ICMA EXPO – Hollywood FL - 2011 · 2014. 1. 15. · SMARTRAC TECHNOLOGY GROUP ICMA EXPO –...
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Dual Interface Possibilities and Challenges: A Panel Discussion Thomas Decker VP Sales EMEA & Americas Business Unit Cards SMARTRAC TECHNOLOGY GROUP ICMA EXPO – Hollywood FL - 2011
Transcript of ICMA EXPO – Hollywood FL - 2011 · 2014. 1. 15. · SMARTRAC TECHNOLOGY GROUP ICMA EXPO –...
Dual Interface Possibilities and Challenges:
A Panel Discussion
Thomas Decker
VP Sales EMEA & Americas
Business Unit Cards
SMARTRAC TECHNOLOGY GROUP
ICMA EXPO – Hollywood FL - 2011
Strictly confidential - FB08032007
Technology considerations for dual interface cards – “Check List”
• 1.) Reliable interconnection between antenna & module
(real interconnection preferred over just contact)
• 2.) Reliability of the antenna technology itself
(antenna material & bridging technology)
• 3.) Consistent RF-performance throughout the specified read range
(form “0” to “X inch”)
• 4.) Durability of the card body itself
(hot-laminated monolithic structure desirable )
• 5.) Economical manufacturing process
(cost of antenna, module, connecting material, equipment)
• 6.) Supply chain aspects
(security; complexity; turnaround times)
Strictly confidential - FB08032007Page 3
BasicTechnologiesBasic
Technologies
InterconnectionTypes
InterconnectionTypes
AntennaTypesAntennaTypes
HERA DDI
Durable Dual
Interface
D&FDrill & Fill
Metal wire
Bond (laser) Direct TC
Metal bond Conductive
Expoxi Flex Bump Pad-Antenna
Embedded
wire & pad Procoil
Embedded
Wire Etched
Combi
Antenna Pad-Antenna
Embedded
wire & pad Standard Wire
Embedded
Antenna Printed
Antenna
State of the art new Technology
Other propriet.
Glues
Overview manufacturing technologies for dual-interface cards (DIF)
Strictly confidential - FB08032007Page 4
Inlays for Drill & Fill (Procoil) ►►►► current volume DIF technology
Different termination area
designs depending on
module / antenna
connecting technology
Strictly confidential - FB08032007Page 5
DDI prelams® ►►►► easy start into reliable DIF @ low investment
“Thermo Compression” (TC) interconnection
between antenna & module ► highest reliability
Customer specific sheet layout
Strictly confidential - FB08032007Page 6
New! HERA process – creating a new DIF reliability standard !
●●●●●●●●●●●● ●●●●●●●● ●●●●
Drill & Fill process with laser-soldered
interconnection between module & antenna
►► fully automated high volume productionof cards with highest reliability !
Strictly confidential - FB08032007Page 7
HERA process-flow
1
Inlay manufacturing Card body manufacturing 2
6
Module implanting
5
Wire to module TC bonding
4
Wire to antenna laser soldering
Module cavity milling
(Exposing of termination pads) 3
Strictly confidential - FB08032007Page 8
HERA process-flow (continue)
7
Section cut of finished HERA dual interface card
Strictly confidential - FB08032007Page 9
End
For further information please contact:
Strictly confidential - FB08032007 23. April 2010 Smart Card Forum Switzerland
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SMARTRAC TECHNOLOGY GROUP
Thomas Decker
VP Sales EMEA & Americas
Business Unit Cards
Office: + 65 6469 1260
Fax: + 65 6469 0867
Mobile: + 49 151 100 24375
+ 66 8 989 411 07
eMail: [email protected]
Skype: thomas.decker
Internet: www.smartrac-group.com
Contact:
