IntroductionThe STEVAL-STLKT01V1 development kit for the STEVAL-STLCS01V1 SensorTile board is a highly integrated developmentplatform with a broad range of functions aimed at improving system design cycles and accelerating the delivery of results.

The tiny SensorTile core system board (13.5 x 13.5 mm) embeds high-accuracy and very-low-power inertial sensors, abarometric pressure sensor and a digital MEMS top-port microphone. The onboard 80-MHz MCU features a dedicatedhardware microphone interface and ultra-low-power support. The wireless network processor provides Bluetooth Smartconnectivity and the integrated balun maximizes RF performance for minimum size and design effort.

The kit includes a cradle expansion board for software and system architecture design support and a compact cradle hostfeaturing a battery charger and SD card interface for on-field testing and data acquisition; both boards come complete with SWDprogramming interfaces.

It contains FCC ID: S9NSTILE01 and module IC 8976C-STILE01 certified with PMN: STEVAL-STLKT01V1; HVIN: STEVAL-STLCS01V1; HMN: STEVAL-STLCX01V1; FVIN: bluenrg_7_1_e_Mode_2-32MHz-XO32K_4M.img.

Figure 1. SensorTile functional block diagram

The FP-SNS-ALLMEMS1 firmware provides a complete framework to build wearable applications. The STBLESensorapplication based on the BlueST-SDK protocol allows data streaming and a serial console over BLE controls the configurationparameters for the connected boards.

It is recommended to upgrade the SensorTile firmware to the latest available version on www.st.com.

Getting started with the STEVAL-STLKT01V1 SensorTile integrated development platform

UM2101

User manual

UM2101 - Rev 5 - March 2019For further information contact your local STMicroelectronics sales office.

www.st.com

1 Getting started

1.1 OverviewThe STEVAL-STLKT01V1 development kit includes everything you need to remotely sense and measure motion,environmental and acoustic parameters. It is designed to support the prototyping phases of new projects and canbe used in the contexts below.An evaluation system• Evaluate high accuracy and very low power ST sensors in an optimized system architecture• Field-test data fusion and embedded signal processing algorithms• Deploy data collection campaigns to support custom algorithm development

Reference design• Compact solution for high-accuracy, low-power motion, environmental and audio sensor data in compact

form-factor designs• Complete hardware and software examples form the starting point for new designs with:

– hardware: schematics, Gerber, BoM, 3D CAD– software: from basic examples (STSW-STLKT01) to complete function packs (FP-SNS-ALLMEMS1,

FP-AUD-BVLINK1)

Embedded software development kit• Source code project examples based on the STM32Cube architecture• Fully compatible with the Open.Software embedded processing libraries, and supported by the STM32 ODE• Host board implements the Arduino UNO R3 expansion connector to enable bridging to well-known

development ecosystems such as STM32 ODE and Arduino

Fast prototyping tool• Plug or solder onto your prototype motherboard to instantly add its embedded sensing and communication

functions to your design• Use the 3D CAD files to integrate the SensorTile in your mechanical design

1.2 Package componentsInside the STEVAL-STLKT01V1 package, you will find all the components needed to experience the demo on thisoptimized platform and to start developing you application

UM2101Getting started

UM2101 - Rev 5 page 2/36

Figure 2. SensorTile kit blister

1.3 Initial setup with pre-loaded demoThe easiest thing to do after unpacking is to run the preloaded software using the SensorTile board together withthe cradle expansion (STLCX01V1).

Step 1. Take the SensorTile and plug it on the cradle expansion through the dedicated connector. Take care tomatch the orientation shown below.

Figure 3. Orientation of SensorTile and cradle expansion connectors

UM2101Initial setup with pre-loaded demo

UM2101 - Rev 5 page 3/36

Figure 4. SensorTile mounted on cradle expansion

Step 2. Connect a USB type A to mini-B USB cable to turn ON the board for the first time, verify that the J2jumper is in position 2-3 (power supply from USB). If everything works fine then you’ll see theSensorTile LED blinking approximately every 2 seconds.

Step 3. The board is now ready to connect to the STBLESensor app: available on official stores for Android oriOS.

Note: To exploit the newest features, upgrade the default firmware version to the new version of the FP-SNS-ALLMEMS1 function pack.

1.4 System requirementsAs the STEVAL-STLKT01V1 is already programmed with FP-SNS-ALLMEMS1 firmware, to run the demo, youonly need:• a smartphone or tablet with minimum Android™ 4.4 or iOS™ 8.0 operating systems and minimum BLE

technology 4.0• a USB type A to mini-B USB cable for power supply (connected to a PC, AC adapter or any other source)

To start designing your own project, you will need:• a Windows™ PC (ver. 7 or higher) with an IAR, KEIL or AC6 firmware development environment• a USB type A to Micro USB male cable to connect the STEVAL-STLKT01V1 to the PC for power supply• an STM32 Nucleo board with ST-LINK V2.1 in-circuit debugger/programmer (preferred) or other compatible

device• the ST-LINK Utility for firmware download (latest embedded software version on www.st.com)

UM2101System requirements

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2 STEVAL-STLCS01V1 hardware description

The STEVAL-STLCS01V1 (SensorTile) is a highly integrated reference design that can be plugged into form-factor prototypes, adding sensing and connectivity capabilities to new designs through a smart hub solution. It canalso easily support development of monitoring and tracking applications as standalone sensor nodes connectedto iOS™/Android™ smartphone applications.The SensorTile occupies a very small 13.5x13.5 mm square outline, with all the electronic components on the topside and small connector on the bottom side to plug it onto the cradle expansion board. The connector pinout isrepeated on 18 PCB pads that render the SensorTile a solderable system on module as well.The figure below and following two tables provide the main board component and pinout details.

Figure 5. STEVAL-STLCS01V1 main components and pinout

Table 1. STEVAL-STLCS01V1 main components

Reference Device Description

A MP34DT05-A MEMS audio sensor digital microphone

B LD39115J18R 150 mA low quiescent current low noise LDO 1.8 V

C STM32L476 MCU ARM Cortex-M4 32-bit microcontroller

D LSM6DSM iNEMO inertial module: low-power 3D accelerometer and 3D gyroscope

E LSM303AGR Ultra-compact high-performance eCompass module: ultra-low power 3D accelerometer and3D magnetometer

F LPS22HB MEMS nano pressure sensor: 260-1260 hPa absolute digital output barometer

G BlueNRG-MS Bluetooth low energy network processor

H BALF-NRG-02D3 50 Ω balun with integrated harmonic filter

UM2101STEVAL-STLCS01V1 hardware description

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Table 2. STEVAL-STLCS01V1 pinout

Board pin CONN pin Pin name MCU pin Main functions (1)

1 2 MIC_CLK PC2 DFSDM1_CKOUT, ADC

2 4 VDD_OUT VDD/VBAT 1.8V from onboard LDO

3 6 VIN / Power supply for LDO [2 V-5.5 V]

4 8 VDDUSBVDDIO2

VDDUSBPower supply for USB peripheral and VDDIO2 [1.8 V-3.3 V]

5 10 GND VSS Ground

6 12 RXD/USB_DP PD2/PA12 USART5 RX or USB_OTG_FS DP (2)

7 14 TXD/USB_DM PC12/PA11 USART5 TX or USB_OTG_FS DM 1

8 16 SAI_CLK PG9 (3) SAI2_SCK_A, SPI3_SCK

9 15 SAI_FS PG10(3) SAI2_FS_A, SPI3_MISO

10 13 SAI_MCLK PG11(3) SAI2_MCLK_A, SPI3_MOSI

11 11 SAI_SD PG12(3) SAI2_SD_A, SPI3_NSS

12 9 GPIO2 PB8/PB9/PC1 DFSDM_DATIN6, I2C3_SDA

13 7 GPIO3 PC0 DFSDM_DATIN4, I2C3_SCL

14 5 NRST NRST STM32 Reset

15 3 SWD_CLK SWD Programming interface clock

16 1 SWD_IO SWD Programming interface IO

17 / GND Ground

18 / GND Ground

1. Refer to STM32L476 Datasheet on www.st.com for the complete set of functions of each pin2. USB_OTG_FS Peripheral is functional for VDDUSB ≥ 3V3. Logic level of this pins is referred to VDDIO2

2.1 Power supplyThe SensorTile board has the following input supply pins:1. VIN is the input for the onboard voltage regulator generating 1.8 V (150 mA max).2. VDDUSB is an input for the STM32L4 VDDUSB and VDDIO2 pins (to use the STM32L4 USB OTG

peripheral, VDDUSB must be ≥ 3 V)VDD is an output for 1.8 V.If the USB peripheral and other 3.3 V signals are not needed for a particular application, you can connect VDD toVDDUSB so that one power supply can power the whole system. This connection can be done externally (e.g.,SB8 on STLCX01V1) or by soldering a 0 Ω resistor on R2 (bottom layer).

UM2101Power supply

UM2101 - Rev 5 page 6/36

Figure 6. STEVAL-STLCS01V1 power supply block diagram

Figure 7. STEVAL-STLCS01V1 component placement (top side)

2.2 Differences among the STEVAL-STLCS01V1 generationsThere are two slightly different generations of SensorTile (STEVAL-STLCS01V1).To distinguish among the two, you need to observe the Balun package (U4):• if the package is black (opaque), it is "First generation"

UM2101Differences among the STEVAL-STLCS01V1 generations

UM2101 - Rev 5 page 7/36

Figure 8. SensorTile first generation

• if the package is transparent, it is "Second generation"

Figure 9. SensorTile second generation

The difference among the two generations is in the part numbers used for U4 and U11:• First generation: U4 →BALF-NRG-01D3, U11→MP34DT04• Second generation: U4 →BALF-NRG-02D3, U11→ MP34DT05-A

UM2101Differences among the STEVAL-STLCS01V1 generations

UM2101 - Rev 5 page 8/36

3 STLCX01V1 hardware description

The SensorTile cradle expansion is an easy-to-use companion board for SensorTile and the SensorTile cradleboards included in the SensorTile Kit. The SensorTile board does not need to be soldered onto the cradleexpansion board, but can be plugged onto the dedicated connector (see Figure 3. Orientation of SensorTile andcradle expansion connectors and Figure 4. SensorTile mounted on cradle expansion.Apart from being a standalone host for the SensorTile board, the cradle expansion board can be connected to anSTM32 Nucleo or other expansion board via the Arduino UNO R3 connectors to easily expand functionality.

Figure 10. STLCX01V1 main components

Table 3. STLCX01V1 main components

Reference Device Description

A SensorTile connector and footprint To plug or solder the SensorTile board

B Arduino UNO R3 UNO R3 connector For STM32 Nucleo board compatibility

C ST2378ETTR 8-bit dual supply 1.71 V to 5.5 V level translator

D micro-USB connector, USBLC6-2P6(U1), LDK120M-R (U4)

micro USB power supply /communication port and 3.3 V voltageregulation

E Audio DAC, phono jack 16-Bit, low-power stereo audio DAC and 3.5 mm stereo phono jack

F SWD connector, Reset button 5-pin SWD connector for programming debugging and board resetbutton

3.1 Power supplyThe power is either supplied by the host PC via USB or by an external source through the Arduino UNO R3connector (CN6.5).Jumper J2 selects the power source for the onboard 3.3 V regulator (U4) and the SensorTile VIN pin:

UM2101STLCX01V1 hardware description

UM2101 - Rev 5 page 9/36

• position 1-2: 5 V external• position 2-3: 5 V via USB (default)

The 3.3 V output of the regulator can be routed to the Arduino UNO R3 connector to power on other externalcomponents by soldering SB18 (default OFF).The VDDUSB pin of the SensorTile can be connected to two different power sources:• 3.3 V – SB9 (default ON)• 1.8 V (SensorTile VDD) – SB8 (default OFF)

3.2 USB deviceThe USB connector on the board can be used to supply power and for communication (USB_OTG_FS).To use the USB peripheral, use the following solder bridge configuration:• SB10, SB11, SB20 and SB21 OFF (disconnect the signals from U5)• SB9 ON (supply 3.3 V to the USB peripheral of the STM32 MCU)

3.3 Audio DACThe PCM1774 is a low-power stereo DAC designed for portable digital audio applications, and can be driven bythe SensorTile to play any kind of Audio stream. A dedicated 3.5 mm audio jack makes it easy to connectheadphones or active loudspeakers.In order to use the onboard audio DAC (U3), the SAI (serial audio interface) and I²C signals must be routed to thecomponent using the following configuration:• SB12, SB13, SB14, SB15, SB16 and SB17 OFF (disconnect the signals from Arduino UNO R3 connector)• SB2, SB3, SB4, SB5, SB6, SB7 ON (connect the signals to the DAC)

3.4 Solder bridge details

Table 4. STLCX01V1 solder bridge details

Solder Bridge SensorTile signal Onboard signal Arduino signal

SB1 Reset CN8.2

SB2 (1) GPIO3 DAC control – I2C SCL (pull-up)

SB3(1) GPIO2 DAC control – I2C SDA (pull-up)

SB4(1) SAI_SD DAC Audio – I2S_SD

SB5(1) SAI_SCK DAC Audio – I2S_SCK

SB6(1) SAI_FS DAC Audio – I2S_WS

SB7(1) SAI_MCLK DAC Audio – I2S_MCLK

SB8 VDDUSB VDD – 1.8V from SensorTile

SB9(1) VDDUSB 3V3 from regulator

SB10 RXD-USB_DP Level Translator - UART_RX CN9.2

SB11 RXD-USB_DP Level Translator - UART_TX CN9.1

SB12 SAI_SD SPI_CS CN5.3

SB13 SAI_MCLK SPI_MOSI CN5.4

SB14 SAI_FS SPI_MISO CN5.5

SB15 SAI_SCK SPI_SCK CN5.6

SB16(1) GPIO3 CN5.10

SB17(1) GPIO2 CN5.9

SB18 MIC_CLK Level Translator - MIC_CLK_3V3 CN9.5

SB19 3V3 – 3V3_Nucleo CN6.2 CN6.3

UM2101USB device

UM2101 - Rev 5 page 10/36

Solder Bridge SensorTile signal Onboard signal Arduino signal

SB20 TXD-USB_DM Level Translator - UART_RX CN9.2

SB21 TXD-USB_DM Level Translator - UART_TX CN9.1

SB22 GPIO2 Level Translator - GPIO2_3V3 CN9.6

SB23 GPIO3 Level Translator – GPIO3_3V3 CN9.7

1. Closed by default.

Figure 11. STLCX01V1 component placement (top side)

UM2101Solder bridge details

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4 STLCR01V1 hardware description

The SensorTile cradle is a small companion board for SensorTile, geared at the development of form factorprototypes. You need to solder the SensorTile board to this board to render the system robust.The small cradle is ideal for applications requiring small, standalone, battery-powered sensor nodes.

Figure 12. STLCR01V1 cradle main components

Table 5. STLCR01V1 main components

Reference Device Description

A SensorTile footprint To solder the SensorTile board

B HTS221 Capacitive digital sensor for relative humidity and temperature

C STBC08PMR, STC3115, LDK120M-R, USBLC6-2P6

800 mA standalone linear Li-Ion battery charger with thermal regulation,Gas gauge IC, 200 mA low quiescent current very low noise LDO, verylow capacitance ESD protection

D Power on/off switch

E SWD connector 5-pin SWD connector for programming and debugging

F Micro USB connector, 3-pin batteryconnector

Micro USB battery charging supply /communication port and connectorfor Li-Ion battery power supply

G Micro-SD card socket

Solder the SensorTile board onto the cradle board as shown in the figure below.

UM2101STLCR01V1 hardware description

UM2101 - Rev 5 page 12/36

Figure 13. SensorTile soldered onto cradle board

4.1 Power supplyThe main board power supply is the 100 mAh lithium-Ion polymer battery attached to the appropriate connectoron the PCB.

Figure 14. Battery connection and power switch

The battery can be recharged via USB connected to a PC or any micro-USB battery charger.A red LED indicates the charging status:• steady ON: the USB plug is correctly connected and the board is charging• steady OFF: charging complete• blinking: battery not present

UM2101Power supply

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The onboard STBC08 battery charger IC is configured by default with a maximum charging current of 50 mA. It ispossible to modify this current by changing the R5 resistor value.Equation 1: Icℎrg = 1VR5 ∙ 1000 (1)

The default 20 kΩ value for R5 hence gives: 1V20K ∙ 1000 = 50mA (2)

During normal usage, the battery needs to be connected to the board for proper operation. When the battery isplugged, the board is turned ON via the SW1 switch. This switch enables LDK120 3V3 voltage regulator pin,which powers all board components.

4.2 SensorTile and cradle assembly in form factor caseRefer to the following image for the orientation of the soldered SensorTile and cradle boards in the dedicated formfactor case.

Figure 15. SensorTile and cradle in plastic case

UM2101SensorTile and cradle assembly in form factor case

UM2101 - Rev 5 page 14/36

Figure 16. STEVAL-STLCR01V1 component placement (top side)

UM2101SensorTile and cradle assembly in form factor case

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Figure 17. STEVAL-STLCR01V1 component placement (bottom side)

UM2101SensorTile and cradle assembly in form factor case

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5 SensorTile programming interface

To program the board, connect an external ST-LINK to the SWD connector on the cradle; a 5-pin flat cable isprovided in the SensorTile Kit package.The easiest way to obtain an ST-LINK device is to get an STM32 Nucleo board, which bundles an ST-LINK V2.1debugger and programmer.Ensure that CN2 jumpers are OFF and connect your STM32 Nucleo board to the SensorTile cradle via the cableprovided, paying attention to the polarity of the connectors. Pin 1 is identified by:• a small circle on the PCB silkscreen – STM32 Nucleo board and SensorTile cradle expansion• the square shape of the soldering pad – connector on the SensorTile cradle.

Figure 18. STM32 Nucleo board, cradle and cradle expansion SWD connectors

Figure 19. SWD connections with 5-pin flat cable

UM2101SensorTile programming interface

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6 Sensors and Bluetooth low energy connectivity

6.1 LSM6DSMThe LSM6DSM is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscopeperforming at 0.65 mA in high-performance mode and enabling always-on low-power features for an optimalmotion experience for the consumer. The LSM6DSM supports main OS requirements, offering real, virtual andbatch sensors with 4 Kbytes for dynamic data batching.ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used forthe production of micromachined accelerometers and gyroscopes. The various sensing elements aremanufactured using specialized micromachining processes, while the IC interfaces are developed using CMOStechnology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of thesensing element.The LSM6DSM has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of±125/±245/±500/±1000/±2000 dps. The LSM6DSM fully supports EIS and OIS applications as the moduleincludes a dedicated configurable signal processing path for OIS and auxiliary SPI configurable for bothgyroscope and accelerometer.High robustness to mechanical shock makes the LSM6DSM the preferred choice of system designers for thecreation and manufacturing of reliable products.

6.2 LSM303AGRThe LSM303AGR is an ultra-low-power high-performance system-in-package featuring a 3D digital linearacceleration sensor and a 3D digital magnetic sensor. The device has linear acceleration full scales of±2g/±4g/±8g/±16g and a magnetic field dynamic range of ±50 gauss.The LSM303AGR includes an I²C serial bus interface that supports standard, fast mode, fast mode plus, andhigh-speed (100 kHz, 400 kHz, 1 MHz, and 3.4 MHz) and an SPI serial standard interface. The system can beconfigured to generate an interrupt signal for free-fall, motion detection and magnetic field detection.The magnetic and accelerometer blocks can be enabled or put into power-down mode separately.

6.3 LPS22HBThe LPS22HB is an ultra-compact piezoresistive absolute pressure sensor which functions as a digital outputbarometer. The device comprises a sensing element and an IC interface which communicates through I²C or SPIfrom the sensing element to the application.The sensing element, which detects absolute pressure, consists of a suspended membrane manufactured using adedicated process developed by ST.The LPS22HB is available in a full-mold, holed LGA package (HLGA). It is guaranteed to operate over atemperature range extending from -40 °C to +85 °C. The package is holed to allow external pressure to reach thesensing element.LPS22HB is factory calibrated but a residual offset could be introduced by the soldering process. This offset canbe removed with a one-point calibration.(For further details, refer to application note AN4833, "Measuringpressure data from ST's LPS22HB digital pressure sensor", on www.st.com.)

6.4 MP34DT05-AThe MP34DT05-A is an ultra-compact, low power, omnidirectional, digital MEMS microphone built with acapacitive sensing element and an IC interface.The sensing element, capable of detecting acoustic waves, is manufactured using a specialized siliconmicromachining process dedicated to producing audio sensors.The IC interface is manufactured using a CMOS process that allows designing a dedicated circuit able to providea digital signal externally in PDM format.The MP34DT05-A is a low-distortion digital microphone with a 64 dB signal-to-noise ratio and –26 dBFS ±3 dBsensitivity.

UM2101Sensors and Bluetooth low energy connectivity

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6.5 BLUENRG-MSThe BlueNRG-MS is a very low power Bluetooth low energy (BLE) single-mode network processor, compliant withBluetooth specification v4.1. The BlueNRG-MS supports multiple roles simultaneously and can act at the sametime as Bluetooth smart sensor and hub device.The Bluetooth Low Energy stack runs on the embedded ARM Cortex-M0 core. The stack is stored on the on-chipnon-volatile Flash memory and can be easily upgraded via SPI.The device comes pre-programmed with a production-ready stack image(Its version could change at any timewithout notice). A different or more up-to-date stack image can be downloaded from the ST website andprogrammed on the device through the ST provided software tools.The BlueNRG-MS allows applications to meet the tight advisable peak current requirements imposed by standardcoin cell batteries.The maximum peak current is only 10 mA at 1 dBm output power. Ultra low-power sleep modes and very shorttransition times between operating modes allow very low average current consumption, resulting in longer batterylife.The BlueNRG-MS offers the option of interfacing with external microcontrollers via SPI transport layer.

6.6 BALF-NRG-02D3This device is an ultra-miniature balun which integrates matching network and harmonics filter.Matching impedance has been customized for the BlueNRG transceiver.The BALF-NRG-02D3 uses STMicroelectronics IPD technology on non-conductive glass substrate whichoptimizes RF performance.

UM2101BLUENRG-MS

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7 Bill of materials

Table 6. STEVAL-STLCS01V1 bill of materials

Item Q.ty Ref. Value Description Order code Manufacturer

1 1 U1

ARM Cortex-M4 32b MCUMicrocontroller

STM32L476JGY6TR ST

2 1 U2 150 mA, 1.8 Vlow quiescentcurrent lownoise LDO

LD39115J18R ST

3 1 U9Ultra-lowPower Acc +Magn

LSM303AGRTR ST

4 1 U10Low-PowerAccelerometer + Gyroscope

LSM6DSMTR ST

5 1 U6

BluetoothLow-EnergyChip V4.1 -MS

BlueNRG-MSCSP ST

6 1 U13Low-powerpressuresensor

LPS22HBTR ST

7 1 U11MEMS audiosensor digitalmicrophone

MP34DT05-A ST

8 1 U4BluetoothLow-EnergyBalun chip

BALF-NRG-02D3 ST

9 1 X2CRYSTAL32MHZ 8PFSMD

CX2016DB32000D0FLJCC AVX

10 1 X1 32.7680kHz,20ppm, 4pF, 60kΩ Crystal ABS06-107-32.768KHZ-T Abracon

11 2 C2, C20 4pF 25V CAP CERNP0 0201 CBR02C409B3GAC Kemet

12 2 C12, C17 15pF 25V CAP 0201NP0 02013A150JAT2A AVX

13 1 FT1 10pF 25V CAP CERNP0 0201 250R05L100GV4T Johanson

Technology

14 1 R2 0 Ω Resistor SMDR0402 Any

15 1 FT2 Any

16 1 MT 0.40pF 25V CAP CERNP0 0201 250R05L0R4AV4T Johanson

Technology

17 2 C32, C34 2.2µF 6.3VCAPCERAMICX5R, 0201

02016D225MAT2A AVX

18 1 C9 0.22µF 6.3V CAP CERX7S 0201 C0603X7S0J224K030BC TDK

UM2101Bill of materials

UM2101 - Rev 5 page 20/36

Item Q.ty Ref. Value Description Order code Manufacturer

19 1 C30 150nF, 10V CAP, MLCC,X5R, 0201 C0603X5R1A154K030BB TDK

20 2 C14, C31 100pF 25V CAP CERNP0 0201 250R05L101JV4T Johanson

Technology

21 1 ANT1 2.4GHZ ANTENNASMD ANT016008LCS2442MA1 TDK

22 9C4, C5, C10,

C11, C13, C18,C29, C33, C43

0.1µF 6.3V ±10% CAP CERX5R 0201 GRM033R60J104KE19D Murata

23 1 R1 560 Ω Resistor SMD Any

24 9C1, C3, C6, C7,C8, C15, C16,

C19, C441µF 6.3V CAP CER

X5R 0201 CL03A105KQ3CSNC Samsung

25 1 LED 605 nm, 2 V, 10mA, 50 mcd

LED, LowPower,Orange

KPG-0603SEC-TT KINGBRIGHT

26 1 CONN 0.4mmConnectorBoard-to-Board

BM10NB(0.8)-16DS-0.4V(51) Hirose

27 1 L1 3.9nH 400mA 300MΩ FIXED IND LQP03TN3N9B02D Murata

28 1 SWD Cable 2.54mm, L=15cm 5 pin ribboncable Any

Table 7. STLCX01V1 bill of materials

Item Q.ty Ref. Value Description Order code Manufacturer

1 1 CN2 BM10JC-16DP-0.4V(53) BM10JC-16DP-0.4V(53) Hirose

2 1 CN5 HEADER 10 SSQ-110-03-L-S Samtec

3 2 CN6,CN9 HEADER 8 SSQ-108-03-L-S Samtec

4 1 CN8 HEADER 6 SSQ-106-03-L-S Samtec

5 5 C1,C5,C10,C13,C14 100nF X7R Any

6 2 C4,C6 47uF, 6.3V Tantal Any

7 4 C8,C9,C11,C12

4.7uF, >6.3V,<2 Ω ESR Tantal Any

8 2 C15,C16 4.7uF, 10V X5R Any

9 1 J1 PHONOJACK STEREO 35RASMT4BHNTRX Switchcraft

10 1 J2 Header M 3x1 Any

11 4 J3,J4,J5,J6 PCB Hole Any

12 1 RESET SYS_MODE PTS820 J20M SMTR LFS C&KComponents

13 1 R1 47kΩ ±1% Any

14 1 R2 147kΩ±1% Any

UM2101Bill of materials

UM2101 - Rev 5 page 21/36

Item Q.ty Ref. Value Description Order code Manufacturer

15 11

SB2,SB3,R3,SB4,R4,SB5,SB6,SB7,SB9,SB16,SB17

0R Any

16 2 R5,R6 4K7 Any

17 14

SB1,SB8,SB10,SB11,SB12,SB13,SB14,SB15,SB18,SB19,SB20,SB21,SB22,

SB23

NC Any

18 1 SWD CON5 Any

19 1 USB USB-MICRO USB3075-30-A GCT

20 1 U1 USBLC6-2P6 USBLC6-2P6 ST

21 1 U3 PCM1774RGP PCM1774RGP TI

22 1 U4 LDK120M-R LDK120M-R ST

23 1 U5 ST2378ETTR ST2378ETTR ST

Table 8. STLCR01V1 bill of materials

Item Q.ty Ref. Value Description Order code Manufacturer

1 1 BATT Battery Connector 78171-0003 Molex

2 1 CHRG Red LED Any

3 3 C1,C8,C9 100nF X7R Any

4 4 C2,C3,C6,C7 10V, 4.7µF X5R Any

6 1 C10 10V, 1µF X5R Any

7 1 LED1 LED Green Any

8 1 R1 47kΩ±1% Any

9 1 R2 147kΩ±1% Any

10 1 R3 2kΩ Any

11 2 R4,R8 1kΩ Any

12 1 R5 20kΩ±1% Any

13 3 R6,R7,R11 NC Any

14 1 R10 0 Ω Any

15 1 R9 50mΩ±1%,>=1/16W Any

16 1 SD Micro-SD DM3D-SF Hirose

17 1 SWD CON5 Any

18 1 SW1 PWR SSAJ120100 Alps ElectricCo.

19 1 USB USB-MICRO USB3075-30-A GCT

20 1 U1 USBLC6-2P6 USBLC6-2P6 ST

21 1 U2 STBC08PMR STBC08PMR ST

22 1 U3 LDK120M-R LDK120M-R ST

UM2101Bill of materials

UM2101 - Rev 5 page 22/36

Item Q.ty Ref. Value Description Order code Manufacturer

23 1 U4 STC3115IQT STC3115IQT ST

24 1 U5 HTS221 HTS221 ST

25 1 Battery 3.7V100mAh

LiPO-501225 3pinconnector LiPO-501225 Himax

electronics

26 1 Plastic Box Plastic Box Any

27 2 M2-Nut HEX shape HEX Nut M2 -steel Any

28 1 M2-Screw Pan head -Phillips

10mm M2 Panhead Phillips -steel

Any

29 1 M2-Screw Pan head -Phillips

12mm M2 Panhead Phillips -steel

Any

UM2101Bill of materials

UM2101 - Rev 5 page 23/36

8 Schematic diagrams

Figure 20. STEVAL-STLCS01V1 schematic diagram (1 of 2)

Decoupling Capacitors

LED

1KP

G-0

603S

EC-T

T

GND

R1

LED

SAI_

SD

1u1u 100n 100n1u

GND GNDGNDGND GND

1u

GND

1u

GND

C1C3 C4 C5C6C8 C15

VDD

VDD

VDD

VDD

VDD

VDD

VDD

USB

Crystal

ABS06-107-32.768KHZ-T

4p 4p

GND GND

X1

C2 C20

OSC

32_O

UT

OSC

32_I

N

Ultra-low-power DSP STM32L476xx Microcontroller

STM32L476JGY6

VDDUSBA1

PA15A2

PD2A3

PG9A4

PG14A5

PB3A6

PB7A7

VSS1A8

VDDA9

VSS2B1

PA14B2

PC12B3

PG10B4

PG13B5

VDDIO2B6

PB6B7

PC13B8

VBATB9

PA12

C1

PA13

C2

PC11

C3

PG12

C5

PG11

C4

PB4

C6

PB5

C7

PC15

C8

PC14

C9

PA11

D1

PA10

D2

PC10

D3

BOO

T0D

7

PH1

D8

PH0

D9

PC9

E1

PA8

E2

PA9

E3

PB8 E7PB9 E8NRST E9PC7 F1PC8 F2PC6 F3PC2 F7PC1 F8PC0 F9PB15 G1PB14 G2PB11 G3PA1 G4PA4 G5PA2 G6PC3 G7VREF+ G8VSSA G9

PB12

H1

PB13

H2

PB10

H3

PA7

H4

PA6

H5

PA5

H6

PA3

H7

PA0

H8

VDD

AH

9VD

D2

J1VS

S3J2

PB2

J3PB

1J4

PB0

J5PC

5J6

PC4

J7VD

D3

J8VS

S4J9

U1

BLU

E_M

OSI

BLU

E_SC

K

BLU

E_IR

Q

BLU

E_M

ISO

BLU

E_C

S

BLU

E_R

ST

GN

D

GN

D

GND

GND

GNDG

ND

VDD

VDD

VDD

VDD

VDD

VDD

NRST

TXD-USB_DM

TXD

-USB

_DM

GPI

O6

GPIO5GPIO3GPIO2

GPIO2GPIO2

VDDUSB

VDDUSB

MIC_CLK

RXD-USB_DP

RXD

-USB

_DP

SAI_SCK

SAI_FS

SAI_

MC

LKSA

I_SD

INT2

INT2

INT2INT2

INT2INT2

MIC_DATA

OSC

32_O

UT

OSC

32_I

N

CS_

AG

CS_

M

CS_

A

CS_

P

SPI_

CLK

SPI_SDA

TEST

1

Low-Drop Out Voltage Regulator

LD39115J18

1u

VDD

GND GND

100n

GND GND

1u

GND

1u

VDD

VDD

VDD

0

ENA2 GND A1

INB2 OUT B1

U2

C7

C10 C16C19

R2

VDD

VIN VDD

USB

Hirose bottom connector (optional)

BM10NB(0.8)-16DS-0.4V(51)

P1P1 P2 P2

P3P3 P4 P4

P5P5 P6 P6

P7P7 P8 P8

P9P9 P10 P10

P11P11 P12 P12

P13P13 P14 P14

P15P15 P16 P16

G2G2

G1G1 G4 G4

G3 G3

CONN

GND

GND

GND

GND

GND

VDDNRST VIN

TXD-USB_DM

GPIO6GPIO5

GPIO3GPIO2

VDDUSB

MIC_CLK

RXD-USB_DP

SAI_SCKSAI_FSSAI_MCLK

SAI_SD

SWD_GNDSWD_IOSWD_CLK

SWD_VDD

LP_UART_TX, I2C3_SDA, ADC_IN2, DFSDM_CKIN4 (DFSDM_DATIN6)LP_UART_RX, I2C3_SCL, ADC_IN1, DFSDM_DATIN4

ADC_IN3, DFSDM_CKOUT

USART RX or USB DPUSART TX or USB DM

SWD_RST

SPI3_NSS, SAI2_SD_ASPI3_MOSI, SAI2_MCLK_A

SPI3_SCK, SAI2_SCK_ASPI3_MISO, SAI2_FS_A

Moon Pin output

GND

GND

GNDVDD

NRST

VIN

TXD-USB_DM

GPIO6GPIO5

GPIO3GPIO2

VDDUSB

MIC_CLK

RXD-USB_DP

SAI_SCKSAI_FS SAI_MCLK

SAI_SD

+5V supply3.0V - 3.6V supply

UM2101Schematic diagrams

UM2101 - Rev 5 page 24/36

Figure 21. STEVAL-STLCS01V1 schematic diagram (2 of 2)

Digital Microphone

MP34DT04GND

CLK B3

DOUT B4

GNDG1*4

LR B2VDDB1

U11

GNDVDD

MIC_CLK

MIC_DATA

Accelerometer + Gyroscope

100n 100n

C11 C18

GN

D

GN

D

VDD

VDD

LSM6DS3H

SDOP1

SDXP2

SCXP3

INT1P4

VDD

IOP5

GN

D1

P6

GN

D2

P7

VDD P8INT2 P9OCS P10NC P11

CS

P12

SCL

P13

SDA

P14

U10

GN

DG

ND

GNDGND

VDD

VDD

VDD

INT2

CS_

AGSP

I_C

LKSP

I_SD

A

Pressure Sensor

LPS22HB

SDO

P5

VDD_IOP1

SCLP2 CS P6INT/DRDY P7

GN

D1

P8

GN

D2

P9

VDD

P10

RES

P3

SDA

P4

U13

GN

D

GN

D

GN

D

VDD

VDDCS_PSPI_CLK

SPI_

SDA

Accelerometer + Magnetometer

220n

GND

LSM303AGR

C9

SCLP1

CS_XLP2

CS_MAGP3

SDAP4 DRDY P7GND2 P8

VDD P9VDD_IO P10

INT1

P12

INT2

P11

C1

P5

GN

D1

P6

U9

GND

GN

D

VDDVDD

CS_M

CS_ASPI_CLK

SPI_SDA

BlueNRG - Bluetooth low energy chip

Tuning

Balun + chip antenna

UM2101Schematic diagrams

UM2101 - Rev 5 page 25/36

Figure 22. STLCX01V1 schematic diagram

15

SH

1

7

OUT

SensorTile

SAI_FS

182

5V

1213

SWDIO

TILE_RESET

1

SensorTile ConnectorUSB, SWD, Power

RXD-USB_DP

SWDCLK

SB8

CN2BM10B(0.8)-16DP-0.4V(51)

3

1

C15

4.7μF 6

3V3

14

3V3

GN

D

2

6

MIC_CLK

G3

VDDUSB

13GPIO2

D11

GPIO3

SAI_MCLK

V_USB

G2

4

8

10

V_USB

VIN

RXD-USB_DP

GPIO2

J2

11

3

VIN

3 SB9

16

SAI_MCLK

Max 200mA

SAI_SCK

4

4

C16

4.7μF

2

TXD-USB_DM

5

3EN

SensorTile Footprint

3

7

V_USB

2

VDDADJ

11

4

12

SWDCLK

SWDIO

TXD-USB_DM G1

9

D3

TXD-USB_DM

3

VIN

16

5

8

14GPIO3

D4

TILE_RESET

SH

2

D2

VDD

4

IN

VDDUSB

1

USB-MICRO

1

5

MIC_CLK 17

5

VDDUSB

C1

100nF

SAI_SD

2

1

1

1

1

Fixing holesOn the cornersHole: 2.2mmHead: 4mm

STM32 Nucleo

R2147K

10RXD-USB_DP

VBUS5

SAI_SCK

VDD

4

1

6

RESET

3 C14100nF

TILE_RESET2

5

15

R147K

9

1

G4

VIN

SAI_FS

6

SAI_SD

GND2

SAI_SCK

3

6

3

I2C_SCL

3V3

2

CN9

SB18

6UART_TX

SB19 7

GPIO2_3V32

CN5

R5

4K7

SPI_CS7

SB15

1

SB14

SB12

4

UART_RX

6

SB16

TILE_RESET

SAI_MCLK

5

3

4

6

5

GPIO3_3V3

SAI_FSSPI_SCK

8

2

8

CN6

3

1

83V3_Nucleo

5

GPIO21I2C_SDA

GPIO3

SB1

2

SPI_MOSI54

R6

4K7

SPI_MISO

3V3

CN8

5VSB17

10

SAI_SD

1

4

9

MIC_CLK_3V3

7

SB13

SWDCLK 34

TILE_RESET 5

SWD

1

VDD

SWDIO

2

SB10

4

2

C10100nF

L6

11

UART_RX

6

GPIO3

SB20

SB23L3

RXD-USB_DP

8

19VCC

13CC7

20

16

L5

TXD-USB_DM

CC3

14

CC1

U5

ST2378ETTR

UART_TX

L7

MIC_CLK_3V3 3CC2

OE

TXD-USB_DM

L1

17

CC4

MIC_CLK

5

18

VDD

CC515

10

CC67

SB22

GPIO3_3V3

SB11

GPIO2_3V3

1

CC89

VL

VDD

C13100nF

L8

RXD-USB_DP

L2

GPIO2

12

GN

D

SB21

L4

3V3

U4 LDK120M-R

ADR1

VCO

M

3

SAI_FS

SCKI

SAI_MCLKSB5

R40R

1719

+

3V3

AGN

D +

SB4 11

P

13MODE

5

J1

PHONOJACK STEREO

H_L

VDD

7

3V3

14

AIR

VIO

2

1

PAD

C4 47μF4

LRCK

C114.7μF16

SB2 PGNDGPIO3DIN SB6

3

4

SB7C5

100nF

VCC

SAI_SCK

+

12

2GPIO2

206

R30R

18

+

15

BCK

C9 4.7μF

9

SDA

C124.7μF

SAI_SD

3V3 8D

GN

D

AIL

H_R

+

SB3

10

SCL

C8 4.7μF

VPA5C6 47μF+

U3 PCM1774RGP

U1 USBLC6-2P6

UM2101Schematic diagrams

UM2101 - Rev 5 page 26/36

Figure 23. STLCR01V1 schematic diagram

3

D2

3V3

5

USBLC6-2P6

6

VBUS

D1RXD-USB_DP2

RESET

C1

100nF

SWDCLK

D4

5

2

1

3

VDD

3

USB, SWD, Power switch

V_USBUSB-MICRO

4D3

R41K

2

1RXD-USB_DM

5

4

1

SH2

2

1

SWDIO

SWD

SH1

LED1

4SWDCLK

V_USB

GND

SDA

5

2 1

1

DRDY

VDD

C9

100nF

DAT

0

4

SCL

CLK

VDD

SWB

U5

R7NC

2I2C_SDA

SD_MISO

DETC

3V3

I2C_SCL

6

SD_SCK

DAT

2

SD_CS

SD

Micro-SD

GND

CD

/DAT

3

CS

8

SW

DAT

1

3

6

57

C8

100nF

GN

D

SWA

4

CM

D

VDD

R6NC

SD_MOSI

3

HTS221

HTS221 sensor

micro-SD card socket

2

SCL

C10

1μF

VBat

3

Vcc

5

SDA

BATT

Battery Connector

SW1

PWR

VIN

R950 mΩR8

1K

ADJ

1

4

VCC

VBat

V_USB

9

BAT_NTC

CHRGPWR_ON

6BATD/CD

VBat

8

5

C7

4.7μF

I2C_SCL

PROG

U4

C2

4.7μFV_USB2

1

4

OUT

10

VPROG = 1VIBAT=(VPROG/RPROG)x1000RPROG=1000*VPROG/IBAT

BAT_NTC

PAD

R11NC

R100R

7

2

1

2

Bat-

VBat

R2147K

Battery Charger

GND

GN

D C3

4.7μF

3

CHRG

C6

4.7μF

1

6

CHRG

BAT

EN3

VBat

NC

R520K

3

U3

I2C_SDAALM

Max 200mA

4

R32K

V_USB

3V3_EN IN1

GN

D

CHRG

5

VBat

R147K

3V3

CG

STBC08PMR

2

7RSTIO

U1

LDK120M-R

U2

STC3115IQT

VDD3V3

SWDCLKSWDIO

RESET

MIC_CLK

RXD-USB_DPRXD-USB_DM

SD_CSSD_MISOSD_SCK

SD_MOSI

I2C_SCLI2C_SDA

SensorTile footprint

123456789 10

14

1615

131211

1718

UM2101Schematic diagrams

UM2101 - Rev 5 page 27/36

9 Formal notices required by the U.S. Federal CommunicationsCommission ("FCC")

FCC NOTICE: This device complies with part 15 of the FCC Rules. Operation is subject to the following twoconditions: (1) This device may cause harmful interference, and (2) this device must accept any interferencereceived, including interference that may cause undesired operation.Changes or modifications not expressly approved by the manufacturer could void the user’s authority to operatethe equipment.Additional warnings for FCCThis equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in aresidential installation. This equipment generates, uses and can radiate radio frequency energy and, if notinstalled and used in accordance with the instructions, may cause harmful interference to radio communications.However, there is no guarantee that interference will not occur in a particular installation. If this equipment doescause harmful interference to radio or television reception, which can be determined by turning the equipment offand on, the user is encouraged to try to correct the interference's by one or more of the following measures:• Reorient or relocate the receiving antenna.• Increase the separation between the equipment and the receiver.• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.• Consult the dealer or an experienced radio/TV technician for help.

UM2101Formal notices required by the U.S. Federal Communications Commission ("FCC")

UM2101 - Rev 5 page 28/36

10 Formal product notice required by the Industry Canada ("IC")

Innovation, Science and Economic Development Canada Compliance - This device complies with Innovation,Science and Economic Development RSS standards. Operation is subject to the following two conditions: (1) thisdevice may not cause harmful interference, and (2) this device must accept any interference received, includinginterference that may cause undesired operation. Changes or modifications not expressly approved by themanufacturer could void the user’s authority to operate the equipment.Conformité à Innovation, Sciences et Développement Économique Canada - Cet appareil est conforme auxnormes RSS d'Innovation, Science et Développement économique. L'utilisation est soumise aux deux conditionssuivantes: (1) cet appareil ne doit pas causer d'interférences nuisibles, et (2) cet appareil doit accepter derecevoir tous les types d’interférence, y comprises les interférences susceptibles d'entraîner un fonctionnementindésirable. Les changements ou les modifications non expressément approuvés par le fabricant pourraientannuler le permis d'utiliser l'équipement.

UM2101Formal product notice required by the Industry Canada ("IC")

UM2101 - Rev 5 page 29/36

11 TYPE certification

The module has been tested according to the following TYPE certification rules:• Type of specified radio equipment:

– radio equipment according to the certification ordinance article 2-1-9– sophisticated low power data communication system in a 2.4 GHz band

• Class of emissions, assigned frequency and antenna power:– F1D, 2402 to 2480 MHz, channel separation 2 MHz/40 channels, 0.006 W

• Certification number:– 006-000482

The design and manufacturing are certified on the basis of the Japan Radio Law 38-24.

UM2101TYPE certification

UM2101 - Rev 5 page 30/36

Revision history

Table 9. Document revision history

Date Version Changes

17-Aug-2016 1 Initial release.

28-Aug-2017 2Updated Section "Introduction", Section 1.1: "Overview", Section 1.3: "Initial setup with pre-loadeddemo", Section 6.4: "MP34DT04", Section 6.5: "BLUENRG-MS" and Section 9: "Formal productnotice required by the Industry Canada ("IC")"

30-Oct-2017 3

Added Figure 7: "STEVAL-STLCS01V1 component placement (top side)", Figure 9: "STLCX01V1component placement (top side)", Figure 14: "STEVAL-STLCR01V1 component placement (topside)", Figure 15: "STEVAL-STLCR01V1 component placement (bottom side)" and Section 10:"TYPE certification".

Updated Figure 21: "STLCR01V1 schematic diagram".

18-Jul-2018 4

Added Section 2.2 Differences among the STEVAL-STLCS01V1 generations, Section 6.4MP34DT05-A and Section 6.6 BALF-NRG-02D3.

Updated Figure 1. SensorTile functional block diagram and Figure 6. STEVAL-STLCS01V1 powersupply block diagram.

07-Mar-2019 5 Added references to STBLESensor application.

UM2101

UM2101 - Rev 5 page 31/36

Contents

1 Getting started . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2

1.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.2 Package components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.3 Initial setup with pre-loaded demo . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

1.4 System requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

2 STEVAL-STLCS01V1 hardware description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

2.1 Power supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.2 Differences among the STEVAL-STLCS01V1 generations . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3 STLCX01V1 hardware description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9

3.1 Power supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3.2 USB device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

3.3 Audio DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

3.4 Solder bridge details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

4 STLCR01V1 hardware description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

4.1 Power supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

4.2 SensorTile and cradle assembly in form factor case . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

5 SensorTile programming interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17

6 Sensors and Bluetooth low energy connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

6.1 LSM6DSM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

6.2 LSM303AGR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

6.3 LPS22HB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

6.4 MP34DT05-A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

6.5 BLUENRG-MS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

6.6 BALF-NRG-02D3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

7 Bill of materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

8 Schematic diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24

9 Formal notices required by the U.S. Federal Communications Commission ("FCC") .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28

10 Formal product notice required by the Industry Canada ("IC") . . . . . . . . . . . . . . . . . . . . .29

UM2101Contents

UM2101 - Rev 5 page 32/36

11 TYPE certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31

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List of tablesTable 1. STEVAL-STLCS01V1 main components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5Table 2. STEVAL-STLCS01V1 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6Table 3. STLCX01V1 main components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9Table 4. STLCX01V1 solder bridge details. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10Table 5. STLCR01V1 main components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12Table 6. STEVAL-STLCS01V1 bill of materials. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20Table 7. STLCX01V1 bill of materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21Table 8. STLCR01V1 bill of materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22Table 9. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

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List of figuresFigure 1. SensorTile functional block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1Figure 2. SensorTile kit blister . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3Figure 3. Orientation of SensorTile and cradle expansion connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3Figure 4. SensorTile mounted on cradle expansion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4Figure 5. STEVAL-STLCS01V1 main components and pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5Figure 6. STEVAL-STLCS01V1 power supply block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7Figure 7. STEVAL-STLCS01V1 component placement (top side) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7Figure 8. SensorTile first generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8Figure 9. SensorTile second generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8Figure 10. STLCX01V1 main components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9Figure 11. STLCX01V1 component placement (top side). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11Figure 12. STLCR01V1 cradle main components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12Figure 13. SensorTile soldered onto cradle board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13Figure 14. Battery connection and power switch. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13Figure 15. SensorTile and cradle in plastic case . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14Figure 16. STEVAL-STLCR01V1 component placement (top side) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15Figure 17. STEVAL-STLCR01V1 component placement (bottom side) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16Figure 18. STM32 Nucleo board, cradle and cradle expansion SWD connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17Figure 19. SWD connections with 5-pin flat cable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17Figure 20. STEVAL-STLCS01V1 schematic diagram (1 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24Figure 21. STEVAL-STLCS01V1 schematic diagram (2 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25Figure 22. STLCX01V1 schematic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26Figure 23. STLCR01V1 schematic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

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