Full-size ATLAS Sensor Testing
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Transcript of Full-size ATLAS Sensor Testing
Full-size ATLAS Sensor Full-size ATLAS Sensor TestingTesting
On behalf of the ATLAS R&D group Development of n-in-p Silicon Sensors for very high
radiation environment
Jan BohmInstitute of Physics AS CR, Prague
R&D50 Workshop, CERN, 16-18.11.2009
Total number of tested sensors: 19
ATLAS institutes involved in testing:
University of Cambridge 2 sensors: W15, W16
J.R.Carter, B. Hommels, D. Robinson
Stony Brook University 9 sensors: W19, W21-23, W25-29
B. DeWilde, R. Maunu, D. Puldon, R. McCarthy, D. Schamberger
Institute of Physics AS CR and Charles University, Prague
6 sensors: W32, W33, W35, W37, W38, W39
J. Bohm, J. Broz, Z. Dolezal, P. Kodys, P. Kubik, M. Mikestikova
Geneva University 2 sensors: W17, W18
A. Clark, D. Ferrèrre, S. G. Sevilla
J.Bohm, R&D50 Conference, CERN 17.11.09
Testing before irradiation
Testing of large area ATLAS07 Series I sensors manufactured by Hamamatsu Photonics
0
50
100
150
200
250
300
350
400
450
0 200 400 600 800 1000Bias voltage [-V]
Lea
kag
e cu
rren
t [-n
A]
w32 PRGw33 PRGw35 PRGW37 PRGw38 PRGw39 PRGw32 HPKW33 HPKw35 HPKw37 HPKw38 HPKw39 HPKW19 SBUW19HPKW21SBUW21 HPKW22 SBUW22 HPKW23 SBUW23 HPKW25 SBUW25 HPKW26 SBUW26 HPKW27 SBUW27HPKW28 SBUW28 HPKW29 SBUW29HPKW18 GeUW17 GeUW15 CAMW16 CAM
. IV characteristics of large area ATLAS07 Series I sensors normalized to 20°C.
No microdischargeswith exception of W18having slow breakdown at ~420Vbut after a “training”, no microdischarge up to 1000V.
All tested sensors satisfy the ATLAS07 Technical Specification Ileak<20µA
Note: Leakage current should be measured with time delay of several seconds (10s) after ramping up bias voltage and measured for both cases, the ramping up and the ramping down of Vbias. See note of A.Chilingarov at RD50 Recommendations.
J.Bohm, R&D50 Conference, CERN 17.11.09
“Training of detectors” :
Detector is biased by the breakdown voltage at current ~10µA for10-20 min or longer time.
IV of sensor W37
-2500
-2000
-1500
-1000
-500
0
-600-500-400-300-200-1000
Reverse bias voltage
Lea
kag
e cu
rren
t [n
A]
After testing06/08Before currentstability 26/10after currentstability 27/10After training14/08
Leakage Current Time EvolutionSensor W35
-290
-270
-250
-230
-210
0 200 400 600 800 1000 1200
time [min]
Lea
kag
e cu
rren
t [n
A]
Leakage Current Time Evolution
-600
-500
-400
-300
-200
-100
0
0 200 400 600 800 1000 1200 1400
time [min]
Leak
age
Curr
ent [
nA]
W37
Time Evolution of Leakage CurrentLeakage current is decreasing with time for sensors having slow breakdown after testing.
Vbias=-240V
After ~20 hours of “training” slow breakdown of W37 at -360V disappeared and IV characteristic was restored.
J.Bohm, R&D50 Conference, CERN 17.11.09
RH=35%
After the quality acceptance tests the measured leakage current was usually higher by 10-30%.
Depletion Voltage
5
Bulk capacitance measured between backplane andbias ring by LCR meter with CSRS function at 1kHz
Vdep extracted as crossing of the linear rise 1/C^2 and the saturated valueVery smooth behavior of CV
Summary: All tested sensors satisfy specifications: Vdep<500V
Estimated values of VdepPrague 6 sensors 199-203VStony Brook 2 190-210VCambridge 2 235, 245V
Frequency dependence of Cbulk
1
1.5
2
2.5
3
3.5
1.E+02 1.E+03 1.E+04 1.E+05 1.E+06Freq [Hz]
Cbu
lk [n
F]
W37
W38
CSRS Vbias=-240V
ATLAS07 - Series I Depletion Voltage
0.00E+00
2.00E-02
4.00E-02
6.00E-02
8.00E-02
1.00E-01
1.20E-01
0 100 200 300 400 500 600
-Vbias [V]
1/C
2 [nF
-2]
W32 Vdep=202.5W33 Vdep=202.3W35 Vdep=201.4W37 Vdep=198.8W38 Vdep=200.3W39 Vdep=199.4W15 Vdep=245.5W16 Vdep=234.9
ATLAS07-P-SSSD_Series I
1kHz with CR in Series
Cbulk =3.25nF on plateau
Frequency dependence of a bulk capacitance of sensors W37 and W38 measured at 240 V with CR in series.
J.Bohm, R&D50 Conference, CERN 17.11.09
Cinter CpRp 100kHz Sensor W37
0.6
0.8
1
1.2
1.4
1.6
1.8
2
2.2
0 100 200 300 400 500 600
Vbias [-V]
Cin
t [p
F]
2 probes
5 probes
3 probes5 needles
Cint/0.89cm CpRp /1MHz W375 probe method
0.5
0.55
0.6
0.65
0.7
0.75
0.8
0 100 200 300 400 500 600
Vbias [-V]
Cin
t/cm
[pF
]
S1
S2
S3
S4Comparison with mini sensors
2-probes
3-probes
5-probes
LCR High
DC pad
LCR LowGND GND
Inter-strip Capacitance – Methods of Measurement
Different methods of Cint measurementFive-probe method: S.Lindgren et al.Santa Crus University
S.Lindgren et al.
Mini-sensorsLstrip=0.89cm
Cint(5-pr)/Cint(3-pr)=0.939 and 0.913 for100kHz and 1MHz, respect.Cint(2-pr)/Cint(5-pr)=0.53
J.Bohm, R&D50 Conference, CERN 17.11. 09
Isolated strips
GND
AC pad
0
0.5
1
1.5
2
2.5
1 10 100 1000
Frequency [kHz]
Inte
rstr
ip c
apac
itanc
e [p
F]
3 probe method
5 probe method
0.5
1.0
1.5
2.0
2.5
3.0
0 100 200 300 400 500 600
Bias voltage [-V]
Inte
rstr
ip c
ap
acit
an
ce [
pF
]
W33-Seg1
W33-Seg2
W33-Seg3
W33-Seg4
W35-Seg1
W35-Seg2
W35-Seg3
W35-Seg4
W37-Seg1
W37-Seg2
W37-Seg3
W37-Seg4
W38-Seg1
W38-Seg2
W38-Seg3
W38-Seg4
W39-Seg1
W39-Seg2
W39-Seg3
W39-Seg4
W32-Seg1
W32-Seg2
W32-Seg3
W32-Seg4
W37-Seg1
3 probe method at 100kHz
5 probe method at 100kHz and 1MHz
Frequency dependence of inter-strip capacitance measured with three-probe method (full symbols) and with five-probe method (open symbols) at Vbias= -240 V.
Inter-strip Capacitance – Bias Scan
Inter-strip capacitance as a function of thereverse bias voltage measured at randomlyselected strips from each sensor segment with the three-probe method at 100 kHz (full symbols) and with the five-probe method (open symbols) at 100 kHz and 1 MHz test frequencies.
Technical Specification defines upper limit:Cint / 1cm < 1.1pF measured by three-probemethod at 100kHz with CR in parallel.
J.Bohm, R&D50 Conference, CERN 17.11.09
Cint has complicated behavior at low bias voltages but becomes constant beyond FDV
Recommendation: Measure Cint at 1MHz Test frequency with function CR in parallel by three- probe method.
0
50
100
150
200
250
300
350
400
1.85 1.87 1.89 1.91 1.93 1.95
Interstrip Capacitance [pF]
Seg4
Seg3
Seg2
Seg1
Three-Probe Method Strip Scan of Cinter
1.4
1.5
1.6
1.7
1.8
1.9
2
2.1
0 500 1000strip#
Cin
t [p
F]
Seg1
Seg2
Seg3
Seg4
Three-Probe MethodStrip Scan of Cinter
1.865
1.87
1.875
1.88
1.885
1.89
1.895
1.9
1.905
1.91
0 200 400 600 800 1000 1200
strip #
Cin
t [pF
]
W37Seg1
W37Seg2
0
20
40
60
80
100
120
140
160
180
0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4
Interstrip Capacitance [pF]
Segment4
Segment3
Segment2
Segment1
00.20.40.60.8
11.21.41.61.8
2
0 200 400 600 800 1000 1200
S trip Num ber
Inte
rstr
ip c
apac
itan
ce [
pF
]
S egment 1S egment 2
S egment 3S egment 4
Strip Scan of Cint by Two-probe and Three-probe methods
Hartmut Sadrozinski initiated three-probe method for the Strip Scan of Cint
The aim of strip-to-strip measurements is to study strip integrity and uniformity of electrical characteristics over the whole sensor .It requires probing 1280 strip pads on each of four sensor segments. A switching matrix was used to perform multiple tests on adjacent strips at each step of an automatic probe station (simultaneous measurement of Ccoupl, Rbias, Istrip, Idiel, Rint,Cint)
Very probably capacitance of the switching matrix is not stable and it changes by several hundreds of fF.
Similar non-stability observed in Stony Brook and Prague
FWHM=12fF
Three-probe method confirmed perfect parameter uniformity over whole large Hamamatsu sensor
Measurement in Prague with three-probe method without switching matrix
J.Bohm, R&D50 Conference, CERN 17.11.09
Two-probe method
Time Evolution of Cint
1.81.821.841.861.88
1.91.921.941.961.98
2
0 100 200 300 400 500 600 700
Time [min]
Cin
t[p
F] 1MHz
100kHz
Bias Scan of Cint
1
1.5
2
2.5
3
3.5
4
-250-150-50 Vbias[V]
Cin
t[pF
]
1MHz
100kHz
Time Evolution of Inter-strip Capacitance
RH=32-35%, T=22C
Cint measured by three-probe method at 100kHz and 1MHz test frequency
A. Chilingarov, Nucl. Instr. and Meth. A 560 (2006) 118-121.
There is no decrease of Cint with time as it was observed on SCT sensors
Very good surface isolation of ATLAS07 sensors
J.Bohm, R&D50 Conference, CERN 17.11.09
Coupling Capacitance/Bias Resistance
10
Coupling Capacitance / strip
64.0
65.0
66.0
67.0
68.0
69.0
70.0
71.0
72.0
73.0
74.0
0 100 200 300 400 500 600 700
-Vbias [V]
Ccp
l [p
F]
W32-Seg2
W35-Seg2
W37-Seg1
W37-Seg2
W37-Seq3
W37-Seg4
W38-Seg1
W38-Seg2
W38-Seg3
W38-Seg4
W39-Seg1
W39-Seg2
W39-Seg3
W39-Seg4
ATLAS07-Series
1 kHz test frequency, CR in ParallelVdep
ATLAS07 Specification: Ccpl measured between strip metal (AC pad) andstrip implant (DC pad) at 1kHz with CR in parallel ≥ 20pF/cm
Ccpl/cm>27.8pF
Frequency Dependence of Coupling Capacitance
0
10
20
30
40
50
60
70
80
0.1 1 10 100 1000
Freq [kHz]
Ccp
l [p
F]
W38-Seg1
W38-Seg2
W38-Seg3
W38-Seg4
W35-Seg2
W37-Seg1
W37-Seg2
W37-Seg3
W37-Seg4
W39-Seg1
W39-Seg2
W39-Seg3
W39-Seg4
ATLAS07 Series I
Vbias = -20V, CR in Parallel
Polysilicon Bias Resistance
1.0001.0501.1001.1501.2001.2501.3001.3501.4001.4501.500
0 200 400 600-Vbias [V]
Rb
ias [
MO
hm
]
W32-Seg1
W32-Seg2
W37-Seg1
W37-Seg2
W37-Seg3
W37-Seg4
W38-Seg1
W38-Seg2
W38-Seg3
W38-Seg4
ATLAS07 Series I
IV scan made by SMU for voltages 1V-6V applied to implant DC pad. Rbias=dUappl/dI
Rbias is constant while n-p junction is closed (Vbias=-0.7V)
ATLAS07 Specification: Rbias = 1.5±0.5MΩ
J.Bohm, R&D50 Conference, CERN 17.11.09
Strip Scan of Coupling Capacitance and Bias Resistor
0
500
1000
1500
2000
2500
0 200 400 600 800 1000 1200
S trip Num be r
Bia
s r
es
ista
nc
e [
kO
hm
]
S egment 1
S egment 2
S egment 3
S egment 40
200
400
600
800
1000
12001
1.0
8
1.1
6
1.2
4
1.3
2
1.4
1.4
8
1.5
6
1.6
4
1.7
2
1.8
1.8
8
1.9
6
Bias Resistance [MOhm]
Segment 4
Segment 3
Segment 2
Segment 1
In the strip scan Ccoupl and Rbias are measured by LCR meter between AC pad and Bias Ring, CR in series at 100kHz test frequency
J.Bohm, R&D50 Conference, CERN 17.11.09
FWHM=120kΩ
AC pad
DC pad
Rinter
Bias Ring
2 DC pads contacted: Rint, Istrip1 AC pad and BR: Ccoupl, Rbias, Idiel3 AC pads contacted: Cinter
FWHM=1.5pF
No openings and shorts were found on tested sensors W15, W16, W23, W25, W38 – in total 23040 strips
Strip Scan of the Strip Current and Inter-strip Resistor
7
7.2
7.4
7.6
7.8
8
8.2
8.4
8.6
0 50 100 150 200 250
B ia s Volta g e [-V]
Inte
rstr
ip C
on
du
ctan
ce [
pA
/V]
W25-1
-0.9-0.8-0.7-0.6-0.5-0.4-0.3-0.2-0.1
0
0 200 400 600 800 1000 1200 1400
S trip Num be r
Str
ip c
urr
ent
(nA
)
S ec tion 1
S ec tion 2
S ec tion 3
S ec tion 4
0
50
100
150
200
250
300
0 5 10 15 20 25 30
Conductance [pA/V]
Series4
Series3
Series2
Series1
Rinter=1/conductance is equal to 300GΩ/cm
W23
The inter-strip resistance has been measured on pair of strips of a fully depleted sensor:SMU applied voltages ±10V to the DC pad and current to ground was measured on second strip.
Strip current was measured between the DC pad on an implant strip and the ground of a fully depleted sensor.Istrip probes the bulk and n-implant homogeneity
J.Bohm, R&D50 Conference, CERN 17.11.09
Current through the coupling dielectric
The current flowing through the couplingdielectric was measured by SMU at 100V applied to the AC pad
J.Bohm, R&D50 Conference, CERN 17.11.09
Sensor W25 Idiel
0
0.1
0.2
0.3
0.4
0.5
0.6
0 500 1000 1500
Strip Number
I die
l (nA
) Section 1
Section 2
Section 3
Section 4
No pinhole have been observed on all tested sensors W23, W25, W38 – in total 12800 strips
ATLAS07 Specification
Measurement
Leakage Current < 200 µA at 600 V 200 nA – 370 nA
Full Depletion Voltage
< 500 V 190 V – 245 V
Coupling Capacitance at 1 kHz
> 20 pF/cm >28 pF/cm
Silicon Bias Resistance
1.5±0.5 MΩ 1.3 MΩ -1.6 MΩ
Current through dielectric
Idiel < 10 nA
Pinhole: Idiel
>>10 nA
< 10 nA
Strip Current No explicit limit < 2 nA
Inter-strip Capacitance3 probe method 100kHz5 probe method
< 1.1 pF/cm 0.7 pF/cm – 0.8 pF/cm0.66pF/cm- [1]0.75pF/cm
Inter-strip Resistanceper cm
> 10x Rbias ~
15 MΩ
> 150 GΩ
[1] For a noise estimate the five-probe method
Comparison of measured parameter values with Technical Specification
All tested sensors satisfied Technical Specification of non-irradiated sensors for leakage current and full depletion voltage as well as for coupling capacitance, bias resistance, inter-strip capacitance and resistance measured with the bias voltage scan. The onset voltage of micro-discharges for ATLAS07 large area sensors is VMD > 1000V.
Strip scans were performed on six sensors. Measurements of coupling capacitance and the current going through coupling dielectric show that there are no defects on 23040 tested strips: no pinholes, punch-through defects, shorts, or openings of metal strips. Measurements of coupling capacitance and bias resistance on one strip as well as measurements on pairs of strips ofthe inter-strip resistance and the three-probe measurement of Cint confirmed no systematic deviations from uniform distributions.
J.Bohm, R&D50 Conference, CERN 17.11.09
All evaluated sensors passed the quality acceptance tests
Punch-through Voltage
Effective ResistanceSensor W37
0
0.5
1
1.5
2
-80 -60 -40 -20 0 20 40 60 80 100 120
Uappl
Eff.
Re
sist
an
ce {
MO
hm
]
Seg1
Seg2
Seg3
Seg4
Punch-through voltage vs Vbias
0
5
10
15
20
25
30
0 100 200 300 400 500
Baias voltage [-V]
Punc
h-th
roug
h vo
ltage
[-V]
Eff. Resistance of large W37 sensor
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
-30 -20 -10
Uappl [V]
Effe
ctiv
e R
esis
tan
ce
[M
Oh
m]
#1240 BR
#1180 BR
#1080 BR
# 880 BR
#320 BR
#40 BR
#2 BR
#2 Opp BR
#40 Opp BR
#320 Opp BR
#640 Opp BR
#1000 Opp BR
#1240 Opp BR
#640 BR
Eff. Resistance dependence on reverse bias voltage
0.1
1
10
-30 -20 -10
Uappl [V]
Effe
ctiv
e re
sist
ance
[M
Ohm]
-20V
-60V
-120V
-240V
-360V
-500V
It was found that the behavior of 1 cm test structures with and without PTP was very similar (Z3 and Z4)(S.Lindgren et al) Voltage is applied on DC pad and currentis measured on bias ring.Hartmut Sadrozinski initiated measurement for full sizesensor
Full size sensors with 2.38cm strips with p-stop only have similarbehavior (Sensor W37) as mini-sensors.
PRELIMINARYa) DC pad closely to bias resistor (BR)b) DC pad on opposite side to BR
Case b) has PTV higher by 1,2V than case a) and eff. res. is also higher by 0.1MOhm for b) than for a). No dependence on strip # was seen.
Punch-through voltage (PTV) depends on bias voltage
Mini-sensors
J.Bohm, R&D50 Conference, CERN 17.11.09