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GIG-Array High Speed, High Density Mezzanine Connectors June 1, 2007 Grace S. Showers Product Manager Slide 2 2 Optimized Design For High-Density, High- Speed Mezzanine Applications Ball Grid Array (BGA) Termination For Process Friendly Attachment 1mm X 0.65mm BGA Grid Optimizes Routing And Electrical Performance 200 and 296 Positions Stack Heights Of 15mm To 40mm GIG-Array Connector Features & Benefits Slide 3 3 100 Ohm Differential Pair Matched Impedance Assures Consistent High Speed Performance 10 Gb/s Differential Pair Performance Supports High Speed Data Rates Near End Crosstalk (NEXT) Of Less Than 3% Preserves Signal Integrity Dual-Beam Receptacle Provides Two Points Of Contact On The Signal Contacts Increasing Product Reliability Polarized Design Assures Proper Mating Of The Connector GIG-Array Features & Benefits Slide 4 4 GIG-Array Plug Plug Pin Configuration G = Ground S = Signal The 296 Position Connector Contains 37 Columns With 8 Usable Signals In A Row The 200 Position Connector Contains 25 Columns Columns Slide 5 5 Integrate Power With The GIG-Array Each Wafer Contains 9 Individual Ground Pins & 8 Individual Signal Pins The 296 Position GIG-Array TM Contains 37 Individual Wafers Designers Can Choose To Run 18 Amps (Derated) Through Just One Wafer Using The Other 36 Wafers For High Speed Requirements Discrete contacts offer more flexibility in handling Power or Low- Speed signals Slide 6 6 GIG-Array Receptacle 2-Points Of Contact On The Signals Increase Reliability Of The End Application Signal Ground Plug Receptacle Narrower Receptacle Slot Openings and Center Walls to Reduce Risk of Contact Damage from Foreign Objects Slide 7 7 GIG-Array Offering 200 & 296 Positions Slide 8 Mezzanine Applications Slide 9 9 Servers & Storage (1U & 3U Rack Server) POWER SUPPLY PCIe CARD FAN RACK PwrBlade Power Distribution System or Power Card Edge Vertical SATA or SAS Receptacles HDD CPU MEMORY DDR1, DDR2 or FBD Sockets PCI Express Card Edge Riser 4X SATA/SAS Plugs & Receptacles MEG-Array, GIG-Array, or BergStak Board Stacking Systems EyeMax or Densi-Shield I/O Link LGA 775 Sockets Slide 10 10 Server Blade Blade Center Chassis Blade Server Board GIG-Array Servers & Storage (Blade Server) Slide 11 11 Switching & Transmission Switches Transmission Routers Slide 12 BGA Technology Slide 13 13 Lower application cost then Press Fit terminations Applied to PCB by standard re-flow soldering processes Excellent SI performance Simplified board routing Eliminates press-fit constraints on via Can mount on PCB opposite other surface-mount components Advantages of BGA Technology BGA PTHSMT Press Fit BGA Slide 14 14 FCIs Patented Design Alternative Designs Perfect Ball True Position in the X, Y, and Z direction Solid Pin-to-Ball connection FCIs Ball Grid Array Design (BGA) No guidance for ball position in X and Y direction Doubtful Pin-to-Ball connection Slide 15 15 Self-Centering in X and Y Directions A. B. C. D. E. F. G. Surface Tension Promotes Self-Centering Of The Connector During Re-flow With A Placement Of Only 50% Of The Solder Sphere On The Pad Compensates For Placement Error 0.030 Diameter Solder Sphere Slide 16 16 Self-Leveling in Z Direction Cross section prior to soldering Cross section after soldering Solder Spheres Collapse Upon Reflow For Vertical Self- Leveling Compensates For Warpage Or Mis-match Slide 17 17 FCIs BGA Reliability GIG-Array Connectors Utilize The Exact Same BGA Sphere, Design, And Process As MEG-Array Connectors FCI 100% Verifies BGA Coplanarity Of Every GIG- Array Connector Solder Joint Reliability FCIs BGA Solder Joint Reliability On The GIG-Array Product In Accordance With IPC-SM-785 GIG-Array Connectors Passed 6000 Thermal Cycles 0 C to +100 C per IPC-SM-785 Slide 18 18 In-Process Inspection & Quality Controls Vision Systems Verification Of Terminal And BGA Presence RVSI 100% Laser Inspection Coplanarity Acuity Verification Of Terminal Placement System Advantages Slide 19 Signal Integrity Testing Slide 20 20 Semi-Rigid Pad Attach Pad PCB Boards (Rogers 4003) Semi-Rigid Pad Attach Pad Vias Connector System Strip-line PCB Trace Vias.062 Typical Test PCB Stack-Up Slide 21 21 Measurement PCB Configuration G = Ground Q = Quiet S = Signal Columns Slide 22 22 GIG-Array High-Speed Performance Notes: * Denotes fully-shielded differential pairs. 79 differential pairs per linear inch can be attained if the differential pairs are continuous ** The acceptance criteria for Eye Patterns are a mask height of 25% and a mask width of 40%. ***Denotes Bandwidth. Frequency at which Insertion Loss reaches 3 dB. Rise time ( T r ) is specified from 10% to 90% of the signal amplitude. Slide 23 23 10 Gb/s Reference Eye Pattern 25 mm GIG-Array Differential Eye Pattern 20 mm GIG-Array Differential Eye Pattern GIG-Array 10Gb/s Eye Patterns Mask Amplitude Was 25% (200 mVp-p) Of The Input Signal And The Mask Width Was Set To 40% (40 ps) Of The Input Signal. Slide 24 24 Summary Provides 10Gb/s Electrical Performance Proven Patented BGA Design FCI Is Recognized As The BGA Expert Shipping over 10 Billion BGA Contacts Connectors Provide 2-Points Of Contact for Reliability Demonstrated > 22 Years Life (IPC-SM-785) Solder Joint Reliability FCI Worked With Solectron & Universal In Developing The GIG-Array Application Specification Assuring Stable Process Capability During Product Application Certified Second Source (Tyco) Intermateable and Interchangeable Slide 25 25 H Datasheet950554-006 H Application SpecificationGS-20-016 H Product SpecificationGS-12-192 H High-Speed Performance Data 950554-008 H Sample Kit950554-009 H SPICE Files Web Site H Drawings Web Site H 3D Models (ProE & IGES) Web Site All Of The Above Information Is Located At: www.fciconnect.com www.fciconnect.com Product Support Slide 26 Thank You