Improve PCB and Package reliability with ANSYS · PDF filePCB and Package Warpage Challenges...
Transcript of Improve PCB and Package reliability with ANSYS · PDF filePCB and Package Warpage Challenges...
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1 © 2015 ANSYS, Inc. October 14, 2016 ANSYS Confidential
Improve PCB and Package reliability with ANSYS
Rajiv Lochan Rath
Korea 2016 UGM
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2 © 2015 ANSYS, Inc. October 14, 2016 ANSYS Confidential
Overview• PCB and Packages are used in almost all electronic products across industries.
Aerospace and Defense Consumer ElectronicsAutomotive
Healthcare Oil and Gas
Controller System Audio System Engine Control Module LCD display module
Drill hole tool
© Baker Hughes
Attendant Controller Panel Engine control module ….
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3 © 2015 ANSYS, Inc. October 14, 2016 ANSYS Confidential
Major Causes of Electronics Failures
Temperature55%
Vibration20%
Humidity19%
Dust6%
Material Properties- Coefficient of Thermal Expansion (CTE)- Coefficient of Moisture Expansion (CME)
Operation Environment- Cyclic Temperature- High Temperature Gradient(Thermal Shock)Operation Environment
- Cyclic Vibration- Shock
Design- Nonuniformity- Thickness (△T)- Thermal Via
Manufacturing Process(Assemblies)- Layering ; Lamination(Delamination)- Bonding- SJR
Material Properties- Conductivity- Moisture Permeability
Manufacturing Process- Void/Groove
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4 © 2015 ANSYS, Inc. October 14, 2016 ANSYS Confidential
• New Design
• Process Design
• Optimization
• Troubleshooting
• Validation
• Reliability
Role of ANSYS in PCB and Package Design
Thermo-Mechanical Stress
Popcorn & DelaminationViscoelastic
Package Warpage
Moisture Diffusion
& Vapor PressureHygro-mechanical
Stress
Solder Joint
Fatigue ModelingMechanical Stress
Mass & Heat Transfer
Fracture Mechanics Drop/Impact
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5 © 2015 ANSYS, Inc. October 14, 2016 ANSYS Confidential
Reliability
DC-IR + ThermalReliability
Thermo-Mechanical Reliability
Hygro-MechanicalReliability
Mechanical Reliability
Large deformation when PCB subjected to random vibration
Cracks formation at interface between solder ball and PCB due to thermal cyclic loading, CTE mismatch
Hot spot on PCB due to trace heating
(© Alcatel Lucent, Intel, Sanmina) (© expertfea.com)
UBM failure induced by Hygroswellling stress due to CME mismatch, moisture sensitivity
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6 © 2015 ANSYS, Inc. October 14, 2016 ANSYS Confidential
• DC-IR + Thermal Reliability
• Thermo-Mechanical Reliability
• Hygro-Mechanical Reliability
• Mechanical Reliability
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7 © 2015 ANSYS, Inc. October 14, 2016 ANSYS Confidential
Background : Joule Heating [𝑄 = 𝐼2𝑅]
• Joule heating effects on copper traces Temperatures increase Reliability issues PCB delamination and failure
• Thermal reliability analysis on printed circuit / wiring boards?
• High current PCB’s are densely populated with components
• Reduction of trace and via dimensions
• Current densities increase
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8 © 2015 ANSYS, Inc. October 14, 2016 ANSYS Confidential
ANSYS Solution
PCB Thermal Reliability
Challenges
Predict accurate temperature of PCB
Understanding both Thermal and Electrical physics and applications
Transfer data between different physics for accurate analysis
Accurate loss calculation with inclusion of thermal effects
Automatic looping until DC losses & Thermal map are constant
SIwave transfers local Joule heating losses into Icepak
Icepak returns temperatures back to SIwave
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9 © 2015 ANSYS, Inc. October 14, 2016 ANSYS Confidential
• Spatial Power Loss information from the DC-IR analysis (SIwave) is transferred to Icepak as a spatial Joule Heating map.
• Spatial Temperature information from the Thermal analysis (Icepak) is transferred to SIwave and interpreted as spatial thermal modifiers for electrical conductivity.
SIwave-DC – Icepak Bi-direction Coupling Overview
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10 © 2015 ANSYS, Inc. October 14, 2016 ANSYS Confidential
SIwave DC Solutions
WorkFlow Wizard, making the Simulation setup more convenient and user-friendly.
Import Settings
Verify / Modify Geometry, Materials, and Circuit Elements
Setup Simulation
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11 © 2015 ANSYS, Inc. October 14, 2016 ANSYS Confidential
SIwave DC Solutions
Quickly Identify:
• High Currents in Vias
• Current Crowding in Copper
• High Power Loss Regions
• Automated report generation with user defined pass/fail criteria.
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12 © 2015 ANSYS, Inc. October 14, 2016 ANSYS Confidential
SIwave – Icepak Coupling : Accurate PCB Thermal Analysis
Coupled DC-IR Simulation Wizard• Imports Power map to Icepak and Export Temperature modifiers back to SIwave• Minimal inputs from Electrical engineer• Automated coupling till convergence
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13 © 2015 ANSYS, Inc. October 14, 2016 ANSYS Confidential
Icepak Results : Temperature ComparisonWithout Trace heating
With Trace heating
1st Iteration 2nd Iteration 3rd Iteration
Simulation TypeMaximum
Temperature
Without Joule Heating 40.0 C
SIwave-Icepak Coupling (First Iteration)
69.0 C
SIwave-Icepak Coupling (Last/Third Iteration)
76.6 C
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14 © 2015 ANSYS, Inc. October 14, 2016 ANSYS Confidential
Case Study: Power Supply Board
• Difference between Icepak / SIwave + Icepak coupling
• Difference between Icepak + Mechanical / SIwave + Icepak + Mechanical coupling
Icepak
(no Trace heating)SIwave + Icepak
Icepak + Mechanical
Shift of max stress
quantity and location
Hotspot off by
10.3 C vs
experiments
Hotspot off by
2.3 C vs
experiments
Siwave + Icepak + Mechanical
Courtesy: Toshiba Corporation, ANSYS Advantage
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15 © 2015 ANSYS, Inc. October 14, 2016 ANSYS Confidential
• Thermal Reliability
• Thermo-Mechanical Reliability
• Hygro-Mechanical Reliability
• Mechanical Reliability
(© Alcatel Lucent, Intel, Sanmina)
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16 © 2015 ANSYS, Inc. October 14, 2016 ANSYS Confidential
ANSYS Solution
PCB and Package Warpage
ChallengesPredict local warpage accurately during reflow
Understanding effect of belt speed, geometry of package
Accurately calculating the local material properties
Trace in Mechanical
R17 feature in Mechanical and SpaceClaim for Copper and FR4
distribution
Reflow Profile applied for Warpage
Warpage calculation in Mechanical
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17 © 2015 ANSYS, Inc. October 14, 2016 ANSYS Confidential
Comparison of Warpage with and w/o Trace in PCB
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18 © 2015 ANSYS, Inc. October 14, 2016 ANSYS Confidential
Flip-chip package Warpage
• Why important is to consider the warpage- critical to the subsequent package process after post mold cure process (reflow failure, solder-joint reliability failure)
• Standard : JESD22-B112A from JEDEC
ANSYS FEM vs ExperimentBlock Warpage from STMicroelectronics
Step I: Silicon, solder bump and substrate bond at reflow temperature (>180 C)
Step II: Cool down from 180 C to room temperature
Step III: Underfilling, cure at 150 C, Cool to room temperature
Step IV: Lid attach/encapsulation at ~120C, cool down to room temp
Step V: Ball attach & reflow at > 180C
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19 © 2015 ANSYS, Inc. October 14, 2016 ANSYS Confidential
ANSYS Solution
Solder Joint Life Cycle Estimation
ChallengesPredict time to failure
Understanding simulation procedure for life cycle estimation
Prediction using Darveauxmethod
Life cycle estimation
ACT Extension to Automate Simulation Process
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20 © 2015 ANSYS, Inc. October 14, 2016 ANSYS Confidential
Darveaux Method – Cycles to FailureFatigue Post-processing
Results Table
Equivalent Plastic Strain
Quarter Symmetric Package Model
No of cycles to failure
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21 © 2015 ANSYS, Inc. October 14, 2016 ANSYS Confidential
• Thermal Reliability
• Thermo-Mechanical Reliability
• Hygro-Mechanical Reliability
• Mechanical Reliability
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22 © 2015 ANSYS, Inc. October 14, 2016 ANSYS Confidential
Moisture-induced Failure
• Requires the Following
1. Absorption under Moisture Sensitivity Level
2. Desorption during bake out or Reflow
3. Heat transfer during Reflow
– May not be needed since reflow profile temperature is known
4. Moisture Swelling
5. Thermal Warpage during Reflow
6. Combination of 4. & 5. Above
7. Vapor pressure in the volume
8. Vapor Pressure & Interface delamination prediction
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23 © 2015 ANSYS, Inc. October 14, 2016 ANSYS Confidential
• The moisture-induced failure- Popcorn- Delamination- common phenomena during solder reflow- due to sudden vaporization of moisture absorbed by package at high temperature condition (local moisture concentration at the critical interface)
• Standard: J-STD-020C Moisture/Reflow Sensitivity TestingJESD22-A113 Reflow Preconditioning
Moisture-induced Failure
Temperature distribution during reflow
Transient vapor pressure/moisture distribution during moisture preconditioning & reflow
Integrated Strain Result
UBM Failure Induced by Hygroswellling Stress
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24 © 2015 ANSYS, Inc. October 14, 2016 ANSYS Confidential
• Thermal Reliability
• Thermo-Mechanical Reliability
• Hygro-Mechanical Reliability
• Mechanical Reliability
(© expertfea.com)
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25 © 2015 ANSYS, Inc. October 14, 2016 ANSYS Confidential
Von Mises Stress Distribution of Solder BallAfter board level drop test
Mechanical Reliability
• Drop test simulation- critical to portable telecommunication devices such as mobile phone, PDA,
home appliances- Explicit ANSYS Solver(Autodyn, LSDyna)
• Shock test simulation- critical to vehicle application devices(JESD22-B104)- critical to defence system application devices(MIL-STD-883)- critical to aerospace application devices(MIL-STD-883)- Implicit/Explicit ANSYS Solver
• Vibration test simulation- critical to vehicle application devices(JESD22-B103)- critical to defence system application devices(MIL-STD-883)- critical to aerospace application devices(MIL-STD-883)- ANSYS Mechanical/APDL
• Fatigue Test Simulation- critical to improve the reliability of the product in market(QA unit/Self Std)- ANSYS Mechanical Fatigue & nCODE for EN/SN Fatigue Simulation
Cycles to Failure
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26 © 2015 ANSYS, Inc. October 14, 2016 ANSYS Confidential
ANSYS Solution
Vibration Reliability
ChallengesPredict the response under Random Vibration Loadings
Predicting fatigue life due to Random Vibration Loadings
PSD
Time History
Frequencies& Mode Shapes
Response PSD
Sigma Values
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27 © 2015 ANSYS, Inc. October 14, 2016 ANSYS Confidential
SummaryValue to Customer
- Ease of coupling multiple physics - Accurate prediction of Temperature- Accurate prediction of local material properties- Accurate Deformation, Stress and Life prediction- Accurate prediction of behavior of an electronic component under vibration- Quick turnaround time- Reduced time to market
Customer using ANSYS Solution
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28 © 2015 ANSYS, Inc. October 14, 2016 ANSYS Confidential
Reliability Analysis of Smart Phone
https://youtu.be/8OsJSnutuVk
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29 © 2015 ANSYS, Inc. October 14, 2016 ANSYS Confidential
ANSYS Consulting Services Your partner in Reliability Simulations
• We bring:• The largest team of CAE experts
• The broadest portfolio of simulation software
• Unmatched industry experience
• With the goal of:• Understanding your process
• Smartly integrating simulation
• Measuring impact on your business
• To give you:• Improved workflow
• Customized tools
• Measurable ROI
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30 © 2015 ANSYS, Inc. October 14, 2016 ANSYS Confidential
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