Http:// OCT.2007 P. 1 Formosa Microsemi Co., LTD Company Profile.

OCT.2007 P. 1

http://www.formosams.comhttp://www.formosams.com

Formosa Microsemi Co., LTDFormosa Microsemi Co., LTD

Company ProfileCompany Profile

OCT.2007 P. 2


Company Profile* Company Overview

* Company Policy

* Company Organization

* Quality Certificate

* Product Construct

* Patent Certificate

* Revenue Growth

* Factory Equipment

* Product Capacity

* Package List & New Package Development Plan

* Major Customers

OCT.2007 P. 3


1 Established JUL.1996

2 President Mr.Ben W.P.Huang

3 Capital USD 8.5M

4 Employees 450

5 Address 5F,NO.208,Sec.3,Chung Yang Road,Tucheng,Taipei Hsien,Taiwan

Company Overview

OCT.2007 P. 4


Main Products

• Schottky Barrier Diode

• Switching Diode

• Zener Diode

• General Purpose Rectifier

• Fast Recovery Rectifier

• Super Fast Rectifier

OCT.2007 P. 5


Taiwan Factory

Located : Taipei , Taiwan

OCT.2007 P. 6


MainLand China Factory

Located : HangZhou

OCT.2007 P. 7


Located : HangZhou


OCT.2007 P. 8


Located : SuZhou


OCT.2007 P. 9


InnovationInnovation

QualityQuality

ServiceService

Company Policy

OCT.2007 P. 10


Company OrganizationTaiwan FMS Board

Director

General Manager Mr. Ben Huang

Taiwan Factory Mr. Ben Huang

Rectifiers

Diode

Small Signal

Bridge

Others

SuZhou Factory Mr. David X

u

Switching Diode

Diac Diode

Others

China Local Sales Company

HangZhou Formosa Mr. Stephen Huan

g

ShenZhen office Mr.Jet Chang

Taiwan Local Sales

Company

Formosa Technology

HangZhou Factory Mr. Yang QiJI

Wafer FAB

Rectifiers

OCT.2007 P. 11


ISO 9001:2000 ISO 9001 ISO14001ISO 9001:2000 ISO 9001 ISO14001

Quality Certificate

OCT.2007 P. 12


Formosa MS - SMAFormosa MS - SMA Traditional - SMATraditional - SMA1. The contact pin picks trimming, the curved formation, in the process the material easy indirect damage, the quality not to be easier to control.

2. The copper lead frame only has 0.2mm thickness.

3. The outlook big, thickness is high, the user must consider gives the bigger spatial design, is more uneconomical.

4. Traditional outlook.

5. The soldering contact face picks the machinery formation, smoothness is worse.

6. Process on the traditional control, the quantity produces slowly.

Product Construct

1. Light

2. Thin

3. Short

4. Small

5. The quality is good (High quality)

6. The patent system process , has competitiveness

OCT.2007 P. 13


Taiwan Patent Taiwan Patent No.124076No.124076



Patent Certificate

表面黏著型整流二極表面黏著型整流二極體之製造方法體之製造方法

表面黏著型排列二極表面黏著型排列二極體之製造方法體之製造方法

無引線型片狀橋式整無引線型片狀橋式整流器之構造流器之構造

OCT.2007 P. 14





表面黏著型整流表面黏著型整流二極體之結構改良二極體之結構改良

雙金屬與陶瓷組成之功率雙金屬與陶瓷組成之功率半導體構造及其製造方法半導體構造及其製造方法

功率半導體之散熱構造功率半導體之散熱構造

Patent Certificate

OCT.2007 P. 15


Japan Patent Japan Patent No.3105138No.3105138

U.S.A. Patent U.S.A. Patent No.6,085,396No.6,085,396

U.S.A. Patent U.S.A. Patent No.6,334,971 B1No.6,334,971 B1

功率半導體之冷卻裝置功率半導體之冷卻裝置整流二極體之製造方法整流二極體之製造方法表面黏著型排列表面黏著型排列二極體之製造方法二極體之製造方法

Patent Certificate

OCT.2007 P. 16


China Patent China Patent No.ZL99109757.2No.ZL99109757.2

China Patent China Patent No. ZL 00 1 21446.7No. ZL 00 1 21446.7

China Patent China Patent No. ZL 2004 2 0050732.3No. ZL 2004 2 0050732.3

表面黏著型整流表面黏著型整流二極體之製造方法二極體之製造方法

表面黏著型排列表面黏著型排列二極體之製造方法二極體之製造方法

功率半導體之散熱構造功率半導體之散熱構造

Patent Certificate

OCT.2007 P. 17


0

200

400

600

800

1000

1200

1400

1600

1800

1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007

ForecastForecast

Revenue Growth

Unit : Million NTD

OCT.2007 P. 18


Lightning Strike Tester Thermal Resistance Tester

Equipment for Hi-Reliability

OCT.2007 P. 19


H.T.R.B. Tester OP.LIFE Tester


OCT.2007 P. 20


VF / PIV / IR / Trr Test Equipment Temperature Cycle Equipment


OCT.2007 P. 21


Delta VF & Forward Surge Tester Solder Ability Equipment


OCT.2007 P. 22


Package KK pcs / Month

DO-35 ( Glass ) 50

DO-34 ( Glass ) 10

DO-41 ( Glass ) 10

DO-41/DO-15 /DO-201 100

R-6 5

Micro-Melf ( Glass ) 10

SOD-80 / Mini-Melf ( Glass ) 20

DL-41 / Melf ( Glass ) 10

SOD-323 / 0805 / Micro SMA 20

SOD123 / Mini SMA 10

DO-214AC / SMA / SMA-L 50

DO-214AA / SMB 10

DO-214AB / SMC 10

DPAK 10

D2PAK 10

Wafer Size pcs / Month

3 Inch 300,000

4 Inch 300,000

AxialAxial

SMDSMD

Diffusion Diffusion WaferWafer

Product Capacity

OCT.2007 P. 23


YearsPackage

2001

SOD-323

ASD/0805

SMC

2007

SOD-123

SMA

SMB

1999 2000 2005 2006 2008

DFS

SOD-923

2002 2003 2004

SOD-723

TO-263

TO-252

SOD-523

SMD Package List & New Package Development Plan

OCT.2007 P. 24


Major Customers

OCT.2007 P. 25


Major Customers

OCT.2007 P. 26


Forever innovation create aForever innovation create aFamous diode in the world to buildFamous diode in the world to buildFirst class enterpriseFirst class enterprise

Thank YouThank You

Company Vision

永續經營持續創新永續經營持續創新建立二極體知名品牌建立二極體知名品牌創造卓越的企業創造卓越的企業

Http:// OCT.2007 P. 1 Formosa Microsemi Co., LTD Company Profile.

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