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iNEMI iNEMI HalogenHalogen--Free ProjectFree Project

Phase 2 ProposalPhase 2 Proposal

Co-Chair: Steve Tisdale, IntelCo-Chair: Roger Krabbenhoft, IBM

March 22, 2007

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HalogenHalogen--free Project free Project

Overall Project Objectives:

• Build on industry knowledge and capability,• Consider unique market segment requirements,• Identify technology readiness and gaps, • Stimulate supply capability, and • Recommend standards development opportunities

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Is / Is NotIs / Is Not

This Project IS This Project Is NOTTechnical evaluation of key electrical and mechanical properties

EHS assessment

Focused on those attributes which are of most value to supply chain.

Biased towards specific laminate suppliers, geographies, or market segments.

Build on learning from prior investigations

Repeat of prior work

Recommendations for standards development or further investigation

Standard Development

Focused on circuit board Electronic components, Cables

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Phase 2: Develop, Manage, and Execute Phase 2: Develop, Manage, and Execute Performance TestingPerformance Testing

• Phase 2 Tasks

1. Develop evaluation plan and schedule

2. Procure parts and test vehicles

3. Assign teams to carry out completion of the testing in a standardized fashion

4. Perform electrical and reliability testing on test vehicles.

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Anticipated Outcomes Anticipated Outcomes

1. Validate electrical and mechanical properties– Loss tangent and Dk modeling over required range of

signal speed– Mechanical performance validation for lead free

assembly (Delamination)– Critical Test Parameter Evaluation (CAF, IST, Flex etc)

2. Validate material supplier and PCB manufacturer infrastructure capability

3. Estimate costs – Volume market leader for new material may not achieve

cost parity with best-in-class FR4

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Candidate MaterialsCandidate Materials

• Team Identified Materials Based on Information Available in The Industry and Through Laminate Supplier Consultation.

• Target Is to Have a Varied Cross Section of Laminate Material Suppliers, Geographies, and Chemistries Represented.– Identified 30 Candidate Halogen Free Laminate Materials From

15 Manufacturers– Eight (8) Laminates From 6 Suppliers Were Identified As

Primary Candidates For Assessment.

• Materials Were Chosen Which Are Purported to Have a Reasonable Chance of Surviving Full Pb-free Assembly Process Conditions Within Their Target Market Segment / Design Point.

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Materials To Be Assessed Materials To Be Assessed

Material

Tg. oC (by DSC unless

otherwise noted)

Dk (reported, not

assessed)

Df (reported, not

assessed)PCB Fab

Shop

NanYa NPG-170TL 170 4.5 / 4.1 @ 1MHz / 1GHz

0.012 – 0.014 @ 1GHz Multek, China

NanYa NPG-TL 150 3.8 – 4.0 @ 1GHz0.012 – 0.014 @ 1GHz

GCE, Taiwan

Hitachi BE-67G(J)

145 (by TMA) 5.0 – 5.2 @ 1MHz Multek, China

200 (by DMA) 4.5 – 4.7 @ 1 GHz

TUC TU-742 150 4.6 / 4.3 @ 1MHz / 1GHz0.013 – 0.014 @ 1GHz

Sanmina

Panasonic/MEW R1566W 148 5.2 / 4.8 @ 1MHz / 1GHz

0.010 @ 1GHzGCE, Taiwan

ITEQ IT140G 155

(method ?) 4.5 @ 1MHz 0.015 @ 1MHz

?

ITEQ IT155G 160

(method ?) 4.6 @ 1MHz0.009 @ 1MHz

?

Shengyi S1155 135 4.7 @ 1MHz0.010 @ 1MHz

?

0.009 – 0.11 @ 1GHz

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Phase 2: Develop, Manage, and Execute Phase 2: Develop, Manage, and Execute Performance TestingPerformance Testing

• Test Vehicles Under Consideration

– Electrical: • IBM Short Pulse Propagation Method - SMASPP2z

– High Temp Reflow Compatibility, Test Vehicle Options:• IBM HOP31 High Temp Reflow Laminate Assessment Test

Vehicle• Intel Materials Evaluation Board (MEB)

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Identify Identify key performance characteristics and key performance characteristics and test criteriatest criteria

• Proposed Stack Ups– SPP

• 1mm (40 mil)

– HOP31 & MEB • 1mm (40 mil)• 2mm (80 mil)

– Control Materials (or similar – Choose one)• Isola IS410• Polyclad Turbo 370• Nelco-4000-6• Nanya NP170

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Identify Identify key performance characteristics and key performance characteristics and test criteriatest criteria

• Proposed Test Strategy– Screening of Materials

• Evaluation of electrical, physical and thermal properties of commercially available Halogen-free laminate materials.

• Determination of propensity for failure (ie, delamination, via fatigue degradation) in the Pb-free process environment on a per-application basis.

– Pb-free on thinner / less thermally massive applications at up to 245 C (4-10 layer)

– Pb-free on more thermally massive applications at up to 260 C. (12 – 24 layer)

– The third party lab evaluates these boards per IPC 6012B Class 2(if deemed necessary)

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Identify Identify key performance characteristics and key performance characteristics and test criteriatest criteria

• Proposed Test Strategy– Electrical Evaluation (< 20GHz)

• Dielectric Constant (10KHz - 20GHz)• Dissipation Factor (10KHz - 20 GHz)• Surface Insulation Resistance (before solder mask)• Dielectric Voltage Breakdown (Dielectric Withstanding)• Moisture Diffusivity• Capacitance

– Mechanical Evaluation• Tg and z-axis CTE• T-260 / T-288• Cross Sections• Line width & spacing• Hole to Pad Registration• Peel Strength• Solder Mask Adhesion• Flex Modulus• Resin Microhardness• Reliability

– CAF– IST– HATS

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Path Forward

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Next steps: Q2 2007Next steps: Q2 2007

Commence Phase 2 Immediately

– Identify participants and team leads– Set up meeting schedules / logistics

• Review Original Schedules and update as needed– Identify Fabricators– Complete Test Vehicles Builds – SPP & HOP31 by July 1st

- MEB II by Aug 1st

– Identify Test Methods – Identify who will perform the required testing

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www.inemi.orgwww.inemi.orgEmail contacts:Email contacts:

Jim McElroy Jim McElroy

jmcelroy@inemi.orgjmcelroy@inemi.org

Bob PfahlBob Pfahl

bob.pfahl@inemi.orgbob.pfahl@inemi.org

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BACKUP

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Task 2: Identify Candidate MaterialsTask 2: Identify Candidate MaterialsLaminateSupplier Material

Country ofManufacture

TUC TU-642 Taiwan

ITEQ IT155G Taiwan

IT140G Taiwan

IT170G * (??)

Mitsubishi CCL-EL150 Japan

Panasonic / MEW R1566 Japan/Taiwan/China

R1515T * Japan

R1515B

Ventec VT44 China

GraceGAHF14 / GAHFR /

GAHFTL * China

Doosan DS7402 (H) * South Korea

DS7402 South Korea

Guangdong Shengyi S1165 * China

Sumitomo Bakelite

ELC-4785GS / ELC-6785GS / ELC-

4765GF Japan

LaminateSupplier Material

Country ofManufacture

NanYa NPG-R Taiwan / China

NPG-TL / NPG-170TL *

Hitachi BE-67G(H)Japan / Hong Kong /

China

E-679FG * Japan

EX-77G ? Japan ?

EliteMaterials

Co EM280 China

Isola IS500 * Italy

DE156 Germany, Taiwan

HF571 (formally Polyclad) * Germany, Taiwan

Nelco 4000-7EF * Singapore

LGChemical LG-E(B) 481 Korea

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Identify Identify key performance characteristics and key performance characteristics and test criteriatest criteria

Physical Properties DataProperty Tested Test Method Acceptable Ideal

Dielectric constant 1-2.5 GHz 2.5.5.6 (IPC-TM-650) < 4.5 < 3.3

Loss factor @ 1 MHz 2.5.5.6 (IPC-TM-650 < 0.017 < 0.007

Glass transition temperature, DSC (C 2.4.25 (IPC-TM-650) > 180 >200

Glass transition temperature, TMA (C) 2.4.24.5 (IPC-TM-650) > 180 >200

Decomposition temperature, TGA (C) > 300 > 350

Time to delamination (min@260/288 C) 2.4.24.1A (IPC-TM-650) > 60 > 120

Flammability C-H 6-0430-102 V0 – Br-free V0 – Br-free

Pressure cooker test (min) 2.6.16 (IPC-TM-650) > 30 > 120

Moisture, 24hr/RT (Wt% Gain) 2.6.2.1 (IPC-TM-650) < 0.3 < 0.1

Moisture, 1hr/PCT (Wt% Gain) ASTM D570 (E 1/105 and D 24/23) < 1.0 < 0.5

Cu Peel (lb/in) 2.4.8.2 (IPC-TM-650) > 5 10

Oxide ILB (lb/in) > 2 5

CTE (ppm/C) X, Y below Tg 2.4.41 (IPC-TM-650) 16 - 18 16 - 18

CTE (ppm/C) X, Y above Tg 2.4.41 (IPC-TM-650) 5 - 8 5 – 8

Sticker ILB (lb/in) > 3 6

CTE (ppm/C) Z below Tg 2.4.41 (IPC-TM-650) ~ 60 30

CTE (ppm/C) Z above Tg 2.4.41 (IPC-TM-650) 300 150

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Short Pulse Propagation Short Pulse Propagation

• Short Pulse Propagation Technique– Provides Time Domain Broadband Assessment of

Laminate Material Dielectric Constant and Loss Tangent

– Capable of Providing Results Up to 50GHz With Proper Equipment.

• Setup Used for iNEMI HF Effort Will Provide Valid Results Up To 20GHz

– Uses Test Structures Which Are Used in Real Applications.

– Material is Excited in Same Fashion as System Operation vs. Traditional Resonant Techniques

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Phase 2: Develop, Manage, and Execute Phase 2: Develop, Manage, and Execute Performance TestingPerformance Testing

– IBM SMASPP2z Electrical Test Vehicle• 8 Layer Design

– Resin Rich Stripline Layer– Resin Poor Stripline Layer

• 5” x 11” (6up per panel)• Extract Dk and Df from 10KHz to 20GHz Using Short Pulse Propagation

Technique

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SPP Test Vehicle Design SPP Test Vehicle Design

Cross Section Definition is Flexible. Desire One Cross Section Definition is Flexible. Desire One

Resin Rich and One Resin Poor Building BlockResin Rich and One Resin Poor Building Block

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Example Results, Halogen Free Laminate Example Results, Halogen Free Laminate

• Example Results, PolycladHF571 (now Isola)

– November, 2005

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Phase 2: Develop, Manage, and Execute Phase 2: Develop, Manage, and Execute Performance TestingPerformance Testing

– IBM “Hop31” Laminate Evaluation Test Vehicle

• Versatile cross section…whatever required.

• Minimum PTH pitch of 31 mils (0.8mm)

• Specifically designed for assessment of higher reflow compatibility of laminate materials.

• Design tweaks underway to easy finding internal delamination. To be completed by next week (2/16/07).

• 4” x 5.5”….many test vehicles / panel.

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Phase 2: Develop, Manage, and Execute Phase 2: Develop, Manage, and Execute Performance TestingPerformance Testing

– Intel Materials Evaluation Board (MEB) Laminate Evaluation Test Vehicle. Under redesign (MEB II) to move to finer pitch structures.

• Flexible design– Multiple layer count and

thicknesses capable– Designed for 18”x24” panel

(16.5x22.5” useable area)– 4 Quadrants – 4 Subpanels– Some coupons have

breakaway tabs

• Focus on material properties– Reliability coupons– Electrical, Mechanical,

Thermal property coupons – Minimal fabrication

capability (trace/space coupons)

– Minimum assembly testing

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Targeted MEB II StackTargeted MEB II Stack--upsupsMEB II Stackup MEB II Stackup

Description Thickness Description ThicknessLayer 1 Plated 1/2 oz Cu 2.1 mils Layer 1 Plated 1/2 oz Cu 2.1 mils

Prepreg 2.8 mils Prepreg 2.8 milsLayer 2 Plated 1/2 oz Cu 1.2 mils Layer 2 Plated 1/2 oz Cu 1.2 mils

Prepreg 2.8 mils Prepreg 2.8 milsLayer 3 Unplated 1/2 oz Cu 0.6 mils Layer 3 Unplated 1/2 oz Cu 0.6 mils

Core 4 mils Core 5 milsLayer 4 Unplated 1/2 oz Cu 0.6 mils Layer 4 Unplated 1/2 oz Cu 0.6 mils

Prepreg 3 mils Prepreg 4.5 milsLayer 5 Unplated 1 oz Cu 1.2 mils Layer 5 Unplated 1 oz Cu 1.2 mils

Core Adjust to achive overall thickness of 0.040" Core

Adjust to achive overall thickness of 0.080"

Layer 6 Unplated 1 oz Cu 1.2 mils Layer 6 Unplated 1 oz Cu 1.2 milsPrepreg 3 mils Prepreg 4.5 mils

Layer 7 Unplated 1/2 oz Cu 0.6 mils Layer 7 Unplated 1/2 oz Cu 0.6 milsCore 4 mils Core 5 mils

Layer 8 Unplated 1/2 oz Cu 0.6 mils Layer 8 Unplated 1/2 oz Cu 0.6 milsPrepreg 2.8 mils Prepreg 2.8 mils

Layer 9 Plated 1/2 oz Cu 1.2 mils Layer 9 Plated 1/2 oz Cu 1.2 milsPrepreg 2.8 mils Prepreg 2.8 mils

Layer 10 Plated 1/2 oz Cu 2.1 mils Layer 10 Plated 1/2 oz Cu 2.1 mils40 mils 80 mils

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MEB II Test MethodsMEB II Test MethodsBoard Level Reliability and Mechanical Testing:• IST (Interconnect Stress Test) – Precondition samples 3X reflow prior

to soldering connectors. Test per IPC TM-650 2.6.26 at a test temperature of 150C. Test to failure.

• CAF – Test per IPC TM-650 2.6.25. Test via to via, via to trace, trace to trace, and plane to plane with the following structures: modified IST coupon, trace and space coupon, Hi-pot coupon. Test conditions: 65 or 85C @ 87% RH with bias voltage of 10-20 volts depending on design. Test to failure.

• Flexural Modulus – Test per ASTM D790. 5” x ¾” sample. Test X and Y board directions.

• Copper Peel Strength - Test per IPC TM-650 2.4.8C “Peel Strength of Metallic Clad Laminates”. 5” x ¾” sample.

• Tg and z-axis CTE – Test per IPC TM650 2.4.24C test method. 6mm x 6mm sample.

• Thermal Stress X-section – Test per IPC TM-650 2.6.8E. 1X and 3X floats at 288C.

• Resin Micro-hardness – Micro-hardness indenter on x-sectioned resin rich area of the laminate.

• Solder mask adhesion – Test per IPC TM-650 2.4.28B

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MEB II Test MethodsMEB II Test MethodsElectrical Testing:• Permittivity (Dielectric Constant) and Loss Tangent (Dissipation

Factor) – VNA S-parameter measurements up to 30 GHz.• Moisture Diffusivity – In situ VNA S-parameter measurements at 105C

bake, 85C/85% RH, and 35C/85% RH. Check moisture absorption rate and desorption rate.

• Insulation Resistance – Test per IPC TM-650 2.5.7• Capacitance – Test per IPC TM-650 2.5.2AAssembly Testing:• Temp Cycle – In situ air to air method (HATS machine). Conditions are

product dependent, need to finalize test temps and dwells. Test to failure.• Transient Bend – Package size dependent spans for bending. Measure

strain curves and examine damage levels (Die and Peel, x-section)• Rework – Test thermal limits of rework conditions.• Board side ball pull – Dage ball pull equipment.

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So Why do this? So Why do this?

1. Emerging consideration of “Progressive” public, institutional, and corporate procurement groups in Sweden, Norway, Denmark, Netherlands, Germany, UK, France, Japan. Companies without HF product offerings have begun to lose bids in these regions, esp. in the mobile phone space

2. Very limited CE and IT product offerings are available.

3. Political and NGO hot-button. NGOs like Greenpeace are targeting actions against companies that use TBBPA

4. Lack of legislation results in “material-of-the month” behavior driven by multiple environmental groups – need a coordinated effort driven by a major industry influence

5. Supply chain capability and capacity is not established. Standards and generic technology.

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What is Halogen Free? What is Halogen Free?

1. JPCA (Japan Printed Circuit Association) JPCA-ES-01-1999 defines criteria and method for “halogen-free”

• Br < 0.09wt% (900ppm)• Cl < 0.09wt% (900ppm)

2. IEC ( International Electrotechnical Commission)– Finalized requirements of IEC 61249-2-21:

• 900 ppm maximum Cl• 900 ppm maximum Br• 1500 ppm maximum total halogens

3. IPC - 4101B has adopted the IEC definition of halogen-free• 900 ppm maximum Cl• 900 ppm maximum Br• 1500 ppm maximum total halogens

Note: fluorine, iodine, and astatine (other Group VIIA halogens)are not restricted in the industry definition of “halogen-free”.

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TBBPA TBBPA

• In epoxy resin circuit boards, TBBA covalently reacts with the epoxy resin backbone and ceases to exist as a chemical entity. ~96% of printed wiring boards utilize TBBA.

• Swedish Environmental Protection Agency studies indicate that TBBA does not bind to human transthyretin in vivo, suggesting no adverse endocrine effects.

• In 1995, the World Health Organization (WHO IPCS) undertook a full scientific assessment of the environmental and human health impacts of TBBPA. Key findings from this study indicated that

– 1) TBBPA has little potential for bioaccumulation, – 2) environmental detection is limited to very few sediment/soil samples and– 3) the human health risks associated with TBBPA for the general population is

considered to be insignificant.

• Six independent studies between 1990-1997 concluded that TBBA is not found to be a significant source of potential human dioxin exposure upon proper incineration (IPC, 2003)

• TBBPA has been analyzed for the presence of 15 2,3,7,8-substituted polybrominated-p-dibenzodioxins and dibenzofurans. None of the analytes were present at or above the quantitation limits established by the U.S. Environmental Protection Agency.

• TBBA has a 50 day half-life in aerobic and anaerobic solids (soil) and has an average half-life of 31 days in water.

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Identify Identify key performance characteristics and key performance characteristics and test criteriatest criteria

• Proposed Test Strategy– Screening of Materials

• The third party lab evaluates these boards per IPC 6012B Class 2. This evaluation includes the following material related requirements:

– 1X and 6X Thermal stress – -Glass Fiber protrusion– -Wicking– -plating integrity– -Etchback and Desmear

– Thermal Shock– -Plating integrity– -Barrel separation– -Lifted lands– -Laminate Voids– -Laminate Cracks

– Bow and Twist (PWB construction/material interaction)

– Stack up analysis (validate prepreg yield per ply compares to Fab stackup)

– Thermal Analysis (Tg and Delta Tg)

– Soldermask thickness (Halogen Free board requires halogen free soldermask: validate thickness requirements to IPC SM 840