Industry Collaboration - iNEMIthor.inemi.org/.../iNEMI_at_OFC_NFOEC_March_06/... · Transformation...

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Industry Collaboration

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MissionMission

Assure Leadership of the Global Electronics Manufacturing Supply Chain for the benefit of members and the industry

Software Solutions

Marketing Design Manufacturing OrderFulfillment

Supply Chain ManagementInformation Technology

LogisticsCommunications

Business Practices

Build toOrder

Materials

Components

Customer

Equipment

MaterialsTransformation

Collaborative Design Life Cycle

SolutionsSoftware Solutions

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MethodologyMethodology

Product Needs

Technology Evolution

GAP AnalysisResearch

Projects

Competitive Solutions

RoadmapProject

Completion

Industry Solution Needed

Academia

Government

iNEMIUsers & Suppliers

Regional Collaboration

No Work Required

Available to Market

Place

GlobalParticipation

Disruptive Technology

RoadmapRoadmap

ImplementationImplementation

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What Does iNEMI Do For the Industry?What Does iNEMI Do For the Industry?

Leverage the combined power of Member Companies to provide industry leadership

• iNEMI roadmaps the global needs of the electronics industry– Evolution of existing technologies– Predictions on emerging/innovative technologies

• iNEMI identifies gaps (both business & technical) in the electronics infrastructure

• iNEMI identifies and prioritizes research needs.• iNEMI stimulates worldwide standards to speed the

introduction of new technology & business practices.

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What Does iNEMI Do For its Members?What Does iNEMI Do For its Members?

Leverage the combined power of member companies to provide industry leadership

• iNEMI stimulates research/innovation to fill gaps• iNEMI sponsors workshops and forums on emerging technology

and issues• iNEMI works with other organizations to ensure that government

policy recommendations are aligned with our mission.• iNEMI establishes implementation projects to eliminate gaps

– Develop processes– Evaluate alternative technologies– Identify equipment needs– Determine component requirements– Develop standards proposals– Communicate results to members

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Value PropositionValue Proposition

“Connect with and Strengthen Your Supply Chain”

• iNEMI offers the opportunity to collaborate with the entire supply chain in an efficient manner

– To understand and accelerate strategic directions– To define future needs and opportunities– To jointly create industry standard solutions.

• Today’s increasingly distributed supply chain makes this more important than ever.

• iNEMI is a member driven organization that adapts to industry changes quickly and provides timely leadership.

• iNEMI provides important deliverables:– Technology roadmaps– Five year technology plans (for members)– Forums on key industry issues– Deployment projects (for members)– Webinars (for members).

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Industry Leaders belong Industry Leaders belong –– OEM/EMSOEM/EMS

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Industry Leaders belong Industry Leaders belong –– SuppliersSuppliers

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Industry Leaders belongIndustry Leaders belong

Consultants, Government, Organizations & UniversitiesConsultants, Government, Organizations & Universities

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OrganizationOrganization

ImplementationImplementation

8 iNEMITIGs

Technical Committee

EMS, OEM, Supplier & Academia/Government

Representatives

Technical CommitteeTechnical Committee


Representatives

TechnologyTechnologyRoadmappingRoadmapping

19 IndustryTWGs

iNEMI Staff

Secretary to BoDCommunications

Membership DevelopmentTechnical Facilitation

iNEMI StaffiNEMI Staff

Secretary to BoDCommunications

Membership DevelopmentTechnical Facilitation

iNEMI Boardof Directors

Elected by iNEMI CouncilRepresentativesEMS DirectorsOEM Directors

Supplier DirectorsStrategic Objectives

Operational Responsibility

iNEMI BoardiNEMI Boardof Directorsof Directors

Elected by iNEMI CouncilRepresentativesEMS DirectorsOEM Directors

Supplier DirectorsStrategic Objectives

Operational Responsibility

SubstratesTIG

OptoelectronicsTIG

(Technology Integration Group)

TechnologyWorkingGroup

•••

TechnologyWorkingGroup Medical

ElectronicsTIG


Board AssemblyTIG

Environmentally Conscious Electronics

TIG

Product Life Cycle Information

ManagementTIG


Research Committee


Representatives

Research CommitteeResearch Committee


RepresentativesProduct Emulator

Group

Product Emulator

Group

Product NeedProduct NeedRoadmappingRoadmapping

7 IndustryPEGs

Business Leadership

Team

EMS & OEM Representatives

Business Business Leadership Leadership

TeamTeam

EMS & OEM Representatives

System in PackageTIG

Heat TransferTechnology

TIG

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Roadmap2004 => 2007

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Attributes of iNEMI RoadmapsAttributes of iNEMI Roadmaps

• iNEMI Roadmap is customer need driven, not technology driven.

• OEM driven Product Emulator Groups (PEGs) start roadmapping process by presenting what they need to remain competitive in the world market.

• Focus of Roadmaps is on process and technology rather than end products.

• Technology Working Groups (TWGs) respond and identify gaps and showstoppers. They do not provide solutions.

• iNEMI Technical Committee prioritizes gaps and forms Technology Integration Groups (TIGs) to close them.

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Statistics for the 2004 RoadmapStatistics for the 2004 Roadmap

• > 470 Participants• > 220 Companies/organizations• 11 Countries from 3 Continents• 19 Technology Working Groups

(TWGs) (added Sensors)• 7 Product Emulator Groups (PEGs)• Over 1200 Pages of Information• Roadmaps the needs for 2005-2015

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7 Product Emulator Groups (PEGs)7 Product Emulator Groups (PEGs)

Emulators Characteristics

Portable / Consumer High volume Consumer Products for which cost is the primary driver including Hand held, battery-powered products driven by size and weight reduction

System in a Package Complete function provided in a package to system manufacturer

Office Systems / Large Business Systems

Products which seek maximum performance from a few thousand dollar cost limit to literally no cost limit

Network / Datacom / Telecom Products

Products that serve the networking, datacom and telecom markets and cover a wide range of cost and performance targets

Medical Products Products which must operate within a highly reliable environment

Automotive Products which must operate in an automotive environment

Defense and Aerospace Products which must operate in extreme environments

Yellow = Completely new Emulator Green = Broadened focus

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19 TWG’s Focused on Technology & Mfg. 19 TWG’s Focused on Technology & Mfg.

Organic Substrates BoardAssembly Customer

RF Components & Subsystems

Optoelectronics

Displays

Energy Storage Systems

Modeling, Simulation, and Design

Modeling, Simulation, and Design

PackagingSemiconductorTechnology

Final Assembly

Mass Storage (Magnetic & Optical)

Passive Components

Product Lifecycle Information

Management (PLIM)

Product Lifecycle Information

Management (PLIM)

Test, Inspection & Measurement

Test, Inspection & Measurement



Ceramic Substrates

Thermal ManagementThermal

Management

Connectors

Sensors

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8 Contributing Organizations8 Contributing Organizations

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Major Trends From Roadmap

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Major Trends Major Trends –– Current & FutureCurrent & Future

• Environmental considerations will expand– RoHS/WEEE is the beginning– Significant impact to supply chain/information needs – Design for Environment/Sustainability – Defensive posture has reduced industry’s influence on

regulations• Manufacturing migration to low cost regions continues

– Some corrections seen due to security/logistics costs– Commodity design is following

• SiP is a major trend in portable products– Infrastructure issues need attention– Could find use in other sectors where mixed IC technologies

are used • Lack of integrated design/simulation tools is:

– Delaying new technology adoption – Impacting product time to market

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Major Trends Major Trends –– Current & FutureCurrent & Future• The predicted end of semiconductor scaling

could have major implications:– Non classical CMOS– Beyond CMOS– Increased thermal challenges– Significant impact to packaging/interconnect

• Nanotechnology has the potential to dramatically effect electronics:– Materials– Displays– Sensors– Power

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Example Gap Analysis: ECEExample Gap Analysis: ECE

ECE = Environmentally Conscious ElectronicsECE = Environmentally Conscious ElectronicsBUSINESS & TECHNOLOGY GAPS 2005 20092003 2007Parts, Materials & Processes

Lead-free Soldering TechnologyLead-free Compatible ComponentsTin Whisker Accelerated Test MethodSubstitution of Hazardous Materials in CablesMercury*Cadmium*Hexavalent Chromium*Halogenated Flame Retardants (PBB, PBDE)s*

Engineering/DesignDfE Integrated into Product Development

ToolsMaterials Declaration Design for Environment (DfE)Life Cycle Assessment (LCA)

BusinessRecycling Infrastructure in EUSupply Chain ReadinessMaterials Declaration StandardsNorth American OEM ReadinessKeeping track of e-waste legislation

* Note: Based upon measured results

Development Required Legend: Emerging Technology(or readiness issues)

Sufficiently Ready

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Example: ECE FiveExample: ECE Five--year Planyear Plan

2003 2005 2007 2009

IMPLEMENTATION NEEDS

ATTRIBUTESEnergy EfficiencyElimination of Materials

of ConcernEnd-of-Life RecyclingInformation ManagementLegislative knowledgeProduct MarkingSubstance BansRecycling TargetsWaste MinimizationRecycled Content

DEPLOYEDTECHNOLOGY

Design tradeoffs for DfE

RESEARCH & DEVELOPMENTLife Cycle Analysis (LCA)Life Cycle Cost Models


of Concern End-of-Life RecyclingInformation ManagementLegislative knowledgeProduct MarkingSubstance Bans

DEPLOYEDTECHNOLOGY

DfELead-freeNon-halogenated flame

retardants (early adopters)Reporting ToolsAlternative Finishes

RESEARCH &DEVELOPMENTDesign tradeoffs for DfE


of ConcernEnd-of-Life RecyclingInformation ManagementLegislative knowledge

DEPLOYEDTECHNOLOGY

Design for EnvironmentApproach (DfE)

Lead-free (early adopters)Environmental Management System (EMS)Product Life-cycle Management (PLM)

RESEARCH & DEVELOPMENTNon-halogenated flame

retardantsReporting ToolsAlternative Finishes


of ConcernEnd-of-Life RecyclingRecycled ContentInformation ManagementLegislative knowledgeProduct MarkingSubstance BansRecycling TargetsWaste MinimizationRecycled ContentLife Cycle Analysis

DEPLOYEDTECHNOLOGY

LCA (early adopters)Life Cycle Cost Models

RESEARCH & DEVELOPMENTDematerializationNew Separation Technologies

DRIVERS - Legislative/regulatory - Sustainable Development- Market Competitiveness - Customer Requirements

WEEE/RoHS Draft EuEELV

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Summary of Recent Progress

Projects close GapsProjects close Gaps

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Software Solutions

Life Cycle Solutions

Materials

CollaborativeDesign

Build toOrder

Equipment

MaterialsTransformationComponents

Substrates TIGProjects:

• High Frequency Materials Effects on HDI

• Optoelectronics for Substrates

Board Assembly TIGProjects:

• Pb Free BGA’s in SnPb Assemblies• Substrate Surface Finishes for lead free• SMT Reel Labeling• Pb-free BGAs in SnPb Assemblies• Lead-Free Nano-Solder

Product Life Cycle Information Management TIG Projects:

• PDX Extensions & Updates• Materials Composition Data Exchange• Offspring Industry Adoption (IPC 2581)

Optoelectronics TIGProjects:

• Fiber Optic Splice Loss Measurement • Fiber Connector End-Face Inspection

Environmentally Conscious Electronics TIGProjects:

• Lead-Free Assembly & Rework• Tin Whisker Accelerated Test• Tin Whisker Modeling• Tin Whisker User Group• Lead-Free Wave Soldering Assembly• RoHS Transition Group• Lead-Free Rework Optimization• High Rel RoHS ComplianceSystem in Package TIG:

• Just being defined• Address equipment, process,

& standards

System in Package TIG:• Just being defined• Address equipment, process,

& standards

Heat Transfer TIG:• Just being defined• Address process & standards

Heat Transfer TIG:• Just being defined• Address process & standards

Medical Electronics TIG:• Just being defined• Address standards

Medical Electronics TIG:• Just being defined• Address standards

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Technology Integration Groups (TIGs)Technology Integration Groups (TIGs)

Co-Directors of Planning: Leslie Guth, Lucent Technologies; Bill Barthel, Plexus

1. Board Assembly– Chair: Tom Pearson, Intel

2. Environmentally Conscious Electronics– Chair: Joe Johnson, Cisco

3. Heat Transfer

– Michael Patterson, Intel

4. Medical Electronics– Chair: Anthony Primavera,

Guidant5. Optoelectronics

– Chair: TBD

6. Product Lifecycle Information Management– Co-Chair: Barbara

Goldstein, NIST– Co-Chair: John Cartwright,

Intel

7. System in Package (SiP) – Chair: Joe Adam, Skyworks

8. Substrates – Chair: Hamid Azimi, Intel

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How TIGs are DefinedHow TIGs are Defined

• TWG chairs identify potential gaps during roadmap development process, recommend follow-up activities.

• iNEMI Technical Committee (TC) reviews TWG recommendations.

• TC decides on formation of Technical Integration Groups (TIGs) to address gaps.

• TIGs review identified gaps and develop Technical Plan; TC approves.

• TIGs, with TC approval, undertake projects to close gaps.

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How Projects are DefinedHow Projects are Defined

• Hold project formation meeting• Members develop Statement of Requirements

– User/business case driven– What is needed– Desired outcome of project

• Identify leaders• Members develop Statement of Work

– Project plan with identified tasks, check points and end dates

– Companies expected to participate– Results expected and how documented

• Members sign Project Statement– Formally commit resources as agreed– Specify information sharing process

• Carry out project, report quarterly

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Board Assembly ProjectsBoard Assembly Projects

Board Assembly TIGChair: Tom Pearson, Intel

Pb-Free BGAs in SnPb Assemblies

Chair: Robert Kinyanjui, Sanmina-SCICo-chair: Charan Gurumurthy, Intel

Pb -Free Assembly Substrate Surface Finishes

Chair: Keith Newman, Sun Microsystems, Co-chair: Charan, Gurumurthy, Intel

SMT Reel Labeling

Chair: Patrick Figueroa, Delphi Electronics & Safety

Pb-free Nano-solder

Chair: Andrew Skipor, Motorola

Pb-free DPMO

Chair: Andrew Dugenske, Georgia Institute of Technology

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Lead-Free AssemblyChair: Edwin Bradley, PhD Motorola

Co-Chair: Rick Charbonneau

Environmentally Conscious Electronics (ECE) Technology

Integration Group (TIG)

Tin Whisker ModelingChair: George Galyon, IBMCo-Chair: Maureen Williams, NIST

Tin Whisker Users GroupChairs: Joe Smetana, Alcatel

Richard Coyle, Lucent

Pb-Free Assembly & ReworkChairs: Jerry Gleason, HP

Charlie Reynolds, IBM

Pb-Free Assembly & ReworkChairs: Jerry Gleason, HP

Charlie Reynolds, IBM

RoHS Transition Task GroupChair: Dave McCarron, DellProjects: Component Supply Chain Readiness

Chair: John OldendorfComponent and Board Marking

Chair: Vivek Gupta, IntelAssembly Process Specifications

Chair: Frank Grano, -SCIMaterials Declarations

Chair: Nancy Bolinger, IBM

Complete

Pb-free Wave Soldering Chair: Denis Barbini, Vitronics Soltec

Co-chair Paul Wang, Microsoft

Complete

Complete

Pb-free Rework OptimizationChair: Jasbir Bath, Solectron

Halogen-freeChair: Steve Tisdale, Intel

RoHS High RelChair: Mike Davisson, AgilentCo-Chair: Joe Smetana, Alcatel

Tin Whisker Accel. TestsChair: Valeska Schroeder, HPCo-Chairs: Jack McCullen, Intel

Mark Kwoka, Intersil

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Optoelectronics TIG ProjectsOptoelectronics TIG Projects

Fiber Optic SignalPerformance

Chair: Tatiana Berdinskikh, CelesticaCo-Chair: Heather Tkalec, Alcatel

Fiber Optic SignalPerformance


Fiber Optic Splice

Loss Measurement Chair: Peter Arrowsmith, Celestica Com

plete

Complete

Optoelectronics TIGChair: Peter Arrowsmith, Celestica

Co-Chair: Alan Rae, PhD, Cookson Electronics

Fiber End-FaceInspection


Fiber Optic Splice Improvement

Chair:Peter Arrowsmith, Celestica Com

plete

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Fiber Optic Signal PerformanceFiber Optic Signal Performance• Objective:

– Learn the effects that anomalies have on the performance of a fiber optic signal

– Identify the severity of optical signal loss due to the most common hazards found in:

– Supplier – Internal manufacturing processes

Scope:– Develop connector end-face inspection criteria, which provides

feedback on specific cleanliness requirements to: • Incoming Quality• Component Engineering • Cable suppliers

– Provide quantitative evidence to production & test departments to validate their inspection and cleaning strategies.

Status: – Project completed - 2004

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Substrates TIG ProjectsSubstrates TIG Projects

High FrequencyMaterial Effects on HDI

Chair: Hamid Azimi, PhD, IntelCo-Chair: Jack Fisher, IPC

Optoelectronics for Substrates

Chair: Jack Fisher, iNEMI/IPC

Substrates TIGChair: Hamid Azimi, PhD, Intel

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Product Life Cycle Information Management (PLIM)Product Life Cycle Information Management (PLIM)

PLIM TIGCo-Chairs:

John Cartwright, IntelBarbara Goldstein, NIST

Materials Composition Data Exchange

Chair: Richard Kubin, E2open, Co-chair: Marissa Yao, Intel

Product Data Exchange (PDX 2.0)

Extensions & Updates

Chair:Barbara Goldstein, NIST CAD Data Exchange

Industry Adoption

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www.inemi.orgwww.inemi.orgEmail contacts:Email contacts:

Jim McElroy Jim McElroy

[email protected]@inemi.org

Bob PfahlBob Pfahl

[email protected]@inemi.org

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