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Transcript of IBM Power Systems Technical Excellence - e … · 4 IBM Power Systems © 2008 IBM Corporation...
© 2008 IBM Corporation
IBM Power Systems
IBM Systems & Technology Group
IBM Power SystemsTechnical
Excellence03/29/07
2
IBM Power Systems
© 2008 IBM Corporation
REQUIRED CHARTS
The presenter must display the Special Notices chart, the Notes on Benchmarks and Values charts (if the referenced values are given), and the Notes on Performance Estimates chart (if the referenced performance estimates are given) during the course of the presentation. Any printed copies of this presentation that are distributed must include legible copies of these charts. If printed copies are not distributed, the attendees must be offered the option to receive legible printed copies of these charts.
TRADEMARKS
Please review the Special Notices page prior to updating this presentation to ensure all trademarks used are given proper attribution.
SPEAKER NOTES
This presentation may contain speaker notes available imbedded or as a separate file. Please ensure these are utilized if available.
Revised January 9, 2003
Notes to Presenter
3
IBM Power Systems
© 2008 IBM Corporation
This document was developed for IBM offerings in the United States as of the date of publication. IBM may not make these offerings available in other countries, and the information is subject to change without notice. Consult your local IBM business contact for information on the IBM offerings available in your area.
Information in this document concerning non-IBM products was obtained from the suppliers of these products or other public sources. Questions on the capabilities of non-IBM products should be addressed to the suppliers of those products.
IBM may have patents or pending patent applications covering subject matter in this document. The furnishing of this document does not give you any license to these patents. Send license inquires, in writing, to IBM Director of Licensing, IBM Corporation, New Castle Drive, Armonk, NY 10504-1785 USA.
All statements regarding IBM future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only.
The information contained in this document has not been submitted to any formal IBM test and is provided "AS IS" with no warranties or guarantees either expressed or implied.
All examples cited or described in this document are presented as illustrations of the manner in which some IBM products can be used and the results that may be achieved. Actual environmental costs and performance characteristics will vary depending on individual client configurations and conditions.
IBM Global Financing offerings are provided through IBM Credit Corporation in the United States and other IBM subsidiaries and divisions worldwide to qualified commercial and government clients. Rates are based on a client's credit rating, financing terms, offering type, equipment type and options, and may vary by country. Other restrictions may apply. Rates and offerings are subject to change, extension or withdrawal without notice.
IBM is not responsible for printing errors in this document that result in pricing or information inaccuracies.
All prices shown are IBM's United States suggested list prices and are subject to change without notice; reseller prices may vary.
IBM hardware products are manufactured from new parts, or new and serviceable used parts. Regardless, our warranty terms apply.
Any performance data contained in this document was determined in a controlled environment. Actual results may vary significantly and are dependent on many factors including system hardware configuration and software design and configuration. Some measurements quoted in this document may have been made on development-level systems. There is no guarantee these measurements will be the same on generally-available systems. Some measurements quoted in this document may have been estimated through extrapolation. Users of this document should verify the applicable data for their specific environment.
Revised September 26, 2006
Special Notices
4
IBM Power Systems
© 2008 IBM Corporation
Revised January 15, 2008
Special Notices (Cont.)
The following terms are registered trademarks of International Business Machines Corporation in the United States and/or other countries: AIX, AIX/L, AIX/L (logo), AIX 6 (logo), alphaWorks, AS/400, BladeCenter, Blue Gene, Blue Lightning, C Set++, CICS, CICS/6000, ClusterProven, CT/2, DataHub, DataJoiner, DB2, DEEP BLUE, developerWorks, DirectTalk, Domino, DYNIX, DYNIX/ptx, e business (logo), e(logo)business, e(logo)server, Enterprise Storage Server, ESCON, FlashCopy, GDDM, i5/OS, i5/OS (logo), IBM, IBM (logo), ibm.com, IBM Business Partner (logo), Informix, IntelliStation, IQ-Link, LANStreamer, LoadLeveler, Lotus, Lotus Notes, Lotusphere, Magstar, MediaStreamer, Micro Channel, MQSeries, Net.Data, Netfinity, NetView, Network Station, Notes, NUMA-Q, OpenPower, Operating System/2, Operating System/400, OS/2, OS/390, OS/400, Parallel Sysplex, PartnerLink, PartnerWorld, Passport Advantage, POWERparallel, Power PC 603, Power PC 604, PowerPC, PowerPC (logo), Predictive Failure Analysis, pSeries, PTX, ptx/ADMIN, Quick Place, Rational, RETAIN, RISC System/6000, RS/6000, RT Personal Computer, S/390, Sametime, Scalable POWERparallel Systems, SecureWay, Sequent, ServerProven, SpaceBall, System/390, The Engines of e-business, THINK, Tivoli, Tivoli (logo), Tivoli Management Environment, Tivoli Ready (logo), TME, TotalStorage, TURBOWAYS, VisualAge, WebSphere, xSeries, z/OS, zSeries.
The following terms are trademarks of International Business Machines Corporation in the United States and/or other countries: Advanced Micro-Partitioning, AIX 5L, AIX PVMe, AS/400e, Calibrated Vectored Cooling, Chiphopper, Chipkill, Cloudscape, DataPower, DB2 OLAP Server, DB2 Universal Database, DFDSM, DFSORT, DS4000, DS6000, DS8000, e-business (logo), e-business on demand, EnergyScale, Enterprise Workload Manager, eServer, Express Middleware, Express Portfolio, Express Servers, Express Servers and Storage, General Purpose File System, GigaProcessor, GPFS, HACMP, HACMP/6000, IBM Systems Director Active Energy Manager, IBM TotalStorage Proven, IBMLink, IMS, Intelligent Miner, iSeries, Micro-Partitioning, NUMACenter, On Demand Business logo, POWER, PowerExecutive, PowerVM, PowerVM (logo), Power Architecture, Power Everywhere, Power Family, POWER Hypervisor, Power PC, Power Systems, Power Systems (logo), Power Systems Software, Power Systems Software (logo), PowerPC Architecture, PowerPC 603, PowerPC 603e, PowerPC 604, PowerPC 750, POWER2, POWER2 Architecture, POWER3, POWER4, POWER4+, POWER5, POWER5+, POWER6, POWER6+, pure XML, Quickr, Redbooks, Sequent (logo), SequentLINK, Server Advantage, ServeRAID, Service Director, SmoothStart, SP, System i, System i5, System p, System p5, System Storage, System z, System z9, S/390 Parallel Enterprise Server, Tivoli Enterprise, TME 10, TotalStorage Proven, Ultramedia, VideoCharger, Virtualization Engine, Visualization Data Explorer, Workload Partitions Manager, X-Architecture, z/Architecture, z/9.
A full list of U.S. trademarks owned by IBM may be found at: http://www.ibm.com/legal/copytrade.shtml.The Power Architecture and Power.org wordmarks and the Power and Power.org logos and related marks are trademarks and service marks licensed by Power.org.UNIX is a registered trademark of The Open Group in the United States, other countries or both. Linux is a trademark of Linus Torvalds in the United States, other countries or both.Microsoft, Windows, Windows NT and the Windows logo are registered trademarks of Microsoft Corporation in the United States, other countries or both.Intel, Itanium, Pentium are registered trademarks and Xeon is a trademark of Intel Corporation or its subsidiaries in the United States, other countries or both.AMD Opteron is a trademark of Advanced Micro Devices, Inc.Java and all Java-based trademarks and logos are trademarks of Sun Microsystems, Inc. in the United States, other countries or both. TPC-C and TPC-H are trademarks of the Transaction Performance Processing Council (TPPC).SPECint, SPECfp, SPECjbb, SPECweb, SPECjAppServer, SPEC OMP, SPECviewperf, SPECapc, SPEChpc, SPECjvm, SPECmail, SPECimap and SPECsfs are trademarks of the Standard Performance Evaluation Corp (SPEC).NetBench is a registered trademark of Ziff Davis Media in the United States, other countries or both.AltiVec is a trademark of Freescale Semiconductor, Inc.Cell Broadband Engine is a trademark of Sony Computer Entertainment Inc.InfiniBand, InfiniBand Trade Association and the InfiniBand design marks are trademarks and/or service marks of the InfiniBand Trade Association. Other company, product and service names may be trademarks or service marks of others.
5
IBM Power Systems
© 2008 IBM Corporation
Revised January 15, 2008
Notes on Benchmarks and Values
The IBM benchmarks results shown herein were derived using particular, well configured, development-level and generally-available computer systems. Buyers should consult other sources of information to evaluate the performance of systems they are considering buying and should consider conducting application oriented testing. For additional information about the benchmarks, values and systems tested, contact your local IBM office or IBM authorized reseller or access the Web site of the benchmark consortium or benchmark vendor.
IBM benchmark results can be found in the IBM Power Systems Performance Report at http://www.ibm.com/systems/p/hardware/system_perf.html.
All performance measurements were made with AIX or AIX 5L operating systems unless otherwise indicated to have used Linux. For new and upgraded systems, AIX Version 4.3, AIX 5L or AIX 6 were used. All other systems used previous versions of AIX. The SPEC CPU2006, SPEC2000, LINPACK, and Technical Computing benchmarks were compiled using IBM's high performance C, C++, and FORTRAN compilers for AIX 5L and Linux. For new and upgraded systems, the latest versions of these compilers were used: XL C Enterprise Edition V7.0 for AIX, XL C/C++ Enterprise Edition V7.0 for AIX, XL FORTRAN Enterprise Edition V9.1 for AIX, XL C/C++ Advanced Edition V7.0 for Linux, and XL FORTRAN Advanced Edition V9.1 for Linux. The SPEC CPU95 (retired in 2000) tests used preprocessors, KAP 3.2 for FORTRAN and KAP/C 1.4.2 from Kuck & Associates and VAST-2 v4.01X8 from Pacific-Sierra Research. The preprocessors were purchased separately from these vendors. Other software packages like IBM ESSL for AIX, MASS for AIX and Kazushige Goto’s BLAS Library for Linux were also used in some benchmarks.
For a definition/explanation of each benchmark and the full list of detailed results, visit the Web site of the benchmark consortium or benchmark vendor.
TPC http://www.tpc.org SPEC http://www.spec.org LINPACK http://www.netlib.org/benchmark/performance.pdf Pro/E http://www.proe.com GPC http://www.spec.org/gpc NotesBench http://www.notesbench.org VolanoMark http://www.volano.com STREAM http://www.cs.virginia.edu/stream/ SAP http://www.sap.com/benchmark/ Oracle Applications http://www.oracle.com/apps_benchmark/ PeopleSoft - To get information on PeopleSoft benchmarks, contact PeopleSoft directly Siebel http://www.siebel.com/crm/performance_benchmark/index.shtm Baan http://www.ssaglobal.com Microsoft Exchange http://www.microsoft.com/exchange/evaluation/performance/default.asp Veritest http://www.veritest.com/clients/reports Fluent http://www.fluent.com/software/fluent/index.htmTOP500 Supercomputers http://www.top500.org/ Ideas International http://www.ideasinternational.com/benchmark/bench.html Storage Performance Council http://www.storageperformance.org/results
6
IBM Power Systems
© 2008 IBM Corporation
Revised October 9, 2007
Notes on Performance EstimatesrPerf
rPerf (Relative Performance) is an estimate of commercial processing performance relative to other IBM UNIX systems. It is derived from an IBM analytical model which uses characteristics from IBM internal workloads, TPC and SPEC benchmarks. The rPerf model is not intended to represent any specific public benchmark results and should not be reasonably used in that way. The model simulates some of the system operations such as CPU, cache and memory. However, the model does not simulate disk or network I/O operations.
rPerf estimates are calculated based on systems with the latest levels of AIX and other pertinent software at the time of system announcement. Actual performance will vary based on application and configuration specifics. The IBM eServer pSeries 640 is the baseline reference system and has a value of 1.0. Although rPerf may be used to approximate relative IBM UNIX commercial processing performance, actual system performance may vary and is dependent upon many factors including system hardware configuration and software design and configuration. Note that the rPerf methodology used for the POWER6 systems is identical to that used for the POWER5 systems. Variations in incremental system performance may be observed in commercial workloads due to changes in the underlying system architecture.
All performance estimates are provided "AS IS" and no warranties or guarantees are expressed or implied by IBM. Buyers should consult other sources of information, including system benchmarks, and application sizing guides to evaluate the performance of a system they are considering buying. For additional information about rPerf, contact your local IBM office or IBM authorized reseller.
7
IBM Power Systems
© 2008 IBM Corporation
OverviewProcessorsIBM Power™ Systems, POWER6™ Processor-based SystemsReliability, Availability, ServiceabilityCapacity on DemandPerformanceAdditional HardwareHardware Management ConsoleIO and NetworkingGreen ComputingStorageOperating SystemLinux®
Table of Contents
9
IBM Power Systems
© 2008 IBM Corporation
IBM Power Systems™
BladeCenter JS12JS22
570 575
595
Common FeaturesProcessor technologyService ProcessorVirtualization
550
520
560
10
IBM Power Systems
© 2008 IBM Corporation
POWER6 System HighlightsBalance System Design
POWER6 Processor Technology 5th Implementation of multi-core design ~100% higher frequencies 4X increase in L2 Cache
POWER6 System Architecture New generation of servers Blades to High End offerings
Enhances memory implementation New IO: PCIe, SAS / SATA, IO Drawers
Enhanced Virtualization Partition Mobility Workload Partitions Virtual Shared Pools Int Virt Ethernet
Green Technologies Processor Nap Mode Memory Power Down support Power Save Mode
Availability New RAS features Processor Instruction Retry Alternate Process Recovery
Workload Mobility Hot Add resources
LPAR
#2
LPARVIOS
LPAR
#3
LPAR
#1
Dedicated
Processor
LPAR# 4
Power Hypervisor
Micro-Partition Shared Processor
Pool
VSCSI
VNET
Boot
HMC
11
IBM Power Systems
© 2008 IBM Corporation
IBM Power System Servers
RHEL 4.5 / 5.1SLES 10
5.3, 6.1
5.4 & 6.1
40
N/A
0 to 20 to 2
00
14.71
73GB – 292TB
2 to 64
3.8
2
POWER6
Blade
5.4 & 6.15.4 & 6.15.4 & 6.15.4 & 6.1IBM i Operating System
RHEL 4.5 / 5.1SLES 10
5.3, 6.1
401
8
30 to 562 to 50
2
31.48
73GB – 30.6TB
2 to 64
4.2
1, 2, 4
POWER6
19-inch 4U rackDeskside
RHEL 4.5 / 5.1SLES 10
5.3, 6.1
801
8
30 to 562 to 50
2
68.20
73GB – 30.6TB
2 to 256
3.5, 4.2
2, 4, 6, 8
POWER6
19-inch 4U rackDeskside
RHEL 4.5 / 5.1SLES 9 or 10
5.3, 6.1
801
12
4 to 80 to 842 to 762 – 4
100.3
73GB – 39.6TB
2 to 384
3.6
4, 8, 16
POWER6
19-inch 4U rack
RHEL 4.5 / 5.1SLES 10
5.3, 6.1
40
N/A
0 to 20 to 2
00
30.26
73GB – 146TB
2 to 32
4.0
4
POWER6
Blade
Maximum rPerf
AIX® support
Processor
Footprint, Packaging
Internal storage*
GHz clock
Linux® support
Max micro-partitions
Max I/O drawers
PCIePCI-X slots
PCI-X 266 slotsGX bus slots
DDR2 GB memory
# of processors(# of cores)
Requires purchase of optional feature to support micro-partitions *With maximum I/O drawers Optiona Preview Announcement Nov 13, 2007l
IBM BladeCenter®
JS22
Power 560Power
520Power
550IBM
BladeCenter® JS12
12
IBM Power Systems
© 2008 IBM Corporation
IBM Power System Servers
RHEL 4.5 / 5.1SLES 9 or 10
5.3, 6.1
5.4 & 6.11601
32
4 to 160 to 1402 to 200
2 – 8
141.21
73GB – 79.2TB
2 to 768
4.4, 5.0
2, 4, 8, 12, 16
POWER6
19-inch 4U rack
RHEL 4.5 / 5.1SLES 9 or 10
5.3, 6.1
5.4 & 6.11601
32
4 to 160 to 1402 to 200
2 – 8
193.25
73GB – 79.2TB
2 to 768
4.2
4, 8, 16, 24, 32
POWER6
19-inch 4U rack
5.4 & 6.1N / AIBM i Operating System
RHEL 4.5 / 5.1SLES 10
5.3, 6.1
2541
1
0 to 40 to 20 0 to 16
2
N/A
146.8GB – 5.1TB
32 to 256
4.7
32
POWER6
24-inch frameby node
573Maximum rPerf
5.3, 6.1AIX® support
POWER6Processor
24-inch frameby node
Footprint, Packaging
146.8GB – 5.1TBInternal storage*
4.2 / 5.0GHz clock
RHEL 4.5 / 5.1SLES 10
Linux® support
2541 Max micro-partitions
12 / 30 Max I/O drawers
0 0 to 240 / 180
0 to 4204 to 32
PCIePCI-X slots
PCI-X 266 slotsGX bus slots
16 to 4 TBDDR2 GB memory
8 ( 4.2 GHz ) To
64 ( 5.0 GHz )
# of processors(# of cores)
Requires purchase of optional feature to support micro-partitions *With maximum I/O drawers Optiona
Power 575Power 595
Power 570 Power 570/32
15
IBM Power Systems
© 2008 IBM Corporation
POWER Design
POWER6 Characteristics
3.5 – 5 GHz 790M transistors .065 micron
POWER6 Architecture
Memory+
GX++ Bridge
GX++ Bus Cntrl
Mem
ory
Cn
trl
Mem
ory
Cn
trl
Memory+
P6
Core
Alti
Vec
L3Ctrl L3L3
CtrlL3
P6
Core
Alti
Vec
4 MB L2
4 MB L2
Chipto Chip
Chipto Chip
Fabric Bus
Controller
Ultra-high frequency dual-core chip: ≥ 3.5 GHz 7-way superscalar, 2-way SMT core
Up to 5 instr. for one thread, up to 2 for other
9 execution units 2LS, 2FP, 2FX, 1BXU, 1VMX, 1DP
790M transistors, 341 mm2 die Enhanced Simultaneous Multi-
Threading 2x4MB on-chip L2 – point of coherency On-chip L3 directory and controller Two memory controllers on-chip
Technology CMOS 65nm lithography, SOI Cu
High-speed elastic bus interface at 2:1 freq
Full error checking and recoveryDynamic power saving
Advanced Clock gating
16
IBM Power Systems
© 2008 IBM Corporation
POWER6 System Processor Options…
Memory+
GX+ Bridge
GX Bus Cntrl
Mem
ory
Cn
trl
Mem
ory
Cn
trl
Memory+
P6
Core
Alti
Vec
L3Ctrl L3L3
CtrlL3
P6
Core
Alti
Vec
4 MB L2
4 MB L2
Fabric Bus
Controller
Memory+
GX+ Bridge
GX Bus Cntrl
Mem
ory
Cn
trl
Mem
ory
Cn
trl
Memory+
P6
Core
Alti
Vec
L3Ctrl L3L3
CtrlL3
P6
Core
Alti
Vec
4 MB L2
4 MB L2
Fabric Bus
Controller
Memory+
GX+ Bridge
GX Bus Cntrl
Mem
ory
Cn
trl
Mem
ory
Cn
trl
P6
Core
Alti
Vec
L3CtrlL3
P6
Core
Alti
Vec
4 MB L2
4 MB L2
Fabric Bus
Controller
Memory+
GX+ Bridge
GX Bus Cntrl
Mem
ory
Cn
trl
P6
Core
Alti
Vec
L3CtrlL3
P6
Core
Alti
Vec
4 MB L2
4 MB L2
Fabric Bus
Controller
Memory+
GX+ Bridge
GX Bus Cntrl
Mem
ory
Cn
trl
Mem
ory
Cn
trl
P6
Core
Alti
Vec
P6
Core
Alti
Vec
4 MB L2
4 MB L2
Fabric Bus
Controller
Memory+
GX+ Bridge
GX Bus Cntrl
Mem
ory
Cn
trl
P6
Core
Alti
Vec
P6
Core
Alti
Vec
4 MB L2
4 MB L2
Fabric Bus
Controller
595 575, 570, 560, & 550520, JS12, & JS22
17
IBM Power Systems
© 2008 IBM Corporation
POWER6 Packaging Options…
P6
Multi Chip ModulesPOWER6 Chip & L3
Power 595
Single Chip ModulePOWER6 & No L3
Power 520 / JS12 / JS22
P6L3
P6
L3
Dual ChipPOWER6 Chip & L3
Power 550, 560, 570/32, & 575
Single Chip ModuleL3 & POWER6Power 570
P6
L3
L3
18
IBM Power Systems
© 2008 IBM Corporation
Processor History Overview….
POWER4414 mm2
1.1 – 1.3 GHz
POWER4+267 mm2
1.5 – 1.9 GHz
POWER5389 mm2
1.65 – 1.9 GHz
POWER5+245 mm2
1.9 – 2.3 GHz
POWER6341 mm2
3.5 – 5.0 GHz
2001 2004 20072002 2003 2005 2006
Technology Change
2008
POWER6341 mm2
4.2 – 5.0 GHz
Refresh
Technology Change
No Technology
Change
20
IBM Power Systems
© 2008 IBM Corporation
BladeCenterJS22
Express
BladeCenterJS12
Express
System i
IBM BladeCenter IBM Power Servers
Power Systems Server Unification
i525i515 i595i570i550
System pp5-595p5-575p5-570p5-550p5-520
Power 520Express
Power 550Express
Power 570 Power 575 Power 595
23
IBM Power Systems
© 2008 IBM Corporation
POWER6 JS12 Blade
BC-H, BC-E and BC-SBlade Chassis
YesService Processor
Yes ( via Blade Center )Fiber Support
AIX & Linux APV Integrated Virtualization Manager
Virtualization
Yes BladeCenterRedundant Cooling
Yes
Yes BladeCenter
1 Blade Center
Dual Port 10/100/1000 EthernetSAS Controller & USB
PCI-X and/or PCIe
0 – 2 SAS disk ( 73 / 146 GB )
2GB to 64GB ( ChipKill )
N / A
2 core / 1 Socket @ 3.8 GHz
JS12 Blade
Media Bays
NEBS Support
Redundant Power
Integrated Options
Daughter Card Options
DASD / Bays
DDR2 Memory
L3 Cache
Architecture
24
IBM Power Systems
© 2008 IBM Corporation
Memory
DISK Power10Gbt
Power10Gbt
POWER6Dual Core
High-speed PCI-Express
connector
Optional I/O connector
MemoryDISK
JS12 Blade
26
IBM Power Systems
© 2008 IBM Corporation
POWER6 JS22 Blade
BC-H and BC-SBC Chassis
IBM Director and CSMIBM EnergyScale™
Systems Management
YesService Processor
Yes ( via Blade Center )Fiber Support
AIX & Linux PowerVM Integrated Virtualization Manager
Virtualization
Yes BladeCenterRedundant Cooling
3 years
Yes BladeCenter
1 BladeCenter
Dual Port 10/100/1000 EthernetSAS Controller & USB
PCI-X and/or PCIe
0 – 1 SAS disk ( 73 / 146GB )
2GB to 32GB ( Chipkill™ )
N / A
4-core / 2 Socket @ 4.0 GHz
JS22 Blade
Media Bays
Warranty
Redundant Power
Integrated Options
Daughter Card Options
DASD / Bays
DDR2 Memory
L3 Cache
Architecture
27
IBM Power Systems
© 2008 IBM Corporation
JS22 Blade
POWER6Dual Core
Memory
DISK Power10Gbt
Power10Gbt
POWER6Dual Core
High-speed PCI-Express
connector
Optional I/O connector
Memory
28
IBM Power Systems
© 2008 IBM Corporation
JS12 / JS22 Expansion Cards
CFFv (Vertical) expansion cards:QLogic 4GB 2 Port Fibre Channel Expansion Card (CFFv) Ethernet Expansion Card (CFFv) SAS Expansion Card (CFFv)Emulex 4GB Fibre Channel Expansion Card (CFFv)
CFFh (Horizontal) expansion cards:
QLogic Ethernet and 4 GB Fibre Channel Expansion Card (CFFh)4X InfiniBand® DDR Expansion Card (CFFh)Cisco 4X InfiniBand DDR Expansion Card (CFFh)Voltaire 4X InfiniBand DDR Expansion Card (CFFh)
One combination form factor vertical (CFFv) may be installed with a combination form factor horizontal (CFFh) expansion card and one SAS HDD.
29
IBM Power Systems
© 2008 IBM Corporation
IBM BladeCenter JS12 vs JS22
AIX 5.3, AIX 6 , Linux, and IBM iAIX 5.3, AIX 6 , Linux, & IBM iOS Support
14.71
IBM Director and CSMIBM EnergyScale Technology
AIX 5L V5.3 & LinuxAdvanced Power Virtualization
(Standard)Integrated Virtualization Manager
Yes (via BladeCenter)
Yes (via BladeCenter)
Yes (via BladeCenter)
Keyboard, Video and MouseDual Port 1Gb EthernetSAS Controller & USB
Legacy, SFF, or High speed DC
0-2 SAS disk (73 or 146 GB)
2GB to 64GB DDR2 (Chip Kill) 533MHZ
3.8GHz POWER6 SCM2 core (1 Socket x 2 Core)
Single Wide
JS12 JS22
30.26
IBM Director and CSMIBM EnergyScale Technology
AIX 5L V5.3, AIX 6 & LinuxAdvanced Power Virtualization
(Standard)Integrated Virtualization Manager
Yes (via BladeCenter)
Yes (via BladeCenter)
Yes (via BladeCenter)
Keyboard, Video and MouseDual Port 1Gb EthernetSAS Controller & USB
Legacy, SFF, or High speed DC
0-1 SAS disk (73 or 146 GB)
2GB to 32GB DDR2 (Chip Kill) 667MHz
4.0 GHz POWER6 SCM4 core (2 Socket x 2 Core)
Single Wide
rPerf Performance
Systems Management
Virtualization
Redundant Cooling
Redundant Power
Fiber Support
Integrated Features
Daughter Cards
DASD / Bays
Memory
Architecture
31
IBM Power Systems
© 2008 IBM Corporation
Power 520 - 4U Rack & Deskside
YesRedundant Cooling
3 USB, 2 Serial, 2 HMCOptional: SAS port
Integrated Ports
Optional
Up to 40 partitions
Yes / Max: 8 GX Bus connection: RIO2 / InfiniBand
1 Slim-line DVD1 Half High Tape
Dual Port 10/100/1000 Ethernet Optional: Quad 1Gbt or Dual 10Gbt
Yes Optional: RAID support
PCIe: 3 Slots PCI-X 266: 2 Slots GX Bus: 2 Slots
Shared with PCIe 1 slot
Up to 6 DASD (3.5”)
Up to 64GB (Buffered )
1, 2, or 4 cores @ 4.2 GHzL3 Cache: N/A
Power 520 8203-E4A
Media Bays
Redundant Power
Dynamic LPAR
Remote IO Drawers
Integrated Virtual Ethernet
Integrated SAS / SATA
Expansion
Internal SAS Disks
DDR2 Memory
Architecture
32
IBM Power Systems
© 2008 IBM Corporation
Power 520 Physical Specifications:
Deskside/Desktop: Width: 328.5 mm (12.9 in) with tip foot 182.3 mm (7.2 in) without tip foot
Depth: 778 mm (30.6 in) Height: 540 mm (21.3 in)
Rack-Mount:
Width: 440 mm (17.3 in) Depth: 538 mm (21.2 in) Height: 173 mm (6.8 in)
Weight: Rack-mount: 31.75 kg (70 lb) Deskside: 40.8 kg (90 lb)
34
IBM Power Systems
© 2008 IBM Corporation
Power 550 Rack & Deskside
YesRedundant Cooling
YesNEBS
3 USB, 2 Serial, 2 HMCOptional: SAS port
Integrated Ports
Optional
Up to 80 partitions
Yes / Max: 8 GX Bus connection: RIO2 / InfiniBand
1 Slim-line DVD1 Half High Tape
Dual Port 10/100/1000 Ethernet Optional: Quad 1Gbt or Dual 10Gbt
Yes Optional: RAID support
PCIe: 3 Slots PCI-X 266: 2 Slots GX Bus: 2 Slots
Shared with PCIe 2 slots
Up to 6 DASD (3.5”)Optional SFF DASD
Up to 256GB (Buffered )
2, 4, 6 or 8 cores @ 3.5 & 4.2 GHzL3 Cache: 32MB per chip
Power 550 8204-E8A
Media Bays
Redundant Power
Dynamic LPAR
Remote IO Drawers
Integrated Virtual Ethernet
Integrated SAS / SATA
Expansion
Internal SAS Disks
DDR2 Memory
Architecture
35
IBM Power Systems
© 2008 IBM Corporation
Power 550 Physical Specifications:
Deskside/Desktop: Width: 282.5 mm (11.1 in) with tip foot 182.5 mm (7.2 in) without tip foot
Depth: 778 mm (30.6 in) Height: 540 mm (21.3 in)
Rack-Mount:
Width: 440 mm (17.3 in) Depth: 730 mm (28.7 in) Height: 175 mm (6.89 in)
Weight: 54.4 kg (120 lb)
36
IBM Power Systems
© 2008 IBM Corporation
POWER6 Entry Systems Comparison
32MB / ChipN / AL3 Cache
YesNoNEBS
4U x 22.8”
Yes
Yes / 40
Max 8
Yes
Yes
2 Sys Port / 3 USB
3 / 2Slot 1 Shared
Yes
64 GB
6 (3.5)
No
4.2 GHz
Power 520
4U x 29”
Yes
Yes / 80
Max 8
Yes
Yes
2 Sys Port / 3 USB
3 / 2Slots 1 & 2 Shared
Yes
256 GB
6 (3.5) / 8 SFF
Yes
3.5 & 4.2 GHz
Power 550
Form Factor
Redundant Power
Dynamic LPAR
Remote IO Drawers
Media Bays
Integrated Virtual Ethernet
Integrated Ports
PCIe / PCI-X
Integrated SAS/SATA
Memory
DASD / Bays
Pluggable Modules
Processors
38
IBM Power Systems
© 2008 IBM Corporation
Power 560 Power 560 8234-EMA
NoCoD
NoHot Node Add
NoConcurrent Repair
21SAS/SATA Controller
2 Slim-line1 Slim-lineMedia Bays
YesRedundant Power & Cooling
Optional / Two Nodes minimum )Redundant Server Processor
Yes (Cold Detect) Two Nodes minimumRedundant Clock
16080Dynamic LPARs
12 Max8 Max Remote I/O Drawers
21Dual Port 10/100/1000Quad Port 1 Gb (Optional)Dual Port 10 Gb (Optional
32GX Bus Slots
8 PCIe, 4 PCI-X 2664 PCIe, 2 PCI-X 266PCI (Internal)
126SAS Disk Bays (3.5”)
Up to 384 GB Up to 192 GBDDR2 Memory (Buffered)
164 or 8Cores
Dual NodesSingle Node
32 MB / ChipL3 Cache
4 / 8 / 16 @ 3.6 GHzPower6 Processors
39
IBM Power Systems
© 2008 IBM Corporation
New FC StandardMemory Type
2400W1400WPower (Est.)
RequiredOptional HMC
8U4URack Units
NoNoConcurrent Maintenance
No9406: Yes9133: No
UpgradesFrom P5+
NoNoCoD
128I/O Drawers
384 GB256 GBMemory
3.6 GHz3.5 GHz4.2 GHzFrequency
4 – 162 – 8Processor cores
560550
IBM Power Systems: 550 & 560 Positioning
40
IBM Power Systems
© 2008 IBM Corporation
Power 560 Bandwidth
32 GB/sec256 GB/sec
Memory / Chip16 core
57.6 GB/secIntra-Node Buses (16 core)
9.6 GB/secInter-Node Buses (16 core)
28.8 GB/sec230.4 GB/sec
L3 / Chip16 core
7.2 GB/sec / node3.6 GB/sec / node4.8 GB/sec / node
24 GB/sec (16 core)
Single NodeInternal I/O BusGX Bus Slot 1GX Bus Slot 2
Total I/O Bandwidth
115.2 GB/sec921.6 GB/sec
L2 / Chip16 core
51.2 GB/secL1 ( Data )BandwidthMemory
Calculations for 3.6 GHz processors and 667 MHz memory
42
IBM Power Systems
© 2008 IBM Corporation
Power 570 Power 570 9117-MMA
YesCoD
16040Dynamic LPARs
YesHot Node Add
Yes ( Nodes 2 / 3 / 4 )Concurrent Repair
41SAS/SATA Controller
4 Slim-line1 Slim-lineMedia Bays
YesRedundant Power & Cooling
Optional ( Two Nodes minimum )Redundant Server Processor
Yes (Cold Detect) ( Two Nodes minimum )Redundant Clock
32 Max8 MaxRemote I/O Drawers
41Dual Port 10/100/1000Quad Port 1 Gb (Optional)Dual Port 10 Gb (Optional)
82GX Bus Slots
16 PCIe, 8 PCI-X 2664 PCIe, 2 PCI-X 266PCI (Internal)
246SAS Disk Bays (3.5”)
768 2-192 DDR2 Memory (Buffered)
162 / 4Cores
Four NodesSingle Node
32 MB / ChipL3 Cache
4.4 / 5.0 GHzPower6 Processors
43
IBM Power Systems
© 2008 IBM Corporation
POWER6 DDR2 Memory DIMMs
Back
DDR2
DDR2
DDR2
DDR2
DDR2
DDR2
DDR2
DDR2
DDR2
DDR2
DDR2
DDR2
DDR2
DDR2
DDR2
DDR2
DDR2
DDR2
Front
Systems: Power 560, 570,570/32, 575, & 595Features / Benefits Dual Sided Connector Pins 3X Reliability of Industry Standard Memory
“Memory Power” Support Energy Savings ( At low utilizations )
On DIMM Buffering Better Performance
45
IBM Power Systems
© 2008 IBM Corporation
Power 570/32 Power 570 9117-MMA
YesCoD
16040 Dynamic LPARs
YesHot Node Add
Yes ( Nodes 2 / 3 / 4 )Concurrent Repair
41SAS/SATA Controller
4 Slim-line1 Slim-lineMedia Bays
YesRedundant Power & Cooling
Optional ( Two Nodes minimum )Redundant Server Processor
Yes (Cold Detect) ( Two Nodes minimum )Redundant Clock
32 Max8 MaxRemote I/O Drawers
41Dual Port 10/100/1000Quad Port 1 Gb (Optional)Dual Port 10 Gb (Optional)
82GX Bus Slots
16 PCIe, 8 PCI-X 2664 PCIe, 2 PCI-X 266PCI (Internal)
246SAS Disk Bays (3.5”)
768 2-192 DDR2 Memory (Buffered)
32 8Cores
Four NodesSingle Node
32 MB / ChipL3 Cache
4.2 GHzPower6 Processors
46
IBM Power Systems
© 2008 IBM Corporation
POWER6 570 Processor Memory Packaging
L3
P PL2
L2
L3P P
L2
L2
4 Cores / Book
2 Cores / Book
POWER 570 Higher
FrequenciesUp to 16 Cores / System
POWER 570/32More ProcessorsUp to 32 Cores / System
L3P P
L2
L2
47
IBM Power Systems
© 2008 IBM Corporation
5.6 KW16.7 KWMax Power
24 GB32 GBMax GB / Core
32MBPer Processor Chip
36MBPer Processor Chip
L3 Cache
8 MBPer Processor Chip
1.9 MBPer Processor Chip
L2 Cache
8160 IO Adapter Slots
254
0
128 DIMMS 2 to 1TB
16 / 32
24 in Rack42U
p590 570/32
254LPARs
19 in Rack16U
Footprint, Packaging
32 IB ( AIX & Linux )192 IO Adapter Slots
I/O Drawers
6 per NodeMax: 24 ( 4 Nodes )
Max PCI slots( Internal )
96 DIMMs2 to 768GB
DIMMs/Max GB memory
4 / 8 / 16 / 24 / 32Configurations
POWER5+ 590 & Power6 570/32 Product Comparison
570/32
p590
49
IBM Power Systems
© 2008 IBM Corporation
Power 575 Node
N+1 Support 1 - 4 Nodes 2 Line Cords 5+ Nodes 4 Line Cords
POWER
Combination Water / AirCooling
Dual GX Bus AdaptersExpansion Slots
Yes Quantity: 1PCI-X ( 20 Slots & 16 DASD )
Two Dual 10/100/1000 EthernetOptional: Dual 10Gb
Yes
PCIe: Up to 4 SlotsPCI-X: Up to 2 slots
2 SAS SFF DASD ( 2.5”)
32 to 256 GB ( Buffered )
L3: 32MB / Chip
32 Core node1 – 14 Nodes / rack ( 448 Cores )
4.7 GHz
Power 575 Node
Remote IO Drawers
Integrated Ethernet
Integrated SAS
Expansion
Internal Disks
DDR2 Memory
Cache
Architecture
50
IBM Power Systems
© 2008 IBM Corporation
Photo of Power 575 Mechanical Model
Power 575 Water Cooled Node
51
IBM Power Systems
© 2008 IBM Corporation
Top View
I/O Unit(Lite or FF)
PCI Riser (2 x PCIe or 1x PCIe, 1x PCI-X DDR2)
PCI Riser (2 x PCIe or 1x PCIe, 1x PCI-X DDR2)
Dual 2 port 4x Host Channel Adapter (Displaces Lower PCI Slot)
Processor UnitI/O Section
Air Moving Device(Fans)
16x DCM(p6 + L3)
32 x DIMM 32 x DIMM
Cold Plate
Dual 2 port 4x Host Channel Adapter (Displaces Lower PCI Slot)
52
IBM Power Systems
© 2008 IBM Corporation
Water Cooling…. Redundant Modular Water Unit
With Non-Redundant Facilities Water (MWU)
Redundant Modular Water UnitWith Redundant Facilities Water (MWU)
MWUMWU
FacilityWater
MWUMWU
FacilityWater
54
IBM Power Systems
© 2008 IBM Corporation
Power 595
Hot Add & Concurrent RepairProcessors / MemoryAvailability
CEC: Yes Node: YesYes / Hot Failover
Redundant Service Processor
Active Energy Manager (Power Save)
Power / Thermal
1 YearWarranty
Yes / Hot FailoverRedundant Clock
Yes / Concurrent Repair
Up to 254 partitions
RIO-2 and 12X Max:30 DrawersDrawer: 20 IO slots & 16 DASD
4 per Node
Up to 8 Nodes( 8 Cores & Max: 512 GB Memory )
Point to Point Interconnect
16GB to 4 TB ( Buffered / ChipKill )
L2: 4MB/Core L3: 32MB/Chip
POWER6: 8 / 16 - 64 core4.2 and 5.0 GHz
Power 595 9119-FHA
Redundant Power & Cooling
Virtualization
Remote IO Drawers ( IO Expansion )
GX Bus ( System Bus)
Processor / MemoryNodes
DDR2 Memory
Cache
Architecture
55
IBM Power Systems
© 2008 IBM Corporation
Power 595 Front Rack View
IO Drawers
Dual Clocks
Bulk Power
Nodes
Enet HubLight Strip
Dual System
Controllers
Dual NodeControllers
Midplane
Up to 8 Nodes Split 4 above / 4 below 8 Cores and Up to 512GB Memory
Up to 3 Remote IO Drawers Up to 60 PCI Slots Up to 48 DASD Bays
Dual Clocks
Dual System Controllers
Dual Node Controllers
Dual Power Supplies
Dual Ethernet Hubs
Dual Lightstrips
Redundant Cooling
Alternate Processor Recovery
Concurrent Repair
Availability Features
Packaging
56
IBM Power Systems
© 2008 IBM Corporation
Max Configuration 64 Cores / 4 TB Memory 32 GX Buses
8 cores / Up to ½ TB Memory 4 GX Ports / 2 Node Controllers
Power 595 System CEC
GX
GX
GX
GX
NC
NC
L3
L3
P6
L2
P6
L2 L3
L3
P6
L2
P6
L2
L3
L3
P6
L2
P6
L2 L3
L3
P6
L2
P6
L2
Dual Node Controllers
GX Bus
DIMMs
DIMMs
DCA Bulk PowerDCA Bulk Power
ClockClock
57
IBM Power Systems
© 2008 IBM Corporation
DDR2
DDR2
DDR2
DDR2
DDR2
DDR2
DDR2
DDR2
DDR2
DDR2
Interposer Buffer Chip
Power 595: POWER5 590/595 Memory DIMMs upgrade…
DIMM Slot
POWER5 DDR2 memory transforms into Buffered Memory supported by POWER6
POWER5 DDR2 non buffered Memory
58
IBM Power Systems
© 2008 IBM Corporation
POWER5 to Power System 595 Upgrade Options
Unified Power 595
POWER6
No upgrade path from a POWER6 570 to a POWER6 5959406-550 upgrade to i570 withdrawn July 2008
Power 595p5-595
i5-595
i5-570
p5-590
System i System
System p System
POWER5
Power System
59
IBM Power Systems
© 2008 IBM Corporation
Power 595 Bandwidth
42.7 GB/sec1366 GB/sec per System
4 x 1B Write4 x 2B Read
MemorySystem
26.7 GB/sec
746.7 GB/sec per System4 x 8B
28 Interconnects
Inter-NodeBuses
System
40 GB/sec per chip160 GB /sec per Node
1280 GB /sec per System
6 x 8B
Intra-NodeBuses
System
80 GB/sec2.56 TB / sec per System4 x 8BL3
20 GB/sec640 GB/sec per System
2 x 4BGX Bus
160 GB/sec2 x 32B L2
80 GB/sec2 x 8BL1 ( Data )
BandwidthBus SizeMemory
61
IBM Power Systems
© 2008 IBM Corporation
Capacity Upgrade on Demand Upgrade system with processors and/or memory No special contracts, no required monitoring (no ability to turn off the capacity) Purchase agreement
On/Off Capacity on Demand Temporary use of requested number of processors or amount of memory Client selects the capacity and activates the resource (registered system) Capacity can be turned on and off by the client Information captured by IBM (or reported to IBM) Rental agreement
Utility Capacity on Demand Processor resources only / Measured by processor minutes Capacity can be turned on and off by the client Prepaid or post pay Requires a minimum of AIX V5.3 or higher and APV
Trial Capacity on Demand Allow clients to test the effects of additional processors and/or memory Partial or total activation of processors and memory Resources available for fixed time No formal commitment required
Dynamic Processor Sparing• Automated replacement of deallocated processors• Unassigned or inactive processors
Capacity on Demand for POWER6 Processor-based Systems
62
IBM Power Systems
© 2008 IBM Corporation
ConfigurationsPower 595: 4.2 / 5.0 GHz Cores: 4 active / 28 CoD Cores: 4 active / 60 CoD
Backup ModeProcessors: 32 / 64 active
Power System 595 Capacity Back-Up Option...
CBU Resources
rPerf
Capacity Back Up with POWER6– POWER6 595 ( 4.2 GHz or 5.0 GHz )– Base configuration: 4 Active processors– AIX V5.3 / V6.1, and Linux support– On / Off Days included with CBU Configurations
4 / 32 1800 CoD Processor days 4 / 64 3600 CoD Processor days
No Permanent Activation
64
IBM Power Systems
© 2008 IBM Corporation
Processor Instruction Retry Alternate Processor Recovery First Failure Data CaptureDDR Chipkill memoryBit-steering/redundant memoryService Processor Failover*Dynamic Firmware Maintenance*Hot I/O Drawer Add*I/O error handling extended beyond base PCI adapterECC extended to inter-chip connections for the fabric/processor busesMemory and L3 Cache soft scrubbingHardware Assisted
L2 & L3 Cache Line DeleteHardware Assisted Memory ScrubbingLive Partition Migration
Primary POWER RAS Features
HMC required to enable these functions..
65
IBM Power Systems
© 2008 IBM Corporation
Primary POWER RAS Features - Continued
HMC required to enable these functions..
Hot Add: Power 570 Processor & MemoryHot Add: Power 590 Processors & MemoryConcurrent Repair: 570 Nodes 2/3/4 (Hot) and Node 1 (Cold)Concurrent Repair: 590 All NodesRepairRedundant power, fansDynamic Processor DeallocationDynamic processor sparing ECC memoryPersistent memory deallocationHot-plug PCI slots, fans, powerInternal light path diagnosticsHot-swappable disk bays
67
IBM Power Systems
© 2008 IBM Corporation
6,085,166 6,085,166
4,092,799 4,033,378
3,210,540
2,382,0322,196,268
$2.81 $2.93 $2.97
$5.07
$3.76$4.70
$2.81
0
1000000
2000000
3000000
4000000
5000000
6000000
7000000
$0
$20
Transaction Performance - TPC-C V5 Non-Clustered
Avail. date: 12/10/08 12/15/08 08/06/07 01/22/07 05/14/05 12/04/08 04/30/08 Result date: 06/10/08 06/15/08 02/27/07 01/22/07 11/18/04 12/04/08 10/30/08
tpmC
$/tpmC
BullPL6460R64-core
DB232/64/128
Source: http://www.tpc.org Results listed with processor chip/core/thread.
IBM p5-59564-core
DB232/64/128
FujitsuP’Quest64-core
Oracle(Linux)
32/64/128
HPS’dome128-coreOracle
64/128/256
FujitsuP’Quest64-core
Oracle(Linux)32/64/128
IBMPower595
64-coreDB2
32/64/128
All results are as of 01/01/09.
IBMp5-59564-core
DB232/64/128
68
IBM Power Systems
© 2008 IBM Corporation
TPC-C V5 Non-Clustered
All measurements indicate tpmC and $/tpmC Results listed with processor chip/core/thread. Source: http://www.tpc.org
629,159 629,159
429,899
372,140 371,044
$2.49
$4.99
$1.81
$5.26
$2.49
0
300,000
600,000
900,000
$0
$5
$10
$15
$20
Avail. date: 04/20/08 06/11/08 09/30/04 06/11/07 09/30/04 Result date: 03/20/08 06/11/08 08/31/04 06/11/07 07/12/04
IBMp5-570Oracle
IBMp5-570
DB24/8/16
BullPL860R
DB24/8/16
IBMPower 550
DB24/8/16
1,616,162 1,616,162
1,025,169
809,144
579,814
$3.54$4.42
$4.95
$0.96
$3.54
0
300,000
600,000
900,000
1,200,000
1,500,000
$0
$5
$10
$15
$20
Avail. date: 11/21/07 12/16/07 05/31/06 09/30/04 11/17/08 Result date: 05/21/07 12/17/07 02/14/06 07/12/04 11/17/08
1,601,784
1,354,0861,245,516 1,238,579
1,025,486
$3.25$4.57 $3.94
$5.43$5.05
0
500,000
1,000,000
1,500,000
2,000,000
$0
$10
$20
$30
$40
$50
Avail. date: 04/20/05 11/22/08 04/30/08 12/15/06 02/29/04 Result date: 04/20/05 11/22/08 01/21/08 11/30/06 09/12/03
6,085,166 6,085,166
4,033,378
3,210,540
2,382,032
$2.81 $2.97$5.07
$3.76$2.81
0
1,000,000
2,000,000
3,000,000
4,000,000
5,000,000
6,000,000
7,000,000
$0
$10
$20
$30
$40
$50
Avail. date: 12/10/08 12/15/08 01/22/07 05/14/05 12/04/08 Result date: 06/10/08 06/15/08 01/22/07 11/18/04 12/04/08
16-core
32-core64-core
HPDL585
SQL Server4/16/16
BullPL1660R
DB2 8/16/32
IBMPower 570
DB28/16/32
IBMp5-570
DB28/16/32
NECExpress5800
Oracle (Linux)16/32/64
p5-595Oracle
FujitsuP’Quest
Oracle (Linux)16/32/64
FujitsuP’Quest
Oracle (Linux)16/32/64
p690DB2
IBMPower 595
DB232/64/128
IBMp5-595
DB232/64/128
BullPL6460R
DB232/64/128
IBMp5-595
DB2
FujitsuPrimequest
Oracle32/64/128
8-core
All results are as of 01/01/09.
IBMp5-570
DB2
HPrx6600
SQL Server4/8/16
69
IBM Power Systems
© 2008 IBM Corporation
TPC-C V5 Non-Clustered
97,083102,454 100,926
82,774
69,564
$0.73 $0.74 $0.84 $0.91$0.68
0
10,000
20,000
30,000
40,000
50,000
60,000
70,000
80,000
90,000
100,000
110,000
$0
$1
$2
$3
$4
$5
DellPowerEdgeSQL Server
1/4/4
Avail. date: 06/16/08 12/31/07 06/08/07 03/27/07 03/09/07 Result date: 06/16/08 09/12/07 06/08/07 03/27/07 03/09/07
HPML350Oracle1/4/4
DellPowerEdgeOracle 11g
1/4/4
HPML350G5
SQL Server1/4/4
42,432
35,030 34,349 33,87332,464
$1.88
$2.40
$1.96
0
10,000
20,000
30,000
40,000
50,000
$0
$1
$2
$3
$4
$5
Avail. date: 03/29/05 03/17/04 08/13/04 12/17/03 12/14/04Result date: 03/29/05 03/02/04 08/13/04 12/17/03 12/14/04
81,43976,214 74,298
71,41368,010
$3.91
$2.40 $2.15 $1.80
$2.99
0
50,000
100,000
$0
$5
$10
$15
$20
Avail. date: 12/22/06 11/08/05 02/14/05 02/14/05 11/01/04Result date: 06/23/06 09/30/05 02/11/05 02/11/05 11/01/04
404,462 404,462
276,383
236,271 230,569
$3.51$2.22 $2.43 $2.63
$3.50
0
100,000
200,000
300,000
400,000
$0
$5
$10
$15
$20
Avail. date: 11/26/07 12/16/07 12/16/08 04/04/08 12/01/06 Result date: 08/06/07 12/17/07 06/16/08 10/04/07 08/01/06 1-core
2-core4-core
HPML350
SQL Server
ItautecInfoServerSQL Server
ItautecInfoServerSQL Server
HPDL380
SQL Server
HPML370
SQL Server
HPML370
SQL Server
HPML370
SQL Server
HPDL385
SQL Server
IBMp5-520
Sybase (Linux)1/2/4
IBMPower 570
Oracle2/4/8
IBMp5-570
Oracle(Linux)4/4/8
HPrx6600Oracle2/4/8
Price/performance
All measurements indicate tpmC and $/tpmC. Results listed with processor chip/core/thread. Source: http://www.tpc.org
All results are as of 01/01/09.
HPDL385
SQL Server2/2/2
IBMPower 550
Sybase2/4/8
HPML350
Oracle (Linux)1/4/4
BullPL1660ROracle2/4/8
70
IBM Power Systems
© 2008 IBM Corporation
95,0806,085,166AIX 5L V5.3IBM DB2 9.5$2.8112/10/0832/64/128IBM Power 595 (5 GHz POWER6)
57,642230,569HP-UX 11.iv2Oracle 10g$2.6312/01/062/4/8HP rx6600 (1.6 GHz Itanium 2)
46,517372,140Windows EESQL EE$1.8106/11/074/8/16HP rx6600 (1.6 GHz Itanium 2)
36,330290,644Windows EESQL EE$2.7109/01/064/8/16HP rx4640 (1.6 GHz Itanium 2)
101,115404,462AIX 5L V5.3Oracle 10g$3.5011/26/072/4/8IBM Power 570 (4.7 GHz POWER6)
101,0101,616,162AIX 5L V5.3IBM DB2 9$3.5411/21/078/16/32IBM Power 570 (4.7 GHz POWER6)
31,9744,092,799HP-UX 11iv3Oracle 10g$2.9308/06/0764/128/256HP Superdome (1.6 GHz Itanium 2)
63,0214,033,378AIX 5L V5.3IBM DB2 9$2.9701/22/0732/64/128IBM p5-595 (2.3 GHz POWER5+)
50,207200,829HP-UX 11.iv2Oracle 10g$2.7509/01/062/4/8HP rx4640 (1.6 GHz Itanium 2)
29,506236,054Windows EEIBM DB2 v8.2$2.0212/05/058-coreHP ProLiant DL585 (2.4 GHz Opteron)
19,2411,231,433Windows DESQL EE$4.8206/05/0664-coreHP Superdome (1.6 GHz Itanium 2)
64,0731,025,169AIX 5L V5.3IBM DB2 v8.2$4.4205/31/068/16/32IBM p5-570 (2.2 GHz POWER5+)
50,859203,439AIX 5L V5.3Oracle 10g$3.9310/17/054-coreIBM p5-570 (1.9 GHz POWER5)
23,412187,296Windows EESQL EE$2.0405/31/058-coreHP ProLiant DL585 (2.2 GHz Opteron)
50,0551,601,784AIX 5L V5.3Oracle 10g$5.0504/20/0532-coreIBM p5-595 (1.9 GHz POWER5)
32,655130,623Windows EESQL EE$2.8005/06/054-coreHP ProLiant DL585 (2.6 GHz Opteron)
18,826301,225Windows EESQL DE$4.5604/15/0416-coreHP rx5670 (1.5 GHz Itanium 2)
50,1643,210,540AIX 5L V5.3IBM DB2 v8.1$5.0705/14/0564-coreIBM p5-595 (1.9 GHz POWER5)
53,737429,899AIX 5L V5.3IBM DB2 v8.1$4.9909/30/048-coreIBM p5-570 (1.9 GHz POWER5)
48,597194,391AIX 5L V5.3Oracle 10g$5.6209/30/044-coreIBM p5-570 (1.9 GHz POWER5)
50,571809,144AIX 5L V5.3IBM DB2 v8.1$4.9509/30/0416-coreIBM p5-570 (1.9 GHz POWER5)
15,7521,008,144HP-UX 11.iOracle 10g$8.3304/14/0464-coreHP Superdome (1.5 GHz Itanium 2)
?No Published Results Sun
tpmC/CoretpmCOSDatabase$/tpmCAvail.Chip/Core/Th
readSystem
Source: http://www.tpc.org Not all results listed. Results listed with processor chip/core/thread.
Transaction Performance - Single System TPC-C V5
All results are as of 01/01/09.
72
IBM Power Systems
© 2008 IBM Corporation
POWER6 Remote I/O Drawer 19” Rack
19” IO DrawerPOWER6 Processor-based Servers only
– Max 4 of drawers per GX Bus½ x 19” 4U Rack-mount
– Optional enclosure for two individual drawers Six PCI Adapter Slots
– PCI-X 2.0 (DDR) 64-bit @ 266 MHz (2 GB/s) “InfiniBand” Host Interface (Loop Architecture)
– 12 x 2.5Gb/s Full Duplex (30 Gb/sec)– Short Run (Intra-rack) or Long Run (Inter-rack)– Four cable lengths: 0.6, 1.5, 3.0, & 8.0m
Customer Setup Concurrently Maintainable Redundant Power Concurrently Maintainable Redundant Cooling Hot Drawer Add Blind-swap Cassettes for Adapter Cards
–Hot-pluggable
Two drawers
PCI-X 266Slots12X Channel
ConnectionSupported Systems
Power 520 / 550 560 / 570
73
IBM Power Systems
© 2008 IBM Corporation
Back
Front
16 DASD
GX Dual Port12X ChannelConnections
POWER6 Remote I/O Drawers 24” Racks
SCSICntrl
24” I/O Drawer 4U I/O Drawer PCI-X & PCI-X 266 Support 6 PCI-X and 14 PCI-X 266 per Drawer All adapter slots 64bits
GX Dual Port 12X Channel InfiniBand Interface 30 Gb/sec Supports 16 Hot-Plug disk drives Four 4-pack disk / Ultra3 SCSI 72.8 / 146.8 / 300 GB
Multiple cabling options Hot Drawer Add Blind Swap Adapter Cards Hot Pluggable
PCI-X 133 PCI-X 266
Dual or Single Path
SCSICntrl
SCSICntrl
SCSICntrl
Supported SystemsPower 575 / 595
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8Gb Fiber Channel
Description:Dual PortedPCIe x4 ArchitectureMultiple speeds: 2Gb, 4Gb, or 8GbSupported Systems: Power 520 / 550 / 560 / 570 / 575Supported OS: AIX and LinuxNPIV enabledFeature Code: 5735
PCIeFC
FC
8Gb FiberChannel
Link
NPIV
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Power Trending Collect and Report Power usage data
Thermal Reporting Collect and display Inlet and Exhaust Temperatures
Static Power Save Save maximum power by dropping voltage and frequency
Power Cap Enforces a user-specified power cap Uses processor and memory throttling
Oversubscription Quickly lower power when failure occurs.
Processor Nap Put processors into low power mode when they are deconfigured or not
used.
EnergyScale Functional Description
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Dynamic Power Save -- Optimize Power / Performance TPMD implements algorithms to optimize power vs. performance
Dynamic Power Save -- with Performance Floor User specifies a minimum acceptable “performance floor”
System Turbo -- Maximum Performance Provides maximum performance by raising voltage and frequency
IO Tower/Drawer Power Trending Drawer, Tower and IO Frame power reporting
Server Power Down Evacuate Servers and power them off
EnergyScale Functional Description - Continued
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PowerVM…
AIX Workload Partitions
PowerVM Editions feature
Micro-Partitioning™
Virtual I/O Server
Integrated Virtualization Manager
Partitioning Pooling
NPIV
Lx86
Logical Partitioning
Virtual Processors
Virtual Networking
Virtual Media
Virtual Tape
Hardware & Software delivering industry-leading virtualization on IBM POWER processor-based processors for UNIX, Linux & IBM i
Live Partition MobilityLive Application Mobility
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POWER6 Delivers with Your Choice of AIX or Linux
Linux on POWERPOWER and x86 apps [2H07]
PowerVM
Reliability, Availability, Serviceability features
Scalability to 128 threads
AIX 6*Virtualization Workload Partitions Live Application Mobility
SecurityAvailabilityManageabilityBinary compatible**
Broad application selectionWide range of workloadsReduced ComplexityPotential cost savings with consolidationLive Partition Mobility
Linux, AIX V5.3 and AIX V6.1
Binary compatible with existing applications on POWER6*
Micro-Partitioning Mainframe-inspired RAS features
hardware and operating system Scalability up to 128 threads
AIX 5L V5.2/5.3
*Complete details on AIX binary compatibility can be found at http://www.ibm.com/servers/aix/os/compatibility/
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AIX Binary Compatibility
Guarantee
*Complete details on AIX binary compatibility can be found at http://www.ibm.com/servers/aix/os/compatibility/
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POWER6 Exploitation
Software Reliability Availability Serviceability
Enhancements to existing Virtualization Technologies
Workload Partitions ( Software based Virtualization )
Application Mobility ( Cross system Workload Mobility )
64-bit Kernel only
Integrated Multilevel Security
Role Base Access Control ( Partial Root base )
Encrypted File system
CAPP EAL4+ and LSPP Security Certification
Solution Performance Tuning
AIX Kernel Hot-Patching
Dynamic Tracing for AIX
Ease of UsePortal base SMT, LPAR Simplification
AIX 6 Features….
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AIX Editions…..
AIX 5.3 Management Edition bundle consisting ofAIX V5.3Tivoli® Application Dependency Discovery ManagerIBM Tivoli MonitoringIBM Usage & Accounting Mgr Virtualization Edition for Power Systems
AIX 6.1 Enterprise Management bundle consisting ofAIX V6.1PowerVM AIX Workload Partitions ManagerTivoli® Application Dependency Discovery ManagerIBM Tivoli MonitoringIBM Usage & Accounting Mgr Virtualization Edition for Power Systems
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V6R1• Major SW release (~3.0 MLoC)• New DB2 Functions• IOPless boot from SAN• IPV6 • System Director Navigator• Safe Computing
•SLIC Signing & S/R Encryption•Intrusion Detection•Encrypted backups and Data on disk
Virtualization• IBM i Storage• VIOS Support
Performance • Performance Management ( Web based )• Improved Storage Performance• 64K Large Page Support/exploitation• 64-bit IBM Technology JVM
High Availability• System HASM Product• SPOOL Modernization• Disk Instrumentation
V5R4M5 (POWER6 enablement)• IBM i V5R4 Refresh• IOPless WAN Adapter support• IOPless Op Console• Software Enablement for:
•Additional IOPless devices•PCI-Express Devices•Serial-Attached SCSI (SAS)
Availability• RAID Hot Spare
Refresh• Content Manager• Domino• PHP• WDSC
IBM i Operating Systems
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● Enterprise Class Computing with Linux on POWER ( LoP )
●Flexibility with LPAR, dynamic LPAR, and virtualization features
●Reliability with built in self-healing capabilities
●Power Architecture/Servers include POWER5, POWER6 and PowerPC970 ( JS20, JS21 blades )
● Linux distributions available for LoP: - SUSE LINUX Enterprise Server 9 or 10 for POWER (SLES 9, SLES 10) - Red Hat Enterprise Linux 4, 5 for POWER (RHEL)
● Technical support available through IBM SupportLine contract. - SUSE LINUX and Red Hat, Inc. also provide support, upgrades and maintenance
●Orderable from IBM or directly from Linux distributors
● For more information about Linux running on IBM Power Systems servers:
● http://www.ibm.com/systems/p/linux/
● http://www.redhat.com/rhel/server/
● http://www.novell.com/products/server/
Linux on POWER*
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AIX
FSP PHYP
SLES RHEL VIOS AIX
PHYP
SLES RHELIVM
(VIOS)
MM
JS21AIX
SLES RHELHS21Win
HMC
HMC: Hardware Management Console WPAR: Workload Partition (Container)
IVM: Integrated Virtualization Manager PHYP: POWER Hypervisor
VIOS: Virtual IO Server (virtual IO and Layer 2 bridge) BMC: Baseboard Management Controller
MM: Management Module SMP: Symmetric Multi Processor
FSP: Flexible Service Processor
POWER6 System Blade Center POWER 5 System
AIXWPAR
WPAR
WPAR
WPAR AIX (SMP)
PHYP FSP
IBM Systems Director 6.1Physical and virtual platformsServer, Storage, Networking
Foundation Management
Advanced Management
Inventory
Health
Config Update
IBM Systems Director Console
IBM i IBM i
IBM Systems Director for Power Topology
BMC/FSP
Availability
Workload
Image Energy Mgt
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Automatic Discovery and Inventory: POWER resources and connected storage which includes the collection of both hardware and software inventory. HMC, CEC, LPAR, AIX, pLinux, HMC, VIOS, FSP, and Virtual Networking components – bridges and VLANS)
Visualize various POWER resource: Topologies and relationship across physical server and virtual servers CEC, HMC, VIOS, LPAR, devices, AIX, pLinux and Virtual Networking components, virtual disks, logical volumes and associated volume groups.
Discovery and documentation of full system configuration Physical and virtual IO resources and association/relationship (for configuration recovery – i.e. System plan).
Director 6.1 Power Capabilities:
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Show Health and Status of Physical and Virtual Servers HMC and VIOS. Show Alerts: Hardware failures and system logs from VIOS, HMC and the operating systems.
Base Monitoring: OS Metrics: CPU and memory utilization File system metrics across hosts and virtual servers. Historical and OS events monitoring. View CPU utilization metrics for environments that contain both shared and dedicated processors for both host and virtual servers.
Director 6.1 Power Capabilities:
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Download, Manage, and apply recommended Updates: AIX, pLinux, i5OS, HMC and System Firmware
Deployment/Provisioning/Planning Ability to configure new systems or clone systems using system plans Deployment of OS and VIOS on a LPAR via HMC.
Base Virtualization Management Support key lifecycle LPAR and mobility operations Within single HMC domain) operations.
Consolidated Interface Integration of tasks for Key Power Resource Managers HMC, IVM/VIOS, AIX and i5OS management consoles
Director 6.1 Power Capabilities:
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Comprehensive CLI interface: Discovery/Health/Update/Deployment, LPAR virtualization lifecycle and mobility, power control and management
Energy Management – Active Energy Manager Monitoring, reporting, capping (both a server and group), and controlling power consumption. Receive power status and alerts. Energy Thresholding - Allow a user to set a power or temperature threshold, and be notified when it is reached (or allow an action to automatically be taken). Full CLI for all key AEM functionality. Support of AEM Server on AIX.
Enterprise Integration and Manageability Out-of-the box management utilizing standard CIM profiles for AIX, pLinux, i50S, HMC, and VIOS resources
Director 6.1 Power Capabilities:
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High availability solutions for UNIX, i and Linux clients
PowerHA
Cluster management solutions High Availability Can enable near continuous application service Minimize impact of planned and unplanned outages
IBM PowerHA™ for AIX® and Linux (formerly HACMP™)IBM PowerHA for i (formerly HASM)
www.ibm.com/systems/power/software/availability
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What is PowerHA?
Business Continuity Solutions for
World wide commerce
Mission-critical applications
Disaster recovery
IBM storage optimization
Integrated optimization for AIX and i
The future with IBM Research & Development
High Availability and Disaster Recovery solutions from IBM for your mission-critical UNIX, i and Linux applications