INFRASTRUCTURE - CoInnovateCS · 2019. 6. 5. · • PIC Opportunity and Challenges • Wafer Level...

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Transcript of INFRASTRUCTURE - CoInnovateCS · 2019. 6. 5. · • PIC Opportunity and Challenges • Wafer Level...

  • Confidential Use Only – Do Not Share

    INFRASTRUCTURE

  • Quality Engineer, Optics

    Photonics Challenges for DC Optics

    Vincent Zeng

  • • Facebook Data Center In Scale

    • PIC Opportunity and Challenges

    • Wafer Level

    • Packaging

    • Bath Tube Challenges

    • Interoperability

    Agenda

  • Facebook Data Center In Scale

  • Papillion, NE

    Fort Worth, TX

    Prineville, OR Forest City, NC Luleä, Sweden Altoona, IA

    Clonee, Ireland Los Lunas, NM Odense, Denmark

    New Albany, OH Henrico, VA Newton County, GA

    Huntsville, AL

    Eagle Mountain, UT

    Singapore

  • Confidential Use Only – Do Not Share

  • 100G Optical Transceiver Quality Performance

    • DOA- almost all failures were

    reported within 3months after power

    on

    • Among those failures, 97% comes

    from laser related

    • We should have more stringent

    screening or Burn In process on

    laser

  • Yield Management- Starts From Wafer

    Level

    • Fully rely on post

    burn-in Process

    • Volume Drives

  • • Laser Integration

    • RF management

    • Optical coupling and

    alignment

    Packaging Challenges

    • Standard process

    • Automation

  • Co-packaged Optical Solution

    • Conventional

    pluggable optics-

    not scalable

    • On-board optics

    • Co-packaged optics• Wafer level integration/test

    • Packaging challenge to wafer

    • Better process control

  • Infant Mortality and Wear Out Reliability Concern

    • Too early to Consider

    Reliability when

    • Less Stringent BI

    Screening

    • Less wafer level Process

    Control

    • Classic GR468 ONLY

    Laser BI

    Optimization

    DOA

    Challenges

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    Facebook Network Fabric Topology

    Interoperability challenges

  • Questions

  • Thank you