FPIX_flip_chip_test module calibration tests November 14 th 2012.
Transcript of FPIX_flip_chip_test module calibration tests November 14 th 2012.
![Page 1: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/1.jpg)
FPIX_flip_chip_test module calibration tests
November 14th 2012
![Page 2: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/2.jpg)
2
Sensor
• 2 SINTEF 2004 1x1 bump bonded– Planar 300 μm thick pixel sensor
• Flip-chipped then reflow• Assembled on a new testboard on November
7th, and 12th 2012• No post-dicing IV was performed for the first
sensor
![Page 3: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/3.jpg)
3
Leakage currentFirst sensor’s before BBM IV was not performed!
![Page 4: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/4.jpg)
4
Full calibration summary – First sensor
ROC pixel alive test
Bump-bonding test
Second sensor has similar calibration
Bias = -150 V
![Page 5: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/5.jpg)
5
Testing bum-bond with forward bias test
• Run pixel alive test • ROC on with sensor at reverse bias• ROC on with sensor at forward bias
• Idea:– Forward bias will saturate the sensor, causing pre-
amplifiers in chip pixels saturate: chip pixels disappear from the pixel alive test map if bump-bonds are in contact
![Page 6: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/6.jpg)
6
Testing bum-bond with forward bias test
SINTEF 2004 1x1 First sensor
NO
BIA
SRE
VERS
E BI
ASFO
RWAR
D B
IAS
SINTEF 2004 1x1 Second sensor
REVERSE BIAS = -150 VFORWARD BIAS = +10 V
![Page 7: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/7.jpg)
7
Radioactive source test (Sr-90)
Bias = -150VMean = 22 ke-MP = 18 ke-285 μm thick
Double pixel hits In one trigger
SINTEF 2004 1x1 Second sensorSINTEF 2004 1x1 First sensor
Bias = -150VMean = 23 ke-MP = 18 ke-285 μm thick
![Page 8: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/8.jpg)
8
Charge collection Charge distribution mean values versus bias voltages Scan not performed for the second sensor
![Page 9: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/9.jpg)
9
Summary• Two SINTEF 2004 1x1 sensors bump bonded• Both sensor ROCs work fine
– Good calibrations: Gain, SCurve, Vsf etc– Full calibration
• Forward bias current and standard methods showed that all bump-bonds are in good contact – IV suggest a good ROC to sensor contact established since
ground goes through ROC for sensor HV• Standard bump-bond algorithm implemented in PSI
DAQ software consistent with forward bias test• Source tests showed a good charge collection
![Page 10: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/10.jpg)
10
SINTEF 2011 1x1 SENSORS
![Page 11: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/11.jpg)
11
![Page 12: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/12.jpg)
12
Past design 1x2 in previous production
L1, S1, S2, S3, S5
New in this batch.Maximized pixel area
S8
L2, L3, S6
New in this batch.Removed asimmetry
S4, S7Note: S1, S2 and S3 have slim edges (S1 the slimmest and increasing in S2 and S3)
SINTEF_2011 1x1 sensors
![Page 13: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/13.jpg)
13
November 13, 2012
![Page 14: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/14.jpg)
14
Sensor: SINTEF_2011_WA15_S5
• Planar 300 μm thick• Bump bonded to a ROC on 11-13-2012
- Flip-chipped then reflown• Assembled on a new testboard on November
13th 2012
![Page 15: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/15.jpg)
15
A15 S5 - Leakage currentBreakdown [V]
On wafer 195Post-dicing 225Module 960
![Page 16: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/16.jpg)
16
A15 S5 - Full calibration summary (-150V)
ROC pixel alive test
Bump-bonding test (this test found 3185 dead bumps)
Bias = -150 V
![Page 17: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/17.jpg)
17
A15 S5 - Full calibration summary (-400V)
ROC pixel alive test
Bump-bonding test (this test found 1 dead bumps)
Bias = -400 V
![Page 18: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/18.jpg)
18
A15 S5 - Testing bum-bond with forward bias test
SINTEF_2011_WA15_S5 pixel alive test at REVERSE BIAS
SINTEF_2011_WA15_S5 pixel alive test at NO BIAS
REVERSE BIAS = -150 VFORWARD BIAS = +10 V
pixel alive test at FORWARD BIASpixel alive test at REVERSE BIAS with LIGHT
![Page 19: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/19.jpg)
19
A15 S5 - Radioactive source test (Sr-90)
Source above sensor center Source above sensor edge
Pixel alive map at forward bias Source placed on different locationsabove the sensor No correlation found betweenforward bias pixel alive map andsource hitmap Can we trust forward bias test?
REVERSE BIAS = -150 VFORWARD BIAS = +10 V
![Page 20: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/20.jpg)
20
A15 S5 - Radioactive source test (Sr-90)
Bias = -150VMean = 25 ke-MP = 21.5 ke-Thickness = 300 μm
Double pixel hits In one trigger
![Page 21: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/21.jpg)
21
Sensor: SINTEF_2011_WA15_S6
• Planar 300 μm thick• Bump bonded to a ROC on 11-13-2012
- Flip-chipped then reflow• Assembled on a new testboard on November
13th 2012
![Page 22: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/22.jpg)
22
A15 S6 - Leakage currentBreakdown [V]
On wafer 360Post-dicing 370Module 835
![Page 23: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/23.jpg)
23
A15 S6 - Full calibration summary (-150V)
ROC pixel alive test
Bump-bonding test (this test found 2488 dead bumps)
Bias = -150 V
![Page 24: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/24.jpg)
24
A15 S6 - Full calibration summary (-300V)
ROC pixel alive test
Bump-bonding test (this test found 6 dead bumps)-400 V has also identical results
Bias = -300 V
![Page 25: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/25.jpg)
25
A15 S6 - Testing bum-bond with forward bias test
SINTEF_2011_WA15_S6 pixel alive test at REVERSE BIAS
SINTEF_2011_WA15_S6 pixel alive test at FORWARD BIAS
SINTEF_2011_WA15_S6 pixel alive test at NO BIAS
~1200 pixels
Forward bias: 1200 dead bumpsPSI software test: 2488 dead bumps
REVERSE BIAS = -150 VFORWARD BIAS = +10 V
![Page 26: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/26.jpg)
26
A15 S6 - Radioactive source test (Sr-90)
Bias = -150VMean = 20.7 ke-MP = 17.5 ke-Thickness = 300 μm
Source hit map
![Page 27: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/27.jpg)
27
Summary• SINTEF 2011 S5 and S6 sensors bump bonded on 11-13-2012• Both sensor ROCs work fine
– Good calibrations: Gain, SCurve, Vsf etc– Full calibration with minimum effort
• Sensor breakdown voltages increased after assembly– No breakdown observed up to 800 V
• Bump-bond tests– Forward bias method: 1000 (S5), 1200 (S6) dead bumps – PSI method: 3185 (S5), 2488 (S6) dead bumps
• Source tests showed a good charge collection– Double hits in one trigger needs to removed from analysis– S6 will be retested with source
![Page 28: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/28.jpg)
28
November 14, 2012
![Page 29: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/29.jpg)
29
Sensor: SINTEF_2011_WA15_S7
• Planar 300 μm thick• Bump bonded to a ROC on 11-14-2012
- Flip-chipped then reflow• Assembled on a new testboard on November
14th 2012• IVs on wafer, before and after BBM, and on
testboard measured
![Page 30: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/30.jpg)
30
A15 S7 - Leakage currentBreakdown [V]
On wafer 310Before BBM 320BBM 945Testboard >1100
![Page 31: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/31.jpg)
31
A15 S7 - Full calibration summary
ROC pixel alive test
Bump-bonding test
Bias = -200 V
![Page 32: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/32.jpg)
32
A15 S7 - Testing bum-bond with forward bias + light test
SINTEF_2011_WA15_S6 pixel alive test at REVERSE BIAS
pixel alive test at FORWARD BIAS
SINTEF_2011_WA15_S6 pixel alive test at NO BIAS
pixel alive test at REVERSE BIAS with LIGHT
REVERSE BIAS = -200 VFORWARD BIAS = +10 V
![Page 33: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/33.jpg)
33
A15 S7 - Radioactive source test (Sr-90)
Bias = -200VMean = 25 ke-MP = 21.7 ke-Thickness = 300 μm
Source hit map
![Page 34: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/34.jpg)
34
Sensor: SINTEF_2011_WA15_S8
• Planar 300 μm thick• Bump bonded to a ROC on 11-14-2012
- Flip-chipped then reflow• Assembled on a new testboard on November
14th 2012• IVs on wafer, before and after BBM, and on
testboard measured
![Page 35: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/35.jpg)
35
A15 S8 - Leakage currentBreakdown [V]
On wafer 310Before BBM 220BBM >1100Testboard 995
![Page 36: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/36.jpg)
36
A15 S8 - Full calibration summary
ROC pixel alive test
Bump-bonding test
Bias = -200 V
![Page 37: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/37.jpg)
37
A15 S8 - Testing bum-bond with forward bias + light test
SINTEF_2011_WA15_S6 pixel alive test at FORWARD BIAS
SINTEF_2011_WA15_S6 pixel alive test at REVERSE BIAS
REVERSE BIAS = -200 VFORWARD BIAS = +10 V
SINTEF_2011_WA15_S6 pixel alive test with LIGHT at REVERSE BIAS
![Page 38: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/38.jpg)
38
A15 S8 - Radioactive source test (Sr-90)
Bias = -200VMean = 26 ke-MP = 22.2 ke-Thickness = 300 μm
Source hit map
![Page 39: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/39.jpg)
39
Sensor: SINTEF_2011_WA17_S5
• Planar 300 μm thick• Bump bonded to a ROC on 11-15-2012
- Flip-chipped then reflow• Assembled on a new testboard on November
15th 2012• IVs on wafer, before and after BBM, and on
testboard measured
![Page 40: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/40.jpg)
40
A17 S5 - Leakage currentBreakdown [V]
On wafer 205Before BBM 185BBM >1000Testboard >1000
![Page 41: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/41.jpg)
41
A17 S5 - Full calibration summary
ROC pixel alive test
Bump-bonding test (found 67 dead bumps)
Bias = -200 V
![Page 42: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/42.jpg)
42
A17 S5 - Testing bum-bond with forward bias + light test
SINTEF_2011_WA17_S5 pixel alive test at FORWARD BIAS
SINTEF_2011_WA17_S5 pixel alive test at REVERSE BIAS
REVERSE BIAS = -200 VFORWARD BIAS = +10 V
SINTEF_2011_WA17_S5 pixel alive test with LIGHT at REVERSE BIAS
![Page 43: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/43.jpg)
43
A17 S5 - Radioactive source test (Sr-90)
Bias = -200VMean = 22.3 ke-MP = 19.7 ke-Thickness = 300 μm
Source hit map
![Page 44: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/44.jpg)
44
Sensor: SINTEF_2011_WA17_S6
• Planar 300 μm thick• Bump bonded to a ROC on 11-15-2012
- Flip-chipped then reflow• Assembled on a new testboard on November
15th 2012• IVs on wafer, before and after BBM, and on
testboard measured
![Page 45: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/45.jpg)
45
A17 S6 - Leakage currentBreakdown [V]
On wafer 210Before BBM 185BBM >1000Testboard >1000
![Page 46: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/46.jpg)
46
A17 S6 - Full calibration summary
ROC pixel alive test
Bump-bonding test (found 6 dead bumps)
Bias = -200 V
![Page 47: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/47.jpg)
47
A17 S6 - Testing bum-bond with forward bias + light test
SINTEF_2011_WA17_S6 pixel alive test at FORWARD BIAS
SINTEF_2011_WA17_S6 pixel alive test at REVERSE BIAS
REVERSE BIAS = -200 VFORWARD BIAS = +10 V
SINTEF_2011_WA17_S6 pixel alive test with LIGHT at REVERSE BIAS
![Page 48: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/48.jpg)
48
A17 S6 - Radioactive source test (Sr-90)
Bias = -200VMean = 26 ke-MP = 21.2 ke-Thickness = 300 μm
Source hit map
![Page 49: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/49.jpg)
49
Sensor: SINTEF_2011_WA17_S7
• Planar 300 μm thick• Bump bonded to a ROC on 11-15-2012
- Flip-chipped then reflow• Assembled on a new testboard on November
15th 2012• IVs on wafer, before, and on testboard
measured
![Page 50: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/50.jpg)
50
A17 S7 - Leakage currentBreakdown [V]
On wafer 405Before BBM 310Testboard 830
![Page 51: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/51.jpg)
51
A17 S7 - Full calibration summary
ROC pixel alive test
Bump-bonding test (found 15 dead bumps)
Bias = -200 V
![Page 52: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/52.jpg)
52
A17 S7 - Testing bum-bond with forward bias + light test
SINTEF_2011_WA17_S7 pixel alive test at FORWARD BIAS
SINTEF_2011_WA17_S7 pixel alive test at REVERSE BIAS
REVERSE BIAS = -200 VFORWARD BIAS = +10 V
SINTEF_2011_WA17_S7 pixel alive test with LIGHT at REVERSE BIAS
![Page 53: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/53.jpg)
53
A17 S7 - Radioactive source test (Sr-90)
Bias = -200VMean = 27 ke-MP = 21.4 ke-Thickness = 300 μm
Source hit map
![Page 54: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/54.jpg)
54
Sensor: SINTEF_2011_WA17_S8
• Planar 300 μm thick• Bump bonded to a ROC on 11-15-2012
- Flip-chipped then reflow• Assembled on a new testboard on November
15th 2012• IVs on wafer, before, and on testboard
measured
![Page 55: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/55.jpg)
55
A17 S8 - Leakage currentBreakdown [V]
On wafer 325Before BBM 330Testboard 810
![Page 56: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/56.jpg)
56
A17 S8 - Full calibration summary
ROC pixel alive test
Bump-bonding test (found 2 dead bumps)
Bias = -200 V
![Page 57: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/57.jpg)
57
A17 S8 - Testing bum-bond with forward bias + light test
SINTEF_2011_WA17_S8 pixel alive test at FORWARD BIAS
SINTEF_2011_WA17_S8 pixel alive test at REVERSE BIAS
REVERSE BIAS = -200 VFORWARD BIAS = +10 V
SINTEF_2011_WA17_S8 pixel alive test with LIGHT at REVERSE BIAS
![Page 58: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/58.jpg)
58
A17 S8 - Radioactive source test (Sr-90)
Bias = -200VMean = 25.5 ke-MP = 21 ke-Thickness = 300 μm
Source hit map
![Page 59: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/59.jpg)
59
Sensor: SINTEF_2011_WA16_S5
• Planar 300 μm thick• Bump bonded to a ROC on 11-16-2012
- Flip-chipped then reflow• Assembled on a new testboard on November
16th 2012• IVs on wafer, before, and on testboard
measured
![Page 60: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/60.jpg)
60
A16 S5 - Leakage currentBreakdown [V]
On wafer 210Before BBM 185After BBM >1000Testboard 950
![Page 61: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/61.jpg)
61
A16 S5 - Full calibration summary
ROC pixel alive test
Bump-bonding test (found 2 dead bumps)
Bias = -200 V
![Page 62: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/62.jpg)
62
A16 S5 - Testing bum-bond with forward bias + light test
SINTEF_2011_WA16_S5 pixel alive test at FORWARD BIAS
SINTEF_2011_WA16_S5 pixel alive test at REVERSE BIAS
REVERSE BIAS = -200 VFORWARD BIAS = +10 V
SINTEF_2011_WA16_S5 pixel alive test with LIGHT at REVERSE BIAS
![Page 63: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/63.jpg)
63
A16 S5 - Radioactive source test (Sr-90)
Bias = -200VMean = 26.7 ke-MP = 21.7 ke-Thickness = 300 μm
Source hit map
![Page 64: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/64.jpg)
64
Sensor: SINTEF_2011_WA16_S6
• Planar 300 μm thick• Bump bonded to a ROC on 11-16-2012
- Flip-chipped then reflow• Assembled on a new testboard on November
16th 2012• IVs on wafer, before, and on testboard
measured
![Page 65: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/65.jpg)
65
A16 S6 - Leakage currentBreakdown [V]
On wafer 345Before BBM 190After BBM 835Testboard 825
![Page 66: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/66.jpg)
66
A16 S6 - Full calibration summary
ROC pixel alive test
Bump-bonding test (found 13 dead bumps)
Bias = -200 V
![Page 67: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/67.jpg)
67
A16 S6 - Testing bum-bond with forward bias + light test
SINTEF_2011_WA16_S6 pixel alive test at FORWARD BIAS
SINTEF_2011_WA16_S6 pixel alive test at REVERSE BIAS
REVERSE BIAS = -200 VFORWARD BIAS = +10 V
SINTEF_2011_WA16_S6 pixel alive test with LIGHT at REVERSE BIAS
![Page 68: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/68.jpg)
68
A16 S6 - Radioactive source test (Sr-90)
Bias = -200VMean = 27 ke-MP = 22.6 ke-Thickness = 300 μm
Source hit map
![Page 69: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/69.jpg)
69
Sensor: SINTEF_2011_WA16_S7
• Planar 300 μm thick• Bump bonded to a ROC on 11-16-2012
- Flip-chipped then reflow• Assembled on a new testboard on November
16th 2012• IVs on wafer, before, and on testboard
measured
![Page 70: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/70.jpg)
70
A16 S7 - Leakage currentBreakdown [V]
On wafer 345Before BBM 190Testboard 980
![Page 71: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/71.jpg)
71
A16 S7 - Full calibration summary
ROC pixel alive test
Bump-bonding test (found 5 dead bumps)
Bias = -200 V
![Page 72: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/72.jpg)
72
A16 S7 - Testing bum-bond with forward bias + light test
SINTEF_2011_WA16_S7 pixel alive test at FORWARD BIAS
SINTEF_2011_WA16_S7 pixel alive test at REVERSE BIAS
REVERSE BIAS = -200 VFORWARD BIAS = +10 V
SINTEF_2011_WA16_S7 pixel alive test with LIGHT at REVERSE BIAS
![Page 73: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/73.jpg)
73
A16 S7 - Radioactive source test (Sr-90)
Bias = -200VMean = 29 ke-MP = 25 ke-Thickness = 300 μm
Source hit map
![Page 74: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/74.jpg)
74
Sensor: SINTEF_2011_WA16_S8
• Planar 300 μm thick• Bump bonded to a ROC on 11-16-2012
- Flip-chipped then reflow• Assembled on a new testboard on November
16th 2012• IVs on wafer, before, and on testboard
measured
![Page 75: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/75.jpg)
75
A16 S8 - Leakage currentBreakdown [V]
On wafer 345Before BBM 325After BBM 970Testboard >1000
![Page 76: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/76.jpg)
76
A16 S8 - Full calibration summary
ROC pixel alive test
Bump-bonding test (found 13 dead bumps)
Bias = -200 V
![Page 77: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/77.jpg)
77
A16 S8 - Testing bum-bond with forward bias + light test
SINTEF_2011_WA16_S8 pixel alive test at FORWARD BIAS
SINTEF_2011_WA16_S8 pixel alive test at REVERSE BIAS
REVERSE BIAS = -200 VFORWARD BIAS = +10 V
SINTEF_2011_WA16_S8 pixel alive test with LIGHT at REVERSE BIAS
![Page 78: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/78.jpg)
78
A16 S8 - Radioactive source test (Sr-90)
Bias = -200VMean = 25.6 ke-MP = 21.3 ke-Thickness = 300 μm
Source hit map
![Page 79: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/79.jpg)
79
Sensor: SINTEF_2011_WA18_S5
• Planar 300 μm thick• Bump bonded to a ROC on 11-17-2012
- Flip-chipped then reflow• Assembled on a new testboard on November
17th 2012• IVs on wafer, before, and on testboard
measured
![Page 80: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/80.jpg)
80
A18 S5 - Leakage currentBreakdown [V]
On waferBefore BBMTestboard
![Page 81: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/81.jpg)
81
A18 S5 - Full calibration summary
ROC pixel alive test
Bump-bonding test (found 493 dead bumps)Not repeatable and degrades at higher biases
Bias = -200 V
![Page 82: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/82.jpg)
82
A18 S5 - Testing bum-bond with forward bias + light test
SINTEF_2011_WA18_S5 pixel alive test at FORWARD BIAS
SINTEF_2011_WA18_S5 pixel alive test at REVERSE BIAS
REVERSE BIAS = -200 VFORWARD BIAS = +10 V
SINTEF_2011_WA18_S5 pixel alive test with LIGHT at REVERSE BIAS
![Page 83: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/83.jpg)
83
A18 S5 - Radioactive source test (Sr-90)
Bias = -200VMean = 27.6 ke-MP = 22.5 ke-Thickness = 300 μm
Source hit map
![Page 84: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/84.jpg)
84
Sensor: SINTEF_2011_WA18_S6
• Planar 300 μm thick• Bump bonded to a ROC on 11-17-2012
- Flip-chipped then reflow• Assembled on a new testboard on November
17th 2012• IVs on wafer, before, and on testboard
measured
![Page 85: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/85.jpg)
85
A18 S6 - Leakage currentBreakdown [V]
On waferBefore BBMTestboard
![Page 86: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/86.jpg)
86
A18 S6 - Full calibration summary
ROC pixel alive test
Bump-bonding test (found 1 dead bumps)
Bias = -200 V
![Page 87: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/87.jpg)
87
A18 S6 - Testing bum-bond with forward bias + light test
SINTEF_2011_WA18_S6 pixel alive test at FORWARD BIAS
SINTEF_2011_WA18_S6 pixel alive test at REVERSE BIAS
REVERSE BIAS = -200 VFORWARD BIAS = +10 V
SINTEF_2011_WA18_S6 pixel alive test with LIGHT at REVERSE BIAS
![Page 88: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/88.jpg)
88
A18 S6 - Radioactive source test (Sr-90)
Bias = -200VMean = 30 ke-MP = 25 ke-Thickness = 300 μm
Source hit map
![Page 89: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/89.jpg)
89
November 27, 2012
![Page 90: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/90.jpg)
90
Noise study
• SCurve tests performed at– 22 °C– Vbias [-V] = 25, 50, 75, 100, 125, 150, 175, 200,
250, and 300– Almost no noise date at Vbias = -25 V
![Page 91: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/91.jpg)
91
SINTEF 2011 WA15
![Page 92: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/92.jpg)
92
SINTEF 2011 WA16
![Page 93: FPIX_flip_chip_test module calibration tests November 14 th 2012.](https://reader036.fdocuments.net/reader036/viewer/2022062408/56649e9f5503460f94ba15d7/html5/thumbnails/93.jpg)
93
SINTEF 2011 WA17