High-Performance ASIC SolutionsFujitsu Microelectronics America, Inc. July 2002 1 High-Performance...
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1Fujitsu Microelectronics America, Inc. July 2002
High-Performance ASIC Solutions
for the Metro & Long Haul Markets
“Growth through Innovation”
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2Fujitsu Microelectronics America, Inc. July 2002
Overview – High-end ASICs
• Business Strategy• Target Markets• Products
• Process Technology• Packaging Roadmap• High-Speed I/O Offerings• Current Advanced ASICs
• Case Study
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3Fujitsu Microelectronics America, Inc. July 2002
Fujitsu Limited Business Strategy
IntegrationCustom
ers
Customers
Customers
PlatformsTechnologies
(ElectronicDevices)
Customers
Service(Products)
Value Chain
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4Fujitsu Microelectronics America, Inc. July 2002
Target Markets – High-end ASICs
High-endAccess
Metropolitan Area Network
Long Haul
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5Fujitsu Microelectronics America, Inc. July 2002
The Fujitsu Advantage – High-end ASICs
• Technology• Robust process technologies like 0.09µm, 0.11µm and 0.18µm to support
high-end ASICs• Wide array of high-performance packages like 2116 FCBGA or 892 EBGA• Key high-speed I/O macros in the range of 2.5Gbps-10Gbps (CMOS)
• Manufacturing• Cutting-edge wafer-fabrication facilities (200mm) all done in house in Japan• Modern facilities (also in house) for assembly and testing for high-
performance Flip-Chip packaging• Quick turn-around time available to meet customers’ time-to-market needs• Special services like burn-in, load boards, test boards also available
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6Fujitsu Microelectronics America, Inc. July 2002
The Fujitsu Advantage (Cont’d)
• Sales/Services• Strong sales force with six U.S.-based sales offices from coast to
coast• Fully staffed U.S. design centers in California, Texas and North
Carolina • Key support for ASICs via Customer Response Centers
• Employees• Unsurpassed experience in supporting key ASIC designs• Rich engineering skill-sets to execute complex, next-generation
ASIC designs• Multi-disciplined teams providing class “A” support
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7Fujitsu Microelectronics America, Inc. July 2002
Why Fujitsu?
Leading-edge Process & Packaging Technology• 0.11µm & 0.18µm processes• High-speed FCBGA with >2000 pins• 256Mb FCRAM interface & other high-speed SRAM• 250-300MHz clock frequency
High-speed I/Os as per OIF Standards• 2.5Gbps-3.125Gbps• SPI-4 & SPI-5 interfaces• SFI-4 & SFI-5 interfaces• HSTL & SSTL I/Os
Robust Design & Manufacturing Capabilities• Timing-driven hierarchical design methodology• Multiple design center locations• In-house wafer, assembly and test operations
Obtain a successful working ASIC first time around
Ensure interoperability as per industry standards
Build a high performance ASIC with leading-edge technology
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8Fujitsu Microelectronics America, Inc. July 2002
10K 100K 1M 10M
0.25µm CE71/CS712.5V
CE81/CS81 1.8V0.18µm
CE91/CS91
100M
1.2V0.11µm
CE77
CE100/CS100 1.2V0.09µm
Introduced
Volume Production
Volume Production
Development
CE200/CS200
Gates
R & D 1.0V
ASIC Product Road Map
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9Fujitsu Microelectronics America, Inc. July 2002
40, 65, 85nm Gate Lengthwith Advanced ArF Lithography
Advanced Multilevel Interconnectwith Cu Dual Damascene
and Low k dielectric(Effective k = 3.0)
Small SRAM Cell Size = 1.27um2
High-performance Tr(Low Leakage, High Speed,
Low Voltage)
Mixed Signal, RF and I/O Options
90nm-node Technology Features
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10Fujitsu Microelectronics America, Inc. July 2002
Cu Dual Damascene (9 Cu Layer + 1 Al Layer)Full Low k Material
Cu
Al
90nm-node Interconnect Technology
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11Fujitsu Microelectronics America, Inc. July 2002
FC-PBGA
400 1200 1600800Package Pin Count
0 2000
Ther
mal
/ El
ectr
ical
Per
form
ance
QFP
EBGA
FDH-BGA
TAB-BGA
PBGA
FC-CBGA
ASIC High Pin-Count Packages
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12Fujitsu Microelectronics America, Inc. July 2002
Future
- Various process die on the package
Current- Pin count (~2116)- On board Clk 3.2Gbps
- Substrate with integrated passive(LCR)- Low-K substrate
-Low-K substrate
2003-2004- Pin count (~3000)- On board Clk 10Gbps
Package Technology Roadmap
• Fujitsu holds the number-one position in package technology
• Leadership position enables Fujitsu to define packaging trends
• Fujitsu’s packages are found in many high-end ASICs & FPGA solutions
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13Fujitsu Microelectronics America, Inc. July 2002
622Mbps
1.25Gbps
2.5Gbps
5.0Gbps
0.25µmCS70
1997-99
0.18µmCS80A2000-01
0.09µm (0.09)CS100A2003-04
5-6.4G Async
Dat
a R
ate
per c
hann
el (G
bps)
2.5-3.125G Asyncwith 622M/1.25G mode
10.0Gbps 10-12.8G Async
0.13µm (0.11)CS90A2002-03
40G Async
622-780M OIF (SFI-4, SPI-4p2)
2.5-3.125G OIF (SFI-5, SPI-5)3.125G XAUI (10G Ethernet)
1.25G Async
40.0Gbps
High-Speed Interface CMOS Macros
*TN: technology nodeLG: gate length on Si
100ps
FJTN (LG)*
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14Fujitsu Microelectronics America, Inc. July 2002
Current Advanced ASICs
• Large-scale integration >12M gates• High-speed performance core >250MHz• Large pin-count package >2000 pins
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15Fujitsu Microelectronics America, Inc. July 2002
Success Story – Foundry Networks, Inc.
• Complex, high-density, high-speed ASIC designs for network applications
• 5 months from project kick-off to delivery of all prototypes
• Keys to success• Advanced process and packaging technologies• Advanced design methodology for critical
timing closure• Strong design support • Quick fabrication of prototype
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