Global Die-level Packaging Equipment Market 2015-2019

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Global Die-level Packaging Equipment Market 2015-2019

The report discusses the following in-depth:

• Market Size and Forecast

• Market Segmentation

• Buying Criteria

• Vendor Landscape

• Business Segmentation

• Geographical Segmentation

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Key Trends

Technavio’s Senior Analyst says, “Changing consumer preferences, the increasing number of Internet users, and rising disposable income of consumers has led to an increased demand for communication devices worldwide, such as smartphones and tablets. This has led to high demand for semiconductor ICs. The demand for packaging these ICs is also increasing, which is fostering the growth of the market.”

• ICs manufactured in the global semiconductor industry are delicate, and thus vulnerable to contamination causing malfunction. To prevent from such malfunctions, silicon chips or ICs are protected using packaging materials. Wafer-level packaging and die-level packaging are the most predominant packaging types.

• Technavio's analysts forecast the global die-level packaging equipment market to grow at a CAGR of 1.24% during 2014-2019.

• Understanding the key drivers influencing the market

• Understanding the challenges faced by the market

• Activities of various stakeholders involved

• Key focus areas for the vendors

• Major trends that will shape the future of this market

• Vendor landscape and trajectory of the market

• Conclusion

Scope of The Report

A detailed analysis of each market driver, challenge

and trend isavailable in our report:

Global Die-level Packaging Equipment Market 2015-2019

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Vendors

To understand the vendor landscape and

for a full list of vendors view our report:

Global Die-level Packaging Equipment Market 2015-2019

ASM International

Besi

DISCO

ASM International was incorporated in 1968 and is headquartered in Almere, the Netherlands. It focuses on the supply of semiconductor process equipment for wafer processing. It offers wafer-processing technologies that are used in industry, includes ion implant, lithography, deposition, and single-wafer epitaxy.

Besi was incorporated in 1995 and is headquartered in Duiven, Netherlands. The company develops, manufactures, and markets semiconductor assembly equipment for the semiconductor and electronics industries.

DISCO was established in 1937 and is headquartered in Tokyo, Japan. The company produces and sells precision cutting, grinding, and polishing machines in Japan and worldwide. It also assembles and recycles precision cutting, grinding, and polishing machines.

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Market Landscape

• The global die-level packaging equipment market is affected by the cyclical nature of the semiconductor industry.

• IC packaging vendors experience fluctuations in revenue because of inconsistent demand.

• As a result, vendors in the die-level packaging equipment market need to ensure that they meet the varying demand in accordance with their production capacity.

• The increased demand for semiconductor ICs has prompted foundries to increase their yield and reduce throughput time, which helps reduce the overall cost of production.

• The deployment of die-level packaging equipment in semiconductor-production assembly lines reduces the chances of faulty wafer production and increases yield.

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Key Buying Criteria• AccuracyBuyers prefer semiconductor die-level packaging equipment that packages ICs at die-level without the risks of contamination or damage.

• CostThe cost of semiconductor die-level packaging equipment is a major factor determining buying behavior. In addition to high R&D spending and other costs, the high cost of die-level packaging equipment hampers the profitability of vendors.

• DurabilitySemiconductor die-level packaging equipment should have a prolonged lifespan, and should function effectively throughout its lifespan. Buyers prefer to invest in equipment that will last for a long time and help increase productivity.

• Power ConsumptionA system that consumes less power is preferred as it saves on costs.

• ReliabilityCustomers prefer semiconductor die-level packaging equipment that delivers consistent output and is reliable.

• Growth Forecasts?

• Market Analysis?

• Revenue Forecasts?

• Regional and Country level Analysis?

• Competitive Structure?

• Emerging Trends?

• Vendor Landscape?

• Other?

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Global Die-level Packaging Equipment

Market 2015-2019

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