GE Corporate R&D Rui Zhou Electronic Power Conversion Program Electronic Systems and Technologies...
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Transcript of GE Corporate R&D Rui Zhou Electronic Power Conversion Program Electronic Systems and Technologies...
GE Corporate R&D
Rui Zhou
Electronic Power Conversion Program
Electronic Systems and Technologies Lab
General Electric Corporate Research & Development
Integrated Power Electronics Simulations at GE CRD
GE Corporate R&D
• Many simple designs can adequately be addressed using specialized
tools such as SABER.• There are more complex systems and applications that require
simultaneous use of different tools:• Large transient applications: steel mill drives, x-ray and MR imaging,
pulsed radar, …• More complex, multi-disciplinary systems: electronic driven
discharge lamps, motors and electronic drives, …
• Real time control code integration with tools.• Today integration solutions are non-systematic and different for each
design.• Most often solutions rely on tool augmented with C or FORTRAN code.• Use of home-grown integration tools such as GEN III DFSS tools is
typical.
• Many simple designs can adequately be addressed using specialized
tools such as SABER.• There are more complex systems and applications that require
simultaneous use of different tools:• Large transient applications: steel mill drives, x-ray and MR imaging,
pulsed radar, …• More complex, multi-disciplinary systems: electronic driven
discharge lamps, motors and electronic drives, …
• Real time control code integration with tools.• Today integration solutions are non-systematic and different for each
design.• Most often solutions rely on tool augmented with C or FORTRAN code.• Use of home-grown integration tools such as GEN III DFSS tools is
typical.
Tools for Power Electronics System Design
GE Corporate R&D
Electronic Design Tools
Circuit Simulation Tools:• Saber• Pspice• ACSL • Hspice• Cadence/Matrix X
Layout Tools:• Mentor• Cadence• Autocad
Fault Analysis Tools:• Oppmax •TESTIFY (Analogy)
Electromagnetic Tools:• Ansoft
Thermal / Mechanical Tools
Solid Modeling Tools:• UG• IDEAS
Finite Element Tools:• ANSYS/Abaqus• Pro Engineer, UG
Thermal Tools: • Fluent• TMG/IDEAS• Ansys Thermal• Flotherm/Flomerics
Optimization Tools
• GEN III DFSS Tools• iSIGHT
Tools for Power Electronics System Design
Many tools, only point solutions for integrationMany tools, only point solutions for integration
GE Corporate R&D
• Develop an integrated, transient thermo-electric simulation to facilitate design of cardiac X-Ray generator power electronics.
• Determine optimal electrical parameters to maximize x-ray tube performance and filament reliability for a wide range of filament coil geometries.
• Develop an integrated, transient thermo-electric simulation to facilitate design of cardiac X-Ray generator power electronics.
• Determine optimal electrical parameters to maximize x-ray tube performance and filament reliability for a wide range of filament coil geometries.
Example: X-Ray Tube Filament System Design
HT_+
z_KV_meas
z_ILR_meas
ILP_pos_high
ILP_pos_low
ILP_neg_low
ILP_neg_high
clk_32MHz
u3
u3
M_point
NP td control
SABER
Td:1uLoad:120k
I_level_low:15
I_level_high:30
Irp
Irs_1
Irs_2
Irprim Irsec
Irload
11p
Cp
44n
Cs_1
44n
Cs_2
Chv1
ic :0
3u
Cr
Iprim/k
1u
Ls_1
1u
Lr
1u
Ls_2
Lm
gon:1333
d2
gon:1333
d1
d3
d4
Vsec/kvm
vp
Rsec
Rp
Rprim
5Rs_1
5Rs_2
18u
Lp
U8
U15
U10M_point
U14
U11
U2
U1
U4
gnd
Chv2
ic :0
short_Lm
ccvs_4p
k:1cn
cp
IGBT_high
IGBT_low
100k
100k
pwld7
von:200
gon:5m
goff:30p
pwld8
von:200
gon:5mgoff:30p
igbt_high
ccvs_4p
k:-1
cn
cp
ILP_pos_high
ILP_pos_low
ILP_neg_low
ILP_neg_high
ILP_input
a2z
zout
smp
ain
gnd
Z
zsmp
100meg
smp
a2z
zout
smp
ain
gnd
LOGIC_4
CLOCK
clock_l4
freq:32megduty:0.5
U1
M_point
U10
u3
HT_+
U1
U11U11
U14 U14 U14
M_point
M_point
M_point
U7
z_sampler_clk
partner
kv_ctrl_board
igbt_h_cmd
igbt_l_cmd
ILR_meas
KV_meas
clk_32mhz
ILP_neg_high
ILP_neg_low
ILP_pos_low
ILP_pos_high
gnd
200
v3
DC_BUS_+
DC_BUS_+
200
v2
_n483
_n483
gnd
gnd
PWL
DSP Controlled Power ConverterDSP Controlled Power Converter X-Ray Tube and FilamentX-Ray Tube and Filament
GE Corporate R&D
• The X-ray generator needs to quickly increase the filament temperature before x-rays can be emitted from the tube.
• Achieve faster response, without overheating the filament.• Take into account filament, geometry, environment, aging,...
• The X-ray generator needs to quickly increase the filament temperature before x-rays can be emitted from the tube.
• Achieve faster response, without overheating the filament.• Take into account filament, geometry, environment, aging,...
Filament current boost Increased filament temperature
Example: X-Ray Tube Filament System Design
GE Corporate R&D
Thermal Model(SRDC IDEAS)
Filament Geometry & Properties (FORTRAN)
Tube Geometry & Properties (many)
Integrated Simulation Approach
Generator Output(SABER+C real time)
Electron-Optical Emission Model (Opera-3D)
Temperatures
e- EmissionProperties
Transient Thermal-Electric Model (Simulink)
Filament Temperature
Filament Life
X-Ray Time
HT_+
z_KV_meas
z_ILR_meas
ILP_pos_high
ILP_pos_low
ILP_neg_low
ILP_neg_high
clk_32MHz
u3
u3
M_point
NP td control
SABER
Td:1uLoad:120k
I_level_low:15
I_level_high:30
Irp
Irs_1
Irs_2
Irprim Irsec
Irload
11p
Cp
44n
Cs_1
44n
Cs_2
Chv1
ic :0
3u
Cr
Iprim/k
1u
Ls_1
1u
Lr
1u
Ls_2
Lm
gon:1333
d2
gon:1333
d1
d3
d4
Vsec/kvm
vp
Rsec
Rp
Rprim
5Rs_1
5Rs_2
18u
Lp
U8
U15
U10M_point
U14
U11
U2
U1
U4
gnd
Chv2
ic :0
short_Lm
ccvs_4p
k:1cn
cp
IGBT_high
IGBT_low
100k
100k
pwld7
von:200
gon:5m
goff:30p
pwld8
von:200
gon:5mgoff:30p
igbt_high
ccvs_4p
k:-1
cn
cp
ILP_pos_high
ILP_pos_low
ILP_neg_low
ILP_neg_high
ILP_input
a2z
zout
smp
ain
gnd
Z
z smp
100meg
smp
a2z
zout
smp
ain
gnd
LOGIC_4
CLOCK
clock_l4
freq:32megduty :0.5
U1
M_point
U10
u3
HT_+
U1
U11U11
U14 U14 U14
M_point
M_point
M_point
U7
z_sampler_clk
partner
kv_ctrl_board
igbt_h_cmd
igbt_l_cmd
ILR_meas
KV_meas
c lk_32mhz
ILP_neg_high
ILP_neg_low
ILP_pos_low
ILP_pos_high
gnd
200
v3
DC_BUS_+
DC_BUS_+
200
v2
_n483
_n483
gnd
gnd
PWL
GE Corporate R&D
Electrodless Fluorescent
Electronic Halogen
Integral CMH
• Challenge is to achieve fully optimized design.
• Very close interaction between electronics and light source.
• Challenge is to achieve fully optimized design.
• Very close interaction between electronics and light source.
Example: Integral Electronic Lamp Design
GE Corporate R&D
iSIGHT or GEN III environ.iSIGHT or GEN III environ.Code Integrationand System Optimization
System Simulation Circuit Layout Lamp Coil Model
Physics-Based Discharge Model in Saber Physics-Based Discharge Model in Saber
DFSS Analysis:• Scorecards• FMEA•DFR
SaberSaber Simulator Ansoft FEA
Example: Integral Electronic Lamp Design
GE Corporate R&DDFSS to Increase Simulation Speed
Identify Key X’s Identify Y’s
Create DoE
Create TransferFunctions
Run FE Models
Validate TransferFunctions
Complex Finite Element Model
Simple Polynomial Equation(Transfer Function)
Y = x12 + x2
2 + x1x2 + ...
GE Corporate R&DSimulation Automation
Microsoft Excel
Identify X’s and Y’s
Select DoE
Chose Simulation
Run Simulation Send X’s
Get Y’s
Perform Regression
Run X1 X2 X3 X4 Y1 Y21 -1 -1 -1 -1 44.4 42.92 1 -1 -1 -1 61.9 59.73 -1 1 -1 -1 48.7 47.24 1 1 -1 -1 70.5 68.25 -1 -1 1 -1 42.8 40.76 1 -1 1 -1 57.6 54.27 -1 1 1 -1 44.9 42.88 1 1 1 -1 62.7 59.39 -1 -1 -1 1 44.6 42.710 1 -1 -1 1 62.5 59.1
Desktop PC Workstation
Need well integrated simulations to automate optimizationNeed well integrated simulations to automate optimization
GE Corporate R&D
EvaluatePerformance
(Saber)
EvaluatePerformance
(Saber)
Design CircuitSchematic/Layout
Design CircuitSchematic/Layout
General Design Process for ElectronicsGeneral Design Process for Electronics
PerformDRC/ERC(Dracula)
PerformDRC/ERC(Dracula)
ComponentSelection
ComponentSelectionPCB SpecsPCB Specs
Yield PredictionYield PredictionEvaluate/Optimize
Cost Function(Cost = Wp * Performance
+ Wy * Yield )
Evaluate/Optimize Cost Function
(Cost = Wp * Performance+ Wy * Yield )
Vary Design Parameters,Component Selection,
PCB Specs
Vary Design Parameters,Component Selection,
PCB Specs
OptimizedProcess
OptimizedProcess
Feed Forward Path
Feed Back Path
Final Path
Optimization Paths
There is a broader need for systematic design processThere is a broader need for systematic design process
GE Corporate R&D
PDM solution helps to enable this collaboration. It provides:• GE-wide connectivity to the databases and tools• Workflow control• The required levels of security for the data
PDM solution helps to enable this collaboration. It provides:• GE-wide connectivity to the databases and tools• Workflow control• The required levels of security for the data
Collaboration between multi-functional teams, customers, vendors and partners across a business in a structured, disciplined fashion and implemented over the
web
Collaboration between multi-functional teams, customers, vendors and partners across a business in a structured, disciplined fashion and implemented over the
web
3-D Solid Models
Simulation & Analytics
DFSS Gen III Tools
Web-basedConnectivity
Manufacturing Process
Capabilities
DigitalPrototyping
Adv. Sys.Eng.
(scorecards)
Knowledge Warehouse
Low-cost implementa-
tion
ProductData Mgmt.
e-Engineering Pyramid
GE’s e-Engineering Vision
GE Corporate R&D
• Need for solutions that speed complex interactions among analysis
programs.• Engineering portals for promoting common tools, methodologies and
models.• Data security.• A PDM solution where design, engineering, production and suppliers
exchange information using neutral formats.• No single standard can address all interactions, however many
protocols have been or are being defined such as XML, HTML, STEP,
IGES, DXF, ODB++, etc.• A collaborative product design environment via the web.• GE - wide connectivity to the databases and tools.• Unified, company - wide tool / data platforms and strategies with
seamless company - wide access.
• Need for solutions that speed complex interactions among analysis
programs.• Engineering portals for promoting common tools, methodologies and
models.• Data security.• A PDM solution where design, engineering, production and suppliers
exchange information using neutral formats.• No single standard can address all interactions, however many
protocols have been or are being defined such as XML, HTML, STEP,
IGES, DXF, ODB++, etc.• A collaborative product design environment via the web.• GE - wide connectivity to the databases and tools.• Unified, company - wide tool / data platforms and strategies with
seamless company - wide access.
Tool / Data / Workflow Integration: Needs