Huawei w1 u00 maintenance manual service manual

HUAWEI W1-U00 Maintenance Manual

V1.0

Prepared by Date

Reviewed by Date

Approved by Date

Huawei Technologies Co., Ltd.

All rights reserved

W1-U00 Maintenance Manual Change History

Issue 1.0 (2013-01-17) Huawei Proprietary and Confidential

Copyright © Huawei Technologies Co., Ltd.

i

Change History

Date Version Change Reason Changed Chapter Description Author

W1-U00 Maintenance Manual Contents



ii

Contents

Change History .................................................................................................................................. i

1 Product Overview ......................................................................................................................... 1

1.1 Appearance ....................................................................................................................................................... 1

1.2 Features ............................................................................................................................................................ 2

2 Applicable Scope and Precautions ............................................................................................ 4

2.1 Applicable Scope .............................................................................................................................................. 4

2.2 Precautions ....................................................................................................................................................... 4

2.3 How to Obtain Product and Repair Information .............................................................................................. 4

3 Exploded View............................................................................................................................... 5

4 PCBA Components ....................................................................................................................... 6

5 Software Upgrade ....................................................................................................................... 10

5.1 Upgrade Preparation ....................................................................................................................................... 10

5.2 Hardware Connection ..................................................................................................................................... 11

5.3 Upgrade Home Screen ................................................................................................................................... 13

5.3.1 Scan && Download Button .................................................................................................................. 13

5.3.2 Remove Devices Button ........................................................................................................................ 15

5.4 Upgrade of Multiple Phones........................................................................................................................... 15

5.5 Precautions ..................................................................................................................................................... 16

5.6 Upgrade Software Classification .................................................................................................................... 16

5.7 Window Phone Upgrade Package .................................................................................................................. 17

6 Maintenance Tools ...................................................................................................................... 18

7 Disassembly Procedure .............................................................................................................. 20

8 Assembly Procedure ................................................................................................................... 25

9 Principles and Failure Analysis ............................................................................................... 30

9.1 W1-U00 Framework ...................................................................................................................................... 30

9.2 Block Diagram ............................................................................................................................................... 31

9.3 PCBA Functions ............................................................................................................................................. 32

9.4 Baseband Subsystem ...................................................................................................................................... 36

9.4.1 Power-on Timing Diagram .................................................................................................................... 36




iii

9.4.2 MSM8230 Memory Interface ............................................................................................................... 36

9.4.3 LCD and Touch Panel ........................................................................................................................... 39

9.4.4 Camera Interface ................................................................................................................................... 41

9.4.5 Wi-Fi and Bluetooth Interface ............................................................................................................... 45

9.4.6 USIM and microSD Card Interfaces ..................................................................................................... 46

9.4.7 Headset Interface .................................................................................................................................. 48

9.4.8 Electric Acoustic Interface and Audio Codec Solution ......................................................................... 50

9.4.9 Keypad Interface ................................................................................................................................... 53

9.4.10 Battery and Charge Interfaces ............................................................................................................. 54

9.4.11 Sensor Interfaces ................................................................................................................................. 65

9.4.12 Vibration Motor Interfaces .................................................................................................................. 70

9.4.13 Environment Monitoring and Prevention Solutions ............................................................................ 71

9.4.14 PCBA's Reset Relationship, Timing, and WDT Function ................................................................... 73

9.4.15 Charging Indicator Interface ............................................................................................................... 76

9.4.16 Board Power Distribution ................................................................................................................... 77

9.4.17 Board Address Allocation ................................................................................................................... 81

9.4.18 Board Power-on and Power-off Process .............................................................................................. 83

9.4.19 Clock Scheme ..................................................................................................................................... 86

9.4.20 RTC and Standby Battery .................................................................................................................... 86

9.4.21 UVLO and SMPL ............................................................................................................................... 87

9.5 RF ................................................................................................................................................................... 88

9.5.1 Transmitter in WCDMA/GSM .............................................................................................................. 89

9.5.2 Receiver in WCDMA/GSM .................................................................................................................. 92

9.5.3 Frequency Source .................................................................................................................................. 94

9.5.4 GPS and B1 Diversity ........................................................................................................................... 95

9.5.5 WLAN and Bluetooth ........................................................................................................................... 96

10 Troubleshooting Common Faults .......................................................................................... 97

10.1 Startup Failure .............................................................................................................................................. 97

10.2 Reception Failure ....................................................................................................................................... 101

10.3 Transmission Failure .................................................................................................................................. 103

10.4 Charging Failure ......................................................................................................................................... 105

10.5 Camera Failure ........................................................................................................................................... 106

10.6 Data Connection Failure ............................................................................................................................. 107

10.7 Call Receiving Failure ................................................................................................................................ 108

10.8 Call Sending Failure ................................................................................................................................... 109

10.9 Vibration Failure ........................................................................................................................................ 110

10.10 No Ringtone ............................................................................................................................................. 111

10.11 LCD Display Failure ................................................................................................................................ 112

10.12 Key Failure ............................................................................................................................................... 113

10.13 Headset Failure ......................................................................................................................................... 114

10.14 microSD Card Detection Failure .............................................................................................................. 115




iv

10.15 GPS Signal Reception Failure .................................................................................................................. 116

11 Solder Points on the PCB and BGA Chips ......................................................................... 117

12 Functional Tests....................................................................................................................... 119

12.1 Keys ........................................................................................................................................................... 119

12.2 MMI Test .................................................................................................................................................... 120

12.2.1 Test Method ....................................................................................................................................... 120

12.2.2 Precautions ........................................................................................................................................ 120

12.2.3 Test Items .......................................................................................................................................... 121

12.3 Voice Call Test ............................................................................................................................................ 135

W1-U00 Maintenance Manual 1 Product Overview



1

1 Product Overview

1.1 Appearance

Figure 1-1 shows the appearance of the HUAWEI W1-U00 (W1-U00 for short).

Figure 1-1 W1-U00 appearance




2

1.2 Features

Table 1-1 describes the W1-U00 features.

Table 1-1 W1-U00 features

Item Description

Type Touch panel smart phone

Dimensions 124.5 mm (4.63 in.) x 63.7 mm (2.0 in.) x 10.5 mm (0.49 in.)

Weight About 130 g (including the battery)

Working bands WCDMA 900 MHz: 880–915 MHz (uplink), 925–960 MHz (downlink)

WCDMA 2100 MHz: 1920–1980 MHz (uplink), 2110–2170 MHz (downlink)

GSM 850 MHz: 824–849 MHz (uplink), 869–894 MHz (downlink)




Maximum transmission

power

WCDMA: +24 dBm (power class 3)

GSM/GPRS 850/900 MHz: +33 dBm (power class 4)

GSM/GPRS 1800 MHz/1900 MHz: +30 dBm (power class 1)

External ports Standard micro USB port, microSD card slot, 3.5-mm headset jack

UIM card port Standard 6-pin

microSD card Up to 32 GB

USB USB 2.0 high speed; 480 Mbit/s

Battery Capacity: 1730 mAh

Standby time: up to TBD hours (2G); up to TBD hours (3G)

Call time: up to TBD minutes (2G); up to TBD minutes (3G)

Charging time: TBD hours

Display 4.0-inch thin film transistor (TFT) display, WVGA 480x800 pixels, 16.7 M

colors

Antenna Built-in antenna

Camera Rear camera: 5 MP, front camera: 0.3 MP

Sensors Accelerometer, proximity sensor, light sensor

Bluetooth Bluetooth V 2.1+enhanced data rate (EDR)

Wi-Fi 802.11b/g/n, Wi-Fi routing




3

Item Description

GPS GpsOne

Power supply 100–240 V, 50/60 Hz, 1 A

Temperature Operating temperature: 0°C to +40°C

Storage temperature: –40°C to +70°C

Humidity Working humidity: 5% to 95% RH

W1-U00 Maintenance Manual 2 Applicable Scope and Precautions



4

2 Applicable Scope and Precautions

2.1 Applicable Scope

This document provides repair instructions for technicians at service sites authorized by

Huawei. This document is Huawei proprietary and is accessible only for authorized service

centers and companies. Although every effort was made to ensure the accuracy of the

document, errors may still exist. If you find any mistake or have any suggestion, contact

Huawei customer service personnel.

2.2 Precautions Maintenance and calibration operations are performed only by qualified technicians.

All repair and maintenance operations are performed in antistatic rooms with ESD wrist

straps correctly worn.

Ensure that all components, nuts, and insulators are installed after maintenance or

calibration. In addition, ensure that all cables and wires are properly installed.

Soldering is lead-free and compliant with environmental protection requirements.

2.3 How to Obtain Product and Repair Information

To obtain product and maintenance information, visit Huawei website at:

http://www.huaweidevice.com/cn/technicaIndex.do.

W1-U00 Maintenance Manual 3 Exploded View



5

3 Exploded View

Figure 3-1 shows the exploded view of the W1-U00.

Figure 3-1 Exploded view of the W1-U00

Aluminum alloy

support of front cover PCBABack cover

assembly Battery

Battery cover

Near field communication

(NFC) antennaUSB boardPrimary flexible

printed circuit (FPC)

LCD and

touch

panel

assembly

W1-U00 Maintenance Manual 4 PCBA Components



6

4 PCBA Components

Figure 4-1 and Figure 4-2 show the components on the top and bottom sides of the PCBA and

failures that might occur if the components are damaged.

Figure 4-1 Components on the PCBA top side

U3601 RF power amplification

chip

Faults caused if damaged:

No signal, weak signal, or

registration failure

U4001 RF chip




J2603, 2604, and 2605


Volume key failure

U2201 gravity sensor chip


Gravity sensor failure

U1402 duplexer chip




U4101 RF power amplification

chip




J1501 battery port


Startup failure

U1403 DCDC power chip


Startup failure

U1401 flash memory


Startup or software failure

X601 PXO 26M crystal

oscillator


Startup failure

U301 CPU/LPDDR2 chip


Startup failure or other failures

Q801 MOS tube


Startup or upgrade failure

U2701 NFC chip


NFC failure

X202 19.2M crystal oscillator


Startup failure

U201 power management chip


Startup failure

J1901 headset jack


Headset failure

U1701 CODEC chip


Audio fault

U2001 LCM driver chip


LCD backlight failure

U5001 Wi-Fi and Bluetooth

chip


Wi-Fi or Bluetooth failure

2102 front camera interface


Front cameral failure




7

Figure 4-2 Components on the PCBA bottom side

U2602 BTB connector


Subboard connection failure

J2301 SIM card connector


SIM card failure

J2302 MicroSD card connector


microSD card failure

J2101 BTB interface


Rear camera failure

U3201 coaxial connector


Registration failure, no signal, or

weak signal

U3301 RF power amplifier


Registration failure, no signal, or

weak signal

U3201 RF switch


RF failure

J2001 BTB connector


LCD or touch panel failure

J2601 BTB connector


Startup, receiver, or sensor failure

U2102 camera flash chip


Camera flash failure

MIC1801 secondary microphone


Secondary microphone failure (for

phones delivered to regions

outside of China)

Z5101 SAW filter


Bluetooth or Wi-Fi failure

Q301 p-channel MOSFET


Startup or charge failure

U7001 and Z7001 background

noise amplifier and SAW filter


GPS failure

J203 USB connector


Charge failure

J201 coaxial connector

Faults caused if

damaged:

RF failure

MIC302 primary

microphone


Transmitter failure

J202 BTB connector

Faults caused if

damaged:

Connection failure to

PCBA

The component list in Table 4-1 is provided for your reference only. It is subject to changes

without notice. Obtain the latest component information from Huawei. If you have any

questions, contact the local technical support center.




8

Table 4-1 Components of the W1-U00

Position NO. Part Number Description

J1501 14240582 Card Socket,Battery connector,4PIN,Mid Mount,Side Contact,2.50mm,With

Plastic Peg,0.50mm,Terminal Dedicated

J1901 14240381 Headphone Connector,3.5mm,6pin,Side plugging,SMT,Mid Mount

J2001 14240579 BTB Connector,BTBconnector,34PIN,0.4mm,0.8mm,SMT,female,Terminal

Dedicated

J2101,J2102 14240181 BTB Connector,Fmale,24Pin,0.4mm,SMT,Mating Height 1.0mm,Terminal

Dedicated

J2301 14240155 Card Socket Connector,SIM Card Socket,6pin,Horizontal,2.54mm,Without

Lock,Without Hold Peg,Height 0.95mm,Terminal Dedicated

J2302 14240303 Card Block Connector,Micro-SD,8,PUSH-PULL,1.1mm,Detect PIN

J2601,J2602,J

202

14240496 BTB Connector,Female,24Pin,0.4mm,SMT,Mating Height 0.8mm,Terminal

Dedicated

J2603,J2604,J

2605

51621274 DKBA8.382.0615,Main Antenna SMT Spring,C5600

J3201,J201 14240060 RF Connector,Coaxial Connector,50,Straight,Male,SMT,Terminal dedicated

J203 14240247 IO Connector,Micro_B Type Female,5pins,Side Plugging Type,SMT,4

Dip,Mid Mount,1.5mm Height from PCB Top Side,Terminal Dedicated

MIC302 22050053 Microphone, -44dB, D4.0mm*1.3mm,SMT,Terminal Dedicated

Q301 15060318 MOSFET,P Channel,12V,5A,0.020ohm,8V,UDFN6,Terminal Dedicated

Q801 15060150 MOSFET,P Channel,-12V,-2.4A,112mohm,-8V,SOT23

Q2301 15060334 Complementary 20 V, 500 mA / -350 mA,0.75ohm,with ESD protection,

SOT-563 package,Terminal Dedicated

U201 39200438 Power Management IC(PM8038),2.5~4.5V,NSP(pb-free),Terminal

Dedicated

U301 39200432 Terminal Baseband process IC,WCDMA/TD_SCDMA/GSM Multimode

BASEBAND PROCESSOR MSM8230,1.2V/1.8V/2.85V/5V,12x12mm

POP,Terminal Dedicated

U301_POP 40020203 DDR2 DRAM,4Gb LPDDR2,533MHz,32bit,1.8V/1.2V,216BALL

FBGA(POP), Channel B,Terminal Dedicated

U1401 40060454 NAND FlASH,4GB EMMC

V4.5,52MHz,1024KB,3.3V/1.8V,FBGA153(Pb-free),W Dedicated,Terminal

Dedicated

U1403 39110756 Switching Regulators,DC/DC buck,2.5V~5.5V,Voadj,1.2A,DFN/QFN

U1701 39200436 AUDIO CODEC DEVICE-WCD9304,1.2/1.8/2.2/3.8V,WLNSP

U2001 39110626 Switching Regulators,Vin~38V,0.02A,QFN-2*2,SMT,2*2,10 LED

Driver,Terminal Dedicated




9

Position NO. Part Number Description

U2102 39110620 Power Driver,1.5A LED flash driver IC,CSP,Terminal Dedicated

U2201 38140098 Semiconductor Sensor,Accelerometer,LGA,3axis,Terminal Dedicated

U3201 47140071 RF

Switch,700MHz~2600MHz,SP10T,<4.3dB,<3.0,12dB.,LGA20H-0303B,Ter

minal Dedicated,Antenna Port:8kV @Contact discharge

U3301 47100500 RF Power Amplifying Module,1920MHz~1980MHz,29.5dB

max.,28.25dBm,QFN,Terminal Dedicated

U3302 13080038 Duplexer,RX:2110~2170MHz/TX:1920~1980MHz,1.9dB(max),2.6dB(max)

,55dB/46dB(min),2.5*2.0*0.9mm, Teminal Dedicated

U3601 47100437 RF Power Amplifying

Module,824~849;880~915;1710~1785;1850~1910,26dB,33dBm,LGA,500V

U3701 39110733 Switching Regulators,0.4~3.4V,<3%,2.5A,WLCSP,SMT,1.75mm x

1.75mm,Terminal Dedicated

U4001 39200417 Terminal Baseband process IC,WCDMA/CDMA/TDSCDMA/GSM

Transceiver WTR1605,1.0~3.3V,BGA

U4101 47100551 RF Power Amplifying Module,880~915MHz,31dB max. at

Pout=28.5dBm,28.5dBm,QFN,Terminal Dedicated, APT

U4102 13080104 Duplexer,TX:880MHz~915MHz/RX:925MHz~960MHz,3dB.,3dB.,55dB/50

dB.,2520,Terminal Dedicated

U5001 39210028 Terminal Baseband process IC,2.4/5GHz WLAN/Bluetooth 4.0/FM Single

chip-WCN3660,1.2~2.9V,79B WLNSP(Pb-free),Terminal Dedicated

U7001 47090053 RF LNA,1575MHz,14dB min.,1.6dB max.,SOT886,Terminal Dedicated

X202 12020215 Crystal Unit,19.2MHz,7pF,+/-10ppm,70ohm,2.5*2.0*0.9mm,NTC

internal,Terminal Dedicated

X601 12020171 Crystal Oscillator,27MHz,12pF,20 ppm,50ohm,3225

Z2301 15040393 Transient Suppression Diode,6V,25V,0.1w,3A,400um 15pin SMT,Terminal

Dedicated

Z5101 13030068 Ceramic Filter,2450MHz,2.0dB,20125,Terminal Dedicated

Z7001 13010264 SAW Filter,1590.16MHz,1.8dB,50V,1411,Terminal Dedicated

W1-U00 Maintenance Manual 5 Software Upgrade



10

5 Software Upgrade

5.1 Upgrade Preparation

Prepare the items listed in Table 5-1 for a software upgrade.

Table 5-1 Preparation items

Item Description Remarks

Upgrade

environment

Computer Operating system: Windows 2000, Windows

XP, or Windows 7

USB cable BOM: 02450768

Upgrade driver

Upgrade tool WH62406270ML01Ver1006

Battery The included battery

Upgrade file U8835_V100R001C1

7B050SP03

This version is provided for reference only.

Please download the latest version when

upgrading the software.




11

5.2 Hardware Connection

Figure 5-1 shows the hardware connection for W1-U00 upgrade.

Figure 5-1 Hardware connection for W1-U00 upgrade

便携机 1 PC

W1-U00USB cable

Computer

To enter the upgrade home screen:

1. Connect the W1-U00 to a computer using the USB cable, as shown in Figure 5-1.

2. Run the program WH62406270ML01Ver1006.

A dialog box shown in Figure 5-2 is displayed.

Figure 5-2 LOGIN dialog box

3. Enter the password (the initial password is Huawei).

You can then log in to the software, and the dialog box shown in Figure 5-3 is displayed.




12

Figure 5-3 Select Bin File dialog box

4. Specify the upgrade type, BIN file, and configuration file.

− To perform a second upgrade, select Allow upgrade for the Second time under Be

cautious to select. The W1-U00 already programmed will be upgraded again.

Do not select this option if the programming is performed after PCB surface mounting. Before you

use this tool to perform upgrade, ensure that the PCBA is loaded with the boot software through the

joint test action group (JTAG) port and has no applications.

Select this option if common upgrade for integrated units is performed after product label printing.

Otherwise, you cannot load the software.

If you change this option, the no variable (NV) value will be affected after the software is loaded,

and you are prompted to confirm your operation.

− To specify the upgrade file, select Firmware under Please Select File.

− To specify the configuration file, select Please Choose The Configuration File,

click , and select the required file.

The upgrade tool is equipped with a default configuration file

PhoneMultiUpgradeDefaultCfg.xml (which may not be available for Windows Phone

and certain phones. In this case, customize a configuration file for them). The

configuration file is stored in the directory of the executable file

WH62406270ML01VerXXXX (XXXX indicates the version number of the upgrade

tool).

5. Click Next.

The upgrade home screen is opened.

To cancel upgrade or exit, click Cancel.




13

5.3 Upgrade Home Screen

After you click Next, the screen shown in Figure 5-4 is displayed.

Figure 5-4 Upgrade home screen

5.3.1 Scan && Download Button

Before you load the software, make sure that the port of a phone is correctly mapped. After

you click Scan && Download, the load software searches for the port correctly mapped (the

port name is set in the configuration file) in the device manager of the computer and starts to

download the upgrade software, as shown in Figure 5-5. When a port is found, its port number

is displayed in the list box. You can click Scan && Port several times until the ports of all

the UE are found.

Figure 5-5 Upgrade process




14

Do not close the window forcibly during the upgrade. Otherwise, the dialog box shown in

Figure 5-6 will be displayed.

Figure 5-6 NewMultiDownload dialog box

Do not terminate the MultiDownload software forcibly during the upgrade using Windows

Task Manager or other methods. Otherwise, the tested boards may get damaged.

For certain products, the NV value does not need to be recovered.

Figure 5-7 shows the process of recovering the NV value.

Figure 5-7 Recovering the NV value

Figure 5-8 shows the download success.




15

Figure 5-8 Download success

5.3.2 Remove Devices Button

Only when all phones are upgraded, you can click Remove Devices to remove a phone.

After you click Remove Devices, the current information will be cleared so that a next

upgrade can be performed.

5.4 Upgrade of Multiple Phones

To upgrade multiple phones at a time:

1. Ensure that the port of each phone is mapped in the device manager of the computer.

2. Click Scan && Download to search for phone ports.

If certain ports are not found, click this button repeatedly. The upgrade progresses of

different phones may vary. You can remove an upgraded phone to release a port for

another phone not upgraded. Before doing this, ensure that the compute will not break

down after you hot swap the phone (especially in the case of multiple phones).

3. Connect a phone not upgraded to the computer.

4. After the port of the phone is correctly mapped, click Scan && Download.

The upgrade for the phone then starts. Other phones that are upgrading will not be

affected.




16

5.5 Precautions

Select the upgrade type shown in Figure 5-9 with caution (very important).

Figure 5-9 Second upgrade

The option Allow upgrade for the Second time indicates whether a second upgrade for a

phone is allowed. When it is selected, the phone that is already programmed with software

will be upgraded again.

For the phone that loads the boot software through the JTAG port and then loads software using a USB,

use this tool to load the software but do not select Allow upgrade for the Second time. Before using

this tool for upgrade, ensure that a PCBA is loaded with the boot software through the JTAG port and

has no applications. Otherwise, "Refuse Download In AMSS Fail" is displayed and the load fails. If this

option is selected due to misoperation, a faulty phone may be produced in follow-up workstations.

Select this option if common upgrade for integrated units is performed after product label

printing. Otherwise, the software upgrade fails ("Refuse Download In AMSS Fail" is

displayed). The software in the PCBA automatically backs up the current NV value before

upgrade and recovers it after upgrade. In addition, the NV data will be recovered after a USB

or microSD upgrade and stored in the PCBA's NV backup area. When you change this option,

you are prompted to confirm your operation. In this case, ensure that your operation is correct.

5.6 Upgrade Software Classification

There are two types of software for upgrading multiple phones at a time: programming

software (which are already not used to program smart phones) and upgrade software. The

operating screens of the two types of software are the same. Only the prompting messages are

different. Accurately differentiate the two during use. Otherwise, the production line may stop

running or an accident may occur. (Upgrade software must be initialized by production

engineers (PEs). Operators must not take the liberty to load this software. Do not close it if no

abnormality occurs.)




17

5.7 Window Phone Upgrade Package

Pay attention to the following items when you upgrade a Windows Phone:

Upgrade an earlier version to the same or a later version.

Do not roll back the version.

Upgrade a version without the secure boot function to one with the secure boot function.

(This upgrade may result in risks. Do not perform such an upgrade for the W1-U00 of

versions earlier than VN2.)

Do not upgrade a version with the secure boot function to one without the secure boot

function.

The Windows Phone provided to technical service engineers must be a retail version

with the secure boot function enabled. For other versions, use this tool to perform

upgrade with caution.

W1-U00 Maintenance Manual 6 Maintenance Tools



18

6 Maintenance Tools

Table 6-1 lists the maintenance tools.

Table 6-1 Maintenance tools

Name: constant-temperature heat gun

Usage: heats components

Name: constant-temperature heat gun

Usage: heats components

Name: soldering iron

Usage: solders components

Name: DC power supply

Usage: powers the device

Name: soldering fixture

Usage: secures the PCBA

W1-U00 Maintenance Manual 6 Maintenance Tools



19

Name: lead-free solder wire

Usage: solders material

Name: digital multimeter

Usage: for measurement

Name: toolkit

Usage: for assembly and disassembly

Name: electronic screwdriver

Usage: tightens and loosens screws

W1-U00 Maintenance Manual 7 Disassembly Procedure



20

7 Disassembly Procedure

Figure 7-1 shows the disassembly procedure.

Figure 7-1 Disassembly procedure

2. Prepare the phone to be disassembled.

1. Wear an ESD wrist.




21

6. Remove the antenna and speaker.

5. Use a hexagon screwdriver to remove the eight

screws.

4. Remove the battery.

3. Remove the battery cover.




22

10. Remove the coaxial cable on the PCBA.

9. Remove the coaxial cable on the USB board.

8. Remove the aluminum alloy front cover assembly.

7. Separate the front cover from the touch panel and

LCD assembly.




23

14. Remove the PCBA.

13. Lift the PCBA.

12. Loosen all card covers.

11. Loosen the primary FPC, receiver's FPC, touch

panel and LCD assembly's FPC, and camera's FPC




24

18. End.

17. Remove the USB board from the primary FPC.

16. Lift the USB's FPC.

15. Remove the camera.

W1-U00 Maintenance Manual 8 Assembly Procedure



25

8 Assembly Procedure

Figure 8-1 shows the assembly procedure.

Figure 8-1 Assembly procedure

4. Install the FPCs of the receiver and power key.

3. Install the receiver.

2. Install the primary FPC.

1. Wear an ESD wrist.




26

8. Install the PCBA into the front cover.

7. Attach the water-indicating label and connect the

coaxial cable.

6. Install the front camera.

5. Install the FPC of volume keys.




27

14. Install the FPC of the camera flash.

13. Install the Wi-Fi and Bluetooth antenna.

12. Arrange and connect the coaxial cable to the USB

board.

11. Install the USB board.

10. Install the rear camera.

9. Connect the primary FPC, receiver FPC, and touch

panel FPC to the mother board.




28

20. Fasten 11 screws on the back cover.

19. Install the GPS antenna properly.

18. Install the antenna support with a speaker.

17. Attach a water-indicating label onto the antenna

support.

16. Install the speaker onto the antenna support.

15. Assemble the front cover.




29

24. End

23. Install the battery cover.

22. Put the battery in the battery compartment.

21. Attach the product label.

W1-U00 Maintenance Manual 9 Principles and Failure Analysis



30

9 Principles and Failure Analysis

9.1 W1-U00 Framework

The W1-U00 is a bar-type phone that consists of the PCBA, battery, and mechanical part. A

PCBA consists of the mother board (M board), proximity sensor and receiver board (S board),

antenna board (K board), FPC board (L board), LCD module, touch panel module, 5 MP rear

camera module, 0.3 MP front camera module, mechanical part, and antenna.

Figure 9-1 shows the W1-U00 framework.

Figure 9-1 W1-U00 framework

A mother board is the core board that controls the baseband, RF, and other boards.




31

9.2 Block Diagram

Figure 9-2 shows the block diagram of the W1-U00.

Figure 9-2 Block diagram of the W1-U00

The MSM8230 is the baseband signal processing chip that processes the input and output of

signals, such as IMAGE, VIDEO, AUDIO, RF INTERFACES, and CONECTIVITY. The

MSM8230 also provides ports including the keypad, LCD, microSD card, Bluetooth, camera,

and microphone ports. The PM8038 provides the analog multichannel switch, real-time clock

circuit, temperature compensated crystal oscillator (TCXO) circuit, motor-driven circuit, and

programmable current source. The WTR1605 is the RF signal processing chip that processes

uplink and downlink wavelength division multiple access (WDMA) RF signals.




32

9.3 PCBA Functions

Based on the functions, the PCBA can be divided into four subsystems: baseband, RF, power,

and user interfaces. Table 9-1 describes the modules and units subordinated to each subsystem

and their functions.

Table 9-1 Modules and units subordinated to each subsystem and their functions

Subsystem Module Unit Description

Baseband MSM8230 Modem

subsystem

Two QDSP6 V4 as the modem processor, which runs at

speeds of up to 500 MHz and modulates and

demodulates the long term evolution (LTE), CDMA,

WCDMA, GPS, and GSM. Includes the ARM9

processor, modem DSP, modem advanced high

performance bus (AHB), interruption controller, and

hibernation controller.

Application

subsystem

Dual Krait processor (up to 1.0 GHz) and QDSP6 V4

processor, supporting function modules, such as the

microSD card, EBI2, UART/USIM, I2C, GPIO, and

clock.

User interface

processing unit

Interfaces of the Camera, PCM, broadband codec,

vocoder, RF, HKADC, LCD, microSD card, USB,

UART card, USIM card, SBI, GPIO, JTAG/ETM, and

keypad

Multimedia and

game engines

Includes the MPEG/JPEG hardware engine, game

engine, Java accelerator, and MP3/MMS/MIDI

functions.

PM8038 Power supply

voltage

monitoring

Lists the monitored items, such as the external power

supply, lithium-ion polymer battery, button battery,

VDD, and important LDOs.

Temperature

monitoring

Battery temperature and polyamide bar (PA)

temperature

Battery ID Distinguishes batteries made by different manufacturers.

Charge and discharge algorithms for software are

realized based on the battery distinguishing signals.

eMMC NAND features,

power

consumption, and

supporting

system files

Stores applications and NV values, 4 GB (2 x 16 Gbit)

LPDDR2RAM PoP

encapsulation, in

the MSM8230

RAM for program running, 4 GB (128 MB x 32)




33


RF GPS GPS reception GNSS, Gps® engine Gen 8 A

Receives and processes GPS signals, includes RTRLTN

and peripheral circuits.

Bluetooth

interface

Bluetooth

module

Bluetooth baseband and RF signal sender and

transceiver, comprised of WCN3660 Bluetooth and

peripheral circuits

Wi-Fi interface Wi-Fi module Wi-Fi baseband and RF sender and transceiver,

comprised of the WCN3660 chip's Wi-Fi part and

peripheral circuits

Oscillator and

frequency

synthesizer

VCTCXO and

MSM control

circuits

Provides high precision 19.2 MHz local clock

TCXVCO.

Antenna Antennas,

internal

interfaces, and

antenna

protective units

Built-in antenna supporting WCDMA at high and low

frequency bands; The antennas include a main antenna,

Wi-Fi/Bluetooth antenna, and GPS antenna.

Coupler Power coupler Couples part of the output power to the RTRLTN chip

for power test.

User

interfaces

UART interface The UART interface in the MSM8230 subsystem is

used for Bluetooth.

USB interface Driver, protective

circuits, and

output interface

units

Include the peripheral circuit, protective circuit, and

interface connector of the USB interface in the

MSM8230 subsystem. The USB interface is a main data

service channel for an engineering prototype and is also

used for commissioning and test during the R&D

process.

USIM card

interface

Power supply,

protective circuit,

USIM socket

USIM card slot and related connected circuits.

Keypad and

backlight

Keypad drive

circuit, external

keypad, LED

backlight control

circuit

The volume key is monitored using the interruption

monitoring method through the GPIO. When users press

the volume key, the two top view LED backlights are

on.

Color LCD and

backlight

LCD driver,

interface mode,

and backlight

control

16 MP main screen with a 480 x 800 dot matrix.

The LCD backlight brightness is controlled using the

content adaptive brightness control (CABC) function.

microSD card Power supply,

protective circuit,

and connector

Mainly refers to the microSD card connector and

relevant interface circuits.




34


Speaker Drive mode,

connection mode,

and speaker

related

components

Plays polyphonic ringtones when a call is received. Its

power is up to 500 mW (class AB). Features good

frequency response to play 20-20kHz audio, and can

also be used as a mono speaker to play MP3.

Receiver Drive mode,

connection mode,

and receiver

related

components

Power < 70 mW

Microphone Interface circuit,

connection mode,

and microphone

related

components

Built-in microphone

Dual microphones for noise reduction

Earphone Headset, headset

interface circuit,

and microphone

interface circuit

The phone provides headset interface for call output or

MP3 output while the microphone is set on the earphone

line to transmit the sound to the phone.

Vibrator

interface

Drive mode,

connection mode,

and vibrator

Vibrates when a call is received.

Accelerometer Controlled by the

I2C interface

The acceleration sensor is an auxiliary module of the

game engine.

Compass Controlled by the

I2C interface

Implements auxiliary functions, such as digital compass.

Power

Supply

Internal backup

battery

Li-on battery and

interface related

components

The nominal output of Li-ion battery is 3.7 V/1650 mAh

with the number of charging/discharging times over

500. The Li-ion battery must meet GB18287 Safety

Requirements (Lithium Ion Battery).

External power

supply (travel

charger)

Power adapter

and interface

related

components

The charger with 90–240 V, 45–55 Hz input can be used

in China, Europe, America, and Australia. The output

voltage of the charger is 5±0.25 V. The travel charger

must pass the CE and China Compulsory Certifications.

The output current must be able to supply power to

charging and the phone's normal running.

Power

distribution

network and

power

management

function

Power

distribution

network

Includes all filtering networks and cables.

Backup battery

management,

charging circuit,

charging mode,

over charge

protection

Manages battery charging and discharging, protects the

battery from being over-charged and over-discharged,

and charges the capacitor that maintains the RTC

current.




35


Power

management of

circuits

(power-on and

power-off

analysis)

Mainly indicates LDO, which manages power supply

flexibly. The PCBA software manages power supplies

to circuits on the PCBA according to service status,

protocols, or power-saving analysis to decrease the

phone's power consumption. A 32.768 kHz sleep clock

is provided.

PM8038's

enhanced

functions

RTC The PM8038 has a built-in RTC circuit, which uses a

32.768 kHz sleep clock that provides precise time.

HKADC 16 channels of analog signals multiplex are supported

and a channel of signals is output to MSMS8230 for

ADC sampling.

TCXO diver and

its control

The PM8038 provides a built-in TCXO driver to output

sine wave, thereby outputting applicable rectangular

wave.

UVLO Low-voltage power-off function. When the input

voltage is lower than the threshold for a certain period,

the phone is powered off.

WDT reset Supports WDT counter overflow reset function.

Over-temperature

protection

When the on-chip junction temperature is over 150°C,

the phone powers off.

Internal driver

circuits

Provides four LED drivers, one oscillator driver, and

one speaker driver.

Interruption

management

There is an embedded interrupt manager to process the

related interrupt signals.

USB driver There is an embedded OTG USB driver supporting USB

2.0 HS. The interface is of /B type. The software does

not support OTG function now.




36

9.4 Baseband Subsystem

9.4.1 Power-on Timing Diagram

Figure 9-3 shows the power-on timing diagram of the PM8038.

Figure 9-3 Power-on timing diagram of the PM8038

The PM8038 will generate interrupt signals when KYPD_PWR_N is pulled down. This

allows the PM8038 to power on signals in the sequence shown in Figure 9-3, while the

signals are powered off in the reversed sequence. In other words, the power-off starts with the

PS_HOLD signal.

9.4.2 MSM8230 Memory Interface

The MSM8230 supports the package-on-package (PoP) memory LPDDR2 SDRAM and the

external flash memory eMMC NAND. Figure 9-4 shows the memory interfaces of the

MSM8230 provided by Qualcomm, which include:

PoP LPDDR2

External embedded multimediacard (eMMC) chip connected to SDC1

microSD card connected to SDC3




37

Figure 9-4 Memory interfaces of the MSM8230 provided by Qualcomm

LPDDR2 connects to the MSM8230 through the 32-bit external bus interface (EBI). The

MSM8230 uses the EBI1 bus that provides clock frequencies of up to 400 MHz and memory

spaces of up to 1 GB.

Qualcomm recommends three types of PoP LPDDR2 controlled using chip selection (CS)

signals of the EBI1. Figure 9-5 shows the EBI's memory configuration solutions.

Figure 9-5 EBI's memory configuration solutions

The MSM8230 supports the eMMC and microSD cards, and provides sensor data record

(SDR) clock rates of up to 104 MHz and dial-on-demand routing (DDR) clock rates of up to

52 MHz. The eMMC and microSD cards connect to the MSM8230 respectively through the

SDC1 interface and SDC3 interface. The W1-U00 supports microSD cards of up to 32 GB.

Figure 9-6 and Figure 9-7 show the circuit diagrams of eMMC and microSD card interfaces.




38

Figure 9-6 Circuit diagram of the eMMC card interface

Figure 9-7 Circuit diagram of the microSD card interface




39

9.4.3 LCD and Touch Panel

The W1-U00 adopts the one glass solution (OGS) technology to bound the LCD and touch

panel. The LCD is a thin film transistor (TFT) module that supports mobile industry processor

interfaces (MIPIs) and features:

Dot matrix: WVGA (480 x 800)

Color: 16.7 MP

Figure 9-8 shows the conceptual diagram of the MSM8230 and LCD interfaces.

Figure 9-8 Conceptual diagram of the MSM8230 and LCD interfaces

The W1-U00's LCD uses the MIPI-DSI interface, requiring only two pairs of low-voltage

differential signaling (LVDS) cables and one pair of power cables. The LCD interface

supports 60 Hz refresh rate. The LCD interface features the frame synchronization function

and uses GPIO_0's MDP_VSYNC_P as the data transmission synchronization signal,

protecting the LCD from being cracked. The LCD uses the TPS61160A backlight control chip.

The input voltage of this chip ranges from 2.7 V to 18 V and the output voltage reaches up to

38 V, which can supply power for 10 serially connected LED lights. Table 9-2 describes the

key pins of the TPS61160A chip.

Table 9-2 Key pins of the TPS61160A chip

Type Description NETS MSM8230 GPIO/PM8038 MPP

Power supply Digital power input VREG_L11_1P8 VREG_L11_1P8 (PM8038)

Digital power input VREG_L12_2P85 VREG_L9_2P85 (PM8038)

Signal cable MIPI signal cable MIPI_DSI_LANE1_P_A MIPI_DSI_LANE1_P

MIPI signal cable MIPI_DSI_LANE1_N_A MIPI_DSI_LANE1_N

MIPI signal cable MIPI_DSI_LANE2_P_A MIPI_DSI_LANE2_P

MIPI signal cable MIPI_DSI_LANE2_N_A MIPI_DSI_LANE2_N

Synchronization

signal

Frame synchronization

clock

MDP_VSYNC_P GPIO0

clock signal MIPI clock MIPI_DSI_CLK_P_A MIPI_DSI_CLK_P




40

Type Description NETS MSM8230 GPIO/PM8038 MPP

MIPI clock MIPI_DSI_CLK_N_A MIPI_DSI_CLK_N

Control signal Reset signal MIPI_DSI0_RESET_N GPIO58

Identity signal LCD model

identification

LCD_ID0 GPIO93

Backlight signal Anode of the backlight

LED

LED_A Anode of the backlight LED

Cathode of the backlight

LED

LED_K Anode of the backlight LED

Control signal of the

panel's output brightness

PWM_OUT

Control signal of the

system's output

brightness

LCD_BL_PWM GPIO1 (PM8038)

VPH_PWR supplies power to the backlight driver chip of the W1-U00. The input signal

PWM_OUT of the CTRL pin controls the output voltage of VPH_PWR. PWM_OUT is a

backlight automatic control signal delivered by the LCD module based on the CABC

principle. Figure 9-9 shows the circuit diagram of the LCD interface and backlight driver.

Figure 9-9 Circuit diagram of the LCD interface and backlight driver




41

9.4.4 Camera Interface

The 5 MP rear camera uses the 24-pin BTB connector and is controlled by the I2C bus. Data

communication is implemented through the MIPI.

Table 9-3 describes the interfaces of the 5 MP rear camera.

Table 9-3 Interfaces of the 5 MP rear camera

Type NETS MSM8230 GPIO/PM8038 MPP

Voltage Connector Serial Number

Remarks

Camera

power

CAM_VIO VREG_LVS1_1P8(P

M8038)

1.8 V 6, 8 0.750 V to 3.050 V

CAM_AVDD VREG_L8 (PM8038) 2.85 V 22 0.750 V to 3.050 V

VREG_L8_2V8 VREG_L8(PM8038) 2.85 V 3 1.500 V to 3.050 V

Clock CAMIF_MCLK GPIO5 1.8 V 16 Camera reference

clock

MIPI_CSI0_CLK_

P

MIPI_CSI0_CLK_P 1.8 V 13

MIPI_CSI0_CLK_

N

MIPI_CSI0_CLK_N 1.8 V 11

Data line MIPI_CSI0_LANE

0_P

MIPI_CSI0_LANE0_

P

1.8 V 17 Data line

MIPI_CSI0_LANE

0_N

MIPI_CSI0_LANE0_

N

1.8 V 15

MIPI_CSI0_LANE

1_P

MIPI_CSI0_LANE1_

P

1.8 V 21

MIPI_CSI0_LANE

1_N

MIPI_CSI0_LANE1_

N

1.8 V 19

I2C

control

signal

I2C3_SCL GPIO21 1.8 V 7 I2C control signal

I2C3_SDA GPIO20 1.8 V 5

Control

signal

MCAMIF_SHDN GPIO54 1.8 V 10 Close-up signal

MCAMIF_ID GPIO55 1.8 V 2 Module supplier

identification

MCAMIF_RESET GPIO107 1.8 V 12 Reset signal

CAM_VCM_PD_N GPIO13 1.8 V 4 Camera motor

control

Ground GND 0 V 1, 9, 14, 18, 24 Ground signal




42

Figure 9-10 shows the circuit diagram of the 5 MP rear camera.

Figure 9-10 circuit diagram of the 5 MP rear camera

The 0.3 MP front camera is also controlled by the I2C bus, and data communication is also

implemented through the MIPI.

Table 9-4 describes the interfaces of the 0.3 MP front camera.

Table 9-4 Interfaces of the 0.3 MP front camera

Type NETS MSM722A GPIO Voltage Connector Serial Number

Remarks

Camera

power

VREG_VIO VREG_S3(PM8038) 1.8 V 6 0.750 V to 3.050 V

VREG_VIO VREG_S3(PM8038) 1.8 V 8 0.750 V to 3.050 V

VREG_AVDD VREG_L17(PM8038) 2.85 V 22 1.500 V to 3.050 V

Clock CAMIF_MCLK GPIO15 1.8 V 16 Camera reference

clock

MSM8230 ->

Camera

MIPI_CSI1_CLK_

P

MIPI_CSI1_CLK_P 1.8 V 13

MIPI_CSI1_CLK_

N

MIPI_CSI1_CLK_N 1.8 V 11

Data line MIPI_CSI1_LANE

0_P

MIPI_CSI1_LANE0_

P

1.8 V 17

MIPI_CSI1_LANE

0_N

MIPI_CSI1_LANE0_

N

1.8 V 15 Data line

I2C I2C3_SCL GPIO21 1.8 V 7 I2C control signal




43

Type NETS MSM722A GPIO Voltage Connector Serial Number

Remarks

control

signal I2C3_SDA GPIO20 1.8 V 5

Control

signal

SCAMIF_SHDN GPIO14 1.8 V 10 Close-up signal

SCAMIF_ID GPIO75 1.8 V 2 Module supplier

identification

SCAMIF_RESET GPIO76 1.8 V 12 Reset signal

Ground GND 0 V 1, 9, 14, 24 Ground signal

Figure 9-11 shows the circuits of the 0.3 MP front camera.

Figure 9-11 Circuits of the 0.3 MP front camera

The W1-U00's camera flash chip is controlled by IIC and delivers currents of up to 1.5 A. The

camera flash's charge pump chip is driven by the TPS61310YFFR. The output current and

switch of the TPS61310YFFR are respectively controlled by IIC and FLASH_EN GPIO27

(MSM7627A). When the switch of the TPS61310YFFR is turned on, GPIO27 (MSM8230) is

switched to 1. STRB0 GPIO117 (MSM7627A) can adjust the LED status (blinking or steady

on). GPIO117 is set to 1 when the camera flash blinks and to 0 when the camera flash is

steady on.

Figure 9-12 shows the circuits of the camera flash.




44

Figure 9-12 Circuits of the camera flash

LED1/2/3: return current pins of external LEDs, which are used to adjust LED currents. The

currents of LED1 and LED3 are controlled by the same register (the maximum current is 400

mA). The current of LED2 is controlled by an independent register (the maximum current is

800 mA).

NRESET: chip reset signal. A chip is restored to factory settings when the signal is at low

level. For the W1-U00, the signal is designed to be at high level.

STRB0: enabling signal of LED1/2/3 pins, which controls LED switches. An LED switch is

turned on when the signal is at low level and turned off when the signal is at high level. You

can also control the LEDs using software.

STRB1: controls the switch between camera flash mode and flashlight mode. The W1-U00

operates in camera flash mode when the signal is at low level and in flashlight mode when the

signal is at high level. You can also use software to set the switch between camera flash mode

and flashlight mode. If the STRB1 signal is at low level, the watchdog is enabled to restrict

the duration for security control when the camera flash is on. The camera flash turns off after

being on for 13 seconds. I2C refreshes the register for once before the camera flash turns off.

SDA/SCL: I2C's data and clock signal cables, which are used to configure registers to control

LED switches, camera flash current and duration, output voltage, and chip mode.

TX_MASK: This pin can be pulled up to switch camera flash mode to flashlight mode to

reduce power consumption of PA. You can also use software to pull up this pin. It can be

floated when not in use.

INDLED: a pin that provides a steady current to drive LED indicators. It can be floated when

not in use.

GPIO/PG: general purpose I/O port pin or Power-Good signal pin (the output voltage is in the

specified range). They can be floated when not in use.

TS: temperature detection pin, which is connected to AVIN or floated when not in use. To use

this pin, connect a negative temperature coefficient (NTC) resistor to the ground to detect the

LED temperature. For the W1-U00, this pin is not used.

SW1/SW2: connected to an inductor to be used by the boost converter in the chip.




45

9.4.5 Wi-Fi and Bluetooth Interface

The W1-U00 uses a Qualcomm chip that integrates Bluetooth, Wi-Fi, and FM and supports 5

GHz WLAN and 2.4 GHz WLAN, Bluetooth, and FM.

1. Power supply

Figure 9-13 shows the WCN3660's power supply conceptual diagram. VREG_L1_1P3 is

the operating power supply of the WCN3660 and supplies power only to the WCN3660.

Table 9-5 describes the power supplies' network names and power supplying directions.

Figure 9-13 WCN3660's power supply conceptual diagram

Table 9-5 Power supplies' network names and power supplying directions

Type NETS Power Supplying Direction PM8038

Operating power supply VREG_L1_1P3 From PM8038 to WCN3660 VREG_L1_1/2

PA power supply VREG_L10_3P0 From PM8038 to WCN3660 VREG_L10

XO power supply VDD_XO_1P8 From PM8038 to WCN3660 VREG_L4

IO power supply VDD_IO_1P8 From PM8038 to WCN3660 VREG_L11

2. Communication module

The WCN3660 chip communicates with the primary chip using three buses: SSBI, I/Q,

and SD. SSIB and I/Q high-rate signal cables use Qualcomm's self-defined bus

protocols.

Figure 9-14 shows the circuit diagram of the communication module.




46

Figure 9-14 Circuit diagram of the communication module

9.4.6 USIM and microSD Card Interfaces

1. USIM card interface

Figure 9-15 shows the circuit diagram of the USIM card interface.




47

Figure 9-15 Circuit diagram of the USIM interface

The MSM8230 supports two UIM cards. The W1-U00 uses only UIM1 card, which

supports 1.8 V and 2.85 V UIM cards. VREG_L15 supplies power to UIM cards. When

detecting a UIM card, VREG_L15 is pulled to 1.8 V. If the USIM card supports 1.8 V,

VREG_L15 keeps 1.8 V. If not, VREG_L15 is pulled to 2.85 V to supply power to the

USIM card.

UIM1_CLK, UIM1_REST, and UIM1_DATA (two-way transmission) are respectively

the clock, reset, and data signals of a UIM card. They are directly connected to the

MSM8230. The UIM1_DATA signal is pulled up to connect to VREG_L15. A UIM card

is frequently inserted into or removed from the SIM card slot. Therefore, a TVS tube is

added to provide ESD and surge prevention.

To support NFC functions, pin 5of the UIM card is connected to the SWIO pin of the

NFC chip. In this case, the data in the NFC chip can be stored in the EEPROM of the

UIM card using the SWIO pin.

2. microSD card interface

The MSM8230 provides five microSD interfaces. SDC3 is the dedicate interface of a

microSD card. In Ascend W1, SDC3 connects to the microSD card connector, as shown

in Figure 9-16.




48

Figure 9-16 Circuit diagram of the microSD card interface

SDC3_CLK and SDC3_CMD are respectively the clock and command signals of the

microSD card. SDC3_DATA0 to SDC3_DATA3 are four data lines. SD_DETCT is used

to detect whether a microSD card is inserted or removed. SD_DETCT has a 1 Mohm

pull-up resistance. The MSM8230 can detect the insertion of a microSD card if

SD_DETCT is pulled down after the microSD card is inserted.

9.4.7 Headset Interface

The headset of the W1-U00 uses a 3.5-mm 5-way jack. Figure 9-17 shows the circuit diagram

of the headset interface.

Figure 9-17 Circuit diagram of the headset interface

The headset interface consists of the left and right sound channels, microphone, and reference

ground and uses the LRGM wire sequence, an American-style headset wire sequence used

currently.

Because the headset jack is not on the PCBA, a TVS tube is added to provide ESD and

overvoltage protection.




49

The detection by plugging in or unplugging the headset must be analyzed based on the

functional diagram of the WCD9304, as shown in Figure 9-18.

Figure 9-18 Architecture diagram of the WCD9304 about headset and headset key detection

In the WCD9304, HPH_LP and the current source L2 are connected in parallel. When no

headset is plugged in, L2 operates, the corresponding Schmitt trigger is not triggered (at high

level), and no interrupt signal is generated. When you plug in a headset, the HPH_LP signal is

pulled down to a low level due to low headset impedance. As a result, the corresponding

Schmitt trigger is triggered, and interrupt signals are generated (falling edge). The plugging

interrupt signals of the headset are then detected. When you unplug the headset, rising edge

interrupt signals are generated on the HPH_LP's Schmitt trigger. The unplugging interrupt

signals of the headset are then detected. The plugging detection can also be implemented by

connecting the headset's pin4 (HS_DETECT) to the GPIO_37 pin of the MSM8230.

The detection of an active sound box may fail because the HPH_LP signal cannot be pulled

down to a low level due to high impedance of the active sound box. In this case, use the

HS_DETECT signal for detection.

Headset key detection: After detecting that a headset is plugged in, the current source L1 that

is in parallel connected to the MIC_BIAS port in the WCD9304 will generate a pulse

(amplitude: 1.8 V, cycle: 100 ms). After certain voltage generated by the pulse is divided by

MIC_BIAS's 2.2K pull-up resistance and headset microphone's internal resistance, the

MBHC_IN pin obtains a pulse with the amplitude of 1.1 V and the cycle of 100 ms. When

this pulse is enabled, the system starts to detect L1's Schmitt trigger. When you press a




50

headset key, the Schmitt trigger is pulled down to a low level, generating key interrupt signals.

For the MBHC function, a headset key is not directly connected to the ground. The ground

resistance of each key varies. In addition to triggering the Schmitt trigger and generating

interrupt signals, the operation on different keys can be detected based on ADC values

obtained by the MBHC_IN pin.

9.4.8 Electric Acoustic Interface and Audio Codec Solution

1. Classifications of electric acoustic interfaces

Electric acoustic interfaces include:

− Speaker: Plays polyphonic ringtones when a call is received. Its power is up to 500

mW. With good frequency response, the speaker is able to replay 20-20 kHz music as

well as play MP3 in single audio channel.

− Receiver: the earpiece for calling

− MIC: built-in microphone of a phone

− Earphone: Supports sound output during calling and the playback of audio in .mp3

format. The microphone is set on the earphone line to transmit the sound to the phone.

The headset supports single-end stereo amplifier.

2. MSM8230's electric acoustic interfaces

Functions of MSM8230's electric acoustic interfaces are implemented by the

corresponding codec chip WCD9304, as shown in Figure 9-19.

Figure 9-19 Circuit diagram of MSM8230's electric acoustic interfaces

The codec chip implements voice and data communication with the MSM8230 through

the SLIMbus interface (the I2S interface is not supported). The codec chip consists of:

− Four analog input interfaces and five analog output interfaces

− Four ADC converters and five DAC converters

− Four digital microphone input interfaces (two pairs of data and clock interfaces)




51

The codec chip supports the MBHC function, which can be used to detect the following:

− Whether a headset is plugged in or unplugged.

− Whether a headset is equipped with a microphone.

− Up to eight keys of a headset.

Figure 9-20 shows the functional modules of the codec chip.

Figure 9-20 Functional modules of the codec chip

3. Detailed information about electric acoustic interfaces

− Speaker

The speaker adopts the class-D audio amplifier of PM8038. The W1-U00 has only

one speaker for differential mono input and mono audio output. The WCD9304

delivers LINE_OUT1 and LINE_OUT2 signals to the PM8038 to drive the speaker.

Figure 9-21 shows the signal connection on the WCD9304.

Figure 9-21 Signal connection on the WCD9304




52

− Receiver

The WCD9304 can be connected to an 8-ohm to 32-ohm telephone receiver and is

built in with a class-G amplifier. The maximum output power is about 125 mW.

Figure 9-22 shows the circuit diagram of the WCD9304. EAR_M and EAR_P are

directly connected to the corresponding pins of the WCD9304.

Figure 9-22 Circuit diagram of the WCD9304

− Microphone

The W1-U00 uses two electrets condenser microphones (ESMs) of the same type to

reduce noise. The primary microphone is installed on the K board at the bottom of the

W1-U00 and is used for collecting audio input information. The secondary

microphone is installed on the M board in the upper area of the W1-U00 and is used

to collect environmental noises for noise reduction and echo elimination. Both

microphones use the MIC_BIAS2 delivered by the codec chip as the bias voltage.

Figure 9-23 shows the circuit diagram of the primary microphone. MIC1_P and

MIC1_N are respectively connected to the WCD9310's MIC1_P and MIC1_N pin.

Figure 9-23 Circuit diagram of the primary microphone




53

9.4.9 Keypad Interface

The W1-U00 has four physical keys: power key, camera key, volume + key, and volume – key.

The touch panel has three touch keys: search key, back key, and menu key.

The KYPD_PWR_ON signal of the power key connects to the KYPD_PWR_N pin of the

PM8038. The camera key provides two press modes: half-press mode and full-press mode.

When you press the camera key half, the CAM_HALF_PRESS_N signal is connected to the

GPIO_11 pin of the PM8038, enabling the zoom function. When you press the camera key

fully, the CAM_FULL_PRESS_N signal is connected to the GPIO_10 pin of the PM8038,

enabling the photograph taking function. GPIO is set to the input pull-up signal by default. It

will report the key information when a low level signal is detected after you press a key.

The four physical keys are connected to the PM8038's detection pins listed in Table 9-6.

Table 9-6 PM8038's detection pins

Key Detection Pin

Power key KYPD_PWR_N

Volume + key GPIO_3

Volume – key GPIO_7

Camera key 1 GPIO_11

Camera key 2 GPIO_10

Figure 9-24, Figure 9-25, and Figure 9-26 show the circuit diagrams of the volume key, power

key, and camera key respectively.

Figure 9-24 Circuit diagram of the volume key




54

Figure 9-25 Circuit diagram of the power key

Figure 9-26 Circuit diagram of the camera key

9.4.10 Battery and Charge Interfaces

Figure 9-27 shows the W1-U00's battery connector interfaces.

Figure 9-27 W1-U00's battery connector interfaces

VBAT is the battery voltage. The BATT_TEMP signal is the battery's temperature detection

output pin. VREF_THERM is the reference pull-up voltage required for temperature detection.

The battery ID of the W1-U00 cannot be detected. The BAT_ID pin for detecting the battery




55

ID is connected to a fixed voltage signal, as shown in Figure 9-28. A threshold can be set to

the battery temperature by adjusting the value of the resistance connected to the battery.

Figure 9-28 Circuit diagram of the battery interface

Charge function

The PM8038 chip supports charge using a USB or a wall charger. Figure 9-29 shows the pins

used for charge.

Figure 9-29 Pins used for charge

A USB port is also used during the wall charge for the W1-U00. Therefore, when the W1-U00

is connected to an external power supply (a wall or USB charger), the power is supplied to the

PM8038 through USB_IN. The PM8038 can then detect the current. The power is then

supplied to DC_IN through USB_OUT. The PM8038 can then detect the voltage.

2. Input power circuit

Resistance and capacitance (RC) network: There is an RC network in both the wall and

USB charger circuits. The capacitors are respectively 1.0 µF and 4.7 µF. They are used

for filtering to stabilize voltages, thereby ensuring electromagnetic compatibility. The

role of a resistor is to pull down a signal to a low level. When the wall or USB charger is

not connected, the signal is pulled down to a low level. The connection between the

W1-U00 and a USB or wall charger can be quickly detected using the resistance.




56

Current detection: The input current can be detected only when power is supplied to the

W1-U00 using a USB charger.

Battery-control MOS tube: Uses the p-channel metal–oxide–semiconductor field-effect

transistor (MOSFET). The MOS tube is controlled by the BAT_FET_N signal of the

PM8038. The charge for the primary battery is determined by the continuity and cut-off

state of the MOS tube. When the MOS tube is conducted, VPH_CHG charges the

primary battery, thereby supplying power to the phone.

Figure 9-30 and Figure 9-31 show the power supplying diagram of the wall and USB

chargers.

Figure 9-30 power supplying diagram of the wall charger

Figure 9-31 Power supplying diagram of the USB charger

3. External detection voltage

The PMIC detects the external power supplying voltage (at USB_IN) continuously. This

voltage can help determine whether the power supply is connected and whether the

voltage is in a valid range. A hysteresis is set to prevent the undesired switch near the

barrier to entry and report the switch state to the chip state machine and MSM8230 or to

the QSC device using interrupt signals.




57

4. OVP

The W1-U00 supports the built-in OVP circuit and USB-OTG switch. When the

W1-U00 is connected to a USB charger, the USB-OTG switch is conducted, and the

OVP circuit detects the input voltage. When the voltage detected is smaller than the

threshold (5.5 V to 7.5 V, step: 0.5 V, default: 6.5 V), the field-effect transistor is

conducted, and USB_OUT obtains the charge voltage. When the voltage detected is

greater than the threshold, overvoltage protection is initiated for the circuit, and the MOS

tube is cut off. As a result, the charge voltage fails to pass through the MOS tube.

Figure 9-32 shows the OVP circuit.

Figure 9-32 OVP circuit

5. Switch battery charge and four control loops

The PM8308 implements charge protection using four control loops: USB's current input

loop, charger's voltage input loop, BUCK circuit's voltage output loop, and battery's

charge current loop, as shown in Figure 9-33.

The four loops can be used to select the minimum duty ratio for controlling the charge

current and voltage.

Figure 9-33 Control loops




58

6. Charge of the primary battery

The PM8038 supports the charge for a lithium-ion cell and provides four charge modes:

trickle charge, constant current charge, modified constant-voltage charge, and pulse

charge. The MSM8230 detects the battery voltage, external power supplying voltage,

and current using the PM8038's analog multiplexer to control the charge process.

The charge state machine starts up during the power-on process. After a VDD is

configured, the state machine will respond to some conditions, for example, a charger is

connected or the battery requires trickle charge. When the W1-U00 is powered on, the

state machine starts up, and then reads the initial state. Whether an automatic trickle

charge is required is determined based on the hardware configurations of the state

machine. In trickle charge mode, the charge current is restricted to prevent VDD from

being powered off suddenly. After the system starts up, software is used to determine

whether a trickle charge is required. When the trickle charge current reaches a threshold,

constant current charge (also known as fast charge) is performed to quicken up the

charge. After the voltage of the lithium-ion cell reaches a target value, the software

controls whether to perform a modified constant-voltage charge or a pulse charge. Figure

9-34 shows the charge flowchart.

Figure 9-34 Charge flowchart

The following section describes the four charge modes in details.

− Trickle charge

A large number of currents will be charged into the battery if a charge is performed

under a large current after the battery enters the deep discharge state. As a result,

VDD will be powered off. This causes unstable functions of the phone or power off

of the power supply. To solve this problem, the PM8038 provides a stable small

current charge mode, that is, trickle charge. The PM8038 implements the trickle

charge using a USB charger or a chip trickle charger.

Figure 9-35 shows the schematic drawing of the trickle charge.




59

Figure 9-35 Schematic drawing of the trickle charge

After the system starts up, the trickle charge is started by software and usually ends

after reaching a specified voltage threshold (3.0 V for a lithium-ion cell). The

software monitors the battery voltage using HKADC and controls the time when the

trickle charge must be stopped. The software can also control the trickle charge

current, which can be set from 50 mA to 300 mA at a certain step.

− Constant current charge

To implement constant current charge, enable the MOS tube to operate in the linear

region manner and connect the primary battery to VDD. The loop control can be then

implemented to detect the battery current. The overall current can be adjusted to

reach the configured value by controlling the transistors. The IMAXSEL.MSM

controls the constant current charge process until the battery voltage reaches a

specified value. Figure 9-36 shows the schematic drawing of the constant current

charge.

Figure 9-36 Schematic drawing of the constant current charge




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When the VBAT voltage approaches a set value, the charge current decreases. The

constant current charge ends, and the modified constant-voltage charge starts. Figure

9-37 shows the voltage and current waveforms generated during the constant current

charge.

Figure 9-37 Voltage and current waveforms

− Modified constant-voltage charge

The settings for the modified constant-voltage charge are similar to those for the

constant current charge, that is, the MOSFET operates in the linear region manner,

and transistors control the loops. However, the purpose of the loop control performed

for the modified constant-voltage charge is to set the VBAT voltage to a specified

value (VMAXSEL). This ensures an accurate battery voltage. Generally, lithium ion

battery vendors recommend that the voltage accuracy reaches 1% or a larger value

when the charge process ends. The battery voltage maintains (or is approximately)

constant during the modified constant-voltage charge process, and the charge current

decreases exponentially. Figure 9-38 shows the waveform generated during the

modified constant-voltage charge.




61

Figure 9-38 Waveform generated during the modified constant-voltage charge

7. Coin battery charge and backup power supply

The W1-U00 is not equipped with a coin battery and is connected to two external 22 µF

capacitors in parallel.

When the W1-U00 is powered off, certain clock and RTC circuits must keep operating.

If the primary battery is available, it will supply power to these circuits. If the primary

battery is unavailable, a coin battery or a backup capacitor is required to supply power to

these circuits. The power provided by the backup capacitor fails to keep the RTC circuit

and other circuits operating. It can be used in the scenario where sudden momentary

power loss (SMPL) occurs. The operating duration of capacitors with different

capacitances varies. A 22 µF capacitor can keep operating for more than 10 seconds.

Figure 9-39 shows the charge process of the backup power supply. The charge settings of

the backup power supply are always valid and do not require resetting when SMPL

occurs. The primary battery still charges the phone when the phone is powered off.

Figure 9-39 Charge process of the backup power supply




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8. Battery monitoring system

Figure 9-40 shows the battery monitoring system (BMS).

Figure 9-40 BMS

The BMS includes:

− Battery temperature detection system

VREF_BAT provides a reference voltage for external temperature detection and

battery identification. You can set a threshold for the battery temperature, as shown in

Figure 9-41. You can also adjust the externally connected resistance based on the

threshold, as shown in Figure 9-42.

Figure 9-41 Setting a temperature threshold

Figure 9-42 Calculating external resistances




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− Battery voltage alarm system

A programmable window detector is used to continuously adjust the VBAT's battery

voltage. The dual barriers to entry, upper threshold, and lower threshold are all

programmable. A voltage hysteresis is provided to ensure voltage stability. To prevent

interruption due to a momentary voltage, the conditions beyond the range must be

triggered after a total time. The hysteresis is also programmable. If the battery voltage

resumes before the programmable hysteresis, the hysteresis counter resets without

interrupt signal generated.

Figure 9-43 shows the conceptual diagram of the battery voltage alarm system.

Figure 9-43 Conceptual diagram of the battery voltage alarm system

Figure 9-44 shows the waveform generated during low battery detection.

Figure 9-44 Waveform generated during low battery detection

− Under voltage lockout (UVLO) and SMPL system

The UVLO circuit monitors the VDD continuously and powers off the W1-U00 in the

case of low power. The programmable barrier to entry of the UVLO circuit is smaller

than that of a low battery.

If the VDD voltage is beyond the specified range and resumes in the period

configured, the power-on timing can be initialized using the SMLP function. After




64

being enabled by the software supplier, the SMPL circuit operates immediately and

automatically recovers when sudden power-off occurs.

− Integrated circuit capacity (ICC) system

The ICC system collects the original data of the open circuit voltage (OCV) and

coulomb counter and calculates the battery resistance based on the measured voltage

and current.

9. Battery MOSFET

Figure 9-45 shows the circuit functions when the battery is equipped with or without the

MOSFET.

Figure 9-45 Circuit functions

Figure 9-46 shows the ways to prevent a sudden load.

Figure 9-46 Ways to prevent a sudden load




65

9.4.11 Sensor Interfaces

1. Accelerometer

There are three accelerometer suppliers (ADI, ST, and Freescale). Table 9-7 lists the

measurement ranges and precisions of the accelerometers provided by these suppliers.

Table 9-7 Accelerometer's measurement range and accuracy

Accelerometer Supplier Measurement Range Highest Accuracy

ADXL346 ADI ±2 g/±4 g/±8 g/±16 g 1/256 g

LIS3DH ST ±2 g/±4 g/±8 g/±16 g 1 mg

MMA8452Q Freescale ±2 g/±4 g/±8 g 1/1024 g

These accelerometers are all 3-axis acceleration sensors that provide ultra-low voltage,

high accuracy, and high resolution. The built-in A/D converter can directly deliver digital

signals. The ADXL346 and LIS3DH support both the I2C and SPI communication

interfaces. The MMA8452Q supports only the I2C communication interface.

To implement the pin-to-pin design for the three accelerometers, engineers adopt the

following design:

− Use the I2C communication mode supported by the three accelerometers. Connect

pin 8 to the I/O power supply and enab1e the I2C function of LIS3DH. Select

I2C4_CLK_SENS as the pin 4 and I2C4_DATA_SENS as pin 6. Connect pin 7 SA0

to the ground and set the least significant bit of the I2C address to 0.

− Connect a 0.1 µF capacitor to the second pin of MMA8452Q in parallel then to the

ground.

− Connect pin 10 of LIS3DH to the ground. Connect pin 5, pin 12, and pin 16 to the

ground.

− Connect pin 15 of ADXL346 to the power supply VDD.

Figure 9-47 shows the accelerometer's interface circuit.

Figure 9-47 Accelerometer's interface circuit




66

Table 9-8 describes the interface signals.

Table 9-8 Interface signals

Signal Direction (Sensor) Description

I2C4_CLK_SENS Input I2C's clock signal, which is connected to the

MSM8230's GPIO_45.

I2C4_DATA_SENS In/Out I2C's data signal, which is connected to the

MSM8230's GPIO_44.

VREG_LVS2_1P8 Power supply I/O power supply, which is supplied with

power by LVS2. Its voltage is 1.8 V.

ACCEL_INT1 Out Interrupt output signal 1, which is connected

to the MSM8230's GPIO_46.

ACCEL_INT2 Out Interrupt output signal 2, which is connected

to the MSM8230's GPIO_67.

VREG_L10_2P7 Power supply Sensor's internal power supply.

CS: used to select the SPI or I2C communication mode. For the W1-U00, the CS is set to

a high level to select the I2C communication mode.

SA0: used to select an I2C address. For the W1-U00, SA0 is set to 0. The I2C addresses

set for the three accelerometers are listed in Table 9-9.

Table 9-9 I2C addresses set for the three accelerometers

Component Writing Address Reading Address

ADXL346 A6H A7H

LIS3DH 30H 31H

MMA8452Q 38H 39H

Table 9-10 lists the requirements for accelerometer specifications.

Table 9-10 Requirements for accelerometer specifications

Parameter Requirement of Microsoft

38140023 ADXL346 Requirement Is Met or Not?

Dimension 3-axis 3-axis Yes

Hardware

sampling rate

100 Hz (A higher

sampling rate is

acceptable.)

Data output rate: 0.1 Hz to

3200 Hz

Yes

Driver-selectable

g-ranges

±2, ±4, ±8 User selectable: ±2, ±4, ±8,

±16

Yes




67

Resolution At least 8 bit (10

bit recommended)

13-bit resolution Yes

Accuracy ±5 degrees tilt at

the ±2 g-range

recommended

Accuracy: ±0.25 degrees

tilt at the ±2 g-range

recommended

Yes

Power modes recommends sleep

and active mode

Power modes: sleep and

active mode

Yes

Signal-to-noise

(SNR) ratio

≤ 500

(recommended)

N/A Not necessarily

meet the

requirement.

2. Compass

±AK8962C is a highly-integrated micro 3-axis electronic compass that can obtain the

information about a 3D magnetic field. It supports the I2C and SPI communication

modes and provides a ±1200 μT measurement range and a 0.3 μT sensitivity.

Figure 9-48 shows the circuit diagram of the compass.

Figure 9-48 Circuit diagram of the compass

The signals on each interface are described as follows:

− COMPASS_INT: data ready signal, which is directly connected to the MSM8230.

The MSM8230 generates interrupt signals when the data is ready.

− I2C4_DATA_SENS and I2C4_CLK_SENS: I2C interfaces, which are used to

configure a register and send sensor data to a processor.

− CSB: CSB: used to select the SPI or I2C communication mode. For the W1-U00, the

CS is set to a high level to select the I2C communication mode.

− CAD0 and CAD1: used to select an I2C address. For the W1-U00, CAD0 and CAD1

are both set to 0. The I2C address is set to 0CH.

Table 9-11 lists the requirements for compass specifications.




68

Table 9-11 Requirements for compass specifications


38140069 AK8963C Requirement Is Met or Not?

Magnetic field

sampling rate

60 Hz 8 Hz or 100 Hz Yes

Resolution At least 1 µT (0.3 µT is

recommended)

0.3 µT Yes

Accuracy ±5 µT 0.3 µT Yes

Magnetic field

range

At least ± 300 µT (±1200

µT is recommended)

±4900 µT Yes

3. Proximity sensor and ambient light sensor

There are two suppliers (Avago and Taos) that can provide proximity and ambient light

sensors, which integrate technologies, such as automatic laser shutdown (ALS),

proximity detection, and IR LED. The ADPS-990x pin provided by Avago and the

TMD2771x pin provided by Taos are completely compatible with each other. An ambient

light sensor is used to detect the ambient brightness and automatically adjusts an LCD's

backlight brightness. A proximity sensor is used to turn off the LCD backlight.

This sensor gives off infrared light using the internal infrared emitting diode and detects

the strength of the infrared light using the light ray detector, to implement functions of a

proximity sensor. This sensor supports the I2C communication interface and

programmable interruption barrier to entry.

Figure 9-49 shows the circuit diagram of a proximity and ambient light sensor.

Figure 9-49 Circuit diagram of a proximity and ambient light sensor

The interfaces are described as follows:

− PROXIMITY_INT: interruption output interface, which is directly connected to the

MSM8230 and generates proximity and ambient light interrupt signals. When the

ADC value of the proximity or ambient light is greater or smaller than the set value,

interrupt signals are generated.




69

− I2C4_DATA_SENS and I2C4_CLK_SENS: I2C interfaces, which are used to

configure a register and send sensor data (including the data of the exposed and

shielded ambient light and that of the proximity light) to a processor.

− LDR connects to LEDK so that the chip of the sensor can drive the LED.

− The address of the I2C interface is set to 0x72 or 0x73.

Table 9-12 lists the requirements for ambient light sensor specifications.

Table 9-12 Requirements for ambient light sensor specifications


APDS-9900 Requirement Is Met or Not?

Spectral response Proximate to response of

human beings' eyes

Proximate to response

of human beings' eyes

Yes

Resolution at the

peak response

wavelength

≤ 10 lux in the

measurement range of

0–100 lux

N/A TBD

Resolution at the

peak response

wavelength

≤ 64 lux in the


100–1000 lux

Accuracy: ±25%

N/A

Resolution at the

peak response

wavelength

≤ 128 lux in the


1000–4000 lux

Accuracy: ±25%

N/A

Sampling rate ≥ 4 Hz ALS ADC integration

time: 2.72–696 ms

Yes

Table 9-13 lists requirements for proximity sensor specifications.

Table 9-13 Requirements for proximity sensor specifications


APDS-9900 Requirement Is Met or Not?

The sensor can detect the

black, gray, and white

card with a width of 3 cm

and a height of 5 cm

when these cards are

respectively moved from

a place 4 mm, 2 mm, and

0 mm away from it to a

place 15 mm away from

it.

The black card is

difficult to detect.

Currently, few sensors

can meet this

requirement because

the requirement for

mechanical design is

high.

Sampling rate ≥ 10 Hz ADC conversion time:

2.72 ms

Yes




70

9.4.12 Vibration Motor Interfaces

The vibration motor is configured on the L board. Figure 9-50 shows the conceptual diagram

of the vibration motor.

Figure 9-50 Conceptual diagram of the vibration motor

The VIB_DRV_N signal is connected to the corresponding pin on the PM8038 and used to

drive the vibration of a motor.




71

9.4.13 Environment Monitoring and Prevention Solutions

The PM8038's HK/XO ADC monitors the external environment of a W1-U00, including the

power voltage, battery temperature, PA temperature, and crystal temperature. For details about

the structure of an environment monitoring system, see the house keeping part shown in

Figure 9-51.

Figure 9-51 Structure of an environment monitoring system

Table 9-14 describes the key pins of an environment monitoring system.




72

Table 9-14 Key pins of an environment monitoring system

Power voltage detection: The analog interface of the PM8038's power supply detects signals,

such as VBAT, VCOIN, VCHG, USB_IN, and DC_IN and sends them to the analog

multiplexer then to the HKADC, which converts them to digital signals.

Battery temperature detection: The NTC resistor in the battery is connected to the

VREF_THERM. The voltage allocated to the NTC resistor is sent to the analog multiplexer

(AMUX1) then to the HKADC, which converts the voltage to digital signals.

PA temperature detection: A temperature sensor (NTC resistor) is configured next to the PA to

measure the PA temperature. The output PA_THERM of the temperature sensor is connected

to the PM8038's analog multiplexer then sent to the HKADC, which converts the signal to

digital signals. Place the temperature sensor as near as possible to the PA during the PCB

design.

Crystal temperature detection: Use the 19.2 MHz crystal oscillator with a built-in NTC

resistor to connect the TH_IN pin to the XO_THERM pin of the PM8038. The PM8038's

analog multiplexer sends the output of the crystal oscillator to the HKADC, which then

converts it to digital signals.




73

9.4.14 PCBA's Reset Relationship, Timing, and WDT Function

Hardware reset signals

Table 9-15 describes the hardware reset signals on the MSM8x30.

Table 9-15 Hardware reset signals on the MSM8x30.

Network Name Output Chip and Pin Input Chip and Pin Function Description

PON_RESET_N PM8038 PON_RST_N MSM8x30 RESIN_N Power-on reset signal delivered

by the PM8038. The signal is

pulled up to a high level after

the PMIC is powered on.

- - - PM8038 RESIN_N External reset input signal

delivered by the PM8038. The

PM8038 has a pull-up signal,

which can be connected to a

switch then to the ground. The

PM8038 resets if the signal is

pulled down to a low level. The

signal is floating in the

conceptual diagram.

MSM_RESOUT_N MSM8x30 RESOUT_N eMMC RSTN Reset signal delivered from the

MSM8x30 to the eMMC

2. The PON_RESET_N signal is a reset signal delivered by the PM8038 after the pins on

the chip are powered on in the sequence shown in Figure 9-52. The PON_RST_N pin

keeps a low level during the power-on of the PM8038. After the power supply and clock

are powered on in a sequence as scheduled, the PON_RST_N pin is pulled up to a high

level after a short delay. This allows the MSM8x30 primary chip to exit the hardware

reset state and then to start.




74

Figure 9-52 Power-on timing

3. The PM8038 chip has a hardware reset input pin, that is, RESIN_N, as shown in Figure

9-53. When the phone breaks down or has operating faults, the external reset switch can

pull up this pin to a low level for a period to reset the PM8038's hardware.

Figure 9-53 RESIN_N pin

Pay attention to the following items when using the reset signal:

− The reset function must be enabled using the control bit of the SBI.

− When the RESIN_N signal is pulled up inside the PM8038, the RESIN_N signal

must be pulled down outside the PM8038.

− A programmable timer (the clock pulse duration ranges from 32 ms to 10.25s) is

configured inside the PM8038. If RESIN_N changes to the high level before the

timer overflows, the PMIC determines that the reset key is pressed by accident and

does not perform any operation. If RESIN_N remains at a low level until the timer

overflows, the PMIC determines that the high level of RESIN_N is valid.

− During reset, the PMIC sends an interrupt signal to the MSM8230, and then the

inside reset timer starts (the clock pulse duration ranges from 10 ms to 2s and the

timer is programmable). After receiving the interrupt signal, the modem chip closes




75

internal functional modules in sequence. If all functional modules are closed before

the timer overflows, the PMIC performs the power-off sequence. When the timer

overflows, the PMIC performs complete power-off timing, no matter the modem chip

is totally powered off or not.

− After the PMIC implements the power-off timing, the next operation is to power on

the PMIC again or retain the PMIC in the power-off status, which is determined by

the remain off or attempt power-on control bit of the SBI register.

For the W1-U00, the RESIN_N pin of the PM8038 is floating, as shown in Figure 9-54.

Figure 9-54 RESIN_N pin floating

The MSM8x30 chip provides a RESOUT_N pin, as shown in Figure 9-55. The reset

output signal of the RRESOUT_N pin is generated from the reset input of the RESIN_N

pin and the watchdog reset of the WDOG_RESET pin. With comparison to the

RESIN_N pin, the rising edge of the RESOUT_N pin delays for multiple uPs.

Figure 9-55 RESOUT_N pin

Watchdog timer and soft reset

The watchdog timer inside the MSM8230 is a 14-bit counter. When a fault occurs in the

system hardware or software unexpectedly and the CPU does not reset the watchdog in a

specified period, the timer will overflow and accordingly the reset operation of the phone

is triggered. The enabling or disabling of the watchdog can be controlled by the

WDOG_DISABLE pin. When the pin is pulled up, the watchdog function is disabled.

When the pin is floating, the watchdog function is enabled. Qualcomm recommends that

the pull-up resistance be reserved and used in the commissioning phase. In the delivery

phase, the pin is floated in normal cases.




76

Figure 9-56 shows the circuit diagram of the watchdog timer

Figure 9-56 Circuit diagram of the watchdog timer

The WDOG_DISABLE pin reads the status only once during W1-U00 startup. In

follow-up operations, the WDOG_DISABLE pin is used as GPIO. Therefore, the

WDOG_DISABLE pin is connected to the pull-up power supply VREG_L11_1P8_FET,

which will be in the floating status after the MSM8230 is started.

The watchdog reset procedure is as follows:

− When the watchdog timer overflows, the PS_HOLD signal of the MSM8230 drive is

at a low level.

− After the PMIC detects that PS_HOLD is at a low level, the PMIC sets the

PON_RST_N signal to a low level and then the MSM8230 and other peripheral chips

are reset.

− After a period, multiple statuses are checked to ensure that the watchdog overflow

event and software reset are implemented.

− During software reset, the PMIC is not powered off. Instead, it restores all SBI

registers to their default settings. After 20 ms, the PMIC sets the PON_RST_N signal

to a high level to allow the MSM8230 to exit the reset status.

9.4.15 Charging Indicator Interface

The PM8038 drives the tri-color LED. Figure 9-57 shows the circuit diagram.

LED_RED_DRV is connected to the RGB_RED pin of the PM8038. LED_GREEN_DRV is

connected to the RGB_GRN pin of the PM8038, and LED_BLUE_DRV is connected to the

RGB_BLU pin of the PM8038. The PM8038 adjusts the light and color of the LED by

controlling the strength and percentage of driving current.

Figure 9-57 Circuit diagram of the PM8038 and tri-color LED




77

9.4.16 Board Power Distribution

The PM8038 manages the power supply of the W1-U00.

Overview of PM8038 power distribution

The PM8038 provides 33 programmable voltage regulators in two types: 6 switch mode

power supplies and 27 LDOs. In addition, the PM8038 provides two low voltage

switches and a negative voltage.

All regulators provide recommended functions and other functions except the following:

− S1: Supplies power only to the modem and USB in the MSM8230.

− S5: Supplies power only to krait 1 in the MSM8230.

− S6: Supplies power only to krait 2 in the MSM8230.

− L13: Supplies power only to the PMIC clock.

− L15/L17: Supplies power only to the UIM card.

Table 9-16 lists parameters of voltage regulators.

Table 9-16 Voltage regulators




78

Reference source

All voltage regulators and other circuits inside the PM8038 share a voltage reference

source with special requirements for circuit connection. REF_GND is the ground of the

reference source. REF_BYP connects a 0.1 µF bypass capacitor to ground and functions

as a low-pass filter with an internal resistance. Filtered voltage can be provided to the

MPP pin as analog output.

Figure 9-58 shows a reference source circuit.

Figure 9-58 Reference source circuit

Switch mode power supply

The PM8038 switch mode power supply works in PWM or PFM mode.

To improve the efficiency in low-current mode, converters can work in low-power mode.

That is, converters are enabled only for a short time to maintain the output voltage. In

this case, buck converters reduce pulse frequencies and work in PFM mode. Note that

pulse frequency may be reduced to the scope of audio frequencies, affecting audio

performance when the load is very slight.

The PM8038 has six step-down switch mode power supplies. The maximum output

current of two rapid switch mode power supplies is 2000 mA, and the maximum output

current of the other four high-frequency switch mode power supplies is 1500 mA.

Recommended usage:

− S1: Supplies power (1500 mA) to the core in the MSM8230.




79

− S5: Supplies power (2,000 mA) to krait 1 in the MSM8230.

− S6: Supplies power (2,000 mA) to krait 2 in the MSM8230.

− L16–L19: Supplies power (1200 mA) to QDSPs.

Figure 9-59 shows the circuit diagrams of converters.

Figure 9-59 Circuit diagrams of converters

Usually, buck converters work in PWM mode. When power consumption is low, they

work in PFM mode. To improve the efficiency, they automatically select the working

mode. The mode can be controlled by software.

Switch mode power supplies in both types use the control structure in current mode with

a constant frequency and built-in switch pipes.

LDO

An LDO consists of a reference voltage, controlled element, feedback path, and

difference amplifier. The four function modules form a closed-loop control system that

adjusts the output voltage near to the reference voltage but does not adjust current. The

input of the difference amplifier is the proportion of the reference voltage to the output

voltage on the feedback path. If the voltages are different, the amplifier generates a

difference voltage. The closed-loop system adjusts the output voltage by changing the

controlled element to eliminate the difference. Therefore, the output voltage does not

change with current. Figure 9-60 shows the LDO functional block diagram.




80

Figure 9-60 LDO functional block diagram

− Reference voltage: The PM8038 generates reference voltage using the reference

circuit of the balance band gap. The precision and stability of the reference voltage

directly affects the output voltage. The closed-loop system feeds back the proportion

of the reference voltage to the output voltage on the feedback path. Therefore, the

reference voltage can be selected.

− Controlled element: The controlled element in the PM8038 is a PMOS pipe. The pipe

generates different gate-source voltage drop based on amplifier output, and transfers

strong current between the drain and source without effect on drain-source voltage

drop. When a circuit is on or off, the current on the controlled element changes

greatly. This meets requirements of the phone in different working modes (sleep, Rx,

or Rx/Tx).

− Feedback path and difference amplifier: The PM8038 uses an OP amplifier to

implement the functions of a feedback path and difference amplifier. An output

voltage (Vout) is fed back as an input by a resistance network.

− For an OP amplifier, V(+) equals V(–) and V(+) equals Vin. Closed-loop feedback

implements that V(–) equals to Vin. Therefore, feedback control is implemented based

on the following formula:

LDOs of the PM8038 are classified into:

1200 mA output current: L1, L16, L19, L20, L24, and L27

600 mA output current: L5, L6, L7, L10, and L11

300 mA output current: L8, L9, and L12



NCP

The PM8038 contains an NCP switch mode power supply that generates a negative 1.8 V

power supply for stereo headsets. NCP is not used in C8868L phones.

Voltage switch




81

The PM8038 contains two low-voltage switches: LVS 1 and LVS 2. They provide 100

mA internal voltage.

Certain internal modules of the PM8038 use the output of special voltage regulators.

These modules are internally connected. By default, these modules of the PM8038 can

work properly only when the output of the regulators is normal. Table 9-17 lists the

connections.

Table 9-17 Internal voltage regulator connections

9.4.17 Board Address Allocation

Figure 9-61 shows the address allocation of the MSM8230.




82

Figure 9-61 Address allocation of the MSM8230




83

9.4.18 Board Power-on and Power-off Process

Figure 9-62 shows board power-on and power-off sequence after the on-off-keying is

switched on.

Figure 9-62 PM8038 power-on and power-off sequence

Figure 9-63 shows PM8038 power supply groups.

Figure 9-63 PM8038 power supply groups

A power-on process starts when the power key is pressed and KPDPWR_N of the PM8038 is

pulled down. The signal must be at low level before the PS_HOLD signal is pulled up.

After KPDPWR_N is pulled down for a short time (equal to treg1), voltage regulators enable

the power supply groups in descending order (power supplies in the same group are enabled

with an interval of four sleep clock periods). After a voltage regulator is enabled, the detection

circuit checks whether the power-on succeeds. Then, the next voltage regulator is powered on




84

after an interval (equal to treg) between groups until all enabled power supplies are powered

on.

Another interval (equal to treset1) later, PON_RESET_N is pulled up. The interval ensures

enough time for MSM8230 power-on.

In the initiation stage of a power-on process, PS_HOLD can be in a random state but it must

be pulled up before the tpshold timer overflows. Then, a power-on is succeeded and

completed.

If PS_HOLD is still low after tpshold overflows, the power-on fails and power-off starts.

PS_HOLD is high when a phone is powered on.

A power-off starts when the power key is pressed and KPDPWR_N is pulled down. The level

of the signal must last for a certain period to indicate that the power key is not pressed by

accident. Then, PS_HOLD is pulled down by the MSM8230, requiring the PM8038 to start a

power-off.

An interval (equal to treset0) later, voltage regulators power off power supplies in the reserved

order of the power-on sequence.

Power-on process

When the PS_HOLD signal keeps low, the PM8038 is disabled and the power-on circuit

monitors the following events that may trigger a power-on sequence:

− The power key is pressed and KPDPWR_N is pulled down.

− Cable Power-on pins are pulled down.

− An external power supply is detected. (Voltage of the VCHG pin is greater than the

upper threshold.)

− Real-time clock alarm is triggered.

− SMPL is detected.

The events generate power-on signals. Triggering source of the MSM8230 power-on is

notified of the corresponding interruption. PM8038 power-on process:

1. One of the five triggering events occur or the events occur consecutively.

2. A power supply is selected. If voltage of VCHG pin is greater than the upper threshold,

the charger serves as the power supply. If voltage of VCHG pin is smaller than the lower

threshold, BAT_FET_N is pulled up, the primary battery serves as the power supply, and

charging is not allowed.

3. The internal band gap reference source is enabled.

4. VDD voltage is monitored. If the value exceeds the preset low voltage lock threshold,

the power-on initiation process continues.

5. The PON_RESET_N signal is pulled down, even if the signal is not exported because

the MSMP regulator is disabled. This mechanism ensures correct state of

PON_RESET_N during MSM8230 power-on.

6. The SBI register is reset to the default value. If the VCOIN voltage is smaller than the

lower threshold, the SBI station that is powered by the standby battery, and the RTCRST

interruption are also reset.

7. If SMPL is enabled and SMPL restart signals are valid, the SMPL interruption is set

and the SMPL timer is reset for next SMPL event.

8. Certain period (equal to treg1) later than the previous power-on, voltage regulators are

enabled in the sequence of S2, L24, S1, S4, L11, L20, L26, L4, L22, L6, L3, and L5.

9. Certain period (equal to treset1) later than power-on of all enabled voltage regulators,

the PON_RESET_N signal is pulled up by default.




85

10. The PS_HOLD counter starts counting and monitors the PS_HOLD signal of the

MSM8230 in real time. Only if the signal is pulled up before the counter overflows, the

power-on can succeed. If the counter overflows and the signal is not pulled up, the

PM8038 returns to the closed state. Then, go to 1. If a triggering event occurs (for

example, KPD_PWR_N is still low), the power-on process restarts. If the PS_HOLD

signal is pulled up before the counter overflows, the PM8038 is powered on (in sleep

mode or work properly). The corresponding interruption is sent to the MSM8230 for

triggering source confirmation.

A power-on fails if:

− The triggering signal disappears. In this case, the power process stops. Then, go to 1.

− If VDD is reduced to the UVL0 threshold before PS_HOLD is pulled up, the

PM8038 suspends the power process and retries twice. If all attempts fail, the

PM8038 is reset until next triggering event.

If PS_HOLD is pulled up before VDD is reduced to the UVL0 threshold, the event is considered as an

SMPL event and the restart circuit does not work.

If the power-on succeeds, the PM8038 is enabled until PS_HOLD is pulled down or a UVLO event or

superheat close up occurs. In the case of one of the three situations, the PM8038 powers off the phone.

Power-off process

When the PS_HOLD signal of the MSM8230 keeps high, the PM8038 is enabled. In this

case, the PM8038 monitors the following events that may trigger a power-off:

− The power key is pressed and the MSM8230 pulls down the PS_HOLD signal.

− The VDD voltage detected on ISNS_M is smaller than the UVLO threshold.

− The temperature of the PM8038 is greater than the superheat threshold.

A power-off starts if the power key is pressed when the MSM8230 is enabled. The

KPDPWR_N pin (with internal pull-up) of the PM8038 is connected to the power key of

the phone. The MSM8230 uses the interruption logic to monitor the key. When

KPD_PWR_N interruption is triggered, the MSM8230 starts a power-off:

1. Press and hold the key to display the power-off menu.

2. Select an option and write the information to be saved in the flash.

3. Disable the SMPL to prevent re-power-on.

4. The MSM8230 pulls down PS_HOLD.

5. The PM8038 pulls down PON_RESET_N, resets the MSM8230 and other peripherals,

and closes the TXCO manager.

6. Certain period (equal to treset0) later, detect the following conditions and act

correspondingly:

− If the temperature of the PM8038 exceeds the superheat protection threshold, the

PON_RESET_N signal is pulled down immediately and all PM8038 circuits are

powered off to prevent the PM8038 from being damaged.

− If VDD is smaller than the UVLO threshold, the PON_RESET_N signal is pulled

down immediately and all PM8038 circuits are powered off to prevent the primary

battery from being damaged.

− If the preceding conditions are not met and the reset position of the watchdog is set,

set the interruption status position for the watchdog, reset the MSM8230 and

watchdog timer, and restart the PM8038 with incomplete power-off.

− If the preceding conditions are not met and the SMPL is enabled, the SMPL process

is triggered.

− If the preceding conditions are not met, the power-off process continues.




86

7. Close other power supply managers in sequence. Power is supplied by only the battery

or VPH_PWR of an external power supply.

9.4.19 Clock Scheme

The clock source on the MSM8230 platform consists of 27 MHz PXO clock and 19.2 MHz

CXO clock. The 32.768 kHz sleep clock is generated by the internal RC oscillation circuit and

calibrated by the 19.2 MHz CXO clock.

Table 9-18 lists the clock scheme.

Table 9-18 Clock scheme

Source Stratum-1 clock Stratum-2 clock Note

19.2 MHz PM8038:

XTAL_19 MHz

XO_OUT_A0 WTR1605: XO_IN

XO_OUT_D0 MSM8230: CXO and

USB_HS_SYSCLK

SLEEP_CLK(32.768 kHz) N/A

27 MHz MSM8230:

PXO (27 MHz)

SB_CLK WCD9304: SB_CLK

SB_MCLK WCD9304: MCLK

9.4.20 RTC and Standby Battery

The phone power-off alarm – real-time clock (RTC) and SMPL functions require a precise 32

kHz (32.768 kHz) clock. Figure 9-64 shows clock sources of the sleep clock in the PM8038.

The clock sources can be:

An external 32 kHz crystal oscillator

A calibrated LP RC oscillator

An external 19.2 MHz crystal oscillator frequency dividing

A 19.2 MHz frequency dividing generated by an internal RC oscillator

Figure 9-64 Clock sources of the sleep clock in the PM8038




87

Only when external 32 kHz crystal oscillator and calibrated LP RC oscillator are unavailable,

external 19.2 MHz crystal oscillator frequency dividing, or 19.2 MHz frequency dividing

generated by an internal RC oscillator is used due to low precision, and is used only for a

sleep clock. Only external 32 kHz crystal oscillator or calibrated LP RC oscillator can be used

for RTC and SMPL.

9.4.21 UVLO and SMPL

The PM8038 implements under-voltage lockout and protection using the UVLO circuit. The

circuit monitors VDD voltage. When the voltage is extremely low, the PMIC is automatically

disabled. The UVLO threshold can be programmed from 1.5 V to 3.05 V at a step of 50 mV

(the default UVLO threshold is 2.70 V). The UVLO threshold must be lower than the

low-voltage alarm threshold of the phone.

UVLO is a hardware function and can interact with software to implement certain additional

features, such as SMPL restoration, power-on suspension, and soft reset in case of watchdog

timeout.

A power-on process is initialized only when the VDD voltage is greater than the raising

threshold. Hysteresis and delay can prevent detected burr from being considered as a UVLO

event. If the VDD voltage is smaller than the threshold for a certain period, a UVLO event is

triggered. When a UVLO is detected, the PON_RST_N signal is driven to a low level, and the

phone is powered off. The UVLO voltage threshold can be programmed using software but

the software does not detect a UVLO. Hysteresis and delay cannot be programmed. A UVLO

event triggers a power-off by directly pulling down the PON_RST_N pin, instead of

generating an interruption.

Figure 9-66 shows the UVLO detection mechanism.

Figure 9-65 UVLO detection mechanism

The SMPL function allows automatic restart when the PMIC is powered off instantaneously.

The SMPL function must be enabled using software. After SMPL is enabled, if the VDD

voltage becomes extremely low (smaller than 2.7 V) and recovers in a period (0.5s – 2.0s,

programmable), a recovery process is performed as follows:

1. A UVLO event drives the PON_RST_N signal to a low level, and the PMIC is powered

off.

2. The standby capacitor or coin battery connected to the VCOIN pin supplies power for

SMPL.




88

3. If the VDD voltage recovers before SMPL times out, the PMIC initiates a power-on

sequence immediately and automatically without software intervention, generates an

interruption of the MSM8230, and notifies the MSM8230 of the following:

− Instantaneous low voltage

− Effect on RTC due to abnormal voltage

− Abnormal power-on of the PMIC

4. If the VDD voltage does not recover before SMPL times out, the phone is powered off

and must be powered on.

SMPL must be enabled using software with keep-alive capacitor or standby battery.

Figure 9-66 VDD recovery

Figure 9-67 shows the VCOIN circuit of the W1-U00. The 44 µF capacitor ensures that RTC

keeps when the phone battery is replaced.

Figure 9-67 VCOIN circuit of the W1-U00

9.5 RF

An RF subsystem consists of a transmitter, receiver, frequency source, antenna, GPS, and

Bluetooth+Wi-Fi module.




89

9.5.1 Transmitter in WCDMA/GSM

The platform chip for RF is WTR1605, which implements RF transmitting, receiving, and

GPS. Figure 9-68 shows the WTR1605 functional block diagram.

Figure 9-68 WTR1605 functional block diagram

The WTR1605 provides the following channels:

Seven receiving channels in WCDMA, CDMA, and LTE modes: three channels for

low-frequency differential signals, and the other four channels for high- and

medium-frequency RF

Four diversity receiving channels in WCDMA: two channels for low-frequency

differential signals, and the other two channels for high- and medium-frequency RF

One GPS receiving channel (supporting A-GPS) for I/Q signal output to the baseband

Four transmitting channels in GSM

Two I/Q signal outputs to the baseband are shared in GSM and WCDMA modes.

The WTR1605 provides transmitting circuits in WCDMA, GSM, CDMA, and LTE modes.

Frequency bands in WCDMA are B1, B2, B3, B4, B5, B8, B9, and B19. Frequency bands in

GSM are GSM, EGSM, PCS, and DCS. Frequency bands in CDMA are BC0, BC1, BC6, and




90

BC15. Frequency bands in LTE are B1, B2, B3, B4, B5, B8, B9, B19, and B41 (unavailable at

present). Figure 9-69 shows B1 transmitting circuit.

Figure 9-69 B1 transmitting circuit

Figure 9-70 shows B8 transmitting circuit.


Figure 9-71 shows B9 transmitting circuit.




91


For the preceding transmitting circuits in WCDMA, the MSM8230 provides control signals,

such as PA enabling signals and gain switching signals.

Figure 9-72 shows transmitting circuits in GSM.

Figure 9-72 Transmitting circuits in GSM

The MSM8230 provides control signals, such as PA enabling signals and frequency band

selection signals for transmitting circuits in GSM. In GSM and WCDMA, signals are

transmitted through an RF switch and main antenna.




92

9.5.2 Receiver in WCDMA/GSM

A receiving circuit contains receiving channels in WCDMA and GSM. Signals are received

by the main antenna and transferred by the main antenna switch to the WTR1605. Figure 9-73

shows the main antenna and main antenna switch.

Figure 9-73 Main antenna and main antenna switch

Receiving Channels in WCDMA

In WCDMA, received signals are transferred by the main antenna, main antenna RF switch,

and duplexer. Then, the signals are matched and transferred to the WTR1605. Figure 9-74

shows B1 receiving.

Figure 9-74 B1 receiving

Figure 9-75 shows B8 receiving.




93


Figure 9-76 shows B9 receiving.


Receiving Channels in GSM

In GSM, received signals are transferred by the main antenna and main antenna RF switch.

Then, the signals are matched and transferred to RTR8615. In GSM900 (same as in WCDMA

B8), PRX_LB2 channel is used. In GSM850, PRX_LB3 channel is used. In

GSM1800/GSM1900, PRX_MB1 channel is used, as shown in Figure 9-77.

Figure 9-77 Receiving channels in GSM




94

9.5.3 Frequency Source

The WTR1605 integrates LO circuits that are required for receiving and transmitting in

WCDMA and GSM, and for GPS receiving. Internally, three LO circuits are provided. Each

circuit contains an independent PLL, VCO, and distribution circuit. Only filter circuits are

required externally. The LO circuits use the XO input of the PM8930 as the reference clock

source, as shown in Figure 9-78.

Figure 9-78 LO circuits

The first local oscillator of the WTR1605 is used for transmitting links in GSM and WCDMA.

The second local oscillator is used for receiving links in GSM and WCDMA. The third local

oscillator is used for GPS receiving links.




95

9.5.4 GPS and B1 Diversity

The WTR1605 integrates GPS functional circuits. GPS signals are filtered and amplified by

an external LNA to the WTR1605. Figure 9-79 shows the GPS receiving circuit.

Figure 9-79 GPS receiving circuit

Figure 9-80 shows B1 DRX circuit.

Figure 9-80 B1 DRX circuit




96

9.5.5 WLAN and Bluetooth

In the W1-U00, Bluetooth and Wi-Fi are combined in Qualcomm WCN3660 chip.

In the design, Bluetooth and Wi-Fi share an antenna and SP3T RF switch is not required.

Figure 9-81 shows the circuit.

Figure 9-81 Circuit of Bluetooth and Wi-Fi

The MSM8230 provides a PCM interface to directly connect the PCM signals of the

Bluetooth module. Table 9-19 lists the definition of interface signals.

Table 9-19 PCM interface signals

BT_WAKES_MSM: It is the wake-up output signal of the Bluetooth module. It is

connected to the HOST_WAKE pin of the Bluetooth module and used to wake up the

MSM8230 in sleep mode.

MSM_WAKES_BT: It is connected to the BT_WAKE pin of the Bluetooth module and

is used by the MSM8230 to wake up the Bluetooth module in sleep mode.

W1-U00 Maintenance Manual 10 Troubleshooting Common Faults



97

10 Troubleshooting Common Faults

10.1 Startup Failure

There are three types of startup failure: no current, weak current, or excessive current. Most of

startup failures are caused by power supply exceptions. Troubleshoot the faults as follows:

1. No current: Power the phone using DC and press and hold the power key. The current is

displayed as 0 mA to 5 mA.

2. Weak current: Power the phone using DC and press and hold the power key. The current

is displayed as 5 mA to 100 mA.

3. Excessive current: Power the phone using DC and press and hold the power key. The

current is displayed as over 300 mA.

If the W1-U00 fails to start, locate the fault by checking the startup current when the W1-U00

is powered using DC.

4. No current

Figure 10-1 shows the procedure for troubleshooting a startup failure without current.




98

Figure 10-1 Procedure for troubleshooting a startup failure without current

Startup failure

Connect the phone to a test

battery and maintenance

power supply. Then, press

and hold the power key and

observe the current.

No current

Check whether the

copper foil of the key is

oxidized.

Check whether VPH_PWR

voltage is normal. (The voltage

of a maintenance power supply

ranges from 3.4 V to 4.2 V.)

Check X202 clock.

Y

Clean the copper foil.

Check U201.

N

Y

N

No current is usually caused by short-circuited primary power supply. Check for short-circuited VBUS

or VSYS power supply.

Figure 10-2 shows U201.




99

Figure 10-2 U201

5. Weak current

Figure 10-3 shows the procedure for troubleshooting a startup failure with weak current.

Figure 10-3 Procedure for troubleshooting a startup failure with weak current

Startup failure






Weak current

Check whether part of U201

DC-DC voltage is exported.

Check whether a U501

output is short-circuited.

Replace U201.

Check U201.

Locate the short

circuit.

Y

N

Y

N




100

In this case, VPH_PWR voltage is normal but the output of U201 is abnormal. This is usually caused by

short circuit of another U201 output, resulting in abnormal PMU power supply output. Check U201

outputs for short circuit.

6. Excessive current

Strong current is usually caused by short-circuited power supply circuits (DC power

supply) which may result in 500 mA or greater current. Mostly the short circuit occurs

between VBAT and earth.

Figure 10-4 shows the procedure for troubleshooting a startup failure with excessive

current.

Figure 10-4 Procedure for troubleshooting a startup failure with excessive current

Startup failure






Strong current

greater than 500 mA

Check whether pin 1

of J1501 is short

circuited with earth.

Check whether U201

voltage is normal.

Check U201.

Check U201.

Re-solder or replace

U201.

Y

N

N

Y

Figure 10-5 shows J1501.




101

Figure 10-5 J1501

10.2 Reception Failure

Maintenance procedure for reception failure in WCDMA2100:

Figure 10-6 shows the procedure for troubleshooting a reception failure.




102

Figure 10-6 Procedure for troubleshooting a reception failure

Reception failure in

WCDMA2100

Check J3201 when

the RF cable is not

connected.

Check whether pin 1 of

J3201 is connected to the

thimble in the center. Check J3201.

Check whether control

signals of U3201 switch are

normal (see Table 10-1).Check U3202 and U301.

Check whether signals of pins

1 and 8 of U3302 are normal,

and whether the insert loss is

smaller than 2.5 dB.

Check U3302.

Check whether IQ signals of

U4001 and the power supply

voltage are normal.

Check U4001.

Check U301.

End

Y

N

Y

Y

Y

Y

N

N

N

Check the control signals of U3201 switch using a multimeter or oscilloscope. See the truth table for

control signals in Table 10-1.




103

Table 10-1 Truth table for main antenna selection

Truth table for main antenna selection

In WCDMA900, just replace U3302 detection with U4102 detection.

In GSM850, just replace U3302 detection with J3201 detection.

In GSM900, the method is the same as that in WCDMA900.

In GSM1800/GSM1900, skip U3302 detection.

10.3 Transmission Failure

Maintenance procedure for transmission failure in WCDMA2100, WCDMA900, GSM850,

GSM900, GSM1800, and GSM1900:

WCDMA2100 is used as an example. Firstly, ensure that the SIM card and antenna are

installed properly. Then, detect the phone according to the procedure in Figure 10-7.




104

Figure 10-7 Procedure for troubleshooting a transmission failure

Y

Transmission failure in

WCDMA2100

Check J3201 when

the RF cable is not

connected.

Check whether pins 1 and 2 of

J3201 are connected.

Check whether control

signals of U3201 are normal

(see Table 10-1).

Check whether signals of pins 1 and

8 of U3302 are normal, and whether

the insert loss is smaller than 2.5 dB.

Check whether PA output of

U3301 in WCDMA2100 is normal.

Check whether IQ signals of

U4001 and the power supply

voltage are normal.

Check U301.

End

Check U4001.

Check U3301.

Check U3302.

Check U3201 and U301.

Check J3201.N

Y

Y

Y

Y

Y

N

N

N

N




105

In WCDMA900, just replace U3301 detection with U4101 detection and replace U3302

detection with U4102 detection.

In GSM, just replace U3301 detection with U3601 detection and skip U3302 detection.

10.4 Charging Failure

Figure 10-8 shows the procedure for troubleshooting a charging failure.

Figure 10-8 Procedure for troubleshooting a charging failure

Charging failure

Check whether the battery

charger works properly.

Check whether J1501

is poorly soldered.

Check whether VPH_PWR

voltage exists.

Check whether the battery

contact is properly connected

to the battery.

Check whether the

battery is damaged.

Check U201.

Replace the

battery.

Repair J1501.

Replace U1001.

Re-solder J1501.

Replace the battery

charger.

Y

N

Y

N

N

Y

N

Y

Y

N




106

10.5 Camera Failure

Figure 10-9 shows the procedure for troubleshooting a camera failure.

Figure 10-9 Procedure for troubleshooting a camera failure

Camera failure

Check whether the

problem is resolved

after software is

reloaded.

Check whether J2101 is

improperly soldered.

Check whether the

problem is resolved after

the camera is replaced.

Replace U2101.

Replace U301.

End

End

Re-solder or

replace J2101.

End

N

Y

Y

Y

Y

N

N

N




107

10.6 Data Connection Failure

Figure 10-10 shows the procedure for troubleshooting a data connection failure.

Figure 10-10 Procedure for troubleshooting a data connection failure

Data connection failure

Check whether the

problem is resolved

when a proper USB

cable is used.

Check whether 5-pin mini USB

port is improperly soldered.

Check whether the BTB

connector is improperly

soldered on the K board.

Check whether the

primary FPC is normal.

Check whether J2602

is improperly soldered.

Check whether the


board software is reloaded.

Check whether

VCHG voltage exists.

Replace C2651.

Replace U201.

End

Re-solder J2602 or

replace the FPC.

Re-solder or

replace the FPC.

Re-solder the connector.

Re-solder the port.

End

Y

N

Y

Y

Y

Y

Y

Y

N

N

N

N




108

10.7 Call Receiving Failure

Figure 10-11 shows the procedure for troubleshooting a call receiving failure.

Figure 10-11 Procedure for troubleshooting a call receiving failure

Call receiving failure after a call

is set up

Check whether the

receiver volume is

properly set.

Check whether the

phone misjudges

headset insert.

Check whether the


the headset is replaced.

Replace U1701.

End

Replace the headset

connector.

End

N

Y

N

N

Y

Y




109

10.8 Call Sending Failure

Figure 10-12 shows the procedure for troubleshooting a call sending failure.

Figure 10-12 Procedure for troubleshooting a call sending failure

Call sending failure after

a call is set up

Check whether the


software is reloaded.End

Check whether the

microphone bias

voltage is 1.8 V.

Check U201.

Check whether the

problem is resolved

after the microphone

is replaced.

End

Replace U1701.

N

Y

N

Y

Y

N




110

10.9 Vibration Failure

Figure 10-13 shows the procedure for troubleshooting a vibration failure.

Figure 10-13 Procedure for troubleshooting a vibration failure

Vibration failure

Check whether the


software is reloaded.End

Check whether the


the motor is replaced.

Replace the primary

FPC.

End

Y

N

N

Y




111

10.10 No Ringtone

Figure 10-14 shows the procedure for troubleshooting a failure of no ringtone.

Figure 10-14 Procedure for troubleshooting a failure of no ringtone

No ringtone upon an

incoming call

Check whether

ringtone volume is

properly set.End

End

End

Check whether the


software is reloaded.

Check whether the problem is

resolved after the speaker is replaced.

Check whether the FPC

is properly installed.

Check whether the

problem is resolved

after the volume

board is replaced.

Replace U1701.

End

Reinstall or replace

the FPC.

N

Y

Y

Y

N

N

N

Y

N

Y




112

10.11 LCD Display Failure

Figure 10-15 shows the procedure for troubleshooting an LCD display failure.

Figure 10-15 Procedure for troubleshooting an LCD display failure

LCD display failure

Check whether the


software is reloaded.

Check whether the problem is

resolved after the LCD ZIF

connector is reinstalled.

Check whether the


the LCD is replaced.

Check whether the earth

impedance of T2010, T2011,

and T2012 is not 0 ohms.

Replace U301.

Replace U2001.

End

End

EndY

N

Y

Y

Y

N

N

N

Figure 10-16 shows T2010, T2011, and T2012.




113

Figure 10-16 T2010, T2011, and T2012

10.12 Key Failure

Figure 10-17 shows the procedure for troubleshooting a key failure.

Figure 10-17 Procedure for troubleshooting a key failure

Key failure

Check whether the

key dome is

properly connected.

Check whether the


the FPC is replaced.

Reload software.

Clear the key.

End

N

Y

Y

N




114

10.13 Headset Failure

Figure 10-18 shows the procedure for troubleshooting a headset failure.

Figure 10-18 Procedure for troubleshooting a headset failure

Headset failure after

a call is set up

Check whether the

receiver volume is

properly set.

Check whether the


the headset is replaced.

Check whether a headset

icon is displayed.

Replace U1701.

End

End

Replace the

headset connector.

N

Y

N

Y

Y

N




115

10.14 microSD Card Detection Failure

Figure 10-19 shows the procedure for troubleshooting a microSD card detection failure.

Figure 10-19 Procedure for troubleshooting a microSD card detection failure

microSD card detection failure

Check whether the problem

is resolved after the

microSD card is replaced.

Check whether card connector

of the microSD card is

improperly installed.

Check whether Q2301

is poorly soldered.

Replace Z2301.

Re-solder Q2301.

Replace the card

connector.

EndY

N

N

N

Y

Y




116

10.15 GPS Signal Reception Failure

Figure 10-20 shows the procedure for troubleshooting a GPS signal reception failure.

Figure 10-20 Procedure for troubleshooting a GPS signal reception failure

GPS signal reception failure

Check whether the GPS antenna is

properly connected to the

corresponding elastomer.

Check whether the GPS

channel is poorly soldered.

Reload software.

Replace the antenna or

elastomer.

Re-solder the channel or

replace corresponding

components.

N

Y

Y

N

W1-U00 Maintenance Manual 11 Solder Points on the PCB and BGA Chips



117

11 Solder Points on the PCB and BGA Chips

Figure 11-1 and Figure 11-2 show solder points on the PCB and BGA chips.

Figure 11-1 Solder points on the PCB

Ground

point

Null

point

W1-U00 Maintenance Manual 11 Solder Points on the PCB and BGA Chips



118

Figure 11-2 Solder points on the BGA

Ground

point

Null

point

W1-U00 Maintenance Manual 12 Functional Tests



119

12 Functional Tests

12.1 Keys

Figure 12-1 shows the W1-U00's keys.

Figure 12-1 Keys

Volume

up

Volume

down

Menu

Return

Power

Camera

Search




120

12.2 MMI Test

12.2.1 Test Method

Test methods are as follows:

Test passed: After a test is passed, the next test starts automatically. For tests to be

manually determined, press the volume down key to confirm the test success and

proceed with the next test.

Test failed: When a test fails and the power key is pressed, "Test Failed" is displayed.

Press the volume down key to proceed with the next test.

Returning to the previous test: During the MMI test, if the previous test is missed or

failed, press the return key to return to the previous test for retest. (For certain tests, you

cannot return directly. In this case, press the power key to confirm the test failure and

return to the previous test.)

12.2.2 Precautions

According to the implementation method of Microsoft, the MMI test can be initiated only by

entering the diagnostic code on the dialer, instead of the dialer for emergency dial.

If a phone is not powered off properly, there is a low probability that the MMI test cannot be

initiated. You can use the following methods to dodge the problem:

1. Touch and hold HWDiagnosticApp in the application list to display a menu shown in

Figure 12-2. Click Remove to remove the application. Then, enter ##2846579# on the

dial screen to install and run MMI.

Figure 12-2 Removing HWDiagnosticApp

2. Choose Setting > About and touch Reset to restore factory defaults.




121

12.2.3 Test Items

Table 12-1 lists MMI test items.

Table 12-1 MMI test items

No. Item Test Method and Contents

Diagram

1 MMI test entry 1. Install a microSD

card, SIM card, and

battery to the phone,

and power it on to

enter the SIM error

message or welcome

screen. The phone

restarts. Do not power

off the phone during

the process. After the

restart, the SIM error

message or welcome

screen is displayed

again. Then, set the

phone and install

preset applications.

After the installation,

a screen shown in

Figure 1 is displayed.

2. Open the dialer and

enter ##2846579#.

Wait for about 8

seconds (the first start

of MMI) for the start

of the diagnosis

application (as shown

in Figure 2).

3. Touch MMI test to

initiate the test, as

shown in Figure 3.

Figure 1 Figure 2

Figure 3 Figure 4




122


Diagram

2 Board

information

test

1. After the MMI test

starts, a daemon

automatically detects

phone information. If

the state of BC, CT, or

BT is F (fail), "Board

Test Failed" is

displayed, as shown in

Figure 5. Press the

volume down key to

proceed with the next

test.

2. If the state of BC, CT

and BT are P (pass),

the test succeeds. No

message is displayed

and the next test starts

automatically.

Figure 5

3 Key test 1. Follow the onscreen

instructions to press

keys. The

corresponding

position is highlighted

in the schematic

diagram.

2. After all keys are

highlighted in the

schematic diagram

(indicating that the

test succeeds), press

the volume down key

to proceed with the

next test.

3. If the test fails, press

the power key to

confirm the test failure

and press the volume

down key to proceed

with the next test.

NOTE

When you press the camera

key on the lower right half

way down, it turns blue.

When you press the camera

key all the way down, it

turns red. Only when it is

blue and red on the

schematic diagram, the key

is normal, as shown in

Figure 7. Then, press the

volume down key to

proceed with the next test.

Figure 6 Figure 7




123


Diagram

4 Rear camera

test

1. Test the rear camera

and flash as follows:

Preview the color

palette on the

screen and check

for abnormal color

display, ripple,

paint, color cast,

and picture display

failure.

If a flash is

available, a

message is

displayed on the

camera screen,

requiring a flash

test. Press the

volume up key to

perform the test.


the power key to



down key to proceed

with the next test.

3. If the test succeeds,

press the volume

down key to proceed

with the next test.

Figure 8

5 Front camera

test

1. Test the front camera

as follows:

Preview the picture of

the front camera (as

shown in Figure 9)

and check for

abnormal color

display, ripple, paint,

color cast, and picture

display failure.


the power key to



down key to proceed

with the next test.


press the volume

down key to proceed

with the next test.

Figure 9




124


Diagram

6 SIM card test 1. A daemon


the SIM card. If no

SIM card is detected,

a message is

displayed, indicating

the error, as shown in

Figure 10. Press the

volume down key to


test.

2. If a SIM card is

detected, no error will

be indicated and the

next test starts

automatically.

Figure 10

7 microSD card

test

1. A daemon


the microSD card. If

no microSD card is

detected, a message is

displayed, indicating

the error, as shown in

Figure 11. Press the

volume down key to


test.

2. If a microSD card is

detected, no error will

be indicated and the

next test starts

automatically.

Figure 11




125


Diagram

8 LCD test 1. Enter the LCD test

screen in Figure 1. A

white picture is

displayed.

2. Press the volume

down key. A black

picture is displayed, as

shown in Figure 12.

3. Press the volume

down key again. A

picture of red, green,

and blue is displayed,

as shown in Figure 13.

4. If pictures are not

displayed properly,

press the power key to



down key to proceed

with the next test.


press the volume

down key to proceed

with the next test.

Figure 12 Figure 13

9 Backlight and

tri-color LED

test

1. The test screen is

shown in Figure 14.

The backlight turns

bright gradually.

Check the test.

2. Tri-color LED works

with the backlight to

display red, blue, and

green. Check the test.

3. If colors are not

displayed properly,

press the power key to



down key to proceed

with the next test.


press the volume

down key to proceed

with the next test.

Figure 14




126


Diagram

10 Key LED light

test

1. The keyboard light

flickers automatically.

Check whether it is

normal.


the power key to



down key to proceed

with the next test.


press the volume

down key to proceed

with the next test.

Figure 15

11 Touchscreen

test

1. Touch the screen

along its edges until

all sides of the screen

turn red, as shown in

Figure 17.

2. If the screen does not

respond or responds

slowly, mark the

phone as defective.


the power key to



down key to proceed

with the next test.


press the volume

down key to proceed

with the next test.

NOTE

Do not touch the screen

with a finger cot or glove to

prevent impact on the

function.

Figure 16 Figure 17




127


Diagram

12 Proximity

sensor test

1. Enter the proximity

sensor test screen

shown in Figure 18.

Note that proximity

light test must be

performed in the same

light, that is, do not

change high light to

low light or vice versa

during the test.

2. Approach the

proximity sensor of

the phone with a

finger until the call

answering screen is


Figure 19. Move away

the finger. A non-call

answering screen is


Figure 18. Repeat the

steps once. The test

succeeds and the next

test starts

automatically.


the power key to



down key to proceed

with the next test.

Figure 18 Figure 19

13 Environmental

light induction

test

1. Turn the phone

forward and backward

for once or twice so

that the phone can

sense light change.

When controlling

software automatically

detects a light

intensity greater than

150.0, the test

succeeds.


the power key to



down key to proceed

with the next test.

Figure 20




128


Diagram

14 Gravity sensor

test

1. Put the phone on the

specified fixture with

an angle of 45° for 1

second. The test

succeeds and the next

test starts

automatically.


the power key to



down key to proceed

with the next test.

Figure 21

15 Motor test 1. The phone vibrates at

a certain frequency.


the power key to



down key to proceed

with the next test.


press the volume

down key to proceed

with the next test.

Figure 22




129


Diagram

16 Loudspeaker

test

1. The phone plays

music circularly and

automatically. Check

for no sound, low

voice, noise, and

distortion.

NOTE

Keep the phone 30 cm

away from your ear. Do not

block the loudspeaker.


the power key to



down key to proceed

with the next test.


press the volume

down key to proceed

with the next test.

Figure 23

17 Receiver test 1. The phone plays

music circularly and

automatically. Check

for no sound, low

voice, noise, and

distortion in the

receiver.


the power key to



down key to proceed

with the next test.


press the volume

down key to proceed

with the next test.

Figure 24




130


Diagram

18 Microphone

voice loopback

test

1. Enter the microphone

voice loopback screen

shown in Figure 25.

Touch Record. The

button changes to

Play, and the phone

starts recording using

the primary

microphone. The

recording lasts for up

to 12 seconds. You

can touch Play to stop

the recording and play

it using the receiver.

The primary

microphone is at the

bottom of the phone.

Record in call mode.

Check the function.

Test the secondary

microphone and both

microphones in the

same way (if there is a

secondary

microphone). Cover

the secondary

microphone with a

finger during the test

for the primary

microphone and cover

the primary

microphone during the

test for the secondary

microphone. Do not

cover microphones

during the test for both

microphones.


the power key to



down key to proceed

with the next test.


press the volume

down key to proceed

with the next test.

Figure 25




131


Diagram

19 Headset voice

loopback test

1. Install the headset.

2. Touch Record on the

screen. The button

changes to Play, and

the phone starts

recording using the

headset microphone.

The recording lasts for

up to 12 seconds. You

can touch Play to stop

the recording and play

it using the headset.

Check the function.

Do not remove the

headset after this test

for headset line

control test.


the power key to



down key to proceed

with the next test.


press the volume

down key to proceed

with the next test.

Figure 26




132


Diagram

20 Headset line

control test

1. Because the headset is

installed during the

headset voice

loopback test, the in

button is green.

2. Press the answer key

on the headset and

observe whether the

button in the middle

changes.

3. Remove the headset

and observe whether

the out button turns

green.


the power key to



down key to proceed

with the next test.


press the volume

down key to proceed

with the next test.

Figure 27

21 Bluetooth test 1. When the MMI test

starts, the phone

searches for Bluetooth

devices in the

background. Media

Access Control

(MAC) addresses of

found Bluetooth

devices are listed, as

shown in Figure 28.

2. If Bluetooth devices

are found, the test

succeeds. Otherwise,

the test fails.

3. Press the volume

down key to proceed

with the next test.

Figure 28




133


Diagram

22 Wi-Fi test 1. Touch Start Wi-Fi

test on the Wi-Fi test

screen to open the

Wi-Fi settings screen.

Enable Wi-Fi and

check whether Wi-Fi

hotspots are found.

2. Wait for about 10

seconds. If Wi-Fi

hotspots are found,

touch the return key.

The Wi-Fi test screen

is displayed and the

test succeeds. Press

the volume down key

to proceed with the

next test.

3. If no Wi-Fi hotspots

are found, touch the

return key. The Wi-Fi

test screen is

displayed. Press the

power key to confirm

the test failure and

press the volume

down key to proceed

with the next test.

Figure 29 Figure 30

Figure 31




134


Diagram

23 Test result

display and

factory

defaults

restoration

After all MMI functions

are tested, test results are

displayed.

1. Failed test items are

listed on the screen, as

shown in Figure 32.

2. If all tests are passed,

"Test succeeds. Do

you want to restore

factory defaults?" is

displayed on the

screen, as shown in

Figure 33. Touch Yes

to restore factory

defaults or touch No

to display "MMI test

succeeds." (as shown

in Figure 34).

3. Tests are completed.

Press the volume

down key to exit the

MMI test.

Figure 32 Figure 33

Figure 34




135

12.3 Voice Call Test

To perform a voice call test:

Step 1 Install a SIM card and battery on the phone.

Step 2 Press and hold the power key to power on the phone.

Step 3 Check whether the signal strength displayed on the LCD is normal (given that the network is

normal).

Step 4 Make a call to a fixed-line phone, and check the voice quality during the call.

Step 5 If no problems are found, finish the voice call test. If any problems are found, troubleshoot

the phone or send it to an advanced service site for repair.

----End

Huawei w1 u00 maintenance manual service manual

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