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A N P E C MOSFET TRANSISTORS N-Channel MOSFET TABLE OF CONTENT Pos. Series Drain Source Voltage Continue Drain Current Case Pages V DSS (V) I D (A) 01 APM 2050 ND 20 5 SOT-89 11 02 APM 3040 ND 30 3 SOT-89 9 03 APM 3054 ND 30 4 SOT-89 10 04 APM 2054 NV 20 5 SOT-223 11 05 APM 3054 NV 30 4 SOT-223 10 06 APM 3055 NG 30 12 TO-263 10 07 APM 4008 NG 40 60 TO-263 11 08 APM 7512 NG 75 75 TO-263 11 09 APM 2506 NUB 25 60 TO-251 10 10 APM 2509 NUB 25 50 TO-251 10 11 APM 2506 NF 25 60 TO-220 9 12 APM 2509 NF 25 50 TO-220 9 13 APM 7512 NF 75 80 TO-220 9 14 APM 4412 NF 30 12 SOP-8 11 15 APM 4810 K 30 11 SOP-8 10 16 APM 4812 K 30 8 SOP-8 9 17 APM 4320 K 30 13 SOP-8 10 18 APM 4330 KC 30 15 SOP-8 10 19 APM 4340 K 30 17 SOP-8 11 20 APM 4472 K 40 12 SOP-8 10 21 APM 4476 K 40 7.5 SOP-8 11 22 APM 4474 K 40 11 SOP-8 9 23 APM 4220 KA 25 16 SOP-8 11 24 APM 4350 KP 30 60 KPAK 11 25 APM 4354 KP 30 70 KPAK 11 26 APM 4356 KP 30 80 KPAK 11 27 APM 9984 CCG 20 6 JSOT-8 11 28 APM 2322 AA 20 1.7 SOT-23 10 29 APM 2324 AA 20 3 SOT-23 10 30 APM 2300 CA 20 6 SOT-23 10 31 APM 2306 A 30 3.5 SOT-23 10 32 APM 2308 A 30 3 SOT-23-3 10 33 APM 2318 A 30 3 SOT-23-3 9 34 APM 2320 A 30 2.5 SOT-23-3 11 35 APM 2360 A 60 2.5 SOT-23 9 36 APM 2600 C 30 6 SOT-23-6 11 37 APM 1402 AS 20 1.1 SC-70 10 38 APM 1404 AS 20 1.5 SC-70-3 10

Transcript of files.iczoom.com · A N P E C MOSFET TRANSISTORS N-Channel MOSFET TABLE OF CONTENT Pos. Series...

Page 1: files.iczoom.com · A N P E C MOSFET TRANSISTORS N-Channel MOSFET TABLE OF CONTENT Pos. Series Drain Source Voltage Continue Drain Current Case Pages V DSS (V) I D (A) 01 APM 2050

A N P E C

MOSFET TRANSISTORS

N-Channel MOSFET

TABLE OF CONTENT Pos. Series Drain Source Voltage Continue Drain Current Case Pages V DSS (V) I D (A) 01 APM 2050 ND 20 5 SOT-89 11 02 APM 3040 ND 30 3 SOT-89 9 03 APM 3054 ND 30 4 SOT-89 10 04 APM 2054 NV 20 5 SOT-223 11 05 APM 3054 NV 30 4 SOT-223 10 06 APM 3055 NG 30 12 TO-263 10 07 APM 4008 NG 40 60 TO-263 11 08 APM 7512 NG 75 75 TO-263 11 09 APM 2506 NUB 25 60 TO-251 10 10 APM 2509 NUB 25 50 TO-251 10 11 APM 2506 NF 25 60 TO-220 9 12 APM 2509 NF 25 50 TO-220 9 13 APM 7512 NF 75 80 TO-220 9 14 APM 4412 NF 30 12 SOP-8 11 15 APM 4810 K 30 11 SOP-8 10 16 APM 4812 K 30 8 SOP-8 9 17 APM 4320 K 30 13 SOP-8 10 18 APM 4330 KC 30 15 SOP-8 10 19 APM 4340 K 30 17 SOP-8 11 20 APM 4472 K 40 12 SOP-8 10 21 APM 4476 K 40 7.5 SOP-8 11 22 APM 4474 K 40 11 SOP-8 9 23 APM 4220 KA 25 16 SOP-8 11 24 APM 4350 KP 30 60 KPAK 11 25 APM 4354 KP 30 70 KPAK 11 26 APM 4356 KP 30 80 KPAK 11 27 APM 9984 CCG 20 6 JSOT-8 11 28 APM 2322 AA 20 1.7 SOT-23 10 29 APM 2324 AA 20 3 SOT-23 10 30 APM 2300 CA 20 6 SOT-23 10 31 APM 2306 A 30 3.5 SOT-23 10 32 APM 2308 A 30 3 SOT-23-3 10 33 APM 2318 A 30 3 SOT-23-3 9 34 APM 2320 A 30 2.5 SOT-23-3 11 35 APM 2360 A 60 2.5 SOT-23 9 36 APM 2600 C 30 6 SOT-23-6 11 37 APM 1402 AS 20 1.1 SC-70 10 38 APM 1404 AS 20 1.5 SC-70-3 10

Page 2: files.iczoom.com · A N P E C MOSFET TRANSISTORS N-Channel MOSFET TABLE OF CONTENT Pos. Series Drain Source Voltage Continue Drain Current Case Pages V DSS (V) I D (A) 01 APM 2050

N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. A.2 - Sep., 2008

APM2050ND

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, andadvise customers to obtain the latest version of relevant information to verify before placing orders.

Pin Description

Ordering and Marking Information

Features

Applications

• 20V/5A,

RDS(ON)=25mΩ(Typ.) @ VGS=10VRDS(ON)=30mΩ(Typ.) @ VGS=4.5VRDS(ON)=50mΩ(Typ.) @ VGS=2.5V

• Super High Dense Cell Design

• Reliable and Rugged

• Lead Free and Green Devices Available

(RoHS Compliant)

N-Channel MOSFET

Top View of SOT-89

• DC/DC Converters

G

S

D

(3)

(2)

(1)

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).

GD

S

APM2050N

Handling Code

Temperature Range

Package Code

Package Code D : SOT-89Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material L : Lead Free Device G : Halogen and Lead Free Device

APM2050N D : APM2050XXXXX_N

XXXXX - Date Code

Assembly Material

Page 3: files.iczoom.com · A N P E C MOSFET TRANSISTORS N-Channel MOSFET TABLE OF CONTENT Pos. Series Drain Source Voltage Continue Drain Current Case Pages V DSS (V) I D (A) 01 APM 2050

Copyright ANPEC Electronics Corp.Rev. A.2 - Sep., 2008

APM2050ND

www.anpec.com.tw2

Absolute Maximum Ratings (TA = 25°C unless otherwise noted)

Electrical Characteristics (TA = 25°C unless otherwise noted)

Symbol Parameter Rating Unit

VDSS Drain-Source Voltage 20

VGSS Gate-Source Voltage ±12 V

ID* Continue Drain Current 5

IDM* Pulsed Drain Current VGS=10V

20 A

IS* Diode Continuous Forward Current 2 A

TJ Maximum Junction Temperature 150

TSTG Storage Temperature Range -55 to 150 °C

TA=25°C 1.47 PD* Power Dissipation for Single Operation

TA=100°C 0.58 W

RθJA* Thermal Resistance-Junction to Ambient 85 °C/W

Note * : Surface Mounted on 1in2 pad area, t ≤ 10 Seconds.

APM2050ND Symbol Parameter Test Conditions

Min. Typ. Max. Unit

STATIC CHARACTERISTICS

BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 20 - - V

VDS=16V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current

TJ=85°C - - 30 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 0.6 0.9 1.5 V

IGSS Gate Leakage Current VGS=±12V, VDS=0V - - ±10 µA

VGS=10V, IDS=5A - 25 35

VGS=4.5V, IDS=3.5A - 30 50 RDS(ON) a Drain-Source On-state Resistance

VGS=2.5V, IDS=2.5A - 50 85

VSDa Diode Forward Voltage ISD=2A, VGS=0V - 0.8 1.3 V

GATE CHARGE CHARACTERISTICS b

Qg Total Gate Charge - 6 8

Qgs Gate-Source Charge - 1 -

Qgd Gate-Drain Charge

VDS=10V, VGS=4.5V, IDS=5A

- 2.6 -

nC

Page 4: files.iczoom.com · A N P E C MOSFET TRANSISTORS N-Channel MOSFET TABLE OF CONTENT Pos. Series Drain Source Voltage Continue Drain Current Case Pages V DSS (V) I D (A) 01 APM 2050

Copyright ANPEC Electronics Corp.Rev. A.2 - Sep., 2008

APM2050ND

www.anpec.com.tw3

Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)

APM2050ND Symbol Parameter Test Conditions

Min. Typ. Max. Unit

DYNAMIC CHARACTERISTICS b

Ciss Input Capacitance - 375 -

Coss Output Capacitance - 105 -

Crss Reverse Transfer Capacitance

VGS=0V, VDS=10V, Frequency=1.0MHz - 85 -

pF

td(ON) Turn-on Delay Time - 4 8

Tr Turn-on Rise Time - 11 21

td(OFF) Turn-off Delay Time - 22 41

Tf Turn-off Fall Time

VDD=10V, RL=10Ω, IDS=1A, VGEN=4.5V, RG=6Ω

- 8 15

ns

trr Reverse Recovery Time - 15 - ns

Qrr Reverse Recovery Charge IDS=5A, dlSD/dt=100A/µs

- 5 - nC

Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.

Page 5: files.iczoom.com · A N P E C MOSFET TRANSISTORS N-Channel MOSFET TABLE OF CONTENT Pos. Series Drain Source Voltage Continue Drain Current Case Pages V DSS (V) I D (A) 01 APM 2050

Copyright ANPEC Electronics Corp.Rev. A.2 - Sep., 2008

APM2050ND

www.anpec.com.tw4

Typical Operating Characteristics

Power Dissipation

Pto

t - P

ower

(W)

Tj - Junction Temperature (°C)

Drain Current

Tj - Junction Temperature

I D -

Dra

in C

urre

nt (

A)

Thermal Transient Impedance

Nor

mal

ized

Tra

nsie

nt T

herm

al R

esis

tanc

e

Square Wave Pulse Duration (sec)

Safe Operation Area

VDS - Drain - Source Voltage (V)

I D -

Dra

in C

urre

nt (A

)

0 20 40 60 80 100 120 140 1600.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

TA=25oC

0 20 40 60 80 100 120 140 1600

1

2

3

4

5

6

TA=25oC,V

G=10V

1E-4 1E-3 0.01 0.1 1 10 1000.01

0.1

1

2

Mounted on 1in2 padR

θJA : 85oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

0.01 0.1 1 10 1000.01

0.1

1

10

100

100ms

Rds(on

) Lim

it

300µs

TA=25oC

1s

1ms

10ms

DC

Page 6: files.iczoom.com · A N P E C MOSFET TRANSISTORS N-Channel MOSFET TABLE OF CONTENT Pos. Series Drain Source Voltage Continue Drain Current Case Pages V DSS (V) I D (A) 01 APM 2050

Copyright ANPEC Electronics Corp.Rev. A.2 - Sep., 2008

APM2050ND

www.anpec.com.tw5

VDS - Drain - Source Voltage (V)

I D -

Dra

in C

urre

nt (A

)

Output Characteristics

RD

S(O

N) -

On

- R

esis

tanc

e (m

Ω)

Drain-Source On Resistance

ID - Drain Current (A)

Drain-Source On Resistance

VGS - Gate - Source Voltage (V)

RD

S(O

N) -

On

- R

esis

tanc

e (m

Ω)

Tj - Junction Temperature (°C)

Gate Threshold Voltage

Nor

mal

ized

Thr

esho

ld V

olta

ge

Typical Operating Characteristics (Cont.)

0.0 0.5 1.0 1.5 2.0 2.5 3.00

2

4

6

8

10

12

14

16

18

20

2V

2.5V

VGS

=3,4,5,6,7,8,9,10V

0 4 8 12 16 200

10

20

30

40

50

60

70

80

90

VGS

=2.5V

VGS

=10V

VGS

=4.5V

1 2 3 4 5 6 7 8 9 100

10

20

30

40

50

60

70

80

90

ID=5A

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

IDS

=250µA

Page 7: files.iczoom.com · A N P E C MOSFET TRANSISTORS N-Channel MOSFET TABLE OF CONTENT Pos. Series Drain Source Voltage Continue Drain Current Case Pages V DSS (V) I D (A) 01 APM 2050

Copyright ANPEC Electronics Corp.Rev. A.2 - Sep., 2008

APM2050ND

www.anpec.com.tw6

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

Tj - Junction Temperature (°C) VSD - Source - Drain Voltage (V)

Source-Drain Diode Forward

I S -

Sou

rce

Cur

rent

(A)

VDS - Drain-Source Voltage (V)

C -

Cap

acita

nce

(pF)

Capacitance Gate Charge

QG - Gate Charge (nC)

VG

S -

Gat

e-so

urce

Vol

tage

(V)

-50 -25 0 25 50 75 100 125 1500.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

RON

@Tj=25oC: 25mΩ

VGS

= 10V

IDS

= 5A

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.60.1

1

10

20

Tj=25oC

Tj=150oC

0 2 4 6 8 10 120

1

2

3

4

5

6

7

8

9

10V

DS=10V

ID = 5A

0 4 8 12 16 200

100

200

300

400

500

600

700

Frequency=1MHz

Crss Coss

Ciss

Typical Operating Characteristics (Cont.)

Page 8: files.iczoom.com · A N P E C MOSFET TRANSISTORS N-Channel MOSFET TABLE OF CONTENT Pos. Series Drain Source Voltage Continue Drain Current Case Pages V DSS (V) I D (A) 01 APM 2050

Copyright ANPEC Electronics Corp.Rev. A.2 - Sep., 2008

APM2050ND

www.anpec.com.tw7

Package Information

SOT-89

SYMBO MIN. MAX.

MILLIMETERS

SOT-89

MIN. MAX.

INCHES

A

C

e1

e

BB1

D

D1

H

EL

E1

1.60

0.44

0.35 0.44

4.40 4.60

1.62 1.83

0.56

2.13

A

B

C

D

D1

E

E1

e

e1

B1 0.36 0.48

3.00 BSC

3.94 4.25

2.29 2.60

2.29

0.118 BSC

0.063

0.017

0.014 0.019

0.014 0.017

0.173 0.181

0.064 0.072

0.084

0.155 0.167

0.090 0.102

0.090

0.022

L 0.89 0.035

H

1.50 BSC 0.059 BSC

1.40

1.20 0.047

0.055L

Note : Follow JEDEC TO-243 AA.

Page 9: files.iczoom.com · A N P E C MOSFET TRANSISTORS N-Channel MOSFET TABLE OF CONTENT Pos. Series Drain Source Voltage Continue Drain Current Case Pages V DSS (V) I D (A) 01 APM 2050

Copyright ANPEC Electronics Corp.Rev. A.2 - Sep., 2008

APM2050ND

www.anpec.com.tw8

Application A H T1 C d D W E1 F

178.0±2.00 50 MIN. 12.4+2.00-0.00

13.0+0.50 -0.20

1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.50±0.05

P0 P1 P2 D0 D1 T A0 B0 K0 SOT-89

4.0±0.10 8.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00

-0.404.80±0.20 4.50±0.20 1.80±0.20

(mm)

Package Type Unit Quantity SOT-89 Type & Reel 1000

Devices Per Unit

Carrier Tape & Reel Dimensions

H

T1

A

d

A

E1

AB

W

F

T

P0OD0

BA0

P2

K0

B0

SECTION B-B

SECTION A-A

OD1

P1

Page 10: files.iczoom.com · A N P E C MOSFET TRANSISTORS N-Channel MOSFET TABLE OF CONTENT Pos. Series Drain Source Voltage Continue Drain Current Case Pages V DSS (V) I D (A) 01 APM 2050

Copyright ANPEC Electronics Corp.Rev. A.2 - Sep., 2008

APM2050ND

www.anpec.com.tw9

Reflow Condition (IR/Convection or VPR Reflow)

Reliability Test Program

t 25 C to Peak

tp

Ramp-up

tL

Ramp-downts

Preheat

Tsmax

Tsmin

TL

TP

25

Tem

per

atu

re

Time

Critical ZoneTL to TP

°

Taping Direction Information

Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles ESD MIL-STD-883D-3015.7 VHBM > 2KV, VMM > 200V Latch-Up JESD 78 10ms, 1tr > 100mA

SOT-89

USER DIRECTION OF FEED

Page 11: files.iczoom.com · A N P E C MOSFET TRANSISTORS N-Channel MOSFET TABLE OF CONTENT Pos. Series Drain Source Voltage Continue Drain Current Case Pages V DSS (V) I D (A) 01 APM 2050

Copyright ANPEC Electronics Corp.Rev. A.2 - Sep., 2008

APM2050ND

www.anpec.com.tw10

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.

Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)

100°C 150°C

60-120 seconds

150°C 200°C

60-180 seconds

Time maintained above: - Temperature (TL) - Time (tL)

183°C 60-150 seconds

217°C 60-150 seconds

Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)

10-30 seconds 20-40 seconds

Ramp-down Rate 6°C/second max. 6°C/second max.

Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.

Table 2. Pb-free Process – Package Classification Reflow Temperatures Package Thickness Volume mm3

<350 Volume mm3

350-2000 Volume mm3

>2000 <1.6 mm 260 +0°C* 260 +0°C* 260 +0°C*

1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C* ≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C*

*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.

Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures Package Thickness Volume mm3

<350 Volume mm3

≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C

Customer Service

Anpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838

Fax : 886-2-2917-3838

Classification Reflow Profiles

Page 12: files.iczoom.com · A N P E C MOSFET TRANSISTORS N-Channel MOSFET TABLE OF CONTENT Pos. Series Drain Source Voltage Continue Drain Current Case Pages V DSS (V) I D (A) 01 APM 2050

N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008

APM3040ND

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, andadvise customers to obtain the latest version of relevant information to verify before placing orders.

Pin Description

Ordering and Marking Information

Features

Applications

• Switching Regulators

• Switching Converters

• 30V/3A,

RDS(ON)=31mΩ(typ.) @ VGS=10V RDS(ON)=35mΩ(typ.) @ VGS=4.5V RDS(ON)=55mΩ(typ.) @ VGS=2.5V

• Super High Dense Cell Design

• Reliable and Rugged

• Lead Free and Green Devices Available (RoHS Compliant)

N-Channel MOSFET

Top View of SOT-89

GD

S

G

S

D

(3)

(2)

(1)

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).

APM3040N

Handling CodeTemperature RangePackage Code

Package Code D : SOT-89Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material G : Halogen and Lead Free Device

APM3040N D: APM3040XXXXX_N

XXXXX - Date Code

Assembly Material

Page 13: files.iczoom.com · A N P E C MOSFET TRANSISTORS N-Channel MOSFET TABLE OF CONTENT Pos. Series Drain Source Voltage Continue Drain Current Case Pages V DSS (V) I D (A) 01 APM 2050

Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008

APM3040ND

www.anpec.com.tw2

Absolute Maximum Ratings (TA = 25°C unless otherwise noted)

Electrical Characteristics (TA = 25°C unless otherwise noted)

Symbol Parameter Rating Unit

VDSS Drain-Source Voltage 30

VGSS Gate-Source Voltage ±12 V

ID* Continuous Drain Current 3

IDM* 300µs Pulsed Drain Current VGS=10V

12 A

IS* Diode Continuous Forward Current 1 A

TJ Maximum Junction Temperature 150

TSTG Storage Temperature Range -55 to 150 °C

TA=25°C 1.47 PD* Power Dissipation for Single Operation

TA=100°C 0.58 W

RθJA* Thermal Resistance-Junction to Ambient 85 °C/W

Note:*Surface Mounted on 1in2 pad area, t ≤ 10sec.

APM3040ND Symbol Parameter Test Conditions

Min. Typ. Max. Unit

STATIC CHARACTERISTICS

BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 30 - - V

VDS=24V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current

TJ=85°C - - 30 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 0.6 0.75 1.5 V

IGSS Gate Leakage Current VGS=±12V, VDS=0V - - ±100 nA

VGS=10V, IDS=3A - 31 40

VGS=4.5V, IDS=1.5A - 35 50 RDS(ON) a Drain-Source On-State Resistance

VGS=2.5V, IDS=0.5A - 55 70

VSDa Diode Forward Voltage ISD=0.5A , VGS=0V - 0.7 1.3 V

GATE CHARGE CHARACTERISTICS b

Qg Total Gate Charge - 18 23

Qgs Gate-Source Charge - 2.5 -

Qgd Gate-Drain Charge

VDS=15V, VGS=10V, IDS=3A

- 2 -

nC

Page 14: files.iczoom.com · A N P E C MOSFET TRANSISTORS N-Channel MOSFET TABLE OF CONTENT Pos. Series Drain Source Voltage Continue Drain Current Case Pages V DSS (V) I D (A) 01 APM 2050

Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008

APM3040ND

www.anpec.com.tw3

Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)

APM3040ND Symbol Parameter Test Conditions

Min. Typ. Max. Unit

DYNAMIC CHARACTERISTICS b

RG Gate Resistance VGS=0, VDS=0, F=1MHz - 1.5 - Ω

Ciss Input Capacitance - 430 -

Coss Output Capacitance - 80 -

Crss Reverse Transfer Capacitance

VGS=0V, VDS=25V, Frequency=1.0MHz - 40 -

pF

td(ON) Turn-on Delay Time - 11 21

Tr Turn-on Rise Time - 17 32

td(OFF) Turn-off Delay Time - 37 68

Tf Turn-off Fall Time

VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω

- 20 38

ns

Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.

Page 15: files.iczoom.com · A N P E C MOSFET TRANSISTORS N-Channel MOSFET TABLE OF CONTENT Pos. Series Drain Source Voltage Continue Drain Current Case Pages V DSS (V) I D (A) 01 APM 2050

Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008

APM3040ND

www.anpec.com.tw4

1E-4 1E-3 0.01 0.1 1 10 1001E-3

0.01

0.1

1

2

Mounted on 1in2 padR

θJA : 85 oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

Typical Operating Characteristics

Power Dissipation

Pto

t - P

ower

(W)

Tj - Junction Temperature (°C)

Drain Current

Tj - Junction Temperature

ID -

Dra

in C

urre

nt (A

)

Thermal Transient Impedance

Nor

mal

ized

Tra

nsie

nt T

herm

al R

esis

tanc

e

Square Wave Pulse Duration (sec)

Safe Operation Area

VDS - Drain - Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

0 20 40 60 80 100 120 140 1600.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

TA=25oC

0 20 40 60 80 100 120 140 160 1800.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

TA=25oC,V

G=10V

0.01 0.1 1 10 1000.01

0.1

1

10

30

Rds(o

n) Li

mit

1s

TA=25oC

10ms

300µs

1ms

100ms

DC

Page 16: files.iczoom.com · A N P E C MOSFET TRANSISTORS N-Channel MOSFET TABLE OF CONTENT Pos. Series Drain Source Voltage Continue Drain Current Case Pages V DSS (V) I D (A) 01 APM 2050

Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008

APM3040ND

www.anpec.com.tw5

VDS - Drain - Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Output Characteristics

RD

S(O

N) - O

n - R

esis

tanc

e (m

Ω)

Drain-Source On Resistance

ID - Drain Current (A)

Transfer Characteristics

VGS - Gate - Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Tj - Junction Temperature (°C)

Gate Threshold Voltage

Nor

mal

ized

Thr

esho

ld V

olta

ge

Typical Operating Characteristics (Cont.)

0 2 4 6 8 100

2

4

6

8

10

12

2V

1.5V

VGS

= 3,4,5,6,7,8,9,10V

0 2 4 6 8 10 120

15

30

45

60

75

90

VGS

=10V

VGS

=2.5V

VGS

=4.5V

0.0 0.5 1.0 1.5 2.0 2.5 3.000

2

4

6

8

10

12

Tj=125oC

Tj=25oC T

j=-55oC

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

IDS

=250µA

Page 17: files.iczoom.com · A N P E C MOSFET TRANSISTORS N-Channel MOSFET TABLE OF CONTENT Pos. Series Drain Source Voltage Continue Drain Current Case Pages V DSS (V) I D (A) 01 APM 2050

Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008

APM3040ND

www.anpec.com.tw6

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

Tj - Junction Temperature (°C) VSD - Source - Drain Voltage (V)

Source-Drain Diode Forward

IS -

Sou

rce

Cur

rent

(A)

VDS - Drain-Source Voltage (V)

C -

Cap

acita

nce

(pF)

Capacitance Gate Charge

QG - Gate Charge (nC)

VG

S -

Gat

e-so

urce

Vol

tage

(V)

Typical Operating Characteristics (Cont.)

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

RON

@Tj=25oC: 31mΩ

VGS

= 10V

IDS

= 3A

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.40.1

1

10

Tj=150oC

Tj=25oC

0 5 10 15 20 25 300

100

200

300

400

500

600Frequency=1MHz

CrssCoss

Ciss

0 4 8 12 16 200

2

4

6

8

10V

DS=15V

IDS

= 3A

Page 18: files.iczoom.com · A N P E C MOSFET TRANSISTORS N-Channel MOSFET TABLE OF CONTENT Pos. Series Drain Source Voltage Continue Drain Current Case Pages V DSS (V) I D (A) 01 APM 2050

Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008

APM3040ND

www.anpec.com.tw7

SOT-89

Package Information

SYMBO MIN. MAX.

MILLIMETERS

SOT-89

MIN. MAX.

INCHES

A

C

e1

e

BB1

D

D1

H

EL

E1

1.60

0.44

0.35 0.44

4.40 4.60

1.62 1.83

0.56

2.13

A

B

C

D

D1

E

E1

e

e1

B1 0.36 0.48

3.00 BSC

3.94 4.25

2.29 2.60

2.29

0.118 BSC

0.063

0.017

0.014 0.019

0.014 0.017

0.173 0.181

0.064 0.072

0.084

0.155 0.167

0.090 0.102

0.090

0.022

L 0.89 0.035

H

1.50 BSC 0.059 BSC

1.40

1.20 0.047

0.055L

Note : Follow JEDEC TO-243 AA.

Page 19: files.iczoom.com · A N P E C MOSFET TRANSISTORS N-Channel MOSFET TABLE OF CONTENT Pos. Series Drain Source Voltage Continue Drain Current Case Pages V DSS (V) I D (A) 01 APM 2050

Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008

APM3040ND

www.anpec.com.tw8

Application A H T1 C d D W E1 F

178.0±2.00 50 MIN. 12.4+2.00 -0.00

13.0+0.50 -0.20

1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.50±0.05

P0 P1 P2 D0 D1 T A0 B0 K0 SOT-89

4.0±0.10 8.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00

-0.40 4.80±0.20 4.50±0.20 1.80±0.20

(mm)

Carrier Tape & Reel Dimensions

H

T1

A

d

A

E1

AB

W

F

T

P0OD0

BA0

P2

K0

B0

SECTION B-B

SECTION A-A

OD1

P1

Devices Per Unit

Package Type Unit Quantity

SOT-89 Tape & Reel 1000

Page 20: files.iczoom.com · A N P E C MOSFET TRANSISTORS N-Channel MOSFET TABLE OF CONTENT Pos. Series Drain Source Voltage Continue Drain Current Case Pages V DSS (V) I D (A) 01 APM 2050

Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008

APM3040ND

www.anpec.com.tw9

Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles

Reflow Condition (IR/Convection or VPR Reflow)

Reliability Test Program

t 25 C to Peak

tp

Ramp-up

tL

Ramp-downts

Preheat

Tsmax

Tsmin

TL

TP

25

Tem

per

atur

e

Time

Critical ZoneTL to TP

°

Taping Direction InformationSOT-89

USER DIRECTION OF FEED

Page 21: files.iczoom.com · A N P E C MOSFET TRANSISTORS N-Channel MOSFET TABLE OF CONTENT Pos. Series Drain Source Voltage Continue Drain Current Case Pages V DSS (V) I D (A) 01 APM 2050

Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008

APM3040ND

www.anpec.com.tw10

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.

Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)

100°C 150°C

60-120 seconds

150°C 200°C

60-180 seconds

Time maintained above: - Temperature (TL) - Time (tL)

183°C 60-150 seconds

217°C 60-150 seconds

Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)

10-30 seconds 20-40 seconds

Ramp-down Rate 6°C/second max. 6°C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.

Table 2. Pb-free Process – Package Classification Reflow Temperatures

Package Thickness Volume mm3 <350

Volume mm3 350-2000

Volume mm3 >2000

<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*

≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.

Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures

Package Thickness Volume mm3

<350 Volume mm3

≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C

Customer ServiceAnpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838Fax : 886-2-2917-3838

Classification Reflow Profiles

Page 22: files.iczoom.com · A N P E C MOSFET TRANSISTORS N-Channel MOSFET TABLE OF CONTENT Pos. Series Drain Source Voltage Continue Drain Current Case Pages V DSS (V) I D (A) 01 APM 2050

N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. B.4 - Dec., 2008

APM3054ND

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, andadvise customers to obtain the latest version of relevant information to verify before placing orders.

Pin Description

Ordering and Marking Information

Features

Applications

• Switching Regulators

• Switching Converters

• 30V/4A,

RDS(ON)=48mΩ(typ.) @ VGS=10V RDS(ON)=75mΩ(typ.) @ VGS=4.5V

• Super High Dense Cell Design

• Reliable and Rugged

• Lead Free and Green Devices Available (RoHS Compliant)

N-Channel MOSFET

Top View of SOT-89

GD

S

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).

G

S

D

(3)

(2)

(1)

APM3054N

Handling CodeTemperature RangePackage Code

Package Code D : SOT-89Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material G : Halogen and Lead Free Device

APM3054N D: APM3054XXXXX

XXXXX - Date Code

Assembly Material

Page 23: files.iczoom.com · A N P E C MOSFET TRANSISTORS N-Channel MOSFET TABLE OF CONTENT Pos. Series Drain Source Voltage Continue Drain Current Case Pages V DSS (V) I D (A) 01 APM 2050

Copyright ANPEC Electronics Corp.Rev. B.4 - Dec., 2008

APM3054ND

www.anpec.com.tw2

Absolute Maximum Ratings (TA = 25°C unless otherwise noted)

Electrical Characteristics (TA = 25°C unless otherwise noted)

Symbol Parameter Rating Unit

VDSS Drain-Source Voltage 30

VGSS Gate-Source Voltage ±20 V

ID* Continuous Drain Current 4

IDM* Pulsed Drain Current VGS=10V

16 A

IS* Diode Continuous Forward Current 1 A

TJ Maximum Junction Temperature 150

TSTG Storage Temperature Range -55 to 150 °C

TA=25°C 1.47 PD* Power Dissipation for Single Operation

TA=100°C 0.58 W

RθJA* Thermal Resistance-Junction to Ambient 85 °C/W

Note : *Surface Mounted on 1in2 pad area, t ≤ 10sec.

APM3054ND Symbol Parameter Test Conditions

Min. Typ. Max. Unit

Static Characteristics

BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 30 - - V

VDS=24V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current

TJ=85°C - - 30 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1 1.5 2 V

IGSS Gate Leakage Current VGS=±20V, VDS=0V - - ±100 nA

VGS=10V, IDS=4A - 48 54 RDS(ON)

a Drain-Source On-state Resistance VGS=4.5V, IDS=3A - 75 90

VSDa Diode Forward Voltage ISD=1A, VGS=0V - 0.75 1.3 V

Gate Charge Characteristics b

Qg Total Gate Charge - 17.6 24

Qgs Gate-Source Charge - 5.2 -

Qgd Gate-Drain Charge

VDS=15V, VGS=10V, IDS=4A

- 2.8 -

nC

Page 24: files.iczoom.com · A N P E C MOSFET TRANSISTORS N-Channel MOSFET TABLE OF CONTENT Pos. Series Drain Source Voltage Continue Drain Current Case Pages V DSS (V) I D (A) 01 APM 2050

Copyright ANPEC Electronics Corp.Rev. B.4 - Dec., 2008

APM3054ND

www.anpec.com.tw3

APM3054ND Symbol Parameter Test Conditions

Min. Typ. Max. Unit

Dynamic Characteristics b

RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 2.3 - Ω

Ciss Input Capacitance - 400 -

Coss Output Capacitance - 80 -

Crss Reverse Transfer Capacitance

VGS=0V, VDS=25V, Frequency=1.0MHz - 45 -

pF

td(ON) Turn-on Delay Time - 6 9

Tr Turn-on Rise Time - 14 24

td(OFF) Turn-off Delay Time - 18 26

Tf Turn-off Fall Time

VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω

- 4 6

ns

Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.

Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)

Page 25: files.iczoom.com · A N P E C MOSFET TRANSISTORS N-Channel MOSFET TABLE OF CONTENT Pos. Series Drain Source Voltage Continue Drain Current Case Pages V DSS (V) I D (A) 01 APM 2050

Copyright ANPEC Electronics Corp.Rev. B.4 - Dec., 2008

APM3054ND

www.anpec.com.tw4

1E-4 1E-3 0.01 0.1 1 10 1001E-3

0.01

0.1

1

2

Mounted on 1in2 padR

θJA : 85 oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

Typical Operating Characteristics

Power Dissipation

Pto

t - P

ower

(W)

Tj - Junction Temperature (°C)

Drain Current

Tj - Junction Temperature

ID -

Dra

in C

urre

nt (A

)

Thermal Transient Impedance

Nor

mal

ized

Tra

nsie

nt T

herm

al R

esis

tanc

e

Square Wave Pulse Duration (sec)

Safe Operation Area

VDS - Drain - Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

0 20 40 60 80 100 120 140 1600.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

TA=25oC

0 20 40 60 80 100 120 140 1600.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

TA=25oC,V

G=10V

0.01 0.1 1 10 1000.01

0.1

1

10

50

1ms

TA=25oC

Rds(o

n) Li

mit

1s

10ms

300µs

100ms

DC

Page 26: files.iczoom.com · A N P E C MOSFET TRANSISTORS N-Channel MOSFET TABLE OF CONTENT Pos. Series Drain Source Voltage Continue Drain Current Case Pages V DSS (V) I D (A) 01 APM 2050

Copyright ANPEC Electronics Corp.Rev. B.4 - Dec., 2008

APM3054ND

www.anpec.com.tw5

VDS - Drain - Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Output Characteristics

RD

S(O

N) - O

n - R

esis

tanc

e (m

Ω)

Drain-Source On Resistance

ID - Drain Current (A)

Transfer Characteristics

VGS - Gate - Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Tj - Junction Temperature (°C)

Gate Threshold Voltage

Nor

mal

ized

Thr

esho

ld V

olta

ge

Typical Operating Characteristics (Cont.)

0 1 2 3 4 50

2

4

6

8

10

12

14

16

3V

4V

5V

VGS

= 6, 7, 8, 9, 10V

0 1 2 3 4 5 6 7 80

2

4

6

8

10

12

14

16

Tj=125oC

Tj=25oC

Tj=-55oC

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4IDS

=250µA

0 2 4 6 8 10 12 14 1610

20

30

40

50

60

70

80

90

100

110

120

VGS

=10V

VGS

=4.5V

Page 27: files.iczoom.com · A N P E C MOSFET TRANSISTORS N-Channel MOSFET TABLE OF CONTENT Pos. Series Drain Source Voltage Continue Drain Current Case Pages V DSS (V) I D (A) 01 APM 2050

Copyright ANPEC Electronics Corp.Rev. B.4 - Dec., 2008

APM3054ND

www.anpec.com.tw6

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

Tj - Junction Temperature (°C) VSD - Source - Drain Voltage (V)

Source-Drain Diode Forward

IS -

Sou

rce

Cur

rent

(A)

VDS - Drain-Source Voltage (V)

C -

Cap

acita

nce

(pF)

Capacitance Gate Charge

QG - Gate Charge (nC)

VG

S -

Gat

e-so

urce

Vol

tage

(V)

Typical Operating Characteristics (Cont.)

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

RON

@Tj=25oC: 48mΩ

VGS

= 10V

IDS

= 4A

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.61

10

20

Tj=25oC

Tj=150oC

0 5 10 15 20 25 300

100

200

300

400

500

600

Frequency=1MHz

Ciss

Coss

Crss

0 2 4 6 8 10 12 14 16 180

1

2

3

4

5

6

7

8

9

10V

DS=15V

ID = 4A

Page 28: files.iczoom.com · A N P E C MOSFET TRANSISTORS N-Channel MOSFET TABLE OF CONTENT Pos. Series Drain Source Voltage Continue Drain Current Case Pages V DSS (V) I D (A) 01 APM 2050

Copyright ANPEC Electronics Corp.Rev. B.4 - Dec., 2008

APM3054ND

www.anpec.com.tw7

SOT-89

Package Information

SYMBO MIN. MAX.

MILLIMETERS

SOT-89

MIN. MAX.

INCHES

A

C

e1

e

BB1

D

D1

H

EL

E1

1.60

0.44

0.35 0.44

4.40 4.60

1.62 1.83

0.56

2.13

A

B

C

D

D1

E

E1

e

e1

B1 0.36 0.48

3.00 BSC

3.94 4.25

2.29 2.60

2.29

0.118 BSC

0.063

0.017

0.014 0.019

0.014 0.017

0.173 0.181

0.064 0.072

0.084

0.155 0.167

0.090 0.102

0.090

0.022

L 0.89 0.035

H

1.50 BSC 0.059 BSC

1.40

1.20 0.047

0.055L

Note : Follow JEDEC TO-243 AA.

Page 29: files.iczoom.com · A N P E C MOSFET TRANSISTORS N-Channel MOSFET TABLE OF CONTENT Pos. Series Drain Source Voltage Continue Drain Current Case Pages V DSS (V) I D (A) 01 APM 2050

Copyright ANPEC Electronics Corp.Rev. B.4 - Dec., 2008

APM3054ND

www.anpec.com.tw8

Application A H T1 C d D W E1 F

178.0±2.00 50 MIN. 12.4+2.00 -0.00

13.0+0.50 -0.20

1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.50±0.05

P0 P1 P2 D0 D1 T A0 B0 K0 SOT-89

4.0±0.10 8.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00

-0.40 4.80±0.20 4.50±0.20 1.80±0.20

(mm)

Carrier Tape & Reel Dimensions

H

T1

A

d

A

E1

AB

W

F

T

P0OD0

BA0

P2

K0

B0

SECTION B-B

SECTION A-A

OD1

P1

Devices Per Unit

Package Type Unit Quantity

SOT-89 Tape & Reel 1000

Page 30: files.iczoom.com · A N P E C MOSFET TRANSISTORS N-Channel MOSFET TABLE OF CONTENT Pos. Series Drain Source Voltage Continue Drain Current Case Pages V DSS (V) I D (A) 01 APM 2050

Copyright ANPEC Electronics Corp.Rev. B.4 - Dec., 2008

APM3054ND

www.anpec.com.tw9

Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles

Reflow Condition (IR/Convection or VPR Reflow)

Reliability Test Program

t 25 C to Peak

tp

Ramp-up

tL

Ramp-downts

Preheat

Tsmax

Tsmin

TL

TP

25

Tem

per

atur

e

Time

Critical ZoneTL to TP

°

Taping Direction InformationSOT-89

USER DIRECTION OF FEED

Page 31: files.iczoom.com · A N P E C MOSFET TRANSISTORS N-Channel MOSFET TABLE OF CONTENT Pos. Series Drain Source Voltage Continue Drain Current Case Pages V DSS (V) I D (A) 01 APM 2050

Copyright ANPEC Electronics Corp.Rev. B.4 - Dec., 2008

APM3054ND

www.anpec.com.tw10

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.

Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)

100°C 150°C

60-120 seconds

150°C 200°C

60-180 seconds

Time maintained above: - Temperature (TL) - Time (tL)

183°C 60-150 seconds

217°C 60-150 seconds

Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)

10-30 seconds 20-40 seconds

Ramp-down Rate 6°C/second max. 6°C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.

Table 2. Pb-free Process – Package Classification Reflow Temperatures

Package Thickness Volume mm3 <350

Volume mm3 350-2000

Volume mm3 >2000

<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*

≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.

Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures

Package Thickness Volume mm3

<350 Volume mm3

≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C

Customer ServiceAnpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838Fax : 886-2-2917-3838

Classification Reflow Profiles

Page 32: files.iczoom.com · A N P E C MOSFET TRANSISTORS N-Channel MOSFET TABLE OF CONTENT Pos. Series Drain Source Voltage Continue Drain Current Case Pages V DSS (V) I D (A) 01 APM 2050

N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.

APM2054NV

Pin Description

Ordering and Marking Information

Features

Applications

• 20V/5A,RDS(ON)= 35mΩ (Typ.) @ VGS= 10VRDS(ON)= 45mΩ (Typ.) @ VGS= 4.5V

RDS(ON)= 110mΩ (Typ.) @ VGS= 2.5V• Super High Dense Cell Design• Reliable and Rugged• Lead Free and Green Devices Available

(RoHS Compliant)

• Switching Regulators

• Switching Converters

Top View of SOT-223

N-Channel MOSFET

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).

G

S

D

(3)

(2)

(1)

GD

S

APM2054N

Handling CodeTemperature RangePackage Code

Package Code V : SOT-223Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material G : Halogen and Lead Free Device

APM2054N V : APM2054NXXXXX

XXXXX - Date Code

Assembly Material

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Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008

www.anpec.com.tw2

APM2054NV

Symbol Parameter Rating Unit

VDSS Drain-Source Voltage 20

VGSS Gate-Source Voltage ±16 V

ID* Continuous Drain Current 5

IDM* Pulsed Drain Current VGS=10V

20 A

IS* Diode Continuous Forward Current 3 A

TJ Maximum Junction Temperature 150

TSTG Storage Temperature Range -55 to 150 °C

TA=25°C 1.47 PD* Power Dissipation for Single Operation

TA=100°C 0.58 W

RθJA* Thermal Resistance-Junction to Ambient 85 °C/W

Note : *Surface Mounted on 1in2 pad area, t ≤ 10sec.

Electrical Characteristics (TA = 25°C unless otherwise noted)

Absolute Maximum Ratings (TA = 25°C unless otherwise noted)

APM2054NV Symbol Parameter Test Conditions

Min. Typ. Max. Unit

STATIC CHARACTERISTICS

BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 20 - - V

VDS=16V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current

TJ=85°C - - 30 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 0.6 0.9 1.5 V

IGSS Gate Leakage Current VGS=±16V, VDS=0V - - ±100 nA

VGS=10V, IDS=5A - 35 40

VGS=4.5V, IDS=3.5A - 45 54 RDS(ON) a Drain-Source On-state Resistance

VGS=2.5V, IDS=2.5A - 110 130

VSDa Diode Forward Voltage ISD=3A, VGS=0V - 0.85 1.3 V

GATE CHARGE CHARACTERISTICS b

Qg Total Gate Charge - 11 13

Qgs Gate-Source Charge - 3.8 -

Qgd Gate-Drain Charge

VDS=10V, VGS=4.5V, IDS=6A

- 5.2 -

nC

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Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008

www.anpec.com.tw3

APM2054NV

APM2054NV Symbol Parameter Test Conditions

Min. Typ. Max. Unit

DYNAMIC CHARACTERISTICS b

td(ON) Turn-On Delay Time - 7 10

Tr Turn-On Rise Time - 15 25

td(OFF) Turn-Off Delay Time - 19 26

Tf Turn-Off Fall Time

VDD=10V, RL=10Ω, IDS=1A, VGEN=4.5V, RG=6Ω

- 6 7

ns

RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 2.5 - Ω

Ciss Input Capacitance - 450 -

Coss Output Capacitance - 100 -

Crss Reverse Transfer Capacitance

VGS=0V, VDS=20V, Frequency=1.0MHz - 60 -

pF

Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.

Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)

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Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008

www.anpec.com.tw4

APM2054NV

Typical Operating Characteristics

Power Dissipation

Pto

t - P

ower

(W)

Tj - Junction Temperature (°C)

ID -

Dra

in C

urre

nt (A

)

Drain Current

Tj - Junction Temperature (°C)

Safe Operation Area

VDS - Drain - Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Nor

mal

ized

Tra

nsie

nt T

herm

al R

esis

tanc

e

Thermal Transient Impedance

Square Wave Pulse Duration (sec)

0 20 40 60 80 100 120 140 1600.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

TA=25oC

0 20 40 60 80 100 120 140 1600

1

2

3

4

5

6

TA=25oC,V

G=10V

0.1 1 10 600.01

0.1

1

10

100

100ms

Rds(on

) Limit

300µs

TA=25oC

1s

1ms

10ms

DC

1E-4 1E-3 0.01 0.1 1 10 1001E-3

0.01

0.1

1

2

Mounted on 1in2 padR

θJA :85 oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

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Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008

www.anpec.com.tw5

APM2054NV

VDS - Drain - Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Output Characteristics

RD

S(O

N) - O

n - R

esis

tanc

e (m

Ω)

Drain-Source On Resistance

ID - Drain Current (A)

Transfer Characteristics

VGS - Gate - Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Tj - Junction Temperature (°C)

Gate Threshold Voltage

Nor

mal

ized

Thr

esho

ld V

olta

ge

0 2 4 6 8 100

2

4

6

8

10

12

14

16

18

20

2V

3V

VGS

= 4, 5, 6, 7, 8, 9, 10V

0 4 8 12 16 200

20

40

60

80

100

120

140

160

VGS

=10V

VGS

=4.5V

VGS

=2.5V

0 1 2 3 4 50

2

4

6

8

10

12

14

16

18

20

Tj=125oC

Tj=25oC

Tj=-55oC

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

IDS

=250µA

Typical Operating Characteristics (Cont.)

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Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008

www.anpec.com.tw6

APM2054NV

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

Tj - Junction Temperature (°C) VSD - Source - Drain Voltage (V)

Source-Drain Diode Forward

IS -

Sou

rce

Cur

rent

(A)

VDS - Drain - Source Voltage (V)

C -

Cap

acita

nce

(pF)

Capacitance Gate Charge

QG - Gate Charge (nC)

VG

S -

Gat

e-so

urce

Vol

tage

(V)

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

2.2

2.4

RON

@Tj=25oC: 35mΩ

VGS

= 10V

IDS

= 5A

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.41

10

20

Tj=25oC

Tj=150oC

0 4 8 12 16 200

100

200

300

400

500

600

700

Frequency=1MHz

Crss

Coss

Ciss

0 4 8 12 16 20 240

1

2

3

4

5

6

7

8

9

10V

DS=10V

ID = 5A

Typical Operating Characteristics (Cont.)

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Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008

www.anpec.com.tw7

APM2054NV

Package Information

SOT-223

AA2

VIEW A

0.25L

GAUGE PLANESEATING PLANE

A1

D

E

e1

e

b2

E1

SEEVIEW A

c

0

SYMBOL MIN. MAX.

1.80

0.02

0.66 0.84

2.90 3.10

0.23 0.33

0.10

6.70

A

A1

b

b2

c

D

E

E1

e

MILLIMETERS

A2 1.50 1.70

2.30 BSC

SOT-223

3.30 3.70

6.30 6.70

7.30

0.091 BSC

MIN. MAX.

INCHES

0.071

0.001

0.059 0.067

0.026 0.033

0.114 0.122

0.009 0.013

0.264

0.130 0.146

0.248 0.264

0.287

0.004

0

L 0.75 0.030

e1 4.60 BSC 0.181 BSC

°10°0 °10°0

Note : 1. Follow from JEDEC TO-261 AA. 2. Dimension D and E1 are determined at the outermost extremes of the plastic exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but including any mismatch between the top and bottom of the plastic body.

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Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008

www.anpec.com.tw8

APM2054NV

Application A H T1 C d D W E1 F

320.0±2.00 50 MIN. 12.4+2.00 -0.00

13.0+0.50 -0.20

1.5 MIN. 20.2 MIN. 12.00±0.30 1.75±0.10 5.50±0.05

P0 P1 P2 D0 D1 T A0 B0 K0 SOT-223

4.00±0.10 8.00±0.10 2.00±0.50 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00

-0.40 6.90±0.20 7.50±0.20 2.10±0.20

(mm)

Carrier Tape & Reel Dimensions

H

T1

A

d

A

E1

AB

W

F

T

P0OD0

BA0

P2

K0

B0

SECTION B-B

SECTION A-A

OD1

P1

Devices Per Unit

Package Type Unit Quantity

SOT-223 Tape & Reel 2500

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Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008

www.anpec.com.tw9

APM2054NV

Reflow Condition (IR/Convection or VPR Reflow)

Reliability Test Program

t 25 C to Peak

tp

Ramp-up

tL

Ramp-downts

Preheat

Tsmax

Tsmin

TL

TP

25

Tem

per

atu

re

Time

Critical ZoneTL to TP

°

Taping Direction Information

Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles

SOT-223

USER DIRECTION OF FEED

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Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008

www.anpec.com.tw10

APM2054NV

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.

Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)

100°C 150°C

60-120 seconds

150°C 200°C

60-180 seconds

Time maintained above: - Temperature (TL) - Time (tL)

183°C 60-150 seconds

217°C 60-150 seconds

Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)

10-30 seconds 20-40 seconds

Ramp-down Rate 6°C/second max. 6°C/second max.

Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.

Table 2. Pb-free Process – Package Classification Reflow Temperatures

Package Thickness Volume mm3 <350

Volume mm3 350-2000

Volume mm3 >2000

<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*

≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.

Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures

Package Thickness Volume mm3

<350 Volume mm3

≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C

Customer Service

Anpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838

Fax : 886-2-2917-3838

Classification Reflow Profiles

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N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008

APM3054NV

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.

Pin Description

Ordering and Marking Information

Features

Applications

• Switching Regulators

• Switching Converters

• 30V/4A,

RDS(ON)=48mΩ(typ.) @ VGS=10V RDS(ON)=75mΩ(typ.) @ VGS=4.5V

• Super High Dense Cell Design

• Reliable and Rugged

• Lead Free and Green Devices Available(RoHS Compliant)

N-Channel MOSFET

Top View of SOT-223

GD

S

G

S

D

(3)

(2)

(1)

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).

APM3054N

Handling CodeTemperature RangePackage Code

Package Code V : SOT-223Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material G : Halogen and Lead Free Device

APM3054N V: APM3054NXXXXX XXXXX - Date Code

Assembly Material

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Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008

APM3054NV

www.anpec.com.tw2

Absolute Maximum Ratings (TA = 25°C unless otherwise noted)

Electrical Characteristics (TA = 25°C unless otherwise noted)

Symbol Parameter Rating Unit

VDSS Drain-Source Voltage 30

VGSS Gate-Source Voltage ±20 V

ID* Continuous Drain Current 4

IDM* Pulsed Drain Current VGS=10V

16 A

IS* Diode Continuous Forward Current 2.2 A

TJ Maximum Junction Temperature 150

TSTG Storage Temperature Range -55 to 150 °C

TA=25°C 1.47 PD* Power Dissipation for Single Operation

TA=100°C 0.58 W

RθJA* Thermal Resistance-Junction to Ambient 85 °C/W

Note : *Surface Mounted on 1in2 pad area, t ≤ 10sec.

APM3054NV Symbol Parameter Test Conditions

Min. Typ. Max. Unit

Static Characteristics

BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 30 - - V

VDS=24V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current

TJ=85°C - - 30 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1 1.5 2 V

IGSS Gate Leakage Current VGS=±20V, VDS=0V - - ±100 nA

VGS=10V, IDS=4A - 48 54 RDS(ON)

a Drain-Source On-state Resistance VGS=4.5V, IDS=3A - 75 90

VSDa Diode Forward Voltage ISD=2.2A, VGS=0V - 0.75 1.3 V

Gate Charge Characteristics b

Qg Total Gate Charge - 17.6 24

Qgs Gate-Source Charge - 5.2 -

Qgd Gate-Drain Charge

VDS=15V, VGS=10V, IDS=4A

- 2.8 -

nC

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Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008

APM3054NV

www.anpec.com.tw3

APM3054NV Symbol Parameter Test Conditions

Min. Typ. Max. Unit

Dynamic Characteristics b

RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 2.3 - Ω

Ciss Input Capacitance - 400 -

Coss Output Capacitance - 80 -

Crss Reverse Transfer Capacitance

VGS=0V, VDS=25V, Frequency=1.0MHz - 45 -

pF

td(ON) Turn-on Delay Time - 6 9

Tr Turn-on Rise Time - 14 24

td(OFF) Turn-off Delay Time - 18 26

Tf Turn-off Fall Time

VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω

- 4 6

ns

Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.

Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)

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Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008

APM3054NV

www.anpec.com.tw4

1E-4 1E-3 0.01 0.1 1 10 1001E-3

0.01

0.1

1

2

Mounted on 1in2 padR

θJA : 85 oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

Typical Opearting Characteristics

Power Dissipation

Pto

t - P

ower

(W)

Tj - Junction Temperature (°C)

Drain Current

Tj - Junction Temperature

ID -

Dra

in C

urre

nt (A

)

Thermal Transient Impedance

Nor

mal

ized

Tra

nsie

nt T

herm

al R

esis

tanc

e

Square Wave Pulse Duration (sec)

Safe Operation Area

VDS - Drain - Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

0 20 40 60 80 100 120 140 1600.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

TA=25oC

0 20 40 60 80 100 120 140 1600.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

TA=25oC,V

G=10V

0.01 0.1 1 10 1000.01

0.1

1

10

50

1ms

TA=25oC

Rds(o

n) Li

mit

1s

10ms

300µs

100ms

DC

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Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008

APM3054NV

www.anpec.com.tw5

VDS - Drain - Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Output Characteristics

RD

S(O

N) - O

n - R

esis

tanc

e (m

Ω)

Drain-Source On Resistance

ID - Drain Current (A)

Transfer Characteristics

VGS - Gate - Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Tj - Junction Temperature (°C)

Gate Threshold Voltage

Nor

mal

ized

Thr

esho

ld V

olta

ge

Typical Opearting Characteristics (Cont.)

0 1 2 3 4 50

2

4

6

8

10

12

14

16

3V

4V

5V

VGS

= 6, 7, 8, 9, 10V

0 1 2 3 4 5 6 7 80

2

4

6

8

10

12

14

16

Tj=125oC

Tj=25oC

Tj=-55oC

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4IDS

=250µA

0 2 4 6 8 10 12 14 1610

20

30

40

50

60

70

80

90

100

110

120

VGS

=10V

VGS

=4.5V

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Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008

APM3054NV

www.anpec.com.tw6

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

Tj - Junction Temperature (°C) VSD - Source - Drain Voltage (V)

Source-Drain Diode Forward

IS -

Sou

rce

Cur

rent

(A)

VDS - Drain-Source Voltage (V)

C -

Cap

acita

nce

(pF)

Capacitance Gate Charge

QG - Gate Charge (nC)

VG

S -

Gat

e-so

urce

Vol

tage

(V)

Typical Opearting Characteristics (Cont.)

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

RON

@Tj=25oC: 48mΩ

VGS

= 10V

IDS

= 4A

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.61

10

20

Tj=25oC

Tj=150oC

0 5 10 15 20 25 300

100

200

300

400

500

600

Frequency=1MHz

Ciss

Coss

Crss

0 2 4 6 8 10 12 14 16 180

1

2

3

4

5

6

7

8

9

10V

DS=15V

ID = 4A

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Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008

APM3054NV

www.anpec.com.tw7

Package Information

SOT-223

AA2

VIEW A

0.25L

GAUGE PLANESEATING PLANE

A1

D

E

e1

e

b2

E1

SEEVIEW A

c

0

SYMBOL MIN. MAX.

1.80

0.02

0.66 0.84

2.90 3.10

0.23 0.33

0.10

6.70

A

A1

b

b2

c

D

E

E1

e

MILLIMETERS

A2 1.50 1.70

2.30 BSC

SOT-223

3.30 3.70

6.30 6.70

7.30

0.091 BSC

MIN. MAX.

INCHES

0.071

0.001

0.059 0.067

0.026 0.033

0.114 0.122

0.009 0.013

0.264

0.130 0.146

0.248 0.264

0.287

0.004

0

L 0.75 0.030

e1 4.60 BSC 0.181 BSC

°10°0 °10°0

Note : 1. Follow from JEDEC TO-261 AA. 2. Dimension D and E1 are determined at the outermost extremes of the plastic exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but including any mismatch between the top and bottom of the plastic body.

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Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008

APM3054NV

www.anpec.com.tw8

Carrier Tape & Reel Dimensions

H

T1

A

d

A

E1

AB

W

F

T

P0OD0

BA0

P2

K0

B0

SECTION B-B

SECTION A-A

OD1

P1

Application A H T1 C d D W E1 F

320.0±2.00 50 MIN. 12.4+2.00 -0.00

13.0+0.50 -0.20

1.5 MIN. 20.2 MIN. 12.00±0.30 1.75±0.10 5.50±0.05

P0 P1 P2 D0 D1 T A0 B0 K0 SOT-223

4.00±0.10 8.00±0.10 2.00±0.50 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00

-0.40 6.90±0.20 7.50±0.20 2.10±0.20

(mm)

Devices Per Unit

Package Type Unit Quantity

SOT-223 Tape & Reel 2500

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Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008

APM3054NV

www.anpec.com.tw9

Taping Direction Information

SOT-223

USER DIRECTION OF FEED

Reflow Condition (IR/Convection or VPR Reflow)

Reliability Test Program

t 25 C to Peak

tp

Ramp-up

tL

Ramp-downts

Preheat

Tsmax

Tsmin

TL

TP

25

Tem

per

atu

re

Time

Critical ZoneTL to TP

°

Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles

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Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008

APM3054NV

www.anpec.com.tw10

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.

Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)

100°C 150°C

60-120 seconds

150°C 200°C

60-180 seconds

Time maintained above: - Temperature (TL) - Time (tL)

183°C 60-150 seconds

217°C 60-150 seconds

Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)

10-30 seconds 20-40 seconds

Ramp-down Rate 6°C/second max. 6°C/second max.

Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.

Table 2. Pb-free Process – Package Classification Reflow Temperatures

Package Thickness Volume mm3 <350

Volume mm3 350-2000

Volume mm3 >2000

<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*

≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.

Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures

Package Thickness Volume mm3

<350 Volume mm3

≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C

Classification Reflow Profiles

Customer Service

Anpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838

Fax : 886-2-2917-3838

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N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. A.4 - Jul., 2008

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, andadvise customers to obtain the latest version of relevant information to verify before placing orders.

APM3055NG

Pin Description

Ordering and Marking Information

Features

Applications

• 30V/12A,

RDS(ON)=75mΩ (typ.) @ VGS=10VRDS(ON)=100mΩ (typ.) @ VGS=4.5V

• Super High Dense Cell Design

• Reliable and Rugged

• Lead Free and Green Devices Available

(RoHS Compliant) Top View of TO-263

N-Channel MOSFET

• Power Management in Desktop Computer or

DC/DC Converters

S

D

G

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).

DG

S

APM3055N

Handling Code

Temperature Range

Package Code

Package Code G : TO-263Operating Junction Temperature Range C : -55 to 150 CHandling Code TR : Tape & ReelAssembly Material L : Lead Free Device G : Halogen and Lead Free Device

APM3055N G: APM3055NXXXXX

XXXXX - Date Code

Assembly Materialo

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Copyright ANPEC Electronics Corp.Rev. A.4 - Jul., 2008

www.anpec.com.tw2

APM3055NG

Absolute Maximum Ratings

Symbol Parameter Rating Unit

Common Ratings (TA=25°C Unless Otherwise Noted)

VDSS Drain-Source Voltage 30

VGSS Gate-Source Voltage ±20 V

TJ Maximum Junction Temperature 150

TSTG Storage Temperature Range -55 to 150 °C

IS Diode Continuous Forward Current TC=25°C 8 A

Mounted on Large Heat Sink TC=25°C 48

IDP 300µs Pulse Drain Current Tested TC=100°C 48

TC=25°C 12* ID Continuous Drain Current

TC=100°C 12

A

TC=25°C 62.5 PD Maximum Power Dissipation

TC=100°C 25 W

RθJC Thermal Resistance-Junction to Case 2 °C/W

Mounted on PCB of 1in2 pad area TA=25°C 16

IDP 300µs Pulse Drain Current Tested TA=100°C 10

TA=25°C 4.3 ID Continuous Drain Current

TA=100°C 3.1

A

TA=25°C 2.8 PD Maximum Power Dissipation

TA=100°C 1.1 W

RθJA Thermal Resistance-Junction to Ambient 45 °C/W

Mounted on PCB of Minimum Footprint TA=25°C 14

IDP 300µs Pulse Drain Current Tested TA=100°C 8

TA=25°C 3.5 ID Continuous Drain Current

TA=100°C 2

A

TA=25°C 2 PD Maximum Power Dissipation

TA=100°C 0.8 W

RθJA Thermal Resistance-Junction to Ambient 62.5 °C/W Notes:

* Current limited by bond wire.

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Copyright ANPEC Electronics Corp.Rev. A.4 - Jul., 2008

www.anpec.com.tw3

APM3055NG

Electrical Characteristics (TA = 25°C unless otherwise noted)

APM3055NG Symbol Parameter Test Conditions

Min. Typ. Max. Unit

Static BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 30 V

VDS=24V, VGS=0V 1 IDSS Zero Gate Voltage Drain Current

TJ=85°C 30 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1 1.5 2 V

IGSS Gate Leakage Current VGS=±20V, VDS=0V ±100 nA

VGS=10V, IDS=12A 75 100 RDS(ON)

a Drain-Source On-state Resistance VGS=4.5V, IDS=6A 100 200

Diode VSD

a Diode Forward Voltage ISD=3A, VGS=0V 0.8 1.3 V

trr Reverse Recovery Time 20 ns

Qrr Reverse Recovery Charge IDS=12A, dlSD/dt=100A/µs

11 nC

Dynamicb RG Gate Resistance VGS=0V,VDS=0V,F=1MHz 2.2 Ω

Ciss Input Capacitance 390

Coss Output Capacitance 65

Crss Reverse Transfer Capacitance

VGS=0V, VDS=15V, Frequency=1.0MHz 35

pF

td(ON) Turn-on Delay Time 3 6

Tr Turn-on Rise Time 10 19

td(OFF) Turn-off Delay Time 15 28

Tf Turn-off Fall Time

VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω

2 5

ns

Gate Chargeb Qg Total Gate Charge 7.7 11

Qgs Gate-Source Charge 1.7

Qgd Gate-Drain Charge

VDS=15V, VGS=10V, IDS=12A

1.1

nC

Notes: a : Pulse test ; pulse width≤300µs, duty cycle≤2%. b : Guaranteed by design, not subject to production testing.

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Copyright ANPEC Electronics Corp.Rev. A.4 - Jul., 2008

www.anpec.com.tw4

APM3055NG

Typical Characteristics

ID -

Dra

in C

urre

nt (A

)

Drain Current

Tj - Junction Temperature (°C)

Safe Operation Area

VDS - Drain - Source Voltage (V)

Thermal Transient Impedance

Square Wave Pulse Duration (sec)

Power Dissipation

Pto

t - P

ower

(W)

Tj - Junction Temperature (°C)

ID -

Dra

in C

urre

nt (A

)

Nor

mal

ized

Tra

nsie

nt T

herm

al R

esis

tanc

e

0 20 40 60 80 100 120 140 160 1800

10

20

30

40

50

60

70

TC=25oC

0 20 40 60 80 100 120 140 1600

2

4

6

8

10

12

14

TC=25oC,V

G=10V

1E-4 1E-3 0.01 0.1 1 10 600.05

0.1

1

2

Mounted on 1in2 padR

θJA : 45 oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

0.1 1 10 1000.1

1

10

100

300µs

Rds(on

) Lim

it

1s

TC=25oC

100ms

DC

1ms

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Copyright ANPEC Electronics Corp.Rev. A.4 - Jul., 2008

www.anpec.com.tw5

APM3055NG

RD

S(O

N) -

On

- Res

ista

nce

(mΩ

)

Drain-Source On Resistance

ID - Drain Current (A)

Tj - Junction Temperature (°C)

Gate Threshold Voltage

VDS - Drain - Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Output Characteristics

Drain-Source On Resistance

VGS - Gate - Source Voltage (V)

RD

S(O

N) -

On

- Res

ista

nce

(mΩ

)

Nor

mal

ized

Thr

esho

ld V

olta

ge

Typical Characteristics (Cont.)

3 4 5 6 7 8 9 1050

60

70

80

90

100

110

120

130

140

150

ID=12A

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6IDS

=250µA

0.0 0.5 1.0 1.5 2.0 2.5 3.00

2

4

6

8

10

12

4V

3V

VGS

=5,6,7,8,9,10V

0 2 4 6 8 10 1220

40

60

80

100

120

140

160

VGS

= 4.5V

VGS

=10V

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Copyright ANPEC Electronics Corp.Rev. A.4 - Jul., 2008

www.anpec.com.tw6

APM3055NG

VDS - Drain - Source Voltage (V)

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

Tj - Junction Temperature (°C)

C -

Cap

acita

nce

(pF)

VSD - Source - Drain Voltage (V)

Source-Drain Diode Forward

IS -

Sou

rce

Cur

rent

(A)

Capacitance Gate Charge

QG - Gate Charge (nC)

VG

S -

Gat

e - s

ourc

e V

olta

ge (V

)

Typical Characteristics (Cont.)

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

RON

@Tj=25oC: 75mΩ

VGS

= 10V

IDS

= 12A

0 5 10 15 20 25 300

50

100

150

200

250

300

350

400

450

500

550

Frequency=1MHz

Crss

Coss

Ciss

0 1 2 3 4 5 6 7 80

1

2

3

4

5

6

7

8

9

10V

DS= 15V

ID = 12A

0.0 0.4 0.8 1.2 1.6 2.00.1

1

10

20

Tj=25oC

Tj=150oC

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Copyright ANPEC Electronics Corp.Rev. A.4 - Jul., 2008

www.anpec.com.tw7

APM3055NG

Package Information

TO-263-3

b2 e

L

VIEW A

0

0.25

GAUGE PLANE

A1

SEATING PLANE

SEE VIEW A

E

H

DL1

A

c2

b c

L2

E1

D1

YMBOL MIN. MAX.

4.83

0.00

1.14 1.78

0.38 0.74

1.14 1.65

0.25

6.00

A1

b2

cc2

D

D1

E

MILLIMETERS

b 0.51 0.99

2.54 BSC

TO263

9.65 11.43

6.22

0.100 BSC

MIN. MAX.

INCHES

0.190

0.000

0.020 0.039

0.045 0.070

0.015 0.029

0.045 0.065

0.236

0.380 0.450

0.245

4.06 0.160

0.010

E1

0.380

0.066

0.110

L2

L

L1

e

1.78

8.38 9.65

1.68

2.79 0.070

0.330

H 14.61 15.88 0.575 0.625

1.78 0.070

9.00

9.00

0.354

0.354

Note : Follow JEDEC TO-263 AB.

S

A

0 808θ o o o o

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Copyright ANPEC Electronics Corp.Rev. A.4 - Jul., 2008

www.anpec.com.tw8

APM3055NG

Carrier Tape & Reel Dimensions

Package Type Unit Quantity TO-263 Tape & Reel 800

Devices Per Unit

Application A H T1 C d D W E1 F

381.0±2.00 60 MIN. 24.4+2.00 -0.00

13.0+0.50 -0.20

1.5 MIN. 20.2 MIN. 24.0±0.30 1.75±0.10 11.5±0.10

P0 P1 P2 D0 D1 T A0 B0 K0 TO-263

4.0±0.10 16.0±0.10 2.0±0.10 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00

-0.40 10.8±0.20 16.1±0.20 5.2±0.20

(mm)

H

T1

A

d

A

E1

AB

W

F

T

P0OD0

BA0

P2

K0

B0

SECTION B-B

SECTION A-A

OD1

P1

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Copyright ANPEC Electronics Corp.Rev. A.4 - Jul., 2008

www.anpec.com.tw9

APM3055NG

Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles

Reflow Condition (IR/Convection or VPR Reflow)

Classification Reflow ProfilesProfile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly

Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.

Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)

100°C 150°C

60-120 seconds

150°C 200°C

60-180 seconds

Time maintained above: - Temperature (TL) - Time (tL)

183°C 60-150 seconds

217°C 60-150 seconds

Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)

10-30 seconds 20-40 seconds

Ramp-down Rate 6°C/second max. 6°C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.

Reliability Test Program

t 25 C to Peak

tp

Ramp-up

tL

Ramp-downts

Preheat

Tsmax

Tsmin

TL

TP

25

Tem

per

atur

e

Time

Critical ZoneTL to TP

°

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Copyright ANPEC Electronics Corp.Rev. A.4 - Jul., 2008

www.anpec.com.tw10

APM3055NG

Table 2. Pb-free Process – Package Classification Reflow Temperatures Package Thickness Volume mm3

<350 Volume mm3

350-2000 Volume mm3

>2000 <1.6 mm 260 +0°C* 260 +0°C* 260 +0°C*

1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C* ≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C*

*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.

Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures Package Thickness Volume mm3

<350 Volume mm3

≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C

Classification Reflow Profiles (Cont.)

Customer Service

Anpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838Fax : 886-2-2917-3838

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N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. A.3 - Apr., 2009

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, andadvise customers to obtain the latest version of relevant information to verify before placing orders.

APM4008NG

Pin Description

Ordering and Marking Information

Features

Applications

• 40V/60A,

RDS(ON)=6.5mΩ (typ.) @ VGS=10VRDS(ON)=10mΩ (typ.) @ VGS=4.5V

• Super High Dense Cell Design

• Reliable and Rugged

• Lead Free and Green Devices Available (RoHS

Compliant)

• Power Management in LCD monitor/TV

N-Channel MOSFET

Top View of TO-263

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).

G

S

D

APM4008N

Handling Code

Temperature Range

Package Code

Package Code G : TO-263Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material G : Halogen and Lead Free Device

APM4008N G : APM4008NXXXXX

XXXXX - Date Code

Assembly Material

G D

S

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Copyright ANPEC Electronics Corp.Rev. A.3 - Apr., 2009

www.anpec.com.tw2

APM4008NG

Absolute Maximum Ratings

Symbol Parameter Rating Unit

Common Ratings (TA=25°C Unless Otherwise Noted)

VDSS Drain-Source Voltage 40

BVDS (Avalanche)* Drain-Source Avalanche Voltage (maximum) 45 V

VGSS Gate-Source Voltage ±20 V

TJ Maximum Junction Temperature 150 °C

TSTG Storage Temperature Range -55 to 150 °C IS Diode Continuous Forward Current 20 A

TC=25°C 150 IDP 300µs Pulse Drain Current Tested

TC=100°C 80 A

EAS** Drain-Source Avalanche Energy 150 mJ

Mounted on Large Heat Sink

TC=25°C 60*** ID Continuous Drain Current

TC=100°C 45 A

TC=25°C 62.5 PD Maximum Power Dissipation

TC=100°C 25 W

RθJC Thermal Resistance-Junction to Case 2 °C/W

Mounted on PCB of 1in2 pad area

TA=25°C 15 ID Continuous Drain Current

TA=100°C 9.5 A

TA=25°C 2.8 PD Maximum Power Dissipation

TA=100°C 1.1 W

RθJA Thermal Resistance-Junction to Ambient 45 °C/W

Mounted on PCB of Minimum Footprint

TA=25°C 13 ID Continuous Drain Current

TA=100°C 8 A

TA=25°C 2 PD Maximum Power Dissipation

TA=100°C 0.8 W

RθJA Thermal Resistance-Junction to Ambient 62.5 °C/W

Notes: * Avalanche single pulse test, and avalanche period time tav≤100µs, duty<1%. ** Avalanche test condition: TJ = 25oC, L=0.5mH, IAS= 25A, VDD=30V, and VGS=10V. *** Current is limited by bond wire.

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Copyright ANPEC Electronics Corp.Rev. A.3 - Apr., 2009

www.anpec.com.tw3

APM4008NG

Electrical Characteristics (TA = 25°C)

APM4008NG Symbol Parameter Test Conditions

Min. Typ. Max. Unit

Static Characteristics

BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 40 - - V

VDS=32V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current

TJ=85°C - - 30 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1.3 2 3 V

IGSS Gate Leakage Current VGS=±20V, VDS=0V - - ±100 nA

VGS=10V, IDS=20A - 6.5 8 RDS(ON)

a Drain-Source On-state Resistance VGS=4.5V, IDS=10A - 10 13.5

Diode Characteristics

VSDa Diode Forward Voltage ISD=20A, VGS=0V - 0.7 1.1 V

Gate Charge Characteristics b

Qg Total Gate Charge - 51 71

Qgs Gate-Source Charge - 8 -

Qgd Gate-Drain Charge

VDS=20V, VGS=10V, IDS=20A

- 14 -

nC

Dynamic Characteristics b

RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 1.3 - Ω

Ciss Input Capacitance - 2600 -

Coss Output Capacitance - 260 -

Crss Reverse Transfer Capacitance

VGS=0V, VDS=20V, Frequency=1.0MHz - 210 -

pF

td(ON) Turn-on Delay Time - 18 33

tr Turn-on Rise Time - 16 30

td(OFF) Turn-off Delay Time - 57 104

tf Turn-off Fall Time

VDD=20V, RL=20Ω, IDS=1A, VGEN=10V, RG=6Ω

- 18 33

ns

trr Reverse Recovery Time - 32 - ns

Qrr Reverse Recovery Charge IDS=20A, dlSD/dt=100A/µs

- 29 - nC

Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.

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Copyright ANPEC Electronics Corp.Rev. A.3 - Apr., 2009

www.anpec.com.tw4

APM4008NG

Typical Operating Characteristics

Power Dissipation

Pto

t - P

ower

(W)

Tj - Junction Temperature (°C)

ID -

Dra

in C

urre

nt (A

)

Drain Current

Tj - Junction Temperature (°C)

Safe Operation Area

VDS - Drain - Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Thermal Transient Impedance

Square Wave Pulse Duration (sec)

Nor

mal

ized

Effe

ctiv

e Tr

ansi

ent

0 20 40 60 80 100 120 140 160 1800

10

20

30

40

50

60

70

TA=25oC

0 20 40 60 80 100 120 140 1600

20

40

60

80

TC=25oC,V

G=10V

1E-4 1E-3 0.01 0.1 1 10 400.02

0.1

1

2

Mounted on 1in2 padR

θJA : 45 oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

0.01 0.1 1 10 1000.1

1

10

100

300

10ms

300µs

Rds(on

) Lim

it

1s

TC=25oC

100ms

DC

1ms

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Copyright ANPEC Electronics Corp.Rev. A.3 - Apr., 2009

www.anpec.com.tw5

APM4008NG

VDS - Drain-Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Output Characteristics

RD

S(O

N) - O

n - R

esis

tanc

e (m

Ω)

Drain-Source On Resistance

ID - Drain Current (A)

VGS - Gate - Source Voltage (V)

RD

S(O

N) -

On

- Res

ista

nce

(mΩ

)

Tj - Junction Temperature (°C)

Gate Threshold Voltage

Nor

mal

ized

Thr

esho

ld V

olta

ge

Drain-Source On Resistance

0.0 0.5 1.0 1.5 2.0 2.5 3.00

30

60

90

120

150

4.5V

4V

5VVGS

=6,7,8,9,10V

-50 -25 0 25 50 75 100 125 1500.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8IDS

=250µA

3 4 5 6 7 8 9 100

5

10

15

20

25

30

ID=20A

0 25 50 75 100 125 1500

3

6

9

12

15

VGS

= 4.5V

VGS

=10V

Typical Operating Characteristics (Cont.)

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www.anpec.com.tw6

APM4008NG

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

Tj - Junction Temperature (°C) VSD - Source-Drain Voltage (V)

Source-Drain Diode Forward

IS -

Sou

rce

Cur

rent

(A)

VDS - Drain - Source Voltage (V)

C -

Cap

acita

nce

(pF)

Capacitance Gate Charge

QG - Gate Charge (nC)

VG

S -

Gat

e-so

urce

Vol

tage

(V)

0 5 10 15 20 25 300

400

800

1200

1600

2000

2400

2800

3200

3600

4000

Frequency=1MHz

CrssCoss

Ciss

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.60.1

1

10

100150

Tj=150oC

Tj=25oC

0 10 20 30 40 50 600

1

2

3

4

5

6

7

8

9

10V

DS= 15V

ID= 20A

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

RON

@Tj=25oC: 6.5mΩ

VGS

= 10V

IDS

= 20A

Typical Operating Characteristics (Cont.)

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APM4008NG

Avalanche Test Circuit and Waveforms

DUT

0.01Ωtp

VDD

VDSL

IL

RG

EAS

VDD

tAV

IAS

VDS

tp VDSX(SUS)

Avalanche Test Circuit and Waveforms

VDD

RD

DUT

VGS

VDS

RG

tp

td(on) tr td(off) tf

VGS

VDS90%

10%

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Copyright ANPEC Electronics Corp.Rev. A.3 - Apr., 2009

www.anpec.com.tw8

APM4008NG

Package Information

TO-263

b2 e

L

VIEW A

0

0.25

GAUGE PLANEA

1SEATING PLANE

SEE VIEW A

E

H

DL1

A

c2

b c

L2

E1

D1

YMBOL MIN. MAX.

4.83

0.00

1.14 1.78

0.38 0.74

1.14 1.65

0.25

6.00

A1

b2

cc2

D

D1

E

MILLIMETERS

b 0.51 0.99

2.54 BSC

TO-263

9.65 11.43

6.22

0.100 BSC

MIN. MAX.

INCHES

0.190

0.000

0.020 0.039

0.045 0.070

0.015 0.029

0.045 0.065

0.236

0.380 0.450

0.245

4.06 0.160

0.010

E1

0.380

0.066

0.110

L2

L

L1

e

1.78

8.38 9.65

1.68

2.79 0.070

0.330

H 14.61 15.88 0.575 0.625

1.78 0.070

9.00

9.00

0.354

0.354

Note : Follow JEDEC TO-263 AB.

S

A

0 808θ o o o o

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Copyright ANPEC Electronics Corp.Rev. A.3 - Apr., 2009

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APM4008NG

Application A H T1 C d D W E1 F

330.0±2.00 50 MIN. 24.4+2.00 -0.00

13.0+0.50 -0.20

1.5 MIN. 20.2 MIN. 24.0±0.30 1.75±0.10 11.5±0.10

P0 P1 P2 D0 D1 T A0 B0 K0 TO-263

4.0±0.10 16.0±0.10 2.0±0.10 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00

-0.40 10.8±0.20 16.1±0.20 5.2±0.20

(mm)

Carrier Tape & Reel Dimensions

Package Type Unit Quantity TO- 263 Tape & Reel 800

Devices Per Unit

H

T1

A

d

A

E1

AB

W

F

T

P0OD0

BA0

P2

K0

B0

SECTION B-B

SECTION A-A

OD1

P1

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Copyright ANPEC Electronics Corp.Rev. A.3 - Apr., 2009

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APM4008NG

Classification Profile

Taping Direction InformationTO-263

USER DIRECTION OF FEED

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Copyright ANPEC Electronics Corp.Rev. A.3 - Apr., 2009

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APM4008NG

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly

Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts)

100 °C 150 °C

60-120 seconds

150 °C 200 °C

60-120 seconds

Average ramp-up rate (Tsmax to TP) 3 °C/second max. 3°C/second max.

Liquidous temperature (TL) Time at liquidous (tL)

183 °C 60-150 seconds

217 °C 60-150 seconds

Peak package body Temperature (Tp)*

See Classification Temp in table 1 See Classification Temp in table 2

Time (tP)** within 5°C of the specified classification temperature (Tc)

20** seconds 30** seconds

Average ramp-down rate (Tp to Tsmax) 6 °C/second max. 6 °C/second max.

Time 25°C to peak temperature 6 minutes max. 8 minutes max.

* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.

Classification Reflow Profiles

Table 2. Pb-free Process – Classification Temperatures (Tc)

Package Thickness

Volume mm3 <350

Volume mm3 350-2000

Volume mm3 >2000

<1.6 mm 260 °C 260 °C 260 °C 1.6 mm – 2.5 mm 260 °C 250 °C 245 °C

≥2.5 mm 250 °C 245 °C 245 °C

Table 1. SnPb Eutectic Process – Classification Temperatures (Tc) Package

Thickness Volume mm3

<350 Volume mm3

≥350 <2.5 mm 235 °C 220 °C

≥2.5 mm 220 °C 220 °C

Reliability Test Program

Test item Method Description SOLDERABILITY JESD-22, B102 5 Sec, 245°C HOLT JESD-22, A108 1000 Hrs, Bias @ 125°C PCT JESD-22, A102 168 Hrs, 100%RH, 2atm, 121°C TCT JESD-22, A104 500 Cycles, -65°C~150°C

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APM4008NG

Customer Service

Anpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838

Fax : 886-2-2917-3838

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N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. A.1 - Apr., 2008

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, andadvise customers to obtain the latest version of relevant information to verify before placing orders.

APM7512NG

Pin Description

Ordering and Marking Information

Features

Applications

• 75V/75A ,

RDS(ON)= 9.1mΩ (typ.) @ VGS= 10V

• Avalanche Rated

• Reliable and Rugged

• Lead Free and Green Devices Available (RoHS

Compliant)

N-Channel MOSFET

Top View of TO-263

• Power Management for Inverter Systems

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).

G

S

D

G

D

S

APM7512N

Handling Code

Temperature Range

Package Code

Package Code G : TO-263Operating Junction Temperature Range C : -55 to 175 CHandling Code TR : Tape & ReelAssembly Material L : Lead Free Device G : Halogen and Lead Free Device

APM7512N G : APM7512NXXXXX

XXXXX - Date Code

Assembly Material°

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Copyright ANPEC Electronics Corp.Rev. A.1 - Apr., 2008

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APM7512NG

Absolute Maximum Ratings

Symbol Parameter Rating Unit

Common Ratings (TA=25°C Unless Otherwise Noted)

VDSS Drain-Source Voltage 75

VGSS Gate-Source Voltage ±25 V

TJ Maximum Junction Temperature 175 °C

TSTG Storage Temperature Range -55 to 175 °C IS Diode Continuous Forward Current 40 A

TC=25°C 300* IDP 300µs Pulse Drain Current Tested

TC=100°C 200 A

TA=25°C 75 ID Continuous Drain Current

TA=100°C 55 A

TA=25°C 150 PD Maximum Power Dissipation

TA=100°C 75 W

RθJC Thermal Resistance-Junction to Case 1 °C/W

RθJA Thermal Resistance-Junction to Ambient 45 °C/W

Drain-Source Avalanche Ratings

EAS Avalanche Energy, Single Pulsed L=2mH 1 J

Note: * Pulse width limited by safe operating area.

Electrical Characteristics (TA = 25°C Unless Otherwise Noted)

APM7512NG Symbol Parameter Test Condition

Min. Typ. Max. Unit

Static Characteristics BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 75 V

VDS=60V, VGS=0V 1 IDSS Zero Gate Voltage Drain Current

TJ=85°C 30 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 2.5 3.5 4.5 V

IGSS Gate Leakage Current VGS=±25V, VDS=0V ±100 nA

RDS(ON) a Drain-Source On-state Resistance VGS=10V, IDS=40A 9.1 12 mΩ

Diode Characteristics VSD

a Diode Forward Voltage ISD=20A, VGS=0V 0.8 1.3 V

trr Reverse Recovery Time 70 ns

qrr Reverse Recovery Charge IDS=40A, dlSD/dt=100A/µs

193 nC

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APM7512NG

Electrical Characteristics (TA = 25°C Unless Otherwise Noted)

APM7512NG Symbol Parameter Test Condition

Min. Typ. Max. Unit

Dynamic Characteristics b RG Gate Resistance VGS=0V,VDS=0V,F=1MHz 1.5 Ω

Ciss Input Capacitance 3740

Coss Output Capacitance 510

Crss Reverse Transfer Capacitance

VGS=0V, VDS=30V, Frequency=1.0MHz 195

pF

td(ON) Turn-on Delay Time 25 46

tr Turn-on Rise Time 15 28

td(OFF) Turn-off Delay Time 65 118

tf Turn-off Fall Time

VDD=35V, RL=35Ω, IDS=1A, VGEN=10V, RG=6Ω

34 62

ns

Gate Charge Characteristics b Qg Total Gate Charge 69 97

Qgs Gate-Source Charge 17.5

Qgd Gate-Drain Charge

VDS=30V, VGS=10V, IDS=40A

22

nC

Notes:

a : Pulse test ; pulse width≤300µs, duty cycle≤2%. b : Guaranteed by design, not subject to production testing.

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Copyright ANPEC Electronics Corp.Rev. A.1 - Apr., 2008

www.anpec.com.tw4

APM7512NG

Typical Characteristics

Power Dissipation

Pto

t - P

ower

(W)

Tj - Junction Temperature (°C)

ID -

Dra

in C

urre

nt (A

)

Drain Current

Tj - Junction Temperature (°C)

Safe Operation Area

VDS - Drain - Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Nor

mal

ized

Effe

ctiv

e Tr

ansi

ent

Thermal Transient Impedance

Square Wave Pulse Duration (sec)

1E-4 1E-3 0.01 0.1 1 10 401E-3

0.01

0.1

1

2

Mounted on 1in2 padR

θJA : 45 oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

0 20 40 60 80 100 120 140 160 1800

20

40

60

80

100

120

140

160

TC=25oC

0.01 0.1 1 10 100 3000.1

1

10

100

500

1ms

1s

Rds(o

n) Li

mit

TC=25oC

10ms

100ms

DC

0 20 40 60 80 100 120 140 160 1800

10

20

30

40

50

60

70

80

TC=25oC,V

G=10V

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Copyright ANPEC Electronics Corp.Rev. A.1 - Apr., 2008

www.anpec.com.tw5

APM7512NG

VDS - Drain-Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Output Characteristics

RD

S(O

N) - O

n - R

esis

tanc

e (m

Ω)

Drain-Source On Resistance

ID - Drain Current (A)

Drain-Source On Resistance

VGS - Gate - Source Voltage (V)

RD

S(O

N) -

On

- Res

ista

nce

(mΩ

)

Typical Characteristics (Cont.)

Tj - Junction Temperature (°C)

Gate Threshold Voltage

Nor

mal

ized

Thr

esho

ld V

olta

ge

0.0 0.5 1.0 1.5 2.0 2.5 3.00

20

40

60

80

100

120

140

160

180

2009V

8V

7V

5V

6V

VGS

= 10V

0 20 40 60 80 1006

7

8

9

10

11

12

13

VGS

=10V

-50 -25 0 25 50 75 100 125 150 1750.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

IDS

=250µA

4 5 6 7 8 9 106

8

10

12

14

16

18

20

IDS

=40A

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Copyright ANPEC Electronics Corp.Rev. A.1 - Apr., 2008

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APM7512NG

VSD - Source-Drain Voltage (V)

Source-Drain Diode Forward

IS -

Sou

rce

Cur

rent

(A)

VDS - Drain - Source Voltage (V)

C -

Cap

acita

nce

(pF)

Capacitance Gate Charge

QG - Gate Charge (nC)

VG

S -

Gat

e-so

urce

Vol

tage

(V)

Typical Characteristics (Cont.)

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

Tj - Junction Temperature (°C)

0 5 10 15 20 25 30 35 400

500

1000

1500

2000

2500

3000

3500

4000

4500

5000

5500

Frequency=1MHz

CrssCoss

Ciss

-50 -25 0 25 50 75 100 125 150 1750.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

RON

@Tj=25oC: 9.1mΩ

VGS

= 10V I

DS = 40A

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.60.6

1

10

100

200

Tj=175oC

Tj=25oC

0 10 20 30 40 50 60 700

1

2

3

4

5

6

7

8

9

10V

DS= 30V

IDS

= 40A

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Copyright ANPEC Electronics Corp.Rev. A.1 - Apr., 2008

www.anpec.com.tw7

APM7512NG

Package Information

TO-263-3

b2 e

L

VIEW A

0

0.25

GAUGE PLANE

A1

SEATING PLANE

SEE VIEW A

E

H

DL1

A

c2

b c

L2

E1

D1

YMBOL MIN. MAX.

4.83

0.00

1.14 1.78

0.38 0.74

1.14 1.65

0.25

6.00

A1

b2

cc2

D

D1

E

MILLIMETERS

b 0.51 0.99

2.54 BSC

TO263

9.65 11.43

6.22

0.100 BSC

MIN. MAX.

INCHES

0.190

0.000

0.020 0.039

0.045 0.070

0.015 0.029

0.045 0.065

0.236

0.380 0.450

0.245

4.06 0.160

0.010

E1

0.380

0.066

0.110

L2

L

L1

e

1.78

8.38 9.65

1.68

2.79 0.070

0.330

H 14.61 15.88 0.575 0.625

1.78 0.070

9.00

9.00

0.354

0.354

Note : Follow JEDEC TO-263 AB.

S

A

0 808θ o o o o

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Copyright ANPEC Electronics Corp.Rev. A.1 - Apr., 2008

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APM7512NG

Carrier Tape & Reel Dimensions

Application A H T1 C d D W E1 F

381.0±2.00 60 MIN. 24.4+2.00 -0.00

13.0+0.50 -0.20

1.5 MIN. 20.2 MIN. 24.0±0.30 1.75±0.10 11.5±0.10

P0 P1 P2 D0 D1 T A0 B0 K0 TO-263

4.0±0.10 16.0±0.10 2.0±0.10 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00

-0.40 10.8±0.20 16.1±0.20 5.2±0.20

H

T1

A

d

A

E1

AB

W

F

T

P0OD0

BA0

P2

K0

B0

SECTION B-B

SECTION A-A

OD1

P1

Package Type Unit Quantity TO- 263 Tape & Reel 1000

Devices Per Unit

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APM7512NG

Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles

Reflow Condition (IR/Convection or VPR Reflow)

Classification Reflow ProfilesProfile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly

Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.

Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)

100°C 150°C

60-120 seconds

150°C 200°C

60-180 seconds

Time maintained above: - Temperature (TL) - Time (tL)

183°C 60-150 seconds

217°C 60-150 seconds

Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)

10-30 seconds 20-40 seconds

Ramp-down Rate 6°C/second max. 6°C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.

Reliability Test Program

t 25 C to Peak

tp

Ramp-up

tL

Ramp-downts

Preheat

Tsmax

Tsmin

TL

TP

25

Tem

per

atu

re

Time

Critical ZoneTL to TP

°

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APM7512NG

Table 2. Pb-free Process – Package Classification Reflow Temperatures Package Thickness Volume mm3

<350 Volume mm3

350-2000 Volume mm3

>2000 <1.6 mm 260 +0°C* 260 +0°C* 260 +0°C*

1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C* ≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C*

*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.

Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures Package Thickness Volume mm3

<350 Volume mm3

≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C

Classification Reflow Profiles (Cont.)

Customer Service

Anpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838Fax : 886-2-2917-3838

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N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. B.2 - Jun., 2006

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.

APM2506NUB

Pin Description

Ordering and Marking Information

Features

Applications

• 25V/60A ,

RDS(ON)=4.8mΩ(typ.) @ VGS=10V RDS(ON)=7mΩ(typ.) @ VGS=4.5V

• Super High Dense Cell Design

• Avalanche Rated

• Reliable and Rugged

• Lead Free Available (RoHS Compliant)

• Power Management in Desktop Computer or

DC/DC Converters

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin platetermination finish; which are fully compliant with RoHS and compatible with both SnPb and lead-free soldieringoperations. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C

for MSL classification at lead-free peak reflow temperature.

°

APM2506N

Handling CodeTemp. RangePackage Code

Package Code UB : TO-251Operating Junction Temp. Range C : -55 to 150 CHandling Code PB : Plastic BagLead Free Code L : Lead Free Device Blank : Original Device

APM2506N UB : APM2506NXXXXX

XXXXX - Date Code

Lead Free Code

Top View of TO-251

N-Channel MOSFET

G

S

D

1 2 3

SDG

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Copyright ANPEC Electronics Corp.Rev. B.2 - Jun., 2006

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APM2506NUB

Absolute Maximum Ratings

Symbol Parameter Rating Unit

Common Ratings (TA = 25°C Unless Otherwise Noted)

VDSS Drain-Source Voltage 25

VGSS Gate-Source Voltage ±20 V

TJ Maximum Junction Temperature 150 °C

TSTG Storage Temperature Range -55 to 150 °C IS Diode Continuous Forward Current TC=25°C 40 A

Mounted on Large Heat Sink TC=25°C 150

IDP 300µs Pulse Drain Current Tested TC=100°C 80

A

TC=25°C 60* ID Continuous Drain Current

TC=100°C 50 A

TC=25°C 50 PD Maximum Power Dissipation

TC=100°C 20 W

RθJC Thermal Resistance-Junction to Case 2.5 °C/W

Mounted on PCB of Minimum Footprint TA=25°C 150

IDP 300µs Pulse Drain Current Tested TA=100°C 80

A

TA=25°C 12 ID Continuous Drain Current

TA=100°C 5.5 A

TA=25°C 1.25 PD Maximum Power Dissipation

TA=100°C 0.25 W

RθJA Thermal Resistance-Junction to Ambient 100 °C/W Note: * Current limited by bond wire.

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Copyright ANPEC Electronics Corp.Rev. B.2 - Jun., 2006

www.anpec.com.tw3

APM2506NUB

Electrical Characteristics (TA = 25°C unless otherwise noted)

Notes:a : Pulse test ; pulse width ≤300µs, duty cycle ≤ 2%.b : Guaranteed by design, not subject to production testing.

APM2506NUB Symbol Parameter Test Condition

Min. Typ. Max. Unit

Drain-Source Avalanche Ratings EAS Drain-Source Avalanche Energy ID=20A, L=0.5mH 100 mJ

Static Characteristics BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 25 V

IDSS Zero Gate Voltage Drain Current VDS=20V, VGS=0V 1 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1.3 1.8 2.5 V

IGSS Gate Leakage Current VGS=±20V, VDS=0V ±100 nA

VGS=10V, IDS=40A 4.8 6 RDS(ON)

a Drain-Source On-state Resistance VGS=4.5V, IDS=20A 7 9

Diode Characteristics VSD

a Diode Forward Voltage ISD=20A, VGS=0V 0.7 1.1 V

trrb Reverse Recovery Time 30 ns

Qrrb Reverse Recovery Charge

ISD=10A, dISD/dt =100A/µs 14 nC

Dynamic Characteristics b RG Gate Resistance VGS=0V,VDS=0V,F=1MHz 1.0 2.1 Ω

Ciss Input Capacitance 3100

Coss Output Capacitance 680

Crss Reverse Transfer Capacitance

VGS=0V, VDS=15V, Frequency=1.0MHz 520

pF

td(ON) Turn-on Delay Time 19

Tr Turn-on Rise Time 20

td(OFF) Turn-off Delay Time 62

Tf Turn-off Fall Time

VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω

43

ns

Gate Charge Characteristics b Qg Total Gate Charge 37.5 56

Qgs Gate-Source Charge 9.4

Qgd Gate-Drain Charge

VDS=15V, VGS=4.5V, IDS=40A

21

nC

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Copyright ANPEC Electronics Corp.Rev. B.2 - Jun., 2006

www.anpec.com.tw4

APM2506NUB

1E-4 1E-3 0.01 0.1 1 10 1001E-3

0.01

0.1

1

2

Mounted on minimum padR

θJA :100oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

Typical Characteristics

Power Dissipation

Pto

t - P

ower

(W)

Tj - Junction Temperature (°C)

ID -

Dra

in C

urre

nt (A

)

Drain Current

Tj - Junction Temperature (°C)

Safe Operation Area

VDS - Drain - Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Thermal Transient Impedance

Square Wave Pulse Duration (sec)

0 20 40 60 80 100 120 140 160 1800

10

20

30

40

50

60

TC=25oC

0.1 1 10 700.1

1

10

100

300

Rds(on

) Lim

it

1s

TC=25oC

10ms

100ms

DC

1ms

Nor

mal

ized

Tra

nsie

nt T

herm

al R

esis

tanc

e

0 20 40 60 80 100 120 140 160 1800

10

20

30

40

50

60

70

TC=25oC, V

G=10V

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Copyright ANPEC Electronics Corp.Rev. B.2 - Jun., 2006

www.anpec.com.tw5

APM2506NUB

VDS - Drain-Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Output Characteristics

RD

S(O

N) - O

n - R

esis

tanc

e (m

Ω)

Drain-Source On Resistance

ID - Drain Current (A)

VGS - Gate - Source Voltage (V) Tj - Junction Temperature (°C)

Gate Threshold Voltage

Nor

mal

ized

Thr

esho

ld V

lota

ge

Typical Characteristics (Cont.)

0.0 0.4 0.8 1.2 1.6 2.00

20

40

60

80

100

3V

2.5V

VGS

=3.5,4,5,6,7,8,9,10V

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

IDS

=250µA

Drain-Source On Resistance

RD

S(O

N) - O

n - R

esis

tanc

e (m

Ω)

0 20 40 60 80 1000

2

4

6

8

10

12

VGS

=4.5V

VGS

=10V

1 2 3 4 5 6 7 8 9 102

4

6

8

10

12

14

ID= 40A

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Copyright ANPEC Electronics Corp.Rev. B.2 - Jun., 2006

www.anpec.com.tw6

APM2506NUB

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

Tj - Junction Temperature (°C) VSD - Source-Drain Voltage (V)

Source-Drain Diode Forward

IS -

Sou

rce

Cur

rent

(A)

VDS - Drain - Source Voltage (V)

C -

Cap

acita

nce

(pF)

Capacitance Gate Charge

QG - Gate Charge (nC)

VG

S -

Gat

e-so

urce

Vol

tage

(V)

Typical Characteristics (Cont.)

-50 -25 0 25 50 75 100 125 1500.00

0.25

0.50

0.75

1.00

1.25

1.50

1.75

2.00

RON

@Tj=25oC: 4.8mΩ

VGS

= 10V

IDS

= 40A

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6

1

10

100

Tj=150oC

Tj=25oC

0 5 10 15 20 250

1000

2000

3000

4000

5000

Frequency=1MHz

CrssCoss

Ciss

0 10 20 30 40 50 600

1

2

3

4

5

6

7

8

9

10V

DS=15V

ID = 40A

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Copyright ANPEC Electronics Corp.Rev. B.2 - Jun., 2006

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APM2506NUB

Avalanche Test Circuit and Waveforms

Switching Time Test Circuit and Waveforms

td(on) tr td(off) t f

V GS

V DS

90%

10%

EAS

V DD

tAV

IAS

V DS

tpV DSX(SUS)

DUT

0.01Ωtp

V DD

V DSL

IL

RG

V DD

RD

DUT

V GS

V DS

RG

tp

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Copyright ANPEC Electronics Corp.Rev. B.2 - Jun., 2006

www.anpec.com.tw8

APM2506NUB

TO-251

Millimeters Inches Dim Min. Max. Min. Max.

A 2.20 2.40 0.087 0.094 A1 1.02 1.27 0.040 0.050 b 0.50 0.88 0.020 0.035 b2 5.20 5.46 0.205 0.215 C 0.40 0.60 0.016 0.024 C1 0.40 0.60 0.016 0.024 D 5.40 6.20 0.213 0.244 D1 5.30 -- 0.209 -- E 6.35 6.70 0.250 0.264 E1 4.40 5.40 0.173 0.213 e1 4.50 4.70 0.177 0.185 H 12.90 15.25 0.508 0.600

b2

E

D

H

E1

D1

b

e1

CA1

E1

D1

A

C1

Packaging Information

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Copyright ANPEC Electronics Corp.Rev. B.2 - Jun., 2006

www.anpec.com.tw9

APM2506NUB

Physical Specifications

t 25 C to Peak

tp

Ramp-up

tL

Ramp-down

tsPreheat

Tsmax

Tsmin

TL

TP

25

Te

mp

era

ture

Time

Critical ZoneTL to TP

°

Terminal Material Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn Lead Solderability Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.

Reflow Condition (IR/Convection or VPR Reflow)

Classification Reflow Profiles

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.

Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)

100°C 150°C

60-120 seconds

150°C 200°C

60-180 seconds

Time maintained above: - Temperature (TL) - Time (tL)

183°C 60-150 seconds

217°C 60-150 seconds

Peak/Classificatioon Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)

10-30 seconds 20-40 seconds

Ramp-down Rate 6°C/second max. 6°C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Notes: All temperatures refer to topside of the package .Measured on the body surface.

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Copyright ANPEC Electronics Corp.Rev. B.2 - Jun., 2006

www.anpec.com.tw10

APM2506NUB

Test item Method DescriptionSOLDERABILITY MIL-STD-883D-2003 245°C,5 SECHOLT MIL-STD 883D-1005.7 1000 Hrs Bias @ 125°CPCT JESD-22-B, A102 168 Hrs, 100% RH, 121°CTST MIL-STD 883D-1011.9 -65°C ~ 150°C, 200 Cycles

Reliability Test Program

Table 2. Pb-free Process – Package Classification Reflow Temperatures Package Thickness Volume mm3

<350 Volume mm3

350-2000 Volume mm3

>2000 <1.6 mm 260 +0°C* 260 +0°C* 260 +0°C*

1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C* ≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C*

*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.

Table 1. SnPb Entectic Process – Package Peak Reflow Temperatures Package Thickness Volume mm3

<350 Volume mm3

≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C

Classification Reflow Profiles(Cont.)

Customer Service

Anpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :7F, No. 137, Lane 235, Pac Chiao Rd.,Hsin Tien City, Taipei Hsien, Taiwan, R. O. C.Tel : 886-2-89191368Fax : 886-2-89191369

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N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. B.1 - Jun., 2006

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.

APM2509NUB

Pin Description

Ordering and Marking Information

Features

Applications

• 25V/50A ,

RDS(ON)=7.5mΩ(typ.) @ VGS=10V RDS(ON)=13mΩ(typ.) @ VGS=4.5V

• Super High Dense Cell Design

• Avalanche Rated

• Reliable and Rugged

• Lead Free Available (RoHS Compliant)

• Power Management in Desktop Computer or

DC/DC Converters

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin platetermination finish; which are fully compliant with RoHS and compatible with both SnPb and lead-free soldieringoperations. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020Cfor MSL classification at lead-free peak reflow temperature.

°

Top View of TO-251

N-Channel MOSFET

G

S

D

1 2 3

SDG

APM2509N

Handling CodeTemp. RangePackage Code

Package Code UB : TO-251Operating Junction Temp. Range C : -55 to 150 CHandling Code PB : Plastic BagLead Free Code L : Lead Free Device Blank : Original Device

APM2509N UB : APM2509NXXXXX

XXXXX - Date Code

Lead Free Code

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Copyright ANPEC Electronics Corp.Rev. B.1 - Jun., 2006

www.anpec.com.tw2

APM2509NUB

Absolute Maximum Ratings

Symbol Parameter Rating Unit

Common Ratings (TA=25°C Unless Otherwise Noted)

VDSS Drain-Source Voltage 25

VGSS Gate-Source Voltage ±20 V

TJ Maximum Junction Temperature 150 °C

TSTG Storage Temperature Range -55 to 150 °C IS Diode Continuous Forward Current TC=25°C 30 A

Mounted on Large Heat Sink TC=25°C 100

IDP 300µs Pulse Drain Current Tested TC=100°C 65

A

TC=25°C 50* ID Continuous Drain Current

TC=100°C 38 A

TC=25°C 50 PD Maximum Power Dissipation

TC=100°C 20 W

RθJC Thermal Resistance-Junction to Case 2.5 °C/W

Mounted on PCB of Minimum Footprint TA=25°C 100

IDP 300µs Pulse Drain Current Tested TA=100°C 65

A

TA=25°C 9.5 ID Continuous Drain Current

TA=100°C 4 A

TA=25°C 1.25 PD Maximum Power Dissipation

TA=100°C 0.25 W

RθJA Thermal Resistance-Junction to Ambient 100 °C/W Note: * Current limited by bond wire.

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Copyright ANPEC Electronics Corp.Rev. B.1 - Jun., 2006

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APM2509NUB

Electrical Characteristics (TA = 25°C unless otherwise noted)

APM2509NUB Symbol Parameter Test Condition

Min. Typ. Max. Unit

Drain-Source Avalanche Ratings

EAS Avalanche Energy, Single Pulsed ID=15A, L=0.5mH 50 mJ

Static Characteristics BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 25 V

VDS=20V, VGS=0V 1 IDSS Zero Gate Voltage Drain Current

TJ=85°C 30 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1.3 1.8 2.5 V

IGSS Gate Leakage Current VGS=±20V, VDS=0V ±100 nA

VGS=10V, IDS=30A 7.5 9 RDS(ON)

a Drain-Source On-state Resistance VGS=4.5V, IDS=15A 13 18

Diode Characteristics VSD

a Diode Forward Voltage ISD=10A, VGS=0V 0.9 1.1 V

trrb Reverse Recovery Time 17 ns

Qrrb Reverse Recovery Charge

ISD=10A, dISD/dt =100A/µs 6 nC

Dynamic Characteristics b RG Gate Resistance VGS=0V,VDS=0V,F=1MHz 1.8 Ω

Ciss Input Capacitance 1560

Coss Output Capacitance 345

Crss Reverse Transfer Capacitance

VGS=0V, VDS=15V, Frequency=1.0MHz 245

pF

td(ON) Turn-on Delay Time 17

Tr Turn-on Rise Time 18

td(OFF) Turn-off Delay Time 41

Tf Turn-off Fall Time

VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω

16

ns

Gate Charge Characteristics b Qg Total Gate Charge 17.5 26

Qgs Gate-Source Charge 5

Qgd Gate-Drain Charge

VDS=15V, VGS=4.5V, IDS=30A

11

nC

Notes: a : Pulse test ; pulse width≤300µs, duty cycle≤2%. b : Guaranteed by design, not subject to production testing.

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APM2509NUB

1E-4 1E-3 0.01 0.1 1 10 1001E-3

0.01

0.1

1

2

Mounted on minimum padR

θJA :100oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

Typical Characteristics

Power Dissipation

Pto

t - P

ower

(W)

Tj - Junction Temperature (°C)

ID -

Dra

in C

urre

nt (A

)

Drain Current

Tj - Junction Temperature (°C)

Safe Operation Area

VDS - Drain - Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Nor

mal

ized

Tra

nsie

nt T

herm

al R

esis

tanc

e

Thermal Transient Impedance

Square Wave Pulse Duration (sec)

0 20 40 60 80 100 120 140 160 1800

10

20

30

40

50

60

TC=25oC

0.1 1 10 700.1

1

10

100

300

1s

10ms

100ms

DC

Rds(on

) Lim

it

Tc=25oC

0 20 40 60 80 100 120 140 160 1800

10

20

30

40

50

60

TC=25oC,V

G=10V

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APM2509NUB

-50 -25 0 25 50 75 100 125 1500.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

IDS

=250µA

VDS - Drain-Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Output Characteristics

RD

S(O

N) - O

n - R

esis

tanc

e (m

Ω)

Drain-Source On Resistance

ID - Drain Current (A)

VGS - Gate - Source Voltage (V) Tj - Junction Temperature (°C)

Gate Threshold Voltage

Typical Characteristics (Cont.)

Nor

mal

ized

Thr

esho

ld V

olta

ge

0 20 40 60 80 1002

4

6

8

10

12

14

16

18

20

22

VGS

=10V

VGS

=4.5V

0.0 0.4 0.8 1.2 1.6 2.00

10

20

30

40

50

60

70

80

90

100

3.5V

3V

2.5V

VGS

=4,5,6,7,8,9,10V

Drain-Source On Resistance

RD

S(O

N) -

On

- Res

ista

nce

(mΩ

)

0 1 2 3 4 5 6 7 8 9 104

6

8

10

12

14

16

18

ID= 30A

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www.anpec.com.tw6

APM2509NUB

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

Tj - Junction Temperature (°C) VSD - Source-Drain Voltage (V)

Source-Drain Diode Forward

IS -

Sou

rce

Cur

rent

(A)

VDS - Drain - Source Voltage (V)

C -

Cap

acita

nce

(pF)

Capacitance Gate Charge

QG - Gate Charge (nC)

VG

S -

Gat

e-so

urce

Vol

tage

(V)

Typical Characteristics (Cont.)

-50 -25 0 25 50 75 100 125 1500.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

VGS

= 10V

IDS

= 30A

RON

@Tj=25oC: 7.5mΩ

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.40.1

1

10

40

Tj=25oC

Tj=150oC

0 5 10 15 20 250

500

1000

1500

2000

2500

3000

Frequency=1MHz

Crss

Coss

Ciss

0 5 10 15 20 25 30 350

1

2

3

4

5

6

7

8

9

10V

DS=15V

ID = 30A

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APM2509NUB

Avalanche Test Circuit and Waveforms

Switching Time Test Circuit and Waveforms

td(on) tr td(off) t f

V GS

V DS

90%

10%

EAS

V DD

tAV

IAS

V DS

tpV DSX(SUS)

DUT

0.01Ωtp

V DD

V DSL

IL

RG

V DD

RD

DUT

V GS

V DS

RG

tp

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Copyright ANPEC Electronics Corp.Rev. B.1 - Jun., 2006

www.anpec.com.tw8

APM2509NUB

TO-251

Millimeters Inches Dim Min. Max. Min. Max.

A 2.20 2.40 0.087 0.094 A1 1.02 1.27 0.040 0.050 b 0.50 0.88 0.020 0.035 b2 5.20 5.46 0.205 0.215 C 0.40 0.60 0.016 0.024 C1 0.40 0.60 0.016 0.024 D 5.40 6.20 0.213 0.244 D1 5.30 -- 0.209 -- E 6.35 6.70 0.250 0.264 E1 4.40 5.40 0.173 0.213 e1 4.50 4.70 0.177 0.185 H 12.90 15.25 0.508 0.600

b2

E

D

H

E1

D1

b

e1

CA1

E1

D1

A

C1

Packaging Information

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Copyright ANPEC Electronics Corp.Rev. B.1 - Jun., 2006

www.anpec.com.tw9

APM2509NUB

Physical Specifications

t 25 C to Peak

tp

Ramp-up

tL

Ramp-down

tsPreheat

Tsmax

Tsmin

TL

TP

25

Te

mp

era

ture

Time

Critical ZoneTL to TP

°

Terminal Material Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn Lead Solderability Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.

Reflow Condition (IR/Convection or VPR Reflow)

Classification Reflow Profiles

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.

Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)

100°C 150°C

60-120 seconds

150°C 200°C

60-180 seconds

Time maintained above: - Temperature (TL) - Time (tL)

183°C 60-150 seconds

217°C 60-150 seconds

Peak/Classificatioon Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)

10-30 seconds 20-40 seconds

Ramp-down Rate 6°C/second max. 6°C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Notes: All temperatures refer to topside of the package .Measured on the body surface.

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Copyright ANPEC Electronics Corp.Rev. B.1 - Jun., 2006

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APM2509NUB

Test item Method DescriptionSOLDERABILITY MIL-STD-883D-2003 245°C,5 SECHOLT MIL-STD 883D-1005.7 1000 Hrs Bias @ 125°CPCT JESD-22-B, A102 168 Hrs, 100% RH, 121°CTST MIL-STD 883D-1011.9 -65°C ~ 150°C, 200 Cycles

Reliability Test Program

Table 2. Pb-free Process – Package Classification Reflow Temperatures Package Thickness Volume mm3

<350 Volume mm3

350-2000 Volume mm3

>2000 <1.6 mm 260 +0°C* 260 +0°C* 260 +0°C*

1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C* ≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C*

*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.

Table 1. SnPb Entectic Process – Package Peak Reflow Temperatures Package Thickness Volume mm3

<350 Volume mm3

≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C

Classification Reflow Profiles(Cont.)

Customer Service

Anpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :7F, No. 137, Lane 235, Pac Chiao Rd.,Hsin Tien City, Taipei Hsien, Taiwan, R. O. C.Tel : 886-2-89191368Fax : 886-2-89191369

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N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. A.1 - Nov., 2006

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, andadvise customers to obtain the latest version of relevant information to verify before placing orders.

APM2506NF

Pin Description

Ordering and Marking Information

Features

Applications

• 25V/60A ,

RDS(ON)=4.2mΩ (typ.) @ VGS=10VRDS(ON)=6.5mΩ (typ.) @ VGS=4.5V

• Super High Dense Cell Design

• Avalanche Rated

• Reliable and Rugged

• Lead Free Available (RoHS Compliant)

N-Channel MOSFET

Note: ANPEC lead-free products contain molding compounds and 100% matte tin plate termination finish;which are fully compliant with RoHS and compatible with both SnPb and lead-free soldiering operations.ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C for MSLclassification at lead-free peak reflow temperature.

°

Top View of TO-220

• Power Management in Computer or Switching

Power Supply Systems

APM2506N

Handling Code

Temp. Range

Package Code

Package Code F : TO-220Operating Junction Temp. Range C : -55 to 150 CHandling Code TU : TubeLead Free Code L : Lead Free Device

APM2506N F : APM2506NXXXXX

XXXXX - Date Code

Lead Free Code

S

D

G

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Copyright ANPEC Electronics Corp.Rev. A.1 - Nov., 2006

www.anpec.com.tw2

APM2506NF

Absolute Maximum Ratings

Symbol Parameter Rating Unit

Common Ratings (TA=25°C Unless Otherwise Noted)

VDSS Drain-Source Voltage 25

VGSS Gate-Source Voltage ±20 V

TJ Maximum Junction Temperature 150 °C

TSTG Storage Temperature Range -55 to 150 °C IS Diode Continuous Forward Current TC=25°C 30 A

Mounted on Large Heat Sink

TC=25°C 240 IDP 300µs Pulse Drain Current Tested

TC=100°C 220 A

TC=25°C 60* ID Continuous Drain Current

TC=100°C 55 A

TC=25°C 62.5 PD Maximum Power Dissipation

TC=100°C 25 W

RθJC Thermal Resistance-Junction to Case 2 °C/W

Mounted on PCB of Minimum Footprint

TA=25°C 60 IDP 300µs Pulse Drain Current Tested

TA=100°C 35 A

TA=25°C 15 ID Continuous Drain Current

TA=100°C 9 A

TA=25°C 2 PD Maximum Power Dissipation

TA=100°C 0.8 W

RθJA Thermal Resistance-Junction to Ambient 62.5 °C/W

Notes: * Current limited by bond wire.

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Copyright ANPEC Electronics Corp.Rev. A.1 - Nov., 2006

www.anpec.com.tw3

APM2506NF

Electrical Characteristics (TA = 25°C unless otherwise noted)

APM2506NF Symbol Parameter Test Condition

Min. Typ. Max. Unit

Drain-Source Avalanche Ratings

EAS Avalanche Energy, Single Pulsed ID=15A, VDD=20V 50 mJ

Static Characteristics

BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 25 V

VDS=20V, VGS=0V 1 IDSS Zero Gate Voltage Drain Current

TJ=85°C 30 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1.3 1.8 2.5 V

IGSS Gate Leakage Current VGS=±20V, VDS=0V ±100 nA

VGS=10V, IDS=40A 4.2 5.5 RDS(ON)

a Drain-Source On-state Resistance VGS=4.5V, IDS=20A 6.5 8.5

Diode Characteristics

VSDa Diode Forward Voltage ISD=10A, VGS=0V 0.7 1.1 V

trr Reverse Recovery Time 30 ns

Qrr Reverse Recovery Charge IDS=10A, dlSD/dt=100A/µs

14 nC

Dynamic Characteristicsb

RG Gate Resistance VGS=0V,VDS=0V,F=1MHz 1.0 2.1 Ω

Ciss Input Capacitance 3100

Coss Output Capacitance 680

Crss Reverse Transfer Capacitance

VGS=0V, VDS=15V, Frequency=1.0MHz 520

pF

td(ON) Turn-on Delay Time 19

Tr Turn-on Rise Time 20

td(OFF) Turn-off Delay Time 62

Tf Turn-off Fall Time

VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω

43

ns

Gate Charge Characteristicsb

Qg Total Gate Charge 37.5 56

Qgs Gate-Source Charge 9.4

Qgd Gate-Drain Charge

VDS=15V, VGS=4.5V, IDS=40A

21

nC

Notes: a : Pulse test ; pulse width≤300µs, duty cycle≤2%. b : Guaranteed by design, not subject to production testing.

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Copyright ANPEC Electronics Corp.Rev. A.1 - Nov., 2006

www.anpec.com.tw4

APM2506NF

Typical Characteristics

Power Dissipation

Pto

t - P

ower

(W)

Tj - Junction Temperature (°C)

ID -

Dra

in C

urre

nt (A

)

Drain Current

Tj - Junction Temperature (°C)

Safe Operation Area

VDS - Drain - Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Nor

mal

ized

Tra

nsie

nt T

herm

al R

esis

tanc

e

Thermal Transient Impedance

Square Wave Pulse Duration (sec)

1E-4 1E-3 0.01 0.1 1 10 1001E-3

0.01

0.1

1

2

Mounted on 1in2 padR

θJA :62.5oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

0 20 40 60 80 100 120 140 160 1800

10

20

30

40

50

60

70

TC=25oC

0 20 40 60 80 100 120 140 160 1800

10

20

30

40

50

60

70

TC=25oC,V

G=10V

0.01 0.1 1 10 1001

10

100

500

Rds(

on) L

imit

1s

TC=25oC

10ms

100ms

DC

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Copyright ANPEC Electronics Corp.Rev. A.1 - Nov., 2006

www.anpec.com.tw5

APM2506NF

VDS - Drain-Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Output Characteristics

RD

S(O

N) - O

n - R

esis

tanc

e (m

Ω)

Drain-Source On Resistance

ID - Drain Current (A)

Gate-Source On Resistance

VGS - Gate - Source Voltage (V)

RD

S(O

N) -

On

- Res

ista

nce

(mΩ

)

Tj - Junction Temperature (°C)

Gate Threshold Voltage

Typical Characteristics (Cont.)

Nor

mal

ized

Thr

esho

ld V

olta

ge

1 2 3 4 5 6 7 8 9 102

4

6

8

10

12

14

ID= 40A

-50 -25 0 25 50 75 100 125 1500.0

0.3

0.6

0.9

1.2

1.5

1.8

IDS

=250µA

0.0 0.4 0.8 1.2 1.6 2.00

10

20

30

40

50

60

3V

2.5V

VGS

=3.5,4,5,6,7,8,9,10V

0 10 20 30 40 50 601

2

3

4

5

6

7

8

9

10

VGS

=4.5V

VGS

=10V

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Copyright ANPEC Electronics Corp.Rev. A.1 - Nov., 2006

www.anpec.com.tw6

APM2506NF

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

Tj - Junction Temperature (°C) VSD - Source-Drain Voltage (V)

Source-Drain Diode Forward

IS -

Sou

rce

Cur

rent

(A)

VDS - Drain - Source Voltage (V)

C -

Cap

acita

nce

(pF)

Capacitance Gate Charge

QG - Gate Charge (nC)

VG

S -

Gat

e-so

urce

Vol

tage

(V)

Typical Characteristics (Cont.)

-50 -25 0 25 50 75 100 125 1500.00

0.25

0.50

0.75

1.00

1.25

1.50

1.75

2.00

RON

@Tj=25oC: 4.2mΩ

VGS

= 10V

IDS

= 40A

0 5 10 15 20 250

1000

2000

3000

4000

5000

Frequency=1MHz

CrssCoss

Ciss

0 10 20 30 40 50 600

1

2

3

4

5

6

7

8

9

10V

DS=15V

ID = 40A

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.60.2

1

10

60

Tj=150oC

Tj=25oC

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Copyright ANPEC Electronics Corp.Rev. A.1 - Nov., 2006

www.anpec.com.tw7

APM2506NF

Avalanche Test Circuit and Waveforms

Switching Time Test Circuit and Waveforms

DUT

0.01Ωtp

VDD

VDSL

IL

RG

EAS

VDD

tAV

IAS

VDS

tp VDSX(SUS)

VDD

RD

DUT

VGS

VDS

RG

tp

td(on) tr td(off) tf

VGS

VDS90%

10%

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Copyright ANPEC Electronics Corp.Rev. A.1 - Nov., 2006

www.anpec.com.tw8

APM2506NF

Package Information

TO-220

Millimeters Inches Dim Min. Max. Min. Max.

A 3.56 4.83 0.140 0.190 A1 0.51 1.40 0.020 0.055 A2 2.03 2.92 0.080 0.115 b 0.38 1.02 0.015 0.040

b2 1.14 1.78 0.045 0.070 c 0.36 0.61 0.014 0.024 D 14.22 16.51 0.560 0.650

D1 8.38 9.02 0.330 0.355 D2 12.19 12.88 0.480 0.507 E 9.65 10.67 0.380 0.420

E1 6.86 8.89 0.270 0.350 E2 - 0.76 - 0.030 e 2.54 BSC 0.100 BSC

H1 5.84 6.86 0.230 0.270 L 12.70 14.73 0.500 0.580

L1 - 6.35 - 0.250 P 3.53 4.09 0.139 0.161 Q 2.54 3.43 0.100 0.135

A2

L

L1

e

P

Q

D

H1

A

A1

c

D1

E1

D2

b

b2

E/2

E

E2

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Copyright ANPEC Electronics Corp.Rev. A.1 - Nov., 2006

www.anpec.com.tw9

APM2506NF

Terminal Material Solder-Plated Copper (Solder Material : Sn) Lead Solderability Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.

Physical Specifications

Reliability test program

Test item Method Description

SOLDERABILITY MIL-STD-883D-2003 245°C,5 SEC

HOLT MIL-STD 883D-1005.7 1000 Hrs Bias @125°C

PCT JESD-22-B, A102 168 Hrs, 100% RH, 121°C

TST MIL-STD 883D-1011.9 -65°C ~ 150°C, 200 Cycles

Customer Service

Anpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :7F, No. 137, Lane 235, Pac Chiao Rd.,Hsin Tien City, Taipei Hsien, Taiwan, R. O. C.Tel : 886-2-89191368Fax : 886-2-89191369

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N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. A.1 - Aug., 2006

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, andadvise customers to obtain the latest version of relevant information to verify before placing orders.

APM2509NF

APM2509N

Handling Code

Temp. Range

Package Code

Package Code F : TO-220Operating Junction Temp. Range C : -55 to 150 CHandling Code TU : TubeLead Free Code L : Lead Free Device

APM2509N F : APM2509NXXXXX

XXXXX - Date Code

Lead Free Code

Pin Description

Ordering and Marking Information

Features

Applications

• 25V/50A ,

RDS(ON)=7.5mΩ (typ.) @ VGS=10VRDS(ON)=13mΩ (typ.) @ VGS=4.5V

• Super High Dense Cell Design

• Avalanche Rated

• Reliable and Rugged

• Lead Free Available (RoHS Compliant)

N-Channel MOSFET

Note: ANPEC lead-free products contain molding compounds and 100% matte tin plate termination finish;which are fully compliant with RoHS and compatible with both SnPb and lead-free soldiering operations.ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C for MSLclassification at lead-free peak reflow temperature.

°

Top View of TO-220

S

D

G

• Power Management in Computer or SPS

Systems

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Copyright ANPEC Electronics Corp.Rev. A.1 - Aug., 2006

www.anpec.com.tw2

APM2509NF

Absolute Maximum Ratings

Symbol Parameter Rating Unit

Common Ratings (TA=25°C Unless Otherwise Noted)

VDSS Drain-Source Voltage 25

VGSS Gate-Source Voltage ±20 V

TJ Maximum Junction Temperature 150 °C

TSTG Storage Temperature Range -55 to 150 °C IS Diode Continuous Forward Current TC=25°C 30 A

Mounted on Large Heat Sink TC=25°C 200

IDP 300µs Pulse Drain Current Tested TC=100°C 170

A

TC=25°C 50* ID Continuous Drain Current

TC=100°C 43 A

TC=25°C 62.5 PD Maximum Power Dissipation

TC=100°C 25 W

RθJC Thermal Resistance-Junction to Case 2 °C/W

Mounted on PCB of Minimum Footprint TA=25°C 48

IDP 300µs Pulse Drain Current Tested TA=100°C 30

A

TA=25°C 12 ID Continuous Drain Current

TA=100°C 7.5 A

TA=25°C 2 PD Maximum Power Dissipation

TA=100°C 0.8 W

RθJA Thermal Resistance-Junction to Ambient 62.5 °C/W Notes:

* Current limited by bond wire.

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Copyright ANPEC Electronics Corp.Rev. A.1 - Aug., 2006

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APM2509NF

Electrical Characteristics (TA = 25°C unless otherwise noted)

APM2509NF Symbol Parameter Test Condition

Min. Typ. Max. Unit

Drain-Source Avalanche Ratings EAS Avalanche Energy, Single Pulsed ID=15A, VDD=20V 50 mJ

Static Characteristics BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 25 V

VDS=20V, VGS=0V 1 IDSS Zero Gate Voltage Drain Current

TJ=85°C 30 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1.3 1.8 2.5 V

IGSS Gate Leakage Current VGS=±20V, VDS=0V ±100 nA

VGS=10V, IDS=30A 7.5 9 RDS(ON)

a Drain-Source On-state Resistance VGS=4.5V, IDS=15A 13 18

Diode Characteristics VSD

a Diode Forward Voltage ISD=10A, VGS=0V 0.9 1.1 V

trr Reverse Recovery Time 17 ns

Qrr Reverse Recovery Charge IDS=10A, dlSD/dt=100A/µs

6 nC

Dynamic Characteristics b

RG Gate Resistance VGS=0V,VDS=0V,F=1MHz 1.8 Ω

Ciss Input Capacitance 1560

Coss Output Capacitance 345

Crss Reverse Transfer Capacitance

VGS=0V, VDS=15V, Frequency=1.0MHz 245

pF

td(ON) Turn-on Delay Time 17

Tr Turn-on Rise Time 18

td(OFF) Turn-off Delay Time 41

Tf Turn-off Fall Time

VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω

16

ns

Gate Charge Characteristics b Qg Total Gate Charge 17.5 26

Qgs Gate-Source Charge 5

Qgd Gate-Drain Charge

VDS=15V, VGS=4.5V, IDS=30A

11

nC

Notes: a : Pulse test ; pulse width≤300µs, duty cycle≤2%. b : Guaranteed by design, not subject to production testing.

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Copyright ANPEC Electronics Corp.Rev. A.1 - Aug., 2006

www.anpec.com.tw4

APM2509NF

Typical Characteristics

Power Dissipation

Pto

t - P

ower

(W)

Tj - Junction Temperature (°C)

ID -

Dra

in C

urre

nt (A

)

Drain Current

Tj - Junction Temperature (°C)

Safe Operation Area

VDS - Drain - Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Nor

mal

ized

Tra

nsie

nt T

herm

al R

esis

tanc

e

Thermal Transient Impedance

Square Wave Pulse Duration (sec)

0 20 40 60 80 100 120 140 160 1800

10

20

30

40

50

60

70

TC=25oC

0.1 1 10 701

10

100

400

1ms

1s

10ms

100ms

DC

Rds(o

n) L

imit

Tc=25oC

1E-4 1E-3 0.01 0.1 1 10 1001E-3

0.01

0.1

1

2

Mounted on minimum padR

θJA :62.5oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

0 20 40 60 80 100 120 140 160 1800

10

20

30

40

50

60

TC=25oC,V

G=10V

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www.anpec.com.tw5

APM2509NF

VDS - Drain-Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Output Characteristics

RD

S(O

N) - O

n - R

esis

tanc

e (m

Ω)

Drain-Source On Resistance

ID - Drain Current (A)

Gate-Source On Resistance

VGS - Gate - Source Voltage (V)

RD

S(O

N) -

On

- Res

ista

nce

(mΩ

)

Tj - Junction Temperature (°C)

Gate Threshold Voltage

Typical Characteristics (Cont.)

Nor

mal

ized

Thr

esho

ld V

olta

ge

0.0 0.5 1.0 1.5 2.0 2.5 3.00

10

20

30

40

50

60

70

80

90

100

3.5V

5V

4V

4.5V

2.5V

3V

VGS

=6,7,8,9,10V

0 20 40 60 80 1000

2

4

6

8

10

12

14

16

18

20

VGS

=10V

VGS

=4.5V

1 2 3 4 5 6 7 8 9 100

5

10

15

20

25

30

ID=30A

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

IDS

=250µA

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Copyright ANPEC Electronics Corp.Rev. A.1 - Aug., 2006

www.anpec.com.tw6

APM2509NF

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

Tj - Junction Temperature (°C) VSD - Source-Drain Voltage (V)

Source-Drain Diode Forward

IS -

Sou

rce

Cur

rent

(A)

VDS - Drain - Source Voltage (V)

C -

Cap

acita

nce

(pF)

Capacitance Gate Charge

QG - Gate Charge (nC)

VG

S -

Gat

e-so

urce

Vol

tage

(V)

Typical Characteristics (Cont.)

0.0 0.4 0.8 1.2 1.6 2.00.1

1

10

100

Tj=150oC

Tj=25oC

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

RON

@Tj=25oC: 7.5mΩ

VGS

= 10V

IDS

= 30A

0 5 10 15 20 250

300

600

900

1200

1500

1800

2100

2400

2700

Frequency=1MHz

CrssCoss

Ciss

0 5 10 15 20 25 30 350

1

2

3

4

5

6

7

8

9

10V

DS=15V

ID = 30A

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Copyright ANPEC Electronics Corp.Rev. A.1 - Aug., 2006

www.anpec.com.tw7

APM2509NF

Avalanche Test Circuit and Waveforms

Switching Time Test Circuit and Waveforms

DUT

0.01Ωtp

VDD

VDSL

IL

RG

EAS

VDD

tAV

IAS

VDS

tp VDSX(SUS)

VDD

RD

DUT

VGS

VDS

RG

tp

td(on) tr td(off) tf

VGS

VDS90%

10%

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Copyright ANPEC Electronics Corp.Rev. A.1 - Aug., 2006

www.anpec.com.tw8

APM2509NF

Package Information

TO-220

Millimeters Inches Dim Min. Max. Min. Max.

A 3.56 4.83 0.140 0.190 A1 0.51 1.40 0.020 0.055 A2 2.03 2.92 0.080 0.115 b 0.38 1.02 0.015 0.040

b2 1.14 1.78 0.045 0.070 c 0.36 0.61 0.014 0.024 D 14.22 16.51 0.560 0.650

D1 8.38 9.02 0.330 0.355 D2 12.19 12.88 0.480 0.507 E 9.65 10.67 0.380 0.420

E1 6.86 8.89 0.270 0.350 E2 - 0.76 - 0.030 e 2.54 BSC 0.100 BSC

H1 5.84 6.86 0.230 0.270 L 12.70 14.73 0.500 0.580

L1 - 6.35 - 0.250 P 3.53 4.09 0.139 0.161 Q 2.54 3.43 0.100 0.135

A2

L

L1

e

P

Q

D

H1

A

A1

c

D1

E1

D2

b

b2

E/2

E

E2

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Copyright ANPEC Electronics Corp.Rev. A.1 - Aug., 2006

www.anpec.com.tw9

APM2509NF

Terminal Material Solder-Plated Copper (Solder Material : Sn) Lead Solderability Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.

Physical Specifications

Reliability test program

Test item Method Description

SOLDERABILITY MIL-STD-883D-2003 245°C,5 SEC

HOLT MIL-STD 883D-1005.7 1000 Hrs Bias @125°C

PCT JESD-22-B, A102 168 Hrs, 100% RH, 121°C

TST MIL-STD 883D-1011.9 -65°C ~ 150°C, 200 Cycles

Customer Service

Anpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :7F, No. 137, Lane 235, Pac Chiao Rd.,Hsin Tien City, Taipei Hsien, Taiwan, R. O. C.Tel : 886-2-89191368Fax : 886-2-89191369

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N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. A.1 - Sept., 2007

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, andadvise customers to obtain the latest version of relevant information to verify before placing orders.

APM7512NF

Pin Description

Ordering and Marking Information

Features

Applications

• 75V/80A ,

RDS(ON)= 9.1mΩ (typ.) @ VGS= 10V

• Avalanche Rated

• Reliable and Rugged

• Lead Free Available (RoHS Compliant)

N-Channel MOSFET

Note: ANPEC lead-free products contain molding compounds and 100% matte tin plate termination finish;which are fully compliant with RoHS and compatible with both SnPb and lead-free soldering operations. ANPEClead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C for MSL classifica-tion at lead-free peak reflow temperature.

Top View of TO-220

S

D

G• Power Management for Inverter Systems

APM7512N

Handling Code

Temp. RangePackageCode

Package Code F : TO-220Operating Junction Temp. Range C : -55 to 175 CHandling Code PB : Plastic BagLead Free Code L : Lead Free Device

APM7512N F : APM7512NXXXXX

XXXXX - Date Code

Lead FreeCode °

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Copyright ANPEC Electronics Corp.Rev. A.1 - Sept., 2007

www.anpec.com.tw2

APM7512NF

Absolute Maximum Ratings

Symbol Parameter Rating Unit

Common Ratings (TA=25°C Unless Otherwise Noted) VDSS Drain-Source Voltage 75

VGSS Gate-Source Voltage ±25 V

TJ Maximum Junction Temperature 175 °C

TSTG Storage Temperature Range -55 to 175 °C IS Diode Continuous Forward Current TC=25°C 40 A

Mounted on Large Heat Sink IDP 300µs Pulse Drain Current Tested TC=25°C 300* A

TC=25°C 80 ID Continuous Drain Current

TC=100°C 75 A

TC=25°C 273 PD Maximum Power Dissipation

TC=100°C 136 W

RθJC Thermal Resistance-Junction to Case 0.55 °C/W

Drain-Source Avalanche Ratings

EAS Avalanche Energy, Single Pulsed L=2mH 1 J

Notes: * Pulse width limited by safe operating area.

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Copyright ANPEC Electronics Corp.Rev. A.1 - Sept., 2007

www.anpec.com.tw3

APM7512NF

Electrical Characteristics (TA = 25°C unless otherwise noted)

APM7512NF Symbol Parameter Test Condition

Min. Typ. Max. Unit

Static Characteristics BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 75 V

VDS=60V, VGS=0V 1 IDSS Zero Gate Voltage Drain Current

TJ=85°C 30 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 2.5 3.5 4.5 V

IGSS Gate Leakage Current VGS=±25V, VDS=0V ±100 nA

RDS(ON) a Drain-Source On-state Resistance VGS=10V, IDS=40A 9.1 12 mΩ

Diode Characteristics VSD

a Diode Forward Voltage ISD=20A, VGS=0V 0.8 1.3 V

trr Reverse Recovery Time 66 ns

Qrr Reverse Recovery Charge IDS=40A, dlSD/dt=100A/µs

177 nC

Dynamic Characteristics b RG Gate Resistance VGS=0V,VDS=0V,F=1MHz 1.5 Ω

Ciss Input Capacitance 4240

Coss Output Capacitance 520

Crss Reverse Transfer Capacitance

VGS=0V, VDS=30V, Frequency=1.0MHz 210

pF

td(ON) Turn-on Delay Time 22 41

Tr Turn-on Rise Time 14 27

td(OFF) Turn-off Delay Time 69 125

Tf Turn-off Fall Time

VDD=35V, RL=35Ω, IDS=1A, VGEN=10V, RG=6Ω

40 73

ns

Gate Charge Characteristics b Qg Total Gate Charge 73 102

Qgs Gate-Source Charge 17

Qgd Gate-Drain Charge

VDS=30V, VGS=10V, IDS=40A

25

nC

Notes: a : Pulse test ; pulse width≤300µs, duty cycle≤2%. b : Guaranteed by design, not subject to production testing.

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Copyright ANPEC Electronics Corp.Rev. A.1 - Sept., 2007

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APM7512NF

1E-4 1E-3 0.01 0.1 1 10 1001E-3

0.01

0.1

1

2

Mounted on minimum padR

θJC :0.55oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

Typical Characteristics

Power Dissipation

Pto

t - P

ower

(W)

Tj - Junction Temperature (°C)

ID -

Dra

in C

urre

nt (A

)

Drain Current

Tj - Junction Temperature (°C)

Safe Operation Area

VDS - Drain - Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Nor

mal

ized

Tra

nsie

nt T

herm

al R

esis

tanc

e

Thermal Transient Impedance

Square Wave Pulse Duration (sec)

0 20 40 60 80 100 120 140 160 180 2000

50

100

150

200

250

300

TC=25oC

0.01 0.1 1 10 100 3000.1

1

10

100

500

1s

Rds(o

n) Li

mit

TC=25oC

10ms

100ms

DC

0 20 40 60 80 100 120 140 160 180 2000

20

40

60

80

100

TC=25oC,V

G=10V

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Copyright ANPEC Electronics Corp.Rev. A.1 - Sept., 2007

www.anpec.com.tw5

APM7512NF

VDS - Drain-Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Output Characteristics

RD

S(O

N) - O

n - R

esis

tanc

e (m

Ω)

Drain-Source On Resistance

ID - Drain Current (A)

Drain-Source On Resistance

VGS - Gate - Source Voltage (V)

RD

S(O

N) -

On

- Res

ista

nce

(mΩ

)

Typical Characteristics (Cont.)

4 5 6 7 8 9 106

8

10

12

14

16

18

20

22

ID=40A

0.0 0.5 1.0 1.5 2.0 2.5 3.00

20

40

60

80

100

120

140

160

180

2009V

8V

7V

5V

6V

VGS

= 10V

0 20 40 60 80 1006

7

8

9

10

11

12

13

VGS

=10V

Tj - Junction Temperature (°C)

Gate Threshold Voltage

Nor

mal

ized

Thr

esho

ld V

olta

ge

-50 -25 0 25 50 75 100 125 150 1750.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

IDS

=250µA

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Copyright ANPEC Electronics Corp.Rev. A.1 - Sept., 2007

www.anpec.com.tw6

APM7512NF

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.60.6

1

10

100

200

Tj=175oC

Tj=25oC

-50 -25 0 25 50 75 100 125 150 1750.00

0.25

0.50

0.75

1.00

1.25

1.50

1.75

2.00

2.25

2.50

RON

@Tj=25oC: 9.1mΩ

VGS

= 10V

IDS

= 40A

VSD - Source-Drain Voltage (V)

Source-Drain Diode Forward

IS -

Sou

rce

Cur

rent

(A)

VDS - Drain - Source Voltage (V)

C -

Cap

acita

nce

(pF)

Capacitance Gate Charge

QG - Gate Charge (nC)

VG

S -

Gat

e-so

urce

Vol

tage

(V)

Typical Characteristics (Cont.)

0 5 10 15 20 25 30 35 400

1000

2000

3000

4000

5000

6000

7000

Frequency=1MHz

Crss Coss

Ciss

0 10 20 30 40 50 60 70 800

1

2

3

4

5

6

7

8

9

10V

DS= 30V

ID= 40A

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

Tj - Junction Temperature (°C)

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Copyright ANPEC Electronics Corp.Rev. A.1 - Sept., 2007

www.anpec.com.tw7

APM7512NF

Avalanche Test Circuit and Waveforms

Switching Time Test Circuit and Waveforms

DUT

0.01Ωtp

VDD

VDSL

IL

RG

EAS

VDD

tAV

IAS

VDS

tp VDSX(SUS)

VDD

RD

DUT

VGS

VDS

RG

tp

td(on) tr td(off) tf

VGS

VDS90%

10%

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Copyright ANPEC Electronics Corp.Rev. A.1 - Sept., 2007

www.anpec.com.tw8

APM7512NF

Package Information

TO-220

A2

L

L1

e

P

Q

D

H1

A

A1

c

D1

E1

D2

b

b2

E/2

E

E2

SYMBOL MIN. MAX.

4.83

0.51

1.14 1.780.36 0.61

14.22 16.51

1.40

12.19

A

A1

b2

cD

D1

D2E

MILLIMETERS

b 0.38 1.02

2.54 BSC

TO-220

9.65 10.67

6.86

0.100 BSC

MIN. MAX.

INCHES

0.190

0.020

0.015 0.040

0.045 0.070

0.014 0.024

0.560 0.650

0.480

0.380 0.420

0.270

3.56 0.140

0.055

E1

0.355

0.250

0.580

P

LL1

e

12.70

8.38 9.02

6.35

14.73 0.500

0.330

Q

H1 5.84 6.86 0.230 0.270

4.09 0.161

2.03A2 2.92 0.080 0.115

E2 0.76 0.030

12.88 0.507

0.3508.89

3.53 0.139

2.54 3.43 0.100 0.135

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Copyright ANPEC Electronics Corp.Rev. A.1 - Sept., 2007

www.anpec.com.tw9

APM7512NF

Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles

Reliability Test Program

Customer Service

Anpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838Fax : 886-2-2917-3838

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N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. B.3 - Nov., 2009

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.

APM4412K

Features

Applications

• Power Management in Notebook Computer,

Portable Equipment and Battery Powered Systems

Pin Description

Ordering and Marking Information

N-Channel MOSFET

• 30V/12A,

RDS(ON) = 9mΩ (typ.) @ VGS = 10V RDS(ON) =12mΩ (typ.) @ VGS = 4.5V

• Super High Dense Cell Design

• Reliable and Rugged

• SOP-8 Package

• Lead Free and Green Devices Available (RoHS Compliant)

Top View of SOP−8

SS

SG

DD

DD

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).

APM4412

Handling CodeTemperature RangePackage Code

Package Code K : SOP-8Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material G : Halogen and Lead Free Device

APM4412 K : APM4412XXXXX XXXXX - Date Code

Assembly Material

G

S

D DDD

SS

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Copyright ANPEC Electronics Corp.Rev. B.3 - Nov., 2009

www.anpec.com.tw2

APM4412K

Absolute Maximum Ratings (TA = 25°C unless otherwise noted)

Electrical Characteristics (TA = 25°C unless otherwise noted)

Symbol Parameter Rating Unit

VDSS Drain-Source Voltage 30

VGSS Gate-Source Voltage ±20 V

TA=25°C 12 ID

a Continuous Drain Current (VGS=10V) TA=70°C 9

IDMa 300µs Pulsed Drain Current (VGS=10V) 45

A

ISa Diode Continuous Forward Current 2

IARb Avalanche Current 16.5

A

EARb Repetitive Avalanche Energy (L=0.3mH) 40 mJ

TJ Maximum Junction Temperature 150

TSTG Storage Temperature Range -55 to 150 °C

TA=25°C 2.5 PD* Maximum Power Dissipation

TA=70°C 1.6 W

RθJAa,c Thermal Resistance-Junction to Ambient T≤10s 50

RθJL Thermal Resistance-Junction to Lead Steady State 25 °C/W

Note a:Surface Mounted on 1in2 pad area, t ≤ 10sec. Note b:UIS tested and pulse width limited by maximum junction temperature 150oC (initial temperature TJ=25oC). Note c:Maximum under Steady State conditions is 75°C/W.

APM4412K Symbol Parameter Test Conditions

Min. Typ. Max. Unit

Static Characteristics

BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 30 - - V

VDS=24V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current

TJ=85°C - - 30 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1.3 1.7 2.5 V

IGSS Gate Leakage Current VGS=±20V, VDS=0V - - ±100 nA

VGS=10V, IDS=12A - 9 12 RDS(ON)

d Drain-Source On-state Resistance VGS=4.5V, IDS=8A - 12 16

VSD d Diode Forward Voltage ISD=2.3A, VGS=0V - 0.75 1.3 V

Gate Charge Characteristics e

Qg Total Gate Charge - 24.5 32

Qgs Gate-Source Charge - 4 -

Qgd Gate-Drain Charge

VDS=15V, VGS=10V, IDS=12A

- 8 -

nC

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Copyright ANPEC Electronics Corp.Rev. B.3 - Nov., 2009

www.anpec.com.tw3

APM4412K

Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)

APM4412K Symbol Parameter Test Conditions

Min. Typ. Max. Unit

Dynamic Characteristics e

RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 2.3 - Ω

Ciss Input Capacitance - 1470 -

Coss Output Capacitance - 233 -

Crss Reverse Transfer Capacitance

VGS=0V, VDS=25V, Frequency=1.0MHz - 157 -

pF

td(ON) Turn-on Delay Time - 13 24

Tr Turn-on Rise Time - 9 17

td(OFF) Turn-off Delay Time - 36 66

Tf Turn-off Fall Time

VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω

- 12 23

ns

trr Reverse Recovery Time - 14 - ns

Qrr Reverse Recovery Charge ISD=12A, dISD/dt =100A/µs

- 5 - nC

Note d : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note e : Guaranteed by design, not subject to production testing.

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Copyright ANPEC Electronics Corp.Rev. B.3 - Nov., 2009

www.anpec.com.tw4

APM4412K

Typical Operating Characteristics

ID -

Dra

in C

urre

nt (A

)

Drain Current

Tj - Junction Temperature (°C)

Safe Operation Area

VDS - Drain - Source Voltage (V)

Nor

mal

ized

Tra

nsie

nt T

herm

al R

esis

tanc

e

Thermal Transient Impedance

Square Wave Pulse Duration (sec)

Power Dissipation

Pto

t - P

ower

(W)

Tj - Junction Temperature (°C)

ID -

Dra

in C

urre

nt (A

)

0 20 40 60 80 100 120 140 1600

2

4

6

8

10

12

14

TA=25oC,V

G=10V

1E-4 1E-3 0.01 0.1 1 10 301E-3

0.01

0.1

1

2

Mounted on 1in2 padR

θJA : 50 oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

0 20 40 60 80 100 120 140 1600.0

0.5

1.0

1.5

2.0

2.5

3.0

TA=25oC

0.01 0.1 1 10 1000.01

0.1

1

10

100

300usRds(on

) Lim

it

1s

TA=25oC

10ms

1ms

100ms

DC

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www.anpec.com.tw5

APM4412K

RD

S(O

N) - O

n - R

esis

tanc

e (m

Ω)

Drain-Source On Resistance

ID - Drain Current (A)

Tj - Junction Temperature (°C)

Gate Threshold Voltage

VDS - Drain-Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Output Characteristics

Transfer Characteristics

VGS - Gate - Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Nor

mal

ized

Thr

esho

ld V

olta

ge

Typical Operating Characteristics (Cont.)

0.0 0.5 1.0 1.5 2.0 2.5 3.00

5

10

15

20

25

30

35

40

45

3.5V

3V

VGS

= 4,5,6,7,8,9,10V

0 9 18 27 36 452

4

6

8

10

12

14

16

18

20

VGS

=10V

VGS

=4.5V

0 1 2 3 4 5 60

5

10

15

20

25

30

35

40

45

Tj=125oC

Tj=25oC

Tj=-55oC

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

IDS

=250µA

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APM4412K

VDS - Drain - Source Voltage (V)

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

Tj - Junction Temperature (°C)

C -

Cap

acita

nce

(pF)

VSD - Source - Drain Voltage (V)

Source-Drain Diode Forward

IS -

Sou

rce

Cur

rent

(A)

Capacitance Gate Charge

QG - Gate Charge (nC)

VG

S -

Gat

e - s

ourc

e V

olta

ge (V

)

Typical Operating Characteristics (Cont.)

-50 -25 0 25 50 75 100 125 1500.00

0.25

0.50

0.75

1.00

1.25

1.50

1.75

2.00

RON

@Tj=25oC: 9mΩ

VGS

= 10V

IDS

= 12A

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.40.5

1

10

50

Tj=150oC

Tj=25oC

0 5 10 15 20 250

1

2

3

4

5

6

7

8

9

10V

DS= 15V

ID = 12A

0 5 10 15 20 25 300

300

600

900

1200

1500

1800

2100

2400

Frequency=1MHz

CrssCoss

Ciss

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APM4412K

SOP-8

Package Information

D

e

EE1

SEE VIEW A

cb

h X

45°

A

A1

A2

L

VIEW A0.

25

SEATING PLANEGAUGE PLANE

Note: 1. Follow JEDEC MS-012 AA. 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension “E” does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side.

SYMBOL MIN. MAX.

1.75

0.10

0.17 0.25

0.25

A

A1

c

D

E

E1

e

h

L

MILLIMETERS

b 0.31 0.51

SOP-8

0.25 0.50

0.40 1.27

MIN. MAX.

INCHES

0.069

0.004

0.012 0.020

0.007 0.010

0.010 0.020

0.016 0.050

0

0.010

1.27 BSC 0.050 BSC

A2 1.25 0.049

0° 8 ° 0° 8 °

3.80

5.80

4.80

4.00

6.20

5.00 0.189 0.197

0.228 0.244

0.150 0.157

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APM4412K

Application A H T1 C d D W E1 F

330.0±2.00 50 MIN. 12.4+2.00 -0.00

13.0+0.50 -0.20

1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.5±0.05

P0 P1 P2 D0 D1 T A0 B0 K0 SOP-8

4.0±0.10 8.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00

-0.40 6.40±0.20 5.20±0.20 2.10±0.20

(mm)

Carrier Tape & Reel Dimensions

H

T1

A

d

A

E1

AB

W

F

T

P0OD0

BA0

P2

K0

B0

SECTION B-B

SECTION A-A

OD1

P1

Devices Per Unit

Package Type Unit Quantity

SOP-8 Tape & Reel 2500

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APM4412K

Taping Direction InformationSOP-8

USER DIRECTION OF FEED

Classification Profile

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APM4412K

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly

Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts)

100 °C 150 °C

60-120 seconds

150 °C 200 °C

60-120 seconds

Average ramp-up rate (Tsmax to TP) 3 °C/second max. 3°C/second max.

Liquidous temperature (TL) Time at liquidous (tL)

183 °C 60-150 seconds

217 °C 60-150 seconds

Peak package body Temperature (Tp)*

See Classification Temp in table 1 See Classification Temp in table 2

Time (tP)** within 5°C of the specified classification temperature (Tc)

20** seconds 30** seconds

Average ramp-down rate (Tp to Tsmax) 6 °C/second max. 6 °C/second max.

Time 25°C to peak temperature 6 minutes max. 8 minutes max.

* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.

Classification Reflow Profiles

Table 2. Pb-free Process – Classification Temperatures (Tc)

Package Thickness

Volume mm3 <350

Volume mm3 350-2000

Volume mm3 >2000

<1.6 mm 260 °C 260 °C 260 °C 1.6 mm – 2.5 mm 260 °C 250 °C 245 °C

≥2.5 mm 250 °C 245 °C 245 °C

Table 1. SnPb Eutectic Process – Classification Temperatures (Tc) Package

Thickness Volume mm3

<350 Volume mm3

≥350 <2.5 mm 235 °C 220 °C

≥2.5 mm 220 °C 220 °C

Reliability Test Program

Test item Method Description SOLDERABILITY JESD-22, B102 5 Sec, 245°C HOLT JESD-22, A108 1000 Hrs, Bias @ 125°C PCT JESD-22, A102 168 Hrs, 100%RH, 2atm, 121°C TCT JESD-22, A104 500 Cycles, -65°C~150°C

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APM4412K

Customer Service

Anpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838

Fax : 886-2-2917-3838

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N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. A.2 - Nov., 2008

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, andadvise customers to obtain the latest version of relevant information to verify before placing orders.

APM4810K

Features

Applications

• Power Management in Notebook Computer,

Portable Equipment and Battery PoweredSystems

Pin Description

Ordering and Marking InformationN-Channel MOSFET

• 30V/11A,

RDS(ON) = 12mΩ(typ.) @ VGS = 10V RDS(ON) =18mΩ(typ.) @ VGS = 4.5V

• Super High Dense Cell Design

• Reliable and Rugged

• Lead Free and Green Devices Available(RoHS Compliant)

Top View of SOP − 8

G

S

D D( 5,6,7,8 )

(4)

(1, 2, 3)

DD

SS

APM4810

Handling Code

Temperature RangePackage Code

Package Code K : SOP-8Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material L : Lead Free Device G : Halogen and Lead Free Device

APM4810 K : XXXXX - Date Code

Assembly Material

APM4810XXXXX

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).

SS

SG

DD

DD

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www.anpec.com.tw2

APM4810K

Absolute Maximum Ratings (TA = 25°C Unless Otherwise Noted)

Electrical Characteristics (TA = 25°C Unless Otherwise Noted)

Symbol Parameter Rating Unit

VDSS Drain-Source Voltage 30

VGSS Gate-Source Voltage ±20 V

ID* Continuous Drain Current 11

IDM* 300µs Pulsed Drain Current VGS=10V

40 A

IS* Diode Continuous Forward Current 2.5 A

TJ Maximum Junction Temperature 150

TSTG Storage Temperature Range -55 to 150 °C

TA=25°C 2 PD* Maximum Power Dissipation

TA=100°C 0.8 W

RθJA* Thermal Resistance-Junction to Ambient 62.5 °C/W

Note : *Surface Mounted on 1in2 pad area, t ≤ 10sec.

APM4810K Symbol Parameter Test Conditions

Min. Typ. Max. Unit

STATIC CHARACTERISTICS

BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 30 - - V

VDS=24V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current

TJ=85°C - - 30 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1.3 1.8 2.5 V

IGSS Gate Leakage Current VGS=±20V, VDS=0V - - ±100 nA

VGS=10V, IDS=11A - 12 15 RDS(ON)

a Drain-Source On-State Resistance VGS=4.5V, IDS=10A - 18 25

VSDa Diode Forward Voltage ISD=2.5A, VGS=0V - 0.75 1.1 V

GATE CHARGE CHARACTERISTICS b

Qg Total Gate Charge - 19 27

Qgs Gate-Source Charge - 2 -

Qgd Gate-Drain Charge

VDS=15V, VGS=10V, IDS=11A

- 4 -

nC

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www.anpec.com.tw3

APM4810K

Electrical Characteristics (Cont.) (TA = 25°C Unless Otherwise Noted)

APM4810K Symbol Parameter Test Conditions

Min. Typ. Max. Unit

DYNAMIC CHARACTERISTICS b

RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 1.5 - Ω

Ciss Input Capacitance - 830 -

Coss Output Capacitance - 130 -

Crss Reverse Transfer Capacitance

VGS=0V, VDS=15V, Frequency=1.0MHz - 95 -

pF

td(ON) Turn-on Delay Time - 7 14

tr Turn-on Rise Time - 13 24

td(OFF) Turn-off Delay Time - 28 51

tf Turn-off Fall Time

VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω

- 6 12

ns

trrb Reverse Recovery Time - 19 - ns

qrrb Reverse Recovery Charge

ISD=11A, dlSD/dt=100A/µs - 13 - nC

Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.

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Copyright ANPEC Electronics Corp.Rev. A.2 - Nov., 2008

www.anpec.com.tw4

APM4810K

I D -

Dra

in C

urre

nt (A

)

Drain Current

TJ- Junction Temperature (°C)

Safe Operation Area

VDS - Drain - Source Voltage (V)

Nor

mal

ized

Tra

nsie

nt T

herm

al R

esis

tanc

e

Thermal Transient Impedance

Square Wave Pulse Duration (sec)

Power Dissipation

Pto

t - P

ower

(W)

TJ - Junction Temperature (°C)

I D -

Dra

in C

urre

nt (A

)

0 20 40 60 80 100 120 140 1600.0

0.5

1.0

1.5

2.0

2.5

TA=25oC

0 20 40 60 80 100 120 140 1600

2

4

6

8

10

12

14

TA=25oC,V

G=10V

1E-4 1E-3 0.01 0.1 1 10 300.01

0.1

1

2

Mounted on 1in2 padR

θJA : 62.5 oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

Typical Operating Characteristics

0.01 0.1 1 10 1000.01

0.1

1

10

100

Rds(on

) Lim

it

1s

TA=25oC

10ms

300µs

1ms

100ms

DC

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Copyright ANPEC Electronics Corp.Rev. A.2 - Nov., 2008

www.anpec.com.tw5

APM4810K

RD

S(O

N) -

On

- Res

ista

nce

(mΩ

)

Drain-Source On Resistance

ID - Drain Current (A)

TJ - Junction Temperature (°C)

Gate Threshold Voltage

VDS - Drain-Source Voltage (V)

I D -

Dra

in C

urre

nt (A

)

Output Characteristics

Drain-Source On Resistance

VGS - Gate - Source Voltage (V)

RD

S(O

N) -

On

- Res

ista

nce

(mΩ

)

Nor

mal

ized

Thr

esho

ld V

olta

ge

0 5 10 15 20 25 30 35 404

8

12

16

20

24

28

VGS

=4.5V

VGS

=10V

2 3 4 5 6 7 8 9 106

9

12

15

18

21

24

27

30

ID=11A

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6IDS

= 250µA

Typical Operating Characteristics (Cont.)

0.0 0.5 1.0 1.5 2.0 2.5 3.00

5

10

15

20

25

30

35

40

2V

3V

2.5V

3.5VV

GS= 4,4.5,5,6,7,8,9,10V

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www.anpec.com.tw6

APM4810K

VDS - Drain - Source Voltage (V)

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

TJ - Junction Temperature (°C)

C -

Cap

acita

nce

(pF)

VSD - Source - Drain Voltage (V)

Source-Drain Diode Forward

I S -

Sou

rce

Cur

rent

(A)

Capacitance Gate Charge

QG - Gate Charge (nC)

VG

S -

Gat

e - s

ourc

e V

olta

ge (V

)

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

2.2

VGS

= 10V

IDS

= 11A

RON

@Tj=25oC: 12mΩ

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.60.1

1

10

40

Tj=150oC

Tj=25oC

0 5 10 15 20 25 300

200

400

600

800

1000

1200

1400

Frequency=1MHz

CrssCoss

Ciss

0 4 8 12 16 200

1

2

3

4

5

6

7

8

9

10V

DS=15V

IDS

=11A

Typical Operating Characteristics (Cont.)

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www.anpec.com.tw7

APM4810K

Package InformationSOP-8

SYMBOL MIN. MAX.

1.75

0.10

0.17 0.25

0.25

A

A1

c

D

E

E1

e

h

L

MILLIMETERS

b 0.31 0.51

SOP-8

0.25 0.50

0.40 1.27

MIN. MAX.

INCHES

0.069

0.004

0.012 0.020

0.007 0.010

0.010 0.020

0.016 0.050

0

0.010

1.27 BSC 0.050 BSC

A2 1.25 0.049

0° 8 ° 0° 8 °

D

e

EE1

SEE VIEW A

cb

h X

45°

A

A1

A2

L

VIEW A

0.25

SEATING PLANEGAUGE PLANE

Note: 1. Follow JEDEC MS-012 AA. 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension “E” does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side.

3.80

5.80

4.80

4.00

6.20

5.00 0.189 0.197

0.228 0.244

0.150 0.157

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Copyright ANPEC Electronics Corp.Rev. A.2 - Nov., 2008

www.anpec.com.tw8

APM4810K

Application A H T1 C d D W E1 F

330.0±2.00 50 MIN. 12.4+2.00 -0.00

13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.5±0.05

P0 P1 P2 D0 D1 T A0 B0 K0 SOP-8

4.0±0.10 8.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00

-0.40 6.40±0.20 5.20±0.20 2.10±0.20

(mm)

Carrier Tape & Reel Dimensions

H

T1

A

d

A

E1

AB

W

F

T

P0OD0

BA0

P2

K0

B0

SECTION B-B

SECTION A-A

OD1

P1

Devices Per Unit

Package Type Unit Quantity

SOP-8 Tape & Reel 2500

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www.anpec.com.tw9

APM4810K

Taping Direction InformationSOP-8

Reflow Condition (IR/Convection or VPR Reflow)

t 25 C to Peak

tp

Ramp-up

tL

Ramp-downts

Preheat

Tsmax

Tsmin

TL

TP

25

Tem

per

atur

e

Time

Critical ZoneTL to TP

°

Reliability Test Program

Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles

USER DIRECTION OF FEED

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www.anpec.com.tw10

APM4810K

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.

Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)

100°C 150°C

60-120 seconds

150°C 200°C

60-180 seconds

Time maintained above: - Temperature (TL) - Time (tL)

183°C 60-150 seconds

217°C 60-150 seconds

Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)

10-30 seconds 20-40 seconds

Ramp-down Rate 6°C/second max. 6°C/second max.

Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.

Classification Reflow Profiles

Table 2. Pb-free Process – Package Classification Reflow Temperatures

Package Thickness Volume mm3 <350

Volume mm3 350-2000

Volume mm3 >2000

<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*

≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.

Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures

Package Thickness Volume mm3

<350 Volume mm3

≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C

Customer Service

Anpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838

Fax : 886-2-2917-3838

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N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2008

APM4812K

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.

Ordering and Marking Information

Features

Applications

• 30V/8A, RDS(ON)= 18mΩ(typ.) @ VGS= 10V RDS(ON)= 26mΩ(typ.) @ VGS= 4.5V• Super High Dense Cell Design• Reliable and Rugged

• Lead Free and Green Devices Available

(RoHS Compliant)

N-Channel MOSFET

Pin Description

• Power Management in Notebook Computer,

Portable Equipment and Battery PoweredSystems

Top View of SOP − 8

SS

SG

DD

DD

G

S

D DDD

SS

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).

APM4812

Handling CodeTemperature RangePackage Code

Package Code K : SOP-8Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material G : Halogen and Lead Free Device

APM4812 K :APM4812XXXXX XXXXX - Date Code

Assembly Material

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Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2008

APM4812K

www.anpec.com.tw2

Electrical Characteristics (TA = 25°C unless otherwise noted)

Absolute Maximum Ratings (TA = 25°C unless otherwise noted)

Symbol Parameter Rating Unit

VDSS Drain-Source Voltage 30

VGSS Gate-Source Voltage ±20 V

ID* Continuous Drain Current 8

IDM* 300µs Pulsed Drain Current VGS=10V

30 A

IS* Diode Continuous Forward Current 2.5 A

TJ Maximum Junction Temperature 150

TSTG Storage Temperature Range -55 to 150 °C

TA=25°C 2 PD* Maximum Power Dissipation

TA=100°C 0.8 W

RθJA* Thermal Resistance-Junction to Ambient 62.5 °C/W

Note : *Surface Mounted on 1in2 pad area, t ≤ 10sec.

APM4812K Symbol Parameter Test Conditions

Min. Typ. Max. Unit

Static Characteristics

BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 30 - - V

VDS=24V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current

TJ=85°C - - 30 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1 1.5 2 V

IGSS Gate Leakage Current VGS=±20V, VDS=0V - - ±100 nA

VGS=10V, IDS=8A - 18 22 RDS(ON)

a Drain-Source On-state Resistance VGS=4.5V, IDS=5.6A - 26 34

Diodes Characteristicsb

VSDa Diode Forward Voltage ISD=2A, VGS=0V - 0.8 1.1 V

trrb Reverse Recovery Time - 16 - ns

qrrb Reverse Recovery Charge

ISD=8A, dlSD/dt=100A/µs - 8 - nc

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Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2008

APM4812K

www.anpec.com.tw3

Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)

APM4812K Symbol Parameter Test Conditions

Min. Typ. Max. Unit

Dynamic Characteristics b

RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 1.5 - Ω

Ciss Input Capacitance - 600 -

Coss Output Capacitance - 90 -

Crss Reverse Transfer Capacitance

VGS=0V, VDS=15V, Frequency=1.0MHz - 65 -

pF

td(ON) Turn-on Delay Time - 8 15

tr Turn-on Rise Time - 12 23

td(OFF) Turn-off Delay Time - 23 42

tf Turn-off Fall Time

VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω

- 4 8

ns

Gate Charge Characteristics b

Qg Total Gate Charge - 13.5 18

Qgs Gate-Source Charge - 1.3 -

Qgd Gate-Drain Charge

VDS=15V, VGS=10V, IDS=8A

- 3 -

nC

Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.

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Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2008

APM4812K

www.anpec.com.tw4

Typical Operating Characteristics

ID -

Dra

in C

urre

nt (A

)

Safe Operation Area

VDS - Drain - Source Voltage (V)

Power Dissipation

Pto

t - P

ower

(W)

Tj - Junction Temperature (°C)

ID -

Dra

in C

urre

nt (A

)

Drain Current

Tj - Junction Temperature (°C)

Thermal Transient Impedance

Square Wave Pulse Duration (sec)

Nor

mal

ized

Tra

nsie

nt T

herm

al R

esis

tanc

e

0 20 40 60 80 100 120 140 1600.0

0.5

1.0

1.5

2.0

2.5

TA=25oC

0 20 40 60 80 100 120 140 1600

2

4

6

8

10

TA=25oC,V

G=10V

0.01 0.1 1 10 1000.01

0.1

1

10

100

Rds(o

n) Li

mit

1s

TA=25oC

10ms

300µs

1ms

100ms

DC

1E-4 1E-3 0.01 0.1 1 10 300.01

0.1

1

2

Mounted on 1in2 padR

θJA : 62.5 oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

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Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2008

APM4812K

www.anpec.com.tw5

Typical Operating Characteristics (Cont.)

VDS - Drain - Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Output Characteristics

RD

S(O

N) - O

n - R

esis

tanc

e (m

Ω)

Drain-Source On Resistance

ID - Drain Current (A)

Drain-Source On Resistance

VGS - Gate - Source Voltage (V)

RD

S(O

N) -

On

- Res

ista

nce

(mΩ

)

Tj - Junction Temperature (°C)

Gate Threshold Voltage

Nor

mal

ized

Thr

esho

ld V

olta

ge

0.0 0.5 1.0 1.5 2.0 2.5 3.00

3

6

9

12

15

18

21

24

27

30

3V

VGS

=4,5,6,7,8,9,10V

0 5 10 15 20 25 305

10

15

20

25

30

35

40

VGS

=4.5V

VGS

=10V

2 3 4 5 6 7 8 9 1012

16

20

24

28

32

36

40

44

ID= 8A

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6IDS

= 250µA

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Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2008

APM4812K

www.anpec.com.tw6

Typical Operating Characteristics (Cont.)

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

Tj - Junction Temperature (°C) VSD - Source - Drain Voltage (V)

Source-Drain Diode Forward

IS -

Sou

rce

Cur

rent

(A)

VDS - Drain - Source Voltage (V)

C -

Cap

acita

nce

(pF)

Capacitance Gate Charge

QG - Gate Charge (nC)

VG

S -

Gat

e-so

urce

Vol

tage

(V)

0 2 4 6 8 10 12 140

1

2

3

4

5

6

7

8

9

10V

DS=15V

IDS

=8A

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.60.1

1

10

30

Tj=150oC

Tj=25oC

0 5 10 15 20 25 300

100

200

300

400

500

600

700

800

900

Frequency=1MHz

Crss

Coss

Ciss

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

VGS

= 10V

IDS

= 8A

RON

@Tj=25oC: 18mΩ

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Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2008

APM4812K

www.anpec.com.tw7

SOP-8

SYMBOL MIN. MAX.

1.75

0.10

0.17 0.25

0.25

A

A1

c

D

E

E1

e

h

L

MILLIMETERS

b 0.31 0.51

SOP-8

0.25 0.50

0.40 1.27

MIN. MAX.

INCHES

0.069

0.004

0.012 0.020

0.007 0.010

0.010 0.020

0.016 0.050

0

0.010

1.27 BSC 0.050 BSC

A2 1.25 0.049

0° 8 ° 0° 8 °

D

e

EE1

SEE VIEW A

cb

h X

45°

A

A1

A2

L

VIEW A

0.25

SEATING PLANEGAUGE PLANE

Note: 1. Follow JEDEC MS-012 AA. 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension “E” does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side.

3.80

5.80

4.80

4.00

6.20

5.00 0.189 0.197

0.228 0.244

0.150 0.157

Package Information

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Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2008

APM4812K

www.anpec.com.tw8

Application A H T1 C d D W E1 F 330.0±2.00

50 MIN. 12.4+2.00 -0.00

13.0+0.50 -0.20

1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.5±0.05

P0 P1 P2 D0 D1 T A0 B0 K0 SOP-8

4.0±0.10 8.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00

-0.40 6.40±0.20 5.20±0.20 2.10±0.20

(mm)

Carrier Tape & Reel Dimensions

H

T1

A

d

A

E1

AB

W

F

T

P0OD0

BA0

P2

K0

B0

SECTION B-B

SECTION A-A

OD1

P1

Devices Per Unit

Package Type Unit Quantity

SOP-8 Tape & Reel 2500

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Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2008

APM4812K

www.anpec.com.tw9

Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles

Reflow Condition (IR/Convection or VPR Reflow)

Reliability Test Program

t 25 C to Peak

tp

Ramp-up

tL

Ramp-downts

Preheat

Tsmax

Tsmin

TL

TP

25

Tem

per

atur

e

Time

Critical ZoneTL to TP

°

Taping Direction InformationSOP-8

USER DIRECTION OF FEED

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Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2008

APM4812K

www.anpec.com.tw10

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.

Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)

100°C 150°C

60-120 seconds

150°C 200°C

60-180 seconds

Time maintained above: - Temperature (TL) - Time (tL)

183°C 60-150 seconds

217°C 60-150 seconds

Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)

10-30 seconds 20-40 seconds

Ramp-down Rate 6°C/second max. 6°C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.

Table 2. Pb-free Process – Package Classification Reflow Temperatures

Package Thickness Volume mm3 <350

Volume mm3 350-2000

Volume mm3 >2000

<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*

≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.

Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures

Package Thickness Volume mm3

<350 Volume mm3

≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C

Customer Service

Anpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838Fax : 886-2-2917-3838

Classification Reflow Profiles

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N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. B.3 - Jan., 2009

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.

APM4320K

Features

Applications

Pin Description

Ordering and Marking InformationN-Channel MOSFET

• 30V/13A,

RDS(ON ) = 7.5mΩ(typ.) @ VGS = 10VRDS(ON) =10.5mΩ(typ.) @ VGS = 4.5V

• Super High Dense Cell Design

• Reliable and Rugged

• SOP-8 Package

• Lead Free and Green Devices Available (RoHS Compliant)

Top View of SOP−8

• Power Management in Notebook Computer,Portable Equipment and Battery PoweredSystems

G

S

D D( 5,6,7,8 )

(4)

(1, 2, 3)

DD

SS

SS

SG

DD

DD

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).

APM4320

Handling CodeTemperature RangePackage Code

Package Code K : SOP-8Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material G : Halogen and Lead Free Device

APM4320 K :APM4320XXXXX XXXXX - Date Code

Assembly Material

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Copyright ANPEC Electronics Corp.Rev. B.3 - Jan., 2009

www.anpec.com.tw2

APM4320K

Absolute Maximum Ratings (TA = 25°C unless otherwise noted)

Electrical Characteristics (TA = 25°C unless otherwise noted)

Symbol Parameter Rating Unit

VDSS Drain-Source Voltage 30

VGSS Gate-Source Voltage ±20 V

ID* Continuous Drain Current 13

IDM* 300µs Pulsed Drain Current VGS=10V

50 A

IS* Diode Continuous Forward Current 2.8 A

TJ Maximum Junction Temperature 150

TSTG Storage Temperature Range -55 to 150 °C

TA=25°C 2 PD* Maximum Power Dissipation

TA=100°C 0.8 W

RθJA* Thermal Resistance-Junction to Ambient 62.5 °C/W

Note : *Surface Mounted on 1in2 pad area, t ≤ 10sec.

APM4320K Symbol Parameter Test Conditions

Min. Typ. Max. Unit

Static Characteristics

BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 30 - - V

VDS=24V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current

TJ=85°C - - 30 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1.3 1.8 2.5 V

IGSS Gate Leakage Current VGS=±20V, VDS=0V - - ±100 nA

VGS=10V, IDS=13A - 7.5 9.5 RDS(ON)

a Drain-Source On-state Resistance VGS=4.5V, IDS=7A - 10.5 13.5

VSDa Diode Forward Voltage ISD=2.8A, VGS=0V - 0.7 1.1 V

Gate Charge Characteristics b

Qg Total Gate Charge - 35 50

Qgs Gate-Source Charge - 6 -

Qgd Gate-Drain Charge

VDS=15V, VGS=10V, IDS=13A

- 11 -

nC

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Copyright ANPEC Electronics Corp.Rev. B.3 - Jan., 2009

www.anpec.com.tw3

APM4320K

Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)

APM4320K Symbol Parameter Test Conditions

Min. Typ. Max. Unit

Dynamic Characteristics b

RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 2 - Ω

Ciss Input Capacitance - 2310 -

Coss Output Capacitance - 350 -

Crss Reverse Transfer Capacitance

VGS=0V, VDS=15V, Frequency=1.0MHz - 210 -

pF

td(ON) Turn-on Delay Time - 15 28

Tr Turn-on Rise Time - 11 21

td(OFF) Turn-off Delay Time - 45 82

Tf Turn-off Fall Time

VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω

- 18 33

ns

trr Reverse Recovery Time - 18 - ns

qrr Reverse Recovery Charge ISD=13A, dlSD/dt=100A/µs

- 9 - nC Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.

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Copyright ANPEC Electronics Corp.Rev. B.3 - Jan., 2009

www.anpec.com.tw4

APM4320K

Typical Operating Characteristics

ID -

Dra

in C

urre

nt (A

)

Drain Current

Tj - Junction Temperature (°C)

Safe Operation Area

VDS - Drain - Source Voltage (V)

Nor

mal

ized

Tra

nsie

nt T

herm

al R

esis

tanc

e

Thermal Transient Impedance

Square Wave Pulse Duration (sec)

Power Dissipation

Pto

t - P

ower

(W)

Tj - Junction Temperature (°C)

ID -

Dra

in C

urre

nt (A

)

0 20 40 60 80 100 120 140 1600.0

0.5

1.0

1.5

2.0

2.5

TA=25oC

0.01 0.1 1 10 1000.01

0.1

1

10

100

Rds(o

n) L

imit

1s

TA=25oC

10ms

300µs

1ms

100ms

DC

1E-4 1E-3 0.01 0.1 1 10 301E-3

0.01

0.1

1

2

Mounted on 1in2 padR

θJA : 62.5 oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

0 20 40 60 80 100 120 140 1600

3

6

9

12

15

TA=25oC,V

G=10V

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Copyright ANPEC Electronics Corp.Rev. B.3 - Jan., 2009

www.anpec.com.tw5

APM4320K

RD

S(O

N) - O

n - R

esis

tanc

e (m

Ω)

Drain-Source On Resistance

ID - Drain Current (A)

Tj - Junction Temperature (°C)

Gate Threshold Voltage

VDS - Drain-Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Output Characteristics

VGS - Gate - Source Voltage (V)

Nor

mal

ized

Thr

esho

ld V

olta

ge

Typical Operating Characteristics (Cont.)

0.0 0.5 1.0 1.5 2.0 2.5 3.00

5

10

15

20

25

30

35

40

45

50

3.5V

3V

4V

VGS

=5,6,7,8,9,10V

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6IDS

=250µA

RD

S(O

N) -

On

- Res

ista

nce

(mΩ

)

Drain-Source On Resistance

0 10 20 30 40 502

4

6

8

10

12

14

16

18

VGS

=10V

VGS

=4.5V

1 2 3 4 5 6 7 8 9 100

5

10

15

20

25

30

ID= 13A

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Copyright ANPEC Electronics Corp.Rev. B.3 - Jan., 2009

www.anpec.com.tw6

APM4320K

VDS - Drain - Source Voltage (V)

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

Tj - Junction Temperature (°C)

C -

Cap

acita

nce

(pF)

VSD - Source - Drain Voltage (V)

Source-Drain Diode Forward

IS -

Sou

rce

Cur

rent

(A)

Capacitance Gate Charge

QG - Gate Charge (nC)

VG

S -

Gat

e - s

ourc

e V

olta

ge (V

)

Typical Operating Characteristics (Cont.)

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.40.3

1

10

50

Tj=150oC

Tj=25oC

0 5 10 15 20 25 300

500

1000

1500

2000

2500

3000

3500

Frequency=1MHz

Crss

Coss

Ciss

0 5 10 15 20 25 30 350

1

2

3

4

5

6

7

8

9

10V

DS= 15V

ID= 13A

-50 -25 0 25 50 75 100 125 1500.00

0.25

0.50

0.75

1.00

1.25

1.50

1.75

RON

@Tj=25oC: 7.5mΩ

VGS

= 10V

IDS

= 13A

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Copyright ANPEC Electronics Corp.Rev. B.3 - Jan., 2009

www.anpec.com.tw7

APM4320K

Package Information

SOP-8

SYMBOL MIN. MAX.

1.75

0.10

0.17 0.25

0.25

A

A1

c

D

E

E1

e

h

L

MILLIMETERS

b 0.31 0.51

SOP-8

0.25 0.50

0.40 1.27

MIN. MAX.

INCHES

0.069

0.004

0.012 0.020

0.007 0.010

0.010 0.020

0.016 0.050

0

0.010

1.27 BSC 0.050 BSC

A2 1.25 0.049

0° 8 ° 0° 8 °

D

e

EE1

SEE VIEW A

cb

h X

45°

A

A1

A2

L

VIEW A

0.25

SEATING PLANEGAUGE PLANE

Note: 1. Follow JEDEC MS-012 AA. 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension “E” does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side.

3.80

5.80

4.80

4.00

6.20

5.00 0.189 0.197

0.228 0.244

0.150 0.157

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Copyright ANPEC Electronics Corp.Rev. B.3 - Jan., 2009

www.anpec.com.tw8

APM4320K

Application A H T1 C d D W E1 F 330.0±2.00

50 MIN. 12.4+2.00 -0.00

13.0+0.50 -0.20

1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.5±0.05

P0 P1 P2 D0 D1 T A0 B0 K0 SOP-8

4.0±0.10 8.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00

-0.40 6.40±0.20 5.20±0.20 2.10±0.20

(mm)

Carrier Tape & Reel Dimensions

H

T1

A

d

A

E1

AB

W

F

T

P0OD0

BA0

P2

K0

B0

SECTION B-B

SECTION A-A

OD1

P1

Devices Per Unit

Package Type Unit Quantity

SOP-8 Tape & Reel 2500

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APM4320K

Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles

Reflow Condition (IR/Convection or VPR Reflow)

Reliability Test Program

t 25 C to Peak

tp

Ramp-up

tL

Ramp-downts

Preheat

Tsmax

Tsmin

TL

TP

25

Tem

per

atur

e

Time

Critical ZoneTL to TP

°

Taping Direction InformationSOP-8

USER DIRECTION OF FEED

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Copyright ANPEC Electronics Corp.Rev. B.3 - Jan., 2009

www.anpec.com.tw10

APM4320K

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.

Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)

100°C 150°C

60-120 seconds

150°C 200°C

60-180 seconds

Time maintained above: - Temperature (TL) - Time (tL)

183°C 60-150 seconds

217°C 60-150 seconds

Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)

10-30 seconds 20-40 seconds

Ramp-down Rate 6°C/second max. 6°C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.

Table 2. Pb-free Process – Package Classification Reflow Temperatures

Package Thickness Volume mm3 <350

Volume mm3 350-2000

Volume mm3 >2000

<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*

≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.

Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures

Package Thickness Volume mm3

<350 Volume mm3

≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C

Customer ServiceAnpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838Fax : 886-2-2917-3838

Classification Reflow Profiles

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N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. B.3 - Nov., 2008

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.

APM4330KC

Features

Applications

• Power Management in Notebook Computer,

Portable Equipment and Battery Powered Sys-tems

Pin Description

Ordering and Marking InformationN-Channel MOSFET

Top View of SOP − 8

• 30V/15A,

RDS(ON) = 5.5mΩ(typ.) @ VGS = 10VRDS(ON) =7mΩ(typ.) @ VGS = 4.5V

• Super High Dense Cell Design

• Reliable and Rugged

• SOP-8 Package

• Lead Free and Green Devices Available (RoHS Compliant)

G

S

D D( 5,6,7,8 )

(4)

(1, 2, 3)

DD

SS

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).

APM4330

Handling CodeTemperature RangePackage Code

Package Code K : SOP-8Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material L : Lead Free Device G : Halogen and Lead Free Device

APM4330 K :APM4330XXXXX XXXXX - Date Code

Assembly Material

SS

SG

DD

DD

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Copyright ANPEC Electronics Corp.Rev. B.3 - Nov., 2008

www.anpec.com.tw2

APM4330KC

Absolute Maximum Ratings (TA = 25°C unless otherwise noted)

Electrical Characteristics (TA = 25°C unless otherwise noted)

Symbol Parameter Rating Unit

VDSS Drain-Source Voltage 30

VGSS Gate-Source Voltage ±20 V

ID* Continuous Drain Current 15

IDM* 300µs Pulsed Drain Current VGS=10V

60 A

IS* Diode Continuous Forward Current 2.8 A

TJ Maximum Junction Temperature 150

TSTG Storage Temperature Range -55 to 150 °C

TA=25°C 2 PD* Maximum Power Dissipation

TA=100°C 0.8 W

RθJA* Thermal Resistance-Junction to Ambient 62.5 °C/W

Note : *Surface Mounted on 1in2 pad area, t ≤ 10sec.

APM4330K Symbol Parameter Test Conditions

Min. Typ. Max. Unit

STATIC CHARACTERISTICS

BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 30 - - V

VDS=24V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current

TJ=85°C - - 30 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1.3 1.8 2.5 V

IGSS Gate Leakage Current VGS=±20V, VDS=0V - - ±100 nA

VGS=10V, IDS=15A - 5.5 6.6 RDS(ON)

a Drain-Source On-State Resistance VGS=4.5V, IDS=11.5A - 7 9

VSDa Diode Forward Voltage ISD=2.8A, VGS=0V - 0.7 1.1 V

GATE CHARGE CHARACTERISTICS b

Qg Total Gate Charge - 55 77

Qgs Gate-Source Charge - 8 -

Qgd Gate-Drain Charge

VDS=15V, VGS=10V, IDS=15A

- 14 -

nC

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Copyright ANPEC Electronics Corp.Rev. B.3 - Nov., 2008

www.anpec.com.tw3

APM4330KC

Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)

APM4330K Symbol Parameter Test Conditions

Min. Typ. Max. Unit

DYNAMIC CHARACTERISTICSb

RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 1.4 - Ω

Ciss Input Capacitance - 3130 -

Coss Output Capacitance - 545 -

Crss Reverse Transfer Capacitance

VGS=0V, VDS=15V, Frequency=1.0MHz - 330 -

pF

td(ON) Turn-on Delay Time - 18 33

tr Turn-on Rise Time - 12 23

td(OFF) Turn-off Delay Time - 59 107

tf Turn-off Fall Time

VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω

- 26 48

ns

trr Reverse Recovery Time - 19 - ns

qrr Reverse Recovery Charge ISD=15A, dlSD/dt=100A/µs

- 6 - nC Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.

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Copyright ANPEC Electronics Corp.Rev. B.3 - Nov., 2008

www.anpec.com.tw4

APM4330KC

Typical Operating Characteristics

I D -

Dra

in C

urre

nt (A

)

Drain Current

TJ - Junction Temperature (°C)

Safe Operation Area

VDS - Drain - Source Voltage (V)

Nor

mal

ized

Tra

nsie

nt T

herm

al R

esis

tanc

e

Thermal Transient Impedance

Square Wave Pulse Duration (sec)

Power Dissipation

Pto

t - P

ower

(W)

TJ- Junction Temperature (°C)

I D -

Dra

in C

urre

nt (A

)

0 20 40 60 80 100 120 140 1600.0

0.5

1.0

1.5

2.0

2.5

TA=25oC

0.01 0.1 1 10 1000.01

0.1

1

10

100

Rds(on

) Lim

it

1s

TA=25oC

10ms

300µs

1ms

100ms

DC

1E-4 1E-3 0.01 0.1 1 10 301E-3

0.01

0.1

1

2

Mounted on 1in2 padR

θJA : 62.5 oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

0 20 40 60 80 100 120 140 1600

3

6

9

12

15

18

TA=25oC,V

G=10V

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Copyright ANPEC Electronics Corp.Rev. B.3 - Nov., 2008

www.anpec.com.tw5

APM4330KC

RD

S(O

N) -

On

- R

esis

tanc

e (m

Ω)

Drain-Source On Resistance

ID - Drain Current (A)

TJ - Junction Temperature (°C)

Gate Threshold Voltage

VDS - Drain-Source Voltage (V)

I D -

Dra

in C

urre

nt (A

)

Output Characteristics

VGS - Gate - Source Voltage (V)

Nor

mal

ized

Thr

esho

ld V

olta

ge

0.0 0.5 1.0 1.5 2.0 2.5 3.00

10

20

30

40

50

60

3V

2.5V

3.5VV

GS=4,5,6,7,8,9,10V

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

IDS

=250µA

RD

S(O

N) -

On

- R

esis

tanc

e (m

Ω)

Drain-Source On Resistance

0 10 20 30 40 50 603

4

5

6

7

8

9

10

VGS

=10V

VGS

=4.5V

1 2 3 4 5 6 7 8 9 100

2

4

6

8

10

12

14

16

18

20

ID= 15A

Typical Operating Characteristics (Cont.)

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Copyright ANPEC Electronics Corp.Rev. B.3 - Nov., 2008

www.anpec.com.tw6

APM4330KC

VDS - Drain - Source Voltage (V)

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

TJ - Junction Temperature (°C)

C -

Cap

acita

nce

(pF)

VSD - Source - Drain Voltage (V)

Source-Drain Diode Forward

I S -

Sou

rce

Cur

rent

(A)

Capacitance Gate Charge

QG - Gate Charge (nC)

VG

S -

Gat

e - s

ourc

e V

olta

ge (V

)

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

RON

@Tj=25oC: 5.5mΩ

VGS

= 10V

IDS

= 15A

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.40.3

1

10

50

Tj=150oC

Tj=25oC

0 5 10 15 20 25 300

500

1000

1500

2000

2500

3000

3500

4000

4500

5000

Frequency=1MHz

Crss

Coss

Ciss

0 10 20 30 40 50 600

1

2

3

4

5

6

7

8

9

10V

DS= 15V

ID= 15A

Typical Operating Characteristics (Cont.)

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Copyright ANPEC Electronics Corp.Rev. B.3 - Nov., 2008

www.anpec.com.tw7

APM4330KC

Package Information

SOP-8

SYMBOL MIN. MAX.

1.75

0.10

0.17 0.25

0.25

A

A1

c

D

E

E1

e

h

L

MILLIMETERS

b 0.31 0.51

SOP-8

0.25 0.50

0.40 1.27

MIN. MAX.

INCHES

0.069

0.004

0.012 0.020

0.007 0.010

0.010 0.020

0.016 0.050

0

0.010

1.27 BSC 0.050 BSC

A2 1.25 0.049

0° 8 ° 0° 8 °

D

e

EE1

SEE VIEW A

cb

h X

45°

A

A1

A2

L

VIEW A

0.25

SEATING PLANEGAUGE PLANE

Note: 1. Follow JEDEC MS-012 AA. 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension “E” does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side.

3.80

5.80

4.80

4.00

6.20

5.00 0.189 0.197

0.228 0.244

0.150 0.157

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Copyright ANPEC Electronics Corp.Rev. B.3 - Nov., 2008

www.anpec.com.tw8

APM4330KC

Application A H T1 C d D W E1 F

330.0±2.00 50 MIN. 12.4+2.00 -0.00

13.0+0.50 -0.20

1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.5±0.05

P0 P1 P2 D0 D1 T A0 B0 K0 SOP-8

4.0±0.10 8.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00

-0.40 6.40±0.20 5.20±0.20 2.10±0.20

(mm)

Carrier Tape & Reel Dimensions

H

T1

A

d

A

E1

AB

W

F

T

P0OD0

BA0

P2

K0

B0

SECTION B-B

SECTION A-A

OD1

P1

Devices Per Unit

Package Type Unit Quantity

SOP-8 Tape & Reel 2500

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Copyright ANPEC Electronics Corp.Rev. B.3 - Nov., 2008

www.anpec.com.tw9

APM4330KC

Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles

Reflow Condition (IR/Convection or VPR Reflow)

Reliability Test Program

t 25 C to Peak

tp

Ramp-up

tL

Ramp-downts

Preheat

Tsmax

Tsmin

TL

TP

25

Tem

per

atur

e

Time

Critical ZoneTL to TP

°

Taping Direction InformationSOP-8

USER DIRECTION OF FEED

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Copyright ANPEC Electronics Corp.Rev. B.3 - Nov., 2008

www.anpec.com.tw10

APM4330KC

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.

Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)

100°C 150°C

60-120 seconds

150°C 200°C

60-180 seconds

Time maintained above: - Temperature (TL) - Time (tL)

183°C 60-150 seconds

217°C 60-150 seconds

Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)

10-30 seconds 20-40 seconds

Ramp-down Rate 6°C/second max. 6°C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.

Table 2. Pb-free Process – Package Classification Reflow Temperatures

Package Thickness Volume mm3 <350

Volume mm3 350-2000

Volume mm3 >2000

<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*

≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.

Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures

Package Thickness Volume mm3

<350 Volume mm3

≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C

Customer ServiceAnpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838Fax : 886-2-2917-3838

Classification Reflow Profiles

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N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. A.2 - Jan., 2009

APM4340K

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, andadvise customers to obtain the latest version of relevant information to verify before placing orders.

Ordering and Marking Information

Features

Applications

• 30V/17A,

RDS(ON)=3.8mΩ (typ.) @ VGS=10VRDS(ON)=5mΩ (typ.) @ VGS=4.5V

• Super High Dense Cell Design

• Avalanche Rated

• Reliable and Rugged

• Lead Free and Green Devices Available

(RoHS Compliant)

N-Channel MOSFET

Top View of SOP−8

Pin Description

• Power Management in Notebook Computer,

Portable Equipment and Battery PoweredSystems

SS

SG

DD

DD

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).

G

S

D D( 5,6,7,8 )

(4)

(1, 2, 3)

DD

SS

APM4340

Handling Code

Temperature Range

Package Code

Package Code K : SOP-8Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material G : Halogen and Lead Free Device

APM4340 K :APM4340XXXXX XXXXX - Date Code

Assembly Material

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Copyright ANPEC Electronics Corp.Rev. A.2 - Jan., 2009

APM4340K

www.anpec.com.tw2

Electrical Characteristics (TA = 25°C unless otherwise noted)

Absolute Maximum Ratings (TA = 25°C unless otherwise noted)

Symbol Parameter Rating Unit

VDSS Drain-Source Voltage 30

VGSS Gate-Source Voltage ±20 V

ID* Continuous Drain Current 17

IDM* 300µs Pulsed Drain Current VGS = 10V

60 A

IS* Diode Continuous Forward Current 3 A

TJ Maximum Junction Temperature 150

TSTG Storage Temperature Range -55 to 150 °C

TA = 25°C 2 PD* Maximum Power Dissipation

TA = 100°C 0.8 W

RθJA* Thermal Resistance-Junction to Ambient 62.5 °C/W

Note : *Surface Mounted on 1in2 pad area, t ≤ 10sec.

APM4340K Symbol Parameter Test Conditions

Min. Typ. Max. Unit

Static Characteristics

BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 30 - - V

VDS=24V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current

TJ=85°C - - 30 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1.3 1.8 2.5 V

IGSS Gate Leakage Current VGS=±20V, VDS=0V - - ±100 nA

VGS=10V, IDS=17A - 3.8 4.5 RDS(ON)

a Drain-Source On-state Resistance VGS=4.5V, IDS=12A - 5 6.3

VSDa Diode Forward Voltage ISD=3A,VGS=0V - 0.7 1.3 V

Gate Charge Characteristics b

Qg Total Gate Charge - 108 151

Qgs Gate-Source Charge - 17 -

Qgd Gate-Drain Charge

VDS=15V, VGS=10V, IDS=17A

- 22 -

nC

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Copyright ANPEC Electronics Corp.Rev. A.2 - Jan., 2009

APM4340K

www.anpec.com.tw3

Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)

APM4340K Symbol Parameter Test Conditions

Min. Typ. Max. Unit

Dynamic Characteristics b

RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 1.3 - Ω

Ciss Input Capacitance - 5600 -

Coss Output Capacitance - 800 -

Crss Reverse Transfer Capacitance

VGS=0V, VDS=15V, Frequency=1.0MHz - 550 -

pF

td(ON) Turn-on Delay Time - 21 39

Tr Turn-on Rise Time - 20 37

td(OFF) Turn-off Delay Time - 111 201

Tf Turn-off Fall Time

VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω

- 47 86

ns

trrb Reverse Recovery Time - 40 - ns

qrrb Reverse Recovery Charge

ISD=17A, dlSD/dt=100A/µs - 37 - nC

Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.

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Copyright ANPEC Electronics Corp.Rev. A.2 - Jan., 2009

APM4340K

www.anpec.com.tw4

Typical Operating Characteristics

ID -

Dra

in C

urre

nt (A

)

Safe Operation Area

VDS - Drain - Source Voltage (V)

Power Dissipation

Pto

t - P

ower

(W)

Tj - Junction Temperature (°C)

ID -

Dra

in C

urre

nt (A

)

Drain Current

Tj - Junction Temperature (°C)

Thermal Transient Impedance

Square Wave Pulse Duration (sec)

Nor

mal

ized

Tra

nsie

nt T

herm

al R

esis

tanc

e

0 20 40 60 80 100 120 140 1600.0

0.5

1.0

1.5

2.0

2.5

TA=25oC

0 20 40 60 80 100 120 140 1600

4

8

12

16

20

TA=25oC,V

G=10V

1E-4 1E-3 0.01 0.1 1 10 301E-3

0.01

0.1

1

2

Mounted on 1in2 padR

θJA : 62.5 oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

0.01 0.1 1 10 1000.01

0.1

1

10

100

200

Rds(on

) Lim

it

1s

TA=25oC

10ms

300µs

1ms

100ms

DC

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Copyright ANPEC Electronics Corp.Rev. A.2 - Jan., 2009

APM4340K

www.anpec.com.tw5

Typical Operating Characteristics (Cont.)

VDS - Drain - Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Output Characteristics

RD

S(O

N) - O

n - R

esis

tanc

e (m

Ω)

Drain-Source On Resistance

ID - Drain Current (A)

Drain-Source On Resistance

VGS - Gate - Source Voltage (V)

RD

S(O

N) -

On

- Res

ista

nce

(mΩ

)

Tj - Junction Temperature (°C)

Gate Threshold Voltage

Nor

mal

ized

Thr

esho

ld V

olta

ge

1 2 3 4 5 6 7 8 9 100

2

4

6

8

10

12

14

16

ID= 17A

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

IDS

=250µA

0.0 0.5 1.0 1.5 2.0 2.5 3.00

10

20

30

40

50

60

3V

VGS

=3.5,4,5,6,7,8,9,10V

0 10 20 30 40 50 601

2

3

4

5

6

7

8

VGS

=10V

VGS

=4.5V

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Copyright ANPEC Electronics Corp.Rev. A.2 - Jan., 2009

APM4340K

www.anpec.com.tw6

Typical Operating Characteristics (Cont.)

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

Tj - Junction Temperature (°C) VSD - Source - Drain Voltage (V)

Source-Drain Diode Forward

IS -

Sou

rce

Cur

rent

(A)

VDS - Drain - Source Voltage (V)

C -

Cap

acita

nce

(pF)

Capacitance Gate Charge

QG - Gate Charge (nC)

VG

S -

Gat

e-so

urce

Vol

tage

(V)

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

RON

@Tj=25oC: 3.8mΩ

VGS

= 10V

IDS

= 17A

0 5 10 15 20 25 300

1000

2000

3000

4000

5000

6000

7000

8000

9000

Frequency=1MHz

Crss

Coss

Ciss

0 20 40 60 80 100 1200

1

2

3

4

5

6

7

8

9

10V

DS= 15V

ID= 17A

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.40.4

1

10

60

Tj=150oC

Tj=25oC

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Copyright ANPEC Electronics Corp.Rev. A.2 - Jan., 2009

APM4340K

www.anpec.com.tw7

SOP-8

SYMBOL MIN. MAX.

1.75

0.10

0.17 0.25

0.25

A

A1

c

D

E

E1

e

h

L

MILLIMETERS

b 0.31 0.51

SOP-8

0.25 0.50

0.40 1.27

MIN. MAX.

INCHES

0.069

0.004

0.012 0.020

0.007 0.010

0.010 0.020

0.016 0.050

0

0.010

1.27 BSC 0.050 BSC

A2 1.25 0.049

0° 8 ° 0° 8 °

D

e

EE1

SEE VIEW A

cb

h X

45°

A

A1

A2

L

VIEW A

0.25

SEATING PLANEGAUGE PLANE

Note: 1. Follow JEDEC MS-012 AA. 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension “E” does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side.

3.80

5.80

4.80

4.00

6.20

5.00 0.189 0.197

0.228 0.244

0.150 0.157

Package Information

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Copyright ANPEC Electronics Corp.Rev. A.2 - Jan., 2009

APM4340K

www.anpec.com.tw8

Application A H T1 C d D W E1 F 330.0±2.00

50 MIN. 12.4+2.00 -0.00

13.0+0.50 -0.20

1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.5±0.05

P0 P1 P2 D0 D1 T A0 B0 K0 SOP-8

4.0±0.10 8.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00

-0.40 6.40±0.20 5.20±0.20 2.10±0.20

(mm)

Carrier Tape & Reel Dimensions

H

T1

A

d

A

E1

AB

W

F

T

P0OD0

BA0

P2

K0

B0

SECTION B-B

SECTION A-A

OD1

P1

Devices Per Unit

Package Type Unit Quantity

SOP-8 Tape & Reel 2500

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Copyright ANPEC Electronics Corp.Rev. A.2 - Jan., 2009

APM4340K

www.anpec.com.tw9

Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles

Reflow Condition (IR/Convection or VPR Reflow)

Reliability Test Program

t 25 C to Peak

tp

Ramp-up

tL

Ramp-downts

Preheat

Tsmax

Tsmin

TL

TP

25

Tem

per

atur

e

Time

Critical ZoneTL to TP

°

Taping Direction InformationSOP-8

USER DIRECTION OF FEED

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Copyright ANPEC Electronics Corp.Rev. A.2 - Jan., 2009

APM4340K

www.anpec.com.tw10

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.

Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)

100°C 150°C

60-120 seconds

150°C 200°C

60-180 seconds

Time maintained above: - Temperature (TL) - Time (tL)

183°C 60-150 seconds

217°C 60-150 seconds

Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)

10-30 seconds 20-40 seconds

Ramp-down Rate 6°C/second max. 6°C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.

Table 2. Pb-free Process – Package Classification Reflow Temperatures

Package Thickness Volume mm3 <350

Volume mm3 350-2000

Volume mm3 >2000

<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*

≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.

Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures

Package Thickness Volume mm3

<350 Volume mm3

≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C

Customer ServiceAnpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838Fax : 886-2-2917-3838

Classification Reflow Profiles

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N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. A.2 - Apr., 2008

APM4472K

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.

Ordering and Marking Information

Features

Applications

• 40V/12A, RDS(ON)= 7.5mΩ(typ.) @ VGS= 10V RDS(ON)= 10.5mΩ(typ.) @ VGS= 4.5V• Super High Dense Cell Design• Avalanche Rated• Reliable and Rugged

• Lead Free and Green Devices Available

(RoHS Compliant)

N-Channel MOSFET

Pin Description

• Inventer Application in LCM and LCD TV

Top View of SOP − 8

SS

SG

DD

DD

APM4472

Handling CodeTemp. RangePackage Code

Package Code K : SOP-8Operating Junction Temp. Range C : -55 to 150°CHandling Code TR : Tape & ReelAssembly Material L : Lead Free Device G : Halogen and Lead Free Device

APM4472 K : APM4472XXXXX XXXXX - Date Code

Assembly Material

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).

G

S

D DDD

SS

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Copyright ANPEC Electronics Corp.Rev. A.2 - Apr., 2008

APM4472K

www.anpec.com.tw2

Electrical Characteristics (TA = 25°C unless otherwise noted)

Absolute Maximum Ratings (TA = 25°C unless otherwise noted)

Symbol Parameter Rating Unit

VDSS Drain-Source Voltage 40

VGSS Gate-Source Voltage ±20 V

ID* Continuous Drain Current 12

IDM* 300µs Pulsed Drain Current VGS=10V

50 A

IS* Diode Continuous Forward Current 3 A

TJ Maximum Junction Temperature 150

TSTG Storage Temperature Range -55 to 150 °C

TA=25°C 2 PD* Maximum Power Dissipation

TA=100°C 0.8 W

RθJA* Thermal Resistance-Junction to Ambient 62.5 °C/W Note:

*Surface Mounted on 1in2 pad area, t ≤ 10sec.

APM4472K Symbol Parameter Test Condition

Min. Typ. Max. Unit

Static Characteristics BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 40 V

VDS=32V, VGS=0V 1 IDSS Zero Gate Voltage Drain Current

TJ=85°C 30 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1.3 2 3 V

IGSS Gate Leakage Current VGS=±20V, VDS=0V ±100 nA

VGS=10V, IDS=12A 7.5 9.5 RDS(ON)

a Drain-Source On-state Resistance VGS=4.5V, IDS=8A 10.5 14

Diodes Characteristics b VSD

a Diode Forward Voltage ISD=3A, VGS=0V 0.7 1.1 V

trrb Reverse Recovery Time 30 ns

qrrb Reverse Recovery Charge

ISD=12A, dlSD/dt=100A/µs 31 nC

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Copyright ANPEC Electronics Corp.Rev. A.2 - Apr., 2008

APM4472K

www.anpec.com.tw3

Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)

APM4472K Symbol Parameter Test Condition

Min. Typ. Max. Unit

Dynamic Characteristics b RG Gate Resistance VGS=0V,VDS=0V,F=1MHz 1.3 Ω

Ciss Input Capacitance 2600

Coss Output Capacitance 320

Crss Reverse Transfer Capacitance

VGS=0V, VDS=20V, Frequency=1.0MHz 220

pF

td(ON) Turn-on Delay Time 16 30

tr Turn-on Rise Time 13 24

td(OFF) Turn-off Delay Time 57 104

tf Turn-off Fall Time

VDD=20V, RL=20Ω, IDS=1A, VGEN=10V, RG=6Ω

21 39

ns

Gate Charge Characteristics b Qg Total Gate Charge 25 35

Qgs Gate-Source Charge 7

Qgd Gate-Drain Charge

VDS=20V, VGS=4.5V, IDS=12A

12

nC

Notes: a : Pulse test ; pulse width≤300µs, duty cycle≤2%. b : Guaranteed by design, not subject to production testing.

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Copyright ANPEC Electronics Corp.Rev. A.2 - Apr., 2008

APM4472K

www.anpec.com.tw4

Typical CharacteristicsID

- D

rain

Cur

rent

(A)

Safe Operation Area

VDS - Drain - Source Voltage (V)

Power Dissipation

Pto

t - P

ower

(W)

Tj - Junction Temperature (°C)

ID -

Dra

in C

urre

nt (A

)

Drain Current

Tj - Junction Temperature (°C)

Thermal Transient Impedance

Square Wave Pulse Duration (sec)

Nor

mal

ized

Tra

nsie

nt T

herm

al R

esis

tanc

e0 20 40 60 80 100 120 140 160

0.0

0.5

1.0

1.5

2.0

2.5

TA=25oC

0 20 40 60 80 100 120 140 1600

2

4

6

8

10

12

14

TA=25oC,V

G=10V

1E-4 1E-3 0.01 0.1 1 10 601E-3

0.01

0.1

1

2

Mounted on 1in2 padR

θJA : 62.5 oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

0.01 0.1 1 10 1000.01

0.1

1

10

100

300µs

1ms

Rds(o

n) L

imit

TC=25oC

10ms

100ms

DC

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Copyright ANPEC Electronics Corp.Rev. A.2 - Apr., 2008

APM4472K

www.anpec.com.tw5

Typical Characteristics (Cont.)

VDS - Drain - Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Output Characteristics

RD

S(O

N) -

On

- Res

ista

nce

(mΩ

)

Drain-Source On Resistance

ID - Drain Current (A)

Drain-Source On Resistance

VGS - Gate - Source Voltage (V)

RD

S(O

N) -

On

- Res

ista

nce

(mΩ

)

Tj - Junction Temperature (°C)

Gate Threshold Voltage

Nor

mal

ized

Thr

esho

ld V

olta

ge

0.0 0.5 1.0 1.5 2.0 2.5 3.00

5

10

15

20

25

30

35

40

45

50

3.5V

3V

VGS

=4,4.5,5,6,7,8,9,10V

0 10 20 30 40 505

6

7

8

9

10

11

12

13

14

15

VGS

=10V

VGS

=4.5V

2 3 4 5 6 7 8 9 104

6

8

10

12

14

16

18

20

ID=12A

-50 -25 0 25 50 75 100 125 1500.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6IDS

=250µA

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Copyright ANPEC Electronics Corp.Rev. A.2 - Apr., 2008

APM4472K

www.anpec.com.tw6

Typical Characteristics (Cont.)

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

Tj - Junction Temperature (°C) VSD - Source - Drain Voltage (V)

Source-Drain Diode Forward

IS -

Sou

rce

Cur

rent

(A)

VDS - Drain - Source Voltage (V)

C -

Cap

acita

nce

(pF)

Capacitance Gate Charge

QG - Gate Charge (nC)

VG

S -

Gat

e-so

urce

Vol

tage

(V)

-50 -25 0 25 50 75 100 125 1500.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

RON

@Tj=25oC: 7.5mΩ

VGS

= 10V

IDS

= 12A

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.40.2

1

10

50

Tj=150oC

Tj=25oC

0 5 10 15 20 25 300

500

1000

1500

2000

2500

3000

3500

4000

Frequency=1MHz

Crss

Coss

Ciss

0 10 20 30 40 50 600

1

2

3

4

5

6

7

8

9

10V

DS=20V

IDS

=12A

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Copyright ANPEC Electronics Corp.Rev. A.2 - Apr., 2008

APM4472K

www.anpec.com.tw7

SOP-8

Package Information

SYMBOL MIN. MAX.

1.75

0.10

0.17 0.25

0.25

A

A1

c

D

E

E1

e

h

L

MILLIMETERS

b 0.31 0.51

SOP-8

0.25 0.50

0.40 1.27

MIN. MAX.

INCHES

0.069

0.004

0.012 0.020

0.007 0.010

0.010 0.020

0.016 0.050

0

0.010

1.27 BSC 0.050 BSC

A2 1.25 0.049

0° 8 ° 0° 8 °

D

e

EE1

SEE VIEW A

cbh

X 4

A

A1

A2

L

VIEW A

0.25

SEATING PLANEGAUGE PLANE

Note: 1. Follow JEDEC MS-012 AA. 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension “E” does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side.

3.80

5.80

4.80

4.00

6.20

5.00 0.189 0.197

0.228 0.244

0.150 0.157

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Copyright ANPEC Electronics Corp.Rev. A.2 - Apr., 2008

APM4472K

www.anpec.com.tw8

Application A H T1 C d D W E1 F

330.0±2.00 50 MIN. 12.4+2.00 -0.00

13.0+0.50 -0.20

1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.5±0.05

P0 P1 P2 D0 D1 T A0 B0 K0 SOP-8

4.0±0.10 8.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00

-0.40 6.40±0.20 5.20±0.20 2.10±0.20

Carrier Tape & Reel Dimensions

H

T1

A

d

A

E1

AB

W

F

T

P0OD0

BA0

P2

K0

B0

SECTION B-B

SECTION A-A

OD1

P1

Package Type Unit Quantity

SOP-8 Tape & Reel 2500

Devices Per Unit

(mm)

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Copyright ANPEC Electronics Corp.Rev. A.2 - Apr., 2008

APM4472K

www.anpec.com.tw9

Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles

Reflow Condition (IR/Convection or VPR Reflow)

Classification Reflow ProfilesProfile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly

Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.

Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)

100°C 150°C

60-120 seconds

150°C 200°C

60-180 seconds

Time maintained above: - Temperature (TL) - Time (tL)

183°C 60-150 seconds

217°C 60-150 seconds

Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)

10-30 seconds 20-40 seconds

Ramp-down Rate 6°C/second max. 6°C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.

Reliability Test Program

t 25 C to Peak

tp

Ramp-up

tL

Ramp-downts

Preheat

Tsmax

Tsmin

TL

TP

25

Tem

per

atur

e

Time

Critical ZoneTL to TP

°

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APM4472K

www.anpec.com.tw10

Table 2. Pb-free Process – Package Classification Reflow Temperatures Package Thickness Volume mm3

<350 Volume mm3

350-2000 Volume mm3

>2000 <1.6 mm 260 +0°C* 260 +0°C* 260 +0°C*

1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C* ≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C*

*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.

Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures Package Thickness Volume mm3

<350 Volume mm3

≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C

Classification Reflow Profiles (Cont.)

Customer Service

Anpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838Fax : 886-2-2917-3838

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N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2009

APM4476K

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, andadvise customers to obtain the latest version of relevant information to verify before placing orders.

Ordering and Marking Information

Features

Applications

• 40V/7.5A,

RDS(ON)= 15mΩ (typ.) @ VGS= 10V

RDS(ON)= 22mΩ (typ.) @ VGS= 4.5V• Super High Dense Cell Design• Reliable and Rugged

• Lead Free and Green Devices Available

(RoHS Compliant)

N-Channel MOSFET

Pin Description

• Power Management in Notebook Computer,Portable Equipment and Battery Powered

Systems.

Top View of SOP- 8

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).

DD

D

SS

SG

D

(4)G

S

D DDD

SS

(5, 6, 7, 8)

(1 , 2 , 3)

APM4476

Handling Code

Temperature Range

Package Code

APM4476 K: APM4476XXXXX XXXXX - Date Code

Assembly Material

Package Code K : SOP-8Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material G : Halogen and Lead Free Device

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Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2009

APM4476K

www.anpec.com.tw2

Electrical Characteristics (TA = 25°C unless otherwise noted)

Absolute Maximum Ratings (TA = 25°C unless otherwise noted)

Symbol Parameter Rating Unit

VDSS Drain-Source Voltage 40

VGSS Gate-Source Voltage ±20 V

ID* Continuous Drain Current 7.5

IDM* 300µs Pulsed Drain Current VGS=10V

30 A

IS* Diode Continuous Forward Current 3 A

TJ Maximum Junction Temperature 150

TSTG Storage Temperature Range -55 to 150 °C

TA=25°C 2 PD* Maximum Power Dissipation

TA=100°C 0.8 W

RθJA* Thermal Resistance-Junction to Ambient 62.5 °C/W

Note: *Surface Mounted on 1in2 pad area, t ≤ 10sec.

APM4476K Symbol Parameter Test Conditions

Min. Typ. Max. Unit

Static Characteristics

BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 40 - - V

VDS=32V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current

TJ=85°C - - 30 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1.3 2 2.5 V

IGSS Gate Leakage Current VGS=±16V, VDS=0V - - ±10 µA

VGS=10V, IDS=7.5A - 15 20 RDS(ON)

a Drain-Source On-state Resistance VGS=4.5V, IDS=6A - 22 32

Diode Characteristics

VSDa Diode Forward Voltage ISD=3A, VGS=0V - 0.8 1.1 V

trr Reverse Recovery Time - 21 - ns

qrr Reverse Recovery Charge ISD=7.5A, dlSD/dt=100A/µs

- 15 - nC

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Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2009

APM4476K

www.anpec.com.tw3

Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)

APM4476K Symbol Parameter Test Conditions

Min. Typ. Max. Unit

Dynamic Characteristics b

RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 4 - Ω

Ciss Input Capacitance - 1050 -

Coss Output Capacitance - 130 -

Crss Reverse Transfer Capacitance

VGS=0V, VDS=20V, Frequency=1.0MHz - 100 -

pF

td(ON) Turn-on Delay Time - 10 19

tr Turn-on Rise Time - 10 19

td(OFF) Turn-off Delay Time - 37 68

tf Turn-off Fall Time

VDD=20V, RL=20Ω, IDS=1A, VGEN=10V, RG=6Ω

- 11 21

ns

Gate Charge Characteristics b

Qg Total Gate Charge - 22.3 31

Qgs Gate-Source Charge - 3.5 -

Qgd Gate-Drain Charge

VDS=20V, VGS=10V, IDS=7.5A

- 3.4 -

nC

Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.

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Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2009

APM4476K

www.anpec.com.tw4

Typical Operating Characteristics

ID -

Dra

in C

urre

nt (A

)

Safe Operation Area

VDS - Drain - Source Voltage (V)

Power Dissipation

Pto

t - P

ower

(W)

Tj - Junction Temperature (°C)

ID -

Dra

in C

urre

nt (A

)

Drain Current

Tj - Junction Temperature (°C)

Thermal Transient Impedance

Square Wave Pulse Duration (sec)

Nor

mal

ized

Effe

ctiv

e Tr

ansi

ent

0 20 40 60 80 100 120 140 1600.0

0.5

1.0

1.5

2.0

2.5

TA=25oC

0 20 40 60 80 100 120 140 1600

2

4

6

8

10

TA=25oC,V

G=10V

0.01 0.1 1 10 1000.01

0.1

1

10

100

1s

300µs

1ms

Rds(on

) Lim

it

TC=25oC

10ms

100ms

DC

1E-4 1E-3 0.01 0.1 1 10 601E-3

0.01

0.1

1

2

Mounted on 1in2 padR

θJA : 62.5 oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

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Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2009

APM4476K

www.anpec.com.tw5

Typical Operating Characteristics (Cont.)

VDS - Drain - Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Output Characteristics

RD

S(O

N) - O

n - R

esis

tanc

e (m

Ω)

Drain-Source On Resistance

ID - Drain Current (A)

Drain-Source On Resistance

VGS - Gate - Source Voltage (V)

RD

S(O

N) -

On

- Res

ista

nce

(mΩ

)

Tj - Junction Temperature (°C)

Gate Threshold Voltage

Nor

mal

ized

Thr

esho

ld V

olta

ge

0.0 0.5 1.0 1.5 2.0 2.5 3.00

5

10

15

20

25

30

3.5V

3V

VGS

=4,4.5,5,6,7,8,9,10V

0 5 10 15 20 25 308

12

16

20

24

28

32

VGS

=10V

VGS

=4.5V

2 3 4 5 6 7 8 9 1010

15

20

25

30

35

40

ID=7.5A

-50 -25 0 25 50 75 100 125 1500.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6IDS

=250µA

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Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2009

APM4476K

www.anpec.com.tw6

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

Tj - Junction Temperature (°C) VSD - Source - Drain Voltage (V)

Source-Drain Diode Forward

IS -

Sou

rce

Cur

rent

(A)

VDS - Drain - Source Voltage (V)

C -

Cap

acita

nce

(pF)

Capacitance Gate Charge

QG - Gate Charge (nC)

VG

S -

Gat

e-S

ourc

e V

olta

ge (V

)

-50 -25 0 25 50 75 100 125 1500.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

RON

@Tj=25oC: 15mΩ

VGS

= 10V

IDS

= 7.5A

0.0 0.3 0.6 0.9 1.2 1.50.2

1

10

30

Tj=150oC

Tj=25oC

0 5 10 15 20 25 30 35 400

200

400

600

800

1000

1200

1400

1600

Frequency=1MHz

CrssCoss

Ciss

0 4 8 12 16 20 240

1

2

3

4

5

6

7

8

9

10V

DS=20V

IDS

=7.5A

Typical Operating Characteristics (Cont.)

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Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2009

APM4476K

www.anpec.com.tw7

Package Information

SOP-8D

e

EE1

SEE VIEW A

cb

h X

45°

A

A1

A2

L

VIEW A0.

25

SEATING PLANEGAUGE PLANE

Note: 1. Follow JEDEC MS-012 AA. 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension “E” does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side.

SYMBOL MIN. MAX.

1.75

0.10

0.17 0.25

0.25

A

A1

c

D

E

E1

e

h

L

MILLIMETERS

b 0.31 0.51

SOP-8

0.25 0.50

0.40 1.27

MIN. MAX.

INCHES

0.069

0.004

0.012 0.020

0.007 0.010

0.010 0.020

0.016 0.050

0

0.010

1.27 BSC 0.050 BSC

A2 1.25 0.049

0° 8 ° 0° 8 °

3.80

5.80

4.80

4.00

6.20

5.00 0.189 0.197

0.228 0.244

0.150 0.157

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Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2009

APM4476K

www.anpec.com.tw8

Carrier Tape & Reel Dimensions

Application A H T1 C d D W E1 F

330.0±2.00 50 MIN. 12.4+2.00 -0.00

13.0+0.50 -0.20

1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.5±0.05

P0 P1 P2 D0 D1 T A0 B0 K0 SOP-8

4.0±0.10 8.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00

-0.40 6.40±0.20 5.20±0.20 2.10±0.20

(mm)

Devices Per Unit

Package Type Unit Quantity SOP- 8 Type & Reel 2500

H

T1

A

d

A

E1

AB

W

F

T

P0OD0

BA0

P2

K0

B0

SECTION B-B

SECTION A-A

OD1

P1

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Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2009

APM4476K

www.anpec.com.tw9

Taping Direction InformationSOP-8

USER DIRECTION OF FEED

Classification Profile

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Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2009

APM4476K

www.anpec.com.tw10

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly

Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts)

100 °C 150 °C

60-120 seconds

150 °C 200 °C

60-120 seconds

Average ramp-up rate (Tsmax to TP) 3 °C/second max. 3°C/second max.

Liquidous temperature (TL) Time at liquidous (tL)

183 °C 60-150 seconds

217 °C 60-150 seconds

Peak package body Temperature (Tp)*

See Classification Temp in table 1 See Classification Temp in table 2

Time (tP)** within 5°C of the specified classification temperature (Tc)

20** seconds 30** seconds

Average ramp-down rate (Tp to Tsmax) 6 °C/second max. 6 °C/second max.

Time 25°C to peak temperature 6 minutes max. 8 minutes max.

* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.

Classification Reflow Profiles

Table 2. Pb-free Process – Classification Temperatures (Tc)

Package Thickness

Volume mm3 <350

Volume mm3 350-2000

Volume mm3 >2000

<1.6 mm 260 °C 260 °C 260 °C 1.6 mm – 2.5 mm 260 °C 250 °C 245 °C

≥2.5 mm 250 °C 245 °C 245 °C

Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)

Package Thickness

Volume mm3

<350 Volume mm3

≥350

<2.5 mm 235 °C 220 °C

≥2.5 mm 220 °C 220 °C

Reliability Test Program

Test item Method Description SOLDERABILITY JESD-22, B102 5 Sec, 245°C HOLT JESD-22, A108 1000 Hrs, Bias @ 125°C PCT JESD-22, A102 168 Hrs, 100%RH, 2atm, 121°C TCT JESD-22, A104 500 Cycles, -65°C~150°C

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Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2009

APM4476K

www.anpec.com.tw11

Customer Service

Anpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838

Fax : 886-2-2917-3838

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N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. A.1 - Aug., 2008

APM4474K

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.

Ordering and Marking Information

Features

Applications

• 40V/11A,

• RDS(ON)= 9mΩ (typ.) @ VGS= 10V

• RDS(ON)= 18mΩ (typ.) @ VGS= 4.5V

• Super High Dense Cell Design

• Avalanche Rated

• Reliable and Rugged

• SOP-8 Package

• Lead Free and Green Devices Available

• (RoHS Compliant)

N-Channel MOSFET

Pin Description

• Power Management in LCD monitor/TV inverter.

Top View of SOP- 8

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; whichare fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C forMSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogenfree (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm byweight).

DD

D

SS

SG

D

G

S

D DDD

SS

APM4474

Handling Code

Temperature Range

Package Code

APM4474 K : APM4474XXXXX

XXXXX - Date Code

Assembly Material

Package Code K : SOP-8Operating Ambient Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material L : Lead Free Device G : Halogen and Lead Free Device

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Copyright ANPEC Electronics Corp.Rev. A.1 - Aug., 2008

APM4474K

www.anpec.com.tw2

Electrical Characteristics (TA = 25°C unless otherwise noted)

Absolute Maximum Ratings (TA = 25°C unless otherwise noted)

Symbol Parameter Rating Unit

VDSS Drain-Source Voltage 40

VGSS Gate-Source Voltage ±20 V

ID* Continuous Drain Current 11

IDM* 300µs Pulsed Drain Current VGS=10V

50 A

IS* Diode Continuous Forward Current 3 A

TJ Maximum Junction Temperature 150

TSTG Storage Temperature Range -55 to 150 °C

TA=25°C 2 PD* Maximum Power Dissipation

TA=100°C 0.8 W

RθJA* Thermal Resistance-Junction to Ambient 62.5 °C/W

Notes:*Surface Mounted on 1in2 pad area, t ≤ 10sec.

APM4474K Symbol Parameter Test Conditions

Min. Typ. Max. Unit

STATIC CHARACTERISTICS

BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 40 - - V

VDS=32V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current

TJ=85°C - - 30 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1.5 2 2.5 V

IGSS Gate Leakage Current VGS=±20V, VDS=0V - - ±100 nA

VGS=10V, IDS=11A - 9 11 RDS(ON)

a Drain-Source On-state Resistance VGS=4.5V, IDS=7A - 18 23

DIODE CHARACTERISTICS

VSDa Diode Forward Voltage ISD=3A, VGS=0V - 0.75 1.1 V

trr Reverse Recovery Time - 26 - ns

qrr Reverse Recovery Charge ISD=11A, dlSD/dt=100A/µs

- 20 - nC

DYNAMIC CHARACTERISTICS b

RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 2.3 - Ω

Ciss Input Capacitance - 1400 -

Coss Output Capacitance - 200 -

Crss Reverse Transfer Capacitance

VGS=0V, VDS=20V, Frequency=1.0MHz - 140 -

pF

td(ON) Turn-on Delay Time - 11 21

tr Turn-on Rise Time - 14 26

td(OFF) Turn-off Delay Time - 57 104

tf Turn-off Fall Time

VDD=20V, RL=20Ω, IDS=1A, VGEN=10V, RG=6Ω

- 30 55

ns

GATE CHARGE CHARACTERISTICS b

Qg Total Gate Charge - 29 41

Qgs Gate-Source Charge - 3.9 -

Qgd Gate-Drain Charge

VDS=20V, VGS=10V, IDS=11A

- 9.3 -

nC

Notes: a : Pulse test ; pulse width≤300µs, duty cycle≤2%. b : Guaranteed by design, not subject to production testing.

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Copyright ANPEC Electronics Corp.Rev. A.1 - Aug., 2008

APM4474K

www.anpec.com.tw3

Typical Characteristics

Power Dissipation Drain Current

Pto

t - P

ower

(W

)

Tj - Junction Temperature (oC)

0 20 40 60 80 100 120 140 1600.0

0.5

1.0

1.5

2.0

2.5

TA=25oC

0 20 40 60 80 100 120 140 1600

2

4

6

8

10

12

TA=25oC,VG=10V

Tj - Junction Temperature (oC)

I D -

Dra

in C

urre

nt (A

)

0.01 0.1 1 10 1000.01

0.1

1

10

100

300µs

DC

TC=25oC

1ms

10ms

100ms

1s

Rds(o

n) L

imit

Safe Operation Area

I D -

Dra

in C

urre

nt (A

)

VDS - Drain-Source Voltage (V)

Thermal Transient Impedance

Nor

mal

ized

Effe

ctiv

e T

rans

ient

Square Wave Pulse Duration (sec)

1E-4 1E-3 0.01 0.1 1 10 601E-3

0.01

0.1

1

2

Mounted on 1in2 padRθJA : 62.5oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

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Copyright ANPEC Electronics Corp.Rev. A.1 - Aug., 2008

APM4474K

www.anpec.com.tw4

Typical Characteristics (Cont.)

Output Characteristics

I D -

Dra

in C

urre

nt (A

)

VDS - Drain-Source Voltage (V)

Drain-Source On Resistance

RD

S(O

N) -

On

Res

ista

nce

(mΩ

)

ID - Drain Current (A)

Drain-Source On Resistance

RD

S(O

N) -

On

Res

ista

nce

(mΩ

)

VGS - Gate-Source Voltage (V)

Gate Threshold Voltage

Nor

mal

ized

Thr

esho

ld V

olta

ge

Tj - Junction Temperature (°C)

0.0 0.5 1.0 1.5 2.0 2.5 3.00

5

10

15

20

25

30

35

40

45

50

4V

4.5V

3.5V

VGS=5,5.5,6,7,8,9,10V

0 10 20 30 40 500

5

10

15

20

25

30

35

VGS=4.5V

VGS=10V

2 3 4 5 6 7 8 94

8

12

16

20

24

28

32IDS=11A

10 -50 -25 0 25 50 75 100 125 1500.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6IDS=250µA

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Copyright ANPEC Electronics Corp.Rev. A.1 - Aug., 2008

APM4474K

www.anpec.com.tw5

Typical Characteristics (Cont.)

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

Tj - Junction Temperature (°C)

Source-Drain Diode Forward

I S -

Sou

rce

Cur

rent

(A

)

VSD - Source-Drain Voltage (V)

Capacitance

C -

Cap

acita

nce

(pF)

Tj - Junction Temperature (oC)

VG

S -

Gat

e-S

ourc

e V

olta

ge (

V)

QG - Gate Charge (nC)

-50 -25 0 25 50 75 100 125 1500.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

RON@Tj=25oC: 9mΩ

VGS=10VIDS=11A

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.40.1

1

10

50

Tj=150oC

Tj=25oC

0 5 10 15 20 25 30 35 400

300

600

900

1200

1500

1800

2100Frequency=1MHz

Coss

Ciss

Crss

Gate Charge

0 5 10 15 20 25 300

1

2

3

4

5

6

7

8

9

10VDS=20VIDS=11A

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Copyright ANPEC Electronics Corp.Rev. A.1 - Aug., 2008

APM4474K

www.anpec.com.tw6

Package Information

SOP-8

SYMBOL MIN. MAX.

1.75

0.10

0.17 0.25

0.25

A

A1

c

D

E

E1

e

h

L

MILLIMETERS

b 0.31 0.51

SOP-8

0.25 0.50

0.40 1.27

MIN. MAX.

INCHES

0.069

0.004

0.012 0.020

0.007 0.010

0.010 0.020

0.016 0.050

0

0.010

1.27 BSC 0.050 BSC

A2 1.25 0.049

0° 8 ° 0° 8 °

D

e

EE1

SEE VIEW A

cb

h X

45°

A

A1

A2

L

VIEW A0.

25SEATING PLANEGAUGE PLANE

Note: 1. Follow JEDEC MS-012 AA. 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension “E” does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side.

3.80

5.80

4.80

4.00

6.20

5.00 0.189 0.197

0.228 0.244

0.150 0.157

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Copyright ANPEC Electronics Corp.Rev. A.1 - Aug., 2008

APM4474K

www.anpec.com.tw7

Carrier Tape & Reel Dimensions

Application A H T1 C d D W E1 F

330.0±2.00 50 MIN. 12.4+2.00 -0.00

13.0+0.50 -0.20

1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.5±0.05

P0 P1 P2 D0 D1 T A0 B0 K0 SOP-8

4.0±0.10 8.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00

-0.40 6.40±0.20 5.20±0.20 2.10±0.20

(mm)

Devices Per Unit

Package Type Unit Quantity SOP- 8 Type & Reel 2500

H

T1

A

d

A

E1

AB

W

F

T

P0OD0

BA0

P2

K0

B0

SECTION B-B

SECTION A-A

OD1

P1

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Copyright ANPEC Electronics Corp.Rev. A.1 - Aug., 2008

APM4474K

www.anpec.com.tw8

Reflow Condition (IR/Convection or VPR Reflow)

Reliability Test Program

t 25 C to Peak

tp

Ramp-up

tL

Ramp-downts

Preheat

Tsmax

Tsmin

TL

TP

25

Tem

per

atur

e

Time

Critical ZoneTL to TP

°

Taping Direction Information

USER DIRECTION OF FEED

SOP-8

Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles ESD MIL-STD-883D-3015.7 VHBM > 2KV, VMM > 200V Latch-Up JESD 78 10ms, 1tr > 100mA

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Copyright ANPEC Electronics Corp.Rev. A.1 - Aug., 2008

APM4474K

www.anpec.com.tw9

Table 2. Pb-free Process – Package Classification Reflow Temperatures Package Thickness Volume mm3

<350 Volume mm3

350-2000 Volume mm3

>2000 <1.6 mm 260 +0°C* 260 +0°C* 260 +0°C*

1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C* ≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C*

*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.

Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures Package Thickness Volume mm3

<350 Volume mm3

≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C

Customer Service

Anpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838

Fax : 886-2-2917-3838

Classification Reflow ProfilesProfile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly

Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.

Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)

100°C 150°C

60-120 seconds

150°C 200°C

60-180 seconds

Time maintained above: - Temperature (TL) - Time (tL)

183°C 60-150 seconds

217°C 60-150 seconds

Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)

10-30 seconds 20-40 seconds

Ramp-down Rate 6°C/second max. 6°C/second max.

Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.

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N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. B.2 - Mar., 2008

APM4220KA

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.

Ordering and Marking Information

Features

Applications

• 25V/16A, RDS(ON)=7.5mΩ(typ.) @ VGS=10V RDS(ON)=10mΩ(typ.) @ VGS=4.5V• Super High Dense Cell Design• Avalanche Rated• Reliable and Rugged• Thermal Pad Exposed with Standard SOP-8 Outline• Lead Free and Green Devices Available (RoHS Compliant)

N-Channel MOSFET

SOP−8 Exposed

Pin Description

• Power Management in Notebook Computer,

Portable Equipment and Battery Powered Systems

= Thermal Pad (connected to Drain plane for better heatdissipation)

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).

APM4220

Handling CodeTemp. RangePackage Code

Package Code KA : SOP-8POperating Junction Temp. Range C : -55 to 150 CHandling Code TR : Tape & ReelAssembly Material L : Lead Free Device G : Halogen and Lead Free Device

APM4220 KA : APM4220XXXXX XXXXX - Date Code

Assembly Materialo

G

S

D D(5,6,7,8)

(4)

(1, 2, 3)

DD

SS

S1S2

S3G4

D6D5

D7D8

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Copyright ANPEC Electronics Corp.Rev. B.2 - Mar., 2008

APM4220KA

www.anpec.com.tw2

Symbol Parameter Rating Unit

Common Ratings (TA=25°C Unless Otherwise Noted)

VDSS Drain-Source Voltage 25

VGSS Gate-Source Voltage ±20 V

TJ Maximum Junction Temperature 150 °C

TSTG Storage Temperature Range -55 to 150 °C Mounted on Large Heat Sink

TC=25°C 50 PD Maximum Power Dissipation

TC=100°C 20 W

RθJC Thermal Resistance-Junction to Case 2.5 °C/W

Mounted on PCB of 1in2 Pad Areaj TA=25°C 50

IDP 300μs Pulse Drain Current Tested TA=100°C 25

A

TA=25°C 16 ID Continuous Drain Current

TA=100°C 8 A

TA=25°C 3 PD Maximum Power Dissipation

TA=100°C 1.2 W

RθJA Thermal Resistance-Junction to Ambient 40 °C/W

Mounted on PCB of Minimum Footprintk

TA=25°C 50 IDP 300μs Pulse Drain Current Tested

TA=100°C 25 A

TA=25°C 13 ID Continuous Drain Current

TA=100°C 6 A

TA=25°C 2.5 PD Maximum Power Dissipation

TA=100°C 1 W

RθJA Thermal Resistance-Junction to Minimum Footprint 50 °C/W

Absolute Maximum Ratings

j.The value of RθJA is when the device mounted on

1in2 pad with 2oz. Copper, t ≤ 10s.

Notes:

k. The value of RθJA is when the device mounted on

minimum pad with 2oz. Copper, t ≤ 10s.

Page 224: files.iczoom.com · A N P E C MOSFET TRANSISTORS N-Channel MOSFET TABLE OF CONTENT Pos. Series Drain Source Voltage Continue Drain Current Case Pages V DSS (V) I D (A) 01 APM 2050

Copyright ANPEC Electronics Corp.Rev. B.2 - Mar., 2008

APM4220KA

www.anpec.com.tw3

Notes:a: Pulse test ; pulse width ≤300µs, duty cycle ≤ 2%.b: Guaranteed by design, not subject to production testing.

APM4220KA Symbol Parameter Test Condition

Min. Typ. Max. Unit

Drain-Source Avalanche Ratings EAS Avalanche Energy, Single Pulsed ID=15A, VDD=15V 50 mJ

Static Characteristics BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 25 V

VDS=20V, VGS=0V 1

VDS=20V, VGS=0V IDSS Zero Gate Voltage Drain Current

TA=25°C 30

µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1.3 1.8 2.5 V

IGSS Gate Leakage Current VGS=±20V, VDS=0V ±100 nA

VGS=10V, IDS=16A 7.5 9 RDS(ON)

a Drain-Source On-state Resistance VGS=4.5V, IDS=14A 10 12

VSDa Diode Forward Voltage ISD=3A, VGS=0V 0.8 1.3 V

Gate Charge Characteristics b Qg Total Gate Charge 20 26

Qgs Gate-Source Charge 4.8

Qgd Gate-Drain Charge

VDS=10V, VGS=4.5V, IDS=12A

8.4

nC

Dynamic Characteristics b RG Gate Resistance VGS=0V, VDS=0V, f=1MHz 2 Ω

Ciss Input Capacitance 1785

Coss Output Capacitance 500

Crss Reverse Transfer Capacitance

VGS=0V, VDS=15V, Frequency=1.0MHz 300

pF

td(ON) Turn-on Delay Time 10 19

Tr Turn-on Rise Time 7 13

td(OFF) Turn-off Delay Time 69 95

Tf Turn-off Fall Time

VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω

32 46

ns

Electrical Characteristics (TA = 25°C unless otherwise noted)

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Copyright ANPEC Electronics Corp.Rev. B.2 - Mar., 2008

APM4220KA

www.anpec.com.tw4

1E-4 1E-3 0.01 0.1 1 10 301E-3

0.01

0.1

1

2

Mounted on 1in2 padR

θJA : 40 oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

Typical CharacteristicsID

- D

rain

Cur

rent

(A)

Safe Operation Area

VDS - Drain - Source Voltage (V)

Power Dissipation

Pto

t - P

ower

(W)

Tj - Junction Temperature (°C)

ID -

Dra

in C

urre

nt (A

)

Drain Current

Tj - Junction Temperature (°C)

Thermal Transient Impedance

Square Wave Pulse Duration (sec)

0 20 40 60 80 100 120 140 1600.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

0 20 40 60 80 100 120 140 1600

3

6

9

12

15

18

0.01 0.1 1 10 1000.01

0.1

1

10

100

Rds(o

n) L

imit

1s

TA=25OC

10ms

300µs

1ms

100ms

DC

Nor

mal

ized

Tra

nsie

nt T

herm

al R

esis

tanc

e

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Copyright ANPEC Electronics Corp.Rev. B.2 - Mar., 2008

APM4220KA

www.anpec.com.tw5

Typical Characteristics (Cont.)

VDS - Drain - Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Output Characteristics

RD

S(O

N) -

On

- Res

ista

nce

(mΩ

)

Drain-Source On Resistance

ID - Drain Current (A)

Transfer Characteristics

VGS - Gate - Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Tj - Junction Temperature (°C)

Gate Threshold Voltage

Nor

mal

ized

Thr

esho

ld V

olta

ge

0 2 4 6 8 100

10

20

30

40

50

VGS

=4,5,6,7,8,9,10V

3V

2.5V

0 10 20 30 40 500

2

4

6

8

10

12

14

16

18

VGS

=10V

VGS

=4.5V

0 1 2 3 4 50

10

20

30

40

50

Tj=125oC

Tj=25oC T

j=-55oC

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6IDS

=250µA

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Copyright ANPEC Electronics Corp.Rev. B.2 - Mar., 2008

APM4220KA

www.anpec.com.tw6

Typical Characteristics (Cont.)

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

Tj - Junction Temperature (°C) VSD - Source - Drain Voltage (V)

Source-Drain Diode Forward

IS -

Sou

rce

Cur

rent

(A)

VDS - Drain - Source Voltage (V)

C -

Cap

acita

nce

(pF)

Capacitance Gate Charge

QG - Gate Charge (nC)

VG

S -

Gat

e-so

urce

Vol

tage

(V)

-50 -25 0 25 50 75 100 125 1500.00

0.25

0.50

0.75

1.00

1.25

1.50

1.75

2.00

RON

@Tj=25oC: 7.5mΩ

VGS

= 10V

IDS

= 12A

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.60.1

1

10

50

Tj=150oC

Tj=25oC

0 5 10 15 20 250

500

1000

1500

2000

2500

3000

Frequency=1MHz

Coss

Ciss

Crss

0 5 10 15 20 25 30 35 400

1

2

3

4

5

6

7

8

9

10V

DS=10V

ID = 12A

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Copyright ANPEC Electronics Corp.Rev. B.2 - Mar., 2008

APM4220KA

www.anpec.com.tw7

td (on) tr td (off) t f

V GS

V DS

90%

10%

Avalanche Test Circuit and Waveforms

Switching Time Test Circuit and Waveforms

DUT

0.01Ωtp

V D D

V DSL

IL

RG

V DD

RD

DUT

V GS

V DS

RG

tp

EAS

V D D

tA V

IAS

V D S

tpV DSX(SU S)

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Copyright ANPEC Electronics Corp.Rev. B.2 - Mar., 2008

APM4220KA

www.anpec.com.tw8

Package Information

SOP-8P

0.020

0.010

0.020

0.050

0.006

0.063

MAX.

0.40L

0

E

e

h

E1

0.25

D

c

b

0.17

0.31

0.0161.27

0.50

1.27 BSC

0.51

0.25

0.050 BSC

0.010

0.012

0.007

MILLIMETERS

MIN.

SYMBOL

A1

A2

A

0.00

1.25

SOP-8P

MAX.

0.15

1.60

MIN.

0.000

0.049

INCHES

D1 2.25 0.098

2.00 0.079E2

3.50

3.00

0.138

0.118

8o 0o 8o0o

h X

45°

D

e

EE1

SEE VIEWA

cb

D1

E2THERMAL

PAD

A

0L

VIEW A

0.25

SEATING PLANEGAUGE PLANE

A1

A2

Inter-lead flash and protrusions shall not exceed 10 mil per side.

Note : 1. Follow JEDEC MS-012 BA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "E" does not include inter-lead flash or protrusions.

4.80 5.00

5.80 6.20

3.80 4.00

0.2440.228

0.1570.150

0.1970.189

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Copyright ANPEC Electronics Corp.Rev. B.2 - Mar., 2008

APM4220KA

www.anpec.com.tw9

Application A H T1 C d D W E1 F

330.0±2.00 50 MIN. 12.4+2.00 -0.00

13.0+0.50 -0.20

1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.5±0.05

P0 P1 P2 D0 D1 T A0 B0 K0 SOP-8P

4.0±0.10 8.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00

-0.40 6.40±0.20 5.20±0.20 2.10±0.20

Carrier Tape & Reel Dimensions

Package Type Unit Quantity

SOP-8P Tape & Reel 2500

Devices Per Unit

(mm)

H

T1

A

d

A

E1

AB

W

F

T

P0OD0

BA0

P2

K0

B0

SECTION B-B

SECTION A-A

OD1

P1

Page 231: files.iczoom.com · A N P E C MOSFET TRANSISTORS N-Channel MOSFET TABLE OF CONTENT Pos. Series Drain Source Voltage Continue Drain Current Case Pages V DSS (V) I D (A) 01 APM 2050

Copyright ANPEC Electronics Corp.Rev. B.2 - Mar., 2008

APM4220KA

www.anpec.com.tw10

Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles

Reflow Condition (IR/Convection or VPR Reflow)

Classification Reflow ProfilesProfile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly

Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.

Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)

100°C 150°C

60-120 seconds

150°C 200°C

60-180 seconds

Time maintained above: - Temperature (TL) - Time (tL)

183°C 60-150 seconds

217°C 60-150 seconds

Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)

10-30 seconds 20-40 seconds

Ramp-down Rate 6°C/second max. 6°C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.

Reliability Test Program

t 25 C to Peak

tp

Ramp-up

tL

Ramp-downts

Preheat

Tsmax

Tsmin

TL

TP

25

Tem

per

atur

e

Time

Critical ZoneTL to TP

°

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Copyright ANPEC Electronics Corp.Rev. B.2 - Mar., 2008

APM4220KA

www.anpec.com.tw11

Table 2. Pb-free Process – Package Classification Reflow Temperatures Package Thickness Volume mm3

<350 Volume mm3

350-2000 Volume mm3

>2000 <1.6 mm 260 +0°C* 260 +0°C* 260 +0°C*

1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C* ≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C*

*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.

Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures Package Thickness Volume mm3

<350 Volume mm3

≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C

Classification Reflow Profiles (Cont.)

Customer Service

Anpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838Fax : 886-2-2917-3838

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N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. A.2 - Jul., 2008

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.

APM4350KP

APM4350

Handling CodeTemperature RangePackage Code

Package Code KP : KPAKOperating Junction Temperature Range C : -55 to 150 CHandling Code TR : Tape & ReelAssembly Material L : Lead Free Device

G : Halogen and Lead Free Device

APM4350 KP : APM4350XXXXX

XXXXX - Date Code

Assembly Material

Features

Applications

Pin Description

Ordering and Marking InformationN-Channel MOSFET

• 30V/60A,

RDS(ON) =7.5mΩ (typ.) @ VGS = 10VRDS(ON) =11.5mΩ (typ.) @ VGS = 4.5V

• Super High Dense Cell Design

• Avalanche Rated

• Reliable and Rugged

• Lead Free and Green Devices Available

(RoHS Compliant)

• Power Management in Notebook Computer, or

Decktop Computer.

°

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).

S

SG

S

DDD

D

G

D

SSS

D D D

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APM4350KP

Absolute Maximum Ratings (TA = 25°C unless otherwise noted)

Symbol Parameter Rating Unit

Common Ratings (TA=25°C Unless Otherwise Noted)

VDSS Drain-Source Voltage 30

VGSS Gate-Source Voltage ±20 V

TJ Maximum Junction Temperature 150 °C

TSTG Storage Temperature Range -55 to 150 °C IS Diode Continuous Forward Current TC=25°C 50 A

TC=25°C 140 IDP 300µs Pulse Drain Current Tested

TC=100°C 80 A

Mounted on Large Heat Sink

TC=25°C 60 ID Continuous Drain Current

TC=100°C 35 A

TC=25°C 50 PD Maximum Power Dissipation

TC=100°C 20 W

RθJC Thermal Resistance-Junction to Case 2.5 °C/W

Mounted on PCB of 1in2 pad area

TA=25°C 13.5 ID Continuous Drain Current

TA=100°C 8.5 A

TA=25°C 2.5 PD Maximum Power Dissipation

TA=100°C 1 W

RθJA Thermal Resistance-Junction to Ambient 50 °C/W

Mounted on PCB of Minimum Footprint

TA=25°C 10 ID Continuous Drain Current

TA=100°°C 6 A

TA=25°C 1.5 PD Maximum Power Dissipation

TA=100°C 0.5 W

RθJA Thermal Resistance-Junction to Ambient 75 °C/W

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APM4350KP

Electrical Characteristics (TA = 25°C Unless Otherwise Noted)

APM4350KP Symbol Parameter Test Conditions

Min. Typ. Max. Unit

Static Characteristics BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 30 V

VDS=24V, VGS=0V 1 IDSS Zero Gate Voltage Drain Current

Tj=85°C 30 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1.3 1.8 2.5 V

IGSS Gate Leakage Current VGS=±20V, VDS=0V ±100 nA

VGS=10V, IDS=30A 7.5 9 RDS(ON)

a Drain-Source On-state Resistance VGS=4.5V, IDS=15A 11.5 14.5

Diode Characteristics

VSDa Diode Forward Voltage ISD=15A, VGS=0V 0.75 1.1 V

trr Reverse Recovery Time 11 ns

Qrr Reverse Recovery Charge IDS=15A, dlSD/dt=100A/µs

3 nC

Gate Charge Characteristics b Qg Total Gate Charge 28 39

Qgs Gate-Source Charge 4

Qgd Gate-Drain Charge

VDS=15V, VGS=10V, IDS=30A

9

nC

Dynamic Characteristics b RG Gate Resistance VGS=0V,VDS=0V,F=1MHz 1.6 Ω

Ciss Input Capacitance 1660

Coss Output Capacitance 260

Crss Reverse Transfer Capacitance

VGS=0V, VDS=15V, Frequency=1.0MHz 170

pF

td(ON) Turn-on Delay Time 18 33

tr Turn-on Rise Time 15 28

td(OFF) Turn-off Delay Time 47 86

tf Turn-off Fall Time

VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω

22 41

ns

Note: a : Pulse test ; pulse width≤300µs, duty cycle≤2%. b : Guaranteed by design, not subject to production testing.

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APM4350KP

Typical Characteristics

ID -

Dra

in C

urre

nt (A

)

Drain Current

Tj - Junction Temperature (°C)

Safe Operation Area

VDS - Drain - Source Voltage (V)

Thermal Transient Impedance

Square Wave Pulse Duration (sec)

Power Dissipation

Pto

t - P

ower

(W)

Tj - Junction Temperature (°C)

ID -

Dra

in C

urre

nt (A

)

Nor

mal

ized

Tra

nsie

nt T

herm

al R

esis

tanc

e

1E-4 1E-3 0.01 0.1 1 10 1000.01

0.1

1

2

Mounted on 1in2 padR

θJA :50oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

0 20 40 60 80 100 120 140 1600

10

20

30

40

50

60

TC=25oC

0 20 40 60 80 100 120 140 1600

10

20

30

40

50

60

70

TC=25oC,V

G=10V

0.1 1 10 800.1

1

10

100

400

TC=25oC

1ms

1s

10ms

100ms

DC

Rds(on

) Lim

it

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Copyright ANPEC Electronics Corp.Rev. A.2 - Jul., 2008

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APM4350KP

RD

S(O

N) -

On

- Res

ista

nce

(mΩ

)

Drain-Source On Resistance

ID - Drain Current (A)

Tj - Junction Temperature (°C)

Gate Threshold Voltage

VDS - Drain-Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Output Characteristics

Gate-Source On Resistance

VGS - Gate - Source Voltage (V)

RD

S(O

N) -

On

- Res

ista

nce

(mΩ

)

Nor

mal

ized

Thr

esho

ld V

olta

ge

Typical Characteristics (Cont.)

0.0 0.5 1.0 1.5 2.0 2.5 3.00

20

40

60

80

100

120

5.5V

4.5V

3.5V

4V

3V

5VV

GS= 6,7,8,9,10V

0 20 40 60 80 100 1202

4

6

8

10

12

14

16

18

20

VGS

=10V

VGS

=4.5V

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

IDS

=250µA

1 2 3 4 5 6 7 8 9 104

6

8

10

12

14

16

18

ID=30A

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APM4350KP

VDS - Drain - Source Voltage (V)

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

Tj - Junction Temperature (°C)

C -

Cap

acita

nce

(pF)

VSD - Source - Drain Voltage (V)

Source-Drain Diode Forward

IS -

Sou

rce

Cur

rent

(A)

Capacitance Gate Charge

QG - Gate Charge (nC)

VG

S -

Gat

e - s

ourc

e V

olta

ge (V

)

Typical Characteristics (Cont.)

0.0 0.3 0.6 0.9 1.2 1.5 1.80.2

1

10

100

Tj=150oC

Tj=25oC

0 5 10 15 20 25 300

500

1000

1500

2000

2500

Frequency=1MHz

Crss

Coss

Ciss

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

RON

@Tj=25oC: 7.5mΩ

VGS = 10V IDS = 30A

0 5 10 15 20 25 300

2

4

6

8

10V

DS= 15V

IDS

= 30A

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APM4350KP

Avalanche Test Circuit and Waveforms

DUT

0.01Ωtp

VDD

VDSL

IL

RG

Switching Time Test Circuit and Waveforms

VDD

RD

DUT

VGS

VDS

RG

tp

td(on) tr td(off) tf

VGS

VDS90%

10%

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APM4350KP

Package InformationKPAK

SYMBOL MIN. MAX.

1.20

0.38

4.80 5.00

5.90 6.10

5.70 5.80

0.05

3.49 3.69

A

B

D

E

E1

e

F

F1

G

H

MILLIMETERS

C 0.19 0.25

1.27 BSC

KPAK

0.35 0.45

MIN. MAX.

INCHES

0.047

0.015

0.050 BSC

0.007 0.010

0.189 0.197

0.232 0.240

0.224 0.228

0.002

0.014 0.018

0.137 0.145

1.00 0.039

0.51 0.020

0.15 0.006

G1

K 1.60 0.063

0.05 0.15 0.002 0.006

0.0180.0140.450.35

E1

E

F1

G1

GK

F

H

Be

D

C

A

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Copyright ANPEC Electronics Corp.Rev. A.2 - Jul., 2008

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APM4350KP

Carrier Tape & Reel Dimensions

Application A H T1 C d D W E1 F

330.0±2.00 50 MIN. 12.4+2.00

-0.00 13.0+0.50 -0.20

1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.5±0.10

P0 P1 P2 D0 D1 T A0 B0 K0 KPAK

4.0±0.10 8.0±0.10 2.0±0.10 1.5+0.10 -0.00 1.5 MIN. 0.3±0.05 6.5±0.10 5.3±0.10 1.4±0.10

Devices Per Unit

Package Type Unit Quantity

KPAK Tape & Reel 2500

(mm)

H

T1

A

d

A

E1

AB

W

F

T

P0OD0

BA0

P2

K0

B0

SECTION B-B

SECTION A-A

OD1

P1

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APM4350KP

Reflow Condition (IR/Convection or VPR Reflow)

Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 SEC HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B,A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles

Reliability Test Program

Classification Reflow ProfilesProfile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly

Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.

Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)

100°C 150°C

60-120 seconds

150°C 200°C

60-180 seconds

Time maintained above: - Temperature (TL) - Time (tL)

183°C 60-150 seconds

217°C 60-150 seconds

Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)

10-30 seconds 20-40 seconds

Ramp-down Rate 6°C/second max. 6°C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.

t 25 C to Peak

tp

Ramp-up

tL

Ramp-downts

Preheat

Tsmax

Tsmin

TL

TP

25

Tem

per

atu

re

Time

Critical ZoneTL to TP

°

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APM4350KP

Customer Service

Classification Reflow Profiles (Con.)

Anpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, TaiwanTel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindian City, Taipei County 23146, TaiwanTel : 886-2-2910-3838Fax : 886-2-2917-3838

Table 2. Pb-free Process – Package Classification Reflow Temperatures Package Thickness Volume mm3

<350 Volume mm3

350-2000 Volume mm3

>2000 <1.6 mm 260 +0°C* 260 +0°C* 260 +0°C*

1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C* ≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C*

*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.

Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures Package Thickness Volume mm3

<350 Volume mm3

≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C

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N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. A.2 - Jan., 2009

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.

APM4354KP

Features

Applications

Pin Description

Ordering and Marking Information

N-Channel MOSFET

• 30V/70A,

RDS(ON) =4.5mΩ (typ.) @ VGS = 10VRDS(ON) =6mΩ (typ.) @ VGS = 4.5V

• Super High Dense Cell Design

• Avalanche Rated

• Reliable and Rugged

• Lead Free and Green Devices Available

(RoHS Compliant)

Top View of KPAK

• Power Management in Notebook Computer, or

Decktop Computer.

SS

SG

DD D D

G

D

SSS

D D D

APM4354

Handling CodeTemperature RangePackage Code

Package Code KP : KPAKOperating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material G : Halogen and Lead Free Device

APM4354 KP : APM4354XXXXX

XXXXX - Date Code

Assembly Material

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).

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APM4354KP

Absolute Maximum Ratings (TA = 25°C unless otherwise noted)

Symbol Parameter Rating Unit

Common Ratings (TA=25°C Unless Otherwise Noted)

VDSS Drain-Source Voltage 30

VGSS Gate-Source Voltage ±20 V

TJ Maximum Junction Temperature 150 °C

TSTG Storage Temperature Range -55 to 150 °C IS Diode Continuous Forward Current TC=25°C 50 A

TC=25°C 150 IDP 300µs Pulse Drain Current Tested

TC=100°C 90 A

Mounted on Large Heat Sink

TC=25°C 70 ID Continuous Drain Current

TC=100°C 40 A

TC=25°C 50 PD Maximum Power Dissipation

TC=100°C 20 W

RθJC Thermal Resistance-Junction to Case 2.5 °C/W

Mounted on PCB of 1in2 pad area

TA=25°C 17 ID Continuous Drain Current

TA=100°C 11 A

TA=25°C 2.5 PD Maximum Power Dissipation

TA=100°C 1 W

RθJA Thermal Resistance-Junction to Ambient 50 °C/W

Mounted on PCB of Minimum Footprint

TA=25°C 14 ID Continuous Drain Current

TA=100°C 8 A

TA=25°C 1.5 PD Maximum Power Dissipation

TA=100°C 0.5 W

RθJA Thermal Resistance-Junction to Ambient 75 °C/W

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APM4354KP

Electrical Characteristics (TA = 25°C unless otherwise noted)

APM4354KP Symbol Parameter Test Conditions

Min. Typ. Max. Unit

Static Characteristics

BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 30 - - V

VDS=24V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current

Tj=85°C - - 30 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1.3 1.8 2.5 V

IGSS Gate Leakage Current VGS=±20V, VDS=0V - - ±100 nA

VGS=10V, IDS=30A - 4.5 5.5 RDS(ON)

a Drain-Source On-state Resistance VGS=4.5V,IDS=20A - 6 8

Diode Characteristics

VSDa Diode Forward Voltage ISD=20A, VGS=0V - 0.75 1.1 V

trr Reverse Recovery Time - 36 - ns

Qrr Reverse Recovery Charge IDS=20A, dlSD/dt=100A/µs

- 29 - nC

Gate Charge Characteristics b

Qg Total Gate Charge - 63 88

Qgs Gate-Source Charge - 10 -

Qgd Gate-Drain Charge

VDS=15V, VGS=10V, IDS=30A

- 19 -

nC

Dynamic Characteristics b

RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 1 - Ω

Ciss Input Capacitance - 3350 -

Coss Output Capacitance - 425 -

Crss Reverse Transfer Capacitance

VGS=0V, VDS=15V, Frequency=1.0MHz - 330 -

pF

td(ON) Turn-on Delay Time - 24 44

tr Turn-on Rise Time - 23 42

td(OFF) Turn-off Delay Time - 73 132

tf Turn-off Fall Time

VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω

- 27 50

ns

Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.

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APM4354KP

Typical Operating Characteristics

ID -

Dra

in C

urre

nt (A

)

Drain Current

Tj - Junction Temperature (°C)

Safe Operation Area

VDS - Drain - Source Voltage (V)

Thermal Transient Impedance

Square Wave Pulse Duration (sec)

Power Dissipation

Pto

t - P

ower

(W)

Tj - Junction Temperature (°C)

ID -

Dra

in C

urre

nt (A

)

Nor

mal

ized

Tra

nsie

nt T

herm

al R

esis

tanc

e

0 20 40 60 80 100 120 140 1600

10

20

30

40

50

60

TC=25oC

0 20 40 60 80 100 120 140 1600

10

20

30

40

50

60

70

80

TC=25oC,V

G=10V

0.1 1 10 800.1

1

10

100

400

TC=25oC

1ms

1s

10ms

100ms

DC

Rds(on

) Lim

it

1E-4 1E-3 0.01 0.1 1 10 1001E-3

0.01

0.1

1

2

Mounted on 1in2 padR

θJA :50oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

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APM4354KP

RD

S(O

N) -

On

- Res

ista

nce

(mΩ

)

Drain-Source On Resistance

ID - Drain Current (A)

Tj - Junction Temperature (°C)

Gate Threshold Voltage

VDS - Drain-Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Output Characteristics

Gate-Source On Resistance

VGS - Gate - Source Voltage (V)

RD

S(O

N) -

On

- Res

ista

nce

(mΩ

)

Nor

mal

ized

Thr

esho

ld V

olta

ge

Typical Operating Characteristics (Cont.)

0 30 60 90 120 1500

2

4

6

8

10

12

VGS

=10V

VGS

=4.5V

1 2 3 4 5 6 7 8 9 100

2

4

6

8

10

12

14

16

ID=30A

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6IDS

=250µA

0.0 0.5 1.0 1.5 2.0 2.5 3.00

30

60

90

120

150

4.5V

3.5V

4V

3V

VGS

= 5,6,7,8,9,10V

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APM4354KP

VDS - Drain - Source Voltage (V)

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

Tj - Junction Temperature (°C)

C -

Cap

acita

nce

(pF)

VSD - Source - Drain Voltage (V)

Source-Drain Diode Forward

IS -

Sou

rce

Cur

rent

(A)

Capacitance Gate Charge

QG - Gate Charge (nC)

VG

S -

Gat

e - s

ourc

e V

olta

ge (V

)

Typical Operating Characteristics (Cont.)

-50 -25 0 25 50 75 100 125 1500.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

VGS

= 10V

IDS

= 30A

RON

@Tj=25oC: 4.5mΩ

0.0 0.3 0.6 0.9 1.2 1.5 1.81

10

100

200

Tj=150oC

Tj=25oC

0 5 10 15 20 25 300

500

1000

1500

2000

2500

3000

3500

4000

4500

5000

Frequency=1MHz

CrssCoss

Ciss

0 10 20 30 40 50 60 700

1

2

3

4

5

6

7

8

9

10V

DS= 15V

ID= 30A

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Copyright ANPEC Electronics Corp.Rev. A.2 - Jan., 2009

www.anpec.com.tw7

APM4354KP

Avalanche Test Circuit and Waveforms

DUT

0.01Ωtp

VDD

VDSL

IL

RG

EAS

VDD

tAV

IAS

VDS

tpVDSX(SUS)

Switching Time Test Circuit and Waveforms

VDD

RD

DUT

VGS

VDS

RG

tp

td(on) tr td(off) tf

VGS

VDS90%

10%

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Copyright ANPEC Electronics Corp.Rev. A.2 - Jan., 2009

www.anpec.com.tw8

APM4354KP

Package InformationKPAK

SYMBOL MIN. MAX.

1.20

0.38

4.80 5.00

5.90 6.10

5.70 5.80

0.05

3.49 3.69

A

B

D

E

E1

e

F

F1

G

H

MILLIMETERS

C 0.19 0.25

1.27 BSC

KPAK

0.35 0.45

MIN. MAX.

INCHES

0.047

0.015

0.050 BSC

0.007 0.010

0.189 0.197

0.232 0.240

0.224 0.228

0.002

0.014 0.018

0.137 0.145

1.00 0.039

0.51 0.020

0.15 0.006

G1

K 1.60 0.063

0.05 0.15 0.002 0.006

0.0180.0140.450.35

E1

E

F1

G1

GK

F

H

Be

D

C

A

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Copyright ANPEC Electronics Corp.Rev. A.2 - Jan., 2009

www.anpec.com.tw9

APM4354KP

Carrier Tape & Reel Dimensions

A

E1

AB

W

F

T

P0OD0

BA0

P2

K0

B0

SECTION B-B

SECTION A-A

OD1

P1

H

T1

A

d

Application A H T1 C d D W E1 F

330.0±2.00 50 MIN. 12.4+2.00 -0.00

13.0+0.50 -0.20

1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.5±0.10

P0 P1 P2 D0 D1 T A0 B0 K0 KPAK

4.0±0.10 8.0±0.10 2.0±0.10 1.5+0.10 -0.00 1.5 MIN. 0.3±0.05 6.5±0.10 5.3±0.10 1.4±0.10

(mm)

Devices Per Unit

Package Type Unit Quantity

KPAK Tape & Reel 2500

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APM4354KP

Taping Direction InformationKPAK

Reflow Condition (IR/Convection or VPR Reflow)

t 25 C to Peak

tp

Ramp-up

tL

Ramp-downts

Preheat

Tsmax

Tsmin

TL

TP

25

Tem

per

atur

e

Time

Critical ZoneTL to TP

°

Reliability Test Program

Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles

USER DIRECTION OF FEED

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APM4354KP

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.

Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)

100°C 150°C

60-120 seconds

150°C 200°C

60-180 seconds

Time maintained above: - Temperature (TL) - Time (tL)

183°C 60-150 seconds

217°C 60-150 seconds

Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)

10-30 seconds 20-40 seconds

Ramp-down Rate 6°C/second max. 6°C/second max.

Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.

Classification Reflow Profiles

Table 2. Pb-free Process – Package Classification Reflow Temperatures

Package Thickness Volume mm3 <350

Volume mm3 350-2000

Volume mm3 >2000

<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*

≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.

Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures

Package Thickness Volume mm3

<350 Volume mm3

≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C

Customer Service

Anpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838

Fax : 886-2-2917-3838

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N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. A.1 - May, 2007

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.

APM4356KP

Features

Applications

Pin Description

Ordering and Marking Information

N-Channel

• 30V/80A,

RDS(ON) = 3.3mΩ (typ.) @ VGS = 10VRDS(ON) = 4.5mΩ (typ.) @ VGS = 4.5V

• Super High Dense Cell Design

• Avalanche Rated

• Reliable and Rugged

• Lead Free Available (RoHS Compliant)

Top View of KPAK

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte in platetermination finish; which are fully compliant with RoHS and compatible with both SnPb and lead-free solderingoperations. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C

S

GS

S

DD

DD

S

GS

S

DD

DD

for MSL classification at lead-free peak reflow temperature.

• Power Management in Notebook Computer, or

Decktop Computer.

G

S

D DDD

SS

APM4356

Handling CodeTemp. RangePackage Code

Package Code KP : KPAKOperating Junction Temp. Range C : -55 to 150 CHandling Code TR : Tape & Reel TU : TubeLead Free Code L : Lead Free Device

APM4356 KP : APM4356XXXXX

XXXXX - Date Code

Lead Free Code°

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Copyright ANPEC Electronics Corp.Rev. A.1 - May, 2007

www.anpec.com.tw2

APM4356KP

Absolute Maximum Ratings (TA = 25°C unless otherwise noted)

Symbol Parameter Rating Unit

Common Ratings (TA=25°C Unless Otherwise Noted)

VDSS Drain-Source Voltage 30

VGSS Gate-Source Voltage ±20 V

TJ Maximum Junction Temperature 150 °C

TSTG Storage Temperature Range -55 to 150 °C IS Diode Continuous Forward Current TC=25°C 50 A

TC=25°C 180 IDP 300µs Pulse Drain Current Tested

TC=100°C 90 A

Mounted on Large Heat Sink

TC=25°C 80 ID Continuous Drain Current

TC=100°C 45 A

TC=25°C 50 PD Maximum Power Dissipation

TC=100°C 20 W

RθJC Thermal Resistance-Junction to Case 2.5 °C/W

Mounted on PCB of 1in2 pad area

TA=25°C 20 ID Continuous Drain Current

TA=100°C 12 A

TA=25°C 2.5 PD Maximum Power Dissipation

TA=100°C 1 W

RθJA Thermal Resistance-Junction to Ambient 50 °C/W

Mounted on PCB of Minimum Footprint

TA=25°C 15 ID Continuous Drain Current

TA=100°C 10 A

TA=25°C 1.5 PD Maximum Power Dissipation

TA=100°C 0.5 W

RθJA Thermal Resistance-Junction to Ambient 75 °C/W

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Copyright ANPEC Electronics Corp.Rev. A.1 - May, 2007

www.anpec.com.tw3

APM4356KP

Electrical Characteristics (TA = 25°C unless otherwise noted)

APM4356KP Symbol Parameter Test Condition

Min. Typ. Max. Unit

Static Characteristics

BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 30 V

VDS=24V, VGS=0V 1 IDSS Zero Gate Voltage Drain Current

TJ=85°C 30 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1.3 1.8 2.5 V

IGSS Gate Leakage Current VGS=±20V, VDS=0V ±100 nA

VGS=10V, IDS=40A 3.3 4 RDS(ON)

a Drain-Source On-state Resistance VGS=4.5V,IDS=20A 4.5 5.8

Diode Characteristics

VSDa Diode Forward Voltage ISD=20A, VGS=0V 0.75 1.1 V

trr Reverse Recovery Time 54 ns

Qrr Reverse Recovery Charge IDS=20A, dlSD/dt=100A/µs

30 nC

Gate Charge Characteristics b

Qg Total Gate Charge 100 140

Qgs Gate-Source Charge 11

Qgd Gate-Drain Charge

VDS=15V, VGS=10V, IDS=40A

20

nC

Dynamic Characteristics b

RG Gate Resistance VGS=0V,VDS=0V, F=1MHz 1.1 Ω

C iss Input Capacitance 5860

Coss Output Capacitance 900

Crss Reverse Transfer Capacitance

VGS=0V, VDS=15V, Frequency=1.0MHz 680

pF

td(ON) Turn-on Delay Time 27 50

tr Turn-on Rise Time 20 37

td(OFF) Turn-off Delay Time 128 231

tf Turn-off Fall Time

VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω

58 105

ns

Note: a : Pulse test ; pulse width≤300µs, duty cycle≤2%. b : Guaranteed by design, not subject to production testing.

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Copyright ANPEC Electronics Corp.Rev. A.1 - May, 2007

www.anpec.com.tw4

APM4356KP

Typical Characteristics

ID -

Dra

in C

urre

nt (A

)

Drain Current

Tj - Junction Temperature (°C)

Safe Operation Area

VDS - Drain - Source Voltage (V)

Thermal Transient Impedance

Square Wave Pulse Duration (sec)

Power Dissipation

Pto

t - P

ower

(W)

Tj - Junction Temperature (°C)

ID -

Dra

in C

urre

nt (A

)

Nor

mal

ized

Tra

nsie

nt T

herm

al R

esis

tanc

e

0 20 40 60 80 100 120 140 1600

10

20

30

40

50

60

TC=25oC

1E-4 1E-3 0.01 0.1 1 10 1001E-3

0.01

0.1

1

2

Mounted on 1in2 padR

θJA :50oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

0 20 40 60 80 100 120 140 1600

20

40

60

80

100

TC=25oC,V

G=10V

0.01 0.1 1 10 1000.1

1

10

100

500

TC=25oC

1ms

1s

10ms

100ms

DC

Rds(on

) Lim

it

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Copyright ANPEC Electronics Corp.Rev. A.1 - May, 2007

www.anpec.com.tw5

APM4356KP

RD

S(O

N) -

On

- Res

ista

nce

(mΩ

)

Drain-Source On Resistance

ID - Drain Current (A)

Tj - Junction Temperature (°C)

Gate Threshold Voltage

VDS - Drain-Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Output Characteristics

Drain-Source On Resistance

VGS - Gate - Source Voltage (V)

RD

S(O

N) -

On

- Res

ista

nce

(mΩ

)

Nor

mal

ized

Thr

esho

ld V

olta

ge

Typical Characteristics (Cont.)

2 3 4 5 6 7 8 9 101

2

3

4

5

6

7

8

9

10

ID=40A

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6IDS

=250µA

0.0 0.5 1.0 1.5 2.0 2.5 3.00

20

40

60

80

100

120

140

160

180

3.5V

4V

3V

VGS

= 4.5,5,6,7,8,9,10V

0 30 60 90 120 150 1801

2

3

4

5

6

7

8

VGS

=10V

VGS

=4.5V

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Copyright ANPEC Electronics Corp.Rev. A.1 - May, 2007

www.anpec.com.tw6

APM4356KP

VDS - Drain - Source Voltage (V)

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

Tj - Junction Temperature (°C)

C -

Cap

acita

nce

(pF)

VSD - Source - Drain Voltage (V)

Source-Drain Diode Forward

IS -

Sou

rce

Cur

rent

(A)

Capacitance Gate Charge

QG - Gate Charge (nC)

VG

S -

Gat

e - s

ourc

e V

olta

ge (V

)

Typical Characteristics (Cont.)

-50 -25 0 25 50 75 100 125 1500.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

VGS

= 10V

IDS

= 40A

RON

@Tj=25oC: 3.3mΩ

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.60.1

1

10

100

200

Tj=150oC

Tj=25oC

0 5 10 15 20 25 300

1000

2000

3000

4000

5000

6000

7000

8000

9000

Frequency=1MHz

CrssCoss

Ciss

0 20 40 60 80 1000

1

2

3

4

5

6

7

8

9

10V

DS= 15V

ID= 40A

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Copyright ANPEC Electronics Corp.Rev. A.1 - May, 2007

www.anpec.com.tw7

APM4356KP

Avalanche Test Circuit and Waveforms

Switching Time Test Circuit and Waveforms

VDD

RD

DUT

VGS

VDS

RG

tp

td(on) tr td(off) tf

VGS

VDS90%

10%

DUT

0.01Ωtp

VDD

VDSL

IL

RG

EAS

VDD

tAV

IAS

VDS

tpVDSX(SUS)

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Copyright ANPEC Electronics Corp.Rev. A.1 - May, 2007

www.anpec.com.tw8

APM4356KP

Package Information

KPAK

SYMBOL MIN. MAX.

1.20

0.38

4.80 5.00

5.90 6.10

5.70 5.80

0.05

3.49 3.69

A

B

D

E

E1

e

F

F1

G

H

MILLIMETERS

C 0.19 0.25

1.27 BSC

KPAK

0.35 0.45

MIN. MAX.

INCHES

0.047

0.015

0.050 BSC

0.007 0.010

0.189 0.197

0.232 0.240

0.224 0.228

0.002

0.014 0.018

0.137 0.145

1.00 0.039

0.51 0.020

0.15 0.006

G1

K 1.60 0.063

0.05 0.15 0.002 0.006

0.0180.0140.450.35

E1

E

F1

G1

GK

F

H

Be

D

C

A

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Copyright ANPEC Electronics Corp.Rev. A.1 - May, 2007

www.anpec.com.tw9

APM4356KP

Carrier Tape & Reel Dimensions

Devices Per Reel

Package Type Devices Per Reel KPAK 2500

Application A H T1 C d D W E1 F

330.0±2.00 50 MIN. 9.2±0.10 13.0+0.50 -0.20

1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.5±0.05

P0 P1 P2 D0 D1 T A0 B0 K0 KPAK

4.0±0.10 8.0±0.10 2.0±0.05 1.5+0.10 1.5 MIN. 0.3±0.05 6.5±0.10 5.3±0.10 1.4±0.10

(mm)

A

E1

AB

W

F

T

P0OD0

BA0

P2

K0

B0

SECTION B-B

SECTION A-A

OD1

P1

H

T1

A

d

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Copyright ANPEC Electronics Corp.Rev. A.1 - May, 2007

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APM4356KP

Terminal Material Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb,100%Sn).

Lead Solderability Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.

Reflow Condition (IR/Convection or VPR Reflow)

Classification Reflow Profiles

Physical Specifications

t 25 C to Peak

tp

Ramp-up

tL

Ramp-down

tsPreheat

Tsmax

Tsmin

TL

TP

25

Tem

per

atu

re

Time

Critical ZoneTL to TP

°

(IR/Convection or VPR Reflow)

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.

Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)

100°C 150°C

60-120 seconds

150°C 200°C

60-180 seconds

Time maintained above: - Temperature (TL) - Time (tL)

183°C 60-150 seconds

217°C 60-150 seconds

Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)

10-30 seconds 20-40 seconds

Ramp-down Rate 6°C/second max. 6°C/second max.

Time 25°C to Peak Temperature 6 minutes max. 8 minutes max.

Notes: All temperatures refer to topside of the package. Measured on the body surface.

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Copyright ANPEC Electronics Corp.Rev. A.1 - May, 2007

www.anpec.com.tw11

APM4356KP

Customer Service

Anpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :7F, No. 137, Lane 235, Pao Chiao Rd.,Hsin Tien City, Taipei Hsien, Taiwan, R. O. C.Tel : 886-2-89191368Fax : 886-2-89191369

Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 SEC HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B,A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles ESD MIL-STD-883D-3015.7 VHBM > 2KV, VMM > 200V Latch-Up JESD 78 10ms, 1tr > 100mA

Reliability Test Program

Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures

Package Thickness Volume mm3

<350 Volume mm3

≥350

<2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C

Table 2. Pb-free Process – Package Classification Reflow Temperatures

Package Thickness Volume mm3

<350 Volume mm3

350-2000 Volume mm3

>2000

<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C*

1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*

≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* * Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated

classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.

Classification Reflow Profiles (Cont.)

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N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. A.3 - Mar., 2009

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, andadvise customers to obtain the latest version of relevant information to verify before placing orders.

APM9984CCG

Features

Applications

Pin Description

Ordering and Marking Information

N-Channel MOSFET

• 20V/6A,

RDS(ON)=16mΩ(typ.) @ VGS=4.5VRDS(ON)=19mΩ(typ.) @ VGS=2.5V

• Super High Dense Cell Design

• Reliable and Rugged

• ESD Rating : 2KV HBM

• Lead Free and Green Devices Available

(RoHS Compliant)

• Power Management in Notebook Computer, Por-

table Equipment and Battery Powered Systems.

Top View of JSOT-8

G2

S2

D2(8) (6)

(2)

(1)

(4)

(3)S1

D1

G1

(7) (5)D1 D2

APM9984C

Handling Code

Temperature Range

Package Code

Package Code CG : JSOT-8Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material G : Halogen and Lead Free Device

APM9984C CG : M9984CXXXXX XXXXX - Date Code

Assembly Material

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).

S1G1S2G2D1

D1D2D2

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Copyright ANPEC Electronics Corp.Rev. A.3 - Mar., 2009

www.anpec.com.tw2

APM9984CCG

Absolute Maximum Ratings (TA = 25°C unless otherwise noted)

Electrical Characteristics (TA = 25°C unless otherwise noted)

Symbol Parameter Rating Unit

VDSS Drain-Source Voltage 20

VGSS Gate-Source Voltage ±12 V

ID* Continuous Drain Current 6

IDM* 300µs Pulsed Drain Current VGS=4.5V

20 A

IS* Diode Continuous Forward Current 1.7 A

TJ Maximum Junction Temperature 150

TSTG Storage Temperature Range -55 to 150 °C

TA=25°C 1.25 PD* Maximum Power Dissipation

TA=100°C 0.5 W

RθJA* Thermal Resistance-Junction to Ambient 100 °C/W

Note : *Surface Mounted on 1in2 pad area, t ≤ 10sec.

APM9984CCG Symbol Parameter Test Conditions

Min. Typ. Max. Unit

Static Characteristics

BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 20 - - V

VDS=16V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current

TJ=85°C - - 30 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 0.5 0.7 1 V

IGSS Gate Leakage Current VGS=±10V, VDS=0V - - ±10 µA

VGS=4.5V, IDS=6A - 16 20 RDS(ON)

a Drain-Source On-state Resistance VGS=2.5V, IDS=5.2A - 19 25

VSDa Diode Forward Voltage ISD=1.7A, VGS=0V - 0.7 1.3 V

Gate Charge Characteristics b

Qg Total Gate Charge - 15 21

Qgs Gate-Source Charge - 1.5 -

Qgd Gate-Drain Charge

VDS=10V, VGS=4.5V, IDS=6A

- 4.5 -

nC

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APM9984CCG

Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)

APM9984CCG Symbol Parameter Test Conditions

Min. Typ. Max. Unit

Dynamic Characteristics b

RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 4 - Ω

Ciss Input Capacitance - 1165 -

Coss Output Capacitance - 210 -

Crss Reverse Transfer Capacitance

VGS=0V, VDS=10V, Frequency=1.0MHz - 190 -

pF

td(ON) Turn-on Delay Time - 7 14

tr Turn-on Rise Time - 10 19

td(OFF) Turn-off Delay Time - 66 110

tf Turn-off Fall Time

VDD=10V, RL=10Ω, IDS=1A, VGEN=4.5V, RG=6Ω

- 44 75

ns

trr Reverse Recovery Time - 25 - nS

Qrr Reverse Recovery Charge ISD=6A, dISD/dt=100A/µs

- 13 - nC

Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.

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APM9984CCG

Typical Operating Characteristics

ID -

Dra

in C

urre

nt (A

)

Drain Current

Tj - Junction Temperature (°C)

Safe Operation Area

VDS - Drain - Source Voltage (V)

Thermal Transient Impedance

Square Wave Pulse Duration (sec)

Power Dissipation

Pto

t - P

ower

(W)

Tj - Junction Temperature (°C)

I D -

Dra

in C

urre

nt (A

)

Nor

mal

ized

Tra

nsie

nt T

herm

al R

esis

tanc

e

0 20 40 60 80 100 120 140 1600.0

0.3

0.6

0.9

1.2

1.5

TA=25oC

0 20 40 60 80 100 120 140 1600

1

2

3

4

5

6

7

TA=25oC,V

G=4.5V

0.01 0.1 1 10 1000.01

0.1

1

10

100

300µs

1msRds(on

) Lim

it

1s

TA=25oC

10ms

100ms

DC

1E-4 1E-3 0.01 0.1 1 10 301E-3

0.01

0.1

1

2

Mounted on 1in2 padR

θJA : 100 oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

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APM9984CCG

RD

S(O

N) -

On

- Res

ista

nce

(mΩ

)

Drain-Source On Resistance

ID - Drain Current (A)

Tj - Junction Temperature (°C)

Gate Threshold Voltage

VDS - Drain-Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Output Characteristics

Drain-Source On Resistance

VGS - Gate - Source Voltage (V)

RD

S(O

N) -

On

- Res

ista

nce

(mΩ

)

Nor

mal

ized

Thr

esho

ld V

olta

ge

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6IDS

=250µA

0.0 0.5 1.0 1.5 2.0 2.5 3.00

2

4

6

8

10

12

14

16

18

20

1V

1.5V

VGS

=2,3,4,5,6,7,8,9,10V

0 4 8 12 16 2013

14

15

16

17

18

19

20

21

22

23

VGS

=2.5V

VGS

=4.5V

1 2 3 4 5 6 7 8 9 1012

14

16

18

20

22

24

ID=6A

Typical Operating Characteristics (Cont.)

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APM9984CCG

VDS - Drain - Source Voltage (V)

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

Tj - Junction Temperature (°C)

C -

Cap

acita

nce

(pF)

VSD - Source - Drain Voltage (V)

Source-Drain Diode Forward

IS -

Sou

rce

Cur

rent

(A)

Capacitance Gate Charge

QG - Gate Charge (nC)

VG

S -

Gat

e - s

ourc

e V

olta

ge (V

)

0.0 0.3 0.6 0.9 1.2 1.5 1.80.1

1

10

20

Tj=150oC

Tj=25oC

0 4 8 12 16 200

200

400

600

800

1000

1200

1400

1600

1800

2000

Frequency=1MHz

CrssCoss

Ciss

0 5 10 15 20 25 300

1

2

3

4

5

6

7

8

9

10V

DS=10V

IDS

= 6A

-50 -25 0 25 50 75 100 125 1500.4

0.6

0.8

1.0

1.2

1.4

1.6

RON

@Tj=25oC: 16mΩ

VGS

= 4.5V

ID = 6A

Typical Operating Characteristics (Cont.)

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APM9984CCG

Package InformationJSOT-8

E1

eb

D

A2

A1

AE

2c

E

L

Θ

SYMBOL MIN. MAX.

1.10

0.01

0.25 0.40

0.10 0.20

2.95 3.10

2.50 3.00

2.30

0.30 0.60

A

A1

b

c

D

E

E1

E2

e

L

MILLIMETERS

A2 0.92 1.00

0.65 BSC

JSOT-8

2.65 3.05

MIN. MAX.

INCHES

0.043

0.000

0.026 BSC

0.036 0.039

0.010 0.016

0.004 0.008

0.116 0.122

0.098 0.118

0.091

0.104 0.120

0.012 0.024

0.93 0.037

0.10 0.004

2.50 0.098

0 0° 8° 0° 8°

Note: 1. Follow GEM2928 8J 2. Dimension D, D1, and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 10 mil.

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APM9984CCG

Carrier Tape & Reel Dimensions

A

E1

AB

W

F

T

P0OD0

BA0

P2

K0

B0

SECTION B-B

SECTION A-A

OD1

P1

H

T1

A

d

Application A H T1 C d D W E1 F

178.0±2.00 50 MIN. 8.4+2.00 -0.00

13.0+0.50 -0.20

1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05

P0 P1 P2 D0 D1 T A0 B0 K0 JSOT-8

4.0±0.10 4.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.0 MIN. 0.6+0.00

-0.40 3.20±0.20 3.10±0.20 1.50±0.20

(mm)

Devices Per UnitPackage Type Unit Quantity

JSOT-8 Tape & Reel 3000

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APM9984CCG

Taping Direction Information

Classification Profile

JSOT-8

USER DIRECTION OF FEED

XXXXXMAAAA MAAAA

XXXXXMAAAAXXXXX

MAAAAXXXXX

MAAAAXXXXX

MAAAAXXXXX

MAAAAXXXXX

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APM9984CCG

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly

Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts)

100 °C 150 °C

60-120 seconds

150 °C 200 °C

60-120 seconds

Average ramp-up rate (Tsmax to TP) 3 °C/second max. 3°C/second max.

Liquidous temperature (TL) Time at liquidous (tL)

183 °C 60-150 seconds

217 °C 60-150 seconds

Peak package body Temperature (Tp)*

See Classification Temp in table 1 See Classification Temp in table 2

Time (tP)** within 5°C of the specified classification temperature (Tc)

20** seconds 30** seconds

Average ramp-down rate (Tp to Tsmax) 6 °C/second max. 6 °C/second max.

Time 25°C to peak temperature 6 minutes max. 8 minutes max.

* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.

Classification Reflow Profiles

Table 2. Pb-free Process – Classification Temperatures (Tc)

Package Thickness

Volume mm3 <350

Volume mm3 350-2000

Volume mm3 >2000

<1.6 mm 260 °C 260 °C 260 °C 1.6 mm – 2.5 mm 260 °C 250 °C 245 °C

≥2.5 mm 250 °C 245 °C 245 °C

Table 1. SnPb Eutectic Process – Classification Temperatures (Tc) Package

Thickness Volume mm3

<350 Volume mm3

≥350 <2.5 mm 235 °C 220 °C

≥2.5 mm 220 °C 220 °C

Reliability Test Program

Test item Method Description SOLDERABILITY JESD-22, B102 5 Sec, 245°C HOLT JESD-22, A108 1000 Hrs, Bias @ 125°C PCT JESD-22, A102 168 Hrs, 100%RH, 2atm, 121°C TCT JESD-22, A104 500 Cycles, -65°C~150°C

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APM9984CCG

Customer Service

Anpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838

Fax : 886-2-2917-3838

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N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. A.2 - Nov., 2008

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.

APM2322AA

Features

Applications

• Power Management in Notebook Computer,

Portable Equipment and Battery PoweredSystems.

Pin Description

Ordering and Marking Information

Top View of SOT-23

N-Channel MOSFET

• 20V/1.7A ,

RDS(ON)= 120mΩ(typ.) @ VGS=4.5V RDS(ON)= 180mΩ(typ.) @ VGS=2.5V RDS(ON)= 280mΩ(typ.) @ VGS=1.8V

• Super High Dense Cell Design

• Reliable and Rugged

• Lead Free and Green Devices Available

(RoHS Compliant)

G

S

D

APM2322A

Handling CodeTemperature RangePackage Code

Package Code A : SOT-23Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material L : Lead Free Device G : Halogen and Lead Free Device

APM2322A A : A22X X - Date Code

Assembly Material

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).

D

G

S

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APM2322AA

Absolute Maximum Ratings (TA = 25°C unless otherwise noted)

Electrical Characteristics (TA = 25°C unless otherwise noted)

Symbol Parameter Rating Unit

VDSS Drain-Source Voltage 20

VGSS Gate-Source Voltage ±12 V

ID* Continuous Drain Current 1.7

IDM* 300µs Pulsed Drain Current VGS=4.5V

7 A

IS* Diode Continuous Forward Current 1 A

TJ Maximum Junction Temperature 150

TSTG Storage Temperature Range -55 to 150 °C

TA=25°C 0.83 PD* Maximum Power Dissipation

TA=100°C 0.3 W

RθJA* Thermal Resistance-Junction to Ambient 150 °C/W Note : *Surface Mounted on 1in2 pad area, t ≤ 10sec.

APM2322AA Symbol Parameter Test Conditions

Min. Typ. Max. Unit

STATIC CHARACTERISTICS

BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 20 - - V

VDS=16V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current

TJ=85°C - - 30 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 0.5 0.7 1 V

IGSS Gate Leakage Current VGS=±10V, VDS=0V - - ±10 µA

VGS=4.5V, IDS=1.7A - 120 160

VGS=2.5V, IDS=1.3A - 180 250 RDS(ON) a Drain-Source On-State Resistance

VGS=1.8V, IDS=0.5A - 280 450

DIODE CHARACTERISTICS

VSDa Diode Forward Voltage ISD=1A, VGS=0V - 0.8 1.3 V

trr Reverse Recovery Time - 14 - ns

Qrr Reverse Recovery Charge ISD=1.7A, dlSD/dt=100A/µs

- 4 - nC

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APM2322AA

Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)

APM2322AA Symbol Parameter Test Conditions

Min. Typ. Max. Unit

DYNAMIC CHARACTERISTICS b

RG Gate resistance VGS=0V,VDS=0V,F=1MHz - 7 - Ω

Ciss Input Capacitance - 115 -

Coss Output Capacitance - 35 -

Crss Reverse Transfer Capacitance

VGS=0V, VDS=10V, Frequency=1.0MHz - 25 -

pF

td(ON) Turn-on Delay Time - 2 5

Tr Turn-on Rise Time - 14 26

td(OFF) Turn-off Delay Time - 12 23

Tf Turn-off Fall Time

VDD=10V, RL=10Ω, IDS=1A, VGEN=4.5V, RG=6Ω

- 2 5

ns

GATE CHARGE CHARACTERISTICS b

Qg Total Gate Charge - 1.8 2.5

Qgs Gate-Source Charge - 0.3 -

Qgd Gate-Drain Charge

VDS=10V, VGS=4.5V, IDS=1.7A

- 0.7 -

nC

Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.

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APM2322AA

Typical Operating Characteristics

I D -

Dra

in C

urre

nt (A

)

Drain Current

Tj - Junction Temperature (°C)

Safe Operation Area

VDS - Drain - Source Voltage (V)

Thermal Transient Impedance

Square Wave Pulse Duration (sec)

Power Dissipation

Pto

t - P

ower

(W)

Tj - Junction Temperature (°C)

I D -

Dra

in C

urre

nt (A

)

Nor

mal

ized

Tra

nsie

nt T

herm

al R

esis

tanc

e

0 20 40 60 80 100 120 140 1600.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

TA=25oC

0 20 40 60 80 100 120 140 1600.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

TA=25oC,V

G=4.5V

0.01 0.1 1 10 1000.01

0.1

1

10

30

Rds(o

n) Li

mit

TA=25oC

10ms

300µs

1ms

100ms

DC

1E-4 1E-3 0.01 0.1 1 10 1000.01

0.1

1

2

Mounted on 1in2 padR

θJA : 150 oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

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APM2322AA

RD

S(O

N) -

On

- R

esis

tanc

e (m

Ω)

Drain-Source On Resistance

ID - Drain Current (A)

Tj - Junction Temperature (°C)

Gate Threshold Voltage

VDS - Drain - Source Voltage (V)

I D -

Dra

in C

urre

nt (A

)

Output Characteristics

Drain-Source On Resistance

VGS - Gate-Source Voltage (V)

RD

S(O

N) -

On

Res

ista

nce

(mΩ

)

Nor

mal

ized

Thr

esho

ld V

olta

ge

0.0 0.5 1.0 1.5 2.0 2.5 3.00

1

2

3

4

5

6

7

2V

3VV

GS=4,5,6,7,8,9,10V

-50 -25 0 25 50 75 100 125 1500.4

0.6

0.8

1.0

1.2

1.4

1.6IDS

=250µA

0 1 2 3 4 5 6 750

100

150

200

250

300

350

400

VGS

=1.8V

VGS

=2.5V

VGS

=4.5V

1 2 3 4 5 6 7 8 9 1060

90

120

150

180

210

240

270

300

ID=1.7A

Typical Operating Characteristics (Cont.)

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APM2322AA

VDS - Drain - Source Voltage (V)

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

Tj - Junction Temperature (°C)

C -

Cap

acita

nce

(pF)

VSD - Source - Drain Voltage (V)

Source-Drain Diode Forward

I S -

Sou

rce

Cur

rent

(A)

Capacitance Gate Charge

QG - Gate Charge (nC)

VG

S -

Gat

e - s

ourc

e V

olta

ge (V

)

-50 -25 0 25 50 75 100 125 1500.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8V

GS = 4.5V

IDS

= 1.7A

RON

@Tj=25oC: 120mΩ

0.0 0.3 0.6 0.9 1.2 1.5 1.80.1

1

7

Tj=150oC

Tj=25oC

0 1 2 3 40

1

2

3

4

5

6

7

8

9

10V

DS= 10V

IDS

= 1.7A

0 4 8 12 16 20

20

40

60

80

100

120

140

160

180

200

Frequency=1MHz

Crss

Coss

Ciss

Typical Operating Characteristics (Cont.)

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APM2322AA

Package InformationSOT-23

0L

VIEW A

0.25

GAUGE PLANESEATING PLANE

AA2

A1

e

D

EE1

SEEVIEW A

b c

e1

MAX.

0.057

0.051

0.024

0.006

0.009

0.0200.012

L 0.30

0

e

e1

E1

E

D

c

b

0.08

0.30

0.60 0.012

0.95 BSC

1.90 BSC

0.22

0.50

0.037 BSC

0.075 BSC

0.003

MIN.

MILLIMETERS

SYMBOL

A1

A2

A

0.00

0.90

SOT-23

MAX.

1.45

0.15

1.30

MIN.

0.000

0.035

INCHES

°8°0 °8°0

1.40

2.60

1.80

3.00

2.70 3.10 0.122

0.071

0.1180.102

0.055

0.106

Note : Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side.

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APM2322AA

Application A H T1 C d D W E1 F

178.0±2.00 50 MIN. 8.4+2.00 -0.00

13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05

P0 P1 P2 D0 D1 T A0 B0 K0 SOT-23

4.0±0.10 4.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.0 MIN. 0.6+0.00

-0.40 3.20±0.20 3.10±0.20 1.50±0.20

(mm)

Carrier Tape & Reel Dimensions

H

T1

A

d

A

E1

AB

W

F

T

P0OD0

BA0

P2

K0

B0

SECTION B-B

SECTION A-A

OD1

P1

Devices Per Unit

Package Type Unit Quantity

SOT-23 Tape & Reel 3000

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APM2322AA

Taping Direction InformationSOT-23

USER DIRECTION OF FEED

Reflow Condition (IR/Convection or VPR Reflow)

t 25 C to Peak

tp

Ramp-up

tL

Ramp-downts

Preheat

Tsmax

Tsmin

TL

TP

25

Tem

per

atur

e

Time

Critical ZoneTL to TP

°

Reliability Test Program

Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles

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APM2322AA

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.

Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)

100°C 150°C

60-120 seconds

150°C 200°C

60-180 seconds

Time maintained above: - Temperature (TL) - Time (tL)

183°C 60-150 seconds

217°C 60-150 seconds

Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)

10-30 seconds 20-40 seconds

Ramp-down Rate 6°C/second max. 6°C/second max.

Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.

Classification Reflow Profiles

Table 2. Pb-free Process – Package Classification Reflow Temperatures

Package Thickness Volume mm3 <350

Volume mm3 350-2000

Volume mm3 >2000

<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*

≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.

Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures

Package Thickness Volume mm3

<350 Volume mm3

≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C

Customer Service

Anpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838

Fax : 886-2-2917-3838

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N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. A.2 - Sep., 2008

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, andadvise customers to obtain the latest version of relevant information to verify before placing orders.

APM2324AA

Features

Applications

Pin Description

Ordering and Marking Information

Top View of SOT-23

N-Channel MOSFET

• 20V/3A,

RDS(ON)= 50mΩ(Typ.) @ VGS= 4.5V

RDS(ON)= 65mΩ(Typ.) @ VGS= 2.5V

RDS(ON)= 120mΩ(Typ.) @ VGS= 1.8V

• Super High Dense Cell Design

• Reliable and Rugged

• Lead Free and Green Devices Available

(RoHS Compliant)

• Power Management in Notebook Computer,

Portable Equipment and Battery PoweredSystems

G

S

D

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).

APM2324A

Handling CodeTemperature Range

Package Code

Package Code A : SOT-23Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material L : Lead Free Device G : Halogen and Lead Free Device

APM2324A A : A24X X - Date Code

Assembly Material

G

S

D

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APM2324AA

Absolute Maximum Ratings (TA = 25°C unless otherwise noted)

Electrical Characteristics (TA = 25°C unless otherwise noted)

Symbol Parameter Rating Unit

VDSS Drain-Source Voltage 20

VGSS Gate-Source Voltage ±12 V

ID* Continuous Drain Current 3

IDM* 300µs Pulsed Drain Current VGS=4.5V

10 A

IS* Diode Continuous Forward Current 1 A

TJ Maximum Junction Temperature 150

TSTG Storage Temperature Range -55 to 150 °C

TA=25°C 0.83 PD* Maximum Power Dissipation

TA=100°C 0.3 W

RθJA* Thermal Resistance-Junction to Ambient 150 °C/W

Note : *Surface Mounted on 1in2 pad area, t ≤ 10 Sec.

APM2324AA Symbol Parameter Test Conditions

Min. Typ. Max. Unit

STATIC CHARACTERISTICS

BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 20 - - V

VDS=16V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current

TJ=85°C - - 30 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 0.5 0.7 1 V

IGSS Gate Leakage Current VGS=±10V, VDS=0V - - ±10 µA

VGS=4.5V, IDS=3A - 50 65

VGS=2.5V, IDS=2A - 65 90 RDS(ON) a Drain-Source On-state Resistance

VGS=1.8V, IDS=0.5A - 120 200

VSDa Diode Forward Voltage ISD=1A, VGS=0V - 0.7 1.3 V

GATE CHARGE CHARACTERISTICS b

Qg Total Gate Charge - 4.4 6

Qgs Gate-Source Charge - 0.5 -

Qgd Gate-Drain Charge

VDS=10V, VGS=4.5V, IDS=3A

- 1.6 -

nC

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APM2324AA

APM2324AA Symbol Parameter Test Conditions

Min. Typ. Max. Unit

DYNAMIC CHARACTERISTICS b

RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 5 - Ω

Ciss Input Capacitance - 320 -

Coss Output Capacitance - 70 -

Crss Reverse Transfer Capacitance

VGS=0V, VDS=10V, Frequency=1.0MHz - 50 -

pF

td(ON) Turn-On Delay Time - 4 8

tr Turn-On Rise Time - 14 26

td(OFF) Turn-Off Delay Time - 21 39

tf Turn-Off Fall Time

VDD=10V, RL=10Ω, IDS=1A, VGEN=4.5V, RG=6Ω

- 5 10

ns

trr Reverse Recovery Time - 15 - ns

Qrr Reverse Recovery Charge ISD=3A, dlSD/dt=100A/µs

- 6 - nC

Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.

Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)

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APM2324AA

Typical Operating Characteristics

I D -

Dra

in C

urre

nt (A

)

Drain Current

Tj - Junction Temperature (°C)

Safe Operation Area

VDS - Drain - Source Voltage (V)

Thermal Transient Impedance

Square Wave Pulse Duration (sec)

Power Dissipation

Pto

t - P

ower

(W)

Tj - Junction Temperature (°C)

I D -

Dra

in C

urre

nt (

A)

Nor

mal

ized

Tra

nsie

nt T

herm

al R

esis

tanc

e

0 20 40 60 80 100 120 140 1600.0

0.2

0.4

0.6

0.8

1.0

TA=25oC

0 20 40 60 80 100 120 140 1600.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

TA=25oC,V

G=4.5V

0.01 0.1 1 10 1000.01

0.1

1

10

30

Rds(o

n) Li

mit

1s

TA=25oC

10ms

300µs

1ms

100ms

DC

1E-4 1E-3 0.01 0.1 1 10 1000.01

0.1

1

2

Mounted on 1in2 padR

θJA : 150 oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

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APM2324AA

RD

S(O

N) -

On

- R

esis

tanc

e (m

Ω)

Drain-Source On Resistance

ID - Drain Current (A)

Tj - Junction Temperature (°C)

Gate Threshold Voltage

VDS - Drain-Source Voltage (V)

I D -

Dra

in C

urre

nt (A

)

Output Characteristics

Drain-Source On Resistance

VGS - Gate - Source Voltage (V)

RD

S(O

N) -

On

- R

esis

tanc

e (m

Ω)

Nor

mal

ized

Thr

esho

ld V

olta

ge

0.0 0.5 1.0 1.5 2.0 2.5 3.00

1

2

3

4

5

6

7

8

9

10

1.5V

2V

VGS

= 2.5,3,4,5,6,7,8,9,10V

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

IDS

=250µA

0 1 2 3 4 5 6 7 8 9 1020

40

60

80

100

120

140

ID=3A

0 2 4 6 8 100

20

40

60

80

100

120

140

160

180

200

VGS

=1.8V

VGS

=2.5V

VGS

=4.5V

Typical Operating Characteristics (Cont.)

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APM2324AA

VDS - Drain - Source Voltage (V)

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

Tj - Junction Temperature (°C)

C -

Cap

acita

nce

(pF)

VSD - Source - Drain Voltage (V)

Source-Drain Diode Forward

I S -

Sou

rce

Cur

rent

(A)

Capacitance Gate Charge

QG - Gate Charge (nC)

VG

S -

Gat

e - s

ourc

e V

olta

ge (V

)

-50 -25 0 25 50 75 100 125 1500.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

RON

@Tj=25oC: 50mΩ

VGS

= 4.5V

IDS

= 3A

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.60.1

1

10

Tj=150oC

Tj=25oC

0 4 8 12 16 200

50

100

150

200

250

300

350

400

450

500

Frequency=1MHz

CrssCoss

Ciss

0 2 4 6 8 100

1

2

3

4

5

6

7

8

9

10V

DS= 10V

IDS

= 3A

Typical Operating Characteristics (Cont.)

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APM2324AA

Package Information

SOT-23

0L

VIEW A

0.25

GAUGE PLANESEATING PLANE

AA2

A1

e

D

EE1

SEEVIEW A

b c

e1

MAX.

0.057

0.051

0.024

0.006

0.009

0.0200.012

L 0.30

0

e

e1

E1

E

D

c

b

0.08

0.30

0.60 0.012

0.95 BSC

1.90 BSC

0.22

0.50

0.037 BSC

0.075 BSC

0.003

MIN.

MILLIMETERS

SYMBOL

A1

A2

A

0.00

0.90

SOT-23

MAX.

1.45

0.15

1.30

MIN.

0.000

0.035

INCHES

°8°0 °8°0

1.40

2.60

1.80

3.00

2.70 3.10 0.122

0.071

0.1180.102

0.055

0.106

Note : Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side.

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APM2324AA

Application A H T1 C d D W E1 F

178.0±2.00 50 MIN. 8.4+2.00 -0.00

13.0+0.50 -0.20

1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05

P0 P1 P2 D0 D1 T A0 B0 K0 SOT-23

4.0±0.10 4.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.0 MIN. 0.6+0.00

-0.40 3.20±0.20 3.10±0.20 1.50±0.20

(mm)

Carrier Tape & Reel Dimensions

H

T1

A

d

A

E1

AB

W

F

T

P0OD0

BA0

P2

K0

B0

SECTION B-B

SECTION A-A

OD1

P1

Package Type Unit Quantity SOT-23 Tape & Reel 3000

Devices Per Unit

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APM2324AA

Reflow Condition (IR/Convection or VPR Reflow)

t 25 C to Peak

tp

Ramp-up

tL

Ramp-down

tsPreheat

Tsmax

Tsmin

TL

TP

25

Tem

per

atu

re

Time

Critical ZoneTL to TP

°

Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 SEC HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B,A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles ESD MIL-STD-883D-3015.7 VHBM > 2KV, VMM > 200V Latch-Up JESD 78 10ms, 1tr > 100mA

Reliability Test Program

Taping Direction InformationSOT-23

USER DIRECTION OF FEED

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www.anpec.com.tw10

APM2324AA

Customer Service

Anpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, TaiwanTel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindian City, Taipei County 23146, TaiwanTel : 886-2-2910-3838Fax : 886-2-2917-3838

Classification Reflow ProfilesProfile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly

Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.

Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)

100°C 150°C

60-120 seconds

150°C 200°C

60-180 seconds

Time maintained above: - Temperature (TL) - Time (tL)

183°C 60-150 seconds

217°C 60-150 seconds

Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)

10-30 seconds 20-40 seconds

Ramp-down Rate 6°C/second max. 6°C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Notes: All temperatures refer to topside of the package. Measured on the body surface. Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures

Package Thickness Volume mm3

<350 Volume mm3

≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C

Table 2. Pb-free Process – Package Classification Reflow Temperatures Package Thickness Volume mm3

<350 Volume mm3

350-2000 Volume mm3

>2000 <1.6 mm 260 +0°C* 260 +0°C* 260 +0°C*

1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C* ≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C*

*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.

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N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. A.3 - Dec., 2008

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, andadvise customers to obtain the latest version of relevant information to verify before placing orders.

APM2300CA

Features

Applications

Pin Description

Ordering and Marking Information

Top View of SOT-23

N-Channel MOSFET

• 20V/6A ,

RDS(ON)=25mΩ (typ.) @ VGS=10VRDS(ON)=32mΩ (typ.) @ VGS=4.5VRDS(ON)=40mΩ (typ.) @ VGS=2.5VRDS(ON)=65mΩ (typ.) @ VGS=1.8V

• Super High Dense Cell Design

• Reliable and Rugged

• Lead Free and Green Devices Available

(RoHS Compliant)

• Power Management in Notebook Computer,

Portable Equipment and Battery PoweredSystems

APM2300C

Handling CodeTemperature RangePackage Code

Package Code A : SOT-23Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material G : Halogen and Lead Free Device

APM2300C A : C00X X - Date Code

Assembly Material

D

G

S

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).

G

S

D

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APM2300CA

Absolute Maximum Ratings (TA = 25°C unless otherwise noted)

Electrical Characteristics (TA = 25°C unless otherwise noted)

Symbol Parameter Rating Unit

VDSS Drain-Source Voltage 20

VGSS Gate-Source Voltage ±12 V

ID* Continuous Drain Current 6

IDM* 300µs Pulsed Drain Current VGS=10V

20 A

IS* Diode Continuous Forward Current 1 A

TJ Maximum Junction Temperature 150

TSTG Storage Temperature Range -55 to 150 °C

TA=25°C 0.83 PD* Maximum Power Dissipation

TA=100°C 0.3 W

RθJA* Thermal Resistance-Junction to Ambient 150 °C/W

Note : *Surface Mounted on 1in2 pad area, t ≤ 10sec.

APM2300CA Symbol Parameter Test Conditions

Min. Typ. Max. Unit

Static Characteristics

BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 20 - - V

VDS=16V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current

TJ=85°C - - 30 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 0.5 0.75 1 V

IGSS Gate Leakage Current VGS=±10V, VDS=0V - - ±10 µA

VGS=10V, IDS=6A - 25 30

VGS=4.5V, IDS=3A - 32 40

VGS=2.5V, IDS=2A - 40 55 RDS(ON)

a Drain-Source On-state Resistance

VGS=1.8V, IDS=1A - 65 110

VSDa Diode Forward Voltage ISD=1A, VGS=0V - 0.7 1.3 V

Gate Charge Characteristics b

Qg Total Gate Charge - 6 8

Qgs Gate-Source Charge - 0.7 -

Qgd Gate-Drain Charge

VDS=10V, VGS=4.5V, IDS=6A

- 3 -

nC

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APM2300CA

Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)

APM2300CA Symbol Parameter Test Conditions

Min. Typ. Max. Unit

Dynamic Characteristics b

RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 6 - Ω

Ciss Input Capacitance - 430 -

Coss Output Capacitance - 110 -

Crss Reverse Transfer Capacitance

VGS=0V, VDS=10V, Frequency=1.0MHz - 90 -

pF

td(ON) Turn-on Delay Time - 5 10

tr Turn-on Rise Time - 15 28

td(OFF) Turn-off Delay Time - 26 48

tf Turn-off Fall Time

VDD=10V, RL=10Ω, IDS=1A, VGEN=4.5V, RG=6Ω

- 15 28

ns

trr Reverse Recovery Time - 21 - ns

Qrr Reverse Recovery Charge ISD=6A, dlSD/dt=100A/µs

- 8 - nC

Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.

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www.anpec.com.tw4

APM2300CA

Typical Operating Characteristics

ID -

Dra

in C

urre

nt (A

)

Drain Current

Tj - Junction Temperature (°C)

Safe Operation Area

VDS - Drain - Source Voltage (V)

Thermal Transient Impedance

Square Wave Pulse Duration (sec)

Power Dissipation

Pto

t - P

ower

(W)

Tj - Junction Temperature (°C)

ID -

Dra

in C

urre

nt (A

)

Nor

mal

ized

Tra

nsie

nt T

herm

al R

esis

tanc

e

0 20 40 60 80 100 120 140 1600.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

TA=25oC

0 20 40 60 80 100 120 140 1600

1

2

3

4

5

6

7

TA=25oC,V

G=10V

0.1 1 10 1000.01

0.1

1

10

100

Rds(on

) Lim

it

1s

TA=25oC

10ms

1ms

100ms

DC

1E-4 1E-3 0.01 0.1 1 10 1001E-3

0.01

0.1

1

2

Mounted on 1in2 padR

θJA : 150 oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

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Copyright ANPEC Electronics Corp.Rev. A.3 - Dec., 2008

www.anpec.com.tw5

APM2300CA

RD

S(O

N) - O

n - R

esis

tanc

e (m

Ω)

Drain-Source On Resistance

ID - Drain Current (A)

Tj - Junction Temperature (°C)

Gate Threshold Voltage

VDS - Drain-Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Output Characteristics

Drain-Source On Resistance

VGS - Gate - Source Voltage (V)

RD

S(O

N) -

On

- Res

ista

nce

(mΩ

)

Nor

mal

ized

Thr

esho

ld V

olta

ge

Typical Operating Characteristics (Cont.)

0.0 0.5 1.0 1.5 2.0 2.5 3.00

2

4

6

8

10

12

14

16

18

20

2V

1.5V

VGS

=2.5,3,4,5,6,7,8,9,10V

0 4 8 12 16 200

20

40

60

80

100

120

140

160

VGS

=1.8V

VGS

=10V

VGS

=2.5V

VGS

=4.5V

0 1 2 3 4 5 6 7 8 9 1010

15

20

25

30

35

40

45

50

55

60

ID=6A

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6IDS

= 250µA

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APM2300CA

VDS - Drain - Source Voltage (V)

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

Tj - Junction Temperature (°C)

C -

Cap

acita

nce

(pF)

VSD - Source - Drain Voltage (V)

Source-Drain Diode Forward

IS -

Sou

rce

Cur

rent

(A)

Capacitance Gate Charge

QG - Gate Charge (nC)

VG

S -

Gat

e - s

ourc

e V

olta

ge (V

)

Typical Operating Characteristics (Cont.)

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

RON

@Tj=25oC: 25mΩ

VGS

= 10V

IDS

= 6A

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.60.1

1

10

20

Tj=150oC

Tj=25oC

0 4 8 12 16 200

100

200

300

400

500

600

700

800

Frequency=1MHz

CrssCoss

Ciss

0 2 4 6 8 10 12 140

1

2

3

4

5

6

7

8

9

10V

DS =10V

IDS

= 6A

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APM2300CA

Package InformationSOT-23

0L

VIEW A

0.25

GAUGE PLANESEATING PLANE

AA2

A1

e

D

EE1

SEEVIEW A

b c

e1

MAX.

0.057

0.051

0.024

0.006

0.009

0.0200.012

L 0.30

0

e

e1

E1

E

D

c

b

0.08

0.30

0.60 0.012

0.95 BSC

1.90 BSC

0.22

0.50

0.037 BSC

0.075 BSC

0.003

MIN.

MILLIMETERS

SYMBOL

A1

A2

A

0.00

0.90

SOT-23

MAX.

1.45

0.15

1.30

MIN.

0.000

0.035

INCHES

°8°0 °8°0

1.40

2.60

1.80

3.00

2.70 3.10 0.122

0.071

0.1180.102

0.055

0.106

Note : Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side.

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Copyright ANPEC Electronics Corp.Rev. A.3 - Dec., 2008

www.anpec.com.tw8

APM2300CA

Application A H T1 C d D W E1 F

178.0±2.00 50 MIN. 8.4+2.00 -0.00

13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05

P0 P1 P2 D0 D1 T A0 B0 K0 SOT-23

4.0±0.10 4.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.0 MIN. 0.6+0.00

-0.40 3.20±0.20 3.10±0.20 1.50±0.20

(mm)

Carrier Tape & Reel Dimensions

H

T1

A

d

A

E1

AB

W

F

T

P0OD0

BA0

P2

K0

B0

SECTION B-B

SECTION A-A

OD1

P1

Devices Per Unit

Package Type Unit Quantity

SOT-23 Tape & Reel 3000

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APM2300CA

Taping Direction InformationSOT-23

USER DIRECTION OF FEED

Reflow Condition (IR/Convection or VPR Reflow)

t 25 C to Peak

tp

Ramp-up

tL

Ramp-downts

Preheat

Tsmax

Tsmin

TL

TP

25

Tem

per

atur

e

Time

Critical ZoneTL to TP

°

Reliability Test Program

Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles

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www.anpec.com.tw10

APM2300CA

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.

Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)

100°C 150°C

60-120 seconds

150°C 200°C

60-180 seconds

Time maintained above: - Temperature (TL) - Time (tL)

183°C 60-150 seconds

217°C 60-150 seconds

Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)

10-30 seconds 20-40 seconds

Ramp-down Rate 6°C/second max. 6°C/second max.

Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.

Classification Reflow Profiles

Table 2. Pb-free Process – Package Classification Reflow Temperatures

Package Thickness Volume mm3 <350

Volume mm3 350-2000

Volume mm3 >2000

<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*

≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.

Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures

Package Thickness Volume mm3

<350 Volume mm3

≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C

Customer Service

Anpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838

Fax : 886-2-2917-3838

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N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. B.2 - Nov., 2008

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.

APM2306A

Features

Applications

• Power Management in Notebook Computer,

Portable Equipment and Battery PoweredSystems.

Pin Description

Ordering and Marking Information

Top View of SOT-23

N-Channel MOSFET

• 30V/3.5A ,

RDS(ON)=42mΩ(typ.) @ VGS=10V RDS(ON)=70mΩ(typ.) @ VGS=5V

• Super High Dense Cell Design

• Reliable and Rugged

• Lead Free and Green Devices Available

(RoHS Compliant)

G

S

D

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).

D

G

S

APM2306

Handling Code

Temperature RangePackage Code

Package Code A : SOT-23Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material L : Lead Free Device G : Halogen and Lead Free Device

APM2306 A : M06X X - Date Code

Assembly Material

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Copyright ANPEC Electronics Corp.Rev. B.2 - Nov., 2008

www.anpec.com.tw2

APM2306A

Absolute Maximum Ratings (TA = 25°C unless otherwise noted)

Electrical Characteristics (TA = 25°C unless otherwise noted)

Symbol Parameter Rating Unit

VDSS Drain-Source Voltage 30

VGSS Gate-Source Voltage ±20 V

ID* Continuous Drain Current 3.5

IDM* 300µs Pulsed Drain Current VGS=10V

14 A

IS* Diode Continuous Forward Current 1.3 A

TJ Maximum Junction Temperature 150

TSTG Storage Temperature Range -55 to 150 °C

TA=25°C 0.83 PD* Maximum Power Dissipation

TA=100°C 0.3 W

RθJA* Thermal Resistance-Junction to Ambient 150 °C/W

Note : *Surface Mounted on 1in2 pad area, t ≤ 10sec.

APM2306A Symbol Parameter Test Conditions

Min. Typ. Max. Unit

STATIC CHARACTERISTICS

BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 30 - - V

VDS=24V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current

TJ=85°C - - 30 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1 1.5 2 V

IGSS Gate Leakage Current VGS=±20V, VDS=0V - - ±100 nA

VGS=10V, IDS=3.5A - 42 65 RDS(ON)

a Drain-Source On-State Resistance VGS=5V, IDS=2.8A - 70 90

VSDa Diode Forward Voltage ISD=1.25A, VGS=0V - 0.8 1.3 V

GATE CHARGE CHARACTERISTICS b

Qg Total Gate Charge - 12.5 16

Qgs Gate-Source Charge - 2.4 -

Qgd Gate-Drain Charge

VDS=15V, VGS=10V, IDS=3.5A

- 1.3 -

nC

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www.anpec.com.tw3

APM2306A

Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)

APM2306A Symbol Parameter Test Conditions

Min. Typ. Max. Unit

DYNAMIC CHARACTERISTICS b

RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 1.5 - Ω

Ciss Input Capacitance - 400 -

Coss Output Capacitance - 80 -

Crss Reverse Transfer Capacitance

VGS=0V, VDS=25V, Frequency=1.0MHz - 45 -

pF

td(ON) Turn-on Delay Time - 10 19

Tr Turn-on Rise Time - 8 15

td(OFF) Turn-off Delay Time - 19 35

Tf Turn-off Fall Time

VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω

- 6.2 12

ns

Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.

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Copyright ANPEC Electronics Corp.Rev. B.2 - Nov., 2008

www.anpec.com.tw4

APM2306A

1E-4 1E-3 0.01 0.1 1 10 1001E-3

0.01

0.1

1

2

Mounted on 1in2 padR

θJA : 150 oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

Typical Operating Characteristics

I D -

Dra

in C

urre

nt (

A)

Drain Current

Tj - Junction Temperature (°C)

Safe Operation Area

VDS - Drain - Source Voltage (V)

Thermal Transient Impedance

Square Wave Pulse Duration (sec)

Power Dissipation

Pto

t - P

ower

(W)

Tj - Junction Temperature (°C)

I D -

Dra

in C

urre

nt (A

)

0 20 40 60 80 100 120 140 1600.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

TA=25oC

0 20 40 60 80 100 120 140 1600.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

TA=25oC,V

G=10V

0.01 0.1 1 10 1000.01

0.1

1

10

50

Rds(on

) Lim

it

1s

TA=25oC

10ms

300µs

1ms

100ms

DC

Nor

mal

ized

Tra

nsie

nt T

herm

al R

esis

tanc

e

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Copyright ANPEC Electronics Corp.Rev. B.2 - Nov., 2008

www.anpec.com.tw5

APM2306A

RD

S(O

N) -

On

- R

esis

tanc

e (m

Ω)

Drain-Source On Resistance

ID - Drain Current (A)

Tj - Junction Temperature (°C)

Gate Threshold Voltage

VDS - Drain - Source Voltage (V)

I D -

Dra

in C

urre

nt (A

)

Output Characteristics

Transfer Characteristics

VGS - Gate - Source Voltage (V)

I D -

Dra

in C

urre

nt (A

)

Nor

mal

ized

Thr

esho

ld V

olta

ge

0 1 2 3 4 50

2

4

6

8

10

12

14

3V

4V

VGS

= 5, 6, 7, 8, 9, 10V

0 2 4 6 8 100

20

40

60

80

100

120

VGS

=5V

VGS

=10V

0 1 2 3 4 5 6 70

2

4

6

8

10

12

14

TJ=-55oC

TJ=25oC

TJ=125oC

-50 -25 0 25 50 75 100 125 1500.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

IDS

=250µΑ

Typical Operating Characteristics (Cont.)

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Copyright ANPEC Electronics Corp.Rev. B.2 - Nov., 2008

www.anpec.com.tw6

APM2306A

VDS - Drain - Source Voltage (V)

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

Tj - Junction Temperature (°C)

C -

Cap

acita

nce

(pF)

VSD - Source - Drain Voltage (V)

Source-Drain Diode Forward

I S -

Sou

rce

Cur

rent

(A)

Capacitance Gate Charge

QG - Gate Charge (nC)

VG

S -

Gat

e - s

ourc

e V

olta

ge (V

)

-50 -25 0 25 50 75 100 125 1500.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

RON

@Tj=25oC: 42mΩ

VGS

= 10V

IDS

= 3.5A

0.0 0.4 0.8 1.2 1.6 2.01

10

20

TJ=150oC

TJ=25oC

0 5 10 15 20 25 300

100

200

300

400

500

600Frequency=1MHz

CrssCoss

Ciss

0 2 4 6 8 10 12 140

2

4

6

8

10V

DS = 15V

ID = 3.5A

Typical Operating Characteristics (Cont.)

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Copyright ANPEC Electronics Corp.Rev. B.2 - Nov., 2008

www.anpec.com.tw7

APM2306A

Package InformationSOT-23

0L

VIEW A

0.25

GAUGE PLANESEATING PLANE

AA2

A1

e

D

EE1

SEEVIEW A

b c

e1

MAX.

0.057

0.051

0.024

0.006

0.009

0.0200.012

L 0.30

0

e

e1

E1

E

D

c

b

0.08

0.30

0.60 0.012

0.95 BSC

1.90 BSC

0.22

0.50

0.037 BSC

0.075 BSC

0.003

MIN.

MILLIMETERS

SYMBOL

A1

A2

A

0.00

0.90

SOT-23

MAX.

1.45

0.15

1.30

MIN.

0.000

0.035

INCHES

°8°0 °8°0

1.40

2.60

1.80

3.00

2.70 3.10 0.122

0.071

0.1180.102

0.055

0.106

Note : Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side.

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Copyright ANPEC Electronics Corp.Rev. B.2 - Nov., 2008

www.anpec.com.tw8

APM2306A

Application A H T1 C d D W E1 F

178.0±2.00 50 MIN. 8.4+2.00 -0.00

13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05

P0 P1 P2 D0 D1 T A0 B0 K0 SOT-23

4.0±0.10 4.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.0 MIN. 0.6+0.00

-0.40 3.20±0.20 3.10±0.20 1.50±0.20

(mm)

Carrier Tape & Reel Dimensions

H

T1

A

d

A

E1

AB

W

F

T

P0OD0

BA0

P2

K0

B0

SECTION B-B

SECTION A-A

OD1

P1

Devices Per Unit

Package Type Unit Quantity

SOT-23 Tape & Reel 3000

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Copyright ANPEC Electronics Corp.Rev. B.2 - Nov., 2008

www.anpec.com.tw9

APM2306A

Taping Direction InformationSOT-23

USER DIRECTION OF FEED

Reflow Condition (IR/Convection or VPR Reflow)

t 25 C to Peak

tp

Ramp-up

tL

Ramp-downts

Preheat

Tsmax

Tsmin

TL

TP

25

Tem

per

atur

e

Time

Critical ZoneTL to TP

°

Reliability Test Program

Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles

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Copyright ANPEC Electronics Corp.Rev. B.2 - Nov., 2008

www.anpec.com.tw10

APM2306A

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.

Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)

100°C 150°C

60-120 seconds

150°C 200°C

60-180 seconds

Time maintained above: - Temperature (TL) - Time (tL)

183°C 60-150 seconds

217°C 60-150 seconds

Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)

10-30 seconds 20-40 seconds

Ramp-down Rate 6°C/second max. 6°C/second max.

Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.

Classification Reflow Profiles

Table 2. Pb-free Process – Package Classification Reflow Temperatures

Package Thickness Volume mm3 <350

Volume mm3 350-2000

Volume mm3 >2000

<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*

≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.

Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures

Package Thickness Volume mm3

<350 Volume mm3

≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C

Customer Service

Anpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838

Fax : 886-2-2917-3838

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N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. A.1 - Nov., 2007

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.

APM2308A

Features

Applications

• Power Management in Notebook Computer,

Portable Equipment and Battery Powered Systems.

Pin Description

Ordering and Marking Information

Top View of SOT-23-3

N-Channel MOSFET

• 30V/3A ,

RDS(ON)= 60mΩ(typ.) @ VGS= 10V RDS(ON)= 90mΩ(typ.) @ VGS= 4.5V

• Super High Dense Cell Design

• Reliable and Rugged

• Lead Free Available (RoHS Compliant)

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte in plate termina-tion finish; which are fully compliant with RoHS and compatible with both SnPb and lead-free soldering operations.ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C for MSL classifica-tion at lead-free peak reflow temperature.

APM2308

Handling CodeTemp. RangePackage Code

Package Code A : SOT-23-3Operating Junction Temp. Range C : -55 to 150°CHandling Code TR : Tape & ReelLead Free Code L : Lead Free Device

APM2308 A: M08X XXXXX - Date Code

Lead Free Code

S

D

G

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Copyright ANPEC Electronics Corp.Rev. A.1 - Nov., 2007

www.anpec.com.tw2

APM2308A

Absolute Maximum Ratings (TA = 25°C unless otherwise noted)

Electrical Characteristics (TA = 25°C unless otherwise noted)

Symbol Parameter Rating Unit

VDSS Drain-Source Voltage 30

VGSS Gate-Source Voltage ±20 V

ID* Continuous Drain Current 3

IDM* 300µs Pulsed Drain Current VGS=10V

10 A

IS* Diode Continuous Forward Current 2 A

TJ Maximum Junction Temperature 150

TSTG Storage Temperature Range -55 to 150 °C

TA=25°C 0.83 PD* Maximum Power Dissipation

TA=100°C 0.3 W

RθJA* Thermal Resistance-Junction to Ambient 150 °C/W Note:

*Surface Mounted on 1in2 pad area, t ≤ 10sec.

APM2308A Symbol Parameter Test Condition

Min. Typ. Max. Unit

Static Characteristics BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 30 V

VDS=24V, VGS=0V 1 IDSS Zero Gate Voltage Drain Current

TJ=85°C 30 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1.3 1.8 2.5 V

IGSS Gate Leakage Current VGS=±16V, VDS=0V ±10 µA

VGS=10V, IDS=3A 60 80 RDS(ON)

a Drain-Source On-state Resistance VGS=4.5V, IDS=2A 90 120

Diode Characteristics VSD

a Diode Forward Voltage ISD=2A, VGS=0V 0.8 1.1 V

trr Reverse Recovery Time 19 ns

Qrr Reverse Recovery Charge ISD=3A, dlSD/dt=100A/µs

9 nC

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Copyright ANPEC Electronics Corp.Rev. A.1 - Nov., 2007

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APM2308A

Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)

APM2308A Symbol Parameter Test Condition

Min. Typ. Max. Unit

Dynamic Characteristics b RG Gate Resistance VGS=0V, VDS=0V,F=1MHz 6 Ω

Ciss Input Capacitance 280

Coss Output Capacitance 50

Crss Reverse Transfer Capacitance

VGS=0V, VDS=15V, Frequency=1.0MHz 35

pF

td(ON) Turn-on Delay Time 5 10

tr Turn-on Rise Time 10 19

td(OFF) Turn-off Delay Time 16 30

tf Turn-off Fall Time

VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω

4 8

ns

Gate Charge Characteristics b

Qg Total Gate Charge 6 8

Qgs Gate-Source Charge 1

Qgd Gate-Drain Charge

VDS=15V, VGS=10V, IDS=3A

1.4

nC

Notes:

a : Pulse test ; pulse width≤300µs, duty cycle≤2%. b : Guaranteed by design, not subject to production testing.

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Copyright ANPEC Electronics Corp.Rev. A.1 - Nov., 2007

www.anpec.com.tw4

APM2308A

Typical Characteristics

ID -

Dra

in C

urre

nt (A

)

Drain Current

Tj - Junction Temperature (°C)

Safe Operation Area

VDS - Drain - Source Voltage (V)

Thermal Transient Impedance

Square Wave Pulse Duration (sec)

Power Dissipation

Pto

t - P

ower

(W)

Tj - Junction Temperature (°C)

ID -

Dra

in C

urre

nt (A

)

Nor

mal

ized

Tra

nsie

nt T

herm

al R

esis

tanc

e

0 20 40 60 80 100 120 140 1600.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

TA=25oC

0 20 40 60 80 100 120 140 1600.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

TA=25oC,V

G=10V

0.01 0.1 1 10 1000.01

0.1

1

10

20

Rds(

on) L

imit

1s

TA=25oC

10ms

300µs

1ms

100ms

DC

1E-4 1E-3 0.01 0.1 1 10 1000.01

0.1

1

2

Mounted on 1in2 padR

θJA : 150 oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

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Copyright ANPEC Electronics Corp.Rev. A.1 - Nov., 2007

www.anpec.com.tw5

APM2308A

RD

S(O

N) - O

n - R

esis

tanc

e (m

Ω)

Drain-Source On Resistance

ID - Drain Current (A)

Tj - Junction Temperature (°C)

Gate Threshold Voltage

VDS - Drain - Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Output Characteristics

Drain-Source On Resistance

VGS - Gate-Source Voltage (V)

RD

S(O

N) -

On

Res

ista

nce

(mΩ

)

Nor

mal

ized

Thr

esho

ld V

olta

ge

Typical Characteristics (Cont.)

0 2 4 6 8 1020

30

40

50

60

70

80

90

100

110

120

130

140

VGS

=4.5V

VGS

=10V

0.0 0.5 1.0 1.5 2.0 2.5 3.00

1

2

3

4

5

6

7

8

9

10

2.5V

3V

VGS

= 4.5,5,6,7,8,9,10V

1 2 3 4 5 6 7 8 9 1040

60

80

100

120

140

160

ID=3A

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

IDS

=250µA

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Copyright ANPEC Electronics Corp.Rev. A.1 - Nov., 2007

www.anpec.com.tw6

APM2308A

VDS - Drain - Source Voltage (V)

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

Tj - Junction Temperature (°C)

C -

Cap

acita

nce

(pF)

VSD - Source - Drain Voltage (V)

Source-Drain Diode Forward

IS -

Sou

rce

Cur

rent

(A)

Capacitance Gate Charge

QG - Gate Charge (nC)

VG

S -

Gat

e - s

ourc

e V

olta

ge (V

)

Typical Characteristics (Cont.)

-50 -25 0 25 50 75 100 125 1500.00

0.25

0.50

0.75

1.00

1.25

1.50

1.75

2.00

VGS

= 10V

IDS

= 3A

RON

@Tj=25oC: 60mΩ

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.40.1

1

10

Tj=150oC

Tj=25oC

0 1 2 3 4 5 6 70

1

2

3

4

5

6

7

8

9

10V

DS=15V

IDS

=3A

0 5 10 15 20 25 300

50

100

150

200

250

300

350

400

450

500

550

600

Frequency=1MHz

CrssCoss

Ciss

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Copyright ANPEC Electronics Corp.Rev. A.1 - Nov., 2007

www.anpec.com.tw7

APM2308A

Package Information

SOT-23-3

0L

VIEW A

0.25

GAUGE PLANESEATING PLANE

AA2

A1

e

D

EE1

SEEVIEW A

b c

e1

MAX.

0.057

0.051

0.024

0.006

0.009

0.0200.012

L 0.30

0

e

e1

E1

E

D

c

b

0.08

0.30

0.60 0.012

2.80 BSC

0.95 BSC

1.90 BSC

1.60 BSC

0.22

0.50

2.90 BSC

0.110 BSC

0.037 BSC

0.075 BSC

0.063 BSC

0.114 BSC

0.003

MIN.

MILLIMETERS

SYMBOL

A1

A2

A

0.00

0.90

SOT-23-3

MAX.

1.45

0.15

1.30

MIN.

0.000

0.035

INCHES

°8°0 °8°0

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www.anpec.com.tw8

APM2308A

Carrier Tape & Reel Dimensions

H

T1

A

d

A

E1

AB

W

F

T

P0OD0

BA0

P2

K0

B0

SECTION B-B

SECTION A-A

OD1

P1

Application A H T1 C d D W E1 F

178.0±2.00 50 MIN. 8.4+2.00 -0.00

13.0+0.50 -0.20

1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05

P0 P1 P2 D0 D1 T A0 B0 K0 SOT- 23-3

4.0±0.10 4.0±0.10 2.0±0.10 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00

-0.40 3.20±0.20 3.10±0.20 1.50±0.20

(mm)

Package Type Unit Quantity

SOT-23-3 Tape & Reel 3000

Devices Per Unit

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APM2308A

Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles

Reflow Condition (IR/Convection or VPR Reflow)

Classification Reflow ProfilesProfile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly

Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.

Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)

100°C 150°C

60-120 seconds

150°C 200°C

60-180 seconds

Time maintained above: - Temperature (TL) - Time (tL)

183°C 60-150 seconds

217°C 60-150 seconds

Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)

10-30 seconds 20-40 seconds

Ramp-down Rate 6°C/second max. 6°C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.

Reliability Test Program

t 25 C to Peak

tp

Ramp-up

tL

Ramp-downts

Preheat

Tsmax

Tsmin

TL

TP

25

Tem

per

atur

e

Time

Critical ZoneTL to TP

°

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APM2308A

Table 2. Pb-free Process – Package Classification Reflow Temperatures Package Thickness Volume mm3

<350 Volume mm3

350-2000 Volume mm3

>2000 <1.6 mm 260 +0°C* 260 +0°C* 260 +0°C*

1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C* ≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C*

*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.

Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures Package Thickness Volume mm3

<350 Volume mm3

≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C

Classification Reflow Profiles (Cont.)

Customer Service

Anpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838Fax : 886-2-2917-3838

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N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. B.2 - Dec., 2008

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.

APM2318A

Features

Applications

• Power Management in Notebook Computer,

Portable Equipment and Battery PoweredSystems.

Pin Description

Ordering and Marking Information

Top View of SOT-23-3

N-Channel MOSFET

• 30V/3A ,

RDS(ON)=35mΩ(typ.) @ VGS=10V RDS(ON)=40mΩ(typ.) @ VGS=4.5V RDS(ON)=60mΩ(typ.) @ VGS=2.5V

• Super High Dense Cell Design

• Reliable and Rugged

• Lead Free and Green Devices Available

(RoHS Compliant)

D

G

S

G

S

D

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).

APM2318

Handling CodeTemperature RangePackage Code

Package Code A : SOT-23-3Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material G : Halogen and Lead Free Device

APM2318 A : M18X X - Date Code

Assembly Material

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Copyright ANPEC Electronics Corp.Rev. B.2 - Dec., 2008

www.anpec.com.tw2

APM2318A

Absolute Maximum Ratings (TA = 25°C unless otherwise noted)

Electrical Characteristics (TA = 25°C unless otherwise noted)

Symbol Parameter Rating Unit

VDSS Drain-Source Voltage 30

VGSS Gate-Source Voltage ±12 V

ID* Continuous Drain Current 3

IDM* 300µs Pulsed Drain Current VGS=10V

12 A

IS* Diode Continuous Forward Current 1 A

TJ Maximum Junction Temperature 150

TSTG Storage Temperature Range -55 to 150 °C

TA=25°C 0.83 PD* Maximum Power Dissipation

TA=100°C 0.3 W

RθJA* Thermal Resistance-Junction to Ambient 150 °C/W

Note : *Surface Mounted on 1in2 pad area, t ≤ 10sec.

APM2318A Symbol Parameter Test Conditions

Min. Typ. Max. Unit

Static Characteristics

BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 30 - - V

VDS=24V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current

TJ=85°C - - 30 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 0.5 0.7 1 V

IGSS Gate Leakage Current VGS=±12V, VDS=0V - - ±100 nA

VGS=10V, IDS=3A - 35 50

VGS=4.5V, IDS=2A - 40 55 RDS(ON) a Drain-Source On-state Resistance

VGS=2.5V, IDS=1.5A - 60 80

VSDa Diode Forward Voltage ISD=0.5A, VGS=0V - 0.7 1.3 V

Gate Charge Characteristics b

Qg Total Gate Charge - 12 16

Qgs Gate-Source Charge - 0.8 -

Qgd Gate-Drain Charge

VDS=15V, VGS=10V, IDS=3A

- 0.8 -

nC

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APM2318A

Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)

APM2318A Symbol Parameter Test Conditions

Min. Typ. Max. Unit

Dynamic Characteristics b

RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 1.5 - Ω

Ciss Input Capacitance - 320 -

Coss Output Capacitance - 25 -

Crss Reverse Transfer Capacitance

VGS=0V, VDS=25V, Frequency=1.0MHz - 15 -

pF

td(ON) Turn-on Delay Time - 11 22

Tr Turn-on Rise Time - 17 32

td(OFF) Turn-off Delay Time - 37 68

Tf Turn-off Fall Time

VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω

- 20 38

ns

Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.

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APM2318A

1E-4 1E-3 0.01 0.1 10 1000.01

0.1

1

2

Mounted on 1in2 padR

θJA : 150 oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

Typical Operating Characteristics

ID -

Dra

in C

urre

nt (A

)

Drain Current

Tj - Junction Temperature (°C)

Safe Operation Area

VDS - Drain - Source Voltage (V)

Thermal Transient Impedance

Square Wave Pulse Duration (sec)

Power Dissipation

Pto

t - P

ower

(W)

Tj - Junction Temperature (°C)

ID -

Dra

in C

urre

nt (A

)

0 20 40 60 80 100 120 140 1600.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

TA=25oC

0 20 40 60 80 100 120 140 1600.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

TA=25oC,V

G=10V

0.01 0.1 1 10 1000.01

0.1

1

10

50

Rds(on

) Lim

it

1s

TA=25oC

10ms

300µs

1ms

100ms

DC

Nor

mal

ized

Tra

nsie

nt T

herm

al R

esis

tanc

e

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www.anpec.com.tw5

APM2318A

RD

S(O

N) - O

n - R

esis

tanc

e (m

Ω)

Drain-Source On Resistance

ID - Drain Current (A)

Tj - Junction Temperature (°C)

Gate Threshold Voltage

VDS - Drain-Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Output Characteristics

Transfer Characteristics

VGS - Gate - Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Nor

mal

ized

Thr

esho

ld V

olta

ge

Typical Operating Characteristics (Cont.)

0 1 2 3 4 50

2

4

6

8

10

12

2V

1.5V

VGS

= 3,4,5,6,7,8,9,10V

0 2 4 6 8 10 120

10

20

30

40

50

60

70

80

90

100

VGS

=10V

VGS

=2.5V

VGS

=4.5V

0.0 0.5 1.0 1.5 2.0 2.5 3.000

2

4

6

8

10

12

Tj=125oC

Tj=25oC T

j=-55oC

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

IDS

=250µA

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www.anpec.com.tw6

APM2318A

VDS - Drain - Source Voltage (V)

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

Tj - Junction Temperature (°C)

C -

Cap

acita

nce

(pF)

VSD - Source - Drain Voltage (V)

Source-Drain Diode Forward

IS -

Sou

rce

Cur

rent

(A)

Capacitance Gate Charge

QG - Gate Charge (nC)

VG

S -

Gat

e - s

ourc

e V

olta

ge (V

)

Typical Operating Characteristics (Cont.)

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.40.1

1

10

Tj=150oC

Tj=25oC

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

RON

@Tj=25oC: 35mΩ

VGS

= 10V

IDS

= 3A

0 5 10 15 20 25 300

100

200

300

400

500Frequency=1MHz

Crss Coss

Ciss

0 2 4 6 8 10 120

2

4

6

8

10V

DS=15V

IDS

= 3A

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APM2318A

Package InformationSOT-23-3

0L

VIEW A

0.25

GAUGE PLANESEATING PLANE

AA2

A1

e

D

EE1

SEEVIEW A

b c

e1

MAX.

0.057

0.051

0.024

0.006

0.009

0.0200.012

L 0.30

0

e

e1

E1

E

D

c

b

0.08

0.30

0.60 0.012

0.95 BSC

1.90 BSC

0.22

0.50

0.037 BSC

0.075 BSC

0.003

MIN.

MILLIMETERS

SYMBOL

A1

A2

A

0.00

0.90

SOT-23-3

MAX.

1.45

0.15

1.30

MIN.

0.000

0.035

INCHES

°8°0 °8°0

1.40

2.60

1.80

3.00

2.70 3.10 0.122

0.071

0.1180.102

0.055

0.106

Note : Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side.

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Copyright ANPEC Electronics Corp.Rev. B.2 - Dec., 2008

www.anpec.com.tw8

APM2318A

Carrier Tape & Reel Dimensions

A

E1

AB

W

F

T

P0OD0

BA0

P2

K0

B0

SECTION B-B

SECTION A-A

OD1

P1

H

T1

A

d

Application A H T1 C d D W E1 F

178.0±2.00 50 MIN. 8.4+2.00 -0.00

13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05

P0 P1 P2 D0 D1 T A0 B0 K0 SOT-23-3

4.0±0.10 4.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.0 MIN. 0.6+0.00

-0.40 3.20±0.20 3.10±0.20 1.50±0.20

(mm)

Devices Per Unit

Package Type Unit Quantity

SOT-23-3 Tape & Reel 3000

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APM2318A

Taping Direction InformationSOT-23-3

Reflow Condition (IR/Convection or VPR Reflow)

t 25 C to Peak

tp

Ramp-up

tL

Ramp-downts

Preheat

Tsmax

Tsmin

TL

TP

25

Tem

per

atur

e

Time

Critical ZoneTL to TP

°

Reliability Test Program

Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles

USER DIRECTION OF FEED

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APM2318A

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.

Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)

100°C 150°C

60-120 seconds

150°C 200°C

60-180 seconds

Time maintained above: - Temperature (TL) - Time (tL)

183°C 60-150 seconds

217°C 60-150 seconds

Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)

10-30 seconds 20-40 seconds

Ramp-down Rate 6°C/second max. 6°C/second max.

Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.

Classification Reflow Profiles

Table 2. Pb-free Process – Package Classification Reflow Temperatures

Package Thickness Volume mm3 <350

Volume mm3 350-2000

Volume mm3 >2000

<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*

≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.

Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures

Package Thickness Volume mm3

<350 Volume mm3

≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C

Customer Service

Anpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838

Fax : 886-2-2917-3838

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N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. B.4 - Dec, 2008

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.

APM2320A

Features

Applications

Pin Description

Ordering and Marking Information

Top View of SOT-23-3

N-Channel MOSFET

• 30V/2.5A,

RDS(ON)=65mΩ (typ.) @ VGS=4.5VRDS(ON)=80mΩ (typ.) @ VGS=2.5V

• Super High Dense Cell Design

• Reliable and Rugged

• Lead Free and Green Devices Available

(RoHS Compliant)

• Power Management in Notebook Computer,

Portable Equipment and Battery PoweredSystems

D

G

S

G

S

D

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).

APM2320

Handling Code

Temperature RangePackage Code

Package Code A : SOT-23-3Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material G : Halogen and Lead Free Device

APM2320 A : M20X X - Date Code

Assembly Material

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APM2320A

Absolute Maximum Ratings (TA = 25°C unless otherwise noted)

Electrical Characteristics (TA = 25°C unless otherwise noted)

Symbol Parameter Rating Unit

VDSS Drain-Source Voltage 30

VGSS Gate-Source Voltage ±8 V

ID* Continuous Drain Current 2.5

IDM* 300µs Pulsed Drain Current VGS=4.5V

10 A

IS* Diode Continuous Forward Current 1 A

TJ Maximum Junction Temperature 150

TSTG Storage Temperature Range -55 to 150 °C

TA=25°C 0.83 PD* Maximum Power Dissipation

TA=100°C 0.3 W

RθJA* Thermal Resistance-Junction to Ambient 150 °C/W

Note : *Surface Mounted on 1in2 pad area, t ≤ 10sec.

APM2320A Symbol Parameter Test Conditions

Min. Typ. Max. Unit

Static Characteristics

BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 30 - - V

VDS=24V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current

TJ=85°C - - 30 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 0.5 0.7 1.2 V

IGSS Gate Leakage Current VGS=±8V, VDS=0V - - ±10 µA

VGS=4.5V, IDS=2.5A - 65 85 RDS(ON)

a Drain-Source On-state Resistance VGS=2.5V, IDS=1.5A - 80 105

VSDa Diode Forward Voltage ISD=0.5A, VGS=0V - 0.7 1.1 V

Gate Charge Characteristics b

Qg Total Gate Charge - 7.2 10

Qgs Gate-Source Charge - 0.5 -

Qgd Gate-Drain Charge

VDS=15V, VGS=10V, IDS=2.5A

- 1.2 -

nC

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APM2320A

Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)

APM2320A Symbol Parameter Test Conditions

Min. Typ. Max. Unit

Dynamic Characteristics b

RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 2.1 - Ω

Ciss Input Capacitance - 256 -

Coss Output Capacitance - 40 -

Crss Reverse Transfer Capacitance

VGS=0V, VDS=15V, Frequency=1.0MHz - 22 -

pF

td(ON) Turn-on Delay Time - 2 5

Tr Turn-on Rise Time - 12 23

td(OFF) Turn-off Delay Time - 15 28

Tf Turn-off Fall Time

VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω

- 2 5

ns

trr Reverse Recovery Time - 11 - ns

Qrr Reverse Recovery Charge ISD=2.5A, dISD/dt =100A/µs

- 6 - nC

Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.

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www.anpec.com.tw4

APM2320A

Typical Operating Characteristics

ID -

Dra

in C

urre

nt (A

)

Drain Current

Tj - Junction Temperature (°C)

Safe Operation Area

VDS - Drain - Source Voltage (V)

Thermal Transient Impedance

Square Wave Pulse Duration (sec)

Power Dissipation

Pto

t - P

ower

(W)

Tj - Junction Temperature (°C)

ID -

Dra

in C

urre

nt (A

)

Nor

mal

ized

Tra

nsie

nt T

herm

al R

esis

tanc

e

0 20 40 60 80 100 120 140 1600.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

TA=25oC

1E-4 1E-3 0.01 0.1 1 10 1000.01

0.1

1

2

Mounted on 1in2 padR

θJA : 150 oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

0.01 0.1 1 10 1000.01

0.1

1

10

20

Rds(

on) L

imit

1s

TA=25oC

10ms

300µs

1ms

100ms

DC

0 20 40 60 80 100 120 140 1600.0

0.5

1.0

1.5

2.0

2.5

3.0

TA=25oC,V

G=4.5V

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www.anpec.com.tw5

APM2320A

RD

S(O

N) - O

n - R

esis

tanc

e (m

Ω)

Drain-Source On Resistance

ID - Drain Current (A)

Tj - Junction Temperature (°C)

Gate Threshold Voltage

VDS - Drain-Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Output Characteristics

Transfer Characteristics

VGS - Gate - Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Nor

mal

ized

Thr

esho

ld V

olta

ge

Typical Operating Characteristics (Cont.)

0.0 0.5 1.0 1.5 2.0 2.5 3.00

1

2

3

4

5

6

7

8

9

10

1.5V

2V

VGS

= 3,4,5,6,7,8,9,10V

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

IDS

=250µA

0 2 4 6 8 1030

40

50

60

70

80

90

100

110

120

VGS

=2.5V

VGS

=4.5V

0.0 0.5 1.0 1.5 2.0 2.5 3.000

1

2

3

4

5

6

7

8

9

10

Tj=125oC

Tj=25oC

Tj=-55oC

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Copyright ANPEC Electronics Corp.Rev. B.4 - Dec, 2008

www.anpec.com.tw6

APM2320A

VDS - Drain - Source Voltage (V)

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

Tj - Junction Temperature (°C)

C -

Cap

acita

nce

(pF)

VSD - Source - Drain Voltage (V)

Source-Drain Diode Forward

IS -

Sou

rce

Cur

rent

(A)

Capacitance Gate Charge

QG - Gate Charge (nC)

VG

S -

Gat

e - s

ourc

e V

olta

ge (V

)

Typical Operating Characteristics (Cont.)

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.60.1

1

10

Tj=150oC

Tj=25oC

0 5 10 15 20 25 300

50

100

150

200

250

300

350

400

Frequency=1MHz

Crss

Coss

Ciss

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

RON

@Tj=25oC: 65mΩ

0 1 2 3 4 5 6 7 80

2

4

6

8

10

VGS = 4.5V IDS = 2.5A

VDS = 15V IDS = 2.5A

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Copyright ANPEC Electronics Corp.Rev. B.4 - Dec, 2008

www.anpec.com.tw7

APM2320A

Package InformationSOT-23-3

0L

VIEW A

0.25

GAUGE PLANESEATING PLANE

AA2

A1

e

D

EE1

SEEVIEW A

b c

e1

MAX.

0.057

0.051

0.024

0.006

0.009

0.0200.012

L 0.30

0

e

e1

E1

E

D

c

b

0.08

0.30

0.60 0.012

0.95 BSC

1.90 BSC

0.22

0.50

0.037 BSC

0.075 BSC

0.003

MIN.

MILLIMETERS

SYMBOL

A1

A2

A

0.00

0.90

SOT-23-3

MAX.

1.45

0.15

1.30

MIN.

0.000

0.035

INCHES

°8°0 °8°0

1.40

2.60

1.80

3.00

2.70 3.10 0.122

0.071

0.1180.102

0.055

0.106

Note : Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side.

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Copyright ANPEC Electronics Corp.Rev. B.4 - Dec, 2008

www.anpec.com.tw8

APM2320A

Carrier Tape & Reel Dimensions

A

E1

AB

W

F

T

P0OD0

BA0

P2

K0

B0

SECTION B-B

SECTION A-A

OD1

P1

H

T1

A

d

Application A H T1 C d D W E1 F

178.0±2.00 50 MIN. 8.4+2.00 -0.00

13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05

P0 P1 P2 D0 D1 T A0 B0 K0 SOT-23-3

4.0±0.10 4.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.0 MIN. 0.6+0.00

-0.40 3.20±0.20 3.10±0.20 1.50±0.20

(mm)

Devices Per Unit

Package Type Unit Quantity

SOT-23-3 Tape & Reel 3000

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www.anpec.com.tw9

APM2320A

Taping Direction InformationSOT-23-3

Reflow Condition (IR/Convection or VPR Reflow)

t 25 C to Peak

tp

Ramp-up

tL

Ramp-downts

Preheat

Tsmax

Tsmin

TL

TP

25

Tem

per

atur

e

Time

Critical ZoneTL to TP

°

Reliability Test Program

Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles

USER DIRECTION OF FEED

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Copyright ANPEC Electronics Corp.Rev. B.4 - Dec, 2008

www.anpec.com.tw10

APM2320A

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.

Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)

100°C 150°C

60-120 seconds

150°C 200°C

60-180 seconds

Time maintained above: - Temperature (TL) - Time (tL)

183°C 60-150 seconds

217°C 60-150 seconds

Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)

10-30 seconds 20-40 seconds

Ramp-down Rate 6°C/second max. 6°C/second max.

Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.

Classification Reflow Profiles

Table 2. Pb-free Process – Package Classification Reflow Temperatures

Package Thickness Volume mm3 <350

Volume mm3 350-2000

Volume mm3 >2000

<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*

≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.

Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures

Package Thickness Volume mm3

<350 Volume mm3

≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C

Customer Service

Anpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838

Fax : 886-2-2917-3838

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N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. A.2 - Nov., 2008

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.

APM2360A

Features

Applications

• Power Management in DC/AC Inventer

Systems.

Pin Description

Ordering and Marking Information

Top View of SOT-23

N-Channel MOSFET

• 60V/2.5A ,

RDS(ON)=90mΩ(typ.) @ VGS=10V RDS(ON)=115mΩ(typ.) @ VGS=4.5V

• Super High Dense Cell Design

• Reliable and Rugged

• Lead Free and Green Devices Available

(RoHS Compliant)

APM2360

Handling CodeTemperature RangePackage Code

Package Code A : SOT-23Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material L : Lead Free Device G : Halogen and Lead Free Device

APM2360 A : M60X X - Date Code

Assembly Material

G

S

D

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).

D

G

S

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www.anpec.com.tw2

APM2360A

Absolute Maximum Ratings (TA = 25°C unless otherwise noted)

Electrical Characteristics (TA = 25°C unless otherwise noted)

Symbol Parameter Rating Unit

VDSS Drain-Source Voltage 60

VGSS Gate-Source Voltage ±20 V

ID* Continuous Drain Current 2.5

IDM* 300µs Pulsed Drain Current VGS=10V

10 A

IS* Diode Continuous Forward Current 1 A

TJ Maximum Junction Temperature 150

TSTG Storage Temperature Range -55 to 150 °C

TA=25°C 0.83 PD* Maximum Power Dissipation

TA=100°C 0.3 W

RθJA* Thermal Resistance-Junction to Ambient 150 °C/W

APM2360A Symbol Parameter Test Conditions

Min. Typ. Max. Unit

STATIC CHARACTERISTICS

BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 60 - - V

VDS=48V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current

TJ=85°C - - 30 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1 2.3 3 V

IGSS Gate Leakage Current VGS=±20V, VDS=0V - - ±100 nA

VGS=10V, IDS=2.5A - 90 120 RDS(ON)

a Drain-Source On-state Resistance VGS=4.5V, IDS=2A - 115 155

VSDa Diode Forward Voltage ISD=1A, VGS=0V - 0.8 1.1 V

GATE CHARGE CHARACTERISTICS b

Qg Total Gate Charge - 8 11

Qgs Gate-Source Charge - 1.5 -

Qgd Gate-Drain Charge

VDS=30V, VGS=10V, IDS=2.5A

- 1.9 -

nC

Note : *Surface Mounted on 1in2 pad area, t ≤ 10sec.

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www.anpec.com.tw3

APM2360A

APM2360A Symbol Parameter Test Conditions

Min. Typ. Max. Unit

DYNAMIC CHARACTERISTICS b

RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 1.3 - Ω

Ciss Input Capacitance - 365 -

Coss Output Capacitance - 40 -

Crss Reverse Transfer Capacitance

VGS=0V, VDS=30V, Frequency=1.0MHz - 20 -

pF

td(ON) Turn-on Delay Time - 6 12

tr Turn-on Rise Time - 7 14

td(OFF) Turn-off Delay Time - 15 28

tf Turn-off Fall Time

VDD=30V, RL=30Ω, IDS=1A, VGEN=10V, RG=6Ω

- 3 6

ns

trr Reverse Recovery Time - 21 - ns

Qrr Reverse Recovery Charge ISD=2.5A, dISD/dt=100A/µs

- 16 - nC

Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.

Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)

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APM2360A

Typical Operating Characteristics

ID -

Dra

in C

urre

nt (A

)

Drain Current

Tj - Junction Temperature (°C)

Safe Operation Area

VDS - Drain - Source Voltage (V)

Thermal Transient Impedance

Square Wave Pulse Duration (sec)

Power Dissipation

Pto

t - P

ower

(W)

Tj - Junction Temperature (°C)

ID -

Dra

in C

urre

nt (A

)

Nor

mal

ized

Tra

nsie

nt T

herm

al R

esis

tanc

e

0 20 40 60 80 100 120 140 1600.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

TA=25oC

0 20 40 60 80 100 120 140 1600.0

0.5

1.0

1.5

2.0

2.5

3.0

TA=25oC,V

G=10V

0.01 0.1 1 10 100 3001E-3

0.01

0.1

1

10

30

Rds(on

) Lim

it

1s

TA=25oC

10ms

300µs

1ms

100ms

DC

1E-4 1E-3 0.01 0.1 1 10 301E-3

0.01

0.1

1

2

Mounted on 1in2 padR

θJA : 150 oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

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APM2360A

RD

S(O

N) -

On

- Res

ista

nce

(mΩ

)

Drain-Source On Resistance

ID - Drain Current (A)

Tj - Junction Temperature (°C)

Gate Threshold Voltage

VDS - Drain-Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Output Characteristics

Gate-Source On Resistance

VGS - Gate - Source Voltage (V)

RD

S(O

N) -

ON

-Res

ista

nce

(mΩ

)

Nor

mal

ized

Thr

esho

ld V

olta

ge

0.0 0.5 1.0 1.5 2.0 2.5 3.00

1

2

3

4

5

6

7

8

9

10

3.5V

4V

3V

VGS

= 5, 6, 7, 8, 9, 10V

0 2 4 6 8 1040

60

80

100

120

140

160

180

VGS

=4.5V

VGS

=10V

1 2 3 4 5 6 7 8 9 1040

60

80

100

120

140

160

180

200

ID=2.5A

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6IDS

=250µA

Typical Operating Characteristics (Cont.)

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APM2360A

VDS - Drain - Source Voltage (V)

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

Tj - Junction Temperature (°C)

C -

Cap

acita

nce

(pF)

VSD - Source - Drain Voltage (V)

Source-Drain Diode Forward

IS -

Sou

rce

Cur

rent

(A)

Capacitance Gate Charge

QG - Gate Charge (nC)

VG

S -

Gat

e - s

ourc

e V

olta

ge (V

)

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

RON

@Tj=25oC: 90mΩ

VGS

= 10V

IDS

= 2.5A

0.0 0.3 0.6 0.9 1.2 1.50.1

1

10

Tj=150oC

Tj=25oC

0 5 10 15 20 25 300

50

100

150

200

250

300

350

400

450

500

Frequency=1MHz

CrssCoss

Ciss

0 1 2 3 4 5 6 7 80

1

2

3

4

5

6

7

8

9

10V

DS= 30V

IDS

= 2.5A

Typical Operating Characteristics (Cont.)

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APM2360A

Package InformationSOT-23

0L

VIEW A

0.25

GAUGE PLANESEATING PLANE

AA2

A1

e

D

EE1

SEEVIEW A

b c

e1

MAX.

0.057

0.051

0.024

0.006

0.009

0.0200.012

L 0.30

0

e

e1

E1

E

D

c

b

0.08

0.30

0.60 0.012

0.95 BSC

1.90 BSC

0.22

0.50

0.037 BSC

0.075 BSC

0.003

MIN.

MILLIMETERS

SYMBOL

A1

A2

A

0.00

0.90

SOT-23

MAX.

1.45

0.15

1.30

MIN.

0.000

0.035

INCHES

°8°0 °8°0

1.40

2.60

1.80

3.00

2.70 3.10 0.122

0.071

0.1180.102

0.055

0.106

Note : Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side.

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www.anpec.com.tw8

APM2360A

Carrier Tape & Reel Dimensions

A

E1

AB

W

F

T

P0OD0

BA0

P2

K0

B0

SECTION B-B

SECTION A-A

OD1

P1

H

T1

A

d

Application A H T1 C d D W E1 F

178.0±2.00 50 MIN. 8.4+2.00 -0.00

13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05

P0 P1 P2 D0 D1 T A0 B0 K0 SOT-23

4.0±0.10 4.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.0 MIN. 0.6+0.00

-0.40 3.20±0.20 3.10±0.20 1.50±0.20

(mm)

Devices Per Unit

Package Type Unit Quantity

SOT-23 Tape & Reel 3000

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APM2360A

Taping Direction InformationSOT-23

Reflow Condition (IR/Convection or VPR Reflow)

t 25 C to Peak

tp

Ramp-up

tL

Ramp-downts

Preheat

Tsmax

Tsmin

TL

TP

25

Tem

per

atur

e

Time

Critical ZoneTL to TP

°

Reliability Test Program

Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles

USER DIRECTION OF FEED

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APM2360A

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.

Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)

100°C 150°C

60-120 seconds

150°C 200°C

60-180 seconds

Time maintained above: - Temperature (TL) - Time (tL)

183°C 60-150 seconds

217°C 60-150 seconds

Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)

10-30 seconds 20-40 seconds

Ramp-down Rate 6°C/second max. 6°C/second max.

Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.

Classification Reflow Profiles

Table 2. Pb-free Process – Package Classification Reflow Temperatures

Package Thickness Volume mm3 <350

Volume mm3 350-2000

Volume mm3 >2000

<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*

≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.

Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures

Package Thickness Volume mm3

<350 Volume mm3

≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C

Customer Service

Anpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838

Fax : 886-2-2917-3838

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N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2008

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, andadvise customers to obtain the latest version of relevant information to verify before placing orders.

APM2600C

Features

Applications

Pin Description

Ordering and Marking Information

• 30V/6A,

RDS(ON)=22mΩ(typ.) @ VGS=10VRDS(ON)=26mΩ(typ.) @ VGS=4.5V

• Super High Dense Cell Design

• Reliable and Rugged

• Lead Free and Green Devices Available

(RoHS Compliant)

Top View of SOT-23-6

N-Channel MOSFET

• Power Management in Notebook Computer,

Portable Equipment and Battery PoweredSystems

D

D D

D S

G

(3)G

(4)S

(1,2,5,6)D D D D

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).

APM2600

Handling CodeTemperature RangePackage Code

Package Code C : SOT-23-6Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material G : Halogen and Lead Free Device

APM2600 C : M00X X - Date Code

Assembly Material

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APM2600C

Absolute Maximum Ratings (TA = 25°C unless otherwise noted)

Electrical Characteristics (TA = 25°C unless otherwise noted)

Symbol Parameter Rating Unit

VDSS Drain-Source Voltage 30

VGSS Gate-Source Voltage ±20 V

ID* Continuous Drain Current 6

IDM* 300µs Pulsed Drain Current VGS=10V

18 A

IS* Diode Continuous Forward Current 1.4 A

TJ Maximum Junction Temperature 150

TSTG Storage Temperature Range -55 to 150 °C

TA=25°C 1.4 PD* Maximum Power Dissipation

TA=100°C 0.5 W

RθJA* Thermal Resistance-Junction to Ambient 90 °C/W

Note : *Surface Mounted on 1in2 pad area, t ≤ 5sec.

APM2600C Symbol Parameter Test Conditions

Min. Typ. Max. Unit

STATIC CHARACTERISTICS

BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 30 - - V

VDS=24V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current

TJ=85°C - - 30 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1 1.5 2 V

IGSS Gate Leakage Current VGS=±20V, VDS=0V - - ±100 nA

VGS=10V, IDS=6A - 22 28 RDS(ON)

a Drain-Source On-State Resistance VGS=4.5V, IDS=4.5A - 26 35

VSDa Diode Forward Voltage ISD=1.4A, VGS=0V - 0.8 1.3 V

GATE CHARGE CHARACTERISTICS b

Qg Total Gate Charge - 9 13

Qgs Gate-Source Charge - 1.5 -

Qgd Gate-Drain Charge

VDS=15V, VGS=4.5V, IDS=6A

- 3.7 -

nC

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APM2600C

Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)

APM2600C Symbol Parameter Test Conditions

Min. Typ. Max. Unit

DYNAMIC CHARACTERISTICS b

RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 1.7 - Ω

Ciss Input Capacitance - 800 -

Coss Output Capacitance - 120 -

Crss Reverse Transfer Capacitance

VGS=0V, VDS=15V, Frequency=1.0MHz - 90 -

pF

td(ON) Turn-on Delay Time - 5 10

Tr Turn-on Rise Time - 9 17

td(OFF) Turn-off Delay Time - 25 46

Tf Turn-off Fall Time

VDD=10V, RL=10Ω, IDS=1A, VGEN=4.5V, RG=6Ω

- 5 10

ns

trr Reverse Recovery Time - 16 - ns

Qrr Reverse Recovery Charge IDS=6A, dlSD/dt=100A/µs

- 10 - nC

Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.

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APM2600C

Typical Operating Characteristics

I D -

Dra

in C

urre

nt (A

)

Drain Current

TJ - Junction Temperature (°C)

Safe Operation Area

VDS - Drain - Source Voltage (V)

Nor

mal

ized

Effe

ctiv

e T

rans

ient

Thermal Transient Impedance

Square Wave Pulse Duration (sec)

Power Dissipation

Pto

t - P

ower

(W)

TJ - Junction Temperature (°C)

I D -

Dra

in C

urre

nt (A

)

1E-4 1E-3 0.01 0.1 1 10 1001E-3

0.01

0.1

1

2

Mounted on 1in2 padR

θJA : 90 oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

0 20 40 60 80 100 120 140 1600.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

TA=25oC

0 20 40 60 80 100 120 140 1600

1

2

3

4

5

6

7

TA=25oC,V

G=10V

0.01 0.1 1 10 1000.01

0.1

1

10

50

300µsRds(on

) Lim

it

TA=25oC

10ms

1ms

100ms

DC

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APM2600C

RD

S(O

N) -

On

- R

esis

tanc

e (m

Ω)

Drain-Source On Resistance

ID - Drain Current (A)

TJ- Junction Temperature (°C)

Gate Threshold Voltage

VDS - Drain - Source Voltage (V)

I D -

Dra

in C

urre

nt (A

)

Output Characteristics

Drain-Source On Resistance

VGS - Gate - Source Voltage (V)

RD

S(O

N) -

On

Res

ista

nce

(mΩ

)

Nor

mal

ized

Thr

esho

ld V

olta

ge

0.0 0.5 1.0 1.5 2.0 2.5 3.00

2

4

6

8

10

12

14

16

18

2.5V

3V

2V

VGS

= 4, 5, 6, 7, 8, 9, 10V

0 2 4 6 8 10 12 14 16 188

12

16

20

24

28

32

36

40

VGS

=10V

VGS

=4.5V

1 2 3 4 5 6 7 8 9 1010

15

20

25

30

35

40

45

50

ID=6A

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8IDS

= 250µA

Typical Operating Characteristics (Cont.)

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APM2600C

VDS - Drain - Source Voltage (V)

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

TJ- Junction Temperature (°C)

C -

Cap

acita

nce

(pF)

VSD - Source - Drain Voltage (V)

Source-Drain Diode Forward

I S -

Sou

rce

Cur

rent

(A)

Capacitance Gate Charge

QG - Gate Charge (nC)

VG

S -

Gat

e - s

ourc

e V

olta

ge (V

)

-50 -25 0 25 50 75 100 125 1500.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

RON

@Tj=25oC: 22mΩ

VGS

= 10V

IDS

= 6A

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.60.1

1

10

20

Tj=25oC

Tj=150oC

0 5 10 15 20 25 300

100

200

300

400

500

600

700

800

900

1000

1100

1200

Frequency=1MHz

CrssCoss

Ciss

0 4 8 12 16 200

1

2

3

4

5

6

7

8

9

10V

DS= 15V

ID = 6A

Typical Operating Characteristics (Cont.)

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APM2600C

Package InformationSOT-23-6

0L

VIEW A0.

25

GAUGE PLANESEATING PLANE

AA2

A1

e

D

E1

SEEVIEW A

b c

e1

E

0° 8° 0° 8°

0.020

0.009

0.006

0.024

0.051

0.057

MAX.

0.30L

0

E

e

e1

E1

D

c

b

0.08

0.30

0.0120.60

0.95 BSC

1.90 BSC

0.50

0.22

0.075 BSC

0.037 BSC

0.012

0.003

MILLIMETERS

MIN.

SYMBOL

A1

A2

A

0.00

0.90

SOT-23-6

MAX.

1.30

0.15

1.45

MIN.

0.000

0.035

INCHES

1.40

2.60 3.00

1.80

2.70 3.10

0.118

0.071

0.122

0.102

0.055

0.106

Note : 1. Follow JEDEC TO-178 AB. 2. Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side.

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Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2008

www.anpec.com.tw8

APM2600C

Application A H T1 C d D W E1 F

178.0±2.00 50 MIN. 8.4+2.00 -0.00

13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05

P0 P1 P2 D0 D1 T A0 B0 K0 SOT-23-6

4.0±0.10 4.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.0 MIN. 0.6+0.00

-0.40 3.20±0.20 3.10±0.20 1.50±0.20

(mm)

Carrier Tape & Reel Dimensions

H

T1

A

d

A

E1

AB

W

F

T

P0OD0

BA0

P2

K0

B0

SECTION B-B

SECTION A-A

OD1

P1

Devices Per Unit

Package Type Unit Quantity

SOT-23-6 Tape & Reel 3000

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APM2600C

Taping Direction InformationSOT-23-6

Reflow Condition (IR/Convection or VPR Reflow)

t 25 C to Peak

tp

Ramp-up

tL

Ramp-downts

Preheat

Tsmax

Tsmin

TL

TP

25

Tem

per

atur

e

Time

Critical ZoneTL to TP

°

Reliability Test Program

Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles

AAAX AAAX AAAX AAAX AAAX AAAX AAAX

USER DIRECTION OF FEED

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www.anpec.com.tw10

APM2600C

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.

Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)

100°C 150°C

60-120 seconds

150°C 200°C

60-180 seconds

Time maintained above: - Temperature (TL) - Time (tL)

183°C 60-150 seconds

217°C 60-150 seconds

Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)

10-30 seconds 20-40 seconds

Ramp-down Rate 6°C/second max. 6°C/second max.

Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.

Classification Reflow Profiles

Table 2. Pb-free Process – Package Classification Reflow Temperatures

Package Thickness Volume mm3 <350

Volume mm3 350-2000

Volume mm3 >2000

<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*

≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.

Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures

Package Thickness Volume mm3

<350 Volume mm3

≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C

Customer Service

Anpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838

Fax : 886-2-2917-3838

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N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. A. 1 - Jun., 2007

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.

APM1402AS

Features

Applications

• Power Management in Notebook Computer,

Portable Equipment and Battery Powered Systems

Pin Description

Ordering and Marking Information

N-Channel MOSFET

Top View of SC-70

• 20V/1.1A,

RDS(ON)= 135mΩ(typ.) @ VGS= 4.5V RDS(ON)= 180mΩ(typ.) @ VGS= 2.5V RDS(ON)= 280mΩ(typ.) @ VGS= 1.8V

• Super High Dense Cell Design

• Reliable and Rugged

• Lead Free Available (RoHS Compliant)

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte in plate termina-tion finish; which are fully compliant with RoHS and compatible with both SnPb and lead-free soldering operations.ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C for MSL classifica-tion at lead-free peak reflow temperature.

APM1402A

Handling CodeTemp. RangePackage Code

Package Code S : SC-70Operating Junction Temp. Range C : -55 to 150 CHandling Code TR : Tape & ReelLead Free Code L : Lead Free Device

APM1402A S : 02

Lead Free Code°

D

S

G

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APM1402AS

Absolute Maximum Ratings (TA = 25°C unless otherwise noted)

Electrical Characteristics (TA = 25°C unless otherwise noted)

Symbol Parameter Rating Unit

VDSS Drain-Source Voltage 20

VGSS Gate-Source Voltage ±12 V

ID* Continuous Drain Current 1.1

IDM* 300µs Pulsed Drain Current VGS=4.5V

4.4 A

IS* Diode Continuous Forward Current 0.4 A

TJ Maximum Junction Temperature 150

TSTG Storage Temperature Range -55 to 150 °C

TA=25°C 0.35 PD* Maximum Power Dissipation

TA=100°C 0.14 W

RθJA* Thermal Resistance-Junction to Ambient 360 °C/W Note:

*Surface Mounted on 1in2 pad area, t ≤ 10sec.

APM1402AS Symbol Parameter Test Condition

Min. Typ. Max. Unit

Static Characteristics

BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 20 V

VDS=16V, VGS=0V 1 IDSS Zero Gate Voltage Drain Current

TJ=85°C 30 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 0.5 0.7 1 V

IGSS Gate Leakage Current VGS=±10V, VDS=0V ±10 µA

VGS=4.5V, IDS=1.1A 135 175

VGS=2.5V, IDS=0.8A 180 250 RDS(ON) a Drain-Source On-state Resistance

VGS=1.8V, IDS=0.5A 280 450

Diode Characteristics

VSDa Diode Forward Voltage ISD=0.4A, VGS=0V 0.8 1.3 V

trr Reverse Recovery Time 13 ns

qrr Reverse Recovery Charge ISD=1.1A, dlSD/dt=100A/µs

3 nC

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APM1402AS

Notes:a : Pulse test ; pulse width ≤300µs, duty cycle ≤ 2%.b : Guaranteed by design, not subject to production testing.

APM1402AS Symbol Parameter Test Condition

Min. Typ. Max. Unit

Dynamic Characteristics b

RG Gate Resistance VGS=0V,VDS=0V,F=1MHz 6.7 Ω

Ciss Input Capacitance 100

Coss Output Capacitance 26

Crss Reverse Transfer Capacitance

VGS=0V, VDS=10V, Frequency=1.0MHz 18

pF

td(ON) Turn-on Delay Time 2 5

tr Turn-on Rise Time 14 26

td(OFF) Turn-off Delay Time 12 23

tf Turn-off Fall Time

VDD=10V, RL=10Ω, IDS=1A, VGEN=4.5V, RG=6Ω

2 5

ns

Gate Charge Characteristics b

Qg Total Gate Charge 1.7 2.4

Qgs Gate-Source Charge 0.3

Qgd Gate-Drain Charge

VDS=10V, VGS=4.5V, IDS=1.1A

0.6

nC

Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)

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APM1402AS

0 20 40 60 80 100 120 140 1600.00

0.05

0.10

0.15

0.20

0.25

0.30

0.35

0.40

TA=25oC

Typical Characteristics

ID -

Dra

in C

urre

nt (A

)

Drain Current

Tj - Junction Temperature (°C)

Safe Operation Area

VDS - Drain - Source Voltage (V)

Thermal Transient Impedance

Square Wave Pulse Duration (sec)

Power Dissipation

Pto

t - P

ower

(W)

Tj - Junction Temperature (°C)

ID -

Dra

in C

urre

nt (A

)

Nor

mal

ized

Tra

nsie

nt T

herm

al R

esis

tanc

e

0 20 40 60 80 100 120 140 1600.0

0.2

0.4

0.6

0.8

1.0

1.2

TA=25oC,V

G=4.5V

0.01 0.1 1 10 1000.01

0.1

1

10

Rds(

on) L

imit

1s

TA=25oC

10ms

300µs

1ms

100ms

DC

1E-4 1E-3 0.01 0.1 1 10 1001E-3

0.01

0.1

1

2

Mounted on 1in2 padR

θJA : 360 oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

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APM1402AS

0 1 2 3 4 5 6 7 8 9 1050

100

150

200

250

300

350

400

ID=1.1A

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.550

100

150

200

250

300

350

400

VGS

=1.8V

VGS

=2.5V

VGS

=4.5V

RD

S(O

N) -

On

- Res

ista

nce

(mΩ

)

Drain-Source On Resistance

ID - Drain Current (A)

Tj - Junction Temperature (°C)

Gate Threshold Voltage

Nor

mal

ized

Thr

esho

ld V

olta

ge

VDS - Drain - Source Voltage (V)

ID -

Dra

in C

urre

nt (A

)

Output Characteristics

Drain-Source On Resistance

VGS - Gate - Source Voltage (V)

Typical Characteristics (Cont.)

0.0 0.5 1.0 1.5 2.0 2.5 3.00.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

2V

1.5V

VGS

=2.5,3,4,5,6,7,8,9,10V

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8IDS

=250µA

RD

S(O

N) -

On

- Res

ista

nce

(mΩ

)

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APM1402AS

VDS - Drain - Source Voltage (V)

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

Tj - Junction Temperature (°C)

C -

Cap

acita

nce

(pF)

VSD - Source - Drain Voltage (V)

Source-Drain Diode Forward

IS -

Sou

rce

Cur

rent

(A)

Capacitance Gate Charge

QG - Gate Charge (nC)

VG

S -

Gat

e-so

urce

Vol

tage

(V

)

Typical Characteristics (Cont.)

-50 -25 0 25 50 75 100 125 1500.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

RON

@Tj = 25°C : 135mΩ

VGS

= 4.5V

IDS

= 1.1A

0.0 0.4 0.8 1.2 1.6 2.00.1

1

5

Tj=150oC

Tj=25oC

0 4 8 12 16 200

20

40

60

80

100

120

140

160

Frequency=1MHz

CrssCoss

Ciss

0.0 0.4 0.8 1.2 1.6 2.00.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0V

DS= 10V

IDS

= 1.1A

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APM1402AS

Package Information

SC-70

0L

VIEW A

0.15

SEATING PLANEGAUGE PLANE

AA2

A1

e

D

EE1

SEE VIEW A

b c

e1

SYMBOL MIN. MAX.

1.10

0.00

0.08 0.25

0.10

A

A1

c

D

E

E1

e

e1

L

MILLIMETERS

b 0.15 0.30

0.65 BSC

SC-70

0.15 0.45

0.026 BSC

MIN. MAX.

INCHES

0.043

0.000

0.031 0.040

0.003 0.010

0.006 0.018

0.004

A2 0.80 1.00

0.006 0.012

1.30 BSC 0.051 BSC

1.25 BSC 0.049 BSC

2.10 BSC 0.083 BSC

2.00 BSC 0.079 BSC

0 0 ° 0 °8 ° 8 °

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APM1402AS

Carrier Tape & Reel Dimensions

Devices Per Unit

Package Type Unit Quantity SC-70 Type & Reel 3000

H

T1

A

d

A

E1

AB

W

F

T

P0OD0

BA0

P2

K0

B0

SECTION B-B

SECTION A-A

OD1

P1

Application A H T1 C d D W E1 F

178.0±2.00 50 MIN. 8.4+2.00 13.0+0.50 -0.20

1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05

P0 P1 P2 D0 D1 T A0 B0 K0 SC-70

4.0±0.10 4.0±0.10 2.0±0.05 1.5+0.10 1.0-0.00 0.6-0.40 2.4±0.20 2.4±0.20 1.2±0.20

(mm)

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APM1402AS

Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles ESD MIL-STD-883D-3015.7 VHBM > 2KV, VMM > 200V Latch-Up JESD 78 10ms, 1tr > 100mA

Reflow Condition (IR/Convection or VPR Reflow)

Classification Reflow ProfilesProfile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly

Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.

Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)

100°C 150°C

60-120 seconds

150°C 200°C

60-180 seconds

Time maintained above: - Temperature (TL) - Time (tL)

183°C 60-150 seconds

217°C 60-150 seconds

Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)

10-30 seconds 20-40 seconds

Ramp-down Rate 6°C/second max. 6°C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Notes: All temperatures refer to topside of the package. Measured on the body surface.

Reliability Test Program

t 25 C to Peak

tp

Ramp-up

tL

Ramp-downts

Preheat

Tsmax

Tsmin

TL

TP

25

Tem

per

atur

e

Time

Critical ZoneTL to TP

°

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APM1402AS

Table 2. Pb-free Process – Package Classification Reflow Temperatures Package Thickness Volume mm3

<350 Volume mm3

350-2000 Volume mm3

>2000 <1.6 mm 260 +0°C* 260 +0°C* 260 +0°C*

1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C* ≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C*

*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.

Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures Package Thickness Volume mm3

<350 Volume mm3

≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C

Classification Reflow Profiles (Cont.)

Customer Service

Anpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838Fax : 886-2-2917-3838

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N-Channel Enhancement Mode MOSFET

Copyright ANPEC Electronics Corp.Rev. A.2 - May., 2009

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.

APM1404AS

Features

Applications

• Power Management in Notebook Computer,

Portable Equipment and Battery Powered Systems

Pin Description

Ordering and Marking Information

N-Channel MOSFET

Top View of SC70-3

• 20V/1.5A,

RDS(ON)= 65mΩ(typ.) @ VGS= 4.5V RDS(ON)= 80mΩ(typ.) @ VGS= 2.5V RDS(ON)= 110mΩ(typ.) @ VGS= 1.8V

• Super High Dense Cell Design

• Reliable and Rugged

• Lead Free and Green Devices Available

(RoHS Compliant)

D

S

G

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).

APM1404A

Handling CodeTemperature RangePackage Code

Package Code S : SC70-3Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material G : Halogen and Lead Free Device

APM1404A S : 04

Assembly Material

G

S

D

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APM1404AS

Absolute Maximum Ratings (TA = 25°C unless otherwise noted)

Electrical Characteristics (TA = 25°C unless otherwise noted)

Symbol Parameter Rating Unit

VDSS Drain-Source Voltage 20

VGSS Gate-Source Voltage ±12 V

ID* Continuous Drain Current 1.5

IDM* 300µs Pulsed Drain Current VGS=4.5V

6 A

IS* Diode Continuous Forward Current 0.5 A

TJ Maximum Junction Temperature 150

TSTG Storage Temperature Range -55 to 150 °C

TA=25°C 0.35 PD* Maximum Power Dissipation

TA=100°C 0.14 W

RθJA* Thermal Resistance-Junction to Ambient 360 °C/W

Note : *Surface Mounted on 1in2 pad area, t ≤ 10sec.

APM1404AS Symbol Parameter Test Conditions

Min. Typ. Max. Unit

Static Characteristics

BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 20 - - V

VDS=16V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current

TJ=85°C - - 30 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 0.5 0.7 1 V

IGSS Gate Leakage Current VGS=±10V, VDS=0V - - ±10 µA

VGS=4.5V, IDS=1.5A - 65 85

VGS=2.5V, IDS=1.2A - 80 110 RDS(ON) a Drain-Source On-State Resistance

VGS=1.8V, IDS=0.5A - 110 200

Diode Characteristics

VSD a Diode Forward Voltage ISD=0.5A, VGS=0V - 0.8 1.3 V

trr Reverse Recovery Time - 12 - ns

qrr Reverse Recovery Charge ISD=1.5A, dlSD/dt=100A/µs

- 3 - nC

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APM1404AS

Note a : Pulse test ; pulse width ≤300µs, duty cycle ≤ 2%.Note b : Guaranteed by design, not subject to production testing.

APM1404AS Symbol Parameter Test Conditions

Min. Typ. Max. Unit

Dynamic Characteristics b

RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 5.1 - Ω

Ciss Input Capacitance - 295 -

Coss Output Capacitance - 66 -

Crss Reverse Transfer Capacitance

VGS=0V, VDS=10V, Frequency=1.0MHz - 50 -

pF

td(ON) Turn-on Delay Time - 3 6

tr Turn-on Rise Time - 13 24

td(OFF) Turn-off Delay Time - 20 37

tf Turn-off Fall Time

VDD=10V, RL=10Ω, IDS=1A, VGEN=4.5V, RG=6Ω

- 3 6

ns

Gate Charge Characteristics b

Qg Total Gate Charge - 4.4 6.2

Qgs Gate-Source Charge - 0.5 -

Qgd Gate-Drain Charge

VDS=10V, VGS=4.5V, IDS=1.5A

- 1.4 -

nC

Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)

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APM1404AS

I D -

Dra

in C

urre

nt (

A)

Drain Current

Tj - Junction Temperature (°C)

Safe Operation Area

VDS - Drain - Source Voltage (V)

Thermal Transient Impedance

Square Wave Pulse Duration (sec)

Power Dissipation

Pto

t - P

ower

(W)

Tj - Junction Temperature (°C)

I D -

Dra

in C

urre

nt (A

)

Nor

mal

ized

Tra

nsie

nt T

herm

al R

esis

tanc

e

0 20 40 60 80 100 120 140 1600.00

0.05

0.10

0.15

0.20

0.25

0.30

0.35

0.40

TA=25oC

0 20 40 60 80 100 120 140 1600.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

TA=25oC,V

G=4.5V

1E-4 1E-3 0.01 0.1 1 10 1001E-3

0.01

0.1

1

2

Mounted on 1in2 padR

θJA : 360 oC/W

0.01

0.02

0.05

0.1

0.2

Single Pulse

Duty = 0.5

0.01 0.1 1 10 1000.01

0.1

1

10

Rds(

on) L

imit

1s

TA=25oC

10ms

300µs

1ms

100ms

DC

Typical Operating Characteristics

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APM1404AS

RD

S(O

N) -

On

- R

esis

tanc

e (m

Ω)

Drain-Source On Resistance

ID - Drain Current (A)

Tj - Junction Temperature (°C)

Gate Threshold Voltage

Nor

mal

ized

Thr

esho

ld V

olta

ge

VDS - Drain - Source Voltage (V)

I D -

Dra

in C

urre

nt (A

)

Output Characteristics

Drain-Source On Resistance

VGS - Gate - Source Voltage (V)

RD

S(O

N) -

On

- R

esis

tanc

e (m

Ω)

0.0 0.5 1.0 1.5 2.0 2.5 3.00

1

2

3

4

5

6

1.5V

VGS

=2,2.5,3,4,5,6,7,8,9,10V

-50 -25 0 25 50 75 100 125 1500.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8IDS

=250µA

1 2 3 4 5 6 7 8 9 1040

50

60

70

80

90

100

110

120

ID=1.5A

0 1 2 3 4 5 620

40

60

80

100

120

140

160

180

200

VGS

=1.8V

VGS

=2.5V

VGS

=4.5V

Typical Operating Characteristics (Cont.)

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APM1404AS

VDS - Drain - Source Voltage (V)

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

Tj - Junction Temperature (°C)

C -

Cap

acita

nce

(pF)

VSD - Source - Drain Voltage (V)

Source-Drain Diode Forward

I S -

Sou

rce

Cur

rent

(A)

Capacitance Gate Charge

QG - Gate Charge (nC)

VG

S -

Gat

e-so

urce

Vol

tage

(V)

Typical Operating Characteristics (Cont.)

-50 -25 0 25 50 75 100 125 1500.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

RON

@Tj = 25°C : 65mΩ

VGS

= 4.5V

IDS

= 1.5A

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.60.1

1

6

Tj=150oC

Tj=25oC

0 4 8 12 16 200

50

100

150

200

250

300

350

400

450

500

Frequency=1MHz

CrssCoss

Ciss

0 1 2 3 4 50.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0V

DS= 10V

IDS

= 1.5A

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APM1404AS

Package Information

SC70-3

0L

VIEW A0.

15

SEATING PLANEGAUGE PLANE

AA2

A1

e

D

EE1

SEE VIEW A

b c

e1

Note: 1. Followed from JEDEC MO-223. 2. Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side.

SYMBOL MIN. MAX.

1.10

0.00

0.08 0.25

0.10

A

A1

c

D

E

E1

e

e1

L

MILLIMETERS

b 0.15 0.30

0.65 BSC

SC70-3

0.15 0.45

0.026 BSC

MIN. MAX.

INCHES

0.043

0.000

0.031 0.040

0.003 0.010

0.006 0.018

0.004

A2 0.80 1.00

0.006 0.012

1.30 BSC 0.051 BSC

0 0° 0 °8° 8°

1.90 2.20

2.00 2.40

1.15 1.35

0.075 0.087

0.045 0.053

0.079 0.095

0.80 0.031

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APM1404AS

Carrier Tape & Reel Dimensions

Application A H T1 C d D W E1 F

178.0±2.00 50 MIN. 8.4+2.00 13.0+0.50 -0.20

1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05

P0 P1 P2 D0 D1 T A0 B0 K0 SC70-3

4.0±0.10 4.0±0.10 2.0±0.05 1.5+0.10 1.0-0.00 0.6-0.40 2.4±0.20 2.4±0.20 1.2±0.20

(mm)

Devices Per Unit

Package Type Unit Quantity

SC70-3 Type & Reel 3000

H

T1

A

d

A

E1

AB

W

F

T

P0OD0

BA0

P2

K0

B0

SECTION B-B

SECTION A-A

OD1

P1

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Taping Direction Information

Classification Profile

SC70-3

USER DIRECTION OF FEED

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Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly

Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts)

100 °C 150 °C

60-120 seconds

150 °C 200 °C

60-120 seconds

Average ramp-up rate (Tsmax to TP) 3 °C/second max. 3°C/second max.

Liquidous temperature (TL) Time at liquidous (tL)

183 °C 60-150 seconds

217 °C 60-150 seconds

Peak package body Temperature (Tp)*

See Classification Temp in table 1 See Classification Temp in table 2

Time (tP)** within 5°C of the specified classification temperature (Tc)

20** seconds 30** seconds

Average ramp-down rate (Tp to Tsmax) 6 °C/second max. 6 °C/second max.

Time 25°C to peak temperature 6 minutes max. 8 minutes max.

* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.

Classification Reflow Profiles

Table 2. Pb-free Process – Classification Temperatures (Tc)

Package Thickness

Volume mm3 <350

Volume mm3 350-2000

Volume mm3 >2000

<1.6 mm 260 °C 260 °C 260 °C 1.6 mm – 2.5 mm 260 °C 250 °C 245 °C

≥2.5 mm 250 °C 245 °C 245 °C

Table 1. SnPb Eutectic Process – Classification Temperatures (Tc) Package

Thickness Volume mm3

<350 Volume mm3

≥350 <2.5 mm 235 °C 220 °C

≥2.5 mm 220 °C 220 °C

Reliability Test Program

Test item Method Description SOLDERABILITY JESD-22, B102 5 Sec, 245°C HOLT JESD-22, A108 1000 Hrs, Bias @ 125°C PCT JESD-22, A102 168 Hrs, 100%RH, 2atm, 121°C TCT JESD-22, A104 500 Cycles, -65°C~150°C

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Customer Service

Anpec Electronics Corp.Head Office :

No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050

Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838

Fax : 886-2-2917-3838