procedure for the Development Kit System

5.0 Flash BIOS Procedure for the Development Kit System

5.1 IntroductionThis section provides the instruction for flashing the BIOS on the Intel® Atom™ Processor E3800 Product Family development kit. The development kit system needs to be disassembled before the flash BIOS procedure can be performed. For more information, refer to Section 7.0, “Disassembly and Reassembly Procedure” on page 33.

5.2 Required EquipmentThe following equipment is required to flash the BIOS for the development kit system:

• DediProg* SF100 IC Programmer (http://www.dediprog.com/pd/spi-flash-solution/sf100)

• Test Clip SO8 (http://www.dediprog.com/pd/programmer-accessories/ISP-TC-8)

• Host PC with the DediProg software installed

Figure 6. DediProg Programmer with Test Clip

http://www.dediprog.com/pd/spi-flash-solution/sf100

http://www.dediprog.com/pd/spi-flash-solution/sf100

http://www.dediprog.com/pd/programmer-accessories/ISP-TC-8



5.3 Flash BIOS ProcedureThe following illustrates the procedure to flash the BIOS on the development kit system.

Caution: Ensure that all precautions are taken before handling the development board. Refer to Section 7.2, “Precautions and Safety Handling of the Development Kit System” on page 33.

1. Identify the location of the SPI chip on the development board as shown in Figure 7.

2. Attach the DediProg test clip onto the SPI chip as shown in Figure 8.

Note: The white dot on the silk-screen refers to Pin 1.

Figure 7. SPI Chip Location



3. Connect the DediProg programmer to the host PC via the USB interface.

Note: Ensure that the host PC has the DediProg software installed.

4. Open the DediProg software on the host PC and click Detect. If the test clip is attached correctly, a dialog box will display W25Q64DW under the Memory List as shown in Figure 9.

Figure 8. Attaching the DediProg Test Clip onto the SPI Chip



5. After the device is detected, click OK to close the dialog box.

6. Click File and the Load File dialog box will appear. Select the raw binary file (.bin) from the host PC as shown in Figure 10. Click OK to load the raw binary file.

Figure 9. Detecting the DediProg Programmer Device



7. Click Prog to begin processing the raw binary file. Wait for the processing to finish as shown in Figure 11.

Figure 10. Loading the Raw Binary File



8. After the processing of the raw binary file is complete and successful, the Programming OK message will appear as shown in Figure 12.

Figure 11. Processing the Raw Binary File



9. Click Verify to begin the verification process. Wait for the processing to finish as shown in Figure 13.

Figure 12. Completing the Raw Binary File Process



10. After the verification process is complete and successful, the Checksum Identical message will appear as shown in Figure 14.

Figure 13. Verifying the Programming Process



11. The BIOS flash procedure is now complete. Close the DediProg software and remove the DediProg test clip from the development board.

Figure 14. Completing the Verification Process


Mechanical Design Information for the Development Kit System

6.0 Mechanical Design Information for the Development Kit System

6.1 IntroductionThe Intel® Atom™ Processor E3800 Product Family development kit offers powerful computing performance in a compact chassis measuring 4 × 4 inches and 17.4mm in thickness. This form factor together with another 4 × 7 inch form factor are the standard for the Intel® Intelligent System Extended (ISX) Reference Design that introduces a small form factor reference design built on the powerful Intel Architecture platform.

The development board is enclosed in a plastic/metal chassis. To meet the thermal requirements of the Intel® Atom™ Processor E3800 Product Family, the heat from the processor is spread to the chassis by a copper pedestal attached to the bottom aluminum cover. Thermal gap pads are also used to bridge the gap between the peripherals and the chassis so that heat generated by the peripherals can be conducted away. The development kit is a total fanless solution whereby heat dissipation is by means of chassis-cooled.

As part of the Intel® ISX Reference Design program, the mechanical design files for the chassis are mass production ready. The program also gives the flexibility for embedded design houses to modify the mechanical design according to their requirements, which provides opportunities to incorporate the reference design into their custom designs, gain the benefits that the Intel Architecture provides, and accelerate their time-to-market.

6.2 Development Kit System Design and SpecificationFigure shows the design of the development kit system, while Table 21 shows its specification.


Mechanical Design Information for the Development Kit System

Figure 15. Development Kit System Design

Table 21. Development Kit System Specification

Parameter Details

System

Form Factor 4.6” × 4.8”

Thickness 17.4mm

Top Cover

Material Polycarbonate

Color Red (Pantone 202C)

Finishing Matte

Bottom Cover

Material Aluminum

Color Black (Pantone 6C)

Finishing Sandblast

FEATURES

VESA Mount >19” Displays


Disassembly and Reassembly Procedure

7.0 Disassembly and Reassembly Procedure

7.1 IntroductionThis section provides details regarding the following:

• Precautions and safety handling of the development kit system

• Disassembly and reassembly of the development kit system

7.2 Precautions and Safety Handling of the Development Kit SystemThe development kit system contains components that are static-sensitive. Electrostatic can cause underlying damages to the system, resulting in failures occurring within weeks or months. Therefore, Electrostatic Discharge (ESD) prevention is important when handling the system.

Observe the following precautions and safety handling before disassembling the development kit system:

• Ensure that the working area is properly grounded using the highest level of ESD protection available. Intel recommends using a wrist strap, ground cords, a table mat, a floor mat, ESD shoes, and an ESD chair.

• Do not wear nylon clothing when handling the system.

• Touch an electrical ground to remove any electrostatic charge from your body that may have accumulated before touching the system.

• If possible, handle the system’s components by holding on to the package and not by the leads.

• Use ESD protection bags when storing or moving the system’s components.

• Ensure that all power source is removed from the system.

Warning: Failing to comply with the proper grounding and handling procedures may cause damage to the development kit system.

7.3 Development Kit System Disassembly and Reassembly Intel recommends not disassembling the development kit system for repair purposes. If the system is faulty and requires repair, please send it to the nearest Intel Service Center.

The following disassembly procedure should be performed only if necessary.

1. Ensure that all cables and power source are removed from the development kit system.

2. Remove the four M3 × 10 screws from the bottom side of the chassis as shown in Figure 16.



3. Lift up the top cover from the HDMI port side.

Note: The top cover needs to be lifted up at an angle as shown in Figure 17.

Figure 16. Development Kit System Screws Removal



4. Remove the main PCB board by lifting it up from the HDMI port side at an angle as shown in Figure 18.

Figure 17. Top Cover Removal



This concludes the disassembly portion of the development kit system. To assemble the development kit system, follow the above disassembly procedure in reverse order.

§ §

Figure 18. Development Board Removal


Development Kit Accessory

Appendix A Development Kit Accessory

A.1 Thermal Jacket (Optional)


Development Kit System Exploded View

Appendix B Development Kit System Exploded View

Intel Atom™ Processor E3800 Product Family Development Kit ... · Intel® Atom™ Processor E3800...

Documents

Transcript of Intel Atom™ Processor E3800 Product Family Development Kit ... · Intel® Atom™ Processor E3800...