GLAST LAT Tracker Delta Manufacturer Readiness Review for Tray Assembly and Test at G&A

Tracker Subsystem 1

GLAST LAT Project TRAY DELTA MRR, 18 Nov., 2004

GLAST LAT TrackerGLAST LAT Tracker

Delta Manufacturer Readiness Delta Manufacturer Readiness Review for Tray Assembly and Review for Tray Assembly and Test at G&ATest at G&A

Luca Latronico

INFN-Pisa

[email protected]

Tracker Subsystem 2


Relevant DocumentsRelevant Documents

LAT-PS-01801 Integration of TMCM and SSD Ladders onto Tracker Trays

released

LAT-PS-03534 Single Tray Electrical Test Plan

released

Production company: G&A Engineering, Carsoli-Oricola (AQ)

Tracker Subsystem 3


alignment jig

Assembly and test flow-chartAssembly and test flow-chart

• INFN provides G&A with tray panels, TMCMs, ladders, (and their relative locations on the tray) + Nusil adhesives

• Alignment jig (WS-B1) provides:– TMCM planarity– Pitch adapter planarity– Bonding pads alignment (HV and shield pads) – Dry assembly test to check TMCM connectors

clearance

• Adhesive distribution (WS-B2)• Assembly of TMCM onto tray (WS-B3)• Metrology (WS-B4)

• Current production rate ramping up:– need to match CC pocket and MCM connector

depth– extra screening on TMCM pitch adapter

(missing connections on signal strips and HV lines – PA debondings)

WS-A Material receiving and inspection

WS-B TMCM Integration

Tracker Subsystem 4


Assembly and test flow-chartAssembly and test flow-chart

• Ladder test (WS-C1)• Tray Z positioning under CMM (WS-C2)

50m wrt nominal position

• Ladder positioning on the bridges (WS-C3)– Alignment from bridge itself used as reference

and excellent alignment of SSD inside ladder (~2 m RMS)

• Glue deposition (WS-C4)– 19 spots of siliconic glue/SSD– 4 spots conductive glue + 1 unbroken line

across ladders

• Ladder assembly (WS-C5)• Ladder metrology (WS-C6)

– Ladder height 0.250.1 mm – Ladders relative parallelism of 0.1 mm

• Wire bonding (WS-C6)– Destructive pull tests on coupons (>5g each)– Visual inspection

• Functional test by INFN with tray inside box– LAT-PS-03534

• DRB and shipping to INFN

WS-C Ladders integration

WS-D Final disposition

Ladder assembly tools

Tracker Subsystem 5


Availability of components and toolsAvailability of components and tools

• Bare panel trays after TVAC test in Roma2 – 27 trays available – planned supply is 4trays/day

• SSD Ladders from G&A and Mipot– ~1400 ladders available - 400 more from G&A (200 to test, 200 being built) –

900 will be built from Mipot asap

• MCM from SLAC through quick functional verification at INFN-Pisa– Currently 38+32– Could match 14 trays (26 TMCMs) from first lot of 38 because of connector stick-

out issue– 6 TMCMs sent back to SLAC for PA debondings

• Nusil at G&A for ~3/4 of tray production• G&A tools

– TMCM alignment tools: 5– Ladder integration tools (tray alignment + ladder bridges): 6– CMM: 2 (1 for alignments, 1 for metrology)– Glue dispenser: 2– wire-bonder: 2– 2 working shifts per day to grant production rate of 4 trays/day

• EGSE for functional tests– 1 full EGSE system installed at G&A and operated by INFN

Tracker Subsystem 6


• From INFN to GA:– List of subparts (ladders and TMCM) from INFN-Pisa

• From GA to INFN:– List of subparts with G&A reference SNs (neede for tray box)– Progress of assembly (weekly)

• Quality Assurance– Rely on G&A certified QA program for internal activity– Handle major NCR notified from G&A (MARECO) with Pisa system

Data exchange with INFN-PisaData exchange with INFN-Pisa

Tracker Subsystem 7


Tower 0 tray productionTower 0 tray production

• 14 complete trays assembled (27 TMCMs and SSD Ladder planes)

– 23 Si layers were within specs– 4 Si layers had short for problems related to

bias circuit delamination

• All went through thermal tests– 4 Si layers (bottom side of heavy trays) had

many disconnected channels because of CTE mismatch impact on wire-bond encapsulation MRB on wire-bond encapsulation

• 23 SSD layers operated successfully up to now

Tracker Subsystem 8


Metrology: with a CMM with interchangeable mechanical-optical heads, the positions of 12 “C” markers, 3 for each ladders, and the positions of the MCM alignment pins are measured on both sides of the tray.

silicon #1

silicon #3

silicon #2

silicon #4

L31

L32

L22

L21

L33

L23

L11

L12

L13

L02L02

L03

L01

MC

M s

ide

Pin 1

Pin 2

Pin 3

Pin 4

x

y

Metrology of ladders alignmentMetrology of ladders alignment

Tracker Subsystem 9


ladders alignment errors X

0

5

10

15

20

25

-0.1 -0.05 0 0.05 0.1

mm

top bottom top bottom top bottommid039 30.294 0.100 0.057 -0.082 -0.056 -0.019 -0.103mid050 30.202 0.069 0.047 -0.067 -0.067 -0.049 0.073mid079 30.408 0.099 0.126 -0.085 -0.051 0.132 0.115

parallelism to the pinstray

total thickness (nominal

30.370)

Z parallelism pin alignment

Results – ladders alignmentResults – ladders alignment

Tracker Subsystem 10


079MID front: 1.67 uA @ 150 V 079MID back: 1.85 uA @ 150 V

050MID front: 2.02 uA @ 150 V 050MID back: 1.77 uA @ 150 V

Functional test results – leakge currentFunctional test results – leakge current



050MID front 050MID back

079MID back079MID front

Functional test results – trigger rates vs thresholdFunctional test results – trigger rates vs threshold



MCM Disconected at SLAC Disconnected at G&A

365 (079 MID Front) Total 8 – ch1227 false positive at PA test

1222, 1224, 1226, 1227, 1228, 1229, 1231, 1428.

Total 7

1222, 1224, 1226, 1228, 1229, 1231, 1428.

296 (079 MID Back) Total 0 Total 0

428 (050 MID Front) Total 0 Total 1 – ch0 false negative?

0

11513 (050 MID Back) Total 3

49, 50, 1031

Total 4 – ch1031 false positive, ch51 false negative?

49, 50, 51, 1445.

Functional tests results – bad channelsFunctional tests results – bad channels

• Total number of bad channels well within specs (16 max)

• High reliability of PA screening test on TMCM

• High yield of wire-bonding



ConclusionsConclusions

• Assembly and test procedures well tuned and tested on EM trays and tower 0

• G&A moving rapidly to planned production rate • High yield of assembly so far

– > 100 ladders glued and wire-bonded with no failures and well within specs

• Tower A production well within specs – Leakage current– Noise and thresholds performance– Bad channels

GLAST LAT Tracker Delta Manufacturer Readiness Review for Tray Assembly and Test at G&A

Documents

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