Headquarters- Central Taiwan Science ParkNo. 15 Keyuan 1st Rd., Central Taiwan Science Park, Taichung City, 40763, Taiwan, R.O.C.Tel : +886-4-2460-8889Fax : +886-4-2460-8896E-mail : info@daxinmat.com

Northern Area BranchRm. B502J, 5F.-2, No. 185, Kewang Rd., Longtan Township,Taoyuan County 32556, Taiwan, R.O.C.E-mail :info@daxinmat.com

Chungkang BranchNo.2, Jian 8th Rd., Wuqi Dist., Taichung City 435,Taiwan,R.O.C.E-mail :info@daxinmat.com

China -Shenzhen OfficeRm. 1501, Shangmei Technology Building, No. 2009, Shahe West Road, Nanshan District, Shenzhen City, China.Tel : +86-755-2585-7795Fax : +86-755-2583-2003E-mail :info@daxinmat.com

China -Suzhou OfficeNo.13, Chun Hui Road, Suzhou Industrial Park, 215121,China.Tel : +86-512-8098-8800Fax : +86-512-6274-9000E-mail :info@daxinmat.com

Daxin Materials Corporation

0201

About DAXIN Research & Development

Best Solution Provider for Customized Products

Core Technologies and Product Development

Consistent Innovation & Intellectual Property Protection

Founded in 2006, DAXIN Materials Corporation started with the aim of being the Material Design House. Since we have always strived to deliver best solutions that meet our customers' needs, our corporation has constantly developed customized products from wet chemicals and functionalized materials to polymer solutions. With our expertise and capabilities related to material design, we have consistently offered innovative and value-added solutions for our customers. DAXIN Materials Corporation is now listed on the Taiwan Stock Exchange under ticker number 5234.

Culture

Vision

Mission

Annual Revenue ( Million NTD )

Daxin 5iintegrityinnovationintelligent integrationintercommunicationindividuals

To Be a Leading Company for Material Innovations

Best Solution Provider for Customized Products

To contribute to our customers’ success, we always keep close relationships with clients to design products as desired. Combining our strength in materials expertise and strong manufacturing ability, we aim to be the best solution provider worldwide.

All the innovations are the extension of fundamental science. From the basic photochemistry to color simulation, molecular simulation, dispersion science, surface chemistry, organic and inorganic hybrid materials design, monomer and polymer synthesis, Daxin links all these technologies to provide superior and customer-oriented products in different fields; including Liquid Crystal Display (LCD), OLED, Touch Panel (TP), and Semiconductor.

To defend our innovation and ensure the right for production, we are working to improve intellectual property protection and enforcement for our company in markets around the globe. Our patents include all ranges: from specific chemical formula, better solution to current technology, to the improvements of products. Until 2019, the approved patent license number was more than 235, the application number was more than 370. With intellectual property protection, it gives us exclusive right granted for invention and protects our corporate value in the market.

Research & Development 0403 About DAXIN

Foundation

Paid-in capital 1.03 billion NTD

Chairman Dr. Cheng-Yih Lin

President Jeremy, Tsung-Hsing Kuo

Mission To Be a Leading Company for Material Innovations

PhotochemistryElectrochemistry

Molecule Design &

Simulation

Instrument Analysis

Statistics&

Methodology Precision Manufacturing

Advanced Purification

Technologies

Nanodispersion Surface

Modification

Organic / Inorganic Hybrid Materials

Monomer & Polymer Synthesis

/ Formulation

Headquarters Central Taiwan Science Park

Employees

Major products

Polyimide wins “Gold Panel Awards 2010”

‧Specialty Chemicals for Display, Semiconductor, and Key Material ‧ Instrument Analysis Services

July 12th, 2006

360 (RD >50%)

One Stop Shopping

Customerized Products

Quick Responses and Services

Engineering Supports in Production Ramp-up

Cutting Edge Performance and Cost Effectiveness

Customers

2006

2007

2008

2009

2010

201 1

2012

2013

2014

2015

2016

2017

133

984

1,367

2,054

2,637

2,902

3,256

3,331

3,378

3,620

3,917

3,612

2018 4,413

2019 4,531

Semiconductor Materials

Laser Release Layer

Features

Specifications

Temporary bonding of ultra thin-glass or wafer to glass carrier has emerged as a viable method for various electronic device processing. Laser debonding enables the use of laser release layer (RL) that can withstand high temperatures above . The processed devices are finally debonded and separated from the carriers easily.

Semiconductor 0605 Semiconductor

Excellent thermal resistance and stability over 300° C

Easily stripped by laser

Applicable under various laser wavelength (308/355/532/1064nm) with high absorption

Optical alignment (Tunable IR absorption or transmittance)

Applications

300 °C

Display

Bonding

RL

0.1 mm glass

Ultra thin glasslaminated oncarrier glass

0.5 mm glass

0.1/0.1 mm ultra thin LCD

LCD process LaserDebond

Semiconductor

*Indirect /Direct Materials for FO,2.5D,3D IC

FOWLP / FOPLP 2.5D IC 3D IC

For exampleFor exampleRL RL

RL

Laser Debond& Cleaning

EMCEMC

RDL( ＰI / PBO)RDL( ＰI / PBO)

RDL( ＰI / PBO)

Face Up Laser Debond& Cleaning

EMCEMC

RDL( ＰI / PBO)

RDL( ＰI / PBO)RDL( ＰI / PBO)

RL

RL RL

For Fine-Pitch

Bonding Laser Debond& Cleaning

RDL( ＰI / PBO)RDL( ＰI / PBO)

Temporary Bonding Adhesive Photosensitive Dielectric / Passivation

Varnish-type photosensitive dielectrics for the advanced chip packaging (WLP/PLP) are designed, which could be spin or slit-coated into thin film on the substrate and is photosensitive, able to be patterned into multi-layer redistribution layer (RDL). It can also be applied as a stress buffer coating. Low curing temperature, excellent Cu adhesion and electric properties are achieved for the varying chip applications.

Temporary bonding adhesive (TBA) is used for die attach or wafer to wafer/glass/molding compound bonding process.TBA offers stable adhesion through subsequent physical or chemical processes. There's no thermal reflow issue during high temperature over-baking. After device processing the adhesives can be easily cleaned from the wafer/carrier.

Specifications

Features

Specifications

FeaturesDebonding capability with various laser

wavelength (308/345/355/532/1064nm)

Easy to be cleaned by thinner Low temperature curing

Excellent Cu adhesion

Low CTE

Good thermal resistance

Good mechanical properties High resolution

Good electrical properties (Dk/Df)

Excellent chemical resistance

Semiconductor 0807 Semiconductor

ApplicationsApplications

Multi-chip Fan-Out Package Fan-Out PoP

Varnish Tape

Varnish Tape

RDL first - Glass and EMC bonding

Chip first- Die/Package attach

Laser Debond& Cleaning

Laser Debond& Cleaning

EMC EMC

EMC

EMC EMC

EMCEMC

RL

RLRLRDL( ＰI / PBO) RDL( ＰI / PBO)

RDL( ＰI / PBO) RDL( ＰI / PBO)

RDL( ＰI / PBO)RDL( ＰI / PBO)

RDL( ＰI / PBO)

ＰＩＭ-1

1086420

ＰＩＭ-2

Toughness

Transparency

HeatResistance

ChemicalResistance

ThermalExpansion

PI varnish for TP, OLED, EPD Substrates

PI (Polyimide) varnish can be used as the flexible substrates, for various devices that need to endure the high-temperature post-processing. Firstly PI varnish is coated on the carrier and cured, then PI substrate can be laser lifted off or mechanical released from the carrier after the device processing.

Applications

Features

Specifications

High thermal resistance

Excellent mechanical properties

Good dimension stability

High chemical resistance

OLED Materials

CarrierCarrier

Making DeviceFlexible Device

Carrier

PI VarnishCoating andFollowed byBaking

Specifications

Si waferTPL

DieRDL

TPLDie

Spin Coating Wafer Dicing Fan-out Package

Temporary Protection Layer

Temporary Protection Layer is applicable in die singulation process, to protect device surface by spin-coating on the wafer, capable of avoiding die chipping or defects during wafer dicing and grinding. Complete removal of Temporary Protection Layer is achieved by wet cleaning after process.

Applications

09 Semiconductor OLED 10

Photosensitive Dielectric/Passivation

PBO dielectric layers can be used as the pixel defining layer (PDL) over the pixel electrode or the planarization layer (PLN) covering the TFTs in an organic light emitting diode display (OLED).Besides, due to its good adhesion ability to copper surface, it can also be used as a dielectric insulating layer or a flat layer above the copper circuit, qnd be applicable in the fields of micro-LED and semiconductors.

Applications

Features

Features

Specifications

Low water absorption

Low dielectric constant

Precision planarization capabilities

Excellent mechanical and thermal properties

High chemical resistance

New : UV-resistance

Good mechanical properties Young’s modulus 6.8 GPa

Good lamination applicability (OCA-free)

OLED 12

543210

Daxin's PBO

Ref.PIDielectricConstant

HeatResistance

WaterAbsorption

InsulationReliabilty

PhotoSpeed

ChemicalResistance

T %

Glass

Insulator InsulatorPoly-Si

Anode

Buffer

PLN

PDL

Gate

S D

Colorless Polyimide Varnish/Film

DAXIN’s colorless polyimide (CPI) varnish/film possesses superior transparency, mechanical strength, thermal stability, and recovery after bending. The adjustable CTE and young’s modulus let it adapt to the applications of foldable displays, such as foldable cover film, film for touch sensor, and substrate. Besides, we provide customization according to customers’ requirement.

Applications

Specifications

11 OLED

Specifications

Specifications

Flexible Hard Coating

Flexible hard coating can be applied to flexible displays, automotive dashboards, polarizer and relevant products as a protective layer. This protective layer endows final products with excellent hardness and transparency. In addition, no crack and substrate separation occur after bending.

Applications

FeaturesExcellent hardness performance (9H on glass)Foldability (Outward R=3 mm, Inward R=2 mm >200K times)Good adhesion, RA without delaminationVariable products for different film stacking

3 mm 1.5 mm

Hard CoatingHard CoatingSubstrateSubstrate

Outward Folding Inward Folding

Foldable Cover Film

Foldable cover film is developed as a cover layer for foldable devices. DAXIN’s colorless polyimide (CPI) film shows excellent transparency, high modulus, and low CTE. While combining with our flexible hard coating, the cover film possesses great surface hardness, as well as transparency and flexibility.

Applications

Features

High transmittance (T> 90%)

Bending radius < 3 mm

Surface hardness 4H~5H

Young’s modulus > 6 GPa

Coefficient of thermal expansion < 15 ppm/° C

13 OLED OLED 14

Flexible HC

crack

Normal HC

After bending test

Photo Spacer

Via adjusting electric field between two glass substrates, the arrangement of liquid crystal materials can be controlled to make LCD exhibit expected pictures. Photo Spacer acts as a key component in TFT LCD which is used to maintain the cell gap’s uniformity.

Applications

FeaturesHigh sensitivity

Good coatability

High elastic recovery ratio

Excellent mechanical properties

New:

High resolution photo spacer for fast response panel

Applicable for ultra-high LCD cell thick panel

PSA028(mask size: 20*20)

PSA032(mask size:20*20)

HPS23mask size:10*10)

Liguid Crystal

ITOPhotoSpacer

BlackMatrix

TFTGlass

GlassITO Pixel

High Resolution

Glass

Glass

TFT

G R

PS

Specifications

Black Matrix Resist

Black matrix is arranged in the form of stripes, grids or mosaics between color patterns of RGB in color filter for LCD panel. This product is designed for high light-shielding properties to increase the contrast ratio of LCD panel.

Applications

Features

Specifications

15 LCD

LCD Materials

High optical density High coating uniformity, high sensitivity, excellent adhesion, excellent developing performanceExcellent reliability in heat, light,and chemical resistance with good shelf-lifeNew: Black matrix resist for LCD panel with high resolution

LCD 16

PI Alignment Layer

Polyimide layer is used to controlled the liquid crystal orientation and the pre-tilt angle. Daxin TN and VA mode alignment layers make LCD panels perform well and provide wide process margin for LCD manufactures.

Applications

Features

TN-PI

Free image sticking

Rubbing mura/ particle free

Stable pretitle angle

Excellent reliability after high

temperature/ humidity

VA-PI

Image sticking free

High VHR and excellent reliability

Stable pretilt angle

Drop mura free

Specifications

3.0

0.1 0.3

DAXIMIDEGood PTA Stability

Ref.

0.70.5

3.5

4.0

4.5

5.0

5.5

6.0

6.5

7.0

5

0 12 18

5.5

6

6.5

7

7.5

8

Liquid Crystal

Liquid crystals are fluid phase of matter which possess orientational ordering. Hence, liquid crystals are anisotropic fluid and could be re-oriented along the direction of the applied electric field, thus controlling light to or not to pass through two-crossed polarizers.

Applications

FeaturesHigh stability to UV and heat

Wide operating temperature

Low threshold voltage and

low electrical power consumption

Fast response time, and image

sticking solution

Excellent contrast ratio and

good image quality

High △ n LC : Applicable for flexible

display and smart window

50

001 00 2003 00 4005 00 600

100

2m s

DLC-111DLC-117

T(%)

Time(ms )

Common Electrode

Pixel Electrode

AlignmentLayer

Color Filter

Polarizer

LiquidCrystal

Specifications

17 LCD LCD 18

High transparency

Excellent planarization ability

Good heat and chemical resistivity

Low UV transmittance, which

protect RGB from UV damage

High crosslink ratio

Thermal Overcoat

Thermal overcoat is applied to IPS-like panel and acts a transparent planarization layer on Color resists (RGB) and Black matrix (BM), protecting color filter and providing flat surface to ensure subsequent process uniformity.

Applications

Features

PI

ThermalOvercoat

Glass

Glass

TFT

G R

PS

Specifications

Cu/Mo Etchant

Cu Stripper

Cu ion Chelating Agent

Features

Features

Features

Coagulant

Hydrogen peroxide type is environmental friendly

Good stability for very high copper loading (> 10k ppm)

Good etching uniformity

Good taper profile after etching.

Non-Corrosive to Cu, Mo, Al, ITO and IGZO

Water compatible, favorable for post-clean process

Regenerable and environmental friendly

Low toxicity, no reproductive toxicity

High chelating performance

Strong aggregation

Easy operation

Completely removed

Suspension

Flocculation

Flocculation

Flocculation

19 LCD LCD 20

Photo Overcoat

Photo overcoat is applied in touch sensor a dielectric layer and a insulating layer. Photo overcoat

contains good properties of insulation, adhesion, chemical resistance and hardness.

Applications

FeaturesOptical properties: high transparency and

good color hue

Mechanical properties: good adhesion to

bare glass, ITO and metal substrates; good

hardness

Protective layer Dielectric layer Metal bridgeITO-Y ITO-X

Specifications

Electrical properties: excellent insulating properties

Chemical properties: excellent chemical resistance

Process window: easy to coat and high sensitivity

New: Low temperature photo overcoat is for on-cell or G/F

touch sensor ( post-bake at 120~150℃ )

Glass Substrate

OCR / OCA

(Glass / Plastic)Cover Lens

OCR(Optical clear resin) is an optical grade adhesive applied on laminated cover lens, touch

panels and LCD modules. OCR can improve visibility and contrast ratio by reducing the

reflection light between the interfaces in cover lens, touch panels or LCMs.

Applications

Features

High transmittance

Easy to rework

Excellent adhesion on cover lens, touch

panels and LCMs

Non-yellowing , low dosage

Fast cure, low dosage

New: High side cure efficiency for shadow area

Optical Clear Resin (Hybrid)

Black Light R% R%R%

Air gap

Black Light

Optical Clear Resin

OCRP-3 series

150~250 μmUV UV

OCRP-3 series

LCD LCD

Black Frame Un cured OCR Cured OCR

Specifications

Touch Panel Materials

21 Touch Panel Touch Panel 22

Green Materials

Developing lithium-ion batteries with high energy density is of critical importance to address the increasing

energy storage needs for the portable electronics and electric vehicles. Silicon acts as an alternative

anode material for LIB due to its high theoretical capacity. However, Si-based anodes also face significant

challenges of volume expansion upon lithium insertion in Si. Binders, which holds the active material

together, thus, maintains the integrity of the electrode during the battery operation. High energy density

and long cycle life have been achieved by the way of utilizing our special designed binder in combination

with Si-based anode materials.

Applications

High Performance Binder for Silicon based Anode Materials of Lithium ion Battery (LIB)

Features

Electrode integrity - volume expansion inhibition Binder performance - Cycling of coin cell

Better flexibility

Strong covalent bonding between silicon and carbon particles

Exceptional dispersing qualities

Excellent adhesion strength to Cu foil

Reduce the expansion rate

High capacity

Cu

-COOH group Conductive material Binder Active material(Si & Carbon)

Adhesion group Current Collector

HC 2

HC 2

HC 2

HC 2

A B C Dm n x y

Specifications

Black Bank White Bank

Black Bank

R G BSubstrate

Black Bank

White Bank

R G BSubstrate

White Bank

MircoLED Materials

Bank Materials

Black bank / white bank materials are used as the separation of LED chips for Micro LED displays.

Black bank with high optical density can increase the contrast. White bank with high reflectance

can increase the brightness. Bank materials are available based on the product designs.

Applications

Features FeaturesHigh optical density

High electrical resistance

Excellent weather resistance

High reflectance

High electrical resistance

Excellent weather resistance

Green Materials 2423 MircoLED Materials

Cycle 30th 100% Lithiation

64 % Expansion

Cycle 30th 100% Lithiation

64 % Expansion

Features Features

CBDA DNDA

Cyclobutane-1,2-3,4-tetracarboxylic dianhydride (CBDA) is an alicyclic dianhydride.

Based on our unique photochemical reaction, we can synthesize the core structure of cyclobutane

and the configuration of CBDA can be determined to be cis-trans-cis.

CBDA is widely used as a raw material for polyimide resins or polyamic acid resins because of its

high reactivity during polymerization. In the application of display materials, such as alignment films

for liquid-crystal-display devices, CBDA provides excellent electrical properties such as high VHR

(Voltage Holding Rate) and low RDC (residual DC Voltage Measurement).

Furthermore, polymers made of CBDA offer good transparency and excellence flexibility, and

therefore it is a good candidate for flexible substrate applications. Moreover, photodegradable

polyimide is also widely known as its other applications.

Decahydro-1,4:5,8-dimethanonaphthalene-2,3,6,7-tetracarboxylic dianhydride (DNDA) is an alicyclic

dianhydride. Based on our unique synthetic process, we can synthesize the core structure of

tetracyclododecane and the stereostructure of DNDA can be controlled well to get high purity as

single form.

DNDA can improve thermal stability and electrical properties of polyimide because of its highly rigid

structure. This unique properties make it be noticed in recent years.

Furthermore, non-aromatic structure made of DNDA offer good transparency, and therefore it is a

good candidate for flexible substrate applications.

Applications Application

Key Materials

25 Key Materiais Key Materiais 26

Organic Components/Outgas Analysis

High Mass

Polymers/Oligomers Monomers

AdditivesAdditivesSolvents

Low Mass

Cold trap-GC/MS

Direct to GC/MS

Py-GC/MSCold trap-GC/MS GC/MS;GC-FID

MPLC/HPLC+FC+NMRGC/MSGC-FID

Thermal decomposition

Reverse analysis

Mixed composition

Trace analysis

Rapid screening

Organic residue

SPMEAqueous phase

SPMEGaseous phase

(10mm )BubbleSi Wafer

Water Particle Metal Native oxideOrganic Contaminants

Fraction Collection

TPD-MSFor H O , CO , SO …2 2 2

General composition analysis

TempRamp to 250℃

@10℃ / min

Hold 30min Hold 30min(℃ )50℃ 50℃ 250℃

lon 1 8.00 H Olon 28.00 N or COlon 32.00 Olon 41 .00 Organic fraglon 44.00 CO

2

22

2

Instrument Analysis 2827 Instrument Analysis

Development and Improvement of Analytical Techniques and Testing Equipment

Identification of ChemicalComposition

Cold trap-GC/MS (Ex. Evolved Gas Analysis and Thermal Desorption Analysis)Development of testing method for the thermal expansion coefficient of transparent material filmDevelopment of technology on the rate of development of thin film materialModifications of variable temperature testing

Separation and purification of mixturesComposition identificationProduct failure mode analysisIdentification of impurities and source trackingProduct efficacy difference analysismaterial

Instrument Analysis

AnalyticalLab

‧Drop Shape Analyzer‧Microwave Oven‧Oxygen Bomb

‧TGA‧DSC‧UV-DSC‧TMA‧DMA ‧Thin Film

Thickness Measurement System

‧Universal Tensile Tester‧Rheometer

‧LCR Meter‧Zeta Potential Analyzer‧High Resistance Meter

‧SEM‧OM

‧Chromatography: GC, HPLC, IC, GPC‧Mass Spectrometry: GC-MS,ICP-MS‧Spectrum: FTIR, UV-Visible

Optical

Others

Thermal

ElectricalMechanical

Chemical

Micro-structure

Thermal Analysis

Physical parameter varies with temperature, time, and environment

TGA DSC TMA DMA

Weight change An endothermic or exothermic change

Dimension change The response to obtain phase angle and deformation data as applying a stress or strain the sample

‧Glass transition temperature ‧Melting temperature‧Crystallization temperature‧Endothermic or exothermic reaction

‧Thermal expansion coefficient‧Glass transition temperature ‧Melting temperature

‧Change with temperature while under dynamic stress

TA TGAModel: Q500Applications:1. Weight loss analysis2. Thermal stability analysis3. General composition analysis

TA TMAMode: Q400 EMApplications:1. CTE2. Strain & stress3. Creep analysis

‧Decomposition temperature (T )‧Composition information‧Thermal stability

d

TA DSCModel: Q200 & Q2000Applications:1. Phase transition temperature (T ,T ,T )2. Heat of reaction3. Specfic heat capacity4. Compatible with UV-light

m g c

29 Instrument Analysis