Integrated Microelectronics Inc. (corporate brochure)
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Transcript of Integrated Microelectronics Inc. (corporate brochure)
ABOUT
MILESTONES
Made it to list of the top 50 global EMS providers of Manufacturing Market Insider
2006
Received Circuits Assembly’s Service Excellence Award for Highest Overall Customer Ranking
2007
Listed by way of introduction on the Philippine Stock Exchange, established IMI Energy Solutions, and acquired power semiconductor company PSi Technologies, Inc.
Acquired EPIQ subsidiaries in Bulgaria, the Czech Republic,and Mexico
IMI has multiple sites spread out in Asia, North America, and Europe, providing solutions to OEMs catering for both regional and international markets
2010
2011
PRESENT
Started offering design and product development services
1998
Established global footprint through acquisition of the EMS assets of Saturn Electronics and Engineering Inc. and then Speedy-Tech
2005
Obtained the Philippine Quality Award level III for mastery in quality management
2001IMI was established as a joint venture between Ayala Corporation and Resins Inc.
1980
Expanded IC assembly business into contract manufacturing of electronics assemblies
1982
ISO 9001:2008 Quality Management System
ISO 14001:2004 Environmental Management System
ISO/TS 16949:2009 Quality Management System for Automotive Applications
ISO 13485:2003 Quality Management System for Medical Devices
QC080000 Hazardous Substance Free Process Management System
ISO/IEC 17025:2005 Quality Management System for Testing and Calibration Laboratories
International Standard Certifications include:
Philippines Singapore China Japan USA Mexico Bulgaria Czech Republic
buILd yOuR buSINESSwITh IMI’S INNOvaTIvE aNd FLExIbLE SOLuTIONS
Integrated Micro-Electronics, Inc.North Science AvenueSpecial Export Processing ZoneLaguna Technopark, Biñan 4024Laguna, PhilippinesTel (63 2) 756 6840Fax (63 49) 544-0322Email [email protected]
Speedy-Tech Electronics Ltd.Speedy-Tech Industrial Building20 Kian Teck LaneSingapore 627854Tel (65) 6262 1118Fax (65) 6262 6668
Shenzhen Speedy-Tech Electronics Co., Ltd.Speedy-Tech Industrial BuildingArea 7, Liantang Industrial ZoneLuo Hu, ShenzhenPeople’s Republic of China 518004Tel (86) 755 2570 8382Fax (86) 755 2570 8019
Speedy-Tech Industrial buildingBuilding A-3 & 4, Bengkang Industrial Zone,Jinye Road, Kuichong Town, Dapeng DistrictShenzhen, People’s Republic of ChinaTel (86) 755 8977 3788Fax (86) 755 8977 3068
Speedy-Tech Electronics (Jiaxing) Co., Ltd.Building 1-3, No. 688, Blk 3 He Ping Street Economic Industrial ZoneJiaxing City, ZhejiangPeople’s Republic of China 314001Tel (86) 573 82224 999Fax (86) 573 82210 558
PSi Technologies, Inc.Lot B2-5 Carmelray Industrial Park IIBarangay Tulo, Calamba, LagunaTel (63 2) 405 5001, (63 49) 554 9995 to 99 www.psitechnologies.com
IMI SaLES OFFICES
IMI Japan, Inc.461-0005 Aichi-ken,Nagoya-shi, Higashi-ku,Higashisakura 2-5-11Shoener Building 4th FloorTel (81 52) 932 1001Fax (81 52) 932 2002
IMI Europe & Middle East(Representative Office)Plockinger Str. 23D-85 298 ScheyernMunich, GermanyTel (49 8441) 80 3840Fax (49 8441) 80 3916
LOGISTICS OFFICE
Speedy-Tech Electronics (hK) Ltd.Unit B, 10/F, CDW Bldg.,No. 388 Castle Peak Road,Tsuen Wan, N.T., Hong KongTel (852) 2413 9830Fax (822) 2413 5911
IMI (Cheng du) Co., Ltd.Muwei Industrial Park , Huanghe Road, XinduDistrict Industrial Zone, East Chengdu City,Sichuan Province, People’s Republic of China 610500Tel (86) 28 8395 8377Fax (86) 28 8395 5509
IMI uSa Inc.14312 Franklin AvenueSuite A, Tustin, CA 92780, USATel (1 714) 734 7043Fax (1 714) 838 8787
IMI Energy Solutions46453 Landing ParkwayFremont, CA 94538Tel (1 510) 770 9825Fax (1 510) 770 9937
Integrated Micro-Electronics bulgariaIndustrial Zone “Mircroelektronika” P.O 662140 Botevgrad, Municipality of BotevgradSofia District, BulgariaTel (359) 723 68 359Fax (359) 723 68 246
Integrated Micro-Electronics Czech Republic S.r.o.Plzenká 1067, Třemošná 330 11Czech RepublicTel (420) 377 882 611Fax (420) 377 882 610
Integrated Micro-Electronics México, S.a.P.I. de C. vCalle 4 Poniente No. 10560Parque Industrial El Salto,C.P.45680 El Salto, Jalisco, MéxicoTel (52) (33) 4777-1500Fax (52) (33) 4777-3263
yOuR PaRTNER OF ChOICE.
IMI is a vertically-integrated global provider of electronics manufacturing services (EMS) and power semiconductor assembly and test services (SATS). Within the EMS market, we have consistently ranked among the top 30 in the world based on the Manufacturing Market Insider’s list. We have the capabilities to take on your specific outsourcing needs, providing you with innovative and flexible solutions that encompass design and product development, advanced manufacturing engineering, volume manufacturing, value engineering, test and systems development, automation, failure analysis and reliability testing, plastic encapsulation, and logistics and order fulfilment. Having served a variety of companies across different industries in several countries, we recognize that each business is unique. With this in mind, we go the extra mile to integrate our processes and systems with yours and tailor them to fit perfectly with your needs.
CollaborationWe make your concerns our concerns. We are passionate about what we do, and what we do best is work closely with you to achieve your objectives.
FlexibilityWe often challenge our own systems and processes to make sure that they are performing optimally. We are a company of quick thinkers comprising design, logistics and production people, with processes adaptable to your requirements.
PrecisionWe solve your problems to maximize your potential. We leverage our expertise – our capabilities, experience, and geographic footprint – to handle the complexities of your business. We take advantage of economies of scale, committed to minimizing your expenses and optimizing your results. We deliver quality products and services.
Standard business Model
Provides standard production processes
Semi-Custom business Model
Allows customers to integrate specific and custom-built processes into the standard manufacturing line
Custom business Model
Allows customers to gain a satellite factory through IMI.
business Models
design & Engineering SolutionsContract design and Joint development Solutions• Power Electronics• Embedded Systems• Camera and Imaging Systems• Power Semiconductors• Short-Range Wireless
design Services• Hardware & Software Development• Mechanical Design• Printed Circuit Board Layout• Design for Manufacturability, Reliability, and Testability• Simultaneous Engineering• Value Engineering• Prototyping
Pre-Certification Testing• FCC• RFI/EMI Testing• UL Safety• CSA• Other Customer Standards
advance Manufacturing Engineering (aME) Capabilities• Direct Chip Attach (COB, Flip Chip, and
Chip on Silicon)• Multi-Chip Module (MCM) and
Microsystem• MEMS (Microelectromechanical Systems)
Assembly• Thermally Enhanced Direct Chip Attach• Advanced Surface Metallurgies• Pre-flow Underfill Process (IMI Patent)• Traceless Flip Chip Technology (IMI Patent)• Substrate and Interconnect Technology• Small Precision Assembly
Test & System development • Co-development of test
specifications concurrent to new product development
• Design for testability and flexibility for product revisions
• Turnkey hardware design and assembly
• Parallel test solutions for high volume manufacturing
• Software development and upgrades
• Test documentation • Training and 24x7 manufacturing
support
Support & Fulfilment • Supply Chain Management
• ERP-based Materials Management
• Cost Management• Supply Chain Optimization• Supply Chain Assurance &
Continuity of Supply• Leveraging Resources
• Logistics and Distribution • Order Management • After-sales Service
1
Reliability Test, Failure analysis, and Equipment Calibration Capabilities Calibration Services• Thermometry• Electrical equipment • Metrology
Reliability Engineering• Accelerated testing to determine product
life expectancy, warranty and reliability
Failure analysis• Data analysis • Identification of the failure mode, failure
mechanism, and probable causes• Advice on preventive measures IMI Singapore, in particular, has a complete facility set-up that includes: • FCC-listed 10m semi-anechoic chamber
and shielded room for radiated emission• Shielded Room• EMC Diagnosis Equipment• Full-Compliance EMC Test and
Measurement Equipment• HALT/HASS Chamber, Climatic Chamber• Infrared Thermal Imager• Optics Laboratory
5
2 New Product Introduction (NPI)Services• Product Concept• Product Development• Process & Test Development• Design for Manufacturability• Design for Reliability• Prototyping• Line Integration• Offshore Manufacturing
3
Manufacturing SolutionsManufacturing• Complete Box Build• Sub-Assembly• Component Assembly• Processing rigid, flexible, ceramic and glass
substrates• RoHS-compliant Systems • Precision Assembly
• Specialty non-PCB substrates• Direct Die Attach• Die Attach & Wire Bond (Al & Au)
• PCB & FPC Assembly• Chip-on-Board• Flexible PCBA• Aluminium PCBA• Ceramic PCBA• Flip Chip • Hybrid Module PCBA• PCBA with Multiple BGA SMT –
Automated Manufacturing• Multi-Chip Module (MCM) and Microsystem• MEMS Assembly• Selective and Robotic Soldering• Cleanroom Operations• Power Semiconductor• Plastic Injection
46
7
IMI’S GLObaLFaCILITIES
By partnering with IMI, you can leverage our global network of manufacturing and engineering capabilities in key continents of the world.
Our plants in China and the Philippines are used for manufacturing for China and other emerging markets of Asia as well as for global markets, while our facilities in North America and Europe serve as a manufacturing base for OEMs that wish to lower their total cost of production through regional outsourcing.
Manufacturing Engineering Sales
uSa
FremontCalifornia
TustinCalifornia Guadalajara
Mexico
San AntonioTexas
DetroitMichigan
China Japan(Sales office only)
EuROPE
TřemošnáCzech Republic
BotevgradBulgaria
Shenzhen( Liantang, Kuichong)
JiaxingChengdu
LagunaTaguigCavite
Philippines
Singapore (Sales office only)
France
Germany
automotive electronics
IMI's Key Capabilities
• AutomotiveCameraPlatform
• SensorsandImagingContractDesign
• PowerElectronics
• COBManufacturing
• ProductMiniaturization
• DFMandDFT
• TestEquipmentDevelopment
• RigidPrintedCircuitBoardAssembly
• FlexPrintedCircuitAssembly
• FlipChipProcess
• AutomaticPinInsertion
• SimultaneousEngineering
• ISO/TS16949:2009CertifiedLines
• CriticalPartMonitoring(CPM)
• RejectProfileAnalysis(RPA)
• PartsAverageTest(PAT)
• StatisticalBinAnalysis
• RoHSCompliantLines
automotive electronics
integrated micro-electronics, inc.NorthScienceAvenueSpecialExportProcessingZoneLagunaTechnopark,Biñan4024,Laguna,Philippines
Tel:(632)7566840Fax:(6349)5440322Email:[email protected]
AutomotiveCameraSunroofControllerAnti-FogSensor
TachometerInfotainment
DashboardBacklight
CarWiperPCBA&EnclosureSystem
GPS/GSMFleetTrackingSystem
LaneDepartureWarningSystem
RotatorSpeedController
OccupancySeatSensor
CruiseControlHeadlightControl
CarAlarmSystem
AutoDoorLockSystem
TirepressureSensorPCBA
TransmissionGearSensor
ABSPressureSensorPCBA
LEDTailLights
Product Experiences
• AutomotiveCamera• PCBAforElectronicStabilityProgram(ESP)• TirePressureSensorPCBA• CarWindshieldTemperatureandHumiditySensor• ElectronicPowerSteering(EPS)RotorPositionSensor(RPS)• PCBAforHeadlight• SwitchControllerforMainLight• CommunicationPowerPCBA• BodyControlModule(BCM)
• AntennaReceiver/DABTuner• PowertrainControlSolutions• SemiconductorsusedinElectricDrive/HybridElectricVehicles• FuelManagement• PumpDriver• SteeringWheelControlDevice• CockpitControlDevice• AudioProcessor• PlasticInjectionMolding
inDustrial
IMI's Key Capabilities
• Low-Volume/High-Mix
Manufacturing
• PowerSupplyDesign
• SensorandImagingContractDesign
• MechanicalEnclosureDesign
• DFMandDFT
• TestEquipmentDevelopment
• RigidPrintedCircuitBoardAssembly
• AutomaticPinInsertion
• COB(Au&AlWires)
• CompleteBoxBuild
• MediumtoHighPowerDiscrete
PackagesandProcess
• PowerModules
• RoHSCompliantLines
inDustrial
integrated micro-electronics, inc.NorthScienceAvenueSpecialExportProcessingZoneLagunaTechnopark,Biñan4024,Laguna,Philippines
Tel:(632)7566840Fax:(6349)5440322Email:[email protected]
Product Experiences
• AutomatedMeterReading(AMR)
• SecurityDevice
• ElectronicDoorAccessSystem
• SmartCard
• PointofSalesSystem
• PrinterControlBoard
• PowerAmplifier
• DC-DCPowerConverter
• EngineControllers
• WeldingMachineInverter
• MotorDriversforConveyor
• FanMotorControlBoard
• ComputerNumericalControl(CNC)ControlBoard
• MainPowerSuppliesforLEDStreetLighting
• ModulesforRenewableEnergyGeneration,TransmissionandConversion
meDical electronics
IMI's Key Capabilities
• Low-Volume/High-Mix
Manufacturing
• ProductDesignCo-development
• DFMandDFT
• ProductMiniaturization
• RigidPrintedCircuitBoardAssembly
• FlexPrintedCircuitAssembly
• FlipChipOnFlexAssembly
• COBincludingDieAttachedof
ImagerDie
• ISO13485:2003CertifiedLines
meDical electronics
integrated micro-electronics, inc.NorthScienceAvenueSpecialExportProcessingZoneLagunaTechnopark,Biñan4024,Laguna,Philippines
Tel:(632)7566840Fax:(6349)5440322Email:[email protected]
Product Experiences
• FlatPanelImagingEquipment
• AutoBodyContouringImagingEquipment
• DentalImagingSystem
• DefibrillatorComponent
• ConcealedHearingAid
• BiomedicalandLaboratoryEquipment
• CentrifugeControlBoard
• FitnessEquipmentControlBoard
telecommunication infrastracture
IMI's Key Capabilities
• DesignforManufacturability
• ProductMiniaturization
• Pre-certificationTesting
• TestEquipmentDevelopment
• RigidPrintedCircuitBoardAssembly
• COBincludingDieAttachedof
ImagerDie
• CompleteBoxBuild
• RepairServices
• RoHSCompliantLines
• PowerQFN
• PowermiteTM
• PowerManagement(IC)Discrete
Packaging,e.g.,TO-220,TO-263,
TO-252,TO-247 andPowerflexTM
telecommunication infrastracture
integrated micro-electronics, inc.NorthScienceAvenueSpecialExportProcessingZoneLagunaTechnopark,Biñan4024,Laguna,Philippines
Tel:(632)7566840Fax:(6349)5440322Email:[email protected]
Product Experiences
• BackPanelforTelecommunicationBoard
• Fibertothe“X”(FFTx)Systems
• BoosterAmplifier
• GPON(GigabitPassiveOpticalNetwork)Systems
• WirelessSecuritySystem
• BaseStationPowerSupply
• DigitalStationControlBoard
• PowerTransistorsforAmplifiersinCellularBaseStations
• PowerConversionICsinAdaptersandChargersforCellPhones
andCordlessPhones
• DCPortandUSBPortProtectionforCellphonesandSatellite
RadioPeripherals
storage Devices
IMI's Key Capabilities
• ProductMiniaturization
• TestEquipmentDevelopment
• RigidPrintedCircuitBoardAssembly
• FlexPrintedCircuitAssembly
• FlipChipProcess
• MechanicalandOpticalPrecision
Assembly
• CompleteBoxBuild
• RoHSCompliantLines
• PowerQFN
• PowermiteTM
• PowerManagement(IC)Discrete
Packaging,e.g.,TO-220,TO-263,
TO-252,TO-247andPowerflexTM
storage Devices
integrated micro-electronics, inc.NorthScienceAvenueSpecialExportProcessingZoneLagunaTechnopark,Biñan4024,Laguna,Philippines
Tel:(632)7566840Fax:(6349)5440322Email:[email protected]
Product Experiences
• CD/ComboDrive
• DVDDrive
• Blu-RayDiscDrive
• HardDiskDrive
• SolidStateDrives
• PrinterSensor
• PrinterControlBoard
• Multi-FunctionCopierMachine
• DVDRecorderPowerSupply
• PowerSuppliesforServers,PCs,Notebooks,andNetbooks
• Over-voltageProtectionforHDDandDCPortProtectionfor
KeyboardMouse
consumer electronics
IMI's Key Capabilities
• Cost-EffectiveHigh-Volume
Manufacturing
• FirmwareDevelopment
• MechanicalEnclosureDesign
• LowProfileSwitchModePowerSupplies
• Pre-certificationTesting
• TestEquipmentDevelopment
• FlipChipProcess
• AutomaticPinInsertion
• CompleteBoxBuildAssembly
• LowtoHighPowerOutline
Packages
• SmalltoLargeOutlinePackages
• SpecializedInterconnectProcess
forProductPowerRequirements
• PlasticInjection
consumer electronics
integrated micro-electronics, inc.NorthScienceAvenueSpecialExportProcessingZoneLagunaTechnopark,Biñan4024,Laguna,Philippines
Tel:(632)7566840Fax:(6349)5440322Email:[email protected]
Product Experiences
• UltrasonicToothbrush
• HybridIC
• GasIgnitorandRe-Ignitor
• Air-Conditioning(HVAC)Controller
• ProjectorLampDrivers
• PowerManagementandHomeApplianceforLightingControl
• RefrigeratorandCookerHoodControlBoard
• HouseholdMeteringDevice
• BluetoothHeadset
• ElectricDriveControlforHomeAppliances
• MainPowerSupplyforFlat-panelTV
• PowerSupplyforGameConsolesandEntertainmentElectronics
• HighVoltagePowerConversionICsinAdaptersandChargersforPersonalElectronics
• GarageDoorControl
• ProgrammableTimer
• PressureCookerModules
• SteamerControllerModules
• WashingMachineControllers
• CoffeeMachine
renewable energy
IMI's Key Capabilities
• PVModuleorPanelDesign/
Co-Development
• MaterialsQualification
• ProcessDevelopment
• Prototyping
• PanelTestingandCertification
(withRETC)
• Low-VolumeManufacturing
ofEngineeringorMarketing
Samples
• MassProductionofSolarPanels
(inJiaxing,China)
renewable energy
integrated micro-electronics, inc.NorthScienceAvenueSpecialExportProcessingZoneLagunaTechnopark,Biñan4024,Laguna,Philippines
Tel:(632)7566840Fax:(6349)5440322Email:[email protected]
Product Experiences
• PVPanelAssembly
• PVCo-DesignandDevelopment
• PVPanelHighVolumeManufacturing
• PVPanelPlatform
• PVInverterPlatform
• InverterElectronics
power semiconDuctors
IMI's Key Capabilities
• Low-VolumeHigh-MixandHigh-VolumeLow-MixManufacturing
• PowerElectronicsContractDesign• RapidPrototyping• VirtualPrototyping(mechanicaldesigntoapplicationsimulation)
• PackageDesignandCo-development• HermeticsAssemblyCapability• CeramicIsolatedPackageTechnologyavailable
• HighDensityMatrixLeadFrameDesign• CUClipDesign• QFNMCMDesign• QFN3DDesign• TestEquipmentandProcessDevelopment
• ISO/TS16949:2002CertifiedLines• LowNRECost,duetoPrototypeAssemblyLine
power semiconDuctors
integrated micro-electronics, inc.NorthScienceAvenueSpecialExportProcessingZoneLagunaTechnopark,Biñan4024,Laguna,Philippines
Tel:(632)7566840Fax:(6349)5440322Email:[email protected]
Product and Package Experiences
• PowerComponentsPackageExperiences-TO220,TO220FP,TO247,TO252,TO264,SOT227-HermeticsPackagesTO257,TO258-Al-wireandAu-wireBonding-StandardandVacuumSolderReflow
• PowerQFNProductExperiences-SawSingulationMultiDieandStackedDie-ICattachacctoDrMOSStandard-StackedDiePowerStage-ICCuWireBonding-PassiveComponentIntegration-CuClipAttach,AluminumRibbonBonding
• PowerModulesProduct/ProcessExperiences-ThyristorModuleAssemblyandTest(Inverter)-IGBTModuleAssemblyandTest(Inverter)-MOSFETModuleAssemblyandTest(SwitchInverter)-Al-wire,Cu-wire,Au-wireBonding-VacuumReflow,SolderDieAttach-TransferMolding-CaseJoiningPotting