IC Packaging 2008
-
Upload
angelo-cordero -
Category
Documents
-
view
249 -
download
1
description
Transcript of IC Packaging 2008
-
CMP annual users meeting, January 10th 2008, PARIS
Chapitre
Franais
1 / 26 [email protected]
CNRS INPG UJF
IC Packaging ServiceIC Packaging Service
CMP offers a Complete Packaging Service:
Ceramic / Plastic / Plastic Open Cavity
Prototyping / Low volume / Add. packaging
Wide Range of Packages
-
CMP annual users meeting, January 10th 2008, PARIS
Chapitre
Franais
2 / 26 [email protected]
CNRS INPG UJF
Ceramic PackagesCeramic Packages
SOIC 8 SOIC 16SOIC 20SOIC 24SOIC 28
Small Outline
PGA 68 PGA 84 PGA 100PGA 120PGA 144PGA 160PGA 180PGA 208PGA 224PGA 256
Pin Grid Array
LCC 16LCC 20LCC 28LCC 32LCC 44LCC 68LCC 84
JLCC 28JLCC 44JLCC 52JLCC 68JLCC 84
Leadless & J-Leaded Chip Carrier
CQFP 20CQFP 28 CQFP 44CQFP 64 CQFP 68 CQFP 84 CQFP 100CQFP 120CQFP 128CQFP 144CQFP 160CQFP 208CQFP 256
CerQuad Flat Pack.
DIL 8 DIL 14DIL 16DIL 18DIL 20DIL 24DIL 28DIL 40DIL 48
DualIn-Line
Sealed or Removable LidsSealed or Removable Lids
-
CMP annual users meeting, January 10th 2008, PARIS
Chapitre
Franais
3 / 26 [email protected]
CNRS INPG UJF
Plastic Packages Plastic Packages ( 1 / 2 )( 1 / 2 )
SOIC 8 SOIC 14SOIC 16SOIC 20SOIC 22SOIC 24SOIC 28
Small Outline
TQFP 32TQFP 44TQFP 48.
.
.
TQFP 160TQFP 176
Thin Quad Flat Package
PLCC 20PLCC 28PLCC 44PLCC 68
Plastic Leaded Chip Carrier
MQFP 80MQFP 100MQFP 128 .
.
.
MQFP 240MQFP 256
Metric Quad Flat Package
Leaded Leaded
LQFP 32LQFP 44LQFP 48.
.
.
LQFP 160LQFP 176
Low Quad Flat Package
QFP FamilyQFP Family
-
CMP annual users meeting, January 10th 2008, PARIS
Chapitre
Franais
4 / 26 [email protected]
CNRS INPG UJF
PBGA 204PBGA 217PBGA 225PBGA 250PBGA 313PBGA 352PBGA 420PBGA 456
Plastic Ball Grid Array
QFN 8QFN 10QFN 12QFN 16
.
.
.
QFN 64QFN 72QFN 80
Quad Flat No lead
FBGA 81FBGA 108FBGA 144FBGA 160FBGA 196FBGA 208FBGA 225FBGA 256FBGA 280
Fine pitchBall Grid Array
TSSOP 20TSSOP 24TSSOP 28TSSOP 38
Thin Shrink SmallOutline Package
Plastic Packages Plastic Packages ( 2 / 2 )( 2 / 2 )
Thin, Array, Leadless Thin, Array, Leadless
-
CMP annual users meeting, January 10th 2008, PARIS
Chapitre
Franais
5 / 26 [email protected]
CNRS INPG UJF
Plastic Packages : Open CavityPlastic Packages : Open Cavity
Advantages:Advantages:-- Open cavity packages enable smooth transfer to plastic packaginOpen cavity packages enable smooth transfer to plastic packaging processg process-- Price for small quantities up to 20Price for small quantities up to 20--40 dies40 dies-- Open cavity process is universal and can be applied to any plasOpen cavity process is universal and can be applied to any plastic IC package:tic IC package:BGA, QFP, QFN, PLCC, SOIC, TSSOP and moreBGA, QFP, QFN, PLCC, SOIC, TSSOP and more
STEP 1 STEP 2 STEP 3 STEP 4
Dummy Package Open Cavity Wire Bonding Remolding or Lid& Marking
-
CMP annual users meeting, January 10th 2008, PARIS
Chapitre
Franais
6 / 26 [email protected]
CNRS INPG UJF
Package GuidelinesPackage Guidelines
Ceramic or Plastic ?Ceramic or Plastic ?
Prototyping:Prototyping:CMP recommends to use ceramic packagingCMP recommends to use ceramic packaging
Advantages:Advantages: Price for small quantitiesPrice for small quantitiesRemovable lidsRemovable lidsFlexible constraint (wire length, ground bonds, die thicknessFlexible constraint (wire length, ground bonds, die thickness))Thermal, HighThermal, High--Reliability (Space qualification)Reliability (Space qualification)
Low volumeLow volume::CMP recommends to choose the plastic packageCMP recommends to choose the plastic packageAdvantagesAdvantages: Low cost from 20: Low cost from 20--40 packaging (open tool only)40 packaging (open tool only)
Access to density solutions for low price (QFN, PBGA)Access to density solutions for low price (QFN, PBGA)
-
CMP annual users meeting, January 10th 2008, PARIS
Chapitre
Franais
7 / 26 [email protected]
CNRS INPG UJF
Pads and Pads and PadringPadring rules rules
Standard Rules Non Standard Rules(available on request)Bonding PAD width
Absolute minimum (m) 76 x 76 -Recommended (m) 85 x 85 55 x 55
Bonding PADS spacingAbsolute minimum (m) 10 -Recommended (m) 15 10
Bonding PADS pitch
Absolute minimum (m) 86 -Recommended (m) 100 65
-
CMP annual users meeting, January 10th 2008, PARIS
Chapitre
Franais
8 / 26 [email protected]
CNRS INPG UJF
CMP packaging process flowCMP packaging process flow
CMP users choose the package (CMP can help)
before the submission.CMP propose to the users the most
convenient package. (die size vs cavity size)CMP standardize all bonding diagrams.
Packaging is managed by MPW run.
CMP order the packages to the packaging house.
CMP ask the users for bonding diagram
and datasheet confirmation during the wafer fabrication.
CMP bonding diagram
-
CMP annual users meeting, January 10th 2008, PARIS
Chapitre
Franais
9 / 26 [email protected]
CNRS INPG UJF
Data Sheet (Ceramic & Plastic Package)Data Sheet (Ceramic & Plastic Package)
Files Extension: .pdf, .dwg
Available Data to CustomersBlank Bonding Diagram Blank Bonding Diagram Package Data Package Data SheetSheet
Soon: Data sheets available for customers throught the web customer interface
-
CMP annual users meeting, January 10th 2008, PARIS
Chapitre
Franais
10 / 26 [email protected]
CNRS INPG UJF
Packaging TechnologiesPackaging Technologies
CQFP,
QFN.
CQFP,
QFN.
Wire Bonding
Flip-Chip
Stacked dies
Stacked dies
MultiMulti--Stacked dies
Stacked dies
Wafer Bum
ping
Wafer Bum
ping
Die Bumping
Die Bumping
-
CMP annual users meeting, January 10th 2008, PARIS
Chapitre
Franais
11 / 26 [email protected]
CNRS INPG UJF
Ultra-Sonic Method : Wedge-Bonding Aluminium wires with diameter up to 50 mAluminium wires with diameter up to 50 m Allow high voltage applicationsAllow high voltage applications Interconnection density smallerInterconnection density smaller
Wire bonding solutionsWire bonding solutions
Thermo-Sonic Method: Ball-Bonding Pure and hardened Gold wiresPure and hardened Gold wires Diameter wires from 18 m up to 50 m Diameter wires from 18 m up to 50 m Few packaging constraintsFew packaging constraints
-
CMP annual users meeting, January 10th 2008, PARIS
Chapitre
Franais
12 / 26 [email protected]
CNRS INPG UJF
Wire bonding Limits Wire bonding Limits
Pad opening need to be about 3 times larger than the wire diametPad opening need to be about 3 times larger than the wire diameterer
-
CMP annual users meeting, January 10th 2008, PARIS
Chapitre
Franais
13 / 26 [email protected]
CNRS INPG UJF
FlipFlip--Chip using Stud Bump Chip using Stud Bump -- Die LevelDie Level
Minimum pitch between bumps: 65 m
Gold wire (with Pd): 18-20 m
Standard machine for tooling
Die down electrical connection (over a substrate or circuit)
Available at die level
Limited to 32 I/O
-
CMP annual users meeting, January 10th 2008, PARIS
Chapitre
Franais
14 / 26 [email protected]
CNRS INPG UJF
FlipFlip--Chip Chip vsvs Wire bondingWire bonding
Size reduced, smaller pitch
Higher integration (I/Os)Shorter connection length
Efficient heat dissipation
Moderate cost
Reliability
Compatibility housings
FLIP CHIP WIRE BONDING
-
CMP annual users meeting, January 10th 2008, PARIS
Chapitre
Franais
15 / 26 [email protected]
CNRS INPG UJF
Density Solutions
Chip Scale Package (CSP)Chip Scale Package (CSP)
CSP package => Naked die occupies 80% or more of the package
Electrical performance is enhanced due to shorter interconnections
Package features Package features (1/3)(1/3)
-
CMP annual users meeting, January 10th 2008, PARIS
Chapitre
Franais
16 / 26 [email protected]
CNRS INPG UJF Quad Flat No lead (QFN) Quad Flat No lead (QFN)
QFN advantages:QFN advantages:
Thermal PerformanceThermal Performance Low Inductance; High FrequencyLow Inductance; High Frequency Thin; Low ProfileThin; Low Profile
Die thickness between 200 and 300 m
Copper Lead Frame
Solder PlatingSilver Ground Bond pad
DIE0.9 mm
Mold Compound
Lead
Package features Package features (2/3)(2/3)
-
CMP annual users meeting, January 10th 2008, PARIS
Chapitre
Franais
17 / 26 [email protected]
CNRS INPG UJF
Ball Grid Array (BGA)Ball Grid Array (BGA)
BGA advantages:BGA advantages:I/OI/Os: up to 456s: up to 456Shorter interconnections (density) Shorter interconnections (density) 1 up to 4 routable layers1 up to 4 routable layersHigh FrequencyHigh Frequency
Die thickness between 200 and 300 m
Package features Package features (3/3)(3/3)
-
CMP annual users meeting, January 10th 2008, PARIS
Chapitre
Franais
18 / 26 [email protected]
CNRS INPG UJF
BGA example realized with CMP BGA example realized with CMP (1/2)(1/2)
Body size: 35 mm x 35 mm
Ceramic BGA
420 I/OsThickness: 1.8 mmBall pitch: 1.27 mm
-
CMP annual users meeting, January 10th 2008, PARIS
Chapitre
Franais
19 / 26 [email protected]
CNRS INPG UJF
BGA example realized with CMP BGA example realized with CMP (2/2)(2/2)
Body size: 31 mm x 31 mm
Organic BGA
304 I/OsPad size: 34 um x 108 umPad pitch: 78 umBall pitch: 1.27 mm
-
CMP annual users meeting, January 10th 2008, PARIS
Chapitre
Franais
20 / 26 [email protected]
CNRS INPG UJF
0
10
20
30
40
50
2004 2005 2006 2007
DIL PGA LCC JLCC QFN QFP SOIC BGA
Choice of the packages per yearChoice of the packages per year%
-
CMP annual users meeting, January 10th 2008, PARIS
Chapitre
Franais
21 / 26 [email protected]
CNRS INPG UJF
05
101520253035404550
DIL PGA LCC JLCC QFN QFP SOIC
2004200520062007
Packages choice evolutionPackages choice evolution
%
-
CMP annual users meeting, January 10th 2008, PARIS
Chapitre
Franais
22 / 26 [email protected]
CNRS INPG UJF
Packaging AnalysisPackaging Analysis
Naked dies are visually inspected Naked dies are visually inspected accordingaccording to to thetheMILMIL--STDSTD--883 883 normnorm, method 2010 condition A or B , method 2010 condition A or B
Plastic Bonding Checking:Plastic Bonding Checking:XX--Ray TestRay Test
Ceramic Bonding Checking:Ceramic Bonding Checking:Visual InspectionVisual Inspection
-
CMP annual users meeting, January 10th 2008, PARIS
Chapitre
Franais
23 / 26 [email protected]
CNRS INPG UJF
Packaging Process Flow for MPW RunPackaging Process Flow for MPW Run
Naked Dies
on Sticking filmSawing8 or 12 Wafer
PackagingLoading in Waffle Pack
PlasticPackaging
Ceramic Packaging
Turnaround: 2 weeks
Visual
Inspection
Extracted Extracted circuitscircuits
-
CMP annual users meeting, January 10th 2008, PARIS
Chapitre
Franais
24 / 26 [email protected]
CNRS INPG UJF
Back lappingBack lapping8 wafers 8 wafers (200 mm)(200 mm): 725 : 725 mm (+/(+/-- 2020m)m) standard thicknessstandard thickness12 wafers 12 wafers (300 mm)(300 mm): 780 : 780 mm (+/(+/-- 2020m)m) standard thicknessstandard thickness
Wafer level back lappingWafer level back lappingaustriamicrosystems:austriamicrosystems:0.35 0.35 m (8m (8)) => standard => standard backback lapping to 480 mlapping to 480 m
=> => backback lapping to 380 m on lapping to 380 m on requestrequest
STMicroelectronics:STMicroelectronics:0.25 0.25 m (8m (8)) => standard => standard backback lapping to 375 mlapping to 375 m0.12 0.12 m (12m (12)) => standard => standard backback lapping to 375 m lapping to 375 m 90 n90 nm (12m (12)) => standard => standard backback lapping to 375 mlapping to 375 m65 n65 nm (12m (12) ) => standard => standard backback lapping to 250 mlapping to 250 m
OMMIC:OMMIC:ED02AHED02AH => => backback lapping to 100mlapping to 100m
Die level back lappingDie level back lappingDown to 150 m (absolute limit 100 Down to 150 m (absolute limit 100 m)m)
-
CMP annual users meeting, January 10th 2008, PARIS
Chapitre
Franais
25 / 26 [email protected]
CNRS INPG UJF
ElectroStaticElectroStatic Discharge (ESD) packing Discharge (ESD) packing
Conditioning & Shipment: Antistatic Tubes:
Antistatic Bags: Protection against the electrostatic discharge
Surface Resistance (ohms) :108-109
Antistatic Boxes:
-
CMP annual users meeting, January 10th 2008, PARIS
Chapitre
Franais
26 / 26 [email protected]
CNRS INPG UJF
Others Packaging Solution Others Packaging Solution
Case by case solutions Optical resin Hybrid Chip On Board (COB) Metallic package Conditioning of wafers and naked dies (vacuum or nitrogen atmosphere)
Service for additional packaging from previous run
[email protected]@imag.fr
http://cmp.imag.frhttp://cmp.imag.fr