ICEPAK on ANSYS Electronics Desktopansys.kr/Uploaded_Files/201711201511188394.pdf · Steady state...

1/47 © 2016 ANSYS, Inc. 2017 ANSYS Electronics Simulation Expo, Seoul

ICEPAK on ANSYS Electronics Desktop

ANSYS Korea2017 ANSYS Electronics Simulation Expo, Seoul

Taeshin Kang


Heat

Thermal Energy

• All matter is made up of atoms and molecules that are constantly moving.

• The motion of atoms and molecules creates a form of energy called heat or

thermal energy which is present in all matter.

• A temperature is an objective comparative measure of hot or cold.

• The Coldest theoretical temperature at which atom or molecule reach state of

motionless is Absolute Zero (-273.15 K).

Surrounding (Cooler)

Hot Body Cold Body

Surrounding (Hotter)

Heat is flow of energy from high temperature to lower temperature


Modes of Heat transfer

Modes of Heat transfer

• Conduction

➢Occurs in a medium (fluid or solid)

➢Diffusion of heat due to temperature gradient within the medium.

• Convection

➢Heat is transported by a moving fluid (liquid or gas).

➢ Type : Natural Conv., Force Conv. and Mixed Conv.

• Radiation

➢ Emission of energy by photons within electromagnetic waves

Conduction Convection Radiation

Reference: https://en.wikipedia.org/wiki/Heat_transfer


ANSYS ICEPAK – Computation Fluid Dynamics Solver

ICEPAK is an integrated “Electronics Cooling” solution for IC packages, printed circuit boards and complete electronic systems

Fluid flow ➢ Laminar

➢ Turbulent

Conjugate heat transfer➢ Conduction

➢ Convection Natural

➢ Convection Forced

➢ Radiation (Thermal and Solar)

➢ Joule Heating

Steady state and transient thermal analysis

Single or multiple fluids

Species transport

Parametrics and Optimization

Reduced Order Modeling (ROM)

Multi-physics coupling

Velocity streamlines and temperature contours for a card array in a VME box cooled by three axial fans

Temperature contours and fluid velocity vectors of a fan cooled rack mounted computer


Heat Sources

The main sources of Heat within electronic equipment

Heating within active components

PCB layers : Joule heating

BUS Bar : Joule heating

Wiring : Joule heating

RF Losses

Eddy Current Losses

Components

Wirebond


DC Electro-Thermal Coupling

SIwave and ICEPAK automatically exchange power map and temperature data

• Accounts for Joule Heating losses within PCBs and packages for a more accurate temperature field

Current Density(SIwave)

Temperature(ICEPAK)

Power Map

Temperature

SIwave Thermal Solution leveraging ICEPAK Solver

Conduction & ConvectionHeat Transfer Modes


ECAD vs. Lumped Board

Lumped BoardTo

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om

ECAD Board

Higher temperatures More accurate heat dissipation


Temperature-Dependent Antenna Performance

• Results:✓ RF Amp Junction Temp: 71.6 oC✓ Antenna + Channel Temp: 53 oC to 70 oC

Case 2: temperature-dependent RF material properties in HFSS + temperature-dependent a

mplifier model in circuit (amp @ 68 C)

• Significant de-tuning of input impedance

Drop in antenna efficiency due to increased operating Temperature:

47% (original) 32% (with Temperature feedback)

Antenna Efficiency:

Antenna Return Loss:

Temperature-Dependent Antenna Performance


Most barrier walls : Different User Experience / User interface

AEDT GUI

ICEPAK GUI


2017 Galaxy S8 2010 Galaxy S


ICEPAK on ANSYS Electronics Desktop


ICEPAK Vision R18.1 & Beyond

Create an Automated, Streamlined Electro-Thermal Multi-Physics Solution that utilizes Native MCAD/ECAD for First Pass Mesh/Solve Success

Key Drivers/Mandates

• Integration into AEDT

• Same UX / UI, Ease-of-Use

• Rapid Release Cycles

R18.1 First release

• Initial exposure with most common feature set

• CPS with Enclosure

• Steady-state thermal

Improved Workflow

• Integrated Electro-Thermal Workflow

• Native ACIS MCAD Modeler

• ECAD-MCAD Assembly

• Geometry Clean Up & Simplification


ANSYS Electronics Desktop

HFSS

Maxwell

Q3D Extractor

ICEPAK solver

ICEPAK on

Ansys Electronics Desktop


Activate ICEPAK on ANSYS Electronics Desktop


ICEPAK on Ansys Electronics Desktop

Same User Experience / User Interface

Easier coupled analysis

Tightly coupled analysis

Variable processing functions

Powerful optimization features


Same UX / UI as Electronics

Project manager

Variables MRB, Context menu

Component Library

ACIS modeler

Modeler Tree


Same as Electronics' Auto mesh setting : Slider Bar Meshing

Solver & Meshing Performance- Slider Bar Meshing- Add DME simplification to SCDM & AEDT 3D Modeler

ICEPAK mesh


Simple user specified mesh regions


ICEPAK Solver Setup / Solve


Material library for Thermal

Materials for Thermal Physics• Fluid materials : Liquid, gaseous materials relevant to electronics cooling applications• Solid materials : Insulations, epoxy, metals, Heat-spreaders, package materials, etc.• Surface materials : Paint, metals, plastics etc.


ICEPAK components library

Support

- Variable Fan library- Variable Heatsink library- Customized Component

Native component migration - Fans : Adda, Delta, EBM, Elina, Jaro, Nidec, NMB, Panasonic, Papst, SanyoDenki, Sunon- Heatsinks : Aavid ( Only component heatsinks migrated)1


Support 3D Model Simplification

Simplify arbitrary shaped object into simpler shapes

• Available for ICEPAK and all 3D products

Simplification Types

• Bounding Box

• Primitive Fit

• Polygon Fit

Simplify in specific coordinate system

Option to separate into primitives bodies

Bounding Box

Polygon Fit

Primitive Fit

Primitive Fit in Relative CS

Simplify

With Separate Bodies


Field Plot

Various thermal plot


Field Plot

Velocity

Thermal by air speed


Script support for automation

- Native Java, VB, and IronPython Scripting with Record & Playback capabilities- Open Command Window for IronPython


Conventional Coupling with ANSYS HFSS / Maxwell / Q3D

Electric Field

Surface heat flux in Aluminum housing

Volumetric heat density in Lossy material

• Surface and volume losses for a waveguide termination are mapped from HFSS to ICEPAK

Natural convection

Fan coolingwith heat sink

Natural convection with heat sink

Heat Losses

Temperature

HFSS / Q3D Workbench ICEPAK


AEDT-ICEPAK EM & ICEPAK Dynamic Thermal Link

• Maps Power Loss into AEDT-ICEPAK

Assign EM Loss ‘Thermal BC’ to selected volumes and/or surfaces

Pick sources -> AEDT Design and Solution

Ability to view or edit link

• Variables, Freq. from source design

• Solve/update source design


Q3D EM Loss


ICEPAK Dynamic Link

ICEPAK Thermal with EM loss


ECAD Trace Mapping vs. Explicit Trace Modeling

• Case study on a flip-chip package in a JEDEC 𝜃𝑗𝑏 setup

• Die power: 1 Watt, ambient temperature: 0oC

• 𝜃𝑗𝑏= maximum die temperature

ECAD model with imported traces Explicit model with all the details

Model Number of Objects Mesh Count Preparation Time RAM Solve Time

ECAD 7 ~3.3 M Minutes 4.2X Reduction 5.3X Faster

Explicit 1581 ~11 M ~ Days 1X 1X


ECAD meshing with HFSS 3D layout

MCAD Project ~34 MB

Solver & Meshing Performance- Improve via mapping, geometry handling & linkages to SIwave & RedHawk

ECAD Project ~0.5 MB


ECAD meshing with HFSS 3D layout

Coarse : 50 200 Fine : 800

Automatic PCB Metal Fraction for ICEPAK


ICEPAK with ECAD

Thermal conductivity X

Top Bottom

Thermal plot & PCB mesh

Customized mesh region

HFSS 3D layout Field Thermal surface plot







Powerful Optimization / DOE features


ACIS Parametric model : Same as Electronics

ACIS Parametric Technology

• Dynamic Edits - Change Dimensions

• Add Variables➢ Project Variables (Global) or Design Variables (Local)

➢ Animate Geometry

➢ Include Units – Default Unit is meters

• Supports mixed Units


ICEPAK Parametric simulations with Electronics

ICEPAK HFSS



Via drill size variations

Via pad size variations

Via pad size

Via drill size



Input current variations

Input current


AEDT : Integrated Design Of Experiments


AEDT : Integrated Design Of Experiments

Via pad diameter : 5 stepDrill diameter : 5 stepInput voltage : 10 step

Parametric sweep250 case

1 Case 15 min250 Case 62.5 Hour

1 Case 15 min13 Case 3.25 Hour

DOE sweep13 case


AEDT : Integrated Design Of ExperimentsG

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HPC for ICEPAK on AEDT

ANSYS Electronics HPCANSYS HPC available at R19

ICEPAK on ANSYS Electronics Desktopansys.kr/Uploaded_Files/201711201511188394.pdf · Steady state...

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