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IHPIm Technologiepark 2515236 Frankfurt (Oder)
Germany
IHP Im Technologiepark 25 15236 Frankfurt (Oder) Germany www.ihp-microelectronics.com © 2006 - All rights reserved
An Implementation Study on Fault Tolerant LEON-3 Processor System
Z. Stamenković
IHP Innovations for High Performance Microelectronics Slide 2 © 2006 - All rights reserved
Outline
• Radiation and fault tolerance
• System description
• Implementation details
• Test results
• Under way
IHP Innovations for High Performance Microelectronics Slide 3 © 2006 - All rights reserved
Reliability Issues in Radiation Environments
• Single-event upset (SEU)
A change of state caused by a charged particle strike to a sensitive volume in a microelectronic device
Alpha particles (helium-4 nuclei) emitted by radioactive atoms found in packaging materials
Thermal neutrons in certain device materials that are heavily doped with 10B
High-energy terrestrial cosmic rays (play a major role)
• SEU-induced latch-up
A failure mechanism of CMOS integrated circuits characterized by excessive current due to parasitic PNPN paths
IHP Innovations for High Performance Microelectronics Slide 4 © 2006 - All rights reserved
Fault Tolerance of LEON-3 Processor
• SEU tolerance by design (Gaisler Research)
Triple-module-redundancy (TMR) on all flip-flops
Three copies of a flip-flop
Two of three voting on output
Register file error-correction (up to 4 errors per 32-bit word)
Cache RAM error-correction (up to 4 errors per tag or 32-bit word)
Autonomous and software transparent error handling
No timing impact due to error detection or correction
Fault-tolerant memory controller
Provides an Error Detection And Correction Unit (EDAC)
Corrects one and detects two errors
• Not immune to SEU-induced latch-up (in present IHP technology)
IHP Innovations for High Performance Microelectronics Slide 5 © 2006 - All rights reserved
LEON-3 Processor System
LEON_3FT Core
8 Reg. Windows
LEON_3FT Core
8 Reg. Windows
FT Memory Controller
FT Memory Controller
8 x
GP
IO8
x G
PIO
GPIOEJTAG
2 kByteI- Cache
2 kByteI- Cache
2 kByteD- Cache
2 kByteD- Cache
AHB APB
1 x 24bitTimer
1 x 24bitTimer
UART 0UART 0
EDAC SRAM
EDAC SRAM FLASHFLASH
Serial 0
Serial 1 UART 1UART 1
Bri
dg
eB
rid
ge
Scan TestScan TestFT Add-onFT Add-on
FT Add-onFT Add-on
Scan-I/F
IHP Innovations for High Performance Microelectronics Slide 6 © 2006 - All rights reserved
• Installation of the release
• Adaptation of the configuration tool (to include IHP’s library)
• Implementation of data and instruction caches
• Logic synthesis of the design
• Implementation of scan chain
• Generation of the chip layout
• Simulation (functional, post-synthesis and post-layout net-list)
• Scan test vectors generation (ATPG)
• Scan test simulation
• Adaptation of testbenches
• EVCD test vectors generation
• Test specification
• Documentation
Implementation Details
IHP Innovations for High Performance Microelectronics Slide 7 © 2006 - All rights reserved
Chip Features
LEON-3
Area (mm2) 22
Number of signal ports 105
Number of power ports 20
Number of scan ports 1 (3)
Transistors (x106) 0.83
Cache Memory (kB) 6
Scanable Flip-Flops (x103) 15
Power/Frequency (mW/MHz) 6.2
Max Frequency (MHz) 160
Cache Array
Size (KB)
No. of Words
Data Width
Address Width
I/D Data 2.5 512 36 of 40 9
I/D Tag 0.5 128 29 of 32 7
IHP Innovations for High Performance Microelectronics Slide 8 © 2006 - All rights reserved
Test System (Gaisler Research)
• Target hardware consists of a small mezzanine with Fault Tolerant LEON-3 device mounted on a development board (Pender Electronic Design)
• Board communicates with a host system (a laptop PC) over one of the on-chip UARTs
IHP Innovations for High Performance Microelectronics Slide 9 © 2006 - All rights reserved
Test Execution (Gaisler Research)
• Heavy-ion-error injection
Chamber with the vacuum of 10-2 mbar
Californium (Cf-252) source
Flux of 25 particles/s/cm2 at the device surface for 3 hours
• “Paranoia” program makes a large number of calculations and registers any computational error or anomaly
• On-chip monitoring logic reported 281 effective SEU errors, of which 99% were corrected
• Cross-section for a memory RAM bit was measured to 7.2x10-8 cm2
IHP Innovations for High Performance Microelectronics Slide 10 © 2006 - All rights reserved
Under Way
Protection against SEU-induced latch-up