ILJIN DIAMOND Co., Ltd.
description
Transcript of ILJIN DIAMOND Co., Ltd.
Diamond
ILJIN DIAMOND Co., Ltd.
IMD seriesIljin Metal bond Diamond
Diamond
IMD-F IMD-D IMD-B IMD-A
Sawing of granite & ceramic tilesRough polishing of graniteReinforced glass edgeFerrite motor coreCMP pad conditioner
Core drill of glassCrystal & glass decorating grooveSilicon nitride OD grindingMiddle stage grinding of Crys-tal & granite
Glass (Normal, TFT-LCD, Motor) edgeCut-off wheel for crystal or glassFinal polishing of granite
Fired tungsten carbideDental burrsBeveling of glass and mirrorCut-off wheel for glass & quartzFerrite grinding
IMD-G
IMD series
Diamond
Toughness IndexTo
ughn
ess
Inde
x
Mesh Size
GF
D
B
A
TP
IGD II10
20
30
40
50
60
70
80
80/100 100/120 120/140 140/170 170/200 200/230 230/270 270/325 325/400 400/500
Diamond
MBG-660 MBS-640 MBG-620
PDA-878 PDA-P768
MBG-610
IMD-F IMD-D IMD-B IMD-AIMD-G
PDA-989PDA-999
Grades equivalent
Diamond
IMD-TP
Shape comparison
IGD-VIGD-II
Crushed Products As-grown Product
Diamond
MESH Weight Percent Spec.
80/100 2wt% ±0.5
100/120 3wt% ±0.5
120/140 4wt% ±0.5
140/170 5wt% ±0.5
170/200 6wt% ±0.5
200/230 7wt% ±0.5
230/270 8wt% ±0.5
270/325 9wt% ±0.5
325/400 10wt% ±0.5
400/500 11wt% ±0.5
Ti coating
Diamond
Test ConditionArea : JapanWheel Type : N/ABond : ElectroplatedWorkpiece Mate-rial :
Ferrite motor core
Mesh Size : 100/120Concentration : N/APeripheral Speed :
N/A
DOC : N/AFeed rate : N/A
C
BA
A B C0
5000
10000
15000
20000
EA
IMD-F MBG-660
Ferrite Motor Core Grinding
D Company
Diamond
5500
9700
15000
9500
G-ratio Power Consumption
IMD-F IMD-F Ti
Test Condition
Area : JapanWheel Type : N/ABond Material : Bronze (Cu-Sn)Work piece Ma-terial :
Glass
Mesh Size : 170/200Concentration : N/APeripheral Speed :
N/A
DOC : N/AFeed rate : N/A
Glass Grinding
Diamond
Safety Glass GrindingArea KoreaIndustry AutomotivePart Name Safety Glass Operation Glass Edge Grinding (Bando)Workpiece Material Glass
Wheel Spe-cific
Metal BondΦ200 x 4w x 75H x 11t
Diamond & cBN IMD-F Ti (Ti Coating)
Process Pa-rameters
Metal BondWheel Vs : 1600m/minFeed rate : 10~20m/min
Results
Remark
STD IMD-FTi0
50
100
150
200
250Chart TitlePa
rt/h
r (e
a)
STD IMD-FTi0
2000
4000
6000
8000
1000012000
14000
Whe
el L
ife (
m/w
heel
)
Diamond
ILJIN DIAMOND Co., Ltd. Grit Business Unit
Ti coated wheel grit
Diamond
1. 코팅 광학 형상
기존IMD-Fti170/200
• 광학사진에서 기존 방식은 상당히 어두운 색을 띄고 표면이 거칠어 보임 . • 신규 샘플은 기존 방식의 제품과 비교하여 광택을 띄고 표면이 매끄러움 .
신규IMD-Fti170/200
Diamond
2. 코팅 SEM 형상
• 기존 제품은 edge 가 벗겨지거나 코팅층이 불균일하게 형성되었음 .• 신규 제품은 코팅층이 일관성있게 형성되어 있음 .
기존IMD-Fti170/200
신규IMD-Fti170/200
Diamond
2. 코팅 SEM 형상
기존IMD-Fti170/200
신규 sput-tering
IMD-Fti170/200
• 고배율 관찰에서도 기존 제품에 비해 치밀한 코팅층을 유지하고 있고 , edge 부분도 손상이 없음 .
Diamond
3. TRS test result
Kg/mm2
New coating As-is#1 1.72 1.32 #2 1.96 1.47 #3 1.75 1.43 #4 1.61 1.50 #5 1.66 1.60 Avg 1.74 1.46
Transverse Rupture Strength TestDia grade/size: IMD-FTi 170/200 meshConcentration: 100Segment size: 6.4*6.4*40mmTRS M/C: ZWICK Z050Test condition: ISO B Type
Sintering ConditionBond system: 50%Cu-20%Sn-30%FeSintering Temp: 700℃/2min
TRS Test-Kgf/mm2
1.741.46
0
3.0
New coating As-is
Diamond
4. 소결 후 본드와의 결합 상태
• SEM 관찰 시 신규 제품이 본드층과의 접합성이 기존 제품에 비해 우수한 것으로 관찰됨 .
기존IMD-Fti170/200
신규IMD-Fti170/200
Diamond
5. 소결 후 TIP 파단면 상태
New Coating As-is
• SEM 관찰 결과 다이아몬드 표면은 모두 Ti 코팅층으로 형성되어 있음 .• 기존 제품과 신규 제품과의 소결 후 탈락된 부분을 비교 관찰한 결과 신규 제품에 비해 기존 제품이 약 20% 가
탈락율이 높은 것으로 분석됨 .
Diamond
ILJIN DIAMOND Co., Ltd.
Diamond for CMP Pad condi-tioner
Diamond
Trend of CMP Process
Metal vs. Oxide CMP : Million $ CMP growth by material
Metal CMP 의 성장속도가 높으며 , 이 중 Cu CMP 의 성장율이 높음 . Cu CMP 에서 scratching issue 및 고집적화에 의한 diamond 의 fine, narrow 경향 심화
Metal CMP 에서 Diamond 의 Shape, Narrow PSD, Diamond purity 의 중요성이 강조
Diamond
CMP Process
Memory Semiconductor 와 Logic 간에 가공하는 피삭재의 차이에 따라 적용되는 Diamond 는
틀리게 적용
MemoryLogic
Diamond
Tech. Trend of CMP Condi-tioner
Sintering BlazingElectroplatingSintering BlazingElectroplating
Pattern, Narrow Size, Special Shape
• CMP Conditioner 에서 요구되는 Cutting Rate 가 높아지고 , 고 집적화 되면서 Dia-mond 는 fine, narrow 한 PSD 가 요구됨 .
• Conditioning 효과를 높이기 위하여 pattern 및 diamond 의 돌출높이는 높이기
위한 개발 , 적용 진행 중
Typical Type of CMP Conditioner
Diamond
As was
Coarse size80/90
90/100
Blocky shapeIMD – F,D PDA 999 MBG 660
As is
Medium / fine size100/120140/170170/200200/230
Angular shape IMD – B,A,TP
PDA 878MBG 620
Increased number of particles
(High Density)
Higher Cutting Rate (CR)
Tech. trend of diamond for CMP
Diamond
Special process for CMP only
PSD
Shape
Impurity
Special Treatment – I
Narrow PSD (Double size → Single mesh → Micron size) Over size particle removing process (3 stage sieving at clean room)
Precision heating control (HPHT) Perfect shape sorting and consistency
Minimized metal inclusions using high magnetic field Suitable for electroplating and vacuum brazing process
Removing the twin, sharp needles and weak crystal No damage of normal crystal’s sharp edge To prevent the Ni over plating and nodules on diamond crystal Perfectly clean and non electric conductivity on the surface of dia-
mond De-magnetizing
Special Treatment – II
Diamond
Temp (0C)1300 1400 1500
5.5
6.0
6.5
(111)+(100)
(110)
(111)(100)
Pres
sure
(GPa
)
A B C
D E F
G H I
Shape – HPHT technology
Diamond
IMD-F IMD-T
Shape – HPHT technology
Diamond
IMD-F IMD-D
IMD-B IMD-A
IMD-G
IMD-TP
Shape – Sorting technology
Diamond
IMD-NA1
IMD-NA2
IMD-NB1
Special treatment I
IMD-NB2
Diamond
Special treatment II
Diamond
Metal impurities on the surface of diamond grit for CMP
ElementILJIN DI E6
2hrs 4hrs 8hrs 2hrs 4hrs 8hrs 2hrs 4hrs 8hrsLi - - 0.00 0.01 0.01 0.01 0.00 0.01 0.01 Na 1.54 1.28 1.22 1.79 3.37 3.76 13.34 12.39 14.53 Mg 0.80 0.89 1.00 0.13 0.21 0.20 6.66 6.02 6.61 Al 0.42 0.39 0.47 0.34 0.64 0.61 0.33 0.43 0.50 K 0.04 - - 0.15 - - 2.17 2.25 2.36 Ca 1.22 1.83 1.94 1.47 2.01 2.12 55.72 54.72 58.23 Cr 0.12 0.36 0.35 0.35 4.71 4.58 0.52 9.80 10.52 Mn 0.21 0.27 0.25 0.10 0.41 0.44 0.07 1.14 1.42 Fe 7.25 23.02 30.47 5.19 31.41 44.57 14.38 97.34 135.27
Co - - - 0.01 0.03 0.04 0.01 0.13 0.15
Ni 1.08 4.30 6.82 1.39 5.79 9.25 4.78 20.64 31.59 Cu 0.92 0.93 0.83 1.96 2.23 2.39 0.28 0.38 0.44 Zn 0.80 1.10 1.29 0.67 0.90 1.15 0.52 1.36 1.92 As 0.01 0.01 0.01 - - - 0.01 0.02 0.02 Sr 0.03 0.03 0.03 0.01 0.03 0.03 0.17 0.18 0.18 Cd 0.01 0.01 0.00 0.00 0.00 0.01 0.00 0.05 0.02 Ba 0.03 0.03 0.03 0.01 0.04 0.05 1.05 1.17 1.20 Pb 0.81 0.77 0.69 0.06 0.13 0.14 0.35 0.43 0.48
(unit : ppb)
Special treatment II
Diamond
Metal impurities on the surface of diamond grit
1.94
0.350.83
6.823.76 2.12
4.58 2.39
9.25
0.44
1.22
0
2
10
50
100
150
Na Ca Cr Cu Fe Ni
30.4714.53
58.23
10.52
44.57
135.27
31.59
(ppb)
ILJINDIE6
Special treatment II
Diamond
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