Electroplating Apparatus U.S. Patent 5,467,824. Jan. 35, 1996 7X Gfiego, assignor to Uemura Kogyo KK, Osaka, Japan

An electroplating method for small arti- cles utilizing an apparatus comprising a treatment room fixed to the upper end of a drive shaft concentrically, the room being tubular with vertical center or the height of the room changing gradually low as radius increases, a cathodic contact ring to supply electricity being disposed the maximum di- ameter inside part or lower inside end of the treatment room, a porous ring near the contact ring allowing only operation liquid to pass and not allowing small articles to be electroplated to pass, an anode being dis- posed through an upper opening of the treatment room, the method comprising loading small articles to be treated in the treatment room; pouring an electroplating liquid until the anode is always dipped; rotating the above treatment room in a cer- tain time and stopped in a short time or decelerate in a short time and repeating the above cycle; after a certain time, stopping the supply of electroplating liquid; supply- ing rinse water; after another certain time,

stopping the supply of rinse water; and dehydrating the water centrifugally by high rotation.

Galvanized Steel Sheet U.S. Patent 5,487,919. Jan. 30, 1996 Y. Tobiyama et al., assignors to Kawasaki Steel Corp., Hyogo, Japan

A method of manufacturing a galvanized steel sheet with high press formability, comprising effecting a galvanization on a steel sheet followed by an alloying treat- ment; immersing the galvanized steel sheet in a bath of an aqueous solution containing OS to 2.0 wt % of hydrous borate of an alkali metal; taking the steel sheet out of the bath and effecting such a control as to make a water-containing borate film on a surface of the steel sheet in a range from 10-l ,000 mg/m’; heating the steel sheet at a temperature ranging from 6O-100°C to dry the film and effecting such a control as to make the total water content, including water contained in the water-containing bo- rate film and crystalline water contained in the water-containing borate film, in a range from 20-70%.

We are uniquely qualified to recommend, design, manufacture and install microfiltration, ultrafiltration, clarification and conventional treatment systems.

Sputtering Target U.S. Patent 5,487,&X Jan. 35, 1996 R. E. Demaray et al., assignors to Applied Materials Inc., Santa Clara, Calif.

An integrated sputtering target assem- bly.

Sputtering Anode U.S. f’atent5,487,821. Jan. 30, 1996 PA. Sk& et a/., assignors to The BOC Group Inc., Murray Hif/, NJ.

An anode structure for magnetron sput- tering systems.

Sputtering Targets Having Life Alarm Function U.S. Patent 5,487,823. Jan. 30, 1996 S. Sawada et al, assignors to Japan Energy Corp., Tokyo

A sputtering target having a life alarm function comprising a sputtering target and a gas-component source embedded in a bottom portion of the target.

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