GAN ICs and Wireless Charging Intro

…personal

…portable

…connected

Dialog Semiconductor

Charging Technology Day

11 November 2016, London

© 2016 Dialog Semiconductor

Dialog Semiconductor – Charging Technology Day, 11 November 2016

Forward Looking Statement

2

This presentation contains “forward-looking statements” that reflect management’s current

views with respect to future events. The words “anticipate,” “believe,” “estimate, “expect,”

“intend,” “may,” “plan,” “project” and “should” and similar expressions identify forward-looking

statements. Such statements are subject to risks and uncertainties, including, but not limited to:

an economic downturn in the semiconductor and telecommunications markets; changes in

currency exchange rates and interest rates, the timing of customer orders and manufacturing

lead times, insufficient, excess or obsolete inventory, the impact of competing products and

their pricing, political risks in the countries in which we operate or sale and supply constraints.

If any of these or other risks and uncertainties occur (some of which are described under the

heading “Risks and their management” in Dialog Semiconductor’s most recent Annual Report)

or if the assumptions underlying any of these statements prove incorrect, then actual results

may be materially different from those expressed or implied by such statements. We do not

intend or assume any obligation to update any forward-looking statement, which speaks only

as of the date on which it is made, however, any subsequent statement will supersede any

previous statement.

Mark Tyndall

Senior Vice President, Corporate Development & Strategy

3 © 2016 Dialog Semiconductor


A New Power Technology

Agenda

Wireless Charging Introduction


GAN: A New Power Technology

5

• A semiconductor technology to be increasingly used

for power electronics

• GAN HEMT, enhancement mode power FETS, the

fastest & most efficient power transistors, critical to

power designs

• 10-100x faster switching speed, lower on resistance

• Smaller and lower cost power transistors

Smaller faster and more efficient

GAN: attractive volume market,

complementary to our current Power

Management & Power Conversion

technologies, opportunity to differentiate

So

urc

e

Dra

in

Gate

Silicon substrate

GAN


GAN, why now?

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GaN

Transitioning to a standard foundry

• GAN transitioning from “boutique” or research

compound semiconductor fabs to mainstream

• Strategic partnership with TSMC for past 2 years,

Dialog’s first products in 2016

• 6 “ inch wafers, 650 volt process

• Not just a FET switch, pioneering together true

monolithic integration

• Qualifying above and beyond the highest reliability

standards


Dialog SmartGaNTM

&

Optimized

analog and logic

The world’s fastest

power switch

DA8801 Fully Integrated

GaN Half Bridge

Ga

N

GaN

7

Integration the Dialog way

Q

QSET

CLR

S

R

SmartGaNTM integration means ease of use, lower cost, and higher performance


Significant SAM Expansion For Dialog

8 2020 Dialog

Traditional SAM

2020 Dialog

SAM with

Integrated GAN

$8.3B

$9.8B

~ A $7 Billion

discrete market

today

~ 20% transition to Integrated

GAN solutions by 2020

Sources: IDC 2016, IHS 2015, Gartner 2015, GFK 2016, Dialog Internal

SmartGan™

SmartGan™

SmartGan™

SmartGan™

8


Smartphone Adapter Challenge

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Higher power adapters, smaller form factor, maintaining BOM cost

Increasing Activity

Demands Trend

Multi-Core

Processors

Greater Battery Capacity

BUT

1500 mAh to >3000 mAh

More power (current)

required to charge

battery

Application

Processor

Maintaining the

adapter small form factor

for increased power rating


GAN Value Proposition: Mobile Adapters

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Higher efficiency

• Cut power losses by ½, increase

efficiency to ~ 94%

Power density

• Wall adapters that are ½ the size

• More power in the same form

factor or shrink adapter size

Lower costs

• Integrates over 30 components monolithically

Complete Dialog solutions

• One supplier for all controllers and GaN, optimized for performance and cost

Shrink transformer

Eliminate discrete

switches

Shrink or eliminate

snubbing and filtering


The world’s first GaN power IC family

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DA8801: Monolithic 650V Half Bridge

• Dialog DA8801 half bridge integrated IC sampling to key OEMs today

• Dialog’s GaN solutions are scalable to meet a wide range of increasing power

requirements

• From smartphones to computing to longer term server

DA8801

Smartphones &

Tablets Notebooks and PCs

Servers &

Infrastructure

25W (today) 45W (2017) 65W 100W – 1kW

Dialog Semiconductor – Charging Technology Day, 11 November 2016 12

Digital

Regulation

Controller Sync Rec

Controller

AC

(from the wall)

5V-12V OUT

• Additional GAN half bridge (#4) in active

clamp configuration, more than doubles

our IC $ content value in a portable

adapter

Complete Next Generation Adapter Platform

DA8801 Integrated GaN Half Bridge

Increased adapter content

(to the phone)

# 1 # 2

# 3

# 4


SmartGaNTM Wall-to-Battery Platform

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GaN solutions are part of Dialog’s most complete power platform,

focused on smaller size, faster charging, and high efficiency

DA8801

GaN Power

IC

• The first

optimized

monolithic

half bridge

Smartphone adapter Smartphone USB Type-C

wire and

connector

Digital PSR

Controllers

• Digital

platform

High Efficiency

Handheld

Chargers

• Proprietary high

efficiency

chargers ICs for

smartphones and

tables

Rapid Charge

Controllers

94% efficient, 40% smaller, 15W/in3 98% efficient

>91% efficiency from wall to battery

• Meets

Qualcomm

QC, MediaTek

Pump

Express,

Samsung

AFC

Achieving absolutely best in class end to end efficiency


Conclusion: GaN is Ready

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• GaN going mainstream, capacity becoming available

• GaN adds significant market SAM expansion to Dialog

• First SmartGaNTM solutions are available now from Dialog Semiconductor,

expected production start in 2HF 2017

With GaN

Without

GaN

a single ubiquitous wall

adapter for PC and smartphone


Resonant Inductive Coupling Charging – Qi -

Why Energous? A disruptive RF wireless charging technology

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VERSUS

• New uncoupled wireless RF charging, providing true wire-free mobile power

• Scalable (0.5watt to 10watt)

• Charging multiple devices over millimetres to meters

• Smallest footprint, miniature antennas on existing circuit board (no coils), cost effective

• Targeting both transmitter and receiver platforms

• IoT, wearables, PC, smartphones, headphone, automotive

10x10 mm 3x3 mm

QFN

Tiny QFN chip

and antenna

Many components

bulky coils

RF Charging


• Exclusive supplier of Energous WattUP ICs

• Leveraging Dialog’s world-class operations & sales

• Accelerating customer adoption

• Strategic investor $10M , full warrant coverage

• Further Dialog SAM expansion

• Complementary technologies driving further sales

– Dialog Bluetooth in receivers and transmitters

– Dialog power management (PMIC)

– Dialog AC/DC Rapid Charge in transmitter

Strategically Aligned Energous, key terms

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Source: Statista, IDC, ABI, IHS, Gartner 2016

Million Units

Wireless Receivers

2018 TAM

…personal

…portable

…connected

…personal

…portable

…connected

© 2016 Dialog Semiconductor

18

Powering the Smart Connected Future

www.dialog-semiconductor.com


GAN ICs and Wireless Charging Intro

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