HP ProLiant SL6000 G6
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Transcript of HP ProLiant SL6000 G6
© 2009 Hewlett-Packard Development Company, L.P.The information contained herein is subject to change without notice.
HP ProLiant SL6000 G6
Technology for better business outcomes
Doug TuckerJune 2009
2June 2009 – HP Restricted. For HP and channel partner internal use.
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HP ProLiant SL6000 Scalable SystemProduct Overview
The HP ProLiant SL6000 Scalable System uses a highly efficient and modular power & cooling infrastructure that enables a suite of pluggable server modules optimized
around a standard 19” rack
Key Benefits
More affordable compute power
Double the compute density over traditional rack servers
Greater levels of efficiency with shared power and thermals
Highly configurable for different application requirements
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SL Product Line Naming
System HP ProLiant SL6000 Scalable System
Chassis HP ProLiant z6000 G6 Chassis
ServersHP ProLiant SL160z G6 Server
HP ProLiant SL170z G6 Server
HP ProLiant SL2x170z G6 Server
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Modular – Designed for Max Efficiency Multi-node, Shared Power & Cooling ArchitectureHigher• ROI• Power efficiency• DensityLower• TCO• Acquisition cost• Pwr/cooling cost
Multi-node, Shared Power & Cooling ArchitectureHigher• ROI• Power efficiency• DensityLower• TCO• Acquisition cost• Pwr/cooling cost
• Energy efficient fans (2U), optional N+1
• Energy efficient fans (2U), optional N+1
• Variety of optimized Node Modules
• Variety of optimized Node Modules
• Reduced weight (shipping cost)
• Reduced weight (shipping cost)
• Unrestricted airflow (no mid-plane or I/O connectors)
• Unrestricted airflow (no mid-plane or I/O connectors)
• Shared Power & Fans
• Shared Power & Fans
• Optional Hot-Plug Redundant PSU
• Optional Hot-Plug Redundant PSU
1 or 2 HP Standard PSUs
1 or 2 HP Standard PSUs
• 3 PSU options
• 3 PSU options
• Standard 19” racks, with front I/O cabling• Standard 19” racks, with front I/O cabling
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HP ProLiant SL6000 Components
10U bulk rail optimized for HP
Racks
Pluggable Server Tray (up to 2 x 2S Servers)
2U Chassis
DL100 series Rail for HP & 3rd Party Racks
HP or 3rd Party Rack
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HP ProLiant z6000 ChassisFeatures:
• Support for (2) 2P (socket) server trays
• Shared Fans, High Efficiency, N+1 Redundancy
• 2U Shared Power−Support for 460W, 750W, or 1200W
AC configurations
−Full Hot Plug RPS, or ebrake RPS support
• Multi-node Efficiency−Shared fan control
−Power capping & measurement
−Optional interface to Rack Control Module
• HP 10k G2 rack optimization−Bulk 10U rail system for lowest cost
• 3rd Party rack support−Supports common DL100 rail
• Front I/O Cabling−Easy serviceability
High efficiency (92%) common slot power
supplies
High efficiency N+1 Redundant Fans
Server Trays
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HP ProLiant SL160z HP ProLiant SL170z HP ProLiant SL2x170z
Maximum expansion with 18 DIMM slots and up to 2 PCIe slots
Maximum storage capacity with up to 6 LFF SATA or SAS hard drives
Maximum compute density with two servers per tray (1U)
Ideal Application Ideal Application Ideal Application
HPC database tierWeb memory-cache
Web SearchWeb database
HPC compute intensiveWeb front end
Target Markets− Scale-out: Web Farms, ISPs, ASPs, Etc…− Web 2.0: Social networking, Shared Content, Blogs, Etc …− HPC: Oil & Gas, Financial, Entertainment, Scientific, Government,
Etc...
HP ProLiant SL6000 Ideal Environment
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HP ProLiant SL160z
HP ProLiant SL160z
ProcessorChipset
• 2P Intel 5500 series• Intel® 5520 Chipset
Memory • 18 DDR3 DIMM Sockets
Storage• HP Embedded SATA controller w/sw
RAID• Up to 2 NHP LFF HDDs
Networking • Embedded Dual Port 1GbE NICs
I/O Expansion
• 1 x16 FH PCIe Gen 2 slot
Management• Standards based DCMI & IPMI • Basic Functionality, node-level power on/off
Additional Features
• High efficiency(>90%) @ 50%+ load• Hot Plug, N+1 PSU (optional)
Density• 2 server nodes in 2U • 1 EATX nodes in 1U tray
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HP ProLiant SL160z – Front View in z6000 Chassis
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VideoPort
(2) USBPorts
SerialPort
UIDPowerButton
Low Profile
PCI Slot
(2) 1Gbit NIC
Health LED
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HP ProLiant SL160z – Inside View
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Low Profile x16PCIe
Slot
18 DIMM Slots
Up to 2 Intel 5500 series processors
OptionalX4
internal PCIe slot
2 LFF SATA or SAS Hard Drives using quick release drive carrier
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HP ProLiant SL170z
HP ProLiant SL170z
ProcessorChipset
• 2P Intel 5500 series• Intel® 5520 Chipset
Memory • 16 DDR3 DIMM Sockets
Storage• HP Embedded SATA controller w/sw RAID• Up to 6 NHP LFF HDDs
Networking • Embedded Dual Port 1GbE NICs
I/O Expansion • 1 x16 LP PCIe Gen 2 slot
Management• Standards based DCMI & IPMI• Basic Functionality, node-level power on/off
Additional Features
• High efficiency(>90%) @ 50%+ load• Hot Plug, N+1 PSU (optional)
Density• 2 server nodes in 2U chassis• 1 ea, EATX PCAs in 1U module
12June 2009 – HP Restricted. For HP and channel partner internal use.
HP ProLiant SL170z - Front View in z6000 Chassis
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VideoPort
(2) USBPorts
SerialPort
UID
Low Profile
PCI Slot
(2) 1Gbit NIC
Health LED
OptionalLO100
dedicated Management
Port
PowerButton
13June 2009 – HP Restricted. For HP and channel partner internal use.
HP ProLiant SL170z – Inside view
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Low Profile x16PCIe
Slot16 DIMM Slots
Up to 2 Intel 5500
series processors
6 LFF SATA or SAS Hard Drives using Quick Release
drive carrier
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HP ProLiant SL2x170z
HP ProLiant SL2x170z (per each SL170 system board)
ProcessorChipset
• 2P Intel 5500 series• Intel® 5520 Chipset
Memory • 16 DDR3 DIMM Sockets
Storage• HP Embedded SATA controller w/sw RAID• 1 NHP LFF HDDs (2 in tray, 1 per node)
Networking • Embedded Dual Port 1GbE NICs
I/O Expansion •1 x16 LP PCIe Gen 2 slot
Management• Standards based DCMI & IPMI• Basic Functionality, node-level power on/off
Additional Features
• High efficiency(>90%) @ 50%+ load• Hot Plug, N+1 PSU (optional)
Density• 4 server nodes in 2U• 2 half-EATX nodes in 1U tray
15June 2009 – HP Restricted. For HP and channel partner internal use.
HP ProLiant SL2x170z - Front View in z6000 Chassis
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VideoPort
(2) USBPorts
SerialPort
UID
Low Profile
PCI Slot(2)
1Gbit NIC
Health LED
OptionalLO100
dedicated Management
Port
PowerButton
16June 2009 – HP Restricted. For HP and channel partner internal use.
HP ProLiant SL2x170z – Inside view
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Low Profile x16PCIe
Slot
16 DIMM Slots per system
board
Up to 2 Intel 5500 series processorsper SL170z
system board
2 LFF (1 per server) SATA or SAS Hard Drives using Quick Release
drive carrier
Low Profile x16PCIe
Slot
(2) SL170z system boards
Power Strategy
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Power Redundancy• Supports Common Slot power supply
− Common slot – 1200W, 750W, 460W options− Allows you to choose right sized power supply for your configuration and run
higher up the efficiency curve.
• Three implementations available for shared power supplies:− No Redundancy
• Run entire z6000 chassis with 1 power supply• Combination of both trays need to fit in the power envelop of the power supply
− Full AC/DC redundancy • Using 2 power supplies to run z6000 chassis• If one power supply fails and the servers fit in the remaining power supply’s power envelop, servers
will continue to run with no interruption
− AC redundancy w/ throttling• Using 2 Power supplies to run z6000 chassis• If one power supply fails and the total power used by the server trays is greater than the remaining
power supply, the servers will throttle down to fit in the remaining power supply’s power envelop
Full Rack Pictures
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Front View
Technology for better business outcomes
HP Datacenter Environmental Edge
Brandon FearsJune 2009
On The Road to Energy Efficiency…• Why the concern about energy?• How Energy Efficiency can affect your
business?• Today’s Power and Cooling Challenges
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How energy efficiency can affectyour businessBusiness impact related to power and cooling issues
Server or system
downtime
Increased operational
costs
Datacenter outage
Inability to add capacity
Increased operational
costs
Fail to support business growth
Loss of revenue Increased operational
costs
Lowered customer
satisfaction
•Portfolio
•HP Insight Environmental Observer visualization
•HP Datacenter Environmental Edge Benefits
•Standard recommended configuration
•HP Datacenter Environmental Edge FAQ
HP Datacenter Environmental Edge Solution Portfolio
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HP Environmental Edge HP Insight Environmental Observer
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Monitoring Points
Racks:Temp
Humidity
Subfloor:Pressure Differential
CRAH:Temp
HumidityPowerChilled Water:
FlowTemp
PDU:KWH Usage
Visualization
Real-time Insight from rack level data center environmental sensors
Energy Avg. data center savings 12% to 18%
Cooling
Up to 30% increase in cooling capacity,
delays additional cooling infrastructure
purchases / build new datacenter
Increase subfloor differential pressure
up to 40%
Installation Simplicity
No data center pre-requisites, non-
invasive installation
HP Technical Services
Installed in 1 day per 500 m2 /5000 ft.2
Notification Real-time notification / Alarming
Cost Typical break even 9 to 14 months
Insight Environmental Observer
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HP Insight Environmental Observer S/W Datacenter Visualization
HP Confidential
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HP Environmental Edge Benefits: Air / Cooling Management Based on Solid Data not Intuition
28 * See “Edge ROI” slide for more details.
Remediation NotificationChange Management
•Fix inefficiencies: air flow / mgmt, CRAH over provisioning, humidity control optimization, rack overcooling, floor tile placement•Reduce power consumption up to18%*•Track environmental trends up to 180 days
•Reduce downtime•Visualize how datacenter changes impact air flow, temperature, etc.•Optimize rack air mixing / bypass•Benchmark key datacenter infrastructure metrics
•Every 60 seconds on critical changes based on user defined parameters•Alerts via text, email, SNMP•Communicate alerts to other systems via SNMP
Reduce Fan Energy / Improve AC Efficiency / Increase Cooling Capacity
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HP Datacenter Environmental Edge Continuous Improvement Process
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3. Analyze Detailed data:•Rack and CRAC/CRAH view•Air pressure, humidity, temp, power•Historical trending/graphing
1. Visualize Temp & Humidity
2. Visualize Air Pressure
4. Implement Changes
5. Visualize Change Results
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HP CONFIDENTIAL - DO NOT DISTRIBUTE30 April 22, 2023
Edge ROI: Energy Savings and Increased Cooling Capacity
Company Utility Fortune 100 technology Financial services
PUE Initial 1.7, projected 1.5 Initial 1.9, projected 1.7 Initial 1.7, projected 1.5
Energy savings 13% 18% 12%
Carbon savings 59 metric tons 2032 metric tons 513 metric tons
Datacenter Size
2,900 ft2 / 290 m2 25,900 ft2 / 260 m2 13,000 ft2 / 130 m2
Capacity increase
22% 33% 8%
Objectives Visibility and alarms
ID risks
Optimize DC ops
Energy Capacity
24 x 7 visibility, alerts, and so on
ID risks
Baseline & optional DC ops
Energy Capacity
24 x 7 visibility, alerts, and so on
ID risksBaseline & optional
DC ops
Energy Capacity
Findings Identified:
•Poor tile placement
•Benefits of blanks
•Remediation will result in the ability to turn off 2 CRACs
Identified:
•Low sub-floor pressure
•Bad tile placement
Remediation:
•Resulted in 2–3 times pressure increase
•Allowed for 13 of 28 CRACs to be turned off
•Goal: Reduce bypass and recirculated air
•104 racks over-cooled 76% of the time
•Improved airflow management and enabled manual VFD control
31June 2009 – HP Restricted. For HP and channel partner internal use.
HP Datacenter Environmental Edge Components• Core solution
− Wireless rack temperature and humidity sensors
− Air pressure sensors every 500 ft2/50 m2
− Insight Environmental Observer S/W
− Hardware and Software installation
• Additional sensors and services− KWH Meters− Chilled water flow− Rack door position− Water leak detection
32June 2009 – HP Restricted. For HP and channel partner internal use.
Why HP Datacenter Environmental Edge?
• Fast and simple to deploy− Approx. 20 hours per 5K ft.2
− Wireless battery powered base stations• Wireless network security features
− Wireless gateway isolated from LAN via serial interface − 128 bit AES encryption
• Can be deployed in any data center− Rack and CRAH vendor agnostic
• Cost-effective solution• Enable rapid decision-making based on 2-D visualization• Easy reconfiguration as data center layout or infrastructure
changes− Customer self-repair and maintenance − 24X7X365 WW HP Support− Global availability− Available direct from HP or from channel partner
33June 2009 – HP Restricted. For HP and channel partner internal use.
Contacts
USUS
EMEAEMEA [email protected]@hp.com
APJAPJ
[email protected]@hp.com
[email protected]@hp.com
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Thank you!