Instrument Series Webinar - Switches 2india.ni.com/sites/default/files/Large Channel Count Switching...

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Transcript of Instrument Series Webinar - Switches 2india.ni.com/sites/default/files/Large Channel Count Switching...

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National Instruments Switches

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Raviteja Chivukula

Webinar OverviewWebinar OverviewWebinar OverviewWebinar Overview

A. Switch BasicsA. Recap

B. Advanced Switch TopicsA. High Channel Switches

B. Fault Insertion Units

C. Resistor Modules

RF Switching

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D. RF Switching

E. Considerations while using Switch Matrix

C. Switch Executive

Switch Basics

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Need for Switches

• Single measurement device – Multiple measurement points

• Nearly every system can benefit from switching• Increases channel count

• Adds measurement flexibility

Simplifies test fixture

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• Simplifies test fixture

• Decreases cost

Test Instruments Test Points Solution

Stimulus/Resp 1 Digitizer, 1 Arb 20 DUTs SWITCHING

Temperature 1 DMM 200 RTDs SWITCHING

Test Architecture

DMMDMMDMMDMM

ArbArbArbArb////FunctGenFunctGenFunctGenFunctGen

DigitizerDigitizerDigitizerDigitizer

Devices Under TestDevices Under TestDevices Under TestDevices Under TestSwitch HardwareSwitch HardwareSwitch HardwareSwitch Hardware

MatrixMatrixMatrixMatrix

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RFRFRFRF AnalyzerAnalyzerAnalyzerAnalyzer

PowerPowerPowerPower SupplySupplySupplySupply

RFRFRFRF GeneratorGeneratorGeneratorGenerator

MatrixMatrixMatrixMatrix

Gen. PurposeGen. PurposeGen. PurposeGen. Purpose

MuxMuxMuxMux

Controlling NI Switches: PXI Options

• Embedded controller

• MXI Connector Kit

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Specifications of a typical matrix card

• Switch TypeSwitch TypeSwitch TypeSwitch Type Matrix

• Max Switching Voltage DCMax Switching Voltage DCMax Switching Voltage DCMax Switching Voltage DC 12 VDC

• Maximum Switching Voltage ACMaximum Switching Voltage ACMaximum Switching Voltage ACMaximum Switching Voltage AC 8 VAC

• Max Switching CurrentMax Switching CurrentMax Switching CurrentMax Switching Current 100 mA

• Maximum Carry CurrentMaximum Carry CurrentMaximum Carry CurrentMaximum Carry Current 100 mA

• Maximum Switching PowerMaximum Switching PowerMaximum Switching PowerMaximum Switching Power 1.2 W

BandwidthBandwidthBandwidthBandwidth 1 MHz

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• BandwidthBandwidthBandwidthBandwidth 1 MHz

• Relay TypeRelay TypeRelay TypeRelay Type FET

• Path Resistance (Typical)Path Resistance (Typical)Path Resistance (Typical)Path Resistance (Typical) 9 Ohm

• Thermal EMFThermal EMFThermal EMFThermal EMF 10 µV

• Scan RateScan RateScan RateScan Rate 50000 cycles/s

• Matrix Config Wire ModeMatrix Config Wire ModeMatrix Config Wire ModeMatrix Config Wire Mode 1-wire

• Matrix Config BanksMatrix Config BanksMatrix Config BanksMatrix Config Banks 1

Advanced Switch Topics

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High Channel Switches – Channel Expansion

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Why expansion?

• Extremely high channel counts

• Strain Measurements on large structures

• Vibration measurements on large structures etc.

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Current Large Matrix Solution

• PXI-2532

• 512 Crosspoints

• Supported topologies

• 4 x 128

• 8 x 64

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• 8 x 64

• 16 x 32

Creating Larger Matrices / Switches / FIUs

• Multiple connected 2532s

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Creating Larger Matrices / Switches / FIUs

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• Expand the PXI-2529

columns using the TB-

2634

• Connect adjacent

terminal blocks with

ribbon cables

PXI Expansion: Matrices

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ribbon cables

Example:

PXI-2529

Two 4x6 Switch Modules -> One 4x12

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•Expansion in Multiplexer mode is possible using analog

bus expansion connectors in front of TB-2605.

PXI Expansion: Multiplexers

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TBTB--26052605

Example:Example:

PXIPXI--25032503

• Column expansion using

SHC68-C68-S cable

• No row expansion

PXI Expansion: Matrices

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Example:Example:

PXIPXI--25352535

Fault Insertion Units

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Fault Insertion Unit (FIU)

• Simulate open, pin-to-pin, short-to-

battery, and short-to-ground faults

• Application – Hardware In Loop Testing

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• Application – Hardware In Loop Testing

• Used to introduce faults between Controller

& Sensor

• NI 2510, NI 2512 etc.

FIU Topology

Controller

Sensor 1

Sensor 2

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FIU – Pass-through Mode

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FIU – Open-circuit Fault

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FIU – Short to GND / Short to PWR

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FIU – Pin to Pin shorts

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272x Resistor Modules

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272x Design Overview272x Design Overview272x Design Overview272x Design Overview

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Green relays: Each bank contains 8 ‘bit’ relays (16 bit banks are 2x8)Green relays: Each bank contains 8 ‘bit’ relays (16 bit banks are 2x8)Green relays: Each bank contains 8 ‘bit’ relays (16 bit banks are 2x8)Green relays: Each bank contains 8 ‘bit’ relays (16 bit banks are 2x8)

Red relay: Infinite resistance (open)Red relay: Infinite resistance (open)Red relay: Infinite resistance (open)Red relay: Infinite resistance (open)

Orange relay: ~0 Ohms (short)Orange relay: ~0 Ohms (short)Orange relay: ~0 Ohms (short)Orange relay: ~0 Ohms (short)

Pink relay: Bridge relay between two banksPink relay: Bridge relay between two banksPink relay: Bridge relay between two banksPink relay: Bridge relay between two banks

Not shown: Test relay to connect to front test connector.Not shown: Test relay to connect to front test connector.Not shown: Test relay to connect to front test connector.Not shown: Test relay to connect to front test connector.

272x Design Overview (cont)272x Design Overview (cont)272x Design Overview (cont)272x Design Overview (cont)

By switching the “green” relays, you decrease the resistance of the

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• By switching the “green” relays, you decrease the resistance of the path.

• Resistor values don’t match exact binary values • Manufacturing differences

• Temperature offset

• Trace and Relay offsets

• NOT able to be calibrated

• Used to replicate RTDs / other sensors, used for load testing, etc

NI 272x Applications

• RTD Simulation

• Other Sensor Simulation

• Resistive Load Simulation etc.

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272x 272x 272x 272x ---- Switch ProgrammingSwitch ProgrammingSwitch ProgrammingSwitch Programming

• Appears like any other switch

• Has appropriately named channels

• Connection and Relay Control APIs both work

• “connect b6->b6r0” vs. “close kb6r0”

• Can use DAQmx, IVI, NI-SWITCH, NI Switch Executive as

a switch device in independent topology.

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a switch device in independent topology.

• NI Recommends the “272x Reference Vis”

NI 272x NI 272x NI 272x NI 272x ---- Reference VIs ProgrammingReference VIs ProgrammingReference VIs ProgrammingReference VIs Programming

• Session Based

• Resistance Based

• “Set Channel 2 to be 100 Ohms”

• Installed by Installer

• Ensures DAQmx Core Product version > 9.5 installed

• Ships with readme and a PDF

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• Ships with readme and a PDF

• Does NOT need NI-SWITCH installed

• example finder support (Help >> Find Examples...)

• VI palettes to Instrument Control

• error code strings

• custom “session handle” to follow session paradigm from other

MI drivers

272x Example Block Diagram272x Example Block Diagram272x Example Block Diagram272x Example Block Diagram

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RF Switch Concepts

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RF Switch Concepts

0 – 500 MHz

NI RF Switch ProductsNI RF Switch ProductsNI RF Switch ProductsNI RF Switch Products

Bandwidth

500 MHz – 2.7 GHz 2.7 GHz – 6.6 GHz 26.5 GHz – 40 GHz

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• 500 MHz 50

switches

• 4 topologies

available

• 2.5 GHz 75 switches

• 2.7 GHz 50 switches

• 6 topologies available

• 5 GHz 504x1 mux

• 6.6 GHz 50 SSR

• 26.5 GHz 50 switches

• 40 GHz 50 switches

• 4 topologies available

21 total modules available

RF Switching SpecificationsRF Switching SpecificationsRF Switching SpecificationsRF Switching Specifications

• Maximum Bandwidth

• Insertion Loss

• VSWR

• Characteristic Impedance

• Crosstalk/Isolation

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• Termination

• Signal Characteristics (Sine or Square, Rise Time, etc.)

• Channel Density

• Maximum Power

What is Insertion Loss?What is Insertion Loss?What is Insertion Loss?What is Insertion Loss?

Zo=50ΩΩΩΩ

Pin Pout

50ΩΩΩΩ

Source Load

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50ΩΩΩΩ

Insertion Loss (dB) = 10 * log10 ( Pout / Pin )

Why Does Insertion Loss Occur? Why Does Insertion Loss Occur? Why Does Insertion Loss Occur? Why Does Insertion Loss Occur?

• Ideal Switch

• But in reality, switch looks more like this

• C = Net Capacitance of Circuit

• R = Path Resistance of Switch

• Insertion loss measures

VoutVin

R

C

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2221

1

CRVV inout

ω+

=inout VV =

• Insertion loss measures attenuation and power loss induced by switch

• For ideal DC systems, ω=0, therefore Vout = Vin

• Loss is higher at higher frequencies

Module ground

Voltage StandingVoltage StandingVoltage StandingVoltage Standing----Wave Ratio (VSWR)Wave Ratio (VSWR)Wave Ratio (VSWR)Wave Ratio (VSWR)

• When waves propagate betweenbetweenbetweenbetween mediums, reflections occur (wave theory)• VSWR is a measure of this reflection

Air Wall

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this reflection• Sound wave example• Greater the variation in mediums, greater the reflection

PropagatedReflected

(ECHO)

Facts About VSWRFacts About VSWRFacts About VSWRFacts About VSWR

• In electrical systems, reflections occur when signal

propagates through components with varying

characteristic impedances (connectors, relays, traces,

etc.)

• VSWR measures the power of this reflected signal

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• VSWR is an important consideration in systems

where signal reflections can damage the source

Characteristic Impedance Characteristic Impedance Characteristic Impedance Characteristic Impedance

• To minimize reflections, RF components are designed to have a certain per unit length impedance or ‘characteristic impedance’

• Characteristic impedance is not a DC resistance !!!

• Almost all RF systems have characteristic impedance of either 50 or 75 Ω

• To minimize reflections and maximize amount of power transferred from source to load transmitted, impedance of all components in RF system must be matched

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components in RF system must be matched

Zo≠ 50ΩΩΩΩ

Pin Pout

50ΩΩΩΩ

50ΩΩΩΩPreflected

Source Load

Matched 501 System (Ideal)

Pin = Pout and

Preflected = 0

Calculating VSWRCalculating VSWRCalculating VSWRCalculating VSWR

• VSWR = Voltage Standing Wave Ratio

• VSWR is the ratio of the maximum to minimum voltage in

the standing wave pattern on the transmission line

VSWRΓ−

Γ+=1

1Impedance Discontinuity

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OL

OL

ZZ

ZZ

+

−=Γ

Γ−

Where,

1

ZL

ZO

Mismatched RF system

In Phase:180° Out of Phase:

Example : VSWRExample : VSWRExample : VSWRExample : VSWR

1Vp-p Incident Wave (20mW) 100mVp-p Reflected Wave (0.2mW)

40.5ΩΩΩΩ

SourceZo=40.5ΩΩΩΩ

50ΩΩΩΩ

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Maximum - In phase : 1.1Vp-p

Minimum - 180° Out of Phase: 0.9Vp-p

50ΩΩΩΩ

Example : VSWRExample : VSWRExample : VSWRExample : VSWR

In phase: 1.1Vp-p

180° Out of Phase: 0.9Vp-p

Ratio of maximum to minimum VSWR formula calculation

METHOD 1 METHOD 2

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1.05.4050

5.4050=

+

−=Γ

22.11.01

1.01=

+=VSWR

22.19.0

1.1==

pp

pp

V

VVSWR

voltage in the standing wave

pattern on the transmission line

VSWR formula calculation

Crosstalk / IsolationCrosstalk / IsolationCrosstalk / IsolationCrosstalk / Isolation

• Crosstalk: When an

unwanted signal is coupled

from one circuit to another.

• Example: Between 2 banks

on switch module

COM1

COM2

Signal carried over between two independent circuits

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• Isolation: When an

unwanted signal is coupled

across an open circuit.

• Example: open relay

COM1

Signal carried over open relay

Signal carried over between two independent circuits

DUT 1 (501)

RFSA

TerminationTerminationTerminationTermination 50Ω Ω Ω Ω Transmission Line

50ΩΩΩΩ

50ΩΩΩΩ

DUT1 LoadZo=50ΩΩΩΩ

50ΩΩΩΩ

DUT8Zo=50ΩΩΩΩ

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DUT 8 (501)

• In the case of DUT1, the entire signal route has a characteristic impedance of 50Ω

• In the case of DUT8, the open relay causes a break in the 50Ω characteristic impedance of the circuit which results in reflections

RAir

Medium change

causes the

majority of the

signal to reflect

Termination (cont)Termination (cont)Termination (cont)Termination (cont)

DUT 1 (501)

RFSA

50ΩΩΩΩ

50ΩΩΩΩ

DUT1 LoadZo=50ΩΩΩΩ

50Ω Ω Ω Ω Transmission Line

50ΩΩΩΩ

DUT4Zo=50ΩΩΩΩ

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• Termination is VERY crucial when the DUT is:• Continuously generating signal

• Sensitive to signal reflections

DUT 4 (501)

50ΩΩΩΩTermination

resistor keeps

reflections low

Rise TimeRise TimeRise TimeRise Time

• Time required for output

signal voltage to rise from

10% to 90%

• Important specification when

routing square waves

Can be used to approximate

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• Can be used to approximate

3 dB point of switch

(bandwidth)

• To route a square wave

accurately, the bandwidth of

the switch should be 7 times

the frequency of the signal

Bandwidth

35.0=τ

Rise Rise Rise Rise Time (cont)Time (cont)Time (cont)Time (cont)

TimeRise35.0

)( =τ

Slower

rise time

Faster

rise time

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BandwidthTimeRise

35.0)( =τ

5 MHz Square Wave with 20 MHz Digitizer5 MHz Square Wave with 300 MHz Digitizer

Considerations while using Switch Matrix

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Switching LowSwitching LowSwitching LowSwitching Low----Voltage Signals (< 1 mV)Voltage Signals (< 1 mV)Voltage Signals (< 1 mV)Voltage Signals (< 1 mV)

• Thermal EMF

• Dissimilar metals create a voltage drop at their junction

• Typicalo Electromechanical: 1 - 10 uV

o Reed: 10-80 uV

• Creates a thermocouple that varies

JunctionJunctionJunctionJunction µV/µV/µV/µV/°°°°

CCCC

Copper-Copper <0.3

Copper-Gold 0.5

Copper-Silver 0.5

Copper-Brass 3

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• Creates a thermocouple that varies voltage offset with temperature

Copper-Brass 3

Copper-Nickel 0.5

Copper-Lead-Tin Solder 1-3

Copper-Aluminum 5

Copper-Kovar 40

Copper-Copper Oxide >500

Switching LowSwitching LowSwitching LowSwitching Low----Voltage Signals (< 1 mV) (cont)Voltage Signals (< 1 mV) (cont)Voltage Signals (< 1 mV) (cont)Voltage Signals (< 1 mV) (cont)

• Minimize the effects of Thermal EMF by using 2-wire topologies

1-wire mode

2.5 µV+ +

2-wire mode

2.6 µV+ +

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DUT DMM

+

--

If DUT = 5 µV

Switch thermal emf = 2.5 µV

DMM measures between 2.5 and 7.5 µV

Measurement error = 50%

DUT DMM2.6 µV+

--

2.4 µV

DUT = 5 µV,

Switch thermal emf = ± (2.6 -2.4 µV)DMM measures between 4.8 and 5.2 µV

Measurement error = 4%

Switching Low Currents (< 10 Switching Low Currents (< 10 Switching Low Currents (< 10 Switching Low Currents (< 10 μμμμA)A)A)A)

• Leakage Currents

Can leak to:

• Leakage to ground

• Channel-to-channel leakage Vs RLeakage To DMM

iLRelay

Channel-to-ground leakage

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ileakage

C

c

C

G

i

L

Rsurface

Ch0

Ch1

Channel-to-Channel leakage

Switching Low Currents (< 10 Switching Low Currents (< 10 Switching Low Currents (< 10 Switching Low Currents (< 10 μμμμA) (cont)A) (cont)A) (cont)A) (cont)

• Minimizing leakage currents• Calibrate your system: Apply step voltage to each individual channel

• Choose the a switch with high isolation & low leakage

o FET/SSR switches have leakage current injected from the relay itself

• Isolate sensitive signals from switch system (use PXI-4022 guard card)

itest - ileakage

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DUTHI Sense

HI

LO Sense

LO

DMMitest ileakage

+

-Guard

Test Fixture

Guarding

Switching Low Currents (< 10 Switching Low Currents (< 10 Switching Low Currents (< 10 Switching Low Currents (< 10 μμμμA) (cont)A) (cont)A) (cont)A) (cont)

• Triboelectric Currents• Generated by charge that builds due to friction between

conductor and insulator on cable

• Occurs when cables are bent or moved excessively

• Can be minimized by tying cables down

• Electrostatic Interference• High-impedance circuitry is susceptible to pick up noise

• Effective shielding of the DUT and cables can help reduce this noise

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reduce this noise

• Settling Time• When relay is closed it bounces before making a

connection. This causes a charge transfer which gives rise to a current pulse

• What happens when ball is dropped on ground?

• Error can be minimized by taking a measurement after settling time of switch has elapsed

Measuring Low Capacitance with SwitchesMeasuring Low Capacitance with SwitchesMeasuring Low Capacitance with SwitchesMeasuring Low Capacitance with Switches

• When performing Low Capacitance measurements, the

switch cannot add additional error.

• Selecting the right topology for these measurements

reduces added capacitance

• SPDT

• Matrix

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Matrix

• Select switches with:

• Low path resistance

• Low minimum current.

• Perform averaging on DMM.

• Perform Open / Short Compensation on DMM

Other ExamplesOther ExamplesOther ExamplesOther Examples

• Switching Inductive Loads• Use MOV and FlyBack

diode to reduce voltage spikes

• Switching Capacitive Loads

• Use resistor in series to prevent inrush current

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Use resistor in series to prevent inrush current

• DMM is a capacitive load!

• Low current / voltage Hot Switching

• Pay attention to “minimum switching load” spec.

• All Armature Relays have this problem

NI Switch Executive

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NI Switch Executive

Modular Test Architecture

Test ModulesTest ModulesTest ModulesTest Modules

TestStandTestStandTestStandTestStand

TestTestTestTestManagementManagementManagementManagementServicesServicesServicesServices

Measurement Measurement Measurement Measurement

SwitchSwitchSwitchSwitch

ManagementManagementManagementManagement

SoftwareSoftwareSoftwareSoftware

NI NI NI NI

Switch Switch Switch Switch

ExecutiveExecutiveExecutiveExecutive

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Measurement Measurement Measurement Measurement ServicesServicesServicesServices

Unit UnderUnit UnderUnit UnderUnit UnderTestTestTestTest

SwitchSwitchSwitchSwitchHardwareHardwareHardwareHardware

Key Benefits to Switch Management SW

• Abstraction of low-level switch programming details• Reuse and easily maintain test modules

o Create test modules with generic switching calls (ex. connect “TestUUT1”)

o For new tests, reuse existing modules and create new NISE configuration

• Multimodule integration

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Multimodule integration• Create a virtual switch device integrating multiple switches

• NISE API treats virtual device as a single switch

• Automatic routing• Assists in creating routes across one or several switch

modules

NI Switch Executive

• Accessed via MAX• Operates as a configuration utility

• Built on top of the IVI switch class driver• Provides a bridge between the driver level and the ADE level

• Is integrated with LabVIEW, LabWindows/CVI, C/C++, Visual Basic and TestStand

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Visual Basic and TestStand• Provides support functions within these environments to utilize

Virtual Devices created within NISE

• Easily deployable to other systems

• Includes hardware protection features

System Level Switch Management Software

• NI Switch Executive

− Visual Route Editor

− Supports common and custom topologies

Multi-module

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− Multi-module configuration

− End-to-end routing

− System validation

− Automated configuration export and system documentation

Supports NI and 3rd Party Switch Hardware

• Built on top of the IVI Switch Class Driver

• Integrates ANY IVI compliant

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IVI compliant switch

• IVI Driver development assistance available through NI

Seamless Integration With LabVIEW

BEFOREBEFOREBEFOREBEFORE

AFTERAFTERAFTERAFTER

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NI Switch Executive in TestStand

• Seamless integration with NI TestStand

• Occurs before all other items in step

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Summary

• Greatly simplify switch programming with switch management software• Multimodule integration

• Automatic routings

• Channel aliases, routes and route groups

• Abstract low-level programming for code reuse and maintenance

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• Abstract low-level programming for code reuse and maintenance

• Build scalable switch solutions with modular switch software• Open, modular switch platform

• Multiple topology devices

• System and module level switch software