High aspect ratio, microstructure-covered, macroscopic surfaces
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amine salts, hydroxylamine com- plexes, and in a quantity of 500 to 5,000 ppm of hydroxylamine, and manganese 0.1 to 5 g/L. PLATING ROTOGRAVURE CYLINDERS U.S. Patent 6,197,169. Mar. 6, 2001 H. F. Metzger, Brookfield, Wis. An apparatus and method for electroplating rotogravure cylin- ders using ultrasonic energy. PLATING PIN-GRID ARRAYS U.S. Patent 6,197,171. Mar. 6, 2001 E.F. Lopergolo et al., assignors to International Business Machines Corp., Armonk, N.Y. A pin-contact mechanism for plat- ing pin-grid arrays. ELECTROPHORETIC DIP PAlNTlNG PLANT U.S. Patent 6,197,175. Mar. 6, 2001 H. Kisi et al., assignors to Durr Systems GmbH, and DaimlerChrysler AG, both of Stuttgart, Germany An electrical contacting system for an electrophoretic dip painting plant for motor vehicle bodies that are guided through an elec- trophoretic dip paint bath com- prising an overhead conveyor having a plurality of conveyor hangers for engaging beneath body carriers. PULSE-MODULATED ELECTROCOATING PROCESS U.S. Patent 6,197,179. Mar. 6, 2001 K. Arit et al., assignors to BASF Coatings AG, Muenster-Hiltrup, Germany A method for electrochemical coating of objects with a resinous coating material comprising ap- plying a direct current to a bath of a cationic resinous coating mate- rial; pulse-modulating a DC volt- age of the direct current by super- imposing thereon an adjustable AC voltage component, wherein the pulse-modulation of the DC voltage is connected and discon- nected with an adjustable duty ratio; and coating an object while applying the direct current. HIGH ASPECT RATIO, MICROSTRUCTURE-COVERED, MACROSCOPIC SURFACES U.S. Patent 6,197,180. Mar. 6, 2001 K. W. Kelly, assignor to Board of Supervisors of Louisiana State University and Agricultural and Mechanical College, Baton Rouge, La. A process for producing micro- structures on a metal surface comprising heat-shrinking a non- conductive polymer sheet onto the metal surface wherein the non- conductive sheet contains a plu- rality of holes; and electroplating metal onto the metal surface with the holes of the non-conductive sheet; whereby metal microstruc- tures are produced on the metal surface. ELECTROPLATING APPARATUS U.S. Patent 6,197,181. Mar. 6, 2001 L.L. Chen, assignor to Semitool, Inc., Ku&spell, Inc., Mont. A process for applying a metal to a microelectronic workpiece, the microelectronic workpiece includ- ing an exteriorly disposed surface having a plurality of micro-re- cessed structures that are defined by sidewalls, the microelectronic workpiece further including a barrier layer deposited on at least a portion of the exteriorly dis- posed surface of the microelec- tronic workpiece and on at least substantial portions of the walls of the plurality of micro-recessed structures. APPARATUS FOR PLATING WAFERS U.S. Patent 6,197,182. Mar. 6, 2001 R. Kaufman et al., assignors to Technic Inc., Cranston, R.I. A method of electroplating a first region of an article wherein said first region is exposed to a plating solution, and wherein an anode is in contact with the plating solu- tion, a method of providing a cath- ode contact to the article, compris- ing providing a cathode electrode not in physical contact with a sec- ond region of the article, wherein the second region is electrically connected to the first region by way of a surface of the article; providing a non-plating electri- cally conductive liquid that makes physical and electrical contact to the second region of the article, wherein the electrically conduc- tive liquid electrically connects the cathode electrode to the sec- ond region of the article; and sub- stantially separating the electri- cally conductive liquid from the plating solution. ELECTRODEPOSITION BATH FOR WEAR-RESISTANT ZINC ARTICLES U.S. Patent 6,197,183. Mar. 6, 2001 R.C. Iosso, Elk Grove Village, Ill. A chromium direct electrodeposi- tion bath, which comprises an aqueous chromic acid and sulfate solution, wherein the chromic acid and the sulfate are present in a weight ratio of 75:l to 125:1, respectively, and containing flue- ride ion in an amount of 0.2 to 0.8 g/L of the solution, and an alkali metal carbonate 0.4 to 0.6 g/L of the solution. TREATING BRASS COMPONENTS TO ELURlNATE LEACHABLE LEAD U.S. Patent 6,197,210. Mar. 6, 2001 A.S. Myerson, assignor to Gerber Plumbing Fixtures Corp., Chicago, Ill. A process for the treatment of brass components to reduce leach- able lead therefrom when the components are exposed to water comprising cleaning with a clean- ing agent selected from the group consisting of mineral acids, a com- bination of mineral acid plus hy- drogen peroxide, ammonium chlo- ride, and ferric chloride in aqueous solution in a concentra- tion sufficient to promote oxidiza- 86 Metal Finishing
Transcript of High aspect ratio, microstructure-covered, macroscopic surfaces
amine salts, hydroxylamine com- plexes, and in a quantity of 500 to 5,000 ppm of hydroxylamine, and manganese 0.1 to 5 g/L.
PLATING ROTOGRAVURE CYLINDERS U.S. Patent 6,197,169. Mar. 6, 2001 H. F. Metzger, Brookfield, Wis.
An apparatus and method for electroplating rotogravure cylin- ders using ultrasonic energy.
PLATING PIN-GRID ARRAYS U.S. Patent 6,197,171. Mar. 6, 2001 E.F. Lopergolo et al., assignors to International Business Machines Corp., Armonk, N.Y.
A pin-contact mechanism for plat- ing pin-grid arrays.
ELECTROPHORETIC DIP PAlNTlNG PLANT U.S. Patent 6,197,175. Mar. 6, 2001 H. Kisi et al., assignors to Durr Systems GmbH, and DaimlerChrysler AG, both of Stuttgart, Germany
An electrical contacting system for an electrophoretic dip painting plant for motor vehicle bodies that are guided through an elec- trophoretic dip paint bath com- prising an overhead conveyor having a plurality of conveyor hangers for engaging beneath body carriers.
PULSE-MODULATED ELECTROCOATING PROCESS U.S. Patent 6,197,179. Mar. 6, 2001 K. Arit et al., assignors to BASF Coatings AG, Muenster-Hiltrup, Germany
A method for electrochemical coating of objects with a resinous coating material comprising ap- plying a direct current to a bath of a cationic resinous coating mate- rial; pulse-modulating a DC volt- age of the direct current by super- imposing thereon an adjustable AC voltage component, wherein the pulse-modulation of the DC voltage is connected and discon-
nected with an adjustable duty ratio; and coating an object while applying the direct current.
HIGH ASPECT RATIO, MICROSTRUCTURE-COVERED, MACROSCOPIC SURFACES U.S. Patent 6,197,180. Mar. 6, 2001 K. W. Kelly, assignor to Board of Supervisors of Louisiana State University and Agricultural and Mechanical College, Baton Rouge, La.
A process for producing micro- structures on a metal surface comprising heat-shrinking a non- conductive polymer sheet onto the metal surface wherein the non- conductive sheet contains a plu- rality of holes; and electroplating metal onto the metal surface with the holes of the non-conductive sheet; whereby metal microstruc- tures are produced on the metal surface.
ELECTROPLATING APPARATUS U.S. Patent 6,197,181. Mar. 6, 2001 L.L. Chen, assignor to Semitool, Inc., Ku&spell, Inc., Mont.
A process for applying a metal to a microelectronic workpiece, the microelectronic workpiece includ- ing an exteriorly disposed surface having a plurality of micro-re- cessed structures that are defined by sidewalls, the microelectronic workpiece further including a barrier layer deposited on at least a portion of the exteriorly dis- posed surface of the microelec- tronic workpiece and on at least substantial portions of the walls of the plurality of micro-recessed structures.
APPARATUS FOR PLATING WAFERS U.S. Patent 6,197,182. Mar. 6, 2001 R. Kaufman et al., assignors to Technic Inc., Cranston, R.I.
A method of electroplating a first region of an article wherein said first region is exposed to a plating solution, and wherein an anode is in contact with the plating solu-
tion, a method of providing a cath- ode contact to the article, compris- ing providing a cathode electrode not in physical contact with a sec- ond region of the article, wherein the second region is electrically connected to the first region by way of a surface of the article; providing a non-plating electri- cally conductive liquid that makes physical and electrical contact to the second region of the article, wherein the electrically conduc- tive liquid electrically connects the cathode electrode to the sec- ond region of the article; and sub- stantially separating the electri- cally conductive liquid from the plating solution.
ELECTRODEPOSITION BATH FOR WEAR-RESISTANT ZINC ARTICLES U.S. Patent 6,197,183. Mar. 6, 2001 R.C. Iosso, Elk Grove Village, Ill.
A chromium direct electrodeposi- tion bath, which comprises an aqueous chromic acid and sulfate solution, wherein the chromic acid and the sulfate are present in a weight ratio of 75:l to 125:1, respectively, and containing flue- ride ion in an amount of 0.2 to 0.8 g/L of the solution, and an alkali metal carbonate 0.4 to 0.6 g/L of the solution.
TREATING BRASS COMPONENTS TO ELURlNATE LEACHABLE LEAD U.S. Patent 6,197,210. Mar. 6, 2001 A.S. Myerson, assignor to Gerber Plumbing Fixtures Corp., Chicago, Ill.
A process for the treatment of brass components to reduce leach- able lead therefrom when the components are exposed to water comprising cleaning with a clean- ing agent selected from the group consisting of mineral acids, a com- bination of mineral acid plus hy- drogen peroxide, ammonium chlo- ride, and ferric chloride in aqueous solution in a concentra- tion sufficient to promote oxidiza-
86 Metal Finishing
