Heraeus Celcion —Materials System for LED Circuits€¦ · Europe, Middle East and Africa +49...
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MCPCB Reliability Data The Celcion ® material set has been tested and surpass reliability automotive standards making Celcion the better choice over traditional MCPCB: • Passed 85%/85°C 1000 hours life testing • Passed Aging tests at 150°C for 1000 hours • Passed -55°C to +150°C thermal cycle testing (1000 cycles) Heraeus Celcion ® is a Thick Film Materials System designed to insulate aluminum substrates. Able to take the same fit and form as traditional MCPCBs, Celcion ® delivers increased thermal connectivity and high dielectric breakdown strength. All materials can be fired at less than 600ºC, and it is compatible with 3000, 4000, 5000 and 6000 series aluminum substrates. Heat Dissipation for High-Power Application • High-Power LED substrates (>1W input) • Street Lighting • Outdoor Lighting • General Illumination • Signals and Signs • Displays • Concentrated Photovoltaic • Power Electronics • Heaters Heraeus Celcion ® —Materials System for LED Circuits ®
Transcript of Heraeus Celcion —Materials System for LED Circuits€¦ · Europe, Middle East and Africa +49...
MCPCB
Reliability DataThe Celcion® material set has been tested and surpass reliability automotive standards making Celcion the better choice over traditional MCPCB:• Passed 85%/85°C 1000 hours life testing• Passed Aging tests at 150°C for 1000 hours• Passed -55°C to +150°C thermal cycle testing (1000 cycles)
Heraeus Celcion® is a Thick Film Materials System designed to insulate aluminum substrates. Able to take the same fi t and form as traditional MCPCBs, Celcion® delivers increased thermal connectivity and high dielectric breakdown strength. All materials can be fi red at less than 600ºC, and it is compatible with 3000, 4000, 5000 and 6000 series aluminum substrates.
Heat Dissipation for High-Power Application• High-Power LED substrates (>1W input)
• Street Lighting• Outdoor Lighting• General Illumination• Signals and Signs• Displays
• Concentrated Photovoltaic• Power Electronics• Heaters
Heraeus Celcion®—Materials System for LED Circuits
®
High-Power LED
MCPCB
Celcion® Advantages
Material Comparison with MCPCB
MCPCB Heraeus Celcion®
Base PlateAl or Cu (1.2 mm or thicker)
Al (1.2 mm or thicker)
Dielectric Layer Filled Epoxy 75-300 µm Glass 50-75 µm
Circuit Layer 1-10 Oz. Cu foil 12-20 µm Ag or Cu
Thermal Conductor 1-2 W/m-K 1-2 W/m-K
Break Down Voltage 800-2000 V/mil ~1000 V/mil
Typical Cost (S/sqin) $0.25 - $0.50 $0.25 - $0.35*
* Dependent on layout
Evolution of Chip on Heat Sink
MaterialsInsulating Paste:
Item Color Description Aluminum Grade Process
IP6075 Gray Dielectric for Aluminum Substrate
3000, 4000, 5000, 6000 Series
550-600°C Dwell time 2-30 min.**
IP6080 Gray Dielectric for Aluminum Substrate
3000, 4000, 5000, 6000 Series
550-600°C Dwell time 2-30 min.**
Conductor:
Item Description Process
C8829D Solderable low-temperature Ag conductor 550-570°C Dwell time 2-10 min.**
C7847 Soderable low-temperature Cu conductor
550-600°C Dwell time 5-7 min.Oxygen content 1-5 ppm***
Cover Coat:
Item Color Description Process
SM1000 White Epoxy insulator 150°C 60 min.
SM2000 White Silicone insulator 200°C 60 min.
Resistor Paste:
Item Description Process
HTR12000AR Low-temperature, low-ohm resistors 550-570°C Dwell time 5-15 min.**
** Dependent upon mass of aluminum substrate*** Contact Heraeus Technical Service for processing guidelines
Yesterday
Today
Tomorrow
MCPCB
LED Package
Solder
Thermal Interface Material
Al Heat Sink
LED PackageSolder
Thick Film Ag: C8829D
Thick Film Dielectric: IP6075/IP6080
Thick Film Ag: C8829D
Al Heat Sink
LED Die
Thick Film Ag: C8829D
Thick Film Dielectric: IP6075/IP6080
Die Attach Material
Thick Film Ag: C8829D
Al Heat Sink
Heat Flow
Heat Flow
Heat Flow
MCPCB ®
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Heraeus ElectronicsHeraeus Deutschland GmbH & Co. KG Heraeusstraße 12-1463450 Hanau, Germanywww.heraeus-electronics.com
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The descriptions and engineering data shown here have been compiled by Heraeus using commonly-accepted procedures, in conjunction with modern testing equipment, and have been compiled as according to the latest factual knowledge in our possession. The information was up-to date on the date this document was printed (latest versions can always be supplied upon request). Although the data is considered accurate, we cannot guarantee accuracy, the results obtained from its use, or any patent infringement resulting from its use (unless this is contractually and explicitly agreed in writing, in advance). The data is supplied on the condition that the user shall conduct tests to determine materials suitability for particular application.
