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A N P E C
MOSFET TRANSISTORS
N-Channel MOSFET
TABLE OF CONTENT Pos. Series Drain Source Voltage Continue Drain Current Case Pages V DSS (V) I D (A) 01 APM 2050 ND 20 5 SOT-89 11 02 APM 3040 ND 30 3 SOT-89 9 03 APM 3054 ND 30 4 SOT-89 10 04 APM 2054 NV 20 5 SOT-223 11 05 APM 3054 NV 30 4 SOT-223 10 06 APM 3055 NG 30 12 TO-263 10 07 APM 4008 NG 40 60 TO-263 11 08 APM 7512 NG 75 75 TO-263 11 09 APM 2506 NUB 25 60 TO-251 10 10 APM 2509 NUB 25 50 TO-251 10 11 APM 2506 NF 25 60 TO-220 9 12 APM 2509 NF 25 50 TO-220 9 13 APM 7512 NF 75 80 TO-220 9 14 APM 4412 NF 30 12 SOP-8 11 15 APM 4810 K 30 11 SOP-8 10 16 APM 4812 K 30 8 SOP-8 9 17 APM 4320 K 30 13 SOP-8 10 18 APM 4330 KC 30 15 SOP-8 10 19 APM 4340 K 30 17 SOP-8 11 20 APM 4472 K 40 12 SOP-8 10 21 APM 4476 K 40 7.5 SOP-8 11 22 APM 4474 K 40 11 SOP-8 9 23 APM 4220 KA 25 16 SOP-8 11 24 APM 4350 KP 30 60 KPAK 11 25 APM 4354 KP 30 70 KPAK 11 26 APM 4356 KP 30 80 KPAK 11 27 APM 9984 CCG 20 6 JSOT-8 11 28 APM 2322 AA 20 1.7 SOT-23 10 29 APM 2324 AA 20 3 SOT-23 10 30 APM 2300 CA 20 6 SOT-23 10 31 APM 2306 A 30 3.5 SOT-23 10 32 APM 2308 A 30 3 SOT-23-3 10 33 APM 2318 A 30 3 SOT-23-3 9 34 APM 2320 A 30 2.5 SOT-23-3 11 35 APM 2360 A 60 2.5 SOT-23 9 36 APM 2600 C 30 6 SOT-23-6 11 37 APM 1402 AS 20 1.1 SC-70 10 38 APM 1404 AS 20 1.5 SC-70-3 10
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. A.2 - Sep., 2008
APM2050ND
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, andadvise customers to obtain the latest version of relevant information to verify before placing orders.
Pin Description
Ordering and Marking Information
Features
Applications
• 20V/5A,
RDS(ON)=25mΩ(Typ.) @ VGS=10VRDS(ON)=30mΩ(Typ.) @ VGS=4.5VRDS(ON)=50mΩ(Typ.) @ VGS=2.5V
• Super High Dense Cell Design
• Reliable and Rugged
• Lead Free and Green Devices Available
(RoHS Compliant)
N-Channel MOSFET
Top View of SOT-89
• DC/DC Converters
G
S
D
(3)
(2)
(1)
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).
GD
S
APM2050N
Handling Code
Temperature Range
Package Code
Package Code D : SOT-89Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material L : Lead Free Device G : Halogen and Lead Free Device
APM2050N D : APM2050XXXXX_N
XXXXX - Date Code
Assembly Material
Copyright ANPEC Electronics Corp.Rev. A.2 - Sep., 2008
APM2050ND
www.anpec.com.tw2
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)
Electrical Characteristics (TA = 25°C unless otherwise noted)
Symbol Parameter Rating Unit
VDSS Drain-Source Voltage 20
VGSS Gate-Source Voltage ±12 V
ID* Continue Drain Current 5
IDM* Pulsed Drain Current VGS=10V
20 A
IS* Diode Continuous Forward Current 2 A
TJ Maximum Junction Temperature 150
TSTG Storage Temperature Range -55 to 150 °C
TA=25°C 1.47 PD* Power Dissipation for Single Operation
TA=100°C 0.58 W
RθJA* Thermal Resistance-Junction to Ambient 85 °C/W
Note * : Surface Mounted on 1in2 pad area, t ≤ 10 Seconds.
APM2050ND Symbol Parameter Test Conditions
Min. Typ. Max. Unit
STATIC CHARACTERISTICS
BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 20 - - V
VDS=16V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current
TJ=85°C - - 30 µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 0.6 0.9 1.5 V
IGSS Gate Leakage Current VGS=±12V, VDS=0V - - ±10 µA
VGS=10V, IDS=5A - 25 35
VGS=4.5V, IDS=3.5A - 30 50 RDS(ON) a Drain-Source On-state Resistance
VGS=2.5V, IDS=2.5A - 50 85
mΩ
VSDa Diode Forward Voltage ISD=2A, VGS=0V - 0.8 1.3 V
GATE CHARGE CHARACTERISTICS b
Qg Total Gate Charge - 6 8
Qgs Gate-Source Charge - 1 -
Qgd Gate-Drain Charge
VDS=10V, VGS=4.5V, IDS=5A
- 2.6 -
nC
Copyright ANPEC Electronics Corp.Rev. A.2 - Sep., 2008
APM2050ND
www.anpec.com.tw3
Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)
APM2050ND Symbol Parameter Test Conditions
Min. Typ. Max. Unit
DYNAMIC CHARACTERISTICS b
Ciss Input Capacitance - 375 -
Coss Output Capacitance - 105 -
Crss Reverse Transfer Capacitance
VGS=0V, VDS=10V, Frequency=1.0MHz - 85 -
pF
td(ON) Turn-on Delay Time - 4 8
Tr Turn-on Rise Time - 11 21
td(OFF) Turn-off Delay Time - 22 41
Tf Turn-off Fall Time
VDD=10V, RL=10Ω, IDS=1A, VGEN=4.5V, RG=6Ω
- 8 15
ns
trr Reverse Recovery Time - 15 - ns
Qrr Reverse Recovery Charge IDS=5A, dlSD/dt=100A/µs
- 5 - nC
Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.
Copyright ANPEC Electronics Corp.Rev. A.2 - Sep., 2008
APM2050ND
www.anpec.com.tw4
Typical Operating Characteristics
Power Dissipation
Pto
t - P
ower
(W)
Tj - Junction Temperature (°C)
Drain Current
Tj - Junction Temperature
I D -
Dra
in C
urre
nt (
A)
Thermal Transient Impedance
Nor
mal
ized
Tra
nsie
nt T
herm
al R
esis
tanc
e
Square Wave Pulse Duration (sec)
Safe Operation Area
VDS - Drain - Source Voltage (V)
I D -
Dra
in C
urre
nt (A
)
0 20 40 60 80 100 120 140 1600.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
TA=25oC
0 20 40 60 80 100 120 140 1600
1
2
3
4
5
6
TA=25oC,V
G=10V
1E-4 1E-3 0.01 0.1 1 10 1000.01
0.1
1
2
Mounted on 1in2 padR
θJA : 85oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
0.01 0.1 1 10 1000.01
0.1
1
10
100
100ms
Rds(on
) Lim
it
300µs
TA=25oC
1s
1ms
10ms
DC
Copyright ANPEC Electronics Corp.Rev. A.2 - Sep., 2008
APM2050ND
www.anpec.com.tw5
VDS - Drain - Source Voltage (V)
I D -
Dra
in C
urre
nt (A
)
Output Characteristics
RD
S(O
N) -
On
- R
esis
tanc
e (m
Ω)
Drain-Source On Resistance
ID - Drain Current (A)
Drain-Source On Resistance
VGS - Gate - Source Voltage (V)
RD
S(O
N) -
On
- R
esis
tanc
e (m
Ω)
Tj - Junction Temperature (°C)
Gate Threshold Voltage
Nor
mal
ized
Thr
esho
ld V
olta
ge
Typical Operating Characteristics (Cont.)
0.0 0.5 1.0 1.5 2.0 2.5 3.00
2
4
6
8
10
12
14
16
18
20
2V
2.5V
VGS
=3,4,5,6,7,8,9,10V
0 4 8 12 16 200
10
20
30
40
50
60
70
80
90
VGS
=2.5V
VGS
=10V
VGS
=4.5V
1 2 3 4 5 6 7 8 9 100
10
20
30
40
50
60
70
80
90
ID=5A
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
IDS
=250µA
Copyright ANPEC Electronics Corp.Rev. A.2 - Sep., 2008
APM2050ND
www.anpec.com.tw6
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
Tj - Junction Temperature (°C) VSD - Source - Drain Voltage (V)
Source-Drain Diode Forward
I S -
Sou
rce
Cur
rent
(A)
VDS - Drain-Source Voltage (V)
C -
Cap
acita
nce
(pF)
Capacitance Gate Charge
QG - Gate Charge (nC)
VG
S -
Gat
e-so
urce
Vol
tage
(V)
-50 -25 0 25 50 75 100 125 1500.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
RON
@Tj=25oC: 25mΩ
VGS
= 10V
IDS
= 5A
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.60.1
1
10
20
Tj=25oC
Tj=150oC
0 2 4 6 8 10 120
1
2
3
4
5
6
7
8
9
10V
DS=10V
ID = 5A
0 4 8 12 16 200
100
200
300
400
500
600
700
Frequency=1MHz
Crss Coss
Ciss
Typical Operating Characteristics (Cont.)
Copyright ANPEC Electronics Corp.Rev. A.2 - Sep., 2008
APM2050ND
www.anpec.com.tw7
Package Information
SOT-89
SYMBO MIN. MAX.
MILLIMETERS
SOT-89
MIN. MAX.
INCHES
A
C
e1
e
BB1
D
D1
H
EL
E1
1.60
0.44
0.35 0.44
4.40 4.60
1.62 1.83
0.56
2.13
A
B
C
D
D1
E
E1
e
e1
B1 0.36 0.48
3.00 BSC
3.94 4.25
2.29 2.60
2.29
0.118 BSC
0.063
0.017
0.014 0.019
0.014 0.017
0.173 0.181
0.064 0.072
0.084
0.155 0.167
0.090 0.102
0.090
0.022
L 0.89 0.035
H
1.50 BSC 0.059 BSC
1.40
1.20 0.047
0.055L
Note : Follow JEDEC TO-243 AA.
Copyright ANPEC Electronics Corp.Rev. A.2 - Sep., 2008
APM2050ND
www.anpec.com.tw8
Application A H T1 C d D W E1 F
178.0±2.00 50 MIN. 12.4+2.00-0.00
13.0+0.50 -0.20
1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.50±0.05
P0 P1 P2 D0 D1 T A0 B0 K0 SOT-89
4.0±0.10 8.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00
-0.404.80±0.20 4.50±0.20 1.80±0.20
(mm)
Package Type Unit Quantity SOT-89 Type & Reel 1000
Devices Per Unit
Carrier Tape & Reel Dimensions
H
T1
A
d
A
E1
AB
W
F
T
P0OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
Copyright ANPEC Electronics Corp.Rev. A.2 - Sep., 2008
APM2050ND
www.anpec.com.tw9
Reflow Condition (IR/Convection or VPR Reflow)
Reliability Test Program
t 25 C to Peak
tp
Ramp-up
tL
Ramp-downts
Preheat
Tsmax
Tsmin
TL
TP
25
Tem
per
atu
re
Time
Critical ZoneTL to TP
°
Taping Direction Information
Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles ESD MIL-STD-883D-3015.7 VHBM > 2KV, VMM > 200V Latch-Up JESD 78 10ms, 1tr > 100mA
SOT-89
USER DIRECTION OF FEED
Copyright ANPEC Electronics Corp.Rev. A.2 - Sep., 2008
APM2050ND
www.anpec.com.tw10
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.
Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)
100°C 150°C
60-120 seconds
150°C 200°C
60-180 seconds
Time maintained above: - Temperature (TL) - Time (tL)
183°C 60-150 seconds
217°C 60-150 seconds
Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)
10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max.
Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.
Table 2. Pb-free Process – Package Classification Reflow Temperatures Package Thickness Volume mm3
<350 Volume mm3
350-2000 Volume mm3
>2000 <1.6 mm 260 +0°C* 260 +0°C* 260 +0°C*
1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C* ≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C*
*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures Package Thickness Volume mm3
<350 Volume mm3
≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C
Customer Service
Anpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838
Fax : 886-2-2917-3838
Classification Reflow Profiles
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008
APM3040ND
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, andadvise customers to obtain the latest version of relevant information to verify before placing orders.
Pin Description
Ordering and Marking Information
Features
Applications
• Switching Regulators
• Switching Converters
• 30V/3A,
RDS(ON)=31mΩ(typ.) @ VGS=10V RDS(ON)=35mΩ(typ.) @ VGS=4.5V RDS(ON)=55mΩ(typ.) @ VGS=2.5V
• Super High Dense Cell Design
• Reliable and Rugged
• Lead Free and Green Devices Available (RoHS Compliant)
N-Channel MOSFET
Top View of SOT-89
GD
S
G
S
D
(3)
(2)
(1)
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).
APM3040N
Handling CodeTemperature RangePackage Code
Package Code D : SOT-89Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material G : Halogen and Lead Free Device
APM3040N D: APM3040XXXXX_N
XXXXX - Date Code
Assembly Material
Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008
APM3040ND
www.anpec.com.tw2
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)
Electrical Characteristics (TA = 25°C unless otherwise noted)
Symbol Parameter Rating Unit
VDSS Drain-Source Voltage 30
VGSS Gate-Source Voltage ±12 V
ID* Continuous Drain Current 3
IDM* 300µs Pulsed Drain Current VGS=10V
12 A
IS* Diode Continuous Forward Current 1 A
TJ Maximum Junction Temperature 150
TSTG Storage Temperature Range -55 to 150 °C
TA=25°C 1.47 PD* Power Dissipation for Single Operation
TA=100°C 0.58 W
RθJA* Thermal Resistance-Junction to Ambient 85 °C/W
Note:*Surface Mounted on 1in2 pad area, t ≤ 10sec.
APM3040ND Symbol Parameter Test Conditions
Min. Typ. Max. Unit
STATIC CHARACTERISTICS
BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 30 - - V
VDS=24V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current
TJ=85°C - - 30 µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 0.6 0.75 1.5 V
IGSS Gate Leakage Current VGS=±12V, VDS=0V - - ±100 nA
VGS=10V, IDS=3A - 31 40
VGS=4.5V, IDS=1.5A - 35 50 RDS(ON) a Drain-Source On-State Resistance
VGS=2.5V, IDS=0.5A - 55 70
mΩ
VSDa Diode Forward Voltage ISD=0.5A , VGS=0V - 0.7 1.3 V
GATE CHARGE CHARACTERISTICS b
Qg Total Gate Charge - 18 23
Qgs Gate-Source Charge - 2.5 -
Qgd Gate-Drain Charge
VDS=15V, VGS=10V, IDS=3A
- 2 -
nC
Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008
APM3040ND
www.anpec.com.tw3
Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)
APM3040ND Symbol Parameter Test Conditions
Min. Typ. Max. Unit
DYNAMIC CHARACTERISTICS b
RG Gate Resistance VGS=0, VDS=0, F=1MHz - 1.5 - Ω
Ciss Input Capacitance - 430 -
Coss Output Capacitance - 80 -
Crss Reverse Transfer Capacitance
VGS=0V, VDS=25V, Frequency=1.0MHz - 40 -
pF
td(ON) Turn-on Delay Time - 11 21
Tr Turn-on Rise Time - 17 32
td(OFF) Turn-off Delay Time - 37 68
Tf Turn-off Fall Time
VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω
- 20 38
ns
Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.
Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008
APM3040ND
www.anpec.com.tw4
1E-4 1E-3 0.01 0.1 1 10 1001E-3
0.01
0.1
1
2
Mounted on 1in2 padR
θJA : 85 oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
Typical Operating Characteristics
Power Dissipation
Pto
t - P
ower
(W)
Tj - Junction Temperature (°C)
Drain Current
Tj - Junction Temperature
ID -
Dra
in C
urre
nt (A
)
Thermal Transient Impedance
Nor
mal
ized
Tra
nsie
nt T
herm
al R
esis
tanc
e
Square Wave Pulse Duration (sec)
Safe Operation Area
VDS - Drain - Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
0 20 40 60 80 100 120 140 1600.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
TA=25oC
0 20 40 60 80 100 120 140 160 1800.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
TA=25oC,V
G=10V
0.01 0.1 1 10 1000.01
0.1
1
10
30
Rds(o
n) Li
mit
1s
TA=25oC
10ms
300µs
1ms
100ms
DC
Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008
APM3040ND
www.anpec.com.tw5
VDS - Drain - Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Output Characteristics
RD
S(O
N) - O
n - R
esis
tanc
e (m
Ω)
Drain-Source On Resistance
ID - Drain Current (A)
Transfer Characteristics
VGS - Gate - Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Tj - Junction Temperature (°C)
Gate Threshold Voltage
Nor
mal
ized
Thr
esho
ld V
olta
ge
Typical Operating Characteristics (Cont.)
0 2 4 6 8 100
2
4
6
8
10
12
2V
1.5V
VGS
= 3,4,5,6,7,8,9,10V
0 2 4 6 8 10 120
15
30
45
60
75
90
VGS
=10V
VGS
=2.5V
VGS
=4.5V
0.0 0.5 1.0 1.5 2.0 2.5 3.000
2
4
6
8
10
12
Tj=125oC
Tj=25oC T
j=-55oC
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
IDS
=250µA
Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008
APM3040ND
www.anpec.com.tw6
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
Tj - Junction Temperature (°C) VSD - Source - Drain Voltage (V)
Source-Drain Diode Forward
IS -
Sou
rce
Cur
rent
(A)
VDS - Drain-Source Voltage (V)
C -
Cap
acita
nce
(pF)
Capacitance Gate Charge
QG - Gate Charge (nC)
VG
S -
Gat
e-so
urce
Vol
tage
(V)
Typical Operating Characteristics (Cont.)
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
RON
@Tj=25oC: 31mΩ
VGS
= 10V
IDS
= 3A
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.40.1
1
10
Tj=150oC
Tj=25oC
0 5 10 15 20 25 300
100
200
300
400
500
600Frequency=1MHz
CrssCoss
Ciss
0 4 8 12 16 200
2
4
6
8
10V
DS=15V
IDS
= 3A
Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008
APM3040ND
www.anpec.com.tw7
SOT-89
Package Information
SYMBO MIN. MAX.
MILLIMETERS
SOT-89
MIN. MAX.
INCHES
A
C
e1
e
BB1
D
D1
H
EL
E1
1.60
0.44
0.35 0.44
4.40 4.60
1.62 1.83
0.56
2.13
A
B
C
D
D1
E
E1
e
e1
B1 0.36 0.48
3.00 BSC
3.94 4.25
2.29 2.60
2.29
0.118 BSC
0.063
0.017
0.014 0.019
0.014 0.017
0.173 0.181
0.064 0.072
0.084
0.155 0.167
0.090 0.102
0.090
0.022
L 0.89 0.035
H
1.50 BSC 0.059 BSC
1.40
1.20 0.047
0.055L
Note : Follow JEDEC TO-243 AA.
Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008
APM3040ND
www.anpec.com.tw8
Application A H T1 C d D W E1 F
178.0±2.00 50 MIN. 12.4+2.00 -0.00
13.0+0.50 -0.20
1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.50±0.05
P0 P1 P2 D0 D1 T A0 B0 K0 SOT-89
4.0±0.10 8.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00
-0.40 4.80±0.20 4.50±0.20 1.80±0.20
(mm)
Carrier Tape & Reel Dimensions
H
T1
A
d
A
E1
AB
W
F
T
P0OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
Devices Per Unit
Package Type Unit Quantity
SOT-89 Tape & Reel 1000
Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008
APM3040ND
www.anpec.com.tw9
Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles
Reflow Condition (IR/Convection or VPR Reflow)
Reliability Test Program
t 25 C to Peak
tp
Ramp-up
tL
Ramp-downts
Preheat
Tsmax
Tsmin
TL
TP
25
Tem
per
atur
e
Time
Critical ZoneTL to TP
°
Taping Direction InformationSOT-89
USER DIRECTION OF FEED
Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008
APM3040ND
www.anpec.com.tw10
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.
Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)
100°C 150°C
60-120 seconds
150°C 200°C
60-180 seconds
Time maintained above: - Temperature (TL) - Time (tL)
183°C 60-150 seconds
217°C 60-150 seconds
Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)
10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.
Table 2. Pb-free Process – Package Classification Reflow Temperatures
Package Thickness Volume mm3 <350
Volume mm3 350-2000
Volume mm3 >2000
<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*
≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures
Package Thickness Volume mm3
<350 Volume mm3
≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C
Customer ServiceAnpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838Fax : 886-2-2917-3838
Classification Reflow Profiles
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. B.4 - Dec., 2008
APM3054ND
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, andadvise customers to obtain the latest version of relevant information to verify before placing orders.
Pin Description
Ordering and Marking Information
Features
Applications
• Switching Regulators
• Switching Converters
• 30V/4A,
RDS(ON)=48mΩ(typ.) @ VGS=10V RDS(ON)=75mΩ(typ.) @ VGS=4.5V
• Super High Dense Cell Design
• Reliable and Rugged
• Lead Free and Green Devices Available (RoHS Compliant)
N-Channel MOSFET
Top View of SOT-89
GD
S
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).
G
S
D
(3)
(2)
(1)
APM3054N
Handling CodeTemperature RangePackage Code
Package Code D : SOT-89Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material G : Halogen and Lead Free Device
APM3054N D: APM3054XXXXX
XXXXX - Date Code
Assembly Material
Copyright ANPEC Electronics Corp.Rev. B.4 - Dec., 2008
APM3054ND
www.anpec.com.tw2
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)
Electrical Characteristics (TA = 25°C unless otherwise noted)
Symbol Parameter Rating Unit
VDSS Drain-Source Voltage 30
VGSS Gate-Source Voltage ±20 V
ID* Continuous Drain Current 4
IDM* Pulsed Drain Current VGS=10V
16 A
IS* Diode Continuous Forward Current 1 A
TJ Maximum Junction Temperature 150
TSTG Storage Temperature Range -55 to 150 °C
TA=25°C 1.47 PD* Power Dissipation for Single Operation
TA=100°C 0.58 W
RθJA* Thermal Resistance-Junction to Ambient 85 °C/W
Note : *Surface Mounted on 1in2 pad area, t ≤ 10sec.
APM3054ND Symbol Parameter Test Conditions
Min. Typ. Max. Unit
Static Characteristics
BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 30 - - V
VDS=24V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current
TJ=85°C - - 30 µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1 1.5 2 V
IGSS Gate Leakage Current VGS=±20V, VDS=0V - - ±100 nA
VGS=10V, IDS=4A - 48 54 RDS(ON)
a Drain-Source On-state Resistance VGS=4.5V, IDS=3A - 75 90
mΩ
VSDa Diode Forward Voltage ISD=1A, VGS=0V - 0.75 1.3 V
Gate Charge Characteristics b
Qg Total Gate Charge - 17.6 24
Qgs Gate-Source Charge - 5.2 -
Qgd Gate-Drain Charge
VDS=15V, VGS=10V, IDS=4A
- 2.8 -
nC
Copyright ANPEC Electronics Corp.Rev. B.4 - Dec., 2008
APM3054ND
www.anpec.com.tw3
APM3054ND Symbol Parameter Test Conditions
Min. Typ. Max. Unit
Dynamic Characteristics b
RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 2.3 - Ω
Ciss Input Capacitance - 400 -
Coss Output Capacitance - 80 -
Crss Reverse Transfer Capacitance
VGS=0V, VDS=25V, Frequency=1.0MHz - 45 -
pF
td(ON) Turn-on Delay Time - 6 9
Tr Turn-on Rise Time - 14 24
td(OFF) Turn-off Delay Time - 18 26
Tf Turn-off Fall Time
VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω
- 4 6
ns
Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.
Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)
Copyright ANPEC Electronics Corp.Rev. B.4 - Dec., 2008
APM3054ND
www.anpec.com.tw4
1E-4 1E-3 0.01 0.1 1 10 1001E-3
0.01
0.1
1
2
Mounted on 1in2 padR
θJA : 85 oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
Typical Operating Characteristics
Power Dissipation
Pto
t - P
ower
(W)
Tj - Junction Temperature (°C)
Drain Current
Tj - Junction Temperature
ID -
Dra
in C
urre
nt (A
)
Thermal Transient Impedance
Nor
mal
ized
Tra
nsie
nt T
herm
al R
esis
tanc
e
Square Wave Pulse Duration (sec)
Safe Operation Area
VDS - Drain - Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
0 20 40 60 80 100 120 140 1600.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
TA=25oC
0 20 40 60 80 100 120 140 1600.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
TA=25oC,V
G=10V
0.01 0.1 1 10 1000.01
0.1
1
10
50
1ms
TA=25oC
Rds(o
n) Li
mit
1s
10ms
300µs
100ms
DC
Copyright ANPEC Electronics Corp.Rev. B.4 - Dec., 2008
APM3054ND
www.anpec.com.tw5
VDS - Drain - Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Output Characteristics
RD
S(O
N) - O
n - R
esis
tanc
e (m
Ω)
Drain-Source On Resistance
ID - Drain Current (A)
Transfer Characteristics
VGS - Gate - Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Tj - Junction Temperature (°C)
Gate Threshold Voltage
Nor
mal
ized
Thr
esho
ld V
olta
ge
Typical Operating Characteristics (Cont.)
0 1 2 3 4 50
2
4
6
8
10
12
14
16
3V
4V
5V
VGS
= 6, 7, 8, 9, 10V
0 1 2 3 4 5 6 7 80
2
4
6
8
10
12
14
16
Tj=125oC
Tj=25oC
Tj=-55oC
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4IDS
=250µA
0 2 4 6 8 10 12 14 1610
20
30
40
50
60
70
80
90
100
110
120
VGS
=10V
VGS
=4.5V
Copyright ANPEC Electronics Corp.Rev. B.4 - Dec., 2008
APM3054ND
www.anpec.com.tw6
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
Tj - Junction Temperature (°C) VSD - Source - Drain Voltage (V)
Source-Drain Diode Forward
IS -
Sou
rce
Cur
rent
(A)
VDS - Drain-Source Voltage (V)
C -
Cap
acita
nce
(pF)
Capacitance Gate Charge
QG - Gate Charge (nC)
VG
S -
Gat
e-so
urce
Vol
tage
(V)
Typical Operating Characteristics (Cont.)
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
RON
@Tj=25oC: 48mΩ
VGS
= 10V
IDS
= 4A
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.61
10
20
Tj=25oC
Tj=150oC
0 5 10 15 20 25 300
100
200
300
400
500
600
Frequency=1MHz
Ciss
Coss
Crss
0 2 4 6 8 10 12 14 16 180
1
2
3
4
5
6
7
8
9
10V
DS=15V
ID = 4A
Copyright ANPEC Electronics Corp.Rev. B.4 - Dec., 2008
APM3054ND
www.anpec.com.tw7
SOT-89
Package Information
SYMBO MIN. MAX.
MILLIMETERS
SOT-89
MIN. MAX.
INCHES
A
C
e1
e
BB1
D
D1
H
EL
E1
1.60
0.44
0.35 0.44
4.40 4.60
1.62 1.83
0.56
2.13
A
B
C
D
D1
E
E1
e
e1
B1 0.36 0.48
3.00 BSC
3.94 4.25
2.29 2.60
2.29
0.118 BSC
0.063
0.017
0.014 0.019
0.014 0.017
0.173 0.181
0.064 0.072
0.084
0.155 0.167
0.090 0.102
0.090
0.022
L 0.89 0.035
H
1.50 BSC 0.059 BSC
1.40
1.20 0.047
0.055L
Note : Follow JEDEC TO-243 AA.
Copyright ANPEC Electronics Corp.Rev. B.4 - Dec., 2008
APM3054ND
www.anpec.com.tw8
Application A H T1 C d D W E1 F
178.0±2.00 50 MIN. 12.4+2.00 -0.00
13.0+0.50 -0.20
1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.50±0.05
P0 P1 P2 D0 D1 T A0 B0 K0 SOT-89
4.0±0.10 8.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00
-0.40 4.80±0.20 4.50±0.20 1.80±0.20
(mm)
Carrier Tape & Reel Dimensions
H
T1
A
d
A
E1
AB
W
F
T
P0OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
Devices Per Unit
Package Type Unit Quantity
SOT-89 Tape & Reel 1000
Copyright ANPEC Electronics Corp.Rev. B.4 - Dec., 2008
APM3054ND
www.anpec.com.tw9
Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles
Reflow Condition (IR/Convection or VPR Reflow)
Reliability Test Program
t 25 C to Peak
tp
Ramp-up
tL
Ramp-downts
Preheat
Tsmax
Tsmin
TL
TP
25
Tem
per
atur
e
Time
Critical ZoneTL to TP
°
Taping Direction InformationSOT-89
USER DIRECTION OF FEED
Copyright ANPEC Electronics Corp.Rev. B.4 - Dec., 2008
APM3054ND
www.anpec.com.tw10
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.
Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)
100°C 150°C
60-120 seconds
150°C 200°C
60-180 seconds
Time maintained above: - Temperature (TL) - Time (tL)
183°C 60-150 seconds
217°C 60-150 seconds
Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)
10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.
Table 2. Pb-free Process – Package Classification Reflow Temperatures
Package Thickness Volume mm3 <350
Volume mm3 350-2000
Volume mm3 >2000
<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*
≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures
Package Thickness Volume mm3
<350 Volume mm3
≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C
Customer ServiceAnpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838Fax : 886-2-2917-3838
Classification Reflow Profiles
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.
APM2054NV
Pin Description
Ordering and Marking Information
Features
Applications
• 20V/5A,RDS(ON)= 35mΩ (Typ.) @ VGS= 10VRDS(ON)= 45mΩ (Typ.) @ VGS= 4.5V
RDS(ON)= 110mΩ (Typ.) @ VGS= 2.5V• Super High Dense Cell Design• Reliable and Rugged• Lead Free and Green Devices Available
(RoHS Compliant)
• Switching Regulators
• Switching Converters
Top View of SOT-223
N-Channel MOSFET
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).
G
S
D
(3)
(2)
(1)
GD
S
APM2054N
Handling CodeTemperature RangePackage Code
Package Code V : SOT-223Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material G : Halogen and Lead Free Device
APM2054N V : APM2054NXXXXX
XXXXX - Date Code
Assembly Material
Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008
www.anpec.com.tw2
APM2054NV
Symbol Parameter Rating Unit
VDSS Drain-Source Voltage 20
VGSS Gate-Source Voltage ±16 V
ID* Continuous Drain Current 5
IDM* Pulsed Drain Current VGS=10V
20 A
IS* Diode Continuous Forward Current 3 A
TJ Maximum Junction Temperature 150
TSTG Storage Temperature Range -55 to 150 °C
TA=25°C 1.47 PD* Power Dissipation for Single Operation
TA=100°C 0.58 W
RθJA* Thermal Resistance-Junction to Ambient 85 °C/W
Note : *Surface Mounted on 1in2 pad area, t ≤ 10sec.
Electrical Characteristics (TA = 25°C unless otherwise noted)
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)
APM2054NV Symbol Parameter Test Conditions
Min. Typ. Max. Unit
STATIC CHARACTERISTICS
BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 20 - - V
VDS=16V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current
TJ=85°C - - 30 µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 0.6 0.9 1.5 V
IGSS Gate Leakage Current VGS=±16V, VDS=0V - - ±100 nA
VGS=10V, IDS=5A - 35 40
VGS=4.5V, IDS=3.5A - 45 54 RDS(ON) a Drain-Source On-state Resistance
VGS=2.5V, IDS=2.5A - 110 130
mΩ
VSDa Diode Forward Voltage ISD=3A, VGS=0V - 0.85 1.3 V
GATE CHARGE CHARACTERISTICS b
Qg Total Gate Charge - 11 13
Qgs Gate-Source Charge - 3.8 -
Qgd Gate-Drain Charge
VDS=10V, VGS=4.5V, IDS=6A
- 5.2 -
nC
Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008
www.anpec.com.tw3
APM2054NV
APM2054NV Symbol Parameter Test Conditions
Min. Typ. Max. Unit
DYNAMIC CHARACTERISTICS b
td(ON) Turn-On Delay Time - 7 10
Tr Turn-On Rise Time - 15 25
td(OFF) Turn-Off Delay Time - 19 26
Tf Turn-Off Fall Time
VDD=10V, RL=10Ω, IDS=1A, VGEN=4.5V, RG=6Ω
- 6 7
ns
RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 2.5 - Ω
Ciss Input Capacitance - 450 -
Coss Output Capacitance - 100 -
Crss Reverse Transfer Capacitance
VGS=0V, VDS=20V, Frequency=1.0MHz - 60 -
pF
Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.
Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)
Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008
www.anpec.com.tw4
APM2054NV
Typical Operating Characteristics
Power Dissipation
Pto
t - P
ower
(W)
Tj - Junction Temperature (°C)
ID -
Dra
in C
urre
nt (A
)
Drain Current
Tj - Junction Temperature (°C)
Safe Operation Area
VDS - Drain - Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Nor
mal
ized
Tra
nsie
nt T
herm
al R
esis
tanc
e
Thermal Transient Impedance
Square Wave Pulse Duration (sec)
0 20 40 60 80 100 120 140 1600.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
TA=25oC
0 20 40 60 80 100 120 140 1600
1
2
3
4
5
6
TA=25oC,V
G=10V
0.1 1 10 600.01
0.1
1
10
100
100ms
Rds(on
) Limit
300µs
TA=25oC
1s
1ms
10ms
DC
1E-4 1E-3 0.01 0.1 1 10 1001E-3
0.01
0.1
1
2
Mounted on 1in2 padR
θJA :85 oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008
www.anpec.com.tw5
APM2054NV
VDS - Drain - Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Output Characteristics
RD
S(O
N) - O
n - R
esis
tanc
e (m
Ω)
Drain-Source On Resistance
ID - Drain Current (A)
Transfer Characteristics
VGS - Gate - Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Tj - Junction Temperature (°C)
Gate Threshold Voltage
Nor
mal
ized
Thr
esho
ld V
olta
ge
0 2 4 6 8 100
2
4
6
8
10
12
14
16
18
20
2V
3V
VGS
= 4, 5, 6, 7, 8, 9, 10V
0 4 8 12 16 200
20
40
60
80
100
120
140
160
VGS
=10V
VGS
=4.5V
VGS
=2.5V
0 1 2 3 4 50
2
4
6
8
10
12
14
16
18
20
Tj=125oC
Tj=25oC
Tj=-55oC
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
IDS
=250µA
Typical Operating Characteristics (Cont.)
Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008
www.anpec.com.tw6
APM2054NV
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
Tj - Junction Temperature (°C) VSD - Source - Drain Voltage (V)
Source-Drain Diode Forward
IS -
Sou
rce
Cur
rent
(A)
VDS - Drain - Source Voltage (V)
C -
Cap
acita
nce
(pF)
Capacitance Gate Charge
QG - Gate Charge (nC)
VG
S -
Gat
e-so
urce
Vol
tage
(V)
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
RON
@Tj=25oC: 35mΩ
VGS
= 10V
IDS
= 5A
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.41
10
20
Tj=25oC
Tj=150oC
0 4 8 12 16 200
100
200
300
400
500
600
700
Frequency=1MHz
Crss
Coss
Ciss
0 4 8 12 16 20 240
1
2
3
4
5
6
7
8
9
10V
DS=10V
ID = 5A
Typical Operating Characteristics (Cont.)
Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008
www.anpec.com.tw7
APM2054NV
Package Information
SOT-223
AA2
VIEW A
0.25L
GAUGE PLANESEATING PLANE
A1
D
E
e1
e
b2
E1
SEEVIEW A
c
b°
0
SYMBOL MIN. MAX.
1.80
0.02
0.66 0.84
2.90 3.10
0.23 0.33
0.10
6.70
A
A1
b
b2
c
D
E
E1
e
MILLIMETERS
A2 1.50 1.70
2.30 BSC
SOT-223
3.30 3.70
6.30 6.70
7.30
0.091 BSC
MIN. MAX.
INCHES
0.071
0.001
0.059 0.067
0.026 0.033
0.114 0.122
0.009 0.013
0.264
0.130 0.146
0.248 0.264
0.287
0.004
0
L 0.75 0.030
e1 4.60 BSC 0.181 BSC
°10°0 °10°0
Note : 1. Follow from JEDEC TO-261 AA. 2. Dimension D and E1 are determined at the outermost extremes of the plastic exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but including any mismatch between the top and bottom of the plastic body.
Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008
www.anpec.com.tw8
APM2054NV
Application A H T1 C d D W E1 F
320.0±2.00 50 MIN. 12.4+2.00 -0.00
13.0+0.50 -0.20
1.5 MIN. 20.2 MIN. 12.00±0.30 1.75±0.10 5.50±0.05
P0 P1 P2 D0 D1 T A0 B0 K0 SOT-223
4.00±0.10 8.00±0.10 2.00±0.50 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00
-0.40 6.90±0.20 7.50±0.20 2.10±0.20
(mm)
Carrier Tape & Reel Dimensions
H
T1
A
d
A
E1
AB
W
F
T
P0OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
Devices Per Unit
Package Type Unit Quantity
SOT-223 Tape & Reel 2500
Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008
www.anpec.com.tw9
APM2054NV
Reflow Condition (IR/Convection or VPR Reflow)
Reliability Test Program
t 25 C to Peak
tp
Ramp-up
tL
Ramp-downts
Preheat
Tsmax
Tsmin
TL
TP
25
Tem
per
atu
re
Time
Critical ZoneTL to TP
°
Taping Direction Information
Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles
SOT-223
USER DIRECTION OF FEED
Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008
www.anpec.com.tw10
APM2054NV
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.
Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)
100°C 150°C
60-120 seconds
150°C 200°C
60-180 seconds
Time maintained above: - Temperature (TL) - Time (tL)
183°C 60-150 seconds
217°C 60-150 seconds
Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)
10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max.
Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.
Table 2. Pb-free Process – Package Classification Reflow Temperatures
Package Thickness Volume mm3 <350
Volume mm3 350-2000
Volume mm3 >2000
<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*
≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures
Package Thickness Volume mm3
<350 Volume mm3
≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C
Customer Service
Anpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838
Fax : 886-2-2917-3838
Classification Reflow Profiles
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008
APM3054NV
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.
Pin Description
Ordering and Marking Information
Features
Applications
• Switching Regulators
• Switching Converters
• 30V/4A,
RDS(ON)=48mΩ(typ.) @ VGS=10V RDS(ON)=75mΩ(typ.) @ VGS=4.5V
• Super High Dense Cell Design
• Reliable and Rugged
• Lead Free and Green Devices Available(RoHS Compliant)
N-Channel MOSFET
Top View of SOT-223
GD
S
G
S
D
(3)
(2)
(1)
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).
APM3054N
Handling CodeTemperature RangePackage Code
Package Code V : SOT-223Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material G : Halogen and Lead Free Device
APM3054N V: APM3054NXXXXX XXXXX - Date Code
Assembly Material
Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008
APM3054NV
www.anpec.com.tw2
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)
Electrical Characteristics (TA = 25°C unless otherwise noted)
Symbol Parameter Rating Unit
VDSS Drain-Source Voltage 30
VGSS Gate-Source Voltage ±20 V
ID* Continuous Drain Current 4
IDM* Pulsed Drain Current VGS=10V
16 A
IS* Diode Continuous Forward Current 2.2 A
TJ Maximum Junction Temperature 150
TSTG Storage Temperature Range -55 to 150 °C
TA=25°C 1.47 PD* Power Dissipation for Single Operation
TA=100°C 0.58 W
RθJA* Thermal Resistance-Junction to Ambient 85 °C/W
Note : *Surface Mounted on 1in2 pad area, t ≤ 10sec.
APM3054NV Symbol Parameter Test Conditions
Min. Typ. Max. Unit
Static Characteristics
BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 30 - - V
VDS=24V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current
TJ=85°C - - 30 µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1 1.5 2 V
IGSS Gate Leakage Current VGS=±20V, VDS=0V - - ±100 nA
VGS=10V, IDS=4A - 48 54 RDS(ON)
a Drain-Source On-state Resistance VGS=4.5V, IDS=3A - 75 90
mΩ
VSDa Diode Forward Voltage ISD=2.2A, VGS=0V - 0.75 1.3 V
Gate Charge Characteristics b
Qg Total Gate Charge - 17.6 24
Qgs Gate-Source Charge - 5.2 -
Qgd Gate-Drain Charge
VDS=15V, VGS=10V, IDS=4A
- 2.8 -
nC
Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008
APM3054NV
www.anpec.com.tw3
APM3054NV Symbol Parameter Test Conditions
Min. Typ. Max. Unit
Dynamic Characteristics b
RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 2.3 - Ω
Ciss Input Capacitance - 400 -
Coss Output Capacitance - 80 -
Crss Reverse Transfer Capacitance
VGS=0V, VDS=25V, Frequency=1.0MHz - 45 -
pF
td(ON) Turn-on Delay Time - 6 9
Tr Turn-on Rise Time - 14 24
td(OFF) Turn-off Delay Time - 18 26
Tf Turn-off Fall Time
VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω
- 4 6
ns
Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.
Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)
Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008
APM3054NV
www.anpec.com.tw4
1E-4 1E-3 0.01 0.1 1 10 1001E-3
0.01
0.1
1
2
Mounted on 1in2 padR
θJA : 85 oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
Typical Opearting Characteristics
Power Dissipation
Pto
t - P
ower
(W)
Tj - Junction Temperature (°C)
Drain Current
Tj - Junction Temperature
ID -
Dra
in C
urre
nt (A
)
Thermal Transient Impedance
Nor
mal
ized
Tra
nsie
nt T
herm
al R
esis
tanc
e
Square Wave Pulse Duration (sec)
Safe Operation Area
VDS - Drain - Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
0 20 40 60 80 100 120 140 1600.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
TA=25oC
0 20 40 60 80 100 120 140 1600.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
TA=25oC,V
G=10V
0.01 0.1 1 10 1000.01
0.1
1
10
50
1ms
TA=25oC
Rds(o
n) Li
mit
1s
10ms
300µs
100ms
DC
Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008
APM3054NV
www.anpec.com.tw5
VDS - Drain - Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Output Characteristics
RD
S(O
N) - O
n - R
esis
tanc
e (m
Ω)
Drain-Source On Resistance
ID - Drain Current (A)
Transfer Characteristics
VGS - Gate - Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Tj - Junction Temperature (°C)
Gate Threshold Voltage
Nor
mal
ized
Thr
esho
ld V
olta
ge
Typical Opearting Characteristics (Cont.)
0 1 2 3 4 50
2
4
6
8
10
12
14
16
3V
4V
5V
VGS
= 6, 7, 8, 9, 10V
0 1 2 3 4 5 6 7 80
2
4
6
8
10
12
14
16
Tj=125oC
Tj=25oC
Tj=-55oC
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4IDS
=250µA
0 2 4 6 8 10 12 14 1610
20
30
40
50
60
70
80
90
100
110
120
VGS
=10V
VGS
=4.5V
Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008
APM3054NV
www.anpec.com.tw6
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
Tj - Junction Temperature (°C) VSD - Source - Drain Voltage (V)
Source-Drain Diode Forward
IS -
Sou
rce
Cur
rent
(A)
VDS - Drain-Source Voltage (V)
C -
Cap
acita
nce
(pF)
Capacitance Gate Charge
QG - Gate Charge (nC)
VG
S -
Gat
e-so
urce
Vol
tage
(V)
Typical Opearting Characteristics (Cont.)
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
RON
@Tj=25oC: 48mΩ
VGS
= 10V
IDS
= 4A
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.61
10
20
Tj=25oC
Tj=150oC
0 5 10 15 20 25 300
100
200
300
400
500
600
Frequency=1MHz
Ciss
Coss
Crss
0 2 4 6 8 10 12 14 16 180
1
2
3
4
5
6
7
8
9
10V
DS=15V
ID = 4A
Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008
APM3054NV
www.anpec.com.tw7
Package Information
SOT-223
AA2
VIEW A
0.25L
GAUGE PLANESEATING PLANE
A1
D
E
e1
e
b2
E1
SEEVIEW A
c
b°
0
SYMBOL MIN. MAX.
1.80
0.02
0.66 0.84
2.90 3.10
0.23 0.33
0.10
6.70
A
A1
b
b2
c
D
E
E1
e
MILLIMETERS
A2 1.50 1.70
2.30 BSC
SOT-223
3.30 3.70
6.30 6.70
7.30
0.091 BSC
MIN. MAX.
INCHES
0.071
0.001
0.059 0.067
0.026 0.033
0.114 0.122
0.009 0.013
0.264
0.130 0.146
0.248 0.264
0.287
0.004
0
L 0.75 0.030
e1 4.60 BSC 0.181 BSC
°10°0 °10°0
Note : 1. Follow from JEDEC TO-261 AA. 2. Dimension D and E1 are determined at the outermost extremes of the plastic exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but including any mismatch between the top and bottom of the plastic body.
Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008
APM3054NV
www.anpec.com.tw8
Carrier Tape & Reel Dimensions
H
T1
A
d
A
E1
AB
W
F
T
P0OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
Application A H T1 C d D W E1 F
320.0±2.00 50 MIN. 12.4+2.00 -0.00
13.0+0.50 -0.20
1.5 MIN. 20.2 MIN. 12.00±0.30 1.75±0.10 5.50±0.05
P0 P1 P2 D0 D1 T A0 B0 K0 SOT-223
4.00±0.10 8.00±0.10 2.00±0.50 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00
-0.40 6.90±0.20 7.50±0.20 2.10±0.20
(mm)
Devices Per Unit
Package Type Unit Quantity
SOT-223 Tape & Reel 2500
Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008
APM3054NV
www.anpec.com.tw9
Taping Direction Information
SOT-223
USER DIRECTION OF FEED
Reflow Condition (IR/Convection or VPR Reflow)
Reliability Test Program
t 25 C to Peak
tp
Ramp-up
tL
Ramp-downts
Preheat
Tsmax
Tsmin
TL
TP
25
Tem
per
atu
re
Time
Critical ZoneTL to TP
°
Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles
Copyright ANPEC Electronics Corp.Rev. B.3 - Dec., 2008
APM3054NV
www.anpec.com.tw10
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.
Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)
100°C 150°C
60-120 seconds
150°C 200°C
60-180 seconds
Time maintained above: - Temperature (TL) - Time (tL)
183°C 60-150 seconds
217°C 60-150 seconds
Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)
10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max.
Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.
Table 2. Pb-free Process – Package Classification Reflow Temperatures
Package Thickness Volume mm3 <350
Volume mm3 350-2000
Volume mm3 >2000
<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*
≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures
Package Thickness Volume mm3
<350 Volume mm3
≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C
Classification Reflow Profiles
Customer Service
Anpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838
Fax : 886-2-2917-3838
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. A.4 - Jul., 2008
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, andadvise customers to obtain the latest version of relevant information to verify before placing orders.
APM3055NG
Pin Description
Ordering and Marking Information
Features
Applications
• 30V/12A,
RDS(ON)=75mΩ (typ.) @ VGS=10VRDS(ON)=100mΩ (typ.) @ VGS=4.5V
• Super High Dense Cell Design
• Reliable and Rugged
• Lead Free and Green Devices Available
(RoHS Compliant) Top View of TO-263
N-Channel MOSFET
• Power Management in Desktop Computer or
DC/DC Converters
S
D
G
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).
DG
S
APM3055N
Handling Code
Temperature Range
Package Code
Package Code G : TO-263Operating Junction Temperature Range C : -55 to 150 CHandling Code TR : Tape & ReelAssembly Material L : Lead Free Device G : Halogen and Lead Free Device
APM3055N G: APM3055NXXXXX
XXXXX - Date Code
Assembly Materialo
Copyright ANPEC Electronics Corp.Rev. A.4 - Jul., 2008
www.anpec.com.tw2
APM3055NG
Absolute Maximum Ratings
Symbol Parameter Rating Unit
Common Ratings (TA=25°C Unless Otherwise Noted)
VDSS Drain-Source Voltage 30
VGSS Gate-Source Voltage ±20 V
TJ Maximum Junction Temperature 150
TSTG Storage Temperature Range -55 to 150 °C
IS Diode Continuous Forward Current TC=25°C 8 A
Mounted on Large Heat Sink TC=25°C 48
IDP 300µs Pulse Drain Current Tested TC=100°C 48
TC=25°C 12* ID Continuous Drain Current
TC=100°C 12
A
TC=25°C 62.5 PD Maximum Power Dissipation
TC=100°C 25 W
RθJC Thermal Resistance-Junction to Case 2 °C/W
Mounted on PCB of 1in2 pad area TA=25°C 16
IDP 300µs Pulse Drain Current Tested TA=100°C 10
TA=25°C 4.3 ID Continuous Drain Current
TA=100°C 3.1
A
TA=25°C 2.8 PD Maximum Power Dissipation
TA=100°C 1.1 W
RθJA Thermal Resistance-Junction to Ambient 45 °C/W
Mounted on PCB of Minimum Footprint TA=25°C 14
IDP 300µs Pulse Drain Current Tested TA=100°C 8
TA=25°C 3.5 ID Continuous Drain Current
TA=100°C 2
A
TA=25°C 2 PD Maximum Power Dissipation
TA=100°C 0.8 W
RθJA Thermal Resistance-Junction to Ambient 62.5 °C/W Notes:
* Current limited by bond wire.
Copyright ANPEC Electronics Corp.Rev. A.4 - Jul., 2008
www.anpec.com.tw3
APM3055NG
Electrical Characteristics (TA = 25°C unless otherwise noted)
APM3055NG Symbol Parameter Test Conditions
Min. Typ. Max. Unit
Static BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 30 V
VDS=24V, VGS=0V 1 IDSS Zero Gate Voltage Drain Current
TJ=85°C 30 µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1 1.5 2 V
IGSS Gate Leakage Current VGS=±20V, VDS=0V ±100 nA
VGS=10V, IDS=12A 75 100 RDS(ON)
a Drain-Source On-state Resistance VGS=4.5V, IDS=6A 100 200
mΩ
Diode VSD
a Diode Forward Voltage ISD=3A, VGS=0V 0.8 1.3 V
trr Reverse Recovery Time 20 ns
Qrr Reverse Recovery Charge IDS=12A, dlSD/dt=100A/µs
11 nC
Dynamicb RG Gate Resistance VGS=0V,VDS=0V,F=1MHz 2.2 Ω
Ciss Input Capacitance 390
Coss Output Capacitance 65
Crss Reverse Transfer Capacitance
VGS=0V, VDS=15V, Frequency=1.0MHz 35
pF
td(ON) Turn-on Delay Time 3 6
Tr Turn-on Rise Time 10 19
td(OFF) Turn-off Delay Time 15 28
Tf Turn-off Fall Time
VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω
2 5
ns
Gate Chargeb Qg Total Gate Charge 7.7 11
Qgs Gate-Source Charge 1.7
Qgd Gate-Drain Charge
VDS=15V, VGS=10V, IDS=12A
1.1
nC
Notes: a : Pulse test ; pulse width≤300µs, duty cycle≤2%. b : Guaranteed by design, not subject to production testing.
Copyright ANPEC Electronics Corp.Rev. A.4 - Jul., 2008
www.anpec.com.tw4
APM3055NG
Typical Characteristics
ID -
Dra
in C
urre
nt (A
)
Drain Current
Tj - Junction Temperature (°C)
Safe Operation Area
VDS - Drain - Source Voltage (V)
Thermal Transient Impedance
Square Wave Pulse Duration (sec)
Power Dissipation
Pto
t - P
ower
(W)
Tj - Junction Temperature (°C)
ID -
Dra
in C
urre
nt (A
)
Nor
mal
ized
Tra
nsie
nt T
herm
al R
esis
tanc
e
0 20 40 60 80 100 120 140 160 1800
10
20
30
40
50
60
70
TC=25oC
0 20 40 60 80 100 120 140 1600
2
4
6
8
10
12
14
TC=25oC,V
G=10V
1E-4 1E-3 0.01 0.1 1 10 600.05
0.1
1
2
Mounted on 1in2 padR
θJA : 45 oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
0.1 1 10 1000.1
1
10
100
300µs
Rds(on
) Lim
it
1s
TC=25oC
100ms
DC
1ms
Copyright ANPEC Electronics Corp.Rev. A.4 - Jul., 2008
www.anpec.com.tw5
APM3055NG
RD
S(O
N) -
On
- Res
ista
nce
(mΩ
)
Drain-Source On Resistance
ID - Drain Current (A)
Tj - Junction Temperature (°C)
Gate Threshold Voltage
VDS - Drain - Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Output Characteristics
Drain-Source On Resistance
VGS - Gate - Source Voltage (V)
RD
S(O
N) -
On
- Res
ista
nce
(mΩ
)
Nor
mal
ized
Thr
esho
ld V
olta
ge
Typical Characteristics (Cont.)
3 4 5 6 7 8 9 1050
60
70
80
90
100
110
120
130
140
150
ID=12A
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6IDS
=250µA
0.0 0.5 1.0 1.5 2.0 2.5 3.00
2
4
6
8
10
12
4V
3V
VGS
=5,6,7,8,9,10V
0 2 4 6 8 10 1220
40
60
80
100
120
140
160
VGS
= 4.5V
VGS
=10V
Copyright ANPEC Electronics Corp.Rev. A.4 - Jul., 2008
www.anpec.com.tw6
APM3055NG
VDS - Drain - Source Voltage (V)
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
Tj - Junction Temperature (°C)
C -
Cap
acita
nce
(pF)
VSD - Source - Drain Voltage (V)
Source-Drain Diode Forward
IS -
Sou
rce
Cur
rent
(A)
Capacitance Gate Charge
QG - Gate Charge (nC)
VG
S -
Gat
e - s
ourc
e V
olta
ge (V
)
Typical Characteristics (Cont.)
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
RON
@Tj=25oC: 75mΩ
VGS
= 10V
IDS
= 12A
0 5 10 15 20 25 300
50
100
150
200
250
300
350
400
450
500
550
Frequency=1MHz
Crss
Coss
Ciss
0 1 2 3 4 5 6 7 80
1
2
3
4
5
6
7
8
9
10V
DS= 15V
ID = 12A
0.0 0.4 0.8 1.2 1.6 2.00.1
1
10
20
Tj=25oC
Tj=150oC
Copyright ANPEC Electronics Corp.Rev. A.4 - Jul., 2008
www.anpec.com.tw7
APM3055NG
Package Information
TO-263-3
b2 e
L
VIEW A
0
0.25
GAUGE PLANE
A1
SEATING PLANE
SEE VIEW A
E
H
DL1
A
c2
b c
L2
E1
D1
YMBOL MIN. MAX.
4.83
0.00
1.14 1.78
0.38 0.74
1.14 1.65
0.25
6.00
A1
b2
cc2
D
D1
E
MILLIMETERS
b 0.51 0.99
2.54 BSC
TO263
9.65 11.43
6.22
0.100 BSC
MIN. MAX.
INCHES
0.190
0.000
0.020 0.039
0.045 0.070
0.015 0.029
0.045 0.065
0.236
0.380 0.450
0.245
4.06 0.160
0.010
E1
0.380
0.066
0.110
L2
L
L1
e
1.78
8.38 9.65
1.68
2.79 0.070
0.330
H 14.61 15.88 0.575 0.625
1.78 0.070
9.00
9.00
0.354
0.354
Note : Follow JEDEC TO-263 AB.
S
A
0 808θ o o o o
Copyright ANPEC Electronics Corp.Rev. A.4 - Jul., 2008
www.anpec.com.tw8
APM3055NG
Carrier Tape & Reel Dimensions
Package Type Unit Quantity TO-263 Tape & Reel 800
Devices Per Unit
Application A H T1 C d D W E1 F
381.0±2.00 60 MIN. 24.4+2.00 -0.00
13.0+0.50 -0.20
1.5 MIN. 20.2 MIN. 24.0±0.30 1.75±0.10 11.5±0.10
P0 P1 P2 D0 D1 T A0 B0 K0 TO-263
4.0±0.10 16.0±0.10 2.0±0.10 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00
-0.40 10.8±0.20 16.1±0.20 5.2±0.20
(mm)
H
T1
A
d
A
E1
AB
W
F
T
P0OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
Copyright ANPEC Electronics Corp.Rev. A.4 - Jul., 2008
www.anpec.com.tw9
APM3055NG
Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles
Reflow Condition (IR/Convection or VPR Reflow)
Classification Reflow ProfilesProfile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.
Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)
100°C 150°C
60-120 seconds
150°C 200°C
60-180 seconds
Time maintained above: - Temperature (TL) - Time (tL)
183°C 60-150 seconds
217°C 60-150 seconds
Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)
10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.
Reliability Test Program
t 25 C to Peak
tp
Ramp-up
tL
Ramp-downts
Preheat
Tsmax
Tsmin
TL
TP
25
Tem
per
atur
e
Time
Critical ZoneTL to TP
°
Copyright ANPEC Electronics Corp.Rev. A.4 - Jul., 2008
www.anpec.com.tw10
APM3055NG
Table 2. Pb-free Process – Package Classification Reflow Temperatures Package Thickness Volume mm3
<350 Volume mm3
350-2000 Volume mm3
>2000 <1.6 mm 260 +0°C* 260 +0°C* 260 +0°C*
1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C* ≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C*
*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures Package Thickness Volume mm3
<350 Volume mm3
≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C
Classification Reflow Profiles (Cont.)
Customer Service
Anpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838Fax : 886-2-2917-3838
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. A.3 - Apr., 2009
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, andadvise customers to obtain the latest version of relevant information to verify before placing orders.
APM4008NG
Pin Description
Ordering and Marking Information
Features
Applications
• 40V/60A,
RDS(ON)=6.5mΩ (typ.) @ VGS=10VRDS(ON)=10mΩ (typ.) @ VGS=4.5V
• Super High Dense Cell Design
• Reliable and Rugged
• Lead Free and Green Devices Available (RoHS
Compliant)
• Power Management in LCD monitor/TV
N-Channel MOSFET
Top View of TO-263
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).
G
S
D
APM4008N
Handling Code
Temperature Range
Package Code
Package Code G : TO-263Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material G : Halogen and Lead Free Device
APM4008N G : APM4008NXXXXX
XXXXX - Date Code
Assembly Material
G D
S
Copyright ANPEC Electronics Corp.Rev. A.3 - Apr., 2009
www.anpec.com.tw2
APM4008NG
Absolute Maximum Ratings
Symbol Parameter Rating Unit
Common Ratings (TA=25°C Unless Otherwise Noted)
VDSS Drain-Source Voltage 40
BVDS (Avalanche)* Drain-Source Avalanche Voltage (maximum) 45 V
VGSS Gate-Source Voltage ±20 V
TJ Maximum Junction Temperature 150 °C
TSTG Storage Temperature Range -55 to 150 °C IS Diode Continuous Forward Current 20 A
TC=25°C 150 IDP 300µs Pulse Drain Current Tested
TC=100°C 80 A
EAS** Drain-Source Avalanche Energy 150 mJ
Mounted on Large Heat Sink
TC=25°C 60*** ID Continuous Drain Current
TC=100°C 45 A
TC=25°C 62.5 PD Maximum Power Dissipation
TC=100°C 25 W
RθJC Thermal Resistance-Junction to Case 2 °C/W
Mounted on PCB of 1in2 pad area
TA=25°C 15 ID Continuous Drain Current
TA=100°C 9.5 A
TA=25°C 2.8 PD Maximum Power Dissipation
TA=100°C 1.1 W
RθJA Thermal Resistance-Junction to Ambient 45 °C/W
Mounted on PCB of Minimum Footprint
TA=25°C 13 ID Continuous Drain Current
TA=100°C 8 A
TA=25°C 2 PD Maximum Power Dissipation
TA=100°C 0.8 W
RθJA Thermal Resistance-Junction to Ambient 62.5 °C/W
Notes: * Avalanche single pulse test, and avalanche period time tav≤100µs, duty<1%. ** Avalanche test condition: TJ = 25oC, L=0.5mH, IAS= 25A, VDD=30V, and VGS=10V. *** Current is limited by bond wire.
Copyright ANPEC Electronics Corp.Rev. A.3 - Apr., 2009
www.anpec.com.tw3
APM4008NG
Electrical Characteristics (TA = 25°C)
APM4008NG Symbol Parameter Test Conditions
Min. Typ. Max. Unit
Static Characteristics
BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 40 - - V
VDS=32V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current
TJ=85°C - - 30 µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1.3 2 3 V
IGSS Gate Leakage Current VGS=±20V, VDS=0V - - ±100 nA
VGS=10V, IDS=20A - 6.5 8 RDS(ON)
a Drain-Source On-state Resistance VGS=4.5V, IDS=10A - 10 13.5
mΩ
Diode Characteristics
VSDa Diode Forward Voltage ISD=20A, VGS=0V - 0.7 1.1 V
Gate Charge Characteristics b
Qg Total Gate Charge - 51 71
Qgs Gate-Source Charge - 8 -
Qgd Gate-Drain Charge
VDS=20V, VGS=10V, IDS=20A
- 14 -
nC
Dynamic Characteristics b
RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 1.3 - Ω
Ciss Input Capacitance - 2600 -
Coss Output Capacitance - 260 -
Crss Reverse Transfer Capacitance
VGS=0V, VDS=20V, Frequency=1.0MHz - 210 -
pF
td(ON) Turn-on Delay Time - 18 33
tr Turn-on Rise Time - 16 30
td(OFF) Turn-off Delay Time - 57 104
tf Turn-off Fall Time
VDD=20V, RL=20Ω, IDS=1A, VGEN=10V, RG=6Ω
- 18 33
ns
trr Reverse Recovery Time - 32 - ns
Qrr Reverse Recovery Charge IDS=20A, dlSD/dt=100A/µs
- 29 - nC
Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.
Copyright ANPEC Electronics Corp.Rev. A.3 - Apr., 2009
www.anpec.com.tw4
APM4008NG
Typical Operating Characteristics
Power Dissipation
Pto
t - P
ower
(W)
Tj - Junction Temperature (°C)
ID -
Dra
in C
urre
nt (A
)
Drain Current
Tj - Junction Temperature (°C)
Safe Operation Area
VDS - Drain - Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Thermal Transient Impedance
Square Wave Pulse Duration (sec)
Nor
mal
ized
Effe
ctiv
e Tr
ansi
ent
0 20 40 60 80 100 120 140 160 1800
10
20
30
40
50
60
70
TA=25oC
0 20 40 60 80 100 120 140 1600
20
40
60
80
TC=25oC,V
G=10V
1E-4 1E-3 0.01 0.1 1 10 400.02
0.1
1
2
Mounted on 1in2 padR
θJA : 45 oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
0.01 0.1 1 10 1000.1
1
10
100
300
10ms
300µs
Rds(on
) Lim
it
1s
TC=25oC
100ms
DC
1ms
Copyright ANPEC Electronics Corp.Rev. A.3 - Apr., 2009
www.anpec.com.tw5
APM4008NG
VDS - Drain-Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Output Characteristics
RD
S(O
N) - O
n - R
esis
tanc
e (m
Ω)
Drain-Source On Resistance
ID - Drain Current (A)
VGS - Gate - Source Voltage (V)
RD
S(O
N) -
On
- Res
ista
nce
(mΩ
)
Tj - Junction Temperature (°C)
Gate Threshold Voltage
Nor
mal
ized
Thr
esho
ld V
olta
ge
Drain-Source On Resistance
0.0 0.5 1.0 1.5 2.0 2.5 3.00
30
60
90
120
150
4.5V
4V
5VVGS
=6,7,8,9,10V
-50 -25 0 25 50 75 100 125 1500.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8IDS
=250µA
3 4 5 6 7 8 9 100
5
10
15
20
25
30
ID=20A
0 25 50 75 100 125 1500
3
6
9
12
15
VGS
= 4.5V
VGS
=10V
Typical Operating Characteristics (Cont.)
Copyright ANPEC Electronics Corp.Rev. A.3 - Apr., 2009
www.anpec.com.tw6
APM4008NG
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
Tj - Junction Temperature (°C) VSD - Source-Drain Voltage (V)
Source-Drain Diode Forward
IS -
Sou
rce
Cur
rent
(A)
VDS - Drain - Source Voltage (V)
C -
Cap
acita
nce
(pF)
Capacitance Gate Charge
QG - Gate Charge (nC)
VG
S -
Gat
e-so
urce
Vol
tage
(V)
0 5 10 15 20 25 300
400
800
1200
1600
2000
2400
2800
3200
3600
4000
Frequency=1MHz
CrssCoss
Ciss
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.60.1
1
10
100150
Tj=150oC
Tj=25oC
0 10 20 30 40 50 600
1
2
3
4
5
6
7
8
9
10V
DS= 15V
ID= 20A
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
RON
@Tj=25oC: 6.5mΩ
VGS
= 10V
IDS
= 20A
Typical Operating Characteristics (Cont.)
Copyright ANPEC Electronics Corp.Rev. A.3 - Apr., 2009
www.anpec.com.tw7
APM4008NG
Avalanche Test Circuit and Waveforms
DUT
0.01Ωtp
VDD
VDSL
IL
RG
EAS
VDD
tAV
IAS
VDS
tp VDSX(SUS)
Avalanche Test Circuit and Waveforms
VDD
RD
DUT
VGS
VDS
RG
tp
td(on) tr td(off) tf
VGS
VDS90%
10%
Copyright ANPEC Electronics Corp.Rev. A.3 - Apr., 2009
www.anpec.com.tw8
APM4008NG
Package Information
TO-263
b2 e
L
VIEW A
0
0.25
GAUGE PLANEA
1SEATING PLANE
SEE VIEW A
E
H
DL1
A
c2
b c
L2
E1
D1
YMBOL MIN. MAX.
4.83
0.00
1.14 1.78
0.38 0.74
1.14 1.65
0.25
6.00
A1
b2
cc2
D
D1
E
MILLIMETERS
b 0.51 0.99
2.54 BSC
TO-263
9.65 11.43
6.22
0.100 BSC
MIN. MAX.
INCHES
0.190
0.000
0.020 0.039
0.045 0.070
0.015 0.029
0.045 0.065
0.236
0.380 0.450
0.245
4.06 0.160
0.010
E1
0.380
0.066
0.110
L2
L
L1
e
1.78
8.38 9.65
1.68
2.79 0.070
0.330
H 14.61 15.88 0.575 0.625
1.78 0.070
9.00
9.00
0.354
0.354
Note : Follow JEDEC TO-263 AB.
S
A
0 808θ o o o o
Copyright ANPEC Electronics Corp.Rev. A.3 - Apr., 2009
www.anpec.com.tw9
APM4008NG
Application A H T1 C d D W E1 F
330.0±2.00 50 MIN. 24.4+2.00 -0.00
13.0+0.50 -0.20
1.5 MIN. 20.2 MIN. 24.0±0.30 1.75±0.10 11.5±0.10
P0 P1 P2 D0 D1 T A0 B0 K0 TO-263
4.0±0.10 16.0±0.10 2.0±0.10 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00
-0.40 10.8±0.20 16.1±0.20 5.2±0.20
(mm)
Carrier Tape & Reel Dimensions
Package Type Unit Quantity TO- 263 Tape & Reel 800
Devices Per Unit
H
T1
A
d
A
E1
AB
W
F
T
P0OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
Copyright ANPEC Electronics Corp.Rev. A.3 - Apr., 2009
www.anpec.com.tw10
APM4008NG
Classification Profile
Taping Direction InformationTO-263
USER DIRECTION OF FEED
Copyright ANPEC Electronics Corp.Rev. A.3 - Apr., 2009
www.anpec.com.tw11
APM4008NG
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts)
100 °C 150 °C
60-120 seconds
150 °C 200 °C
60-120 seconds
Average ramp-up rate (Tsmax to TP) 3 °C/second max. 3°C/second max.
Liquidous temperature (TL) Time at liquidous (tL)
183 °C 60-150 seconds
217 °C 60-150 seconds
Peak package body Temperature (Tp)*
See Classification Temp in table 1 See Classification Temp in table 2
Time (tP)** within 5°C of the specified classification temperature (Tc)
20** seconds 30** seconds
Average ramp-down rate (Tp to Tsmax) 6 °C/second max. 6 °C/second max.
Time 25°C to peak temperature 6 minutes max. 8 minutes max.
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Classification Reflow Profiles
Table 2. Pb-free Process – Classification Temperatures (Tc)
Package Thickness
Volume mm3 <350
Volume mm3 350-2000
Volume mm3 >2000
<1.6 mm 260 °C 260 °C 260 °C 1.6 mm – 2.5 mm 260 °C 250 °C 245 °C
≥2.5 mm 250 °C 245 °C 245 °C
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc) Package
Thickness Volume mm3
<350 Volume mm3
≥350 <2.5 mm 235 °C 220 °C
≥2.5 mm 220 °C 220 °C
Reliability Test Program
Test item Method Description SOLDERABILITY JESD-22, B102 5 Sec, 245°C HOLT JESD-22, A108 1000 Hrs, Bias @ 125°C PCT JESD-22, A102 168 Hrs, 100%RH, 2atm, 121°C TCT JESD-22, A104 500 Cycles, -65°C~150°C
Copyright ANPEC Electronics Corp.Rev. A.3 - Apr., 2009
www.anpec.com.tw12
APM4008NG
Customer Service
Anpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838
Fax : 886-2-2917-3838
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. A.1 - Apr., 2008
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, andadvise customers to obtain the latest version of relevant information to verify before placing orders.
APM7512NG
Pin Description
Ordering and Marking Information
Features
Applications
• 75V/75A ,
RDS(ON)= 9.1mΩ (typ.) @ VGS= 10V
• Avalanche Rated
• Reliable and Rugged
• Lead Free and Green Devices Available (RoHS
Compliant)
N-Channel MOSFET
Top View of TO-263
• Power Management for Inverter Systems
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).
G
S
D
G
D
S
APM7512N
Handling Code
Temperature Range
Package Code
Package Code G : TO-263Operating Junction Temperature Range C : -55 to 175 CHandling Code TR : Tape & ReelAssembly Material L : Lead Free Device G : Halogen and Lead Free Device
APM7512N G : APM7512NXXXXX
XXXXX - Date Code
Assembly Material°
Copyright ANPEC Electronics Corp.Rev. A.1 - Apr., 2008
www.anpec.com.tw2
APM7512NG
Absolute Maximum Ratings
Symbol Parameter Rating Unit
Common Ratings (TA=25°C Unless Otherwise Noted)
VDSS Drain-Source Voltage 75
VGSS Gate-Source Voltage ±25 V
TJ Maximum Junction Temperature 175 °C
TSTG Storage Temperature Range -55 to 175 °C IS Diode Continuous Forward Current 40 A
TC=25°C 300* IDP 300µs Pulse Drain Current Tested
TC=100°C 200 A
TA=25°C 75 ID Continuous Drain Current
TA=100°C 55 A
TA=25°C 150 PD Maximum Power Dissipation
TA=100°C 75 W
RθJC Thermal Resistance-Junction to Case 1 °C/W
RθJA Thermal Resistance-Junction to Ambient 45 °C/W
Drain-Source Avalanche Ratings
EAS Avalanche Energy, Single Pulsed L=2mH 1 J
Note: * Pulse width limited by safe operating area.
Electrical Characteristics (TA = 25°C Unless Otherwise Noted)
APM7512NG Symbol Parameter Test Condition
Min. Typ. Max. Unit
Static Characteristics BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 75 V
VDS=60V, VGS=0V 1 IDSS Zero Gate Voltage Drain Current
TJ=85°C 30 µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 2.5 3.5 4.5 V
IGSS Gate Leakage Current VGS=±25V, VDS=0V ±100 nA
RDS(ON) a Drain-Source On-state Resistance VGS=10V, IDS=40A 9.1 12 mΩ
Diode Characteristics VSD
a Diode Forward Voltage ISD=20A, VGS=0V 0.8 1.3 V
trr Reverse Recovery Time 70 ns
qrr Reverse Recovery Charge IDS=40A, dlSD/dt=100A/µs
193 nC
Copyright ANPEC Electronics Corp.Rev. A.1 - Apr., 2008
www.anpec.com.tw3
APM7512NG
Electrical Characteristics (TA = 25°C Unless Otherwise Noted)
APM7512NG Symbol Parameter Test Condition
Min. Typ. Max. Unit
Dynamic Characteristics b RG Gate Resistance VGS=0V,VDS=0V,F=1MHz 1.5 Ω
Ciss Input Capacitance 3740
Coss Output Capacitance 510
Crss Reverse Transfer Capacitance
VGS=0V, VDS=30V, Frequency=1.0MHz 195
pF
td(ON) Turn-on Delay Time 25 46
tr Turn-on Rise Time 15 28
td(OFF) Turn-off Delay Time 65 118
tf Turn-off Fall Time
VDD=35V, RL=35Ω, IDS=1A, VGEN=10V, RG=6Ω
34 62
ns
Gate Charge Characteristics b Qg Total Gate Charge 69 97
Qgs Gate-Source Charge 17.5
Qgd Gate-Drain Charge
VDS=30V, VGS=10V, IDS=40A
22
nC
Notes:
a : Pulse test ; pulse width≤300µs, duty cycle≤2%. b : Guaranteed by design, not subject to production testing.
Copyright ANPEC Electronics Corp.Rev. A.1 - Apr., 2008
www.anpec.com.tw4
APM7512NG
Typical Characteristics
Power Dissipation
Pto
t - P
ower
(W)
Tj - Junction Temperature (°C)
ID -
Dra
in C
urre
nt (A
)
Drain Current
Tj - Junction Temperature (°C)
Safe Operation Area
VDS - Drain - Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Nor
mal
ized
Effe
ctiv
e Tr
ansi
ent
Thermal Transient Impedance
Square Wave Pulse Duration (sec)
1E-4 1E-3 0.01 0.1 1 10 401E-3
0.01
0.1
1
2
Mounted on 1in2 padR
θJA : 45 oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
0 20 40 60 80 100 120 140 160 1800
20
40
60
80
100
120
140
160
TC=25oC
0.01 0.1 1 10 100 3000.1
1
10
100
500
1ms
1s
Rds(o
n) Li
mit
TC=25oC
10ms
100ms
DC
0 20 40 60 80 100 120 140 160 1800
10
20
30
40
50
60
70
80
TC=25oC,V
G=10V
Copyright ANPEC Electronics Corp.Rev. A.1 - Apr., 2008
www.anpec.com.tw5
APM7512NG
VDS - Drain-Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Output Characteristics
RD
S(O
N) - O
n - R
esis
tanc
e (m
Ω)
Drain-Source On Resistance
ID - Drain Current (A)
Drain-Source On Resistance
VGS - Gate - Source Voltage (V)
RD
S(O
N) -
On
- Res
ista
nce
(mΩ
)
Typical Characteristics (Cont.)
Tj - Junction Temperature (°C)
Gate Threshold Voltage
Nor
mal
ized
Thr
esho
ld V
olta
ge
0.0 0.5 1.0 1.5 2.0 2.5 3.00
20
40
60
80
100
120
140
160
180
2009V
8V
7V
5V
6V
VGS
= 10V
0 20 40 60 80 1006
7
8
9
10
11
12
13
VGS
=10V
-50 -25 0 25 50 75 100 125 150 1750.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
IDS
=250µA
4 5 6 7 8 9 106
8
10
12
14
16
18
20
IDS
=40A
Copyright ANPEC Electronics Corp.Rev. A.1 - Apr., 2008
www.anpec.com.tw6
APM7512NG
VSD - Source-Drain Voltage (V)
Source-Drain Diode Forward
IS -
Sou
rce
Cur
rent
(A)
VDS - Drain - Source Voltage (V)
C -
Cap
acita
nce
(pF)
Capacitance Gate Charge
QG - Gate Charge (nC)
VG
S -
Gat
e-so
urce
Vol
tage
(V)
Typical Characteristics (Cont.)
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
Tj - Junction Temperature (°C)
0 5 10 15 20 25 30 35 400
500
1000
1500
2000
2500
3000
3500
4000
4500
5000
5500
Frequency=1MHz
CrssCoss
Ciss
-50 -25 0 25 50 75 100 125 150 1750.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
RON
@Tj=25oC: 9.1mΩ
VGS
= 10V I
DS = 40A
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.60.6
1
10
100
200
Tj=175oC
Tj=25oC
0 10 20 30 40 50 60 700
1
2
3
4
5
6
7
8
9
10V
DS= 30V
IDS
= 40A
Copyright ANPEC Electronics Corp.Rev. A.1 - Apr., 2008
www.anpec.com.tw7
APM7512NG
Package Information
TO-263-3
b2 e
L
VIEW A
0
0.25
GAUGE PLANE
A1
SEATING PLANE
SEE VIEW A
E
H
DL1
A
c2
b c
L2
E1
D1
YMBOL MIN. MAX.
4.83
0.00
1.14 1.78
0.38 0.74
1.14 1.65
0.25
6.00
A1
b2
cc2
D
D1
E
MILLIMETERS
b 0.51 0.99
2.54 BSC
TO263
9.65 11.43
6.22
0.100 BSC
MIN. MAX.
INCHES
0.190
0.000
0.020 0.039
0.045 0.070
0.015 0.029
0.045 0.065
0.236
0.380 0.450
0.245
4.06 0.160
0.010
E1
0.380
0.066
0.110
L2
L
L1
e
1.78
8.38 9.65
1.68
2.79 0.070
0.330
H 14.61 15.88 0.575 0.625
1.78 0.070
9.00
9.00
0.354
0.354
Note : Follow JEDEC TO-263 AB.
S
A
0 808θ o o o o
Copyright ANPEC Electronics Corp.Rev. A.1 - Apr., 2008
www.anpec.com.tw8
APM7512NG
Carrier Tape & Reel Dimensions
Application A H T1 C d D W E1 F
381.0±2.00 60 MIN. 24.4+2.00 -0.00
13.0+0.50 -0.20
1.5 MIN. 20.2 MIN. 24.0±0.30 1.75±0.10 11.5±0.10
P0 P1 P2 D0 D1 T A0 B0 K0 TO-263
4.0±0.10 16.0±0.10 2.0±0.10 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00
-0.40 10.8±0.20 16.1±0.20 5.2±0.20
H
T1
A
d
A
E1
AB
W
F
T
P0OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
Package Type Unit Quantity TO- 263 Tape & Reel 1000
Devices Per Unit
Copyright ANPEC Electronics Corp.Rev. A.1 - Apr., 2008
www.anpec.com.tw9
APM7512NG
Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles
Reflow Condition (IR/Convection or VPR Reflow)
Classification Reflow ProfilesProfile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.
Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)
100°C 150°C
60-120 seconds
150°C 200°C
60-180 seconds
Time maintained above: - Temperature (TL) - Time (tL)
183°C 60-150 seconds
217°C 60-150 seconds
Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)
10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.
Reliability Test Program
t 25 C to Peak
tp
Ramp-up
tL
Ramp-downts
Preheat
Tsmax
Tsmin
TL
TP
25
Tem
per
atu
re
Time
Critical ZoneTL to TP
°
Copyright ANPEC Electronics Corp.Rev. A.1 - Apr., 2008
www.anpec.com.tw10
APM7512NG
Table 2. Pb-free Process – Package Classification Reflow Temperatures Package Thickness Volume mm3
<350 Volume mm3
350-2000 Volume mm3
>2000 <1.6 mm 260 +0°C* 260 +0°C* 260 +0°C*
1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C* ≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C*
*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures Package Thickness Volume mm3
<350 Volume mm3
≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C
Classification Reflow Profiles (Cont.)
Customer Service
Anpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838Fax : 886-2-2917-3838
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. B.2 - Jun., 2006
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.
APM2506NUB
Pin Description
Ordering and Marking Information
Features
Applications
• 25V/60A ,
RDS(ON)=4.8mΩ(typ.) @ VGS=10V RDS(ON)=7mΩ(typ.) @ VGS=4.5V
• Super High Dense Cell Design
• Avalanche Rated
• Reliable and Rugged
• Lead Free Available (RoHS Compliant)
• Power Management in Desktop Computer or
DC/DC Converters
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin platetermination finish; which are fully compliant with RoHS and compatible with both SnPb and lead-free soldieringoperations. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C
for MSL classification at lead-free peak reflow temperature.
°
APM2506N
Handling CodeTemp. RangePackage Code
Package Code UB : TO-251Operating Junction Temp. Range C : -55 to 150 CHandling Code PB : Plastic BagLead Free Code L : Lead Free Device Blank : Original Device
APM2506N UB : APM2506NXXXXX
XXXXX - Date Code
Lead Free Code
Top View of TO-251
N-Channel MOSFET
G
S
D
1 2 3
SDG
Copyright ANPEC Electronics Corp.Rev. B.2 - Jun., 2006
www.anpec.com.tw2
APM2506NUB
Absolute Maximum Ratings
Symbol Parameter Rating Unit
Common Ratings (TA = 25°C Unless Otherwise Noted)
VDSS Drain-Source Voltage 25
VGSS Gate-Source Voltage ±20 V
TJ Maximum Junction Temperature 150 °C
TSTG Storage Temperature Range -55 to 150 °C IS Diode Continuous Forward Current TC=25°C 40 A
Mounted on Large Heat Sink TC=25°C 150
IDP 300µs Pulse Drain Current Tested TC=100°C 80
A
TC=25°C 60* ID Continuous Drain Current
TC=100°C 50 A
TC=25°C 50 PD Maximum Power Dissipation
TC=100°C 20 W
RθJC Thermal Resistance-Junction to Case 2.5 °C/W
Mounted on PCB of Minimum Footprint TA=25°C 150
IDP 300µs Pulse Drain Current Tested TA=100°C 80
A
TA=25°C 12 ID Continuous Drain Current
TA=100°C 5.5 A
TA=25°C 1.25 PD Maximum Power Dissipation
TA=100°C 0.25 W
RθJA Thermal Resistance-Junction to Ambient 100 °C/W Note: * Current limited by bond wire.
Copyright ANPEC Electronics Corp.Rev. B.2 - Jun., 2006
www.anpec.com.tw3
APM2506NUB
Electrical Characteristics (TA = 25°C unless otherwise noted)
Notes:a : Pulse test ; pulse width ≤300µs, duty cycle ≤ 2%.b : Guaranteed by design, not subject to production testing.
APM2506NUB Symbol Parameter Test Condition
Min. Typ. Max. Unit
Drain-Source Avalanche Ratings EAS Drain-Source Avalanche Energy ID=20A, L=0.5mH 100 mJ
Static Characteristics BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 25 V
IDSS Zero Gate Voltage Drain Current VDS=20V, VGS=0V 1 µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1.3 1.8 2.5 V
IGSS Gate Leakage Current VGS=±20V, VDS=0V ±100 nA
VGS=10V, IDS=40A 4.8 6 RDS(ON)
a Drain-Source On-state Resistance VGS=4.5V, IDS=20A 7 9
mΩ
Diode Characteristics VSD
a Diode Forward Voltage ISD=20A, VGS=0V 0.7 1.1 V
trrb Reverse Recovery Time 30 ns
Qrrb Reverse Recovery Charge
ISD=10A, dISD/dt =100A/µs 14 nC
Dynamic Characteristics b RG Gate Resistance VGS=0V,VDS=0V,F=1MHz 1.0 2.1 Ω
Ciss Input Capacitance 3100
Coss Output Capacitance 680
Crss Reverse Transfer Capacitance
VGS=0V, VDS=15V, Frequency=1.0MHz 520
pF
td(ON) Turn-on Delay Time 19
Tr Turn-on Rise Time 20
td(OFF) Turn-off Delay Time 62
Tf Turn-off Fall Time
VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω
43
ns
Gate Charge Characteristics b Qg Total Gate Charge 37.5 56
Qgs Gate-Source Charge 9.4
Qgd Gate-Drain Charge
VDS=15V, VGS=4.5V, IDS=40A
21
nC
Copyright ANPEC Electronics Corp.Rev. B.2 - Jun., 2006
www.anpec.com.tw4
APM2506NUB
1E-4 1E-3 0.01 0.1 1 10 1001E-3
0.01
0.1
1
2
Mounted on minimum padR
θJA :100oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
Typical Characteristics
Power Dissipation
Pto
t - P
ower
(W)
Tj - Junction Temperature (°C)
ID -
Dra
in C
urre
nt (A
)
Drain Current
Tj - Junction Temperature (°C)
Safe Operation Area
VDS - Drain - Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Thermal Transient Impedance
Square Wave Pulse Duration (sec)
0 20 40 60 80 100 120 140 160 1800
10
20
30
40
50
60
TC=25oC
0.1 1 10 700.1
1
10
100
300
Rds(on
) Lim
it
1s
TC=25oC
10ms
100ms
DC
1ms
Nor
mal
ized
Tra
nsie
nt T
herm
al R
esis
tanc
e
0 20 40 60 80 100 120 140 160 1800
10
20
30
40
50
60
70
TC=25oC, V
G=10V
Copyright ANPEC Electronics Corp.Rev. B.2 - Jun., 2006
www.anpec.com.tw5
APM2506NUB
VDS - Drain-Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Output Characteristics
RD
S(O
N) - O
n - R
esis
tanc
e (m
Ω)
Drain-Source On Resistance
ID - Drain Current (A)
VGS - Gate - Source Voltage (V) Tj - Junction Temperature (°C)
Gate Threshold Voltage
Nor
mal
ized
Thr
esho
ld V
lota
ge
Typical Characteristics (Cont.)
0.0 0.4 0.8 1.2 1.6 2.00
20
40
60
80
100
3V
2.5V
VGS
=3.5,4,5,6,7,8,9,10V
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
IDS
=250µA
Drain-Source On Resistance
RD
S(O
N) - O
n - R
esis
tanc
e (m
Ω)
0 20 40 60 80 1000
2
4
6
8
10
12
VGS
=4.5V
VGS
=10V
1 2 3 4 5 6 7 8 9 102
4
6
8
10
12
14
ID= 40A
Copyright ANPEC Electronics Corp.Rev. B.2 - Jun., 2006
www.anpec.com.tw6
APM2506NUB
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
Tj - Junction Temperature (°C) VSD - Source-Drain Voltage (V)
Source-Drain Diode Forward
IS -
Sou
rce
Cur
rent
(A)
VDS - Drain - Source Voltage (V)
C -
Cap
acita
nce
(pF)
Capacitance Gate Charge
QG - Gate Charge (nC)
VG
S -
Gat
e-so
urce
Vol
tage
(V)
Typical Characteristics (Cont.)
-50 -25 0 25 50 75 100 125 1500.00
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
RON
@Tj=25oC: 4.8mΩ
VGS
= 10V
IDS
= 40A
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
1
10
100
Tj=150oC
Tj=25oC
0 5 10 15 20 250
1000
2000
3000
4000
5000
Frequency=1MHz
CrssCoss
Ciss
0 10 20 30 40 50 600
1
2
3
4
5
6
7
8
9
10V
DS=15V
ID = 40A
Copyright ANPEC Electronics Corp.Rev. B.2 - Jun., 2006
www.anpec.com.tw7
APM2506NUB
Avalanche Test Circuit and Waveforms
Switching Time Test Circuit and Waveforms
td(on) tr td(off) t f
V GS
V DS
90%
10%
EAS
V DD
tAV
IAS
V DS
tpV DSX(SUS)
DUT
0.01Ωtp
V DD
V DSL
IL
RG
V DD
RD
DUT
V GS
V DS
RG
tp
Copyright ANPEC Electronics Corp.Rev. B.2 - Jun., 2006
www.anpec.com.tw8
APM2506NUB
TO-251
Millimeters Inches Dim Min. Max. Min. Max.
A 2.20 2.40 0.087 0.094 A1 1.02 1.27 0.040 0.050 b 0.50 0.88 0.020 0.035 b2 5.20 5.46 0.205 0.215 C 0.40 0.60 0.016 0.024 C1 0.40 0.60 0.016 0.024 D 5.40 6.20 0.213 0.244 D1 5.30 -- 0.209 -- E 6.35 6.70 0.250 0.264 E1 4.40 5.40 0.173 0.213 e1 4.50 4.70 0.177 0.185 H 12.90 15.25 0.508 0.600
b2
E
D
H
E1
D1
b
e1
CA1
E1
D1
A
C1
Packaging Information
Copyright ANPEC Electronics Corp.Rev. B.2 - Jun., 2006
www.anpec.com.tw9
APM2506NUB
Physical Specifications
t 25 C to Peak
tp
Ramp-up
tL
Ramp-down
tsPreheat
Tsmax
Tsmin
TL
TP
25
Te
mp
era
ture
Time
Critical ZoneTL to TP
°
Terminal Material Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn Lead Solderability Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition (IR/Convection or VPR Reflow)
Classification Reflow Profiles
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.
Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)
100°C 150°C
60-120 seconds
150°C 200°C
60-180 seconds
Time maintained above: - Temperature (TL) - Time (tL)
183°C 60-150 seconds
217°C 60-150 seconds
Peak/Classificatioon Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)
10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Notes: All temperatures refer to topside of the package .Measured on the body surface.
Copyright ANPEC Electronics Corp.Rev. B.2 - Jun., 2006
www.anpec.com.tw10
APM2506NUB
Test item Method DescriptionSOLDERABILITY MIL-STD-883D-2003 245°C,5 SECHOLT MIL-STD 883D-1005.7 1000 Hrs Bias @ 125°CPCT JESD-22-B, A102 168 Hrs, 100% RH, 121°CTST MIL-STD 883D-1011.9 -65°C ~ 150°C, 200 Cycles
Reliability Test Program
Table 2. Pb-free Process – Package Classification Reflow Temperatures Package Thickness Volume mm3
<350 Volume mm3
350-2000 Volume mm3
>2000 <1.6 mm 260 +0°C* 260 +0°C* 260 +0°C*
1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C* ≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C*
*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.
Table 1. SnPb Entectic Process – Package Peak Reflow Temperatures Package Thickness Volume mm3
<350 Volume mm3
≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C
Classification Reflow Profiles(Cont.)
Customer Service
Anpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :7F, No. 137, Lane 235, Pac Chiao Rd.,Hsin Tien City, Taipei Hsien, Taiwan, R. O. C.Tel : 886-2-89191368Fax : 886-2-89191369
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. B.1 - Jun., 2006
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.
APM2509NUB
Pin Description
Ordering and Marking Information
Features
Applications
• 25V/50A ,
RDS(ON)=7.5mΩ(typ.) @ VGS=10V RDS(ON)=13mΩ(typ.) @ VGS=4.5V
• Super High Dense Cell Design
• Avalanche Rated
• Reliable and Rugged
• Lead Free Available (RoHS Compliant)
• Power Management in Desktop Computer or
DC/DC Converters
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin platetermination finish; which are fully compliant with RoHS and compatible with both SnPb and lead-free soldieringoperations. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020Cfor MSL classification at lead-free peak reflow temperature.
°
Top View of TO-251
N-Channel MOSFET
G
S
D
1 2 3
SDG
APM2509N
Handling CodeTemp. RangePackage Code
Package Code UB : TO-251Operating Junction Temp. Range C : -55 to 150 CHandling Code PB : Plastic BagLead Free Code L : Lead Free Device Blank : Original Device
APM2509N UB : APM2509NXXXXX
XXXXX - Date Code
Lead Free Code
Copyright ANPEC Electronics Corp.Rev. B.1 - Jun., 2006
www.anpec.com.tw2
APM2509NUB
Absolute Maximum Ratings
Symbol Parameter Rating Unit
Common Ratings (TA=25°C Unless Otherwise Noted)
VDSS Drain-Source Voltage 25
VGSS Gate-Source Voltage ±20 V
TJ Maximum Junction Temperature 150 °C
TSTG Storage Temperature Range -55 to 150 °C IS Diode Continuous Forward Current TC=25°C 30 A
Mounted on Large Heat Sink TC=25°C 100
IDP 300µs Pulse Drain Current Tested TC=100°C 65
A
TC=25°C 50* ID Continuous Drain Current
TC=100°C 38 A
TC=25°C 50 PD Maximum Power Dissipation
TC=100°C 20 W
RθJC Thermal Resistance-Junction to Case 2.5 °C/W
Mounted on PCB of Minimum Footprint TA=25°C 100
IDP 300µs Pulse Drain Current Tested TA=100°C 65
A
TA=25°C 9.5 ID Continuous Drain Current
TA=100°C 4 A
TA=25°C 1.25 PD Maximum Power Dissipation
TA=100°C 0.25 W
RθJA Thermal Resistance-Junction to Ambient 100 °C/W Note: * Current limited by bond wire.
Copyright ANPEC Electronics Corp.Rev. B.1 - Jun., 2006
www.anpec.com.tw3
APM2509NUB
Electrical Characteristics (TA = 25°C unless otherwise noted)
APM2509NUB Symbol Parameter Test Condition
Min. Typ. Max. Unit
Drain-Source Avalanche Ratings
EAS Avalanche Energy, Single Pulsed ID=15A, L=0.5mH 50 mJ
Static Characteristics BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 25 V
VDS=20V, VGS=0V 1 IDSS Zero Gate Voltage Drain Current
TJ=85°C 30 µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1.3 1.8 2.5 V
IGSS Gate Leakage Current VGS=±20V, VDS=0V ±100 nA
VGS=10V, IDS=30A 7.5 9 RDS(ON)
a Drain-Source On-state Resistance VGS=4.5V, IDS=15A 13 18
mΩ
Diode Characteristics VSD
a Diode Forward Voltage ISD=10A, VGS=0V 0.9 1.1 V
trrb Reverse Recovery Time 17 ns
Qrrb Reverse Recovery Charge
ISD=10A, dISD/dt =100A/µs 6 nC
Dynamic Characteristics b RG Gate Resistance VGS=0V,VDS=0V,F=1MHz 1.8 Ω
Ciss Input Capacitance 1560
Coss Output Capacitance 345
Crss Reverse Transfer Capacitance
VGS=0V, VDS=15V, Frequency=1.0MHz 245
pF
td(ON) Turn-on Delay Time 17
Tr Turn-on Rise Time 18
td(OFF) Turn-off Delay Time 41
Tf Turn-off Fall Time
VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω
16
ns
Gate Charge Characteristics b Qg Total Gate Charge 17.5 26
Qgs Gate-Source Charge 5
Qgd Gate-Drain Charge
VDS=15V, VGS=4.5V, IDS=30A
11
nC
Notes: a : Pulse test ; pulse width≤300µs, duty cycle≤2%. b : Guaranteed by design, not subject to production testing.
Copyright ANPEC Electronics Corp.Rev. B.1 - Jun., 2006
www.anpec.com.tw4
APM2509NUB
1E-4 1E-3 0.01 0.1 1 10 1001E-3
0.01
0.1
1
2
Mounted on minimum padR
θJA :100oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
Typical Characteristics
Power Dissipation
Pto
t - P
ower
(W)
Tj - Junction Temperature (°C)
ID -
Dra
in C
urre
nt (A
)
Drain Current
Tj - Junction Temperature (°C)
Safe Operation Area
VDS - Drain - Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Nor
mal
ized
Tra
nsie
nt T
herm
al R
esis
tanc
e
Thermal Transient Impedance
Square Wave Pulse Duration (sec)
0 20 40 60 80 100 120 140 160 1800
10
20
30
40
50
60
TC=25oC
0.1 1 10 700.1
1
10
100
300
1s
10ms
100ms
DC
Rds(on
) Lim
it
Tc=25oC
0 20 40 60 80 100 120 140 160 1800
10
20
30
40
50
60
TC=25oC,V
G=10V
Copyright ANPEC Electronics Corp.Rev. B.1 - Jun., 2006
www.anpec.com.tw5
APM2509NUB
-50 -25 0 25 50 75 100 125 1500.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
IDS
=250µA
VDS - Drain-Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Output Characteristics
RD
S(O
N) - O
n - R
esis
tanc
e (m
Ω)
Drain-Source On Resistance
ID - Drain Current (A)
VGS - Gate - Source Voltage (V) Tj - Junction Temperature (°C)
Gate Threshold Voltage
Typical Characteristics (Cont.)
Nor
mal
ized
Thr
esho
ld V
olta
ge
0 20 40 60 80 1002
4
6
8
10
12
14
16
18
20
22
VGS
=10V
VGS
=4.5V
0.0 0.4 0.8 1.2 1.6 2.00
10
20
30
40
50
60
70
80
90
100
3.5V
3V
2.5V
VGS
=4,5,6,7,8,9,10V
Drain-Source On Resistance
RD
S(O
N) -
On
- Res
ista
nce
(mΩ
)
0 1 2 3 4 5 6 7 8 9 104
6
8
10
12
14
16
18
ID= 30A
Copyright ANPEC Electronics Corp.Rev. B.1 - Jun., 2006
www.anpec.com.tw6
APM2509NUB
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
Tj - Junction Temperature (°C) VSD - Source-Drain Voltage (V)
Source-Drain Diode Forward
IS -
Sou
rce
Cur
rent
(A)
VDS - Drain - Source Voltage (V)
C -
Cap
acita
nce
(pF)
Capacitance Gate Charge
QG - Gate Charge (nC)
VG
S -
Gat
e-so
urce
Vol
tage
(V)
Typical Characteristics (Cont.)
-50 -25 0 25 50 75 100 125 1500.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
VGS
= 10V
IDS
= 30A
RON
@Tj=25oC: 7.5mΩ
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.40.1
1
10
40
Tj=25oC
Tj=150oC
0 5 10 15 20 250
500
1000
1500
2000
2500
3000
Frequency=1MHz
Crss
Coss
Ciss
0 5 10 15 20 25 30 350
1
2
3
4
5
6
7
8
9
10V
DS=15V
ID = 30A
Copyright ANPEC Electronics Corp.Rev. B.1 - Jun., 2006
www.anpec.com.tw7
APM2509NUB
Avalanche Test Circuit and Waveforms
Switching Time Test Circuit and Waveforms
td(on) tr td(off) t f
V GS
V DS
90%
10%
EAS
V DD
tAV
IAS
V DS
tpV DSX(SUS)
DUT
0.01Ωtp
V DD
V DSL
IL
RG
V DD
RD
DUT
V GS
V DS
RG
tp
Copyright ANPEC Electronics Corp.Rev. B.1 - Jun., 2006
www.anpec.com.tw8
APM2509NUB
TO-251
Millimeters Inches Dim Min. Max. Min. Max.
A 2.20 2.40 0.087 0.094 A1 1.02 1.27 0.040 0.050 b 0.50 0.88 0.020 0.035 b2 5.20 5.46 0.205 0.215 C 0.40 0.60 0.016 0.024 C1 0.40 0.60 0.016 0.024 D 5.40 6.20 0.213 0.244 D1 5.30 -- 0.209 -- E 6.35 6.70 0.250 0.264 E1 4.40 5.40 0.173 0.213 e1 4.50 4.70 0.177 0.185 H 12.90 15.25 0.508 0.600
b2
E
D
H
E1
D1
b
e1
CA1
E1
D1
A
C1
Packaging Information
Copyright ANPEC Electronics Corp.Rev. B.1 - Jun., 2006
www.anpec.com.tw9
APM2509NUB
Physical Specifications
t 25 C to Peak
tp
Ramp-up
tL
Ramp-down
tsPreheat
Tsmax
Tsmin
TL
TP
25
Te
mp
era
ture
Time
Critical ZoneTL to TP
°
Terminal Material Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn Lead Solderability Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition (IR/Convection or VPR Reflow)
Classification Reflow Profiles
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.
Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)
100°C 150°C
60-120 seconds
150°C 200°C
60-180 seconds
Time maintained above: - Temperature (TL) - Time (tL)
183°C 60-150 seconds
217°C 60-150 seconds
Peak/Classificatioon Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)
10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Notes: All temperatures refer to topside of the package .Measured on the body surface.
Copyright ANPEC Electronics Corp.Rev. B.1 - Jun., 2006
www.anpec.com.tw10
APM2509NUB
Test item Method DescriptionSOLDERABILITY MIL-STD-883D-2003 245°C,5 SECHOLT MIL-STD 883D-1005.7 1000 Hrs Bias @ 125°CPCT JESD-22-B, A102 168 Hrs, 100% RH, 121°CTST MIL-STD 883D-1011.9 -65°C ~ 150°C, 200 Cycles
Reliability Test Program
Table 2. Pb-free Process – Package Classification Reflow Temperatures Package Thickness Volume mm3
<350 Volume mm3
350-2000 Volume mm3
>2000 <1.6 mm 260 +0°C* 260 +0°C* 260 +0°C*
1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C* ≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C*
*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.
Table 1. SnPb Entectic Process – Package Peak Reflow Temperatures Package Thickness Volume mm3
<350 Volume mm3
≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C
Classification Reflow Profiles(Cont.)
Customer Service
Anpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :7F, No. 137, Lane 235, Pac Chiao Rd.,Hsin Tien City, Taipei Hsien, Taiwan, R. O. C.Tel : 886-2-89191368Fax : 886-2-89191369
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. A.1 - Nov., 2006
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, andadvise customers to obtain the latest version of relevant information to verify before placing orders.
APM2506NF
Pin Description
Ordering and Marking Information
Features
Applications
• 25V/60A ,
RDS(ON)=4.2mΩ (typ.) @ VGS=10VRDS(ON)=6.5mΩ (typ.) @ VGS=4.5V
• Super High Dense Cell Design
• Avalanche Rated
• Reliable and Rugged
• Lead Free Available (RoHS Compliant)
N-Channel MOSFET
Note: ANPEC lead-free products contain molding compounds and 100% matte tin plate termination finish;which are fully compliant with RoHS and compatible with both SnPb and lead-free soldiering operations.ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C for MSLclassification at lead-free peak reflow temperature.
°
Top View of TO-220
• Power Management in Computer or Switching
Power Supply Systems
APM2506N
Handling Code
Temp. Range
Package Code
Package Code F : TO-220Operating Junction Temp. Range C : -55 to 150 CHandling Code TU : TubeLead Free Code L : Lead Free Device
APM2506N F : APM2506NXXXXX
XXXXX - Date Code
Lead Free Code
S
D
G
Copyright ANPEC Electronics Corp.Rev. A.1 - Nov., 2006
www.anpec.com.tw2
APM2506NF
Absolute Maximum Ratings
Symbol Parameter Rating Unit
Common Ratings (TA=25°C Unless Otherwise Noted)
VDSS Drain-Source Voltage 25
VGSS Gate-Source Voltage ±20 V
TJ Maximum Junction Temperature 150 °C
TSTG Storage Temperature Range -55 to 150 °C IS Diode Continuous Forward Current TC=25°C 30 A
Mounted on Large Heat Sink
TC=25°C 240 IDP 300µs Pulse Drain Current Tested
TC=100°C 220 A
TC=25°C 60* ID Continuous Drain Current
TC=100°C 55 A
TC=25°C 62.5 PD Maximum Power Dissipation
TC=100°C 25 W
RθJC Thermal Resistance-Junction to Case 2 °C/W
Mounted on PCB of Minimum Footprint
TA=25°C 60 IDP 300µs Pulse Drain Current Tested
TA=100°C 35 A
TA=25°C 15 ID Continuous Drain Current
TA=100°C 9 A
TA=25°C 2 PD Maximum Power Dissipation
TA=100°C 0.8 W
RθJA Thermal Resistance-Junction to Ambient 62.5 °C/W
Notes: * Current limited by bond wire.
Copyright ANPEC Electronics Corp.Rev. A.1 - Nov., 2006
www.anpec.com.tw3
APM2506NF
Electrical Characteristics (TA = 25°C unless otherwise noted)
APM2506NF Symbol Parameter Test Condition
Min. Typ. Max. Unit
Drain-Source Avalanche Ratings
EAS Avalanche Energy, Single Pulsed ID=15A, VDD=20V 50 mJ
Static Characteristics
BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 25 V
VDS=20V, VGS=0V 1 IDSS Zero Gate Voltage Drain Current
TJ=85°C 30 µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1.3 1.8 2.5 V
IGSS Gate Leakage Current VGS=±20V, VDS=0V ±100 nA
VGS=10V, IDS=40A 4.2 5.5 RDS(ON)
a Drain-Source On-state Resistance VGS=4.5V, IDS=20A 6.5 8.5
mΩ
Diode Characteristics
VSDa Diode Forward Voltage ISD=10A, VGS=0V 0.7 1.1 V
trr Reverse Recovery Time 30 ns
Qrr Reverse Recovery Charge IDS=10A, dlSD/dt=100A/µs
14 nC
Dynamic Characteristicsb
RG Gate Resistance VGS=0V,VDS=0V,F=1MHz 1.0 2.1 Ω
Ciss Input Capacitance 3100
Coss Output Capacitance 680
Crss Reverse Transfer Capacitance
VGS=0V, VDS=15V, Frequency=1.0MHz 520
pF
td(ON) Turn-on Delay Time 19
Tr Turn-on Rise Time 20
td(OFF) Turn-off Delay Time 62
Tf Turn-off Fall Time
VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω
43
ns
Gate Charge Characteristicsb
Qg Total Gate Charge 37.5 56
Qgs Gate-Source Charge 9.4
Qgd Gate-Drain Charge
VDS=15V, VGS=4.5V, IDS=40A
21
nC
Notes: a : Pulse test ; pulse width≤300µs, duty cycle≤2%. b : Guaranteed by design, not subject to production testing.
Copyright ANPEC Electronics Corp.Rev. A.1 - Nov., 2006
www.anpec.com.tw4
APM2506NF
Typical Characteristics
Power Dissipation
Pto
t - P
ower
(W)
Tj - Junction Temperature (°C)
ID -
Dra
in C
urre
nt (A
)
Drain Current
Tj - Junction Temperature (°C)
Safe Operation Area
VDS - Drain - Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Nor
mal
ized
Tra
nsie
nt T
herm
al R
esis
tanc
e
Thermal Transient Impedance
Square Wave Pulse Duration (sec)
1E-4 1E-3 0.01 0.1 1 10 1001E-3
0.01
0.1
1
2
Mounted on 1in2 padR
θJA :62.5oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
0 20 40 60 80 100 120 140 160 1800
10
20
30
40
50
60
70
TC=25oC
0 20 40 60 80 100 120 140 160 1800
10
20
30
40
50
60
70
TC=25oC,V
G=10V
0.01 0.1 1 10 1001
10
100
500
Rds(
on) L
imit
1s
TC=25oC
10ms
100ms
DC
Copyright ANPEC Electronics Corp.Rev. A.1 - Nov., 2006
www.anpec.com.tw5
APM2506NF
VDS - Drain-Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Output Characteristics
RD
S(O
N) - O
n - R
esis
tanc
e (m
Ω)
Drain-Source On Resistance
ID - Drain Current (A)
Gate-Source On Resistance
VGS - Gate - Source Voltage (V)
RD
S(O
N) -
On
- Res
ista
nce
(mΩ
)
Tj - Junction Temperature (°C)
Gate Threshold Voltage
Typical Characteristics (Cont.)
Nor
mal
ized
Thr
esho
ld V
olta
ge
1 2 3 4 5 6 7 8 9 102
4
6
8
10
12
14
ID= 40A
-50 -25 0 25 50 75 100 125 1500.0
0.3
0.6
0.9
1.2
1.5
1.8
IDS
=250µA
0.0 0.4 0.8 1.2 1.6 2.00
10
20
30
40
50
60
3V
2.5V
VGS
=3.5,4,5,6,7,8,9,10V
0 10 20 30 40 50 601
2
3
4
5
6
7
8
9
10
VGS
=4.5V
VGS
=10V
Copyright ANPEC Electronics Corp.Rev. A.1 - Nov., 2006
www.anpec.com.tw6
APM2506NF
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
Tj - Junction Temperature (°C) VSD - Source-Drain Voltage (V)
Source-Drain Diode Forward
IS -
Sou
rce
Cur
rent
(A)
VDS - Drain - Source Voltage (V)
C -
Cap
acita
nce
(pF)
Capacitance Gate Charge
QG - Gate Charge (nC)
VG
S -
Gat
e-so
urce
Vol
tage
(V)
Typical Characteristics (Cont.)
-50 -25 0 25 50 75 100 125 1500.00
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
RON
@Tj=25oC: 4.2mΩ
VGS
= 10V
IDS
= 40A
0 5 10 15 20 250
1000
2000
3000
4000
5000
Frequency=1MHz
CrssCoss
Ciss
0 10 20 30 40 50 600
1
2
3
4
5
6
7
8
9
10V
DS=15V
ID = 40A
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.60.2
1
10
60
Tj=150oC
Tj=25oC
Copyright ANPEC Electronics Corp.Rev. A.1 - Nov., 2006
www.anpec.com.tw7
APM2506NF
Avalanche Test Circuit and Waveforms
Switching Time Test Circuit and Waveforms
DUT
0.01Ωtp
VDD
VDSL
IL
RG
EAS
VDD
tAV
IAS
VDS
tp VDSX(SUS)
VDD
RD
DUT
VGS
VDS
RG
tp
td(on) tr td(off) tf
VGS
VDS90%
10%
Copyright ANPEC Electronics Corp.Rev. A.1 - Nov., 2006
www.anpec.com.tw8
APM2506NF
Package Information
TO-220
Millimeters Inches Dim Min. Max. Min. Max.
A 3.56 4.83 0.140 0.190 A1 0.51 1.40 0.020 0.055 A2 2.03 2.92 0.080 0.115 b 0.38 1.02 0.015 0.040
b2 1.14 1.78 0.045 0.070 c 0.36 0.61 0.014 0.024 D 14.22 16.51 0.560 0.650
D1 8.38 9.02 0.330 0.355 D2 12.19 12.88 0.480 0.507 E 9.65 10.67 0.380 0.420
E1 6.86 8.89 0.270 0.350 E2 - 0.76 - 0.030 e 2.54 BSC 0.100 BSC
H1 5.84 6.86 0.230 0.270 L 12.70 14.73 0.500 0.580
L1 - 6.35 - 0.250 P 3.53 4.09 0.139 0.161 Q 2.54 3.43 0.100 0.135
A2
L
L1
e
P
Q
D
H1
A
A1
c
D1
E1
D2
b
b2
E/2
E
E2
Copyright ANPEC Electronics Corp.Rev. A.1 - Nov., 2006
www.anpec.com.tw9
APM2506NF
Terminal Material Solder-Plated Copper (Solder Material : Sn) Lead Solderability Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Physical Specifications
Reliability test program
Test item Method Description
SOLDERABILITY MIL-STD-883D-2003 245°C,5 SEC
HOLT MIL-STD 883D-1005.7 1000 Hrs Bias @125°C
PCT JESD-22-B, A102 168 Hrs, 100% RH, 121°C
TST MIL-STD 883D-1011.9 -65°C ~ 150°C, 200 Cycles
Customer Service
Anpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :7F, No. 137, Lane 235, Pac Chiao Rd.,Hsin Tien City, Taipei Hsien, Taiwan, R. O. C.Tel : 886-2-89191368Fax : 886-2-89191369
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. A.1 - Aug., 2006
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, andadvise customers to obtain the latest version of relevant information to verify before placing orders.
APM2509NF
APM2509N
Handling Code
Temp. Range
Package Code
Package Code F : TO-220Operating Junction Temp. Range C : -55 to 150 CHandling Code TU : TubeLead Free Code L : Lead Free Device
APM2509N F : APM2509NXXXXX
XXXXX - Date Code
Lead Free Code
Pin Description
Ordering and Marking Information
Features
Applications
• 25V/50A ,
RDS(ON)=7.5mΩ (typ.) @ VGS=10VRDS(ON)=13mΩ (typ.) @ VGS=4.5V
• Super High Dense Cell Design
• Avalanche Rated
• Reliable and Rugged
• Lead Free Available (RoHS Compliant)
N-Channel MOSFET
Note: ANPEC lead-free products contain molding compounds and 100% matte tin plate termination finish;which are fully compliant with RoHS and compatible with both SnPb and lead-free soldiering operations.ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C for MSLclassification at lead-free peak reflow temperature.
°
Top View of TO-220
S
D
G
• Power Management in Computer or SPS
Systems
Copyright ANPEC Electronics Corp.Rev. A.1 - Aug., 2006
www.anpec.com.tw2
APM2509NF
Absolute Maximum Ratings
Symbol Parameter Rating Unit
Common Ratings (TA=25°C Unless Otherwise Noted)
VDSS Drain-Source Voltage 25
VGSS Gate-Source Voltage ±20 V
TJ Maximum Junction Temperature 150 °C
TSTG Storage Temperature Range -55 to 150 °C IS Diode Continuous Forward Current TC=25°C 30 A
Mounted on Large Heat Sink TC=25°C 200
IDP 300µs Pulse Drain Current Tested TC=100°C 170
A
TC=25°C 50* ID Continuous Drain Current
TC=100°C 43 A
TC=25°C 62.5 PD Maximum Power Dissipation
TC=100°C 25 W
RθJC Thermal Resistance-Junction to Case 2 °C/W
Mounted on PCB of Minimum Footprint TA=25°C 48
IDP 300µs Pulse Drain Current Tested TA=100°C 30
A
TA=25°C 12 ID Continuous Drain Current
TA=100°C 7.5 A
TA=25°C 2 PD Maximum Power Dissipation
TA=100°C 0.8 W
RθJA Thermal Resistance-Junction to Ambient 62.5 °C/W Notes:
* Current limited by bond wire.
Copyright ANPEC Electronics Corp.Rev. A.1 - Aug., 2006
www.anpec.com.tw3
APM2509NF
Electrical Characteristics (TA = 25°C unless otherwise noted)
APM2509NF Symbol Parameter Test Condition
Min. Typ. Max. Unit
Drain-Source Avalanche Ratings EAS Avalanche Energy, Single Pulsed ID=15A, VDD=20V 50 mJ
Static Characteristics BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 25 V
VDS=20V, VGS=0V 1 IDSS Zero Gate Voltage Drain Current
TJ=85°C 30 µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1.3 1.8 2.5 V
IGSS Gate Leakage Current VGS=±20V, VDS=0V ±100 nA
VGS=10V, IDS=30A 7.5 9 RDS(ON)
a Drain-Source On-state Resistance VGS=4.5V, IDS=15A 13 18
mΩ
Diode Characteristics VSD
a Diode Forward Voltage ISD=10A, VGS=0V 0.9 1.1 V
trr Reverse Recovery Time 17 ns
Qrr Reverse Recovery Charge IDS=10A, dlSD/dt=100A/µs
6 nC
Dynamic Characteristics b
RG Gate Resistance VGS=0V,VDS=0V,F=1MHz 1.8 Ω
Ciss Input Capacitance 1560
Coss Output Capacitance 345
Crss Reverse Transfer Capacitance
VGS=0V, VDS=15V, Frequency=1.0MHz 245
pF
td(ON) Turn-on Delay Time 17
Tr Turn-on Rise Time 18
td(OFF) Turn-off Delay Time 41
Tf Turn-off Fall Time
VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω
16
ns
Gate Charge Characteristics b Qg Total Gate Charge 17.5 26
Qgs Gate-Source Charge 5
Qgd Gate-Drain Charge
VDS=15V, VGS=4.5V, IDS=30A
11
nC
Notes: a : Pulse test ; pulse width≤300µs, duty cycle≤2%. b : Guaranteed by design, not subject to production testing.
Copyright ANPEC Electronics Corp.Rev. A.1 - Aug., 2006
www.anpec.com.tw4
APM2509NF
Typical Characteristics
Power Dissipation
Pto
t - P
ower
(W)
Tj - Junction Temperature (°C)
ID -
Dra
in C
urre
nt (A
)
Drain Current
Tj - Junction Temperature (°C)
Safe Operation Area
VDS - Drain - Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Nor
mal
ized
Tra
nsie
nt T
herm
al R
esis
tanc
e
Thermal Transient Impedance
Square Wave Pulse Duration (sec)
0 20 40 60 80 100 120 140 160 1800
10
20
30
40
50
60
70
TC=25oC
0.1 1 10 701
10
100
400
1ms
1s
10ms
100ms
DC
Rds(o
n) L
imit
Tc=25oC
1E-4 1E-3 0.01 0.1 1 10 1001E-3
0.01
0.1
1
2
Mounted on minimum padR
θJA :62.5oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
0 20 40 60 80 100 120 140 160 1800
10
20
30
40
50
60
TC=25oC,V
G=10V
Copyright ANPEC Electronics Corp.Rev. A.1 - Aug., 2006
www.anpec.com.tw5
APM2509NF
VDS - Drain-Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Output Characteristics
RD
S(O
N) - O
n - R
esis
tanc
e (m
Ω)
Drain-Source On Resistance
ID - Drain Current (A)
Gate-Source On Resistance
VGS - Gate - Source Voltage (V)
RD
S(O
N) -
On
- Res
ista
nce
(mΩ
)
Tj - Junction Temperature (°C)
Gate Threshold Voltage
Typical Characteristics (Cont.)
Nor
mal
ized
Thr
esho
ld V
olta
ge
0.0 0.5 1.0 1.5 2.0 2.5 3.00
10
20
30
40
50
60
70
80
90
100
3.5V
5V
4V
4.5V
2.5V
3V
VGS
=6,7,8,9,10V
0 20 40 60 80 1000
2
4
6
8
10
12
14
16
18
20
VGS
=10V
VGS
=4.5V
1 2 3 4 5 6 7 8 9 100
5
10
15
20
25
30
ID=30A
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
IDS
=250µA
Copyright ANPEC Electronics Corp.Rev. A.1 - Aug., 2006
www.anpec.com.tw6
APM2509NF
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
Tj - Junction Temperature (°C) VSD - Source-Drain Voltage (V)
Source-Drain Diode Forward
IS -
Sou
rce
Cur
rent
(A)
VDS - Drain - Source Voltage (V)
C -
Cap
acita
nce
(pF)
Capacitance Gate Charge
QG - Gate Charge (nC)
VG
S -
Gat
e-so
urce
Vol
tage
(V)
Typical Characteristics (Cont.)
0.0 0.4 0.8 1.2 1.6 2.00.1
1
10
100
Tj=150oC
Tj=25oC
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
RON
@Tj=25oC: 7.5mΩ
VGS
= 10V
IDS
= 30A
0 5 10 15 20 250
300
600
900
1200
1500
1800
2100
2400
2700
Frequency=1MHz
CrssCoss
Ciss
0 5 10 15 20 25 30 350
1
2
3
4
5
6
7
8
9
10V
DS=15V
ID = 30A
Copyright ANPEC Electronics Corp.Rev. A.1 - Aug., 2006
www.anpec.com.tw7
APM2509NF
Avalanche Test Circuit and Waveforms
Switching Time Test Circuit and Waveforms
DUT
0.01Ωtp
VDD
VDSL
IL
RG
EAS
VDD
tAV
IAS
VDS
tp VDSX(SUS)
VDD
RD
DUT
VGS
VDS
RG
tp
td(on) tr td(off) tf
VGS
VDS90%
10%
Copyright ANPEC Electronics Corp.Rev. A.1 - Aug., 2006
www.anpec.com.tw8
APM2509NF
Package Information
TO-220
Millimeters Inches Dim Min. Max. Min. Max.
A 3.56 4.83 0.140 0.190 A1 0.51 1.40 0.020 0.055 A2 2.03 2.92 0.080 0.115 b 0.38 1.02 0.015 0.040
b2 1.14 1.78 0.045 0.070 c 0.36 0.61 0.014 0.024 D 14.22 16.51 0.560 0.650
D1 8.38 9.02 0.330 0.355 D2 12.19 12.88 0.480 0.507 E 9.65 10.67 0.380 0.420
E1 6.86 8.89 0.270 0.350 E2 - 0.76 - 0.030 e 2.54 BSC 0.100 BSC
H1 5.84 6.86 0.230 0.270 L 12.70 14.73 0.500 0.580
L1 - 6.35 - 0.250 P 3.53 4.09 0.139 0.161 Q 2.54 3.43 0.100 0.135
A2
L
L1
e
P
Q
D
H1
A
A1
c
D1
E1
D2
b
b2
E/2
E
E2
Copyright ANPEC Electronics Corp.Rev. A.1 - Aug., 2006
www.anpec.com.tw9
APM2509NF
Terminal Material Solder-Plated Copper (Solder Material : Sn) Lead Solderability Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Physical Specifications
Reliability test program
Test item Method Description
SOLDERABILITY MIL-STD-883D-2003 245°C,5 SEC
HOLT MIL-STD 883D-1005.7 1000 Hrs Bias @125°C
PCT JESD-22-B, A102 168 Hrs, 100% RH, 121°C
TST MIL-STD 883D-1011.9 -65°C ~ 150°C, 200 Cycles
Customer Service
Anpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :7F, No. 137, Lane 235, Pac Chiao Rd.,Hsin Tien City, Taipei Hsien, Taiwan, R. O. C.Tel : 886-2-89191368Fax : 886-2-89191369
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. A.1 - Sept., 2007
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, andadvise customers to obtain the latest version of relevant information to verify before placing orders.
APM7512NF
Pin Description
Ordering and Marking Information
Features
Applications
• 75V/80A ,
RDS(ON)= 9.1mΩ (typ.) @ VGS= 10V
• Avalanche Rated
• Reliable and Rugged
• Lead Free Available (RoHS Compliant)
N-Channel MOSFET
Note: ANPEC lead-free products contain molding compounds and 100% matte tin plate termination finish;which are fully compliant with RoHS and compatible with both SnPb and lead-free soldering operations. ANPEClead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C for MSL classifica-tion at lead-free peak reflow temperature.
Top View of TO-220
S
D
G• Power Management for Inverter Systems
APM7512N
Handling Code
Temp. RangePackageCode
Package Code F : TO-220Operating Junction Temp. Range C : -55 to 175 CHandling Code PB : Plastic BagLead Free Code L : Lead Free Device
APM7512N F : APM7512NXXXXX
XXXXX - Date Code
Lead FreeCode °
Copyright ANPEC Electronics Corp.Rev. A.1 - Sept., 2007
www.anpec.com.tw2
APM7512NF
Absolute Maximum Ratings
Symbol Parameter Rating Unit
Common Ratings (TA=25°C Unless Otherwise Noted) VDSS Drain-Source Voltage 75
VGSS Gate-Source Voltage ±25 V
TJ Maximum Junction Temperature 175 °C
TSTG Storage Temperature Range -55 to 175 °C IS Diode Continuous Forward Current TC=25°C 40 A
Mounted on Large Heat Sink IDP 300µs Pulse Drain Current Tested TC=25°C 300* A
TC=25°C 80 ID Continuous Drain Current
TC=100°C 75 A
TC=25°C 273 PD Maximum Power Dissipation
TC=100°C 136 W
RθJC Thermal Resistance-Junction to Case 0.55 °C/W
Drain-Source Avalanche Ratings
EAS Avalanche Energy, Single Pulsed L=2mH 1 J
Notes: * Pulse width limited by safe operating area.
Copyright ANPEC Electronics Corp.Rev. A.1 - Sept., 2007
www.anpec.com.tw3
APM7512NF
Electrical Characteristics (TA = 25°C unless otherwise noted)
APM7512NF Symbol Parameter Test Condition
Min. Typ. Max. Unit
Static Characteristics BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 75 V
VDS=60V, VGS=0V 1 IDSS Zero Gate Voltage Drain Current
TJ=85°C 30 µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 2.5 3.5 4.5 V
IGSS Gate Leakage Current VGS=±25V, VDS=0V ±100 nA
RDS(ON) a Drain-Source On-state Resistance VGS=10V, IDS=40A 9.1 12 mΩ
Diode Characteristics VSD
a Diode Forward Voltage ISD=20A, VGS=0V 0.8 1.3 V
trr Reverse Recovery Time 66 ns
Qrr Reverse Recovery Charge IDS=40A, dlSD/dt=100A/µs
177 nC
Dynamic Characteristics b RG Gate Resistance VGS=0V,VDS=0V,F=1MHz 1.5 Ω
Ciss Input Capacitance 4240
Coss Output Capacitance 520
Crss Reverse Transfer Capacitance
VGS=0V, VDS=30V, Frequency=1.0MHz 210
pF
td(ON) Turn-on Delay Time 22 41
Tr Turn-on Rise Time 14 27
td(OFF) Turn-off Delay Time 69 125
Tf Turn-off Fall Time
VDD=35V, RL=35Ω, IDS=1A, VGEN=10V, RG=6Ω
40 73
ns
Gate Charge Characteristics b Qg Total Gate Charge 73 102
Qgs Gate-Source Charge 17
Qgd Gate-Drain Charge
VDS=30V, VGS=10V, IDS=40A
25
nC
Notes: a : Pulse test ; pulse width≤300µs, duty cycle≤2%. b : Guaranteed by design, not subject to production testing.
Copyright ANPEC Electronics Corp.Rev. A.1 - Sept., 2007
www.anpec.com.tw4
APM7512NF
1E-4 1E-3 0.01 0.1 1 10 1001E-3
0.01
0.1
1
2
Mounted on minimum padR
θJC :0.55oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
Typical Characteristics
Power Dissipation
Pto
t - P
ower
(W)
Tj - Junction Temperature (°C)
ID -
Dra
in C
urre
nt (A
)
Drain Current
Tj - Junction Temperature (°C)
Safe Operation Area
VDS - Drain - Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Nor
mal
ized
Tra
nsie
nt T
herm
al R
esis
tanc
e
Thermal Transient Impedance
Square Wave Pulse Duration (sec)
0 20 40 60 80 100 120 140 160 180 2000
50
100
150
200
250
300
TC=25oC
0.01 0.1 1 10 100 3000.1
1
10
100
500
1s
Rds(o
n) Li
mit
TC=25oC
10ms
100ms
DC
0 20 40 60 80 100 120 140 160 180 2000
20
40
60
80
100
TC=25oC,V
G=10V
Copyright ANPEC Electronics Corp.Rev. A.1 - Sept., 2007
www.anpec.com.tw5
APM7512NF
VDS - Drain-Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Output Characteristics
RD
S(O
N) - O
n - R
esis
tanc
e (m
Ω)
Drain-Source On Resistance
ID - Drain Current (A)
Drain-Source On Resistance
VGS - Gate - Source Voltage (V)
RD
S(O
N) -
On
- Res
ista
nce
(mΩ
)
Typical Characteristics (Cont.)
4 5 6 7 8 9 106
8
10
12
14
16
18
20
22
ID=40A
0.0 0.5 1.0 1.5 2.0 2.5 3.00
20
40
60
80
100
120
140
160
180
2009V
8V
7V
5V
6V
VGS
= 10V
0 20 40 60 80 1006
7
8
9
10
11
12
13
VGS
=10V
Tj - Junction Temperature (°C)
Gate Threshold Voltage
Nor
mal
ized
Thr
esho
ld V
olta
ge
-50 -25 0 25 50 75 100 125 150 1750.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
IDS
=250µA
Copyright ANPEC Electronics Corp.Rev. A.1 - Sept., 2007
www.anpec.com.tw6
APM7512NF
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.60.6
1
10
100
200
Tj=175oC
Tj=25oC
-50 -25 0 25 50 75 100 125 150 1750.00
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
2.25
2.50
RON
@Tj=25oC: 9.1mΩ
VGS
= 10V
IDS
= 40A
VSD - Source-Drain Voltage (V)
Source-Drain Diode Forward
IS -
Sou
rce
Cur
rent
(A)
VDS - Drain - Source Voltage (V)
C -
Cap
acita
nce
(pF)
Capacitance Gate Charge
QG - Gate Charge (nC)
VG
S -
Gat
e-so
urce
Vol
tage
(V)
Typical Characteristics (Cont.)
0 5 10 15 20 25 30 35 400
1000
2000
3000
4000
5000
6000
7000
Frequency=1MHz
Crss Coss
Ciss
0 10 20 30 40 50 60 70 800
1
2
3
4
5
6
7
8
9
10V
DS= 30V
ID= 40A
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
Tj - Junction Temperature (°C)
Copyright ANPEC Electronics Corp.Rev. A.1 - Sept., 2007
www.anpec.com.tw7
APM7512NF
Avalanche Test Circuit and Waveforms
Switching Time Test Circuit and Waveforms
DUT
0.01Ωtp
VDD
VDSL
IL
RG
EAS
VDD
tAV
IAS
VDS
tp VDSX(SUS)
VDD
RD
DUT
VGS
VDS
RG
tp
td(on) tr td(off) tf
VGS
VDS90%
10%
Copyright ANPEC Electronics Corp.Rev. A.1 - Sept., 2007
www.anpec.com.tw8
APM7512NF
Package Information
TO-220
A2
L
L1
e
P
Q
D
H1
A
A1
c
D1
E1
D2
b
b2
E/2
E
E2
SYMBOL MIN. MAX.
4.83
0.51
1.14 1.780.36 0.61
14.22 16.51
1.40
12.19
A
A1
b2
cD
D1
D2E
MILLIMETERS
b 0.38 1.02
2.54 BSC
TO-220
9.65 10.67
6.86
0.100 BSC
MIN. MAX.
INCHES
0.190
0.020
0.015 0.040
0.045 0.070
0.014 0.024
0.560 0.650
0.480
0.380 0.420
0.270
3.56 0.140
0.055
E1
0.355
0.250
0.580
P
LL1
e
12.70
8.38 9.02
6.35
14.73 0.500
0.330
Q
H1 5.84 6.86 0.230 0.270
4.09 0.161
2.03A2 2.92 0.080 0.115
E2 0.76 0.030
12.88 0.507
0.3508.89
3.53 0.139
2.54 3.43 0.100 0.135
Copyright ANPEC Electronics Corp.Rev. A.1 - Sept., 2007
www.anpec.com.tw9
APM7512NF
Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles
Reliability Test Program
Customer Service
Anpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838Fax : 886-2-2917-3838
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. B.3 - Nov., 2009
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.
APM4412K
Features
Applications
• Power Management in Notebook Computer,
Portable Equipment and Battery Powered Systems
Pin Description
Ordering and Marking Information
N-Channel MOSFET
• 30V/12A,
RDS(ON) = 9mΩ (typ.) @ VGS = 10V RDS(ON) =12mΩ (typ.) @ VGS = 4.5V
• Super High Dense Cell Design
• Reliable and Rugged
• SOP-8 Package
• Lead Free and Green Devices Available (RoHS Compliant)
Top View of SOP−8
SS
SG
DD
DD
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).
APM4412
Handling CodeTemperature RangePackage Code
Package Code K : SOP-8Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material G : Halogen and Lead Free Device
APM4412 K : APM4412XXXXX XXXXX - Date Code
Assembly Material
G
S
D DDD
SS
Copyright ANPEC Electronics Corp.Rev. B.3 - Nov., 2009
www.anpec.com.tw2
APM4412K
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)
Electrical Characteristics (TA = 25°C unless otherwise noted)
Symbol Parameter Rating Unit
VDSS Drain-Source Voltage 30
VGSS Gate-Source Voltage ±20 V
TA=25°C 12 ID
a Continuous Drain Current (VGS=10V) TA=70°C 9
IDMa 300µs Pulsed Drain Current (VGS=10V) 45
A
ISa Diode Continuous Forward Current 2
IARb Avalanche Current 16.5
A
EARb Repetitive Avalanche Energy (L=0.3mH) 40 mJ
TJ Maximum Junction Temperature 150
TSTG Storage Temperature Range -55 to 150 °C
TA=25°C 2.5 PD* Maximum Power Dissipation
TA=70°C 1.6 W
RθJAa,c Thermal Resistance-Junction to Ambient T≤10s 50
RθJL Thermal Resistance-Junction to Lead Steady State 25 °C/W
Note a:Surface Mounted on 1in2 pad area, t ≤ 10sec. Note b:UIS tested and pulse width limited by maximum junction temperature 150oC (initial temperature TJ=25oC). Note c:Maximum under Steady State conditions is 75°C/W.
APM4412K Symbol Parameter Test Conditions
Min. Typ. Max. Unit
Static Characteristics
BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 30 - - V
VDS=24V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current
TJ=85°C - - 30 µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1.3 1.7 2.5 V
IGSS Gate Leakage Current VGS=±20V, VDS=0V - - ±100 nA
VGS=10V, IDS=12A - 9 12 RDS(ON)
d Drain-Source On-state Resistance VGS=4.5V, IDS=8A - 12 16
mΩ
VSD d Diode Forward Voltage ISD=2.3A, VGS=0V - 0.75 1.3 V
Gate Charge Characteristics e
Qg Total Gate Charge - 24.5 32
Qgs Gate-Source Charge - 4 -
Qgd Gate-Drain Charge
VDS=15V, VGS=10V, IDS=12A
- 8 -
nC
Copyright ANPEC Electronics Corp.Rev. B.3 - Nov., 2009
www.anpec.com.tw3
APM4412K
Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)
APM4412K Symbol Parameter Test Conditions
Min. Typ. Max. Unit
Dynamic Characteristics e
RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 2.3 - Ω
Ciss Input Capacitance - 1470 -
Coss Output Capacitance - 233 -
Crss Reverse Transfer Capacitance
VGS=0V, VDS=25V, Frequency=1.0MHz - 157 -
pF
td(ON) Turn-on Delay Time - 13 24
Tr Turn-on Rise Time - 9 17
td(OFF) Turn-off Delay Time - 36 66
Tf Turn-off Fall Time
VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω
- 12 23
ns
trr Reverse Recovery Time - 14 - ns
Qrr Reverse Recovery Charge ISD=12A, dISD/dt =100A/µs
- 5 - nC
Note d : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note e : Guaranteed by design, not subject to production testing.
Copyright ANPEC Electronics Corp.Rev. B.3 - Nov., 2009
www.anpec.com.tw4
APM4412K
Typical Operating Characteristics
ID -
Dra
in C
urre
nt (A
)
Drain Current
Tj - Junction Temperature (°C)
Safe Operation Area
VDS - Drain - Source Voltage (V)
Nor
mal
ized
Tra
nsie
nt T
herm
al R
esis
tanc
e
Thermal Transient Impedance
Square Wave Pulse Duration (sec)
Power Dissipation
Pto
t - P
ower
(W)
Tj - Junction Temperature (°C)
ID -
Dra
in C
urre
nt (A
)
0 20 40 60 80 100 120 140 1600
2
4
6
8
10
12
14
TA=25oC,V
G=10V
1E-4 1E-3 0.01 0.1 1 10 301E-3
0.01
0.1
1
2
Mounted on 1in2 padR
θJA : 50 oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
0 20 40 60 80 100 120 140 1600.0
0.5
1.0
1.5
2.0
2.5
3.0
TA=25oC
0.01 0.1 1 10 1000.01
0.1
1
10
100
300usRds(on
) Lim
it
1s
TA=25oC
10ms
1ms
100ms
DC
Copyright ANPEC Electronics Corp.Rev. B.3 - Nov., 2009
www.anpec.com.tw5
APM4412K
RD
S(O
N) - O
n - R
esis
tanc
e (m
Ω)
Drain-Source On Resistance
ID - Drain Current (A)
Tj - Junction Temperature (°C)
Gate Threshold Voltage
VDS - Drain-Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Output Characteristics
Transfer Characteristics
VGS - Gate - Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Nor
mal
ized
Thr
esho
ld V
olta
ge
Typical Operating Characteristics (Cont.)
0.0 0.5 1.0 1.5 2.0 2.5 3.00
5
10
15
20
25
30
35
40
45
3.5V
3V
VGS
= 4,5,6,7,8,9,10V
0 9 18 27 36 452
4
6
8
10
12
14
16
18
20
VGS
=10V
VGS
=4.5V
0 1 2 3 4 5 60
5
10
15
20
25
30
35
40
45
Tj=125oC
Tj=25oC
Tj=-55oC
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
IDS
=250µA
Copyright ANPEC Electronics Corp.Rev. B.3 - Nov., 2009
www.anpec.com.tw6
APM4412K
VDS - Drain - Source Voltage (V)
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
Tj - Junction Temperature (°C)
C -
Cap
acita
nce
(pF)
VSD - Source - Drain Voltage (V)
Source-Drain Diode Forward
IS -
Sou
rce
Cur
rent
(A)
Capacitance Gate Charge
QG - Gate Charge (nC)
VG
S -
Gat
e - s
ourc
e V
olta
ge (V
)
Typical Operating Characteristics (Cont.)
-50 -25 0 25 50 75 100 125 1500.00
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
RON
@Tj=25oC: 9mΩ
VGS
= 10V
IDS
= 12A
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.40.5
1
10
50
Tj=150oC
Tj=25oC
0 5 10 15 20 250
1
2
3
4
5
6
7
8
9
10V
DS= 15V
ID = 12A
0 5 10 15 20 25 300
300
600
900
1200
1500
1800
2100
2400
Frequency=1MHz
CrssCoss
Ciss
Copyright ANPEC Electronics Corp.Rev. B.3 - Nov., 2009
www.anpec.com.tw7
APM4412K
SOP-8
Package Information
D
e
EE1
SEE VIEW A
cb
h X
45°
A
A1
A2
L
VIEW A0.
25
SEATING PLANEGAUGE PLANE
Note: 1. Follow JEDEC MS-012 AA. 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension “E” does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side.
SYMBOL MIN. MAX.
1.75
0.10
0.17 0.25
0.25
A
A1
c
D
E
E1
e
h
L
MILLIMETERS
b 0.31 0.51
SOP-8
0.25 0.50
0.40 1.27
MIN. MAX.
INCHES
0.069
0.004
0.012 0.020
0.007 0.010
0.010 0.020
0.016 0.050
0
0.010
1.27 BSC 0.050 BSC
A2 1.25 0.049
0° 8 ° 0° 8 °
3.80
5.80
4.80
4.00
6.20
5.00 0.189 0.197
0.228 0.244
0.150 0.157
Copyright ANPEC Electronics Corp.Rev. B.3 - Nov., 2009
www.anpec.com.tw8
APM4412K
Application A H T1 C d D W E1 F
330.0±2.00 50 MIN. 12.4+2.00 -0.00
13.0+0.50 -0.20
1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.5±0.05
P0 P1 P2 D0 D1 T A0 B0 K0 SOP-8
4.0±0.10 8.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00
-0.40 6.40±0.20 5.20±0.20 2.10±0.20
(mm)
Carrier Tape & Reel Dimensions
H
T1
A
d
A
E1
AB
W
F
T
P0OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
Devices Per Unit
Package Type Unit Quantity
SOP-8 Tape & Reel 2500
Copyright ANPEC Electronics Corp.Rev. B.3 - Nov., 2009
www.anpec.com.tw9
APM4412K
Taping Direction InformationSOP-8
USER DIRECTION OF FEED
Classification Profile
Copyright ANPEC Electronics Corp.Rev. B.3 - Nov., 2009
www.anpec.com.tw10
APM4412K
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts)
100 °C 150 °C
60-120 seconds
150 °C 200 °C
60-120 seconds
Average ramp-up rate (Tsmax to TP) 3 °C/second max. 3°C/second max.
Liquidous temperature (TL) Time at liquidous (tL)
183 °C 60-150 seconds
217 °C 60-150 seconds
Peak package body Temperature (Tp)*
See Classification Temp in table 1 See Classification Temp in table 2
Time (tP)** within 5°C of the specified classification temperature (Tc)
20** seconds 30** seconds
Average ramp-down rate (Tp to Tsmax) 6 °C/second max. 6 °C/second max.
Time 25°C to peak temperature 6 minutes max. 8 minutes max.
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Classification Reflow Profiles
Table 2. Pb-free Process – Classification Temperatures (Tc)
Package Thickness
Volume mm3 <350
Volume mm3 350-2000
Volume mm3 >2000
<1.6 mm 260 °C 260 °C 260 °C 1.6 mm – 2.5 mm 260 °C 250 °C 245 °C
≥2.5 mm 250 °C 245 °C 245 °C
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc) Package
Thickness Volume mm3
<350 Volume mm3
≥350 <2.5 mm 235 °C 220 °C
≥2.5 mm 220 °C 220 °C
Reliability Test Program
Test item Method Description SOLDERABILITY JESD-22, B102 5 Sec, 245°C HOLT JESD-22, A108 1000 Hrs, Bias @ 125°C PCT JESD-22, A102 168 Hrs, 100%RH, 2atm, 121°C TCT JESD-22, A104 500 Cycles, -65°C~150°C
Copyright ANPEC Electronics Corp.Rev. B.3 - Nov., 2009
www.anpec.com.tw11
APM4412K
Customer Service
Anpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838
Fax : 886-2-2917-3838
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. A.2 - Nov., 2008
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, andadvise customers to obtain the latest version of relevant information to verify before placing orders.
APM4810K
Features
Applications
• Power Management in Notebook Computer,
Portable Equipment and Battery PoweredSystems
Pin Description
Ordering and Marking InformationN-Channel MOSFET
• 30V/11A,
RDS(ON) = 12mΩ(typ.) @ VGS = 10V RDS(ON) =18mΩ(typ.) @ VGS = 4.5V
• Super High Dense Cell Design
• Reliable and Rugged
• Lead Free and Green Devices Available(RoHS Compliant)
Top View of SOP − 8
G
S
D D( 5,6,7,8 )
(4)
(1, 2, 3)
DD
SS
APM4810
Handling Code
Temperature RangePackage Code
Package Code K : SOP-8Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material L : Lead Free Device G : Halogen and Lead Free Device
APM4810 K : XXXXX - Date Code
Assembly Material
APM4810XXXXX
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).
SS
SG
DD
DD
Copyright ANPEC Electronics Corp.Rev. A.2 - Nov., 2008
www.anpec.com.tw2
APM4810K
Absolute Maximum Ratings (TA = 25°C Unless Otherwise Noted)
Electrical Characteristics (TA = 25°C Unless Otherwise Noted)
Symbol Parameter Rating Unit
VDSS Drain-Source Voltage 30
VGSS Gate-Source Voltage ±20 V
ID* Continuous Drain Current 11
IDM* 300µs Pulsed Drain Current VGS=10V
40 A
IS* Diode Continuous Forward Current 2.5 A
TJ Maximum Junction Temperature 150
TSTG Storage Temperature Range -55 to 150 °C
TA=25°C 2 PD* Maximum Power Dissipation
TA=100°C 0.8 W
RθJA* Thermal Resistance-Junction to Ambient 62.5 °C/W
Note : *Surface Mounted on 1in2 pad area, t ≤ 10sec.
APM4810K Symbol Parameter Test Conditions
Min. Typ. Max. Unit
STATIC CHARACTERISTICS
BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 30 - - V
VDS=24V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current
TJ=85°C - - 30 µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1.3 1.8 2.5 V
IGSS Gate Leakage Current VGS=±20V, VDS=0V - - ±100 nA
VGS=10V, IDS=11A - 12 15 RDS(ON)
a Drain-Source On-State Resistance VGS=4.5V, IDS=10A - 18 25
mΩ
VSDa Diode Forward Voltage ISD=2.5A, VGS=0V - 0.75 1.1 V
GATE CHARGE CHARACTERISTICS b
Qg Total Gate Charge - 19 27
Qgs Gate-Source Charge - 2 -
Qgd Gate-Drain Charge
VDS=15V, VGS=10V, IDS=11A
- 4 -
nC
Copyright ANPEC Electronics Corp.Rev. A.2 - Nov., 2008
www.anpec.com.tw3
APM4810K
Electrical Characteristics (Cont.) (TA = 25°C Unless Otherwise Noted)
APM4810K Symbol Parameter Test Conditions
Min. Typ. Max. Unit
DYNAMIC CHARACTERISTICS b
RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 1.5 - Ω
Ciss Input Capacitance - 830 -
Coss Output Capacitance - 130 -
Crss Reverse Transfer Capacitance
VGS=0V, VDS=15V, Frequency=1.0MHz - 95 -
pF
td(ON) Turn-on Delay Time - 7 14
tr Turn-on Rise Time - 13 24
td(OFF) Turn-off Delay Time - 28 51
tf Turn-off Fall Time
VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω
- 6 12
ns
trrb Reverse Recovery Time - 19 - ns
qrrb Reverse Recovery Charge
ISD=11A, dlSD/dt=100A/µs - 13 - nC
Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.
Copyright ANPEC Electronics Corp.Rev. A.2 - Nov., 2008
www.anpec.com.tw4
APM4810K
I D -
Dra
in C
urre
nt (A
)
Drain Current
TJ- Junction Temperature (°C)
Safe Operation Area
VDS - Drain - Source Voltage (V)
Nor
mal
ized
Tra
nsie
nt T
herm
al R
esis
tanc
e
Thermal Transient Impedance
Square Wave Pulse Duration (sec)
Power Dissipation
Pto
t - P
ower
(W)
TJ - Junction Temperature (°C)
I D -
Dra
in C
urre
nt (A
)
0 20 40 60 80 100 120 140 1600.0
0.5
1.0
1.5
2.0
2.5
TA=25oC
0 20 40 60 80 100 120 140 1600
2
4
6
8
10
12
14
TA=25oC,V
G=10V
1E-4 1E-3 0.01 0.1 1 10 300.01
0.1
1
2
Mounted on 1in2 padR
θJA : 62.5 oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
Typical Operating Characteristics
0.01 0.1 1 10 1000.01
0.1
1
10
100
Rds(on
) Lim
it
1s
TA=25oC
10ms
300µs
1ms
100ms
DC
Copyright ANPEC Electronics Corp.Rev. A.2 - Nov., 2008
www.anpec.com.tw5
APM4810K
RD
S(O
N) -
On
- Res
ista
nce
(mΩ
)
Drain-Source On Resistance
ID - Drain Current (A)
TJ - Junction Temperature (°C)
Gate Threshold Voltage
VDS - Drain-Source Voltage (V)
I D -
Dra
in C
urre
nt (A
)
Output Characteristics
Drain-Source On Resistance
VGS - Gate - Source Voltage (V)
RD
S(O
N) -
On
- Res
ista
nce
(mΩ
)
Nor
mal
ized
Thr
esho
ld V
olta
ge
0 5 10 15 20 25 30 35 404
8
12
16
20
24
28
VGS
=4.5V
VGS
=10V
2 3 4 5 6 7 8 9 106
9
12
15
18
21
24
27
30
ID=11A
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6IDS
= 250µA
Typical Operating Characteristics (Cont.)
0.0 0.5 1.0 1.5 2.0 2.5 3.00
5
10
15
20
25
30
35
40
2V
3V
2.5V
3.5VV
GS= 4,4.5,5,6,7,8,9,10V
Copyright ANPEC Electronics Corp.Rev. A.2 - Nov., 2008
www.anpec.com.tw6
APM4810K
VDS - Drain - Source Voltage (V)
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
TJ - Junction Temperature (°C)
C -
Cap
acita
nce
(pF)
VSD - Source - Drain Voltage (V)
Source-Drain Diode Forward
I S -
Sou
rce
Cur
rent
(A)
Capacitance Gate Charge
QG - Gate Charge (nC)
VG
S -
Gat
e - s
ourc
e V
olta
ge (V
)
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
VGS
= 10V
IDS
= 11A
RON
@Tj=25oC: 12mΩ
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.60.1
1
10
40
Tj=150oC
Tj=25oC
0 5 10 15 20 25 300
200
400
600
800
1000
1200
1400
Frequency=1MHz
CrssCoss
Ciss
0 4 8 12 16 200
1
2
3
4
5
6
7
8
9
10V
DS=15V
IDS
=11A
Typical Operating Characteristics (Cont.)
Copyright ANPEC Electronics Corp.Rev. A.2 - Nov., 2008
www.anpec.com.tw7
APM4810K
Package InformationSOP-8
SYMBOL MIN. MAX.
1.75
0.10
0.17 0.25
0.25
A
A1
c
D
E
E1
e
h
L
MILLIMETERS
b 0.31 0.51
SOP-8
0.25 0.50
0.40 1.27
MIN. MAX.
INCHES
0.069
0.004
0.012 0.020
0.007 0.010
0.010 0.020
0.016 0.050
0
0.010
1.27 BSC 0.050 BSC
A2 1.25 0.049
0° 8 ° 0° 8 °
D
e
EE1
SEE VIEW A
cb
h X
45°
A
A1
A2
L
VIEW A
0.25
SEATING PLANEGAUGE PLANE
Note: 1. Follow JEDEC MS-012 AA. 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension “E” does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side.
3.80
5.80
4.80
4.00
6.20
5.00 0.189 0.197
0.228 0.244
0.150 0.157
Copyright ANPEC Electronics Corp.Rev. A.2 - Nov., 2008
www.anpec.com.tw8
APM4810K
Application A H T1 C d D W E1 F
330.0±2.00 50 MIN. 12.4+2.00 -0.00
13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.5±0.05
P0 P1 P2 D0 D1 T A0 B0 K0 SOP-8
4.0±0.10 8.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00
-0.40 6.40±0.20 5.20±0.20 2.10±0.20
(mm)
Carrier Tape & Reel Dimensions
H
T1
A
d
A
E1
AB
W
F
T
P0OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
Devices Per Unit
Package Type Unit Quantity
SOP-8 Tape & Reel 2500
Copyright ANPEC Electronics Corp.Rev. A.2 - Nov., 2008
www.anpec.com.tw9
APM4810K
Taping Direction InformationSOP-8
Reflow Condition (IR/Convection or VPR Reflow)
t 25 C to Peak
tp
Ramp-up
tL
Ramp-downts
Preheat
Tsmax
Tsmin
TL
TP
25
Tem
per
atur
e
Time
Critical ZoneTL to TP
°
Reliability Test Program
Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles
USER DIRECTION OF FEED
Copyright ANPEC Electronics Corp.Rev. A.2 - Nov., 2008
www.anpec.com.tw10
APM4810K
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.
Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)
100°C 150°C
60-120 seconds
150°C 200°C
60-180 seconds
Time maintained above: - Temperature (TL) - Time (tL)
183°C 60-150 seconds
217°C 60-150 seconds
Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)
10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max.
Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.
Classification Reflow Profiles
Table 2. Pb-free Process – Package Classification Reflow Temperatures
Package Thickness Volume mm3 <350
Volume mm3 350-2000
Volume mm3 >2000
<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*
≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures
Package Thickness Volume mm3
<350 Volume mm3
≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C
Customer Service
Anpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838
Fax : 886-2-2917-3838
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2008
APM4812K
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.
Ordering and Marking Information
Features
Applications
• 30V/8A, RDS(ON)= 18mΩ(typ.) @ VGS= 10V RDS(ON)= 26mΩ(typ.) @ VGS= 4.5V• Super High Dense Cell Design• Reliable and Rugged
• Lead Free and Green Devices Available
(RoHS Compliant)
N-Channel MOSFET
Pin Description
• Power Management in Notebook Computer,
Portable Equipment and Battery PoweredSystems
Top View of SOP − 8
SS
SG
DD
DD
G
S
D DDD
SS
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).
APM4812
Handling CodeTemperature RangePackage Code
Package Code K : SOP-8Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material G : Halogen and Lead Free Device
APM4812 K :APM4812XXXXX XXXXX - Date Code
Assembly Material
Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2008
APM4812K
www.anpec.com.tw2
Electrical Characteristics (TA = 25°C unless otherwise noted)
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)
Symbol Parameter Rating Unit
VDSS Drain-Source Voltage 30
VGSS Gate-Source Voltage ±20 V
ID* Continuous Drain Current 8
IDM* 300µs Pulsed Drain Current VGS=10V
30 A
IS* Diode Continuous Forward Current 2.5 A
TJ Maximum Junction Temperature 150
TSTG Storage Temperature Range -55 to 150 °C
TA=25°C 2 PD* Maximum Power Dissipation
TA=100°C 0.8 W
RθJA* Thermal Resistance-Junction to Ambient 62.5 °C/W
Note : *Surface Mounted on 1in2 pad area, t ≤ 10sec.
APM4812K Symbol Parameter Test Conditions
Min. Typ. Max. Unit
Static Characteristics
BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 30 - - V
VDS=24V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current
TJ=85°C - - 30 µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1 1.5 2 V
IGSS Gate Leakage Current VGS=±20V, VDS=0V - - ±100 nA
VGS=10V, IDS=8A - 18 22 RDS(ON)
a Drain-Source On-state Resistance VGS=4.5V, IDS=5.6A - 26 34
mΩ
Diodes Characteristicsb
VSDa Diode Forward Voltage ISD=2A, VGS=0V - 0.8 1.1 V
trrb Reverse Recovery Time - 16 - ns
qrrb Reverse Recovery Charge
ISD=8A, dlSD/dt=100A/µs - 8 - nc
Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2008
APM4812K
www.anpec.com.tw3
Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)
APM4812K Symbol Parameter Test Conditions
Min. Typ. Max. Unit
Dynamic Characteristics b
RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 1.5 - Ω
Ciss Input Capacitance - 600 -
Coss Output Capacitance - 90 -
Crss Reverse Transfer Capacitance
VGS=0V, VDS=15V, Frequency=1.0MHz - 65 -
pF
td(ON) Turn-on Delay Time - 8 15
tr Turn-on Rise Time - 12 23
td(OFF) Turn-off Delay Time - 23 42
tf Turn-off Fall Time
VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω
- 4 8
ns
Gate Charge Characteristics b
Qg Total Gate Charge - 13.5 18
Qgs Gate-Source Charge - 1.3 -
Qgd Gate-Drain Charge
VDS=15V, VGS=10V, IDS=8A
- 3 -
nC
Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.
Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2008
APM4812K
www.anpec.com.tw4
Typical Operating Characteristics
ID -
Dra
in C
urre
nt (A
)
Safe Operation Area
VDS - Drain - Source Voltage (V)
Power Dissipation
Pto
t - P
ower
(W)
Tj - Junction Temperature (°C)
ID -
Dra
in C
urre
nt (A
)
Drain Current
Tj - Junction Temperature (°C)
Thermal Transient Impedance
Square Wave Pulse Duration (sec)
Nor
mal
ized
Tra
nsie
nt T
herm
al R
esis
tanc
e
0 20 40 60 80 100 120 140 1600.0
0.5
1.0
1.5
2.0
2.5
TA=25oC
0 20 40 60 80 100 120 140 1600
2
4
6
8
10
TA=25oC,V
G=10V
0.01 0.1 1 10 1000.01
0.1
1
10
100
Rds(o
n) Li
mit
1s
TA=25oC
10ms
300µs
1ms
100ms
DC
1E-4 1E-3 0.01 0.1 1 10 300.01
0.1
1
2
Mounted on 1in2 padR
θJA : 62.5 oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2008
APM4812K
www.anpec.com.tw5
Typical Operating Characteristics (Cont.)
VDS - Drain - Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Output Characteristics
RD
S(O
N) - O
n - R
esis
tanc
e (m
Ω)
Drain-Source On Resistance
ID - Drain Current (A)
Drain-Source On Resistance
VGS - Gate - Source Voltage (V)
RD
S(O
N) -
On
- Res
ista
nce
(mΩ
)
Tj - Junction Temperature (°C)
Gate Threshold Voltage
Nor
mal
ized
Thr
esho
ld V
olta
ge
0.0 0.5 1.0 1.5 2.0 2.5 3.00
3
6
9
12
15
18
21
24
27
30
3V
VGS
=4,5,6,7,8,9,10V
0 5 10 15 20 25 305
10
15
20
25
30
35
40
VGS
=4.5V
VGS
=10V
2 3 4 5 6 7 8 9 1012
16
20
24
28
32
36
40
44
ID= 8A
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6IDS
= 250µA
Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2008
APM4812K
www.anpec.com.tw6
Typical Operating Characteristics (Cont.)
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
Tj - Junction Temperature (°C) VSD - Source - Drain Voltage (V)
Source-Drain Diode Forward
IS -
Sou
rce
Cur
rent
(A)
VDS - Drain - Source Voltage (V)
C -
Cap
acita
nce
(pF)
Capacitance Gate Charge
QG - Gate Charge (nC)
VG
S -
Gat
e-so
urce
Vol
tage
(V)
0 2 4 6 8 10 12 140
1
2
3
4
5
6
7
8
9
10V
DS=15V
IDS
=8A
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.60.1
1
10
30
Tj=150oC
Tj=25oC
0 5 10 15 20 25 300
100
200
300
400
500
600
700
800
900
Frequency=1MHz
Crss
Coss
Ciss
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
VGS
= 10V
IDS
= 8A
RON
@Tj=25oC: 18mΩ
Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2008
APM4812K
www.anpec.com.tw7
SOP-8
SYMBOL MIN. MAX.
1.75
0.10
0.17 0.25
0.25
A
A1
c
D
E
E1
e
h
L
MILLIMETERS
b 0.31 0.51
SOP-8
0.25 0.50
0.40 1.27
MIN. MAX.
INCHES
0.069
0.004
0.012 0.020
0.007 0.010
0.010 0.020
0.016 0.050
0
0.010
1.27 BSC 0.050 BSC
A2 1.25 0.049
0° 8 ° 0° 8 °
D
e
EE1
SEE VIEW A
cb
h X
45°
A
A1
A2
L
VIEW A
0.25
SEATING PLANEGAUGE PLANE
Note: 1. Follow JEDEC MS-012 AA. 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension “E” does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side.
3.80
5.80
4.80
4.00
6.20
5.00 0.189 0.197
0.228 0.244
0.150 0.157
Package Information
Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2008
APM4812K
www.anpec.com.tw8
Application A H T1 C d D W E1 F 330.0±2.00
50 MIN. 12.4+2.00 -0.00
13.0+0.50 -0.20
1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.5±0.05
P0 P1 P2 D0 D1 T A0 B0 K0 SOP-8
4.0±0.10 8.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00
-0.40 6.40±0.20 5.20±0.20 2.10±0.20
(mm)
Carrier Tape & Reel Dimensions
H
T1
A
d
A
E1
AB
W
F
T
P0OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
Devices Per Unit
Package Type Unit Quantity
SOP-8 Tape & Reel 2500
Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2008
APM4812K
www.anpec.com.tw9
Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles
Reflow Condition (IR/Convection or VPR Reflow)
Reliability Test Program
t 25 C to Peak
tp
Ramp-up
tL
Ramp-downts
Preheat
Tsmax
Tsmin
TL
TP
25
Tem
per
atur
e
Time
Critical ZoneTL to TP
°
Taping Direction InformationSOP-8
USER DIRECTION OF FEED
Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2008
APM4812K
www.anpec.com.tw10
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.
Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)
100°C 150°C
60-120 seconds
150°C 200°C
60-180 seconds
Time maintained above: - Temperature (TL) - Time (tL)
183°C 60-150 seconds
217°C 60-150 seconds
Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)
10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.
Table 2. Pb-free Process – Package Classification Reflow Temperatures
Package Thickness Volume mm3 <350
Volume mm3 350-2000
Volume mm3 >2000
<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*
≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures
Package Thickness Volume mm3
<350 Volume mm3
≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C
Customer Service
Anpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838Fax : 886-2-2917-3838
Classification Reflow Profiles
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. B.3 - Jan., 2009
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.
APM4320K
Features
Applications
Pin Description
Ordering and Marking InformationN-Channel MOSFET
• 30V/13A,
RDS(ON ) = 7.5mΩ(typ.) @ VGS = 10VRDS(ON) =10.5mΩ(typ.) @ VGS = 4.5V
• Super High Dense Cell Design
• Reliable and Rugged
• SOP-8 Package
• Lead Free and Green Devices Available (RoHS Compliant)
Top View of SOP−8
• Power Management in Notebook Computer,Portable Equipment and Battery PoweredSystems
G
S
D D( 5,6,7,8 )
(4)
(1, 2, 3)
DD
SS
SS
SG
DD
DD
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).
APM4320
Handling CodeTemperature RangePackage Code
Package Code K : SOP-8Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material G : Halogen and Lead Free Device
APM4320 K :APM4320XXXXX XXXXX - Date Code
Assembly Material
Copyright ANPEC Electronics Corp.Rev. B.3 - Jan., 2009
www.anpec.com.tw2
APM4320K
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)
Electrical Characteristics (TA = 25°C unless otherwise noted)
Symbol Parameter Rating Unit
VDSS Drain-Source Voltage 30
VGSS Gate-Source Voltage ±20 V
ID* Continuous Drain Current 13
IDM* 300µs Pulsed Drain Current VGS=10V
50 A
IS* Diode Continuous Forward Current 2.8 A
TJ Maximum Junction Temperature 150
TSTG Storage Temperature Range -55 to 150 °C
TA=25°C 2 PD* Maximum Power Dissipation
TA=100°C 0.8 W
RθJA* Thermal Resistance-Junction to Ambient 62.5 °C/W
Note : *Surface Mounted on 1in2 pad area, t ≤ 10sec.
APM4320K Symbol Parameter Test Conditions
Min. Typ. Max. Unit
Static Characteristics
BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 30 - - V
VDS=24V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current
TJ=85°C - - 30 µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1.3 1.8 2.5 V
IGSS Gate Leakage Current VGS=±20V, VDS=0V - - ±100 nA
VGS=10V, IDS=13A - 7.5 9.5 RDS(ON)
a Drain-Source On-state Resistance VGS=4.5V, IDS=7A - 10.5 13.5
mΩ
VSDa Diode Forward Voltage ISD=2.8A, VGS=0V - 0.7 1.1 V
Gate Charge Characteristics b
Qg Total Gate Charge - 35 50
Qgs Gate-Source Charge - 6 -
Qgd Gate-Drain Charge
VDS=15V, VGS=10V, IDS=13A
- 11 -
nC
Copyright ANPEC Electronics Corp.Rev. B.3 - Jan., 2009
www.anpec.com.tw3
APM4320K
Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)
APM4320K Symbol Parameter Test Conditions
Min. Typ. Max. Unit
Dynamic Characteristics b
RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 2 - Ω
Ciss Input Capacitance - 2310 -
Coss Output Capacitance - 350 -
Crss Reverse Transfer Capacitance
VGS=0V, VDS=15V, Frequency=1.0MHz - 210 -
pF
td(ON) Turn-on Delay Time - 15 28
Tr Turn-on Rise Time - 11 21
td(OFF) Turn-off Delay Time - 45 82
Tf Turn-off Fall Time
VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω
- 18 33
ns
trr Reverse Recovery Time - 18 - ns
qrr Reverse Recovery Charge ISD=13A, dlSD/dt=100A/µs
- 9 - nC Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.
Copyright ANPEC Electronics Corp.Rev. B.3 - Jan., 2009
www.anpec.com.tw4
APM4320K
Typical Operating Characteristics
ID -
Dra
in C
urre
nt (A
)
Drain Current
Tj - Junction Temperature (°C)
Safe Operation Area
VDS - Drain - Source Voltage (V)
Nor
mal
ized
Tra
nsie
nt T
herm
al R
esis
tanc
e
Thermal Transient Impedance
Square Wave Pulse Duration (sec)
Power Dissipation
Pto
t - P
ower
(W)
Tj - Junction Temperature (°C)
ID -
Dra
in C
urre
nt (A
)
0 20 40 60 80 100 120 140 1600.0
0.5
1.0
1.5
2.0
2.5
TA=25oC
0.01 0.1 1 10 1000.01
0.1
1
10
100
Rds(o
n) L
imit
1s
TA=25oC
10ms
300µs
1ms
100ms
DC
1E-4 1E-3 0.01 0.1 1 10 301E-3
0.01
0.1
1
2
Mounted on 1in2 padR
θJA : 62.5 oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
0 20 40 60 80 100 120 140 1600
3
6
9
12
15
TA=25oC,V
G=10V
Copyright ANPEC Electronics Corp.Rev. B.3 - Jan., 2009
www.anpec.com.tw5
APM4320K
RD
S(O
N) - O
n - R
esis
tanc
e (m
Ω)
Drain-Source On Resistance
ID - Drain Current (A)
Tj - Junction Temperature (°C)
Gate Threshold Voltage
VDS - Drain-Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Output Characteristics
VGS - Gate - Source Voltage (V)
Nor
mal
ized
Thr
esho
ld V
olta
ge
Typical Operating Characteristics (Cont.)
0.0 0.5 1.0 1.5 2.0 2.5 3.00
5
10
15
20
25
30
35
40
45
50
3.5V
3V
4V
VGS
=5,6,7,8,9,10V
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6IDS
=250µA
RD
S(O
N) -
On
- Res
ista
nce
(mΩ
)
Drain-Source On Resistance
0 10 20 30 40 502
4
6
8
10
12
14
16
18
VGS
=10V
VGS
=4.5V
1 2 3 4 5 6 7 8 9 100
5
10
15
20
25
30
ID= 13A
Copyright ANPEC Electronics Corp.Rev. B.3 - Jan., 2009
www.anpec.com.tw6
APM4320K
VDS - Drain - Source Voltage (V)
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
Tj - Junction Temperature (°C)
C -
Cap
acita
nce
(pF)
VSD - Source - Drain Voltage (V)
Source-Drain Diode Forward
IS -
Sou
rce
Cur
rent
(A)
Capacitance Gate Charge
QG - Gate Charge (nC)
VG
S -
Gat
e - s
ourc
e V
olta
ge (V
)
Typical Operating Characteristics (Cont.)
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.40.3
1
10
50
Tj=150oC
Tj=25oC
0 5 10 15 20 25 300
500
1000
1500
2000
2500
3000
3500
Frequency=1MHz
Crss
Coss
Ciss
0 5 10 15 20 25 30 350
1
2
3
4
5
6
7
8
9
10V
DS= 15V
ID= 13A
-50 -25 0 25 50 75 100 125 1500.00
0.25
0.50
0.75
1.00
1.25
1.50
1.75
RON
@Tj=25oC: 7.5mΩ
VGS
= 10V
IDS
= 13A
Copyright ANPEC Electronics Corp.Rev. B.3 - Jan., 2009
www.anpec.com.tw7
APM4320K
Package Information
SOP-8
SYMBOL MIN. MAX.
1.75
0.10
0.17 0.25
0.25
A
A1
c
D
E
E1
e
h
L
MILLIMETERS
b 0.31 0.51
SOP-8
0.25 0.50
0.40 1.27
MIN. MAX.
INCHES
0.069
0.004
0.012 0.020
0.007 0.010
0.010 0.020
0.016 0.050
0
0.010
1.27 BSC 0.050 BSC
A2 1.25 0.049
0° 8 ° 0° 8 °
D
e
EE1
SEE VIEW A
cb
h X
45°
A
A1
A2
L
VIEW A
0.25
SEATING PLANEGAUGE PLANE
Note: 1. Follow JEDEC MS-012 AA. 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension “E” does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side.
3.80
5.80
4.80
4.00
6.20
5.00 0.189 0.197
0.228 0.244
0.150 0.157
Copyright ANPEC Electronics Corp.Rev. B.3 - Jan., 2009
www.anpec.com.tw8
APM4320K
Application A H T1 C d D W E1 F 330.0±2.00
50 MIN. 12.4+2.00 -0.00
13.0+0.50 -0.20
1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.5±0.05
P0 P1 P2 D0 D1 T A0 B0 K0 SOP-8
4.0±0.10 8.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00
-0.40 6.40±0.20 5.20±0.20 2.10±0.20
(mm)
Carrier Tape & Reel Dimensions
H
T1
A
d
A
E1
AB
W
F
T
P0OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
Devices Per Unit
Package Type Unit Quantity
SOP-8 Tape & Reel 2500
Copyright ANPEC Electronics Corp.Rev. B.3 - Jan., 2009
www.anpec.com.tw9
APM4320K
Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles
Reflow Condition (IR/Convection or VPR Reflow)
Reliability Test Program
t 25 C to Peak
tp
Ramp-up
tL
Ramp-downts
Preheat
Tsmax
Tsmin
TL
TP
25
Tem
per
atur
e
Time
Critical ZoneTL to TP
°
Taping Direction InformationSOP-8
USER DIRECTION OF FEED
Copyright ANPEC Electronics Corp.Rev. B.3 - Jan., 2009
www.anpec.com.tw10
APM4320K
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.
Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)
100°C 150°C
60-120 seconds
150°C 200°C
60-180 seconds
Time maintained above: - Temperature (TL) - Time (tL)
183°C 60-150 seconds
217°C 60-150 seconds
Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)
10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.
Table 2. Pb-free Process – Package Classification Reflow Temperatures
Package Thickness Volume mm3 <350
Volume mm3 350-2000
Volume mm3 >2000
<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*
≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures
Package Thickness Volume mm3
<350 Volume mm3
≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C
Customer ServiceAnpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838Fax : 886-2-2917-3838
Classification Reflow Profiles
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. B.3 - Nov., 2008
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.
APM4330KC
Features
Applications
• Power Management in Notebook Computer,
Portable Equipment and Battery Powered Sys-tems
Pin Description
Ordering and Marking InformationN-Channel MOSFET
Top View of SOP − 8
• 30V/15A,
RDS(ON) = 5.5mΩ(typ.) @ VGS = 10VRDS(ON) =7mΩ(typ.) @ VGS = 4.5V
• Super High Dense Cell Design
• Reliable and Rugged
• SOP-8 Package
• Lead Free and Green Devices Available (RoHS Compliant)
G
S
D D( 5,6,7,8 )
(4)
(1, 2, 3)
DD
SS
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).
APM4330
Handling CodeTemperature RangePackage Code
Package Code K : SOP-8Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material L : Lead Free Device G : Halogen and Lead Free Device
APM4330 K :APM4330XXXXX XXXXX - Date Code
Assembly Material
SS
SG
DD
DD
Copyright ANPEC Electronics Corp.Rev. B.3 - Nov., 2008
www.anpec.com.tw2
APM4330KC
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)
Electrical Characteristics (TA = 25°C unless otherwise noted)
Symbol Parameter Rating Unit
VDSS Drain-Source Voltage 30
VGSS Gate-Source Voltage ±20 V
ID* Continuous Drain Current 15
IDM* 300µs Pulsed Drain Current VGS=10V
60 A
IS* Diode Continuous Forward Current 2.8 A
TJ Maximum Junction Temperature 150
TSTG Storage Temperature Range -55 to 150 °C
TA=25°C 2 PD* Maximum Power Dissipation
TA=100°C 0.8 W
RθJA* Thermal Resistance-Junction to Ambient 62.5 °C/W
Note : *Surface Mounted on 1in2 pad area, t ≤ 10sec.
APM4330K Symbol Parameter Test Conditions
Min. Typ. Max. Unit
STATIC CHARACTERISTICS
BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 30 - - V
VDS=24V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current
TJ=85°C - - 30 µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1.3 1.8 2.5 V
IGSS Gate Leakage Current VGS=±20V, VDS=0V - - ±100 nA
VGS=10V, IDS=15A - 5.5 6.6 RDS(ON)
a Drain-Source On-State Resistance VGS=4.5V, IDS=11.5A - 7 9
mΩ
VSDa Diode Forward Voltage ISD=2.8A, VGS=0V - 0.7 1.1 V
GATE CHARGE CHARACTERISTICS b
Qg Total Gate Charge - 55 77
Qgs Gate-Source Charge - 8 -
Qgd Gate-Drain Charge
VDS=15V, VGS=10V, IDS=15A
- 14 -
nC
Copyright ANPEC Electronics Corp.Rev. B.3 - Nov., 2008
www.anpec.com.tw3
APM4330KC
Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)
APM4330K Symbol Parameter Test Conditions
Min. Typ. Max. Unit
DYNAMIC CHARACTERISTICSb
RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 1.4 - Ω
Ciss Input Capacitance - 3130 -
Coss Output Capacitance - 545 -
Crss Reverse Transfer Capacitance
VGS=0V, VDS=15V, Frequency=1.0MHz - 330 -
pF
td(ON) Turn-on Delay Time - 18 33
tr Turn-on Rise Time - 12 23
td(OFF) Turn-off Delay Time - 59 107
tf Turn-off Fall Time
VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω
- 26 48
ns
trr Reverse Recovery Time - 19 - ns
qrr Reverse Recovery Charge ISD=15A, dlSD/dt=100A/µs
- 6 - nC Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.
Copyright ANPEC Electronics Corp.Rev. B.3 - Nov., 2008
www.anpec.com.tw4
APM4330KC
Typical Operating Characteristics
I D -
Dra
in C
urre
nt (A
)
Drain Current
TJ - Junction Temperature (°C)
Safe Operation Area
VDS - Drain - Source Voltage (V)
Nor
mal
ized
Tra
nsie
nt T
herm
al R
esis
tanc
e
Thermal Transient Impedance
Square Wave Pulse Duration (sec)
Power Dissipation
Pto
t - P
ower
(W)
TJ- Junction Temperature (°C)
I D -
Dra
in C
urre
nt (A
)
0 20 40 60 80 100 120 140 1600.0
0.5
1.0
1.5
2.0
2.5
TA=25oC
0.01 0.1 1 10 1000.01
0.1
1
10
100
Rds(on
) Lim
it
1s
TA=25oC
10ms
300µs
1ms
100ms
DC
1E-4 1E-3 0.01 0.1 1 10 301E-3
0.01
0.1
1
2
Mounted on 1in2 padR
θJA : 62.5 oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
0 20 40 60 80 100 120 140 1600
3
6
9
12
15
18
TA=25oC,V
G=10V
Copyright ANPEC Electronics Corp.Rev. B.3 - Nov., 2008
www.anpec.com.tw5
APM4330KC
RD
S(O
N) -
On
- R
esis
tanc
e (m
Ω)
Drain-Source On Resistance
ID - Drain Current (A)
TJ - Junction Temperature (°C)
Gate Threshold Voltage
VDS - Drain-Source Voltage (V)
I D -
Dra
in C
urre
nt (A
)
Output Characteristics
VGS - Gate - Source Voltage (V)
Nor
mal
ized
Thr
esho
ld V
olta
ge
0.0 0.5 1.0 1.5 2.0 2.5 3.00
10
20
30
40
50
60
3V
2.5V
3.5VV
GS=4,5,6,7,8,9,10V
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
IDS
=250µA
RD
S(O
N) -
On
- R
esis
tanc
e (m
Ω)
Drain-Source On Resistance
0 10 20 30 40 50 603
4
5
6
7
8
9
10
VGS
=10V
VGS
=4.5V
1 2 3 4 5 6 7 8 9 100
2
4
6
8
10
12
14
16
18
20
ID= 15A
Typical Operating Characteristics (Cont.)
Copyright ANPEC Electronics Corp.Rev. B.3 - Nov., 2008
www.anpec.com.tw6
APM4330KC
VDS - Drain - Source Voltage (V)
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
TJ - Junction Temperature (°C)
C -
Cap
acita
nce
(pF)
VSD - Source - Drain Voltage (V)
Source-Drain Diode Forward
I S -
Sou
rce
Cur
rent
(A)
Capacitance Gate Charge
QG - Gate Charge (nC)
VG
S -
Gat
e - s
ourc
e V
olta
ge (V
)
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
RON
@Tj=25oC: 5.5mΩ
VGS
= 10V
IDS
= 15A
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.40.3
1
10
50
Tj=150oC
Tj=25oC
0 5 10 15 20 25 300
500
1000
1500
2000
2500
3000
3500
4000
4500
5000
Frequency=1MHz
Crss
Coss
Ciss
0 10 20 30 40 50 600
1
2
3
4
5
6
7
8
9
10V
DS= 15V
ID= 15A
Typical Operating Characteristics (Cont.)
Copyright ANPEC Electronics Corp.Rev. B.3 - Nov., 2008
www.anpec.com.tw7
APM4330KC
Package Information
SOP-8
SYMBOL MIN. MAX.
1.75
0.10
0.17 0.25
0.25
A
A1
c
D
E
E1
e
h
L
MILLIMETERS
b 0.31 0.51
SOP-8
0.25 0.50
0.40 1.27
MIN. MAX.
INCHES
0.069
0.004
0.012 0.020
0.007 0.010
0.010 0.020
0.016 0.050
0
0.010
1.27 BSC 0.050 BSC
A2 1.25 0.049
0° 8 ° 0° 8 °
D
e
EE1
SEE VIEW A
cb
h X
45°
A
A1
A2
L
VIEW A
0.25
SEATING PLANEGAUGE PLANE
Note: 1. Follow JEDEC MS-012 AA. 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension “E” does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side.
3.80
5.80
4.80
4.00
6.20
5.00 0.189 0.197
0.228 0.244
0.150 0.157
Copyright ANPEC Electronics Corp.Rev. B.3 - Nov., 2008
www.anpec.com.tw8
APM4330KC
Application A H T1 C d D W E1 F
330.0±2.00 50 MIN. 12.4+2.00 -0.00
13.0+0.50 -0.20
1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.5±0.05
P0 P1 P2 D0 D1 T A0 B0 K0 SOP-8
4.0±0.10 8.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00
-0.40 6.40±0.20 5.20±0.20 2.10±0.20
(mm)
Carrier Tape & Reel Dimensions
H
T1
A
d
A
E1
AB
W
F
T
P0OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
Devices Per Unit
Package Type Unit Quantity
SOP-8 Tape & Reel 2500
Copyright ANPEC Electronics Corp.Rev. B.3 - Nov., 2008
www.anpec.com.tw9
APM4330KC
Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles
Reflow Condition (IR/Convection or VPR Reflow)
Reliability Test Program
t 25 C to Peak
tp
Ramp-up
tL
Ramp-downts
Preheat
Tsmax
Tsmin
TL
TP
25
Tem
per
atur
e
Time
Critical ZoneTL to TP
°
Taping Direction InformationSOP-8
USER DIRECTION OF FEED
Copyright ANPEC Electronics Corp.Rev. B.3 - Nov., 2008
www.anpec.com.tw10
APM4330KC
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.
Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)
100°C 150°C
60-120 seconds
150°C 200°C
60-180 seconds
Time maintained above: - Temperature (TL) - Time (tL)
183°C 60-150 seconds
217°C 60-150 seconds
Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)
10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.
Table 2. Pb-free Process – Package Classification Reflow Temperatures
Package Thickness Volume mm3 <350
Volume mm3 350-2000
Volume mm3 >2000
<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*
≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures
Package Thickness Volume mm3
<350 Volume mm3
≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C
Customer ServiceAnpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838Fax : 886-2-2917-3838
Classification Reflow Profiles
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. A.2 - Jan., 2009
APM4340K
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, andadvise customers to obtain the latest version of relevant information to verify before placing orders.
Ordering and Marking Information
Features
Applications
• 30V/17A,
RDS(ON)=3.8mΩ (typ.) @ VGS=10VRDS(ON)=5mΩ (typ.) @ VGS=4.5V
• Super High Dense Cell Design
• Avalanche Rated
• Reliable and Rugged
• Lead Free and Green Devices Available
(RoHS Compliant)
N-Channel MOSFET
Top View of SOP−8
Pin Description
• Power Management in Notebook Computer,
Portable Equipment and Battery PoweredSystems
SS
SG
DD
DD
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).
G
S
D D( 5,6,7,8 )
(4)
(1, 2, 3)
DD
SS
APM4340
Handling Code
Temperature Range
Package Code
Package Code K : SOP-8Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material G : Halogen and Lead Free Device
APM4340 K :APM4340XXXXX XXXXX - Date Code
Assembly Material
Copyright ANPEC Electronics Corp.Rev. A.2 - Jan., 2009
APM4340K
www.anpec.com.tw2
Electrical Characteristics (TA = 25°C unless otherwise noted)
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)
Symbol Parameter Rating Unit
VDSS Drain-Source Voltage 30
VGSS Gate-Source Voltage ±20 V
ID* Continuous Drain Current 17
IDM* 300µs Pulsed Drain Current VGS = 10V
60 A
IS* Diode Continuous Forward Current 3 A
TJ Maximum Junction Temperature 150
TSTG Storage Temperature Range -55 to 150 °C
TA = 25°C 2 PD* Maximum Power Dissipation
TA = 100°C 0.8 W
RθJA* Thermal Resistance-Junction to Ambient 62.5 °C/W
Note : *Surface Mounted on 1in2 pad area, t ≤ 10sec.
APM4340K Symbol Parameter Test Conditions
Min. Typ. Max. Unit
Static Characteristics
BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 30 - - V
VDS=24V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current
TJ=85°C - - 30 µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1.3 1.8 2.5 V
IGSS Gate Leakage Current VGS=±20V, VDS=0V - - ±100 nA
VGS=10V, IDS=17A - 3.8 4.5 RDS(ON)
a Drain-Source On-state Resistance VGS=4.5V, IDS=12A - 5 6.3
mΩ
VSDa Diode Forward Voltage ISD=3A,VGS=0V - 0.7 1.3 V
Gate Charge Characteristics b
Qg Total Gate Charge - 108 151
Qgs Gate-Source Charge - 17 -
Qgd Gate-Drain Charge
VDS=15V, VGS=10V, IDS=17A
- 22 -
nC
Copyright ANPEC Electronics Corp.Rev. A.2 - Jan., 2009
APM4340K
www.anpec.com.tw3
Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)
APM4340K Symbol Parameter Test Conditions
Min. Typ. Max. Unit
Dynamic Characteristics b
RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 1.3 - Ω
Ciss Input Capacitance - 5600 -
Coss Output Capacitance - 800 -
Crss Reverse Transfer Capacitance
VGS=0V, VDS=15V, Frequency=1.0MHz - 550 -
pF
td(ON) Turn-on Delay Time - 21 39
Tr Turn-on Rise Time - 20 37
td(OFF) Turn-off Delay Time - 111 201
Tf Turn-off Fall Time
VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω
- 47 86
ns
trrb Reverse Recovery Time - 40 - ns
qrrb Reverse Recovery Charge
ISD=17A, dlSD/dt=100A/µs - 37 - nC
Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.
Copyright ANPEC Electronics Corp.Rev. A.2 - Jan., 2009
APM4340K
www.anpec.com.tw4
Typical Operating Characteristics
ID -
Dra
in C
urre
nt (A
)
Safe Operation Area
VDS - Drain - Source Voltage (V)
Power Dissipation
Pto
t - P
ower
(W)
Tj - Junction Temperature (°C)
ID -
Dra
in C
urre
nt (A
)
Drain Current
Tj - Junction Temperature (°C)
Thermal Transient Impedance
Square Wave Pulse Duration (sec)
Nor
mal
ized
Tra
nsie
nt T
herm
al R
esis
tanc
e
0 20 40 60 80 100 120 140 1600.0
0.5
1.0
1.5
2.0
2.5
TA=25oC
0 20 40 60 80 100 120 140 1600
4
8
12
16
20
TA=25oC,V
G=10V
1E-4 1E-3 0.01 0.1 1 10 301E-3
0.01
0.1
1
2
Mounted on 1in2 padR
θJA : 62.5 oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
0.01 0.1 1 10 1000.01
0.1
1
10
100
200
Rds(on
) Lim
it
1s
TA=25oC
10ms
300µs
1ms
100ms
DC
Copyright ANPEC Electronics Corp.Rev. A.2 - Jan., 2009
APM4340K
www.anpec.com.tw5
Typical Operating Characteristics (Cont.)
VDS - Drain - Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Output Characteristics
RD
S(O
N) - O
n - R
esis
tanc
e (m
Ω)
Drain-Source On Resistance
ID - Drain Current (A)
Drain-Source On Resistance
VGS - Gate - Source Voltage (V)
RD
S(O
N) -
On
- Res
ista
nce
(mΩ
)
Tj - Junction Temperature (°C)
Gate Threshold Voltage
Nor
mal
ized
Thr
esho
ld V
olta
ge
1 2 3 4 5 6 7 8 9 100
2
4
6
8
10
12
14
16
ID= 17A
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
IDS
=250µA
0.0 0.5 1.0 1.5 2.0 2.5 3.00
10
20
30
40
50
60
3V
VGS
=3.5,4,5,6,7,8,9,10V
0 10 20 30 40 50 601
2
3
4
5
6
7
8
VGS
=10V
VGS
=4.5V
Copyright ANPEC Electronics Corp.Rev. A.2 - Jan., 2009
APM4340K
www.anpec.com.tw6
Typical Operating Characteristics (Cont.)
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
Tj - Junction Temperature (°C) VSD - Source - Drain Voltage (V)
Source-Drain Diode Forward
IS -
Sou
rce
Cur
rent
(A)
VDS - Drain - Source Voltage (V)
C -
Cap
acita
nce
(pF)
Capacitance Gate Charge
QG - Gate Charge (nC)
VG
S -
Gat
e-so
urce
Vol
tage
(V)
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
RON
@Tj=25oC: 3.8mΩ
VGS
= 10V
IDS
= 17A
0 5 10 15 20 25 300
1000
2000
3000
4000
5000
6000
7000
8000
9000
Frequency=1MHz
Crss
Coss
Ciss
0 20 40 60 80 100 1200
1
2
3
4
5
6
7
8
9
10V
DS= 15V
ID= 17A
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.40.4
1
10
60
Tj=150oC
Tj=25oC
Copyright ANPEC Electronics Corp.Rev. A.2 - Jan., 2009
APM4340K
www.anpec.com.tw7
SOP-8
SYMBOL MIN. MAX.
1.75
0.10
0.17 0.25
0.25
A
A1
c
D
E
E1
e
h
L
MILLIMETERS
b 0.31 0.51
SOP-8
0.25 0.50
0.40 1.27
MIN. MAX.
INCHES
0.069
0.004
0.012 0.020
0.007 0.010
0.010 0.020
0.016 0.050
0
0.010
1.27 BSC 0.050 BSC
A2 1.25 0.049
0° 8 ° 0° 8 °
D
e
EE1
SEE VIEW A
cb
h X
45°
A
A1
A2
L
VIEW A
0.25
SEATING PLANEGAUGE PLANE
Note: 1. Follow JEDEC MS-012 AA. 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension “E” does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side.
3.80
5.80
4.80
4.00
6.20
5.00 0.189 0.197
0.228 0.244
0.150 0.157
Package Information
Copyright ANPEC Electronics Corp.Rev. A.2 - Jan., 2009
APM4340K
www.anpec.com.tw8
Application A H T1 C d D W E1 F 330.0±2.00
50 MIN. 12.4+2.00 -0.00
13.0+0.50 -0.20
1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.5±0.05
P0 P1 P2 D0 D1 T A0 B0 K0 SOP-8
4.0±0.10 8.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00
-0.40 6.40±0.20 5.20±0.20 2.10±0.20
(mm)
Carrier Tape & Reel Dimensions
H
T1
A
d
A
E1
AB
W
F
T
P0OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
Devices Per Unit
Package Type Unit Quantity
SOP-8 Tape & Reel 2500
Copyright ANPEC Electronics Corp.Rev. A.2 - Jan., 2009
APM4340K
www.anpec.com.tw9
Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles
Reflow Condition (IR/Convection or VPR Reflow)
Reliability Test Program
t 25 C to Peak
tp
Ramp-up
tL
Ramp-downts
Preheat
Tsmax
Tsmin
TL
TP
25
Tem
per
atur
e
Time
Critical ZoneTL to TP
°
Taping Direction InformationSOP-8
USER DIRECTION OF FEED
Copyright ANPEC Electronics Corp.Rev. A.2 - Jan., 2009
APM4340K
www.anpec.com.tw10
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.
Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)
100°C 150°C
60-120 seconds
150°C 200°C
60-180 seconds
Time maintained above: - Temperature (TL) - Time (tL)
183°C 60-150 seconds
217°C 60-150 seconds
Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)
10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.
Table 2. Pb-free Process – Package Classification Reflow Temperatures
Package Thickness Volume mm3 <350
Volume mm3 350-2000
Volume mm3 >2000
<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*
≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures
Package Thickness Volume mm3
<350 Volume mm3
≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C
Customer ServiceAnpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838Fax : 886-2-2917-3838
Classification Reflow Profiles
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. A.2 - Apr., 2008
APM4472K
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.
Ordering and Marking Information
Features
Applications
• 40V/12A, RDS(ON)= 7.5mΩ(typ.) @ VGS= 10V RDS(ON)= 10.5mΩ(typ.) @ VGS= 4.5V• Super High Dense Cell Design• Avalanche Rated• Reliable and Rugged
• Lead Free and Green Devices Available
(RoHS Compliant)
N-Channel MOSFET
Pin Description
• Inventer Application in LCM and LCD TV
Top View of SOP − 8
SS
SG
DD
DD
APM4472
Handling CodeTemp. RangePackage Code
Package Code K : SOP-8Operating Junction Temp. Range C : -55 to 150°CHandling Code TR : Tape & ReelAssembly Material L : Lead Free Device G : Halogen and Lead Free Device
APM4472 K : APM4472XXXXX XXXXX - Date Code
Assembly Material
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).
G
S
D DDD
SS
Copyright ANPEC Electronics Corp.Rev. A.2 - Apr., 2008
APM4472K
www.anpec.com.tw2
Electrical Characteristics (TA = 25°C unless otherwise noted)
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)
Symbol Parameter Rating Unit
VDSS Drain-Source Voltage 40
VGSS Gate-Source Voltage ±20 V
ID* Continuous Drain Current 12
IDM* 300µs Pulsed Drain Current VGS=10V
50 A
IS* Diode Continuous Forward Current 3 A
TJ Maximum Junction Temperature 150
TSTG Storage Temperature Range -55 to 150 °C
TA=25°C 2 PD* Maximum Power Dissipation
TA=100°C 0.8 W
RθJA* Thermal Resistance-Junction to Ambient 62.5 °C/W Note:
*Surface Mounted on 1in2 pad area, t ≤ 10sec.
APM4472K Symbol Parameter Test Condition
Min. Typ. Max. Unit
Static Characteristics BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 40 V
VDS=32V, VGS=0V 1 IDSS Zero Gate Voltage Drain Current
TJ=85°C 30 µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1.3 2 3 V
IGSS Gate Leakage Current VGS=±20V, VDS=0V ±100 nA
VGS=10V, IDS=12A 7.5 9.5 RDS(ON)
a Drain-Source On-state Resistance VGS=4.5V, IDS=8A 10.5 14
mΩ
Diodes Characteristics b VSD
a Diode Forward Voltage ISD=3A, VGS=0V 0.7 1.1 V
trrb Reverse Recovery Time 30 ns
qrrb Reverse Recovery Charge
ISD=12A, dlSD/dt=100A/µs 31 nC
Copyright ANPEC Electronics Corp.Rev. A.2 - Apr., 2008
APM4472K
www.anpec.com.tw3
Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)
APM4472K Symbol Parameter Test Condition
Min. Typ. Max. Unit
Dynamic Characteristics b RG Gate Resistance VGS=0V,VDS=0V,F=1MHz 1.3 Ω
Ciss Input Capacitance 2600
Coss Output Capacitance 320
Crss Reverse Transfer Capacitance
VGS=0V, VDS=20V, Frequency=1.0MHz 220
pF
td(ON) Turn-on Delay Time 16 30
tr Turn-on Rise Time 13 24
td(OFF) Turn-off Delay Time 57 104
tf Turn-off Fall Time
VDD=20V, RL=20Ω, IDS=1A, VGEN=10V, RG=6Ω
21 39
ns
Gate Charge Characteristics b Qg Total Gate Charge 25 35
Qgs Gate-Source Charge 7
Qgd Gate-Drain Charge
VDS=20V, VGS=4.5V, IDS=12A
12
nC
Notes: a : Pulse test ; pulse width≤300µs, duty cycle≤2%. b : Guaranteed by design, not subject to production testing.
Copyright ANPEC Electronics Corp.Rev. A.2 - Apr., 2008
APM4472K
www.anpec.com.tw4
Typical CharacteristicsID
- D
rain
Cur
rent
(A)
Safe Operation Area
VDS - Drain - Source Voltage (V)
Power Dissipation
Pto
t - P
ower
(W)
Tj - Junction Temperature (°C)
ID -
Dra
in C
urre
nt (A
)
Drain Current
Tj - Junction Temperature (°C)
Thermal Transient Impedance
Square Wave Pulse Duration (sec)
Nor
mal
ized
Tra
nsie
nt T
herm
al R
esis
tanc
e0 20 40 60 80 100 120 140 160
0.0
0.5
1.0
1.5
2.0
2.5
TA=25oC
0 20 40 60 80 100 120 140 1600
2
4
6
8
10
12
14
TA=25oC,V
G=10V
1E-4 1E-3 0.01 0.1 1 10 601E-3
0.01
0.1
1
2
Mounted on 1in2 padR
θJA : 62.5 oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
0.01 0.1 1 10 1000.01
0.1
1
10
100
300µs
1ms
Rds(o
n) L
imit
TC=25oC
10ms
100ms
DC
Copyright ANPEC Electronics Corp.Rev. A.2 - Apr., 2008
APM4472K
www.anpec.com.tw5
Typical Characteristics (Cont.)
VDS - Drain - Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Output Characteristics
RD
S(O
N) -
On
- Res
ista
nce
(mΩ
)
Drain-Source On Resistance
ID - Drain Current (A)
Drain-Source On Resistance
VGS - Gate - Source Voltage (V)
RD
S(O
N) -
On
- Res
ista
nce
(mΩ
)
Tj - Junction Temperature (°C)
Gate Threshold Voltage
Nor
mal
ized
Thr
esho
ld V
olta
ge
0.0 0.5 1.0 1.5 2.0 2.5 3.00
5
10
15
20
25
30
35
40
45
50
3.5V
3V
VGS
=4,4.5,5,6,7,8,9,10V
0 10 20 30 40 505
6
7
8
9
10
11
12
13
14
15
VGS
=10V
VGS
=4.5V
2 3 4 5 6 7 8 9 104
6
8
10
12
14
16
18
20
ID=12A
-50 -25 0 25 50 75 100 125 1500.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6IDS
=250µA
Copyright ANPEC Electronics Corp.Rev. A.2 - Apr., 2008
APM4472K
www.anpec.com.tw6
Typical Characteristics (Cont.)
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
Tj - Junction Temperature (°C) VSD - Source - Drain Voltage (V)
Source-Drain Diode Forward
IS -
Sou
rce
Cur
rent
(A)
VDS - Drain - Source Voltage (V)
C -
Cap
acita
nce
(pF)
Capacitance Gate Charge
QG - Gate Charge (nC)
VG
S -
Gat
e-so
urce
Vol
tage
(V)
-50 -25 0 25 50 75 100 125 1500.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
RON
@Tj=25oC: 7.5mΩ
VGS
= 10V
IDS
= 12A
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.40.2
1
10
50
Tj=150oC
Tj=25oC
0 5 10 15 20 25 300
500
1000
1500
2000
2500
3000
3500
4000
Frequency=1MHz
Crss
Coss
Ciss
0 10 20 30 40 50 600
1
2
3
4
5
6
7
8
9
10V
DS=20V
IDS
=12A
Copyright ANPEC Electronics Corp.Rev. A.2 - Apr., 2008
APM4472K
www.anpec.com.tw7
SOP-8
Package Information
SYMBOL MIN. MAX.
1.75
0.10
0.17 0.25
0.25
A
A1
c
D
E
E1
e
h
L
MILLIMETERS
b 0.31 0.51
SOP-8
0.25 0.50
0.40 1.27
MIN. MAX.
INCHES
0.069
0.004
0.012 0.020
0.007 0.010
0.010 0.020
0.016 0.050
0
0.010
1.27 BSC 0.050 BSC
A2 1.25 0.049
0° 8 ° 0° 8 °
D
e
EE1
SEE VIEW A
cbh
X 4
5°
A
A1
A2
L
VIEW A
0.25
SEATING PLANEGAUGE PLANE
Note: 1. Follow JEDEC MS-012 AA. 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension “E” does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side.
3.80
5.80
4.80
4.00
6.20
5.00 0.189 0.197
0.228 0.244
0.150 0.157
Copyright ANPEC Electronics Corp.Rev. A.2 - Apr., 2008
APM4472K
www.anpec.com.tw8
Application A H T1 C d D W E1 F
330.0±2.00 50 MIN. 12.4+2.00 -0.00
13.0+0.50 -0.20
1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.5±0.05
P0 P1 P2 D0 D1 T A0 B0 K0 SOP-8
4.0±0.10 8.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00
-0.40 6.40±0.20 5.20±0.20 2.10±0.20
Carrier Tape & Reel Dimensions
H
T1
A
d
A
E1
AB
W
F
T
P0OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
Package Type Unit Quantity
SOP-8 Tape & Reel 2500
Devices Per Unit
(mm)
Copyright ANPEC Electronics Corp.Rev. A.2 - Apr., 2008
APM4472K
www.anpec.com.tw9
Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles
Reflow Condition (IR/Convection or VPR Reflow)
Classification Reflow ProfilesProfile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.
Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)
100°C 150°C
60-120 seconds
150°C 200°C
60-180 seconds
Time maintained above: - Temperature (TL) - Time (tL)
183°C 60-150 seconds
217°C 60-150 seconds
Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)
10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.
Reliability Test Program
t 25 C to Peak
tp
Ramp-up
tL
Ramp-downts
Preheat
Tsmax
Tsmin
TL
TP
25
Tem
per
atur
e
Time
Critical ZoneTL to TP
°
Copyright ANPEC Electronics Corp.Rev. A.2 - Apr., 2008
APM4472K
www.anpec.com.tw10
Table 2. Pb-free Process – Package Classification Reflow Temperatures Package Thickness Volume mm3
<350 Volume mm3
350-2000 Volume mm3
>2000 <1.6 mm 260 +0°C* 260 +0°C* 260 +0°C*
1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C* ≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C*
*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures Package Thickness Volume mm3
<350 Volume mm3
≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C
Classification Reflow Profiles (Cont.)
Customer Service
Anpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838Fax : 886-2-2917-3838
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2009
APM4476K
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, andadvise customers to obtain the latest version of relevant information to verify before placing orders.
Ordering and Marking Information
Features
Applications
• 40V/7.5A,
RDS(ON)= 15mΩ (typ.) @ VGS= 10V
RDS(ON)= 22mΩ (typ.) @ VGS= 4.5V• Super High Dense Cell Design• Reliable and Rugged
• Lead Free and Green Devices Available
(RoHS Compliant)
N-Channel MOSFET
Pin Description
• Power Management in Notebook Computer,Portable Equipment and Battery Powered
Systems.
Top View of SOP- 8
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).
DD
D
SS
SG
D
(4)G
S
D DDD
SS
(5, 6, 7, 8)
(1 , 2 , 3)
APM4476
Handling Code
Temperature Range
Package Code
APM4476 K: APM4476XXXXX XXXXX - Date Code
Assembly Material
Package Code K : SOP-8Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material G : Halogen and Lead Free Device
Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2009
APM4476K
www.anpec.com.tw2
Electrical Characteristics (TA = 25°C unless otherwise noted)
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)
Symbol Parameter Rating Unit
VDSS Drain-Source Voltage 40
VGSS Gate-Source Voltage ±20 V
ID* Continuous Drain Current 7.5
IDM* 300µs Pulsed Drain Current VGS=10V
30 A
IS* Diode Continuous Forward Current 3 A
TJ Maximum Junction Temperature 150
TSTG Storage Temperature Range -55 to 150 °C
TA=25°C 2 PD* Maximum Power Dissipation
TA=100°C 0.8 W
RθJA* Thermal Resistance-Junction to Ambient 62.5 °C/W
Note: *Surface Mounted on 1in2 pad area, t ≤ 10sec.
APM4476K Symbol Parameter Test Conditions
Min. Typ. Max. Unit
Static Characteristics
BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 40 - - V
VDS=32V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current
TJ=85°C - - 30 µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1.3 2 2.5 V
IGSS Gate Leakage Current VGS=±16V, VDS=0V - - ±10 µA
VGS=10V, IDS=7.5A - 15 20 RDS(ON)
a Drain-Source On-state Resistance VGS=4.5V, IDS=6A - 22 32
mΩ
Diode Characteristics
VSDa Diode Forward Voltage ISD=3A, VGS=0V - 0.8 1.1 V
trr Reverse Recovery Time - 21 - ns
qrr Reverse Recovery Charge ISD=7.5A, dlSD/dt=100A/µs
- 15 - nC
Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2009
APM4476K
www.anpec.com.tw3
Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)
APM4476K Symbol Parameter Test Conditions
Min. Typ. Max. Unit
Dynamic Characteristics b
RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 4 - Ω
Ciss Input Capacitance - 1050 -
Coss Output Capacitance - 130 -
Crss Reverse Transfer Capacitance
VGS=0V, VDS=20V, Frequency=1.0MHz - 100 -
pF
td(ON) Turn-on Delay Time - 10 19
tr Turn-on Rise Time - 10 19
td(OFF) Turn-off Delay Time - 37 68
tf Turn-off Fall Time
VDD=20V, RL=20Ω, IDS=1A, VGEN=10V, RG=6Ω
- 11 21
ns
Gate Charge Characteristics b
Qg Total Gate Charge - 22.3 31
Qgs Gate-Source Charge - 3.5 -
Qgd Gate-Drain Charge
VDS=20V, VGS=10V, IDS=7.5A
- 3.4 -
nC
Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.
Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2009
APM4476K
www.anpec.com.tw4
Typical Operating Characteristics
ID -
Dra
in C
urre
nt (A
)
Safe Operation Area
VDS - Drain - Source Voltage (V)
Power Dissipation
Pto
t - P
ower
(W)
Tj - Junction Temperature (°C)
ID -
Dra
in C
urre
nt (A
)
Drain Current
Tj - Junction Temperature (°C)
Thermal Transient Impedance
Square Wave Pulse Duration (sec)
Nor
mal
ized
Effe
ctiv
e Tr
ansi
ent
0 20 40 60 80 100 120 140 1600.0
0.5
1.0
1.5
2.0
2.5
TA=25oC
0 20 40 60 80 100 120 140 1600
2
4
6
8
10
TA=25oC,V
G=10V
0.01 0.1 1 10 1000.01
0.1
1
10
100
1s
300µs
1ms
Rds(on
) Lim
it
TC=25oC
10ms
100ms
DC
1E-4 1E-3 0.01 0.1 1 10 601E-3
0.01
0.1
1
2
Mounted on 1in2 padR
θJA : 62.5 oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2009
APM4476K
www.anpec.com.tw5
Typical Operating Characteristics (Cont.)
VDS - Drain - Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Output Characteristics
RD
S(O
N) - O
n - R
esis
tanc
e (m
Ω)
Drain-Source On Resistance
ID - Drain Current (A)
Drain-Source On Resistance
VGS - Gate - Source Voltage (V)
RD
S(O
N) -
On
- Res
ista
nce
(mΩ
)
Tj - Junction Temperature (°C)
Gate Threshold Voltage
Nor
mal
ized
Thr
esho
ld V
olta
ge
0.0 0.5 1.0 1.5 2.0 2.5 3.00
5
10
15
20
25
30
3.5V
3V
VGS
=4,4.5,5,6,7,8,9,10V
0 5 10 15 20 25 308
12
16
20
24
28
32
VGS
=10V
VGS
=4.5V
2 3 4 5 6 7 8 9 1010
15
20
25
30
35
40
ID=7.5A
-50 -25 0 25 50 75 100 125 1500.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6IDS
=250µA
Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2009
APM4476K
www.anpec.com.tw6
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
Tj - Junction Temperature (°C) VSD - Source - Drain Voltage (V)
Source-Drain Diode Forward
IS -
Sou
rce
Cur
rent
(A)
VDS - Drain - Source Voltage (V)
C -
Cap
acita
nce
(pF)
Capacitance Gate Charge
QG - Gate Charge (nC)
VG
S -
Gat
e-S
ourc
e V
olta
ge (V
)
-50 -25 0 25 50 75 100 125 1500.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
RON
@Tj=25oC: 15mΩ
VGS
= 10V
IDS
= 7.5A
0.0 0.3 0.6 0.9 1.2 1.50.2
1
10
30
Tj=150oC
Tj=25oC
0 5 10 15 20 25 30 35 400
200
400
600
800
1000
1200
1400
1600
Frequency=1MHz
CrssCoss
Ciss
0 4 8 12 16 20 240
1
2
3
4
5
6
7
8
9
10V
DS=20V
IDS
=7.5A
Typical Operating Characteristics (Cont.)
Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2009
APM4476K
www.anpec.com.tw7
Package Information
SOP-8D
e
EE1
SEE VIEW A
cb
h X
45°
A
A1
A2
L
VIEW A0.
25
SEATING PLANEGAUGE PLANE
Note: 1. Follow JEDEC MS-012 AA. 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension “E” does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side.
SYMBOL MIN. MAX.
1.75
0.10
0.17 0.25
0.25
A
A1
c
D
E
E1
e
h
L
MILLIMETERS
b 0.31 0.51
SOP-8
0.25 0.50
0.40 1.27
MIN. MAX.
INCHES
0.069
0.004
0.012 0.020
0.007 0.010
0.010 0.020
0.016 0.050
0
0.010
1.27 BSC 0.050 BSC
A2 1.25 0.049
0° 8 ° 0° 8 °
3.80
5.80
4.80
4.00
6.20
5.00 0.189 0.197
0.228 0.244
0.150 0.157
Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2009
APM4476K
www.anpec.com.tw8
Carrier Tape & Reel Dimensions
Application A H T1 C d D W E1 F
330.0±2.00 50 MIN. 12.4+2.00 -0.00
13.0+0.50 -0.20
1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.5±0.05
P0 P1 P2 D0 D1 T A0 B0 K0 SOP-8
4.0±0.10 8.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00
-0.40 6.40±0.20 5.20±0.20 2.10±0.20
(mm)
Devices Per Unit
Package Type Unit Quantity SOP- 8 Type & Reel 2500
H
T1
A
d
A
E1
AB
W
F
T
P0OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2009
APM4476K
www.anpec.com.tw9
Taping Direction InformationSOP-8
USER DIRECTION OF FEED
Classification Profile
Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2009
APM4476K
www.anpec.com.tw10
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts)
100 °C 150 °C
60-120 seconds
150 °C 200 °C
60-120 seconds
Average ramp-up rate (Tsmax to TP) 3 °C/second max. 3°C/second max.
Liquidous temperature (TL) Time at liquidous (tL)
183 °C 60-150 seconds
217 °C 60-150 seconds
Peak package body Temperature (Tp)*
See Classification Temp in table 1 See Classification Temp in table 2
Time (tP)** within 5°C of the specified classification temperature (Tc)
20** seconds 30** seconds
Average ramp-down rate (Tp to Tsmax) 6 °C/second max. 6 °C/second max.
Time 25°C to peak temperature 6 minutes max. 8 minutes max.
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Classification Reflow Profiles
Table 2. Pb-free Process – Classification Temperatures (Tc)
Package Thickness
Volume mm3 <350
Volume mm3 350-2000
Volume mm3 >2000
<1.6 mm 260 °C 260 °C 260 °C 1.6 mm – 2.5 mm 260 °C 250 °C 245 °C
≥2.5 mm 250 °C 245 °C 245 °C
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
Package Thickness
Volume mm3
<350 Volume mm3
≥350
<2.5 mm 235 °C 220 °C
≥2.5 mm 220 °C 220 °C
Reliability Test Program
Test item Method Description SOLDERABILITY JESD-22, B102 5 Sec, 245°C HOLT JESD-22, A108 1000 Hrs, Bias @ 125°C PCT JESD-22, A102 168 Hrs, 100%RH, 2atm, 121°C TCT JESD-22, A104 500 Cycles, -65°C~150°C
Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2009
APM4476K
www.anpec.com.tw11
Customer Service
Anpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838
Fax : 886-2-2917-3838
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. A.1 - Aug., 2008
APM4474K
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.
Ordering and Marking Information
Features
Applications
• 40V/11A,
• RDS(ON)= 9mΩ (typ.) @ VGS= 10V
• RDS(ON)= 18mΩ (typ.) @ VGS= 4.5V
• Super High Dense Cell Design
• Avalanche Rated
• Reliable and Rugged
• SOP-8 Package
• Lead Free and Green Devices Available
• (RoHS Compliant)
N-Channel MOSFET
Pin Description
• Power Management in LCD monitor/TV inverter.
Top View of SOP- 8
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; whichare fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C forMSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogenfree (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm byweight).
DD
D
SS
SG
D
G
S
D DDD
SS
APM4474
Handling Code
Temperature Range
Package Code
APM4474 K : APM4474XXXXX
XXXXX - Date Code
Assembly Material
Package Code K : SOP-8Operating Ambient Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material L : Lead Free Device G : Halogen and Lead Free Device
Copyright ANPEC Electronics Corp.Rev. A.1 - Aug., 2008
APM4474K
www.anpec.com.tw2
Electrical Characteristics (TA = 25°C unless otherwise noted)
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)
Symbol Parameter Rating Unit
VDSS Drain-Source Voltage 40
VGSS Gate-Source Voltage ±20 V
ID* Continuous Drain Current 11
IDM* 300µs Pulsed Drain Current VGS=10V
50 A
IS* Diode Continuous Forward Current 3 A
TJ Maximum Junction Temperature 150
TSTG Storage Temperature Range -55 to 150 °C
TA=25°C 2 PD* Maximum Power Dissipation
TA=100°C 0.8 W
RθJA* Thermal Resistance-Junction to Ambient 62.5 °C/W
Notes:*Surface Mounted on 1in2 pad area, t ≤ 10sec.
APM4474K Symbol Parameter Test Conditions
Min. Typ. Max. Unit
STATIC CHARACTERISTICS
BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 40 - - V
VDS=32V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current
TJ=85°C - - 30 µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1.5 2 2.5 V
IGSS Gate Leakage Current VGS=±20V, VDS=0V - - ±100 nA
VGS=10V, IDS=11A - 9 11 RDS(ON)
a Drain-Source On-state Resistance VGS=4.5V, IDS=7A - 18 23
mΩ
DIODE CHARACTERISTICS
VSDa Diode Forward Voltage ISD=3A, VGS=0V - 0.75 1.1 V
trr Reverse Recovery Time - 26 - ns
qrr Reverse Recovery Charge ISD=11A, dlSD/dt=100A/µs
- 20 - nC
DYNAMIC CHARACTERISTICS b
RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 2.3 - Ω
Ciss Input Capacitance - 1400 -
Coss Output Capacitance - 200 -
Crss Reverse Transfer Capacitance
VGS=0V, VDS=20V, Frequency=1.0MHz - 140 -
pF
td(ON) Turn-on Delay Time - 11 21
tr Turn-on Rise Time - 14 26
td(OFF) Turn-off Delay Time - 57 104
tf Turn-off Fall Time
VDD=20V, RL=20Ω, IDS=1A, VGEN=10V, RG=6Ω
- 30 55
ns
GATE CHARGE CHARACTERISTICS b
Qg Total Gate Charge - 29 41
Qgs Gate-Source Charge - 3.9 -
Qgd Gate-Drain Charge
VDS=20V, VGS=10V, IDS=11A
- 9.3 -
nC
Notes: a : Pulse test ; pulse width≤300µs, duty cycle≤2%. b : Guaranteed by design, not subject to production testing.
Copyright ANPEC Electronics Corp.Rev. A.1 - Aug., 2008
APM4474K
www.anpec.com.tw3
Typical Characteristics
Power Dissipation Drain Current
Pto
t - P
ower
(W
)
Tj - Junction Temperature (oC)
0 20 40 60 80 100 120 140 1600.0
0.5
1.0
1.5
2.0
2.5
TA=25oC
0 20 40 60 80 100 120 140 1600
2
4
6
8
10
12
TA=25oC,VG=10V
Tj - Junction Temperature (oC)
I D -
Dra
in C
urre
nt (A
)
0.01 0.1 1 10 1000.01
0.1
1
10
100
300µs
DC
TC=25oC
1ms
10ms
100ms
1s
Rds(o
n) L
imit
Safe Operation Area
I D -
Dra
in C
urre
nt (A
)
VDS - Drain-Source Voltage (V)
Thermal Transient Impedance
Nor
mal
ized
Effe
ctiv
e T
rans
ient
Square Wave Pulse Duration (sec)
1E-4 1E-3 0.01 0.1 1 10 601E-3
0.01
0.1
1
2
Mounted on 1in2 padRθJA : 62.5oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
Copyright ANPEC Electronics Corp.Rev. A.1 - Aug., 2008
APM4474K
www.anpec.com.tw4
Typical Characteristics (Cont.)
Output Characteristics
I D -
Dra
in C
urre
nt (A
)
VDS - Drain-Source Voltage (V)
Drain-Source On Resistance
RD
S(O
N) -
On
Res
ista
nce
(mΩ
)
ID - Drain Current (A)
Drain-Source On Resistance
RD
S(O
N) -
On
Res
ista
nce
(mΩ
)
VGS - Gate-Source Voltage (V)
Gate Threshold Voltage
Nor
mal
ized
Thr
esho
ld V
olta
ge
Tj - Junction Temperature (°C)
0.0 0.5 1.0 1.5 2.0 2.5 3.00
5
10
15
20
25
30
35
40
45
50
4V
4.5V
3.5V
VGS=5,5.5,6,7,8,9,10V
0 10 20 30 40 500
5
10
15
20
25
30
35
VGS=4.5V
VGS=10V
2 3 4 5 6 7 8 94
8
12
16
20
24
28
32IDS=11A
10 -50 -25 0 25 50 75 100 125 1500.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6IDS=250µA
Copyright ANPEC Electronics Corp.Rev. A.1 - Aug., 2008
APM4474K
www.anpec.com.tw5
Typical Characteristics (Cont.)
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
Tj - Junction Temperature (°C)
Source-Drain Diode Forward
I S -
Sou
rce
Cur
rent
(A
)
VSD - Source-Drain Voltage (V)
Capacitance
C -
Cap
acita
nce
(pF)
Tj - Junction Temperature (oC)
VG
S -
Gat
e-S
ourc
e V
olta
ge (
V)
QG - Gate Charge (nC)
-50 -25 0 25 50 75 100 125 1500.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
RON@Tj=25oC: 9mΩ
VGS=10VIDS=11A
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.40.1
1
10
50
Tj=150oC
Tj=25oC
0 5 10 15 20 25 30 35 400
300
600
900
1200
1500
1800
2100Frequency=1MHz
Coss
Ciss
Crss
Gate Charge
0 5 10 15 20 25 300
1
2
3
4
5
6
7
8
9
10VDS=20VIDS=11A
Copyright ANPEC Electronics Corp.Rev. A.1 - Aug., 2008
APM4474K
www.anpec.com.tw6
Package Information
SOP-8
SYMBOL MIN. MAX.
1.75
0.10
0.17 0.25
0.25
A
A1
c
D
E
E1
e
h
L
MILLIMETERS
b 0.31 0.51
SOP-8
0.25 0.50
0.40 1.27
MIN. MAX.
INCHES
0.069
0.004
0.012 0.020
0.007 0.010
0.010 0.020
0.016 0.050
0
0.010
1.27 BSC 0.050 BSC
A2 1.25 0.049
0° 8 ° 0° 8 °
D
e
EE1
SEE VIEW A
cb
h X
45°
A
A1
A2
L
VIEW A0.
25SEATING PLANEGAUGE PLANE
Note: 1. Follow JEDEC MS-012 AA. 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension “E” does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side.
3.80
5.80
4.80
4.00
6.20
5.00 0.189 0.197
0.228 0.244
0.150 0.157
Copyright ANPEC Electronics Corp.Rev. A.1 - Aug., 2008
APM4474K
www.anpec.com.tw7
Carrier Tape & Reel Dimensions
Application A H T1 C d D W E1 F
330.0±2.00 50 MIN. 12.4+2.00 -0.00
13.0+0.50 -0.20
1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.5±0.05
P0 P1 P2 D0 D1 T A0 B0 K0 SOP-8
4.0±0.10 8.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00
-0.40 6.40±0.20 5.20±0.20 2.10±0.20
(mm)
Devices Per Unit
Package Type Unit Quantity SOP- 8 Type & Reel 2500
H
T1
A
d
A
E1
AB
W
F
T
P0OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
Copyright ANPEC Electronics Corp.Rev. A.1 - Aug., 2008
APM4474K
www.anpec.com.tw8
Reflow Condition (IR/Convection or VPR Reflow)
Reliability Test Program
t 25 C to Peak
tp
Ramp-up
tL
Ramp-downts
Preheat
Tsmax
Tsmin
TL
TP
25
Tem
per
atur
e
Time
Critical ZoneTL to TP
°
Taping Direction Information
USER DIRECTION OF FEED
SOP-8
Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles ESD MIL-STD-883D-3015.7 VHBM > 2KV, VMM > 200V Latch-Up JESD 78 10ms, 1tr > 100mA
Copyright ANPEC Electronics Corp.Rev. A.1 - Aug., 2008
APM4474K
www.anpec.com.tw9
Table 2. Pb-free Process – Package Classification Reflow Temperatures Package Thickness Volume mm3
<350 Volume mm3
350-2000 Volume mm3
>2000 <1.6 mm 260 +0°C* 260 +0°C* 260 +0°C*
1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C* ≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C*
*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures Package Thickness Volume mm3
<350 Volume mm3
≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C
Customer Service
Anpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838
Fax : 886-2-2917-3838
Classification Reflow ProfilesProfile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.
Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)
100°C 150°C
60-120 seconds
150°C 200°C
60-180 seconds
Time maintained above: - Temperature (TL) - Time (tL)
183°C 60-150 seconds
217°C 60-150 seconds
Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)
10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max.
Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. B.2 - Mar., 2008
APM4220KA
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.
Ordering and Marking Information
Features
Applications
• 25V/16A, RDS(ON)=7.5mΩ(typ.) @ VGS=10V RDS(ON)=10mΩ(typ.) @ VGS=4.5V• Super High Dense Cell Design• Avalanche Rated• Reliable and Rugged• Thermal Pad Exposed with Standard SOP-8 Outline• Lead Free and Green Devices Available (RoHS Compliant)
N-Channel MOSFET
SOP−8 Exposed
Pin Description
• Power Management in Notebook Computer,
Portable Equipment and Battery Powered Systems
= Thermal Pad (connected to Drain plane for better heatdissipation)
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).
APM4220
Handling CodeTemp. RangePackage Code
Package Code KA : SOP-8POperating Junction Temp. Range C : -55 to 150 CHandling Code TR : Tape & ReelAssembly Material L : Lead Free Device G : Halogen and Lead Free Device
APM4220 KA : APM4220XXXXX XXXXX - Date Code
Assembly Materialo
G
S
D D(5,6,7,8)
(4)
(1, 2, 3)
DD
SS
S1S2
S3G4
D6D5
D7D8
Copyright ANPEC Electronics Corp.Rev. B.2 - Mar., 2008
APM4220KA
www.anpec.com.tw2
Symbol Parameter Rating Unit
Common Ratings (TA=25°C Unless Otherwise Noted)
VDSS Drain-Source Voltage 25
VGSS Gate-Source Voltage ±20 V
TJ Maximum Junction Temperature 150 °C
TSTG Storage Temperature Range -55 to 150 °C Mounted on Large Heat Sink
TC=25°C 50 PD Maximum Power Dissipation
TC=100°C 20 W
RθJC Thermal Resistance-Junction to Case 2.5 °C/W
Mounted on PCB of 1in2 Pad Areaj TA=25°C 50
IDP 300μs Pulse Drain Current Tested TA=100°C 25
A
TA=25°C 16 ID Continuous Drain Current
TA=100°C 8 A
TA=25°C 3 PD Maximum Power Dissipation
TA=100°C 1.2 W
RθJA Thermal Resistance-Junction to Ambient 40 °C/W
Mounted on PCB of Minimum Footprintk
TA=25°C 50 IDP 300μs Pulse Drain Current Tested
TA=100°C 25 A
TA=25°C 13 ID Continuous Drain Current
TA=100°C 6 A
TA=25°C 2.5 PD Maximum Power Dissipation
TA=100°C 1 W
RθJA Thermal Resistance-Junction to Minimum Footprint 50 °C/W
Absolute Maximum Ratings
j.The value of RθJA is when the device mounted on
1in2 pad with 2oz. Copper, t ≤ 10s.
Notes:
k. The value of RθJA is when the device mounted on
minimum pad with 2oz. Copper, t ≤ 10s.
Copyright ANPEC Electronics Corp.Rev. B.2 - Mar., 2008
APM4220KA
www.anpec.com.tw3
Notes:a: Pulse test ; pulse width ≤300µs, duty cycle ≤ 2%.b: Guaranteed by design, not subject to production testing.
APM4220KA Symbol Parameter Test Condition
Min. Typ. Max. Unit
Drain-Source Avalanche Ratings EAS Avalanche Energy, Single Pulsed ID=15A, VDD=15V 50 mJ
Static Characteristics BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 25 V
VDS=20V, VGS=0V 1
VDS=20V, VGS=0V IDSS Zero Gate Voltage Drain Current
TA=25°C 30
µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1.3 1.8 2.5 V
IGSS Gate Leakage Current VGS=±20V, VDS=0V ±100 nA
VGS=10V, IDS=16A 7.5 9 RDS(ON)
a Drain-Source On-state Resistance VGS=4.5V, IDS=14A 10 12
mΩ
VSDa Diode Forward Voltage ISD=3A, VGS=0V 0.8 1.3 V
Gate Charge Characteristics b Qg Total Gate Charge 20 26
Qgs Gate-Source Charge 4.8
Qgd Gate-Drain Charge
VDS=10V, VGS=4.5V, IDS=12A
8.4
nC
Dynamic Characteristics b RG Gate Resistance VGS=0V, VDS=0V, f=1MHz 2 Ω
Ciss Input Capacitance 1785
Coss Output Capacitance 500
Crss Reverse Transfer Capacitance
VGS=0V, VDS=15V, Frequency=1.0MHz 300
pF
td(ON) Turn-on Delay Time 10 19
Tr Turn-on Rise Time 7 13
td(OFF) Turn-off Delay Time 69 95
Tf Turn-off Fall Time
VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω
32 46
ns
Electrical Characteristics (TA = 25°C unless otherwise noted)
Copyright ANPEC Electronics Corp.Rev. B.2 - Mar., 2008
APM4220KA
www.anpec.com.tw4
1E-4 1E-3 0.01 0.1 1 10 301E-3
0.01
0.1
1
2
Mounted on 1in2 padR
θJA : 40 oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
Typical CharacteristicsID
- D
rain
Cur
rent
(A)
Safe Operation Area
VDS - Drain - Source Voltage (V)
Power Dissipation
Pto
t - P
ower
(W)
Tj - Junction Temperature (°C)
ID -
Dra
in C
urre
nt (A
)
Drain Current
Tj - Junction Temperature (°C)
Thermal Transient Impedance
Square Wave Pulse Duration (sec)
0 20 40 60 80 100 120 140 1600.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0 20 40 60 80 100 120 140 1600
3
6
9
12
15
18
0.01 0.1 1 10 1000.01
0.1
1
10
100
Rds(o
n) L
imit
1s
TA=25OC
10ms
300µs
1ms
100ms
DC
Nor
mal
ized
Tra
nsie
nt T
herm
al R
esis
tanc
e
Copyright ANPEC Electronics Corp.Rev. B.2 - Mar., 2008
APM4220KA
www.anpec.com.tw5
Typical Characteristics (Cont.)
VDS - Drain - Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Output Characteristics
RD
S(O
N) -
On
- Res
ista
nce
(mΩ
)
Drain-Source On Resistance
ID - Drain Current (A)
Transfer Characteristics
VGS - Gate - Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Tj - Junction Temperature (°C)
Gate Threshold Voltage
Nor
mal
ized
Thr
esho
ld V
olta
ge
0 2 4 6 8 100
10
20
30
40
50
VGS
=4,5,6,7,8,9,10V
3V
2.5V
0 10 20 30 40 500
2
4
6
8
10
12
14
16
18
VGS
=10V
VGS
=4.5V
0 1 2 3 4 50
10
20
30
40
50
Tj=125oC
Tj=25oC T
j=-55oC
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6IDS
=250µA
Copyright ANPEC Electronics Corp.Rev. B.2 - Mar., 2008
APM4220KA
www.anpec.com.tw6
Typical Characteristics (Cont.)
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
Tj - Junction Temperature (°C) VSD - Source - Drain Voltage (V)
Source-Drain Diode Forward
IS -
Sou
rce
Cur
rent
(A)
VDS - Drain - Source Voltage (V)
C -
Cap
acita
nce
(pF)
Capacitance Gate Charge
QG - Gate Charge (nC)
VG
S -
Gat
e-so
urce
Vol
tage
(V)
-50 -25 0 25 50 75 100 125 1500.00
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
RON
@Tj=25oC: 7.5mΩ
VGS
= 10V
IDS
= 12A
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.60.1
1
10
50
Tj=150oC
Tj=25oC
0 5 10 15 20 250
500
1000
1500
2000
2500
3000
Frequency=1MHz
Coss
Ciss
Crss
0 5 10 15 20 25 30 35 400
1
2
3
4
5
6
7
8
9
10V
DS=10V
ID = 12A
Copyright ANPEC Electronics Corp.Rev. B.2 - Mar., 2008
APM4220KA
www.anpec.com.tw7
td (on) tr td (off) t f
V GS
V DS
90%
10%
Avalanche Test Circuit and Waveforms
Switching Time Test Circuit and Waveforms
DUT
0.01Ωtp
V D D
V DSL
IL
RG
V DD
RD
DUT
V GS
V DS
RG
tp
EAS
V D D
tA V
IAS
V D S
tpV DSX(SU S)
Copyright ANPEC Electronics Corp.Rev. B.2 - Mar., 2008
APM4220KA
www.anpec.com.tw8
Package Information
SOP-8P
0.020
0.010
0.020
0.050
0.006
0.063
MAX.
0.40L
0
E
e
h
E1
0.25
D
c
b
0.17
0.31
0.0161.27
0.50
1.27 BSC
0.51
0.25
0.050 BSC
0.010
0.012
0.007
MILLIMETERS
MIN.
SYMBOL
A1
A2
A
0.00
1.25
SOP-8P
MAX.
0.15
1.60
MIN.
0.000
0.049
INCHES
D1 2.25 0.098
2.00 0.079E2
3.50
3.00
0.138
0.118
8o 0o 8o0o
h X
45°
D
e
EE1
SEE VIEWA
cb
D1
E2THERMAL
PAD
A
0L
VIEW A
0.25
SEATING PLANEGAUGE PLANE
A1
A2
Inter-lead flash and protrusions shall not exceed 10 mil per side.
Note : 1. Follow JEDEC MS-012 BA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "E" does not include inter-lead flash or protrusions.
4.80 5.00
5.80 6.20
3.80 4.00
0.2440.228
0.1570.150
0.1970.189
Copyright ANPEC Electronics Corp.Rev. B.2 - Mar., 2008
APM4220KA
www.anpec.com.tw9
Application A H T1 C d D W E1 F
330.0±2.00 50 MIN. 12.4+2.00 -0.00
13.0+0.50 -0.20
1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.5±0.05
P0 P1 P2 D0 D1 T A0 B0 K0 SOP-8P
4.0±0.10 8.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00
-0.40 6.40±0.20 5.20±0.20 2.10±0.20
Carrier Tape & Reel Dimensions
Package Type Unit Quantity
SOP-8P Tape & Reel 2500
Devices Per Unit
(mm)
H
T1
A
d
A
E1
AB
W
F
T
P0OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
Copyright ANPEC Electronics Corp.Rev. B.2 - Mar., 2008
APM4220KA
www.anpec.com.tw10
Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles
Reflow Condition (IR/Convection or VPR Reflow)
Classification Reflow ProfilesProfile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.
Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)
100°C 150°C
60-120 seconds
150°C 200°C
60-180 seconds
Time maintained above: - Temperature (TL) - Time (tL)
183°C 60-150 seconds
217°C 60-150 seconds
Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)
10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.
Reliability Test Program
t 25 C to Peak
tp
Ramp-up
tL
Ramp-downts
Preheat
Tsmax
Tsmin
TL
TP
25
Tem
per
atur
e
Time
Critical ZoneTL to TP
°
Copyright ANPEC Electronics Corp.Rev. B.2 - Mar., 2008
APM4220KA
www.anpec.com.tw11
Table 2. Pb-free Process – Package Classification Reflow Temperatures Package Thickness Volume mm3
<350 Volume mm3
350-2000 Volume mm3
>2000 <1.6 mm 260 +0°C* 260 +0°C* 260 +0°C*
1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C* ≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C*
*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures Package Thickness Volume mm3
<350 Volume mm3
≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C
Classification Reflow Profiles (Cont.)
Customer Service
Anpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838Fax : 886-2-2917-3838
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. A.2 - Jul., 2008
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.
APM4350KP
APM4350
Handling CodeTemperature RangePackage Code
Package Code KP : KPAKOperating Junction Temperature Range C : -55 to 150 CHandling Code TR : Tape & ReelAssembly Material L : Lead Free Device
G : Halogen and Lead Free Device
APM4350 KP : APM4350XXXXX
XXXXX - Date Code
Assembly Material
Features
Applications
Pin Description
Ordering and Marking InformationN-Channel MOSFET
• 30V/60A,
RDS(ON) =7.5mΩ (typ.) @ VGS = 10VRDS(ON) =11.5mΩ (typ.) @ VGS = 4.5V
• Super High Dense Cell Design
• Avalanche Rated
• Reliable and Rugged
• Lead Free and Green Devices Available
(RoHS Compliant)
• Power Management in Notebook Computer, or
Decktop Computer.
°
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).
S
SG
S
DDD
D
G
D
SSS
D D D
Copyright ANPEC Electronics Corp.Rev. A.2 - Jul., 2008
www.anpec.com.tw2
APM4350KP
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)
Symbol Parameter Rating Unit
Common Ratings (TA=25°C Unless Otherwise Noted)
VDSS Drain-Source Voltage 30
VGSS Gate-Source Voltage ±20 V
TJ Maximum Junction Temperature 150 °C
TSTG Storage Temperature Range -55 to 150 °C IS Diode Continuous Forward Current TC=25°C 50 A
TC=25°C 140 IDP 300µs Pulse Drain Current Tested
TC=100°C 80 A
Mounted on Large Heat Sink
TC=25°C 60 ID Continuous Drain Current
TC=100°C 35 A
TC=25°C 50 PD Maximum Power Dissipation
TC=100°C 20 W
RθJC Thermal Resistance-Junction to Case 2.5 °C/W
Mounted on PCB of 1in2 pad area
TA=25°C 13.5 ID Continuous Drain Current
TA=100°C 8.5 A
TA=25°C 2.5 PD Maximum Power Dissipation
TA=100°C 1 W
RθJA Thermal Resistance-Junction to Ambient 50 °C/W
Mounted on PCB of Minimum Footprint
TA=25°C 10 ID Continuous Drain Current
TA=100°°C 6 A
TA=25°C 1.5 PD Maximum Power Dissipation
TA=100°C 0.5 W
RθJA Thermal Resistance-Junction to Ambient 75 °C/W
Copyright ANPEC Electronics Corp.Rev. A.2 - Jul., 2008
www.anpec.com.tw3
APM4350KP
Electrical Characteristics (TA = 25°C Unless Otherwise Noted)
APM4350KP Symbol Parameter Test Conditions
Min. Typ. Max. Unit
Static Characteristics BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 30 V
VDS=24V, VGS=0V 1 IDSS Zero Gate Voltage Drain Current
Tj=85°C 30 µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1.3 1.8 2.5 V
IGSS Gate Leakage Current VGS=±20V, VDS=0V ±100 nA
VGS=10V, IDS=30A 7.5 9 RDS(ON)
a Drain-Source On-state Resistance VGS=4.5V, IDS=15A 11.5 14.5
mΩ
Diode Characteristics
VSDa Diode Forward Voltage ISD=15A, VGS=0V 0.75 1.1 V
trr Reverse Recovery Time 11 ns
Qrr Reverse Recovery Charge IDS=15A, dlSD/dt=100A/µs
3 nC
Gate Charge Characteristics b Qg Total Gate Charge 28 39
Qgs Gate-Source Charge 4
Qgd Gate-Drain Charge
VDS=15V, VGS=10V, IDS=30A
9
nC
Dynamic Characteristics b RG Gate Resistance VGS=0V,VDS=0V,F=1MHz 1.6 Ω
Ciss Input Capacitance 1660
Coss Output Capacitance 260
Crss Reverse Transfer Capacitance
VGS=0V, VDS=15V, Frequency=1.0MHz 170
pF
td(ON) Turn-on Delay Time 18 33
tr Turn-on Rise Time 15 28
td(OFF) Turn-off Delay Time 47 86
tf Turn-off Fall Time
VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω
22 41
ns
Note: a : Pulse test ; pulse width≤300µs, duty cycle≤2%. b : Guaranteed by design, not subject to production testing.
Copyright ANPEC Electronics Corp.Rev. A.2 - Jul., 2008
www.anpec.com.tw4
APM4350KP
Typical Characteristics
ID -
Dra
in C
urre
nt (A
)
Drain Current
Tj - Junction Temperature (°C)
Safe Operation Area
VDS - Drain - Source Voltage (V)
Thermal Transient Impedance
Square Wave Pulse Duration (sec)
Power Dissipation
Pto
t - P
ower
(W)
Tj - Junction Temperature (°C)
ID -
Dra
in C
urre
nt (A
)
Nor
mal
ized
Tra
nsie
nt T
herm
al R
esis
tanc
e
1E-4 1E-3 0.01 0.1 1 10 1000.01
0.1
1
2
Mounted on 1in2 padR
θJA :50oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
0 20 40 60 80 100 120 140 1600
10
20
30
40
50
60
TC=25oC
0 20 40 60 80 100 120 140 1600
10
20
30
40
50
60
70
TC=25oC,V
G=10V
0.1 1 10 800.1
1
10
100
400
TC=25oC
1ms
1s
10ms
100ms
DC
Rds(on
) Lim
it
Copyright ANPEC Electronics Corp.Rev. A.2 - Jul., 2008
www.anpec.com.tw5
APM4350KP
RD
S(O
N) -
On
- Res
ista
nce
(mΩ
)
Drain-Source On Resistance
ID - Drain Current (A)
Tj - Junction Temperature (°C)
Gate Threshold Voltage
VDS - Drain-Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Output Characteristics
Gate-Source On Resistance
VGS - Gate - Source Voltage (V)
RD
S(O
N) -
On
- Res
ista
nce
(mΩ
)
Nor
mal
ized
Thr
esho
ld V
olta
ge
Typical Characteristics (Cont.)
0.0 0.5 1.0 1.5 2.0 2.5 3.00
20
40
60
80
100
120
5.5V
4.5V
3.5V
4V
3V
5VV
GS= 6,7,8,9,10V
0 20 40 60 80 100 1202
4
6
8
10
12
14
16
18
20
VGS
=10V
VGS
=4.5V
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
IDS
=250µA
1 2 3 4 5 6 7 8 9 104
6
8
10
12
14
16
18
ID=30A
Copyright ANPEC Electronics Corp.Rev. A.2 - Jul., 2008
www.anpec.com.tw6
APM4350KP
VDS - Drain - Source Voltage (V)
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
Tj - Junction Temperature (°C)
C -
Cap
acita
nce
(pF)
VSD - Source - Drain Voltage (V)
Source-Drain Diode Forward
IS -
Sou
rce
Cur
rent
(A)
Capacitance Gate Charge
QG - Gate Charge (nC)
VG
S -
Gat
e - s
ourc
e V
olta
ge (V
)
Typical Characteristics (Cont.)
0.0 0.3 0.6 0.9 1.2 1.5 1.80.2
1
10
100
Tj=150oC
Tj=25oC
0 5 10 15 20 25 300
500
1000
1500
2000
2500
Frequency=1MHz
Crss
Coss
Ciss
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
RON
@Tj=25oC: 7.5mΩ
VGS = 10V IDS = 30A
0 5 10 15 20 25 300
2
4
6
8
10V
DS= 15V
IDS
= 30A
Copyright ANPEC Electronics Corp.Rev. A.2 - Jul., 2008
www.anpec.com.tw7
APM4350KP
Avalanche Test Circuit and Waveforms
DUT
0.01Ωtp
VDD
VDSL
IL
RG
Switching Time Test Circuit and Waveforms
VDD
RD
DUT
VGS
VDS
RG
tp
td(on) tr td(off) tf
VGS
VDS90%
10%
Copyright ANPEC Electronics Corp.Rev. A.2 - Jul., 2008
www.anpec.com.tw8
APM4350KP
Package InformationKPAK
SYMBOL MIN. MAX.
1.20
0.38
4.80 5.00
5.90 6.10
5.70 5.80
0.05
3.49 3.69
A
B
D
E
E1
e
F
F1
G
H
MILLIMETERS
C 0.19 0.25
1.27 BSC
KPAK
0.35 0.45
MIN. MAX.
INCHES
0.047
0.015
0.050 BSC
0.007 0.010
0.189 0.197
0.232 0.240
0.224 0.228
0.002
0.014 0.018
0.137 0.145
1.00 0.039
0.51 0.020
0.15 0.006
G1
K 1.60 0.063
0.05 0.15 0.002 0.006
0.0180.0140.450.35
E1
E
F1
G1
GK
F
H
Be
D
C
A
Copyright ANPEC Electronics Corp.Rev. A.2 - Jul., 2008
www.anpec.com.tw9
APM4350KP
Carrier Tape & Reel Dimensions
Application A H T1 C d D W E1 F
330.0±2.00 50 MIN. 12.4+2.00
-0.00 13.0+0.50 -0.20
1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.5±0.10
P0 P1 P2 D0 D1 T A0 B0 K0 KPAK
4.0±0.10 8.0±0.10 2.0±0.10 1.5+0.10 -0.00 1.5 MIN. 0.3±0.05 6.5±0.10 5.3±0.10 1.4±0.10
Devices Per Unit
Package Type Unit Quantity
KPAK Tape & Reel 2500
(mm)
H
T1
A
d
A
E1
AB
W
F
T
P0OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
Copyright ANPEC Electronics Corp.Rev. A.2 - Jul., 2008
www.anpec.com.tw10
APM4350KP
Reflow Condition (IR/Convection or VPR Reflow)
Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 SEC HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B,A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles
Reliability Test Program
Classification Reflow ProfilesProfile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.
Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)
100°C 150°C
60-120 seconds
150°C 200°C
60-180 seconds
Time maintained above: - Temperature (TL) - Time (tL)
183°C 60-150 seconds
217°C 60-150 seconds
Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)
10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.
t 25 C to Peak
tp
Ramp-up
tL
Ramp-downts
Preheat
Tsmax
Tsmin
TL
TP
25
Tem
per
atu
re
Time
Critical ZoneTL to TP
°
Copyright ANPEC Electronics Corp.Rev. A.2 - Jul., 2008
www.anpec.com.tw11
APM4350KP
Customer Service
Classification Reflow Profiles (Con.)
Anpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, TaiwanTel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindian City, Taipei County 23146, TaiwanTel : 886-2-2910-3838Fax : 886-2-2917-3838
Table 2. Pb-free Process – Package Classification Reflow Temperatures Package Thickness Volume mm3
<350 Volume mm3
350-2000 Volume mm3
>2000 <1.6 mm 260 +0°C* 260 +0°C* 260 +0°C*
1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C* ≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C*
*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures Package Thickness Volume mm3
<350 Volume mm3
≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. A.2 - Jan., 2009
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.
APM4354KP
Features
Applications
Pin Description
Ordering and Marking Information
N-Channel MOSFET
• 30V/70A,
RDS(ON) =4.5mΩ (typ.) @ VGS = 10VRDS(ON) =6mΩ (typ.) @ VGS = 4.5V
• Super High Dense Cell Design
• Avalanche Rated
• Reliable and Rugged
• Lead Free and Green Devices Available
(RoHS Compliant)
Top View of KPAK
• Power Management in Notebook Computer, or
Decktop Computer.
SS
SG
DD D D
G
D
SSS
D D D
APM4354
Handling CodeTemperature RangePackage Code
Package Code KP : KPAKOperating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material G : Halogen and Lead Free Device
APM4354 KP : APM4354XXXXX
XXXXX - Date Code
Assembly Material
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).
Copyright ANPEC Electronics Corp.Rev. A.2 - Jan., 2009
www.anpec.com.tw2
APM4354KP
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)
Symbol Parameter Rating Unit
Common Ratings (TA=25°C Unless Otherwise Noted)
VDSS Drain-Source Voltage 30
VGSS Gate-Source Voltage ±20 V
TJ Maximum Junction Temperature 150 °C
TSTG Storage Temperature Range -55 to 150 °C IS Diode Continuous Forward Current TC=25°C 50 A
TC=25°C 150 IDP 300µs Pulse Drain Current Tested
TC=100°C 90 A
Mounted on Large Heat Sink
TC=25°C 70 ID Continuous Drain Current
TC=100°C 40 A
TC=25°C 50 PD Maximum Power Dissipation
TC=100°C 20 W
RθJC Thermal Resistance-Junction to Case 2.5 °C/W
Mounted on PCB of 1in2 pad area
TA=25°C 17 ID Continuous Drain Current
TA=100°C 11 A
TA=25°C 2.5 PD Maximum Power Dissipation
TA=100°C 1 W
RθJA Thermal Resistance-Junction to Ambient 50 °C/W
Mounted on PCB of Minimum Footprint
TA=25°C 14 ID Continuous Drain Current
TA=100°C 8 A
TA=25°C 1.5 PD Maximum Power Dissipation
TA=100°C 0.5 W
RθJA Thermal Resistance-Junction to Ambient 75 °C/W
Copyright ANPEC Electronics Corp.Rev. A.2 - Jan., 2009
www.anpec.com.tw3
APM4354KP
Electrical Characteristics (TA = 25°C unless otherwise noted)
APM4354KP Symbol Parameter Test Conditions
Min. Typ. Max. Unit
Static Characteristics
BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 30 - - V
VDS=24V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current
Tj=85°C - - 30 µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1.3 1.8 2.5 V
IGSS Gate Leakage Current VGS=±20V, VDS=0V - - ±100 nA
VGS=10V, IDS=30A - 4.5 5.5 RDS(ON)
a Drain-Source On-state Resistance VGS=4.5V,IDS=20A - 6 8
mΩ
Diode Characteristics
VSDa Diode Forward Voltage ISD=20A, VGS=0V - 0.75 1.1 V
trr Reverse Recovery Time - 36 - ns
Qrr Reverse Recovery Charge IDS=20A, dlSD/dt=100A/µs
- 29 - nC
Gate Charge Characteristics b
Qg Total Gate Charge - 63 88
Qgs Gate-Source Charge - 10 -
Qgd Gate-Drain Charge
VDS=15V, VGS=10V, IDS=30A
- 19 -
nC
Dynamic Characteristics b
RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 1 - Ω
Ciss Input Capacitance - 3350 -
Coss Output Capacitance - 425 -
Crss Reverse Transfer Capacitance
VGS=0V, VDS=15V, Frequency=1.0MHz - 330 -
pF
td(ON) Turn-on Delay Time - 24 44
tr Turn-on Rise Time - 23 42
td(OFF) Turn-off Delay Time - 73 132
tf Turn-off Fall Time
VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω
- 27 50
ns
Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.
Copyright ANPEC Electronics Corp.Rev. A.2 - Jan., 2009
www.anpec.com.tw4
APM4354KP
Typical Operating Characteristics
ID -
Dra
in C
urre
nt (A
)
Drain Current
Tj - Junction Temperature (°C)
Safe Operation Area
VDS - Drain - Source Voltage (V)
Thermal Transient Impedance
Square Wave Pulse Duration (sec)
Power Dissipation
Pto
t - P
ower
(W)
Tj - Junction Temperature (°C)
ID -
Dra
in C
urre
nt (A
)
Nor
mal
ized
Tra
nsie
nt T
herm
al R
esis
tanc
e
0 20 40 60 80 100 120 140 1600
10
20
30
40
50
60
TC=25oC
0 20 40 60 80 100 120 140 1600
10
20
30
40
50
60
70
80
TC=25oC,V
G=10V
0.1 1 10 800.1
1
10
100
400
TC=25oC
1ms
1s
10ms
100ms
DC
Rds(on
) Lim
it
1E-4 1E-3 0.01 0.1 1 10 1001E-3
0.01
0.1
1
2
Mounted on 1in2 padR
θJA :50oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
Copyright ANPEC Electronics Corp.Rev. A.2 - Jan., 2009
www.anpec.com.tw5
APM4354KP
RD
S(O
N) -
On
- Res
ista
nce
(mΩ
)
Drain-Source On Resistance
ID - Drain Current (A)
Tj - Junction Temperature (°C)
Gate Threshold Voltage
VDS - Drain-Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Output Characteristics
Gate-Source On Resistance
VGS - Gate - Source Voltage (V)
RD
S(O
N) -
On
- Res
ista
nce
(mΩ
)
Nor
mal
ized
Thr
esho
ld V
olta
ge
Typical Operating Characteristics (Cont.)
0 30 60 90 120 1500
2
4
6
8
10
12
VGS
=10V
VGS
=4.5V
1 2 3 4 5 6 7 8 9 100
2
4
6
8
10
12
14
16
ID=30A
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6IDS
=250µA
0.0 0.5 1.0 1.5 2.0 2.5 3.00
30
60
90
120
150
4.5V
3.5V
4V
3V
VGS
= 5,6,7,8,9,10V
Copyright ANPEC Electronics Corp.Rev. A.2 - Jan., 2009
www.anpec.com.tw6
APM4354KP
VDS - Drain - Source Voltage (V)
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
Tj - Junction Temperature (°C)
C -
Cap
acita
nce
(pF)
VSD - Source - Drain Voltage (V)
Source-Drain Diode Forward
IS -
Sou
rce
Cur
rent
(A)
Capacitance Gate Charge
QG - Gate Charge (nC)
VG
S -
Gat
e - s
ourc
e V
olta
ge (V
)
Typical Operating Characteristics (Cont.)
-50 -25 0 25 50 75 100 125 1500.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
VGS
= 10V
IDS
= 30A
RON
@Tj=25oC: 4.5mΩ
0.0 0.3 0.6 0.9 1.2 1.5 1.81
10
100
200
Tj=150oC
Tj=25oC
0 5 10 15 20 25 300
500
1000
1500
2000
2500
3000
3500
4000
4500
5000
Frequency=1MHz
CrssCoss
Ciss
0 10 20 30 40 50 60 700
1
2
3
4
5
6
7
8
9
10V
DS= 15V
ID= 30A
Copyright ANPEC Electronics Corp.Rev. A.2 - Jan., 2009
www.anpec.com.tw7
APM4354KP
Avalanche Test Circuit and Waveforms
DUT
0.01Ωtp
VDD
VDSL
IL
RG
EAS
VDD
tAV
IAS
VDS
tpVDSX(SUS)
Switching Time Test Circuit and Waveforms
VDD
RD
DUT
VGS
VDS
RG
tp
td(on) tr td(off) tf
VGS
VDS90%
10%
Copyright ANPEC Electronics Corp.Rev. A.2 - Jan., 2009
www.anpec.com.tw8
APM4354KP
Package InformationKPAK
SYMBOL MIN. MAX.
1.20
0.38
4.80 5.00
5.90 6.10
5.70 5.80
0.05
3.49 3.69
A
B
D
E
E1
e
F
F1
G
H
MILLIMETERS
C 0.19 0.25
1.27 BSC
KPAK
0.35 0.45
MIN. MAX.
INCHES
0.047
0.015
0.050 BSC
0.007 0.010
0.189 0.197
0.232 0.240
0.224 0.228
0.002
0.014 0.018
0.137 0.145
1.00 0.039
0.51 0.020
0.15 0.006
G1
K 1.60 0.063
0.05 0.15 0.002 0.006
0.0180.0140.450.35
E1
E
F1
G1
GK
F
H
Be
D
C
A
Copyright ANPEC Electronics Corp.Rev. A.2 - Jan., 2009
www.anpec.com.tw9
APM4354KP
Carrier Tape & Reel Dimensions
A
E1
AB
W
F
T
P0OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
H
T1
A
d
Application A H T1 C d D W E1 F
330.0±2.00 50 MIN. 12.4+2.00 -0.00
13.0+0.50 -0.20
1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.5±0.10
P0 P1 P2 D0 D1 T A0 B0 K0 KPAK
4.0±0.10 8.0±0.10 2.0±0.10 1.5+0.10 -0.00 1.5 MIN. 0.3±0.05 6.5±0.10 5.3±0.10 1.4±0.10
(mm)
Devices Per Unit
Package Type Unit Quantity
KPAK Tape & Reel 2500
Copyright ANPEC Electronics Corp.Rev. A.2 - Jan., 2009
www.anpec.com.tw10
APM4354KP
Taping Direction InformationKPAK
Reflow Condition (IR/Convection or VPR Reflow)
t 25 C to Peak
tp
Ramp-up
tL
Ramp-downts
Preheat
Tsmax
Tsmin
TL
TP
25
Tem
per
atur
e
Time
Critical ZoneTL to TP
°
Reliability Test Program
Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles
USER DIRECTION OF FEED
Copyright ANPEC Electronics Corp.Rev. A.2 - Jan., 2009
www.anpec.com.tw11
APM4354KP
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.
Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)
100°C 150°C
60-120 seconds
150°C 200°C
60-180 seconds
Time maintained above: - Temperature (TL) - Time (tL)
183°C 60-150 seconds
217°C 60-150 seconds
Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)
10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max.
Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.
Classification Reflow Profiles
Table 2. Pb-free Process – Package Classification Reflow Temperatures
Package Thickness Volume mm3 <350
Volume mm3 350-2000
Volume mm3 >2000
<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*
≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures
Package Thickness Volume mm3
<350 Volume mm3
≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C
Customer Service
Anpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838
Fax : 886-2-2917-3838
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. A.1 - May, 2007
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.
APM4356KP
Features
Applications
Pin Description
Ordering and Marking Information
N-Channel
• 30V/80A,
RDS(ON) = 3.3mΩ (typ.) @ VGS = 10VRDS(ON) = 4.5mΩ (typ.) @ VGS = 4.5V
• Super High Dense Cell Design
• Avalanche Rated
• Reliable and Rugged
• Lead Free Available (RoHS Compliant)
Top View of KPAK
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte in platetermination finish; which are fully compliant with RoHS and compatible with both SnPb and lead-free solderingoperations. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C
S
GS
S
DD
DD
S
GS
S
DD
DD
for MSL classification at lead-free peak reflow temperature.
• Power Management in Notebook Computer, or
Decktop Computer.
G
S
D DDD
SS
APM4356
Handling CodeTemp. RangePackage Code
Package Code KP : KPAKOperating Junction Temp. Range C : -55 to 150 CHandling Code TR : Tape & Reel TU : TubeLead Free Code L : Lead Free Device
APM4356 KP : APM4356XXXXX
XXXXX - Date Code
Lead Free Code°
Copyright ANPEC Electronics Corp.Rev. A.1 - May, 2007
www.anpec.com.tw2
APM4356KP
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)
Symbol Parameter Rating Unit
Common Ratings (TA=25°C Unless Otherwise Noted)
VDSS Drain-Source Voltage 30
VGSS Gate-Source Voltage ±20 V
TJ Maximum Junction Temperature 150 °C
TSTG Storage Temperature Range -55 to 150 °C IS Diode Continuous Forward Current TC=25°C 50 A
TC=25°C 180 IDP 300µs Pulse Drain Current Tested
TC=100°C 90 A
Mounted on Large Heat Sink
TC=25°C 80 ID Continuous Drain Current
TC=100°C 45 A
TC=25°C 50 PD Maximum Power Dissipation
TC=100°C 20 W
RθJC Thermal Resistance-Junction to Case 2.5 °C/W
Mounted on PCB of 1in2 pad area
TA=25°C 20 ID Continuous Drain Current
TA=100°C 12 A
TA=25°C 2.5 PD Maximum Power Dissipation
TA=100°C 1 W
RθJA Thermal Resistance-Junction to Ambient 50 °C/W
Mounted on PCB of Minimum Footprint
TA=25°C 15 ID Continuous Drain Current
TA=100°C 10 A
TA=25°C 1.5 PD Maximum Power Dissipation
TA=100°C 0.5 W
RθJA Thermal Resistance-Junction to Ambient 75 °C/W
Copyright ANPEC Electronics Corp.Rev. A.1 - May, 2007
www.anpec.com.tw3
APM4356KP
Electrical Characteristics (TA = 25°C unless otherwise noted)
APM4356KP Symbol Parameter Test Condition
Min. Typ. Max. Unit
Static Characteristics
BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 30 V
VDS=24V, VGS=0V 1 IDSS Zero Gate Voltage Drain Current
TJ=85°C 30 µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1.3 1.8 2.5 V
IGSS Gate Leakage Current VGS=±20V, VDS=0V ±100 nA
VGS=10V, IDS=40A 3.3 4 RDS(ON)
a Drain-Source On-state Resistance VGS=4.5V,IDS=20A 4.5 5.8
mΩ
Diode Characteristics
VSDa Diode Forward Voltage ISD=20A, VGS=0V 0.75 1.1 V
trr Reverse Recovery Time 54 ns
Qrr Reverse Recovery Charge IDS=20A, dlSD/dt=100A/µs
30 nC
Gate Charge Characteristics b
Qg Total Gate Charge 100 140
Qgs Gate-Source Charge 11
Qgd Gate-Drain Charge
VDS=15V, VGS=10V, IDS=40A
20
nC
Dynamic Characteristics b
RG Gate Resistance VGS=0V,VDS=0V, F=1MHz 1.1 Ω
C iss Input Capacitance 5860
Coss Output Capacitance 900
Crss Reverse Transfer Capacitance
VGS=0V, VDS=15V, Frequency=1.0MHz 680
pF
td(ON) Turn-on Delay Time 27 50
tr Turn-on Rise Time 20 37
td(OFF) Turn-off Delay Time 128 231
tf Turn-off Fall Time
VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω
58 105
ns
Note: a : Pulse test ; pulse width≤300µs, duty cycle≤2%. b : Guaranteed by design, not subject to production testing.
Copyright ANPEC Electronics Corp.Rev. A.1 - May, 2007
www.anpec.com.tw4
APM4356KP
Typical Characteristics
ID -
Dra
in C
urre
nt (A
)
Drain Current
Tj - Junction Temperature (°C)
Safe Operation Area
VDS - Drain - Source Voltage (V)
Thermal Transient Impedance
Square Wave Pulse Duration (sec)
Power Dissipation
Pto
t - P
ower
(W)
Tj - Junction Temperature (°C)
ID -
Dra
in C
urre
nt (A
)
Nor
mal
ized
Tra
nsie
nt T
herm
al R
esis
tanc
e
0 20 40 60 80 100 120 140 1600
10
20
30
40
50
60
TC=25oC
1E-4 1E-3 0.01 0.1 1 10 1001E-3
0.01
0.1
1
2
Mounted on 1in2 padR
θJA :50oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
0 20 40 60 80 100 120 140 1600
20
40
60
80
100
TC=25oC,V
G=10V
0.01 0.1 1 10 1000.1
1
10
100
500
TC=25oC
1ms
1s
10ms
100ms
DC
Rds(on
) Lim
it
Copyright ANPEC Electronics Corp.Rev. A.1 - May, 2007
www.anpec.com.tw5
APM4356KP
RD
S(O
N) -
On
- Res
ista
nce
(mΩ
)
Drain-Source On Resistance
ID - Drain Current (A)
Tj - Junction Temperature (°C)
Gate Threshold Voltage
VDS - Drain-Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Output Characteristics
Drain-Source On Resistance
VGS - Gate - Source Voltage (V)
RD
S(O
N) -
On
- Res
ista
nce
(mΩ
)
Nor
mal
ized
Thr
esho
ld V
olta
ge
Typical Characteristics (Cont.)
2 3 4 5 6 7 8 9 101
2
3
4
5
6
7
8
9
10
ID=40A
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6IDS
=250µA
0.0 0.5 1.0 1.5 2.0 2.5 3.00
20
40
60
80
100
120
140
160
180
3.5V
4V
3V
VGS
= 4.5,5,6,7,8,9,10V
0 30 60 90 120 150 1801
2
3
4
5
6
7
8
VGS
=10V
VGS
=4.5V
Copyright ANPEC Electronics Corp.Rev. A.1 - May, 2007
www.anpec.com.tw6
APM4356KP
VDS - Drain - Source Voltage (V)
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
Tj - Junction Temperature (°C)
C -
Cap
acita
nce
(pF)
VSD - Source - Drain Voltage (V)
Source-Drain Diode Forward
IS -
Sou
rce
Cur
rent
(A)
Capacitance Gate Charge
QG - Gate Charge (nC)
VG
S -
Gat
e - s
ourc
e V
olta
ge (V
)
Typical Characteristics (Cont.)
-50 -25 0 25 50 75 100 125 1500.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
VGS
= 10V
IDS
= 40A
RON
@Tj=25oC: 3.3mΩ
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.60.1
1
10
100
200
Tj=150oC
Tj=25oC
0 5 10 15 20 25 300
1000
2000
3000
4000
5000
6000
7000
8000
9000
Frequency=1MHz
CrssCoss
Ciss
0 20 40 60 80 1000
1
2
3
4
5
6
7
8
9
10V
DS= 15V
ID= 40A
Copyright ANPEC Electronics Corp.Rev. A.1 - May, 2007
www.anpec.com.tw7
APM4356KP
Avalanche Test Circuit and Waveforms
Switching Time Test Circuit and Waveforms
VDD
RD
DUT
VGS
VDS
RG
tp
td(on) tr td(off) tf
VGS
VDS90%
10%
DUT
0.01Ωtp
VDD
VDSL
IL
RG
EAS
VDD
tAV
IAS
VDS
tpVDSX(SUS)
Copyright ANPEC Electronics Corp.Rev. A.1 - May, 2007
www.anpec.com.tw8
APM4356KP
Package Information
KPAK
SYMBOL MIN. MAX.
1.20
0.38
4.80 5.00
5.90 6.10
5.70 5.80
0.05
3.49 3.69
A
B
D
E
E1
e
F
F1
G
H
MILLIMETERS
C 0.19 0.25
1.27 BSC
KPAK
0.35 0.45
MIN. MAX.
INCHES
0.047
0.015
0.050 BSC
0.007 0.010
0.189 0.197
0.232 0.240
0.224 0.228
0.002
0.014 0.018
0.137 0.145
1.00 0.039
0.51 0.020
0.15 0.006
G1
K 1.60 0.063
0.05 0.15 0.002 0.006
0.0180.0140.450.35
E1
E
F1
G1
GK
F
H
Be
D
C
A
Copyright ANPEC Electronics Corp.Rev. A.1 - May, 2007
www.anpec.com.tw9
APM4356KP
Carrier Tape & Reel Dimensions
Devices Per Reel
Package Type Devices Per Reel KPAK 2500
Application A H T1 C d D W E1 F
330.0±2.00 50 MIN. 9.2±0.10 13.0+0.50 -0.20
1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.5±0.05
P0 P1 P2 D0 D1 T A0 B0 K0 KPAK
4.0±0.10 8.0±0.10 2.0±0.05 1.5+0.10 1.5 MIN. 0.3±0.05 6.5±0.10 5.3±0.10 1.4±0.10
(mm)
A
E1
AB
W
F
T
P0OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
H
T1
A
d
Copyright ANPEC Electronics Corp.Rev. A.1 - May, 2007
www.anpec.com.tw10
APM4356KP
Terminal Material Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb,100%Sn).
Lead Solderability Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition (IR/Convection or VPR Reflow)
Classification Reflow Profiles
Physical Specifications
t 25 C to Peak
tp
Ramp-up
tL
Ramp-down
tsPreheat
Tsmax
Tsmin
TL
TP
25
Tem
per
atu
re
Time
Critical ZoneTL to TP
°
(IR/Convection or VPR Reflow)
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.
Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)
100°C 150°C
60-120 seconds
150°C 200°C
60-180 seconds
Time maintained above: - Temperature (TL) - Time (tL)
183°C 60-150 seconds
217°C 60-150 seconds
Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)
10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max.
Time 25°C to Peak Temperature 6 minutes max. 8 minutes max.
Notes: All temperatures refer to topside of the package. Measured on the body surface.
Copyright ANPEC Electronics Corp.Rev. A.1 - May, 2007
www.anpec.com.tw11
APM4356KP
Customer Service
Anpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :7F, No. 137, Lane 235, Pao Chiao Rd.,Hsin Tien City, Taipei Hsien, Taiwan, R. O. C.Tel : 886-2-89191368Fax : 886-2-89191369
Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 SEC HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B,A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles ESD MIL-STD-883D-3015.7 VHBM > 2KV, VMM > 200V Latch-Up JESD 78 10ms, 1tr > 100mA
Reliability Test Program
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures
Package Thickness Volume mm3
<350 Volume mm3
≥350
<2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C
Table 2. Pb-free Process – Package Classification Reflow Temperatures
Package Thickness Volume mm3
<350 Volume mm3
350-2000 Volume mm3
>2000
<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C*
1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*
≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* * Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated
classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.
Classification Reflow Profiles (Cont.)
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. A.3 - Mar., 2009
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, andadvise customers to obtain the latest version of relevant information to verify before placing orders.
APM9984CCG
Features
Applications
Pin Description
Ordering and Marking Information
N-Channel MOSFET
• 20V/6A,
RDS(ON)=16mΩ(typ.) @ VGS=4.5VRDS(ON)=19mΩ(typ.) @ VGS=2.5V
• Super High Dense Cell Design
• Reliable and Rugged
• ESD Rating : 2KV HBM
• Lead Free and Green Devices Available
(RoHS Compliant)
• Power Management in Notebook Computer, Por-
table Equipment and Battery Powered Systems.
Top View of JSOT-8
G2
S2
D2(8) (6)
(2)
(1)
(4)
(3)S1
D1
G1
(7) (5)D1 D2
APM9984C
Handling Code
Temperature Range
Package Code
Package Code CG : JSOT-8Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material G : Halogen and Lead Free Device
APM9984C CG : M9984CXXXXX XXXXX - Date Code
Assembly Material
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).
S1G1S2G2D1
D1D2D2
Copyright ANPEC Electronics Corp.Rev. A.3 - Mar., 2009
www.anpec.com.tw2
APM9984CCG
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)
Electrical Characteristics (TA = 25°C unless otherwise noted)
Symbol Parameter Rating Unit
VDSS Drain-Source Voltage 20
VGSS Gate-Source Voltage ±12 V
ID* Continuous Drain Current 6
IDM* 300µs Pulsed Drain Current VGS=4.5V
20 A
IS* Diode Continuous Forward Current 1.7 A
TJ Maximum Junction Temperature 150
TSTG Storage Temperature Range -55 to 150 °C
TA=25°C 1.25 PD* Maximum Power Dissipation
TA=100°C 0.5 W
RθJA* Thermal Resistance-Junction to Ambient 100 °C/W
Note : *Surface Mounted on 1in2 pad area, t ≤ 10sec.
APM9984CCG Symbol Parameter Test Conditions
Min. Typ. Max. Unit
Static Characteristics
BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 20 - - V
VDS=16V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current
TJ=85°C - - 30 µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 0.5 0.7 1 V
IGSS Gate Leakage Current VGS=±10V, VDS=0V - - ±10 µA
VGS=4.5V, IDS=6A - 16 20 RDS(ON)
a Drain-Source On-state Resistance VGS=2.5V, IDS=5.2A - 19 25
mΩ
VSDa Diode Forward Voltage ISD=1.7A, VGS=0V - 0.7 1.3 V
Gate Charge Characteristics b
Qg Total Gate Charge - 15 21
Qgs Gate-Source Charge - 1.5 -
Qgd Gate-Drain Charge
VDS=10V, VGS=4.5V, IDS=6A
- 4.5 -
nC
Copyright ANPEC Electronics Corp.Rev. A.3 - Mar., 2009
www.anpec.com.tw3
APM9984CCG
Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)
APM9984CCG Symbol Parameter Test Conditions
Min. Typ. Max. Unit
Dynamic Characteristics b
RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 4 - Ω
Ciss Input Capacitance - 1165 -
Coss Output Capacitance - 210 -
Crss Reverse Transfer Capacitance
VGS=0V, VDS=10V, Frequency=1.0MHz - 190 -
pF
td(ON) Turn-on Delay Time - 7 14
tr Turn-on Rise Time - 10 19
td(OFF) Turn-off Delay Time - 66 110
tf Turn-off Fall Time
VDD=10V, RL=10Ω, IDS=1A, VGEN=4.5V, RG=6Ω
- 44 75
ns
trr Reverse Recovery Time - 25 - nS
Qrr Reverse Recovery Charge ISD=6A, dISD/dt=100A/µs
- 13 - nC
Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.
Copyright ANPEC Electronics Corp.Rev. A.3 - Mar., 2009
www.anpec.com.tw4
APM9984CCG
Typical Operating Characteristics
ID -
Dra
in C
urre
nt (A
)
Drain Current
Tj - Junction Temperature (°C)
Safe Operation Area
VDS - Drain - Source Voltage (V)
Thermal Transient Impedance
Square Wave Pulse Duration (sec)
Power Dissipation
Pto
t - P
ower
(W)
Tj - Junction Temperature (°C)
I D -
Dra
in C
urre
nt (A
)
Nor
mal
ized
Tra
nsie
nt T
herm
al R
esis
tanc
e
0 20 40 60 80 100 120 140 1600.0
0.3
0.6
0.9
1.2
1.5
TA=25oC
0 20 40 60 80 100 120 140 1600
1
2
3
4
5
6
7
TA=25oC,V
G=4.5V
0.01 0.1 1 10 1000.01
0.1
1
10
100
300µs
1msRds(on
) Lim
it
1s
TA=25oC
10ms
100ms
DC
1E-4 1E-3 0.01 0.1 1 10 301E-3
0.01
0.1
1
2
Mounted on 1in2 padR
θJA : 100 oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
Copyright ANPEC Electronics Corp.Rev. A.3 - Mar., 2009
www.anpec.com.tw5
APM9984CCG
RD
S(O
N) -
On
- Res
ista
nce
(mΩ
)
Drain-Source On Resistance
ID - Drain Current (A)
Tj - Junction Temperature (°C)
Gate Threshold Voltage
VDS - Drain-Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Output Characteristics
Drain-Source On Resistance
VGS - Gate - Source Voltage (V)
RD
S(O
N) -
On
- Res
ista
nce
(mΩ
)
Nor
mal
ized
Thr
esho
ld V
olta
ge
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6IDS
=250µA
0.0 0.5 1.0 1.5 2.0 2.5 3.00
2
4
6
8
10
12
14
16
18
20
1V
1.5V
VGS
=2,3,4,5,6,7,8,9,10V
0 4 8 12 16 2013
14
15
16
17
18
19
20
21
22
23
VGS
=2.5V
VGS
=4.5V
1 2 3 4 5 6 7 8 9 1012
14
16
18
20
22
24
ID=6A
Typical Operating Characteristics (Cont.)
Copyright ANPEC Electronics Corp.Rev. A.3 - Mar., 2009
www.anpec.com.tw6
APM9984CCG
VDS - Drain - Source Voltage (V)
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
Tj - Junction Temperature (°C)
C -
Cap
acita
nce
(pF)
VSD - Source - Drain Voltage (V)
Source-Drain Diode Forward
IS -
Sou
rce
Cur
rent
(A)
Capacitance Gate Charge
QG - Gate Charge (nC)
VG
S -
Gat
e - s
ourc
e V
olta
ge (V
)
0.0 0.3 0.6 0.9 1.2 1.5 1.80.1
1
10
20
Tj=150oC
Tj=25oC
0 4 8 12 16 200
200
400
600
800
1000
1200
1400
1600
1800
2000
Frequency=1MHz
CrssCoss
Ciss
0 5 10 15 20 25 300
1
2
3
4
5
6
7
8
9
10V
DS=10V
IDS
= 6A
-50 -25 0 25 50 75 100 125 1500.4
0.6
0.8
1.0
1.2
1.4
1.6
RON
@Tj=25oC: 16mΩ
VGS
= 4.5V
ID = 6A
Typical Operating Characteristics (Cont.)
Copyright ANPEC Electronics Corp.Rev. A.3 - Mar., 2009
www.anpec.com.tw7
APM9984CCG
Package InformationJSOT-8
E1
eb
D
A2
A1
AE
2c
E
L
Θ
SYMBOL MIN. MAX.
1.10
0.01
0.25 0.40
0.10 0.20
2.95 3.10
2.50 3.00
2.30
0.30 0.60
A
A1
b
c
D
E
E1
E2
e
L
MILLIMETERS
A2 0.92 1.00
0.65 BSC
JSOT-8
2.65 3.05
MIN. MAX.
INCHES
0.043
0.000
0.026 BSC
0.036 0.039
0.010 0.016
0.004 0.008
0.116 0.122
0.098 0.118
0.091
0.104 0.120
0.012 0.024
0.93 0.037
0.10 0.004
2.50 0.098
0 0° 8° 0° 8°
Note: 1. Follow GEM2928 8J 2. Dimension D, D1, and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 10 mil.
Copyright ANPEC Electronics Corp.Rev. A.3 - Mar., 2009
www.anpec.com.tw8
APM9984CCG
Carrier Tape & Reel Dimensions
A
E1
AB
W
F
T
P0OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
H
T1
A
d
Application A H T1 C d D W E1 F
178.0±2.00 50 MIN. 8.4+2.00 -0.00
13.0+0.50 -0.20
1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05
P0 P1 P2 D0 D1 T A0 B0 K0 JSOT-8
4.0±0.10 4.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.0 MIN. 0.6+0.00
-0.40 3.20±0.20 3.10±0.20 1.50±0.20
(mm)
Devices Per UnitPackage Type Unit Quantity
JSOT-8 Tape & Reel 3000
Copyright ANPEC Electronics Corp.Rev. A.3 - Mar., 2009
www.anpec.com.tw9
APM9984CCG
Taping Direction Information
Classification Profile
JSOT-8
USER DIRECTION OF FEED
XXXXXMAAAA MAAAA
XXXXXMAAAAXXXXX
MAAAAXXXXX
MAAAAXXXXX
MAAAAXXXXX
MAAAAXXXXX
Copyright ANPEC Electronics Corp.Rev. A.3 - Mar., 2009
www.anpec.com.tw10
APM9984CCG
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts)
100 °C 150 °C
60-120 seconds
150 °C 200 °C
60-120 seconds
Average ramp-up rate (Tsmax to TP) 3 °C/second max. 3°C/second max.
Liquidous temperature (TL) Time at liquidous (tL)
183 °C 60-150 seconds
217 °C 60-150 seconds
Peak package body Temperature (Tp)*
See Classification Temp in table 1 See Classification Temp in table 2
Time (tP)** within 5°C of the specified classification temperature (Tc)
20** seconds 30** seconds
Average ramp-down rate (Tp to Tsmax) 6 °C/second max. 6 °C/second max.
Time 25°C to peak temperature 6 minutes max. 8 minutes max.
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Classification Reflow Profiles
Table 2. Pb-free Process – Classification Temperatures (Tc)
Package Thickness
Volume mm3 <350
Volume mm3 350-2000
Volume mm3 >2000
<1.6 mm 260 °C 260 °C 260 °C 1.6 mm – 2.5 mm 260 °C 250 °C 245 °C
≥2.5 mm 250 °C 245 °C 245 °C
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc) Package
Thickness Volume mm3
<350 Volume mm3
≥350 <2.5 mm 235 °C 220 °C
≥2.5 mm 220 °C 220 °C
Reliability Test Program
Test item Method Description SOLDERABILITY JESD-22, B102 5 Sec, 245°C HOLT JESD-22, A108 1000 Hrs, Bias @ 125°C PCT JESD-22, A102 168 Hrs, 100%RH, 2atm, 121°C TCT JESD-22, A104 500 Cycles, -65°C~150°C
Copyright ANPEC Electronics Corp.Rev. A.3 - Mar., 2009
www.anpec.com.tw11
APM9984CCG
Customer Service
Anpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838
Fax : 886-2-2917-3838
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. A.2 - Nov., 2008
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.
APM2322AA
Features
Applications
• Power Management in Notebook Computer,
Portable Equipment and Battery PoweredSystems.
Pin Description
Ordering and Marking Information
Top View of SOT-23
N-Channel MOSFET
• 20V/1.7A ,
RDS(ON)= 120mΩ(typ.) @ VGS=4.5V RDS(ON)= 180mΩ(typ.) @ VGS=2.5V RDS(ON)= 280mΩ(typ.) @ VGS=1.8V
• Super High Dense Cell Design
• Reliable and Rugged
• Lead Free and Green Devices Available
(RoHS Compliant)
G
S
D
APM2322A
Handling CodeTemperature RangePackage Code
Package Code A : SOT-23Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material L : Lead Free Device G : Halogen and Lead Free Device
APM2322A A : A22X X - Date Code
Assembly Material
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).
D
G
S
Copyright ANPEC Electronics Corp.Rev. A.2 - Nov., 2008
www.anpec.com.tw2
APM2322AA
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)
Electrical Characteristics (TA = 25°C unless otherwise noted)
Symbol Parameter Rating Unit
VDSS Drain-Source Voltage 20
VGSS Gate-Source Voltage ±12 V
ID* Continuous Drain Current 1.7
IDM* 300µs Pulsed Drain Current VGS=4.5V
7 A
IS* Diode Continuous Forward Current 1 A
TJ Maximum Junction Temperature 150
TSTG Storage Temperature Range -55 to 150 °C
TA=25°C 0.83 PD* Maximum Power Dissipation
TA=100°C 0.3 W
RθJA* Thermal Resistance-Junction to Ambient 150 °C/W Note : *Surface Mounted on 1in2 pad area, t ≤ 10sec.
APM2322AA Symbol Parameter Test Conditions
Min. Typ. Max. Unit
STATIC CHARACTERISTICS
BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 20 - - V
VDS=16V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current
TJ=85°C - - 30 µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 0.5 0.7 1 V
IGSS Gate Leakage Current VGS=±10V, VDS=0V - - ±10 µA
VGS=4.5V, IDS=1.7A - 120 160
VGS=2.5V, IDS=1.3A - 180 250 RDS(ON) a Drain-Source On-State Resistance
VGS=1.8V, IDS=0.5A - 280 450
mΩ
DIODE CHARACTERISTICS
VSDa Diode Forward Voltage ISD=1A, VGS=0V - 0.8 1.3 V
trr Reverse Recovery Time - 14 - ns
Qrr Reverse Recovery Charge ISD=1.7A, dlSD/dt=100A/µs
- 4 - nC
Copyright ANPEC Electronics Corp.Rev. A.2 - Nov., 2008
www.anpec.com.tw3
APM2322AA
Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)
APM2322AA Symbol Parameter Test Conditions
Min. Typ. Max. Unit
DYNAMIC CHARACTERISTICS b
RG Gate resistance VGS=0V,VDS=0V,F=1MHz - 7 - Ω
Ciss Input Capacitance - 115 -
Coss Output Capacitance - 35 -
Crss Reverse Transfer Capacitance
VGS=0V, VDS=10V, Frequency=1.0MHz - 25 -
pF
td(ON) Turn-on Delay Time - 2 5
Tr Turn-on Rise Time - 14 26
td(OFF) Turn-off Delay Time - 12 23
Tf Turn-off Fall Time
VDD=10V, RL=10Ω, IDS=1A, VGEN=4.5V, RG=6Ω
- 2 5
ns
GATE CHARGE CHARACTERISTICS b
Qg Total Gate Charge - 1.8 2.5
Qgs Gate-Source Charge - 0.3 -
Qgd Gate-Drain Charge
VDS=10V, VGS=4.5V, IDS=1.7A
- 0.7 -
nC
Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.
Copyright ANPEC Electronics Corp.Rev. A.2 - Nov., 2008
www.anpec.com.tw4
APM2322AA
Typical Operating Characteristics
I D -
Dra
in C
urre
nt (A
)
Drain Current
Tj - Junction Temperature (°C)
Safe Operation Area
VDS - Drain - Source Voltage (V)
Thermal Transient Impedance
Square Wave Pulse Duration (sec)
Power Dissipation
Pto
t - P
ower
(W)
Tj - Junction Temperature (°C)
I D -
Dra
in C
urre
nt (A
)
Nor
mal
ized
Tra
nsie
nt T
herm
al R
esis
tanc
e
0 20 40 60 80 100 120 140 1600.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
TA=25oC
0 20 40 60 80 100 120 140 1600.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
TA=25oC,V
G=4.5V
0.01 0.1 1 10 1000.01
0.1
1
10
30
Rds(o
n) Li
mit
TA=25oC
10ms
300µs
1ms
100ms
DC
1E-4 1E-3 0.01 0.1 1 10 1000.01
0.1
1
2
Mounted on 1in2 padR
θJA : 150 oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
Copyright ANPEC Electronics Corp.Rev. A.2 - Nov., 2008
www.anpec.com.tw5
APM2322AA
RD
S(O
N) -
On
- R
esis
tanc
e (m
Ω)
Drain-Source On Resistance
ID - Drain Current (A)
Tj - Junction Temperature (°C)
Gate Threshold Voltage
VDS - Drain - Source Voltage (V)
I D -
Dra
in C
urre
nt (A
)
Output Characteristics
Drain-Source On Resistance
VGS - Gate-Source Voltage (V)
RD
S(O
N) -
On
Res
ista
nce
(mΩ
)
Nor
mal
ized
Thr
esho
ld V
olta
ge
0.0 0.5 1.0 1.5 2.0 2.5 3.00
1
2
3
4
5
6
7
2V
3VV
GS=4,5,6,7,8,9,10V
-50 -25 0 25 50 75 100 125 1500.4
0.6
0.8
1.0
1.2
1.4
1.6IDS
=250µA
0 1 2 3 4 5 6 750
100
150
200
250
300
350
400
VGS
=1.8V
VGS
=2.5V
VGS
=4.5V
1 2 3 4 5 6 7 8 9 1060
90
120
150
180
210
240
270
300
ID=1.7A
Typical Operating Characteristics (Cont.)
Copyright ANPEC Electronics Corp.Rev. A.2 - Nov., 2008
www.anpec.com.tw6
APM2322AA
VDS - Drain - Source Voltage (V)
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
Tj - Junction Temperature (°C)
C -
Cap
acita
nce
(pF)
VSD - Source - Drain Voltage (V)
Source-Drain Diode Forward
I S -
Sou
rce
Cur
rent
(A)
Capacitance Gate Charge
QG - Gate Charge (nC)
VG
S -
Gat
e - s
ourc
e V
olta
ge (V
)
-50 -25 0 25 50 75 100 125 1500.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8V
GS = 4.5V
IDS
= 1.7A
RON
@Tj=25oC: 120mΩ
0.0 0.3 0.6 0.9 1.2 1.5 1.80.1
1
7
Tj=150oC
Tj=25oC
0 1 2 3 40
1
2
3
4
5
6
7
8
9
10V
DS= 10V
IDS
= 1.7A
0 4 8 12 16 20
20
40
60
80
100
120
140
160
180
200
Frequency=1MHz
Crss
Coss
Ciss
Typical Operating Characteristics (Cont.)
Copyright ANPEC Electronics Corp.Rev. A.2 - Nov., 2008
www.anpec.com.tw7
APM2322AA
Package InformationSOT-23
0L
VIEW A
0.25
GAUGE PLANESEATING PLANE
AA2
A1
e
D
EE1
SEEVIEW A
b c
e1
MAX.
0.057
0.051
0.024
0.006
0.009
0.0200.012
L 0.30
0
e
e1
E1
E
D
c
b
0.08
0.30
0.60 0.012
0.95 BSC
1.90 BSC
0.22
0.50
0.037 BSC
0.075 BSC
0.003
MIN.
MILLIMETERS
SYMBOL
A1
A2
A
0.00
0.90
SOT-23
MAX.
1.45
0.15
1.30
MIN.
0.000
0.035
INCHES
°8°0 °8°0
1.40
2.60
1.80
3.00
2.70 3.10 0.122
0.071
0.1180.102
0.055
0.106
Note : Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side.
Copyright ANPEC Electronics Corp.Rev. A.2 - Nov., 2008
www.anpec.com.tw8
APM2322AA
Application A H T1 C d D W E1 F
178.0±2.00 50 MIN. 8.4+2.00 -0.00
13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05
P0 P1 P2 D0 D1 T A0 B0 K0 SOT-23
4.0±0.10 4.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.0 MIN. 0.6+0.00
-0.40 3.20±0.20 3.10±0.20 1.50±0.20
(mm)
Carrier Tape & Reel Dimensions
H
T1
A
d
A
E1
AB
W
F
T
P0OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
Devices Per Unit
Package Type Unit Quantity
SOT-23 Tape & Reel 3000
Copyright ANPEC Electronics Corp.Rev. A.2 - Nov., 2008
www.anpec.com.tw9
APM2322AA
Taping Direction InformationSOT-23
USER DIRECTION OF FEED
Reflow Condition (IR/Convection or VPR Reflow)
t 25 C to Peak
tp
Ramp-up
tL
Ramp-downts
Preheat
Tsmax
Tsmin
TL
TP
25
Tem
per
atur
e
Time
Critical ZoneTL to TP
°
Reliability Test Program
Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles
Copyright ANPEC Electronics Corp.Rev. A.2 - Nov., 2008
www.anpec.com.tw10
APM2322AA
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.
Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)
100°C 150°C
60-120 seconds
150°C 200°C
60-180 seconds
Time maintained above: - Temperature (TL) - Time (tL)
183°C 60-150 seconds
217°C 60-150 seconds
Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)
10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max.
Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.
Classification Reflow Profiles
Table 2. Pb-free Process – Package Classification Reflow Temperatures
Package Thickness Volume mm3 <350
Volume mm3 350-2000
Volume mm3 >2000
<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*
≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures
Package Thickness Volume mm3
<350 Volume mm3
≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C
Customer Service
Anpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838
Fax : 886-2-2917-3838
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. A.2 - Sep., 2008
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, andadvise customers to obtain the latest version of relevant information to verify before placing orders.
APM2324AA
Features
Applications
Pin Description
Ordering and Marking Information
Top View of SOT-23
N-Channel MOSFET
• 20V/3A,
RDS(ON)= 50mΩ(Typ.) @ VGS= 4.5V
RDS(ON)= 65mΩ(Typ.) @ VGS= 2.5V
RDS(ON)= 120mΩ(Typ.) @ VGS= 1.8V
• Super High Dense Cell Design
• Reliable and Rugged
• Lead Free and Green Devices Available
(RoHS Compliant)
• Power Management in Notebook Computer,
Portable Equipment and Battery PoweredSystems
G
S
D
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).
APM2324A
Handling CodeTemperature Range
Package Code
Package Code A : SOT-23Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material L : Lead Free Device G : Halogen and Lead Free Device
APM2324A A : A24X X - Date Code
Assembly Material
G
S
D
Copyright ANPEC Electronics Corp.Rev. A.2 - Sep., 2008
www.anpec.com.tw2
APM2324AA
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)
Electrical Characteristics (TA = 25°C unless otherwise noted)
Symbol Parameter Rating Unit
VDSS Drain-Source Voltage 20
VGSS Gate-Source Voltage ±12 V
ID* Continuous Drain Current 3
IDM* 300µs Pulsed Drain Current VGS=4.5V
10 A
IS* Diode Continuous Forward Current 1 A
TJ Maximum Junction Temperature 150
TSTG Storage Temperature Range -55 to 150 °C
TA=25°C 0.83 PD* Maximum Power Dissipation
TA=100°C 0.3 W
RθJA* Thermal Resistance-Junction to Ambient 150 °C/W
Note : *Surface Mounted on 1in2 pad area, t ≤ 10 Sec.
APM2324AA Symbol Parameter Test Conditions
Min. Typ. Max. Unit
STATIC CHARACTERISTICS
BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 20 - - V
VDS=16V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current
TJ=85°C - - 30 µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 0.5 0.7 1 V
IGSS Gate Leakage Current VGS=±10V, VDS=0V - - ±10 µA
VGS=4.5V, IDS=3A - 50 65
VGS=2.5V, IDS=2A - 65 90 RDS(ON) a Drain-Source On-state Resistance
VGS=1.8V, IDS=0.5A - 120 200
mΩ
VSDa Diode Forward Voltage ISD=1A, VGS=0V - 0.7 1.3 V
GATE CHARGE CHARACTERISTICS b
Qg Total Gate Charge - 4.4 6
Qgs Gate-Source Charge - 0.5 -
Qgd Gate-Drain Charge
VDS=10V, VGS=4.5V, IDS=3A
- 1.6 -
nC
Copyright ANPEC Electronics Corp.Rev. A.2 - Sep., 2008
www.anpec.com.tw3
APM2324AA
APM2324AA Symbol Parameter Test Conditions
Min. Typ. Max. Unit
DYNAMIC CHARACTERISTICS b
RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 5 - Ω
Ciss Input Capacitance - 320 -
Coss Output Capacitance - 70 -
Crss Reverse Transfer Capacitance
VGS=0V, VDS=10V, Frequency=1.0MHz - 50 -
pF
td(ON) Turn-On Delay Time - 4 8
tr Turn-On Rise Time - 14 26
td(OFF) Turn-Off Delay Time - 21 39
tf Turn-Off Fall Time
VDD=10V, RL=10Ω, IDS=1A, VGEN=4.5V, RG=6Ω
- 5 10
ns
trr Reverse Recovery Time - 15 - ns
Qrr Reverse Recovery Charge ISD=3A, dlSD/dt=100A/µs
- 6 - nC
Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.
Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)
Copyright ANPEC Electronics Corp.Rev. A.2 - Sep., 2008
www.anpec.com.tw4
APM2324AA
Typical Operating Characteristics
I D -
Dra
in C
urre
nt (A
)
Drain Current
Tj - Junction Temperature (°C)
Safe Operation Area
VDS - Drain - Source Voltage (V)
Thermal Transient Impedance
Square Wave Pulse Duration (sec)
Power Dissipation
Pto
t - P
ower
(W)
Tj - Junction Temperature (°C)
I D -
Dra
in C
urre
nt (
A)
Nor
mal
ized
Tra
nsie
nt T
herm
al R
esis
tanc
e
0 20 40 60 80 100 120 140 1600.0
0.2
0.4
0.6
0.8
1.0
TA=25oC
0 20 40 60 80 100 120 140 1600.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
TA=25oC,V
G=4.5V
0.01 0.1 1 10 1000.01
0.1
1
10
30
Rds(o
n) Li
mit
1s
TA=25oC
10ms
300µs
1ms
100ms
DC
1E-4 1E-3 0.01 0.1 1 10 1000.01
0.1
1
2
Mounted on 1in2 padR
θJA : 150 oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
Copyright ANPEC Electronics Corp.Rev. A.2 - Sep., 2008
www.anpec.com.tw5
APM2324AA
RD
S(O
N) -
On
- R
esis
tanc
e (m
Ω)
Drain-Source On Resistance
ID - Drain Current (A)
Tj - Junction Temperature (°C)
Gate Threshold Voltage
VDS - Drain-Source Voltage (V)
I D -
Dra
in C
urre
nt (A
)
Output Characteristics
Drain-Source On Resistance
VGS - Gate - Source Voltage (V)
RD
S(O
N) -
On
- R
esis
tanc
e (m
Ω)
Nor
mal
ized
Thr
esho
ld V
olta
ge
0.0 0.5 1.0 1.5 2.0 2.5 3.00
1
2
3
4
5
6
7
8
9
10
1.5V
2V
VGS
= 2.5,3,4,5,6,7,8,9,10V
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
IDS
=250µA
0 1 2 3 4 5 6 7 8 9 1020
40
60
80
100
120
140
ID=3A
0 2 4 6 8 100
20
40
60
80
100
120
140
160
180
200
VGS
=1.8V
VGS
=2.5V
VGS
=4.5V
Typical Operating Characteristics (Cont.)
Copyright ANPEC Electronics Corp.Rev. A.2 - Sep., 2008
www.anpec.com.tw6
APM2324AA
VDS - Drain - Source Voltage (V)
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
Tj - Junction Temperature (°C)
C -
Cap
acita
nce
(pF)
VSD - Source - Drain Voltage (V)
Source-Drain Diode Forward
I S -
Sou
rce
Cur
rent
(A)
Capacitance Gate Charge
QG - Gate Charge (nC)
VG
S -
Gat
e - s
ourc
e V
olta
ge (V
)
-50 -25 0 25 50 75 100 125 1500.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
RON
@Tj=25oC: 50mΩ
VGS
= 4.5V
IDS
= 3A
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.60.1
1
10
Tj=150oC
Tj=25oC
0 4 8 12 16 200
50
100
150
200
250
300
350
400
450
500
Frequency=1MHz
CrssCoss
Ciss
0 2 4 6 8 100
1
2
3
4
5
6
7
8
9
10V
DS= 10V
IDS
= 3A
Typical Operating Characteristics (Cont.)
Copyright ANPEC Electronics Corp.Rev. A.2 - Sep., 2008
www.anpec.com.tw7
APM2324AA
Package Information
SOT-23
0L
VIEW A
0.25
GAUGE PLANESEATING PLANE
AA2
A1
e
D
EE1
SEEVIEW A
b c
e1
MAX.
0.057
0.051
0.024
0.006
0.009
0.0200.012
L 0.30
0
e
e1
E1
E
D
c
b
0.08
0.30
0.60 0.012
0.95 BSC
1.90 BSC
0.22
0.50
0.037 BSC
0.075 BSC
0.003
MIN.
MILLIMETERS
SYMBOL
A1
A2
A
0.00
0.90
SOT-23
MAX.
1.45
0.15
1.30
MIN.
0.000
0.035
INCHES
°8°0 °8°0
1.40
2.60
1.80
3.00
2.70 3.10 0.122
0.071
0.1180.102
0.055
0.106
Note : Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side.
Copyright ANPEC Electronics Corp.Rev. A.2 - Sep., 2008
www.anpec.com.tw8
APM2324AA
Application A H T1 C d D W E1 F
178.0±2.00 50 MIN. 8.4+2.00 -0.00
13.0+0.50 -0.20
1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05
P0 P1 P2 D0 D1 T A0 B0 K0 SOT-23
4.0±0.10 4.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.0 MIN. 0.6+0.00
-0.40 3.20±0.20 3.10±0.20 1.50±0.20
(mm)
Carrier Tape & Reel Dimensions
H
T1
A
d
A
E1
AB
W
F
T
P0OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
Package Type Unit Quantity SOT-23 Tape & Reel 3000
Devices Per Unit
Copyright ANPEC Electronics Corp.Rev. A.2 - Sep., 2008
www.anpec.com.tw9
APM2324AA
Reflow Condition (IR/Convection or VPR Reflow)
t 25 C to Peak
tp
Ramp-up
tL
Ramp-down
tsPreheat
Tsmax
Tsmin
TL
TP
25
Tem
per
atu
re
Time
Critical ZoneTL to TP
°
Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 SEC HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B,A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles ESD MIL-STD-883D-3015.7 VHBM > 2KV, VMM > 200V Latch-Up JESD 78 10ms, 1tr > 100mA
Reliability Test Program
Taping Direction InformationSOT-23
USER DIRECTION OF FEED
Copyright ANPEC Electronics Corp.Rev. A.2 - Sep., 2008
www.anpec.com.tw10
APM2324AA
Customer Service
Anpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, TaiwanTel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindian City, Taipei County 23146, TaiwanTel : 886-2-2910-3838Fax : 886-2-2917-3838
Classification Reflow ProfilesProfile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.
Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)
100°C 150°C
60-120 seconds
150°C 200°C
60-180 seconds
Time maintained above: - Temperature (TL) - Time (tL)
183°C 60-150 seconds
217°C 60-150 seconds
Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)
10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Notes: All temperatures refer to topside of the package. Measured on the body surface. Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures
Package Thickness Volume mm3
<350 Volume mm3
≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C
Table 2. Pb-free Process – Package Classification Reflow Temperatures Package Thickness Volume mm3
<350 Volume mm3
350-2000 Volume mm3
>2000 <1.6 mm 260 +0°C* 260 +0°C* 260 +0°C*
1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C* ≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C*
*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. A.3 - Dec., 2008
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, andadvise customers to obtain the latest version of relevant information to verify before placing orders.
APM2300CA
Features
Applications
Pin Description
Ordering and Marking Information
Top View of SOT-23
N-Channel MOSFET
• 20V/6A ,
RDS(ON)=25mΩ (typ.) @ VGS=10VRDS(ON)=32mΩ (typ.) @ VGS=4.5VRDS(ON)=40mΩ (typ.) @ VGS=2.5VRDS(ON)=65mΩ (typ.) @ VGS=1.8V
• Super High Dense Cell Design
• Reliable and Rugged
• Lead Free and Green Devices Available
(RoHS Compliant)
• Power Management in Notebook Computer,
Portable Equipment and Battery PoweredSystems
APM2300C
Handling CodeTemperature RangePackage Code
Package Code A : SOT-23Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material G : Halogen and Lead Free Device
APM2300C A : C00X X - Date Code
Assembly Material
D
G
S
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).
G
S
D
Copyright ANPEC Electronics Corp.Rev. A.3 - Dec., 2008
www.anpec.com.tw2
APM2300CA
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)
Electrical Characteristics (TA = 25°C unless otherwise noted)
Symbol Parameter Rating Unit
VDSS Drain-Source Voltage 20
VGSS Gate-Source Voltage ±12 V
ID* Continuous Drain Current 6
IDM* 300µs Pulsed Drain Current VGS=10V
20 A
IS* Diode Continuous Forward Current 1 A
TJ Maximum Junction Temperature 150
TSTG Storage Temperature Range -55 to 150 °C
TA=25°C 0.83 PD* Maximum Power Dissipation
TA=100°C 0.3 W
RθJA* Thermal Resistance-Junction to Ambient 150 °C/W
Note : *Surface Mounted on 1in2 pad area, t ≤ 10sec.
APM2300CA Symbol Parameter Test Conditions
Min. Typ. Max. Unit
Static Characteristics
BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 20 - - V
VDS=16V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current
TJ=85°C - - 30 µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 0.5 0.75 1 V
IGSS Gate Leakage Current VGS=±10V, VDS=0V - - ±10 µA
VGS=10V, IDS=6A - 25 30
VGS=4.5V, IDS=3A - 32 40
VGS=2.5V, IDS=2A - 40 55 RDS(ON)
a Drain-Source On-state Resistance
VGS=1.8V, IDS=1A - 65 110
mΩ
VSDa Diode Forward Voltage ISD=1A, VGS=0V - 0.7 1.3 V
Gate Charge Characteristics b
Qg Total Gate Charge - 6 8
Qgs Gate-Source Charge - 0.7 -
Qgd Gate-Drain Charge
VDS=10V, VGS=4.5V, IDS=6A
- 3 -
nC
Copyright ANPEC Electronics Corp.Rev. A.3 - Dec., 2008
www.anpec.com.tw3
APM2300CA
Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)
APM2300CA Symbol Parameter Test Conditions
Min. Typ. Max. Unit
Dynamic Characteristics b
RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 6 - Ω
Ciss Input Capacitance - 430 -
Coss Output Capacitance - 110 -
Crss Reverse Transfer Capacitance
VGS=0V, VDS=10V, Frequency=1.0MHz - 90 -
pF
td(ON) Turn-on Delay Time - 5 10
tr Turn-on Rise Time - 15 28
td(OFF) Turn-off Delay Time - 26 48
tf Turn-off Fall Time
VDD=10V, RL=10Ω, IDS=1A, VGEN=4.5V, RG=6Ω
- 15 28
ns
trr Reverse Recovery Time - 21 - ns
Qrr Reverse Recovery Charge ISD=6A, dlSD/dt=100A/µs
- 8 - nC
Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.
Copyright ANPEC Electronics Corp.Rev. A.3 - Dec., 2008
www.anpec.com.tw4
APM2300CA
Typical Operating Characteristics
ID -
Dra
in C
urre
nt (A
)
Drain Current
Tj - Junction Temperature (°C)
Safe Operation Area
VDS - Drain - Source Voltage (V)
Thermal Transient Impedance
Square Wave Pulse Duration (sec)
Power Dissipation
Pto
t - P
ower
(W)
Tj - Junction Temperature (°C)
ID -
Dra
in C
urre
nt (A
)
Nor
mal
ized
Tra
nsie
nt T
herm
al R
esis
tanc
e
0 20 40 60 80 100 120 140 1600.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
TA=25oC
0 20 40 60 80 100 120 140 1600
1
2
3
4
5
6
7
TA=25oC,V
G=10V
0.1 1 10 1000.01
0.1
1
10
100
Rds(on
) Lim
it
1s
TA=25oC
10ms
1ms
100ms
DC
1E-4 1E-3 0.01 0.1 1 10 1001E-3
0.01
0.1
1
2
Mounted on 1in2 padR
θJA : 150 oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
Copyright ANPEC Electronics Corp.Rev. A.3 - Dec., 2008
www.anpec.com.tw5
APM2300CA
RD
S(O
N) - O
n - R
esis
tanc
e (m
Ω)
Drain-Source On Resistance
ID - Drain Current (A)
Tj - Junction Temperature (°C)
Gate Threshold Voltage
VDS - Drain-Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Output Characteristics
Drain-Source On Resistance
VGS - Gate - Source Voltage (V)
RD
S(O
N) -
On
- Res
ista
nce
(mΩ
)
Nor
mal
ized
Thr
esho
ld V
olta
ge
Typical Operating Characteristics (Cont.)
0.0 0.5 1.0 1.5 2.0 2.5 3.00
2
4
6
8
10
12
14
16
18
20
2V
1.5V
VGS
=2.5,3,4,5,6,7,8,9,10V
0 4 8 12 16 200
20
40
60
80
100
120
140
160
VGS
=1.8V
VGS
=10V
VGS
=2.5V
VGS
=4.5V
0 1 2 3 4 5 6 7 8 9 1010
15
20
25
30
35
40
45
50
55
60
ID=6A
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6IDS
= 250µA
Copyright ANPEC Electronics Corp.Rev. A.3 - Dec., 2008
www.anpec.com.tw6
APM2300CA
VDS - Drain - Source Voltage (V)
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
Tj - Junction Temperature (°C)
C -
Cap
acita
nce
(pF)
VSD - Source - Drain Voltage (V)
Source-Drain Diode Forward
IS -
Sou
rce
Cur
rent
(A)
Capacitance Gate Charge
QG - Gate Charge (nC)
VG
S -
Gat
e - s
ourc
e V
olta
ge (V
)
Typical Operating Characteristics (Cont.)
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
RON
@Tj=25oC: 25mΩ
VGS
= 10V
IDS
= 6A
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.60.1
1
10
20
Tj=150oC
Tj=25oC
0 4 8 12 16 200
100
200
300
400
500
600
700
800
Frequency=1MHz
CrssCoss
Ciss
0 2 4 6 8 10 12 140
1
2
3
4
5
6
7
8
9
10V
DS =10V
IDS
= 6A
Copyright ANPEC Electronics Corp.Rev. A.3 - Dec., 2008
www.anpec.com.tw7
APM2300CA
Package InformationSOT-23
0L
VIEW A
0.25
GAUGE PLANESEATING PLANE
AA2
A1
e
D
EE1
SEEVIEW A
b c
e1
MAX.
0.057
0.051
0.024
0.006
0.009
0.0200.012
L 0.30
0
e
e1
E1
E
D
c
b
0.08
0.30
0.60 0.012
0.95 BSC
1.90 BSC
0.22
0.50
0.037 BSC
0.075 BSC
0.003
MIN.
MILLIMETERS
SYMBOL
A1
A2
A
0.00
0.90
SOT-23
MAX.
1.45
0.15
1.30
MIN.
0.000
0.035
INCHES
°8°0 °8°0
1.40
2.60
1.80
3.00
2.70 3.10 0.122
0.071
0.1180.102
0.055
0.106
Note : Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side.
Copyright ANPEC Electronics Corp.Rev. A.3 - Dec., 2008
www.anpec.com.tw8
APM2300CA
Application A H T1 C d D W E1 F
178.0±2.00 50 MIN. 8.4+2.00 -0.00
13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05
P0 P1 P2 D0 D1 T A0 B0 K0 SOT-23
4.0±0.10 4.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.0 MIN. 0.6+0.00
-0.40 3.20±0.20 3.10±0.20 1.50±0.20
(mm)
Carrier Tape & Reel Dimensions
H
T1
A
d
A
E1
AB
W
F
T
P0OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
Devices Per Unit
Package Type Unit Quantity
SOT-23 Tape & Reel 3000
Copyright ANPEC Electronics Corp.Rev. A.3 - Dec., 2008
www.anpec.com.tw9
APM2300CA
Taping Direction InformationSOT-23
USER DIRECTION OF FEED
Reflow Condition (IR/Convection or VPR Reflow)
t 25 C to Peak
tp
Ramp-up
tL
Ramp-downts
Preheat
Tsmax
Tsmin
TL
TP
25
Tem
per
atur
e
Time
Critical ZoneTL to TP
°
Reliability Test Program
Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles
Copyright ANPEC Electronics Corp.Rev. A.3 - Dec., 2008
www.anpec.com.tw10
APM2300CA
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.
Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)
100°C 150°C
60-120 seconds
150°C 200°C
60-180 seconds
Time maintained above: - Temperature (TL) - Time (tL)
183°C 60-150 seconds
217°C 60-150 seconds
Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)
10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max.
Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.
Classification Reflow Profiles
Table 2. Pb-free Process – Package Classification Reflow Temperatures
Package Thickness Volume mm3 <350
Volume mm3 350-2000
Volume mm3 >2000
<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*
≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures
Package Thickness Volume mm3
<350 Volume mm3
≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C
Customer Service
Anpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838
Fax : 886-2-2917-3838
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. B.2 - Nov., 2008
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.
APM2306A
Features
Applications
• Power Management in Notebook Computer,
Portable Equipment and Battery PoweredSystems.
Pin Description
Ordering and Marking Information
Top View of SOT-23
N-Channel MOSFET
• 30V/3.5A ,
RDS(ON)=42mΩ(typ.) @ VGS=10V RDS(ON)=70mΩ(typ.) @ VGS=5V
• Super High Dense Cell Design
• Reliable and Rugged
• Lead Free and Green Devices Available
(RoHS Compliant)
G
S
D
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).
D
G
S
APM2306
Handling Code
Temperature RangePackage Code
Package Code A : SOT-23Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material L : Lead Free Device G : Halogen and Lead Free Device
APM2306 A : M06X X - Date Code
Assembly Material
Copyright ANPEC Electronics Corp.Rev. B.2 - Nov., 2008
www.anpec.com.tw2
APM2306A
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)
Electrical Characteristics (TA = 25°C unless otherwise noted)
Symbol Parameter Rating Unit
VDSS Drain-Source Voltage 30
VGSS Gate-Source Voltage ±20 V
ID* Continuous Drain Current 3.5
IDM* 300µs Pulsed Drain Current VGS=10V
14 A
IS* Diode Continuous Forward Current 1.3 A
TJ Maximum Junction Temperature 150
TSTG Storage Temperature Range -55 to 150 °C
TA=25°C 0.83 PD* Maximum Power Dissipation
TA=100°C 0.3 W
RθJA* Thermal Resistance-Junction to Ambient 150 °C/W
Note : *Surface Mounted on 1in2 pad area, t ≤ 10sec.
APM2306A Symbol Parameter Test Conditions
Min. Typ. Max. Unit
STATIC CHARACTERISTICS
BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 30 - - V
VDS=24V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current
TJ=85°C - - 30 µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1 1.5 2 V
IGSS Gate Leakage Current VGS=±20V, VDS=0V - - ±100 nA
VGS=10V, IDS=3.5A - 42 65 RDS(ON)
a Drain-Source On-State Resistance VGS=5V, IDS=2.8A - 70 90
mΩ
VSDa Diode Forward Voltage ISD=1.25A, VGS=0V - 0.8 1.3 V
GATE CHARGE CHARACTERISTICS b
Qg Total Gate Charge - 12.5 16
Qgs Gate-Source Charge - 2.4 -
Qgd Gate-Drain Charge
VDS=15V, VGS=10V, IDS=3.5A
- 1.3 -
nC
Copyright ANPEC Electronics Corp.Rev. B.2 - Nov., 2008
www.anpec.com.tw3
APM2306A
Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)
APM2306A Symbol Parameter Test Conditions
Min. Typ. Max. Unit
DYNAMIC CHARACTERISTICS b
RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 1.5 - Ω
Ciss Input Capacitance - 400 -
Coss Output Capacitance - 80 -
Crss Reverse Transfer Capacitance
VGS=0V, VDS=25V, Frequency=1.0MHz - 45 -
pF
td(ON) Turn-on Delay Time - 10 19
Tr Turn-on Rise Time - 8 15
td(OFF) Turn-off Delay Time - 19 35
Tf Turn-off Fall Time
VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω
- 6.2 12
ns
Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.
Copyright ANPEC Electronics Corp.Rev. B.2 - Nov., 2008
www.anpec.com.tw4
APM2306A
1E-4 1E-3 0.01 0.1 1 10 1001E-3
0.01
0.1
1
2
Mounted on 1in2 padR
θJA : 150 oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
Typical Operating Characteristics
I D -
Dra
in C
urre
nt (
A)
Drain Current
Tj - Junction Temperature (°C)
Safe Operation Area
VDS - Drain - Source Voltage (V)
Thermal Transient Impedance
Square Wave Pulse Duration (sec)
Power Dissipation
Pto
t - P
ower
(W)
Tj - Junction Temperature (°C)
I D -
Dra
in C
urre
nt (A
)
0 20 40 60 80 100 120 140 1600.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
TA=25oC
0 20 40 60 80 100 120 140 1600.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
TA=25oC,V
G=10V
0.01 0.1 1 10 1000.01
0.1
1
10
50
Rds(on
) Lim
it
1s
TA=25oC
10ms
300µs
1ms
100ms
DC
Nor
mal
ized
Tra
nsie
nt T
herm
al R
esis
tanc
e
Copyright ANPEC Electronics Corp.Rev. B.2 - Nov., 2008
www.anpec.com.tw5
APM2306A
RD
S(O
N) -
On
- R
esis
tanc
e (m
Ω)
Drain-Source On Resistance
ID - Drain Current (A)
Tj - Junction Temperature (°C)
Gate Threshold Voltage
VDS - Drain - Source Voltage (V)
I D -
Dra
in C
urre
nt (A
)
Output Characteristics
Transfer Characteristics
VGS - Gate - Source Voltage (V)
I D -
Dra
in C
urre
nt (A
)
Nor
mal
ized
Thr
esho
ld V
olta
ge
0 1 2 3 4 50
2
4
6
8
10
12
14
3V
4V
VGS
= 5, 6, 7, 8, 9, 10V
0 2 4 6 8 100
20
40
60
80
100
120
VGS
=5V
VGS
=10V
0 1 2 3 4 5 6 70
2
4
6
8
10
12
14
TJ=-55oC
TJ=25oC
TJ=125oC
-50 -25 0 25 50 75 100 125 1500.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
IDS
=250µΑ
Typical Operating Characteristics (Cont.)
Copyright ANPEC Electronics Corp.Rev. B.2 - Nov., 2008
www.anpec.com.tw6
APM2306A
VDS - Drain - Source Voltage (V)
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
Tj - Junction Temperature (°C)
C -
Cap
acita
nce
(pF)
VSD - Source - Drain Voltage (V)
Source-Drain Diode Forward
I S -
Sou
rce
Cur
rent
(A)
Capacitance Gate Charge
QG - Gate Charge (nC)
VG
S -
Gat
e - s
ourc
e V
olta
ge (V
)
-50 -25 0 25 50 75 100 125 1500.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
RON
@Tj=25oC: 42mΩ
VGS
= 10V
IDS
= 3.5A
0.0 0.4 0.8 1.2 1.6 2.01
10
20
TJ=150oC
TJ=25oC
0 5 10 15 20 25 300
100
200
300
400
500
600Frequency=1MHz
CrssCoss
Ciss
0 2 4 6 8 10 12 140
2
4
6
8
10V
DS = 15V
ID = 3.5A
Typical Operating Characteristics (Cont.)
Copyright ANPEC Electronics Corp.Rev. B.2 - Nov., 2008
www.anpec.com.tw7
APM2306A
Package InformationSOT-23
0L
VIEW A
0.25
GAUGE PLANESEATING PLANE
AA2
A1
e
D
EE1
SEEVIEW A
b c
e1
MAX.
0.057
0.051
0.024
0.006
0.009
0.0200.012
L 0.30
0
e
e1
E1
E
D
c
b
0.08
0.30
0.60 0.012
0.95 BSC
1.90 BSC
0.22
0.50
0.037 BSC
0.075 BSC
0.003
MIN.
MILLIMETERS
SYMBOL
A1
A2
A
0.00
0.90
SOT-23
MAX.
1.45
0.15
1.30
MIN.
0.000
0.035
INCHES
°8°0 °8°0
1.40
2.60
1.80
3.00
2.70 3.10 0.122
0.071
0.1180.102
0.055
0.106
Note : Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side.
Copyright ANPEC Electronics Corp.Rev. B.2 - Nov., 2008
www.anpec.com.tw8
APM2306A
Application A H T1 C d D W E1 F
178.0±2.00 50 MIN. 8.4+2.00 -0.00
13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05
P0 P1 P2 D0 D1 T A0 B0 K0 SOT-23
4.0±0.10 4.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.0 MIN. 0.6+0.00
-0.40 3.20±0.20 3.10±0.20 1.50±0.20
(mm)
Carrier Tape & Reel Dimensions
H
T1
A
d
A
E1
AB
W
F
T
P0OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
Devices Per Unit
Package Type Unit Quantity
SOT-23 Tape & Reel 3000
Copyright ANPEC Electronics Corp.Rev. B.2 - Nov., 2008
www.anpec.com.tw9
APM2306A
Taping Direction InformationSOT-23
USER DIRECTION OF FEED
Reflow Condition (IR/Convection or VPR Reflow)
t 25 C to Peak
tp
Ramp-up
tL
Ramp-downts
Preheat
Tsmax
Tsmin
TL
TP
25
Tem
per
atur
e
Time
Critical ZoneTL to TP
°
Reliability Test Program
Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles
Copyright ANPEC Electronics Corp.Rev. B.2 - Nov., 2008
www.anpec.com.tw10
APM2306A
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.
Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)
100°C 150°C
60-120 seconds
150°C 200°C
60-180 seconds
Time maintained above: - Temperature (TL) - Time (tL)
183°C 60-150 seconds
217°C 60-150 seconds
Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)
10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max.
Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.
Classification Reflow Profiles
Table 2. Pb-free Process – Package Classification Reflow Temperatures
Package Thickness Volume mm3 <350
Volume mm3 350-2000
Volume mm3 >2000
<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*
≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures
Package Thickness Volume mm3
<350 Volume mm3
≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C
Customer Service
Anpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838
Fax : 886-2-2917-3838
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. A.1 - Nov., 2007
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.
APM2308A
Features
Applications
• Power Management in Notebook Computer,
Portable Equipment and Battery Powered Systems.
Pin Description
Ordering and Marking Information
Top View of SOT-23-3
N-Channel MOSFET
• 30V/3A ,
RDS(ON)= 60mΩ(typ.) @ VGS= 10V RDS(ON)= 90mΩ(typ.) @ VGS= 4.5V
• Super High Dense Cell Design
• Reliable and Rugged
• Lead Free Available (RoHS Compliant)
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte in plate termina-tion finish; which are fully compliant with RoHS and compatible with both SnPb and lead-free soldering operations.ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C for MSL classifica-tion at lead-free peak reflow temperature.
APM2308
Handling CodeTemp. RangePackage Code
Package Code A : SOT-23-3Operating Junction Temp. Range C : -55 to 150°CHandling Code TR : Tape & ReelLead Free Code L : Lead Free Device
APM2308 A: M08X XXXXX - Date Code
Lead Free Code
S
D
G
Copyright ANPEC Electronics Corp.Rev. A.1 - Nov., 2007
www.anpec.com.tw2
APM2308A
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)
Electrical Characteristics (TA = 25°C unless otherwise noted)
Symbol Parameter Rating Unit
VDSS Drain-Source Voltage 30
VGSS Gate-Source Voltage ±20 V
ID* Continuous Drain Current 3
IDM* 300µs Pulsed Drain Current VGS=10V
10 A
IS* Diode Continuous Forward Current 2 A
TJ Maximum Junction Temperature 150
TSTG Storage Temperature Range -55 to 150 °C
TA=25°C 0.83 PD* Maximum Power Dissipation
TA=100°C 0.3 W
RθJA* Thermal Resistance-Junction to Ambient 150 °C/W Note:
*Surface Mounted on 1in2 pad area, t ≤ 10sec.
APM2308A Symbol Parameter Test Condition
Min. Typ. Max. Unit
Static Characteristics BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 30 V
VDS=24V, VGS=0V 1 IDSS Zero Gate Voltage Drain Current
TJ=85°C 30 µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1.3 1.8 2.5 V
IGSS Gate Leakage Current VGS=±16V, VDS=0V ±10 µA
VGS=10V, IDS=3A 60 80 RDS(ON)
a Drain-Source On-state Resistance VGS=4.5V, IDS=2A 90 120
mΩ
Diode Characteristics VSD
a Diode Forward Voltage ISD=2A, VGS=0V 0.8 1.1 V
trr Reverse Recovery Time 19 ns
Qrr Reverse Recovery Charge ISD=3A, dlSD/dt=100A/µs
9 nC
Copyright ANPEC Electronics Corp.Rev. A.1 - Nov., 2007
www.anpec.com.tw3
APM2308A
Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)
APM2308A Symbol Parameter Test Condition
Min. Typ. Max. Unit
Dynamic Characteristics b RG Gate Resistance VGS=0V, VDS=0V,F=1MHz 6 Ω
Ciss Input Capacitance 280
Coss Output Capacitance 50
Crss Reverse Transfer Capacitance
VGS=0V, VDS=15V, Frequency=1.0MHz 35
pF
td(ON) Turn-on Delay Time 5 10
tr Turn-on Rise Time 10 19
td(OFF) Turn-off Delay Time 16 30
tf Turn-off Fall Time
VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω
4 8
ns
Gate Charge Characteristics b
Qg Total Gate Charge 6 8
Qgs Gate-Source Charge 1
Qgd Gate-Drain Charge
VDS=15V, VGS=10V, IDS=3A
1.4
nC
Notes:
a : Pulse test ; pulse width≤300µs, duty cycle≤2%. b : Guaranteed by design, not subject to production testing.
Copyright ANPEC Electronics Corp.Rev. A.1 - Nov., 2007
www.anpec.com.tw4
APM2308A
Typical Characteristics
ID -
Dra
in C
urre
nt (A
)
Drain Current
Tj - Junction Temperature (°C)
Safe Operation Area
VDS - Drain - Source Voltage (V)
Thermal Transient Impedance
Square Wave Pulse Duration (sec)
Power Dissipation
Pto
t - P
ower
(W)
Tj - Junction Temperature (°C)
ID -
Dra
in C
urre
nt (A
)
Nor
mal
ized
Tra
nsie
nt T
herm
al R
esis
tanc
e
0 20 40 60 80 100 120 140 1600.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
TA=25oC
0 20 40 60 80 100 120 140 1600.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
TA=25oC,V
G=10V
0.01 0.1 1 10 1000.01
0.1
1
10
20
Rds(
on) L
imit
1s
TA=25oC
10ms
300µs
1ms
100ms
DC
1E-4 1E-3 0.01 0.1 1 10 1000.01
0.1
1
2
Mounted on 1in2 padR
θJA : 150 oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
Copyright ANPEC Electronics Corp.Rev. A.1 - Nov., 2007
www.anpec.com.tw5
APM2308A
RD
S(O
N) - O
n - R
esis
tanc
e (m
Ω)
Drain-Source On Resistance
ID - Drain Current (A)
Tj - Junction Temperature (°C)
Gate Threshold Voltage
VDS - Drain - Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Output Characteristics
Drain-Source On Resistance
VGS - Gate-Source Voltage (V)
RD
S(O
N) -
On
Res
ista
nce
(mΩ
)
Nor
mal
ized
Thr
esho
ld V
olta
ge
Typical Characteristics (Cont.)
0 2 4 6 8 1020
30
40
50
60
70
80
90
100
110
120
130
140
VGS
=4.5V
VGS
=10V
0.0 0.5 1.0 1.5 2.0 2.5 3.00
1
2
3
4
5
6
7
8
9
10
2.5V
3V
VGS
= 4.5,5,6,7,8,9,10V
1 2 3 4 5 6 7 8 9 1040
60
80
100
120
140
160
ID=3A
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
IDS
=250µA
Copyright ANPEC Electronics Corp.Rev. A.1 - Nov., 2007
www.anpec.com.tw6
APM2308A
VDS - Drain - Source Voltage (V)
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
Tj - Junction Temperature (°C)
C -
Cap
acita
nce
(pF)
VSD - Source - Drain Voltage (V)
Source-Drain Diode Forward
IS -
Sou
rce
Cur
rent
(A)
Capacitance Gate Charge
QG - Gate Charge (nC)
VG
S -
Gat
e - s
ourc
e V
olta
ge (V
)
Typical Characteristics (Cont.)
-50 -25 0 25 50 75 100 125 1500.00
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
VGS
= 10V
IDS
= 3A
RON
@Tj=25oC: 60mΩ
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.40.1
1
10
Tj=150oC
Tj=25oC
0 1 2 3 4 5 6 70
1
2
3
4
5
6
7
8
9
10V
DS=15V
IDS
=3A
0 5 10 15 20 25 300
50
100
150
200
250
300
350
400
450
500
550
600
Frequency=1MHz
CrssCoss
Ciss
Copyright ANPEC Electronics Corp.Rev. A.1 - Nov., 2007
www.anpec.com.tw7
APM2308A
Package Information
SOT-23-3
0L
VIEW A
0.25
GAUGE PLANESEATING PLANE
AA2
A1
e
D
EE1
SEEVIEW A
b c
e1
MAX.
0.057
0.051
0.024
0.006
0.009
0.0200.012
L 0.30
0
e
e1
E1
E
D
c
b
0.08
0.30
0.60 0.012
2.80 BSC
0.95 BSC
1.90 BSC
1.60 BSC
0.22
0.50
2.90 BSC
0.110 BSC
0.037 BSC
0.075 BSC
0.063 BSC
0.114 BSC
0.003
MIN.
MILLIMETERS
SYMBOL
A1
A2
A
0.00
0.90
SOT-23-3
MAX.
1.45
0.15
1.30
MIN.
0.000
0.035
INCHES
°8°0 °8°0
Copyright ANPEC Electronics Corp.Rev. A.1 - Nov., 2007
www.anpec.com.tw8
APM2308A
Carrier Tape & Reel Dimensions
H
T1
A
d
A
E1
AB
W
F
T
P0OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
Application A H T1 C d D W E1 F
178.0±2.00 50 MIN. 8.4+2.00 -0.00
13.0+0.50 -0.20
1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05
P0 P1 P2 D0 D1 T A0 B0 K0 SOT- 23-3
4.0±0.10 4.0±0.10 2.0±0.10 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00
-0.40 3.20±0.20 3.10±0.20 1.50±0.20
(mm)
Package Type Unit Quantity
SOT-23-3 Tape & Reel 3000
Devices Per Unit
Copyright ANPEC Electronics Corp.Rev. A.1 - Nov., 2007
www.anpec.com.tw9
APM2308A
Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles
Reflow Condition (IR/Convection or VPR Reflow)
Classification Reflow ProfilesProfile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.
Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)
100°C 150°C
60-120 seconds
150°C 200°C
60-180 seconds
Time maintained above: - Temperature (TL) - Time (tL)
183°C 60-150 seconds
217°C 60-150 seconds
Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)
10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.
Reliability Test Program
t 25 C to Peak
tp
Ramp-up
tL
Ramp-downts
Preheat
Tsmax
Tsmin
TL
TP
25
Tem
per
atur
e
Time
Critical ZoneTL to TP
°
Copyright ANPEC Electronics Corp.Rev. A.1 - Nov., 2007
www.anpec.com.tw10
APM2308A
Table 2. Pb-free Process – Package Classification Reflow Temperatures Package Thickness Volume mm3
<350 Volume mm3
350-2000 Volume mm3
>2000 <1.6 mm 260 +0°C* 260 +0°C* 260 +0°C*
1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C* ≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C*
*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures Package Thickness Volume mm3
<350 Volume mm3
≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C
Classification Reflow Profiles (Cont.)
Customer Service
Anpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838Fax : 886-2-2917-3838
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. B.2 - Dec., 2008
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.
APM2318A
Features
Applications
• Power Management in Notebook Computer,
Portable Equipment and Battery PoweredSystems.
Pin Description
Ordering and Marking Information
Top View of SOT-23-3
N-Channel MOSFET
• 30V/3A ,
RDS(ON)=35mΩ(typ.) @ VGS=10V RDS(ON)=40mΩ(typ.) @ VGS=4.5V RDS(ON)=60mΩ(typ.) @ VGS=2.5V
• Super High Dense Cell Design
• Reliable and Rugged
• Lead Free and Green Devices Available
(RoHS Compliant)
D
G
S
G
S
D
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).
APM2318
Handling CodeTemperature RangePackage Code
Package Code A : SOT-23-3Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material G : Halogen and Lead Free Device
APM2318 A : M18X X - Date Code
Assembly Material
Copyright ANPEC Electronics Corp.Rev. B.2 - Dec., 2008
www.anpec.com.tw2
APM2318A
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)
Electrical Characteristics (TA = 25°C unless otherwise noted)
Symbol Parameter Rating Unit
VDSS Drain-Source Voltage 30
VGSS Gate-Source Voltage ±12 V
ID* Continuous Drain Current 3
IDM* 300µs Pulsed Drain Current VGS=10V
12 A
IS* Diode Continuous Forward Current 1 A
TJ Maximum Junction Temperature 150
TSTG Storage Temperature Range -55 to 150 °C
TA=25°C 0.83 PD* Maximum Power Dissipation
TA=100°C 0.3 W
RθJA* Thermal Resistance-Junction to Ambient 150 °C/W
Note : *Surface Mounted on 1in2 pad area, t ≤ 10sec.
APM2318A Symbol Parameter Test Conditions
Min. Typ. Max. Unit
Static Characteristics
BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 30 - - V
VDS=24V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current
TJ=85°C - - 30 µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 0.5 0.7 1 V
IGSS Gate Leakage Current VGS=±12V, VDS=0V - - ±100 nA
VGS=10V, IDS=3A - 35 50
VGS=4.5V, IDS=2A - 40 55 RDS(ON) a Drain-Source On-state Resistance
VGS=2.5V, IDS=1.5A - 60 80
mΩ
VSDa Diode Forward Voltage ISD=0.5A, VGS=0V - 0.7 1.3 V
Gate Charge Characteristics b
Qg Total Gate Charge - 12 16
Qgs Gate-Source Charge - 0.8 -
Qgd Gate-Drain Charge
VDS=15V, VGS=10V, IDS=3A
- 0.8 -
nC
Copyright ANPEC Electronics Corp.Rev. B.2 - Dec., 2008
www.anpec.com.tw3
APM2318A
Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)
APM2318A Symbol Parameter Test Conditions
Min. Typ. Max. Unit
Dynamic Characteristics b
RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 1.5 - Ω
Ciss Input Capacitance - 320 -
Coss Output Capacitance - 25 -
Crss Reverse Transfer Capacitance
VGS=0V, VDS=25V, Frequency=1.0MHz - 15 -
pF
td(ON) Turn-on Delay Time - 11 22
Tr Turn-on Rise Time - 17 32
td(OFF) Turn-off Delay Time - 37 68
Tf Turn-off Fall Time
VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω
- 20 38
ns
Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.
Copyright ANPEC Electronics Corp.Rev. B.2 - Dec., 2008
www.anpec.com.tw4
APM2318A
1E-4 1E-3 0.01 0.1 10 1000.01
0.1
1
2
Mounted on 1in2 padR
θJA : 150 oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
Typical Operating Characteristics
ID -
Dra
in C
urre
nt (A
)
Drain Current
Tj - Junction Temperature (°C)
Safe Operation Area
VDS - Drain - Source Voltage (V)
Thermal Transient Impedance
Square Wave Pulse Duration (sec)
Power Dissipation
Pto
t - P
ower
(W)
Tj - Junction Temperature (°C)
ID -
Dra
in C
urre
nt (A
)
0 20 40 60 80 100 120 140 1600.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
TA=25oC
0 20 40 60 80 100 120 140 1600.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
TA=25oC,V
G=10V
0.01 0.1 1 10 1000.01
0.1
1
10
50
Rds(on
) Lim
it
1s
TA=25oC
10ms
300µs
1ms
100ms
DC
Nor
mal
ized
Tra
nsie
nt T
herm
al R
esis
tanc
e
Copyright ANPEC Electronics Corp.Rev. B.2 - Dec., 2008
www.anpec.com.tw5
APM2318A
RD
S(O
N) - O
n - R
esis
tanc
e (m
Ω)
Drain-Source On Resistance
ID - Drain Current (A)
Tj - Junction Temperature (°C)
Gate Threshold Voltage
VDS - Drain-Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Output Characteristics
Transfer Characteristics
VGS - Gate - Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Nor
mal
ized
Thr
esho
ld V
olta
ge
Typical Operating Characteristics (Cont.)
0 1 2 3 4 50
2
4
6
8
10
12
2V
1.5V
VGS
= 3,4,5,6,7,8,9,10V
0 2 4 6 8 10 120
10
20
30
40
50
60
70
80
90
100
VGS
=10V
VGS
=2.5V
VGS
=4.5V
0.0 0.5 1.0 1.5 2.0 2.5 3.000
2
4
6
8
10
12
Tj=125oC
Tj=25oC T
j=-55oC
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
IDS
=250µA
Copyright ANPEC Electronics Corp.Rev. B.2 - Dec., 2008
www.anpec.com.tw6
APM2318A
VDS - Drain - Source Voltage (V)
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
Tj - Junction Temperature (°C)
C -
Cap
acita
nce
(pF)
VSD - Source - Drain Voltage (V)
Source-Drain Diode Forward
IS -
Sou
rce
Cur
rent
(A)
Capacitance Gate Charge
QG - Gate Charge (nC)
VG
S -
Gat
e - s
ourc
e V
olta
ge (V
)
Typical Operating Characteristics (Cont.)
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.40.1
1
10
Tj=150oC
Tj=25oC
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
RON
@Tj=25oC: 35mΩ
VGS
= 10V
IDS
= 3A
0 5 10 15 20 25 300
100
200
300
400
500Frequency=1MHz
Crss Coss
Ciss
0 2 4 6 8 10 120
2
4
6
8
10V
DS=15V
IDS
= 3A
Copyright ANPEC Electronics Corp.Rev. B.2 - Dec., 2008
www.anpec.com.tw7
APM2318A
Package InformationSOT-23-3
0L
VIEW A
0.25
GAUGE PLANESEATING PLANE
AA2
A1
e
D
EE1
SEEVIEW A
b c
e1
MAX.
0.057
0.051
0.024
0.006
0.009
0.0200.012
L 0.30
0
e
e1
E1
E
D
c
b
0.08
0.30
0.60 0.012
0.95 BSC
1.90 BSC
0.22
0.50
0.037 BSC
0.075 BSC
0.003
MIN.
MILLIMETERS
SYMBOL
A1
A2
A
0.00
0.90
SOT-23-3
MAX.
1.45
0.15
1.30
MIN.
0.000
0.035
INCHES
°8°0 °8°0
1.40
2.60
1.80
3.00
2.70 3.10 0.122
0.071
0.1180.102
0.055
0.106
Note : Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side.
Copyright ANPEC Electronics Corp.Rev. B.2 - Dec., 2008
www.anpec.com.tw8
APM2318A
Carrier Tape & Reel Dimensions
A
E1
AB
W
F
T
P0OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
H
T1
A
d
Application A H T1 C d D W E1 F
178.0±2.00 50 MIN. 8.4+2.00 -0.00
13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05
P0 P1 P2 D0 D1 T A0 B0 K0 SOT-23-3
4.0±0.10 4.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.0 MIN. 0.6+0.00
-0.40 3.20±0.20 3.10±0.20 1.50±0.20
(mm)
Devices Per Unit
Package Type Unit Quantity
SOT-23-3 Tape & Reel 3000
Copyright ANPEC Electronics Corp.Rev. B.2 - Dec., 2008
www.anpec.com.tw9
APM2318A
Taping Direction InformationSOT-23-3
Reflow Condition (IR/Convection or VPR Reflow)
t 25 C to Peak
tp
Ramp-up
tL
Ramp-downts
Preheat
Tsmax
Tsmin
TL
TP
25
Tem
per
atur
e
Time
Critical ZoneTL to TP
°
Reliability Test Program
Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles
USER DIRECTION OF FEED
Copyright ANPEC Electronics Corp.Rev. B.2 - Dec., 2008
www.anpec.com.tw10
APM2318A
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.
Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)
100°C 150°C
60-120 seconds
150°C 200°C
60-180 seconds
Time maintained above: - Temperature (TL) - Time (tL)
183°C 60-150 seconds
217°C 60-150 seconds
Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)
10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max.
Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.
Classification Reflow Profiles
Table 2. Pb-free Process – Package Classification Reflow Temperatures
Package Thickness Volume mm3 <350
Volume mm3 350-2000
Volume mm3 >2000
<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*
≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures
Package Thickness Volume mm3
<350 Volume mm3
≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C
Customer Service
Anpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838
Fax : 886-2-2917-3838
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. B.4 - Dec, 2008
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.
APM2320A
Features
Applications
Pin Description
Ordering and Marking Information
Top View of SOT-23-3
N-Channel MOSFET
• 30V/2.5A,
RDS(ON)=65mΩ (typ.) @ VGS=4.5VRDS(ON)=80mΩ (typ.) @ VGS=2.5V
• Super High Dense Cell Design
• Reliable and Rugged
• Lead Free and Green Devices Available
(RoHS Compliant)
• Power Management in Notebook Computer,
Portable Equipment and Battery PoweredSystems
D
G
S
G
S
D
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).
APM2320
Handling Code
Temperature RangePackage Code
Package Code A : SOT-23-3Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material G : Halogen and Lead Free Device
APM2320 A : M20X X - Date Code
Assembly Material
Copyright ANPEC Electronics Corp.Rev. B.4 - Dec, 2008
www.anpec.com.tw2
APM2320A
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)
Electrical Characteristics (TA = 25°C unless otherwise noted)
Symbol Parameter Rating Unit
VDSS Drain-Source Voltage 30
VGSS Gate-Source Voltage ±8 V
ID* Continuous Drain Current 2.5
IDM* 300µs Pulsed Drain Current VGS=4.5V
10 A
IS* Diode Continuous Forward Current 1 A
TJ Maximum Junction Temperature 150
TSTG Storage Temperature Range -55 to 150 °C
TA=25°C 0.83 PD* Maximum Power Dissipation
TA=100°C 0.3 W
RθJA* Thermal Resistance-Junction to Ambient 150 °C/W
Note : *Surface Mounted on 1in2 pad area, t ≤ 10sec.
APM2320A Symbol Parameter Test Conditions
Min. Typ. Max. Unit
Static Characteristics
BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 30 - - V
VDS=24V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current
TJ=85°C - - 30 µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 0.5 0.7 1.2 V
IGSS Gate Leakage Current VGS=±8V, VDS=0V - - ±10 µA
VGS=4.5V, IDS=2.5A - 65 85 RDS(ON)
a Drain-Source On-state Resistance VGS=2.5V, IDS=1.5A - 80 105
mΩ
VSDa Diode Forward Voltage ISD=0.5A, VGS=0V - 0.7 1.1 V
Gate Charge Characteristics b
Qg Total Gate Charge - 7.2 10
Qgs Gate-Source Charge - 0.5 -
Qgd Gate-Drain Charge
VDS=15V, VGS=10V, IDS=2.5A
- 1.2 -
nC
Copyright ANPEC Electronics Corp.Rev. B.4 - Dec, 2008
www.anpec.com.tw3
APM2320A
Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)
APM2320A Symbol Parameter Test Conditions
Min. Typ. Max. Unit
Dynamic Characteristics b
RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 2.1 - Ω
Ciss Input Capacitance - 256 -
Coss Output Capacitance - 40 -
Crss Reverse Transfer Capacitance
VGS=0V, VDS=15V, Frequency=1.0MHz - 22 -
pF
td(ON) Turn-on Delay Time - 2 5
Tr Turn-on Rise Time - 12 23
td(OFF) Turn-off Delay Time - 15 28
Tf Turn-off Fall Time
VDD=15V, RL=15Ω, IDS=1A, VGEN=10V, RG=6Ω
- 2 5
ns
trr Reverse Recovery Time - 11 - ns
Qrr Reverse Recovery Charge ISD=2.5A, dISD/dt =100A/µs
- 6 - nC
Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.
Copyright ANPEC Electronics Corp.Rev. B.4 - Dec, 2008
www.anpec.com.tw4
APM2320A
Typical Operating Characteristics
ID -
Dra
in C
urre
nt (A
)
Drain Current
Tj - Junction Temperature (°C)
Safe Operation Area
VDS - Drain - Source Voltage (V)
Thermal Transient Impedance
Square Wave Pulse Duration (sec)
Power Dissipation
Pto
t - P
ower
(W)
Tj - Junction Temperature (°C)
ID -
Dra
in C
urre
nt (A
)
Nor
mal
ized
Tra
nsie
nt T
herm
al R
esis
tanc
e
0 20 40 60 80 100 120 140 1600.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
TA=25oC
1E-4 1E-3 0.01 0.1 1 10 1000.01
0.1
1
2
Mounted on 1in2 padR
θJA : 150 oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
0.01 0.1 1 10 1000.01
0.1
1
10
20
Rds(
on) L
imit
1s
TA=25oC
10ms
300µs
1ms
100ms
DC
0 20 40 60 80 100 120 140 1600.0
0.5
1.0
1.5
2.0
2.5
3.0
TA=25oC,V
G=4.5V
Copyright ANPEC Electronics Corp.Rev. B.4 - Dec, 2008
www.anpec.com.tw5
APM2320A
RD
S(O
N) - O
n - R
esis
tanc
e (m
Ω)
Drain-Source On Resistance
ID - Drain Current (A)
Tj - Junction Temperature (°C)
Gate Threshold Voltage
VDS - Drain-Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Output Characteristics
Transfer Characteristics
VGS - Gate - Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Nor
mal
ized
Thr
esho
ld V
olta
ge
Typical Operating Characteristics (Cont.)
0.0 0.5 1.0 1.5 2.0 2.5 3.00
1
2
3
4
5
6
7
8
9
10
1.5V
2V
VGS
= 3,4,5,6,7,8,9,10V
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
IDS
=250µA
0 2 4 6 8 1030
40
50
60
70
80
90
100
110
120
VGS
=2.5V
VGS
=4.5V
0.0 0.5 1.0 1.5 2.0 2.5 3.000
1
2
3
4
5
6
7
8
9
10
Tj=125oC
Tj=25oC
Tj=-55oC
Copyright ANPEC Electronics Corp.Rev. B.4 - Dec, 2008
www.anpec.com.tw6
APM2320A
VDS - Drain - Source Voltage (V)
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
Tj - Junction Temperature (°C)
C -
Cap
acita
nce
(pF)
VSD - Source - Drain Voltage (V)
Source-Drain Diode Forward
IS -
Sou
rce
Cur
rent
(A)
Capacitance Gate Charge
QG - Gate Charge (nC)
VG
S -
Gat
e - s
ourc
e V
olta
ge (V
)
Typical Operating Characteristics (Cont.)
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.60.1
1
10
Tj=150oC
Tj=25oC
0 5 10 15 20 25 300
50
100
150
200
250
300
350
400
Frequency=1MHz
Crss
Coss
Ciss
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
RON
@Tj=25oC: 65mΩ
0 1 2 3 4 5 6 7 80
2
4
6
8
10
VGS = 4.5V IDS = 2.5A
VDS = 15V IDS = 2.5A
Copyright ANPEC Electronics Corp.Rev. B.4 - Dec, 2008
www.anpec.com.tw7
APM2320A
Package InformationSOT-23-3
0L
VIEW A
0.25
GAUGE PLANESEATING PLANE
AA2
A1
e
D
EE1
SEEVIEW A
b c
e1
MAX.
0.057
0.051
0.024
0.006
0.009
0.0200.012
L 0.30
0
e
e1
E1
E
D
c
b
0.08
0.30
0.60 0.012
0.95 BSC
1.90 BSC
0.22
0.50
0.037 BSC
0.075 BSC
0.003
MIN.
MILLIMETERS
SYMBOL
A1
A2
A
0.00
0.90
SOT-23-3
MAX.
1.45
0.15
1.30
MIN.
0.000
0.035
INCHES
°8°0 °8°0
1.40
2.60
1.80
3.00
2.70 3.10 0.122
0.071
0.1180.102
0.055
0.106
Note : Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side.
Copyright ANPEC Electronics Corp.Rev. B.4 - Dec, 2008
www.anpec.com.tw8
APM2320A
Carrier Tape & Reel Dimensions
A
E1
AB
W
F
T
P0OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
H
T1
A
d
Application A H T1 C d D W E1 F
178.0±2.00 50 MIN. 8.4+2.00 -0.00
13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05
P0 P1 P2 D0 D1 T A0 B0 K0 SOT-23-3
4.0±0.10 4.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.0 MIN. 0.6+0.00
-0.40 3.20±0.20 3.10±0.20 1.50±0.20
(mm)
Devices Per Unit
Package Type Unit Quantity
SOT-23-3 Tape & Reel 3000
Copyright ANPEC Electronics Corp.Rev. B.4 - Dec, 2008
www.anpec.com.tw9
APM2320A
Taping Direction InformationSOT-23-3
Reflow Condition (IR/Convection or VPR Reflow)
t 25 C to Peak
tp
Ramp-up
tL
Ramp-downts
Preheat
Tsmax
Tsmin
TL
TP
25
Tem
per
atur
e
Time
Critical ZoneTL to TP
°
Reliability Test Program
Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles
USER DIRECTION OF FEED
Copyright ANPEC Electronics Corp.Rev. B.4 - Dec, 2008
www.anpec.com.tw10
APM2320A
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.
Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)
100°C 150°C
60-120 seconds
150°C 200°C
60-180 seconds
Time maintained above: - Temperature (TL) - Time (tL)
183°C 60-150 seconds
217°C 60-150 seconds
Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)
10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max.
Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.
Classification Reflow Profiles
Table 2. Pb-free Process – Package Classification Reflow Temperatures
Package Thickness Volume mm3 <350
Volume mm3 350-2000
Volume mm3 >2000
<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*
≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures
Package Thickness Volume mm3
<350 Volume mm3
≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C
Customer Service
Anpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838
Fax : 886-2-2917-3838
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. A.2 - Nov., 2008
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.
APM2360A
Features
Applications
• Power Management in DC/AC Inventer
Systems.
Pin Description
Ordering and Marking Information
Top View of SOT-23
N-Channel MOSFET
• 60V/2.5A ,
RDS(ON)=90mΩ(typ.) @ VGS=10V RDS(ON)=115mΩ(typ.) @ VGS=4.5V
• Super High Dense Cell Design
• Reliable and Rugged
• Lead Free and Green Devices Available
(RoHS Compliant)
APM2360
Handling CodeTemperature RangePackage Code
Package Code A : SOT-23Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material L : Lead Free Device G : Halogen and Lead Free Device
APM2360 A : M60X X - Date Code
Assembly Material
G
S
D
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).
D
G
S
Copyright ANPEC Electronics Corp.Rev. A.2 - Nov., 2008
www.anpec.com.tw2
APM2360A
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)
Electrical Characteristics (TA = 25°C unless otherwise noted)
Symbol Parameter Rating Unit
VDSS Drain-Source Voltage 60
VGSS Gate-Source Voltage ±20 V
ID* Continuous Drain Current 2.5
IDM* 300µs Pulsed Drain Current VGS=10V
10 A
IS* Diode Continuous Forward Current 1 A
TJ Maximum Junction Temperature 150
TSTG Storage Temperature Range -55 to 150 °C
TA=25°C 0.83 PD* Maximum Power Dissipation
TA=100°C 0.3 W
RθJA* Thermal Resistance-Junction to Ambient 150 °C/W
APM2360A Symbol Parameter Test Conditions
Min. Typ. Max. Unit
STATIC CHARACTERISTICS
BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 60 - - V
VDS=48V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current
TJ=85°C - - 30 µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1 2.3 3 V
IGSS Gate Leakage Current VGS=±20V, VDS=0V - - ±100 nA
VGS=10V, IDS=2.5A - 90 120 RDS(ON)
a Drain-Source On-state Resistance VGS=4.5V, IDS=2A - 115 155
mΩ
VSDa Diode Forward Voltage ISD=1A, VGS=0V - 0.8 1.1 V
GATE CHARGE CHARACTERISTICS b
Qg Total Gate Charge - 8 11
Qgs Gate-Source Charge - 1.5 -
Qgd Gate-Drain Charge
VDS=30V, VGS=10V, IDS=2.5A
- 1.9 -
nC
Note : *Surface Mounted on 1in2 pad area, t ≤ 10sec.
Copyright ANPEC Electronics Corp.Rev. A.2 - Nov., 2008
www.anpec.com.tw3
APM2360A
APM2360A Symbol Parameter Test Conditions
Min. Typ. Max. Unit
DYNAMIC CHARACTERISTICS b
RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 1.3 - Ω
Ciss Input Capacitance - 365 -
Coss Output Capacitance - 40 -
Crss Reverse Transfer Capacitance
VGS=0V, VDS=30V, Frequency=1.0MHz - 20 -
pF
td(ON) Turn-on Delay Time - 6 12
tr Turn-on Rise Time - 7 14
td(OFF) Turn-off Delay Time - 15 28
tf Turn-off Fall Time
VDD=30V, RL=30Ω, IDS=1A, VGEN=10V, RG=6Ω
- 3 6
ns
trr Reverse Recovery Time - 21 - ns
Qrr Reverse Recovery Charge ISD=2.5A, dISD/dt=100A/µs
- 16 - nC
Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.
Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)
Copyright ANPEC Electronics Corp.Rev. A.2 - Nov., 2008
www.anpec.com.tw4
APM2360A
Typical Operating Characteristics
ID -
Dra
in C
urre
nt (A
)
Drain Current
Tj - Junction Temperature (°C)
Safe Operation Area
VDS - Drain - Source Voltage (V)
Thermal Transient Impedance
Square Wave Pulse Duration (sec)
Power Dissipation
Pto
t - P
ower
(W)
Tj - Junction Temperature (°C)
ID -
Dra
in C
urre
nt (A
)
Nor
mal
ized
Tra
nsie
nt T
herm
al R
esis
tanc
e
0 20 40 60 80 100 120 140 1600.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
TA=25oC
0 20 40 60 80 100 120 140 1600.0
0.5
1.0
1.5
2.0
2.5
3.0
TA=25oC,V
G=10V
0.01 0.1 1 10 100 3001E-3
0.01
0.1
1
10
30
Rds(on
) Lim
it
1s
TA=25oC
10ms
300µs
1ms
100ms
DC
1E-4 1E-3 0.01 0.1 1 10 301E-3
0.01
0.1
1
2
Mounted on 1in2 padR
θJA : 150 oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
Copyright ANPEC Electronics Corp.Rev. A.2 - Nov., 2008
www.anpec.com.tw5
APM2360A
RD
S(O
N) -
On
- Res
ista
nce
(mΩ
)
Drain-Source On Resistance
ID - Drain Current (A)
Tj - Junction Temperature (°C)
Gate Threshold Voltage
VDS - Drain-Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Output Characteristics
Gate-Source On Resistance
VGS - Gate - Source Voltage (V)
RD
S(O
N) -
ON
-Res
ista
nce
(mΩ
)
Nor
mal
ized
Thr
esho
ld V
olta
ge
0.0 0.5 1.0 1.5 2.0 2.5 3.00
1
2
3
4
5
6
7
8
9
10
3.5V
4V
3V
VGS
= 5, 6, 7, 8, 9, 10V
0 2 4 6 8 1040
60
80
100
120
140
160
180
VGS
=4.5V
VGS
=10V
1 2 3 4 5 6 7 8 9 1040
60
80
100
120
140
160
180
200
ID=2.5A
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6IDS
=250µA
Typical Operating Characteristics (Cont.)
Copyright ANPEC Electronics Corp.Rev. A.2 - Nov., 2008
www.anpec.com.tw6
APM2360A
VDS - Drain - Source Voltage (V)
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
Tj - Junction Temperature (°C)
C -
Cap
acita
nce
(pF)
VSD - Source - Drain Voltage (V)
Source-Drain Diode Forward
IS -
Sou
rce
Cur
rent
(A)
Capacitance Gate Charge
QG - Gate Charge (nC)
VG
S -
Gat
e - s
ourc
e V
olta
ge (V
)
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
RON
@Tj=25oC: 90mΩ
VGS
= 10V
IDS
= 2.5A
0.0 0.3 0.6 0.9 1.2 1.50.1
1
10
Tj=150oC
Tj=25oC
0 5 10 15 20 25 300
50
100
150
200
250
300
350
400
450
500
Frequency=1MHz
CrssCoss
Ciss
0 1 2 3 4 5 6 7 80
1
2
3
4
5
6
7
8
9
10V
DS= 30V
IDS
= 2.5A
Typical Operating Characteristics (Cont.)
Copyright ANPEC Electronics Corp.Rev. A.2 - Nov., 2008
www.anpec.com.tw7
APM2360A
Package InformationSOT-23
0L
VIEW A
0.25
GAUGE PLANESEATING PLANE
AA2
A1
e
D
EE1
SEEVIEW A
b c
e1
MAX.
0.057
0.051
0.024
0.006
0.009
0.0200.012
L 0.30
0
e
e1
E1
E
D
c
b
0.08
0.30
0.60 0.012
0.95 BSC
1.90 BSC
0.22
0.50
0.037 BSC
0.075 BSC
0.003
MIN.
MILLIMETERS
SYMBOL
A1
A2
A
0.00
0.90
SOT-23
MAX.
1.45
0.15
1.30
MIN.
0.000
0.035
INCHES
°8°0 °8°0
1.40
2.60
1.80
3.00
2.70 3.10 0.122
0.071
0.1180.102
0.055
0.106
Note : Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side.
Copyright ANPEC Electronics Corp.Rev. A.2 - Nov., 2008
www.anpec.com.tw8
APM2360A
Carrier Tape & Reel Dimensions
A
E1
AB
W
F
T
P0OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
H
T1
A
d
Application A H T1 C d D W E1 F
178.0±2.00 50 MIN. 8.4+2.00 -0.00
13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05
P0 P1 P2 D0 D1 T A0 B0 K0 SOT-23
4.0±0.10 4.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.0 MIN. 0.6+0.00
-0.40 3.20±0.20 3.10±0.20 1.50±0.20
(mm)
Devices Per Unit
Package Type Unit Quantity
SOT-23 Tape & Reel 3000
Copyright ANPEC Electronics Corp.Rev. A.2 - Nov., 2008
www.anpec.com.tw9
APM2360A
Taping Direction InformationSOT-23
Reflow Condition (IR/Convection or VPR Reflow)
t 25 C to Peak
tp
Ramp-up
tL
Ramp-downts
Preheat
Tsmax
Tsmin
TL
TP
25
Tem
per
atur
e
Time
Critical ZoneTL to TP
°
Reliability Test Program
Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles
USER DIRECTION OF FEED
Copyright ANPEC Electronics Corp.Rev. A.2 - Nov., 2008
www.anpec.com.tw10
APM2360A
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.
Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)
100°C 150°C
60-120 seconds
150°C 200°C
60-180 seconds
Time maintained above: - Temperature (TL) - Time (tL)
183°C 60-150 seconds
217°C 60-150 seconds
Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)
10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max.
Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.
Classification Reflow Profiles
Table 2. Pb-free Process – Package Classification Reflow Temperatures
Package Thickness Volume mm3 <350
Volume mm3 350-2000
Volume mm3 >2000
<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*
≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures
Package Thickness Volume mm3
<350 Volume mm3
≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C
Customer Service
Anpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838
Fax : 886-2-2917-3838
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2008
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, andadvise customers to obtain the latest version of relevant information to verify before placing orders.
APM2600C
Features
Applications
Pin Description
Ordering and Marking Information
• 30V/6A,
RDS(ON)=22mΩ(typ.) @ VGS=10VRDS(ON)=26mΩ(typ.) @ VGS=4.5V
• Super High Dense Cell Design
• Reliable and Rugged
• Lead Free and Green Devices Available
(RoHS Compliant)
Top View of SOT-23-6
N-Channel MOSFET
• Power Management in Notebook Computer,
Portable Equipment and Battery PoweredSystems
D
D D
D S
G
(3)G
(4)S
(1,2,5,6)D D D D
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).
APM2600
Handling CodeTemperature RangePackage Code
Package Code C : SOT-23-6Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material G : Halogen and Lead Free Device
APM2600 C : M00X X - Date Code
Assembly Material
Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2008
www.anpec.com.tw2
APM2600C
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)
Electrical Characteristics (TA = 25°C unless otherwise noted)
Symbol Parameter Rating Unit
VDSS Drain-Source Voltage 30
VGSS Gate-Source Voltage ±20 V
ID* Continuous Drain Current 6
IDM* 300µs Pulsed Drain Current VGS=10V
18 A
IS* Diode Continuous Forward Current 1.4 A
TJ Maximum Junction Temperature 150
TSTG Storage Temperature Range -55 to 150 °C
TA=25°C 1.4 PD* Maximum Power Dissipation
TA=100°C 0.5 W
RθJA* Thermal Resistance-Junction to Ambient 90 °C/W
Note : *Surface Mounted on 1in2 pad area, t ≤ 5sec.
APM2600C Symbol Parameter Test Conditions
Min. Typ. Max. Unit
STATIC CHARACTERISTICS
BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 30 - - V
VDS=24V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current
TJ=85°C - - 30 µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 1 1.5 2 V
IGSS Gate Leakage Current VGS=±20V, VDS=0V - - ±100 nA
VGS=10V, IDS=6A - 22 28 RDS(ON)
a Drain-Source On-State Resistance VGS=4.5V, IDS=4.5A - 26 35
mΩ
VSDa Diode Forward Voltage ISD=1.4A, VGS=0V - 0.8 1.3 V
GATE CHARGE CHARACTERISTICS b
Qg Total Gate Charge - 9 13
Qgs Gate-Source Charge - 1.5 -
Qgd Gate-Drain Charge
VDS=15V, VGS=4.5V, IDS=6A
- 3.7 -
nC
Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2008
www.anpec.com.tw3
APM2600C
Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)
APM2600C Symbol Parameter Test Conditions
Min. Typ. Max. Unit
DYNAMIC CHARACTERISTICS b
RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 1.7 - Ω
Ciss Input Capacitance - 800 -
Coss Output Capacitance - 120 -
Crss Reverse Transfer Capacitance
VGS=0V, VDS=15V, Frequency=1.0MHz - 90 -
pF
td(ON) Turn-on Delay Time - 5 10
Tr Turn-on Rise Time - 9 17
td(OFF) Turn-off Delay Time - 25 46
Tf Turn-off Fall Time
VDD=10V, RL=10Ω, IDS=1A, VGEN=4.5V, RG=6Ω
- 5 10
ns
trr Reverse Recovery Time - 16 - ns
Qrr Reverse Recovery Charge IDS=6A, dlSD/dt=100A/µs
- 10 - nC
Note a : Pulse test ; pulse width≤300µs, duty cycle≤2%. Note b : Guaranteed by design, not subject to production testing.
Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2008
www.anpec.com.tw4
APM2600C
Typical Operating Characteristics
I D -
Dra
in C
urre
nt (A
)
Drain Current
TJ - Junction Temperature (°C)
Safe Operation Area
VDS - Drain - Source Voltage (V)
Nor
mal
ized
Effe
ctiv
e T
rans
ient
Thermal Transient Impedance
Square Wave Pulse Duration (sec)
Power Dissipation
Pto
t - P
ower
(W)
TJ - Junction Temperature (°C)
I D -
Dra
in C
urre
nt (A
)
1E-4 1E-3 0.01 0.1 1 10 1001E-3
0.01
0.1
1
2
Mounted on 1in2 padR
θJA : 90 oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
0 20 40 60 80 100 120 140 1600.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
TA=25oC
0 20 40 60 80 100 120 140 1600
1
2
3
4
5
6
7
TA=25oC,V
G=10V
0.01 0.1 1 10 1000.01
0.1
1
10
50
300µsRds(on
) Lim
it
TA=25oC
10ms
1ms
100ms
DC
Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2008
www.anpec.com.tw5
APM2600C
RD
S(O
N) -
On
- R
esis
tanc
e (m
Ω)
Drain-Source On Resistance
ID - Drain Current (A)
TJ- Junction Temperature (°C)
Gate Threshold Voltage
VDS - Drain - Source Voltage (V)
I D -
Dra
in C
urre
nt (A
)
Output Characteristics
Drain-Source On Resistance
VGS - Gate - Source Voltage (V)
RD
S(O
N) -
On
Res
ista
nce
(mΩ
)
Nor
mal
ized
Thr
esho
ld V
olta
ge
0.0 0.5 1.0 1.5 2.0 2.5 3.00
2
4
6
8
10
12
14
16
18
2.5V
3V
2V
VGS
= 4, 5, 6, 7, 8, 9, 10V
0 2 4 6 8 10 12 14 16 188
12
16
20
24
28
32
36
40
VGS
=10V
VGS
=4.5V
1 2 3 4 5 6 7 8 9 1010
15
20
25
30
35
40
45
50
ID=6A
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8IDS
= 250µA
Typical Operating Characteristics (Cont.)
Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2008
www.anpec.com.tw6
APM2600C
VDS - Drain - Source Voltage (V)
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
TJ- Junction Temperature (°C)
C -
Cap
acita
nce
(pF)
VSD - Source - Drain Voltage (V)
Source-Drain Diode Forward
I S -
Sou
rce
Cur
rent
(A)
Capacitance Gate Charge
QG - Gate Charge (nC)
VG
S -
Gat
e - s
ourc
e V
olta
ge (V
)
-50 -25 0 25 50 75 100 125 1500.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
RON
@Tj=25oC: 22mΩ
VGS
= 10V
IDS
= 6A
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.60.1
1
10
20
Tj=25oC
Tj=150oC
0 5 10 15 20 25 300
100
200
300
400
500
600
700
800
900
1000
1100
1200
Frequency=1MHz
CrssCoss
Ciss
0 4 8 12 16 200
1
2
3
4
5
6
7
8
9
10V
DS= 15V
ID = 6A
Typical Operating Characteristics (Cont.)
Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2008
www.anpec.com.tw7
APM2600C
Package InformationSOT-23-6
0L
VIEW A0.
25
GAUGE PLANESEATING PLANE
AA2
A1
e
D
E1
SEEVIEW A
b c
e1
E
0° 8° 0° 8°
0.020
0.009
0.006
0.024
0.051
0.057
MAX.
0.30L
0
E
e
e1
E1
D
c
b
0.08
0.30
0.0120.60
0.95 BSC
1.90 BSC
0.50
0.22
0.075 BSC
0.037 BSC
0.012
0.003
MILLIMETERS
MIN.
SYMBOL
A1
A2
A
0.00
0.90
SOT-23-6
MAX.
1.30
0.15
1.45
MIN.
0.000
0.035
INCHES
1.40
2.60 3.00
1.80
2.70 3.10
0.118
0.071
0.122
0.102
0.055
0.106
Note : 1. Follow JEDEC TO-178 AB. 2. Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side.
Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2008
www.anpec.com.tw8
APM2600C
Application A H T1 C d D W E1 F
178.0±2.00 50 MIN. 8.4+2.00 -0.00
13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05
P0 P1 P2 D0 D1 T A0 B0 K0 SOT-23-6
4.0±0.10 4.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.0 MIN. 0.6+0.00
-0.40 3.20±0.20 3.10±0.20 1.50±0.20
(mm)
Carrier Tape & Reel Dimensions
H
T1
A
d
A
E1
AB
W
F
T
P0OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
Devices Per Unit
Package Type Unit Quantity
SOT-23-6 Tape & Reel 3000
Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2008
www.anpec.com.tw9
APM2600C
Taping Direction InformationSOT-23-6
Reflow Condition (IR/Convection or VPR Reflow)
t 25 C to Peak
tp
Ramp-up
tL
Ramp-downts
Preheat
Tsmax
Tsmin
TL
TP
25
Tem
per
atur
e
Time
Critical ZoneTL to TP
°
Reliability Test Program
Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles
AAAX AAAX AAAX AAAX AAAX AAAX AAAX
USER DIRECTION OF FEED
Copyright ANPEC Electronics Corp.Rev. A.2 - Dec., 2008
www.anpec.com.tw10
APM2600C
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.
Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)
100°C 150°C
60-120 seconds
150°C 200°C
60-180 seconds
Time maintained above: - Temperature (TL) - Time (tL)
183°C 60-150 seconds
217°C 60-150 seconds
Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)
10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max.
Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.
Classification Reflow Profiles
Table 2. Pb-free Process – Package Classification Reflow Temperatures
Package Thickness Volume mm3 <350
Volume mm3 350-2000
Volume mm3 >2000
<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*
≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures
Package Thickness Volume mm3
<350 Volume mm3
≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C
Customer Service
Anpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838
Fax : 886-2-2917-3838
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. A. 1 - Jun., 2007
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.
APM1402AS
Features
Applications
• Power Management in Notebook Computer,
Portable Equipment and Battery Powered Systems
Pin Description
Ordering and Marking Information
N-Channel MOSFET
Top View of SC-70
• 20V/1.1A,
RDS(ON)= 135mΩ(typ.) @ VGS= 4.5V RDS(ON)= 180mΩ(typ.) @ VGS= 2.5V RDS(ON)= 280mΩ(typ.) @ VGS= 1.8V
• Super High Dense Cell Design
• Reliable and Rugged
• Lead Free Available (RoHS Compliant)
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte in plate termina-tion finish; which are fully compliant with RoHS and compatible with both SnPb and lead-free soldering operations.ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C for MSL classifica-tion at lead-free peak reflow temperature.
APM1402A
Handling CodeTemp. RangePackage Code
Package Code S : SC-70Operating Junction Temp. Range C : -55 to 150 CHandling Code TR : Tape & ReelLead Free Code L : Lead Free Device
APM1402A S : 02
Lead Free Code°
D
S
G
Copyright ANPEC Electronics Corp.Rev. A.1 - Jun., 2007
www.anpec.com.tw2
APM1402AS
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)
Electrical Characteristics (TA = 25°C unless otherwise noted)
Symbol Parameter Rating Unit
VDSS Drain-Source Voltage 20
VGSS Gate-Source Voltage ±12 V
ID* Continuous Drain Current 1.1
IDM* 300µs Pulsed Drain Current VGS=4.5V
4.4 A
IS* Diode Continuous Forward Current 0.4 A
TJ Maximum Junction Temperature 150
TSTG Storage Temperature Range -55 to 150 °C
TA=25°C 0.35 PD* Maximum Power Dissipation
TA=100°C 0.14 W
RθJA* Thermal Resistance-Junction to Ambient 360 °C/W Note:
*Surface Mounted on 1in2 pad area, t ≤ 10sec.
APM1402AS Symbol Parameter Test Condition
Min. Typ. Max. Unit
Static Characteristics
BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 20 V
VDS=16V, VGS=0V 1 IDSS Zero Gate Voltage Drain Current
TJ=85°C 30 µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 0.5 0.7 1 V
IGSS Gate Leakage Current VGS=±10V, VDS=0V ±10 µA
VGS=4.5V, IDS=1.1A 135 175
VGS=2.5V, IDS=0.8A 180 250 RDS(ON) a Drain-Source On-state Resistance
VGS=1.8V, IDS=0.5A 280 450
mΩ
Diode Characteristics
VSDa Diode Forward Voltage ISD=0.4A, VGS=0V 0.8 1.3 V
trr Reverse Recovery Time 13 ns
qrr Reverse Recovery Charge ISD=1.1A, dlSD/dt=100A/µs
3 nC
Copyright ANPEC Electronics Corp.Rev. A.1 - Jun., 2007
www.anpec.com.tw3
APM1402AS
Notes:a : Pulse test ; pulse width ≤300µs, duty cycle ≤ 2%.b : Guaranteed by design, not subject to production testing.
APM1402AS Symbol Parameter Test Condition
Min. Typ. Max. Unit
Dynamic Characteristics b
RG Gate Resistance VGS=0V,VDS=0V,F=1MHz 6.7 Ω
Ciss Input Capacitance 100
Coss Output Capacitance 26
Crss Reverse Transfer Capacitance
VGS=0V, VDS=10V, Frequency=1.0MHz 18
pF
td(ON) Turn-on Delay Time 2 5
tr Turn-on Rise Time 14 26
td(OFF) Turn-off Delay Time 12 23
tf Turn-off Fall Time
VDD=10V, RL=10Ω, IDS=1A, VGEN=4.5V, RG=6Ω
2 5
ns
Gate Charge Characteristics b
Qg Total Gate Charge 1.7 2.4
Qgs Gate-Source Charge 0.3
Qgd Gate-Drain Charge
VDS=10V, VGS=4.5V, IDS=1.1A
0.6
nC
Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)
Copyright ANPEC Electronics Corp.Rev. A.1 - Jun., 2007
www.anpec.com.tw4
APM1402AS
0 20 40 60 80 100 120 140 1600.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
TA=25oC
Typical Characteristics
ID -
Dra
in C
urre
nt (A
)
Drain Current
Tj - Junction Temperature (°C)
Safe Operation Area
VDS - Drain - Source Voltage (V)
Thermal Transient Impedance
Square Wave Pulse Duration (sec)
Power Dissipation
Pto
t - P
ower
(W)
Tj - Junction Temperature (°C)
ID -
Dra
in C
urre
nt (A
)
Nor
mal
ized
Tra
nsie
nt T
herm
al R
esis
tanc
e
0 20 40 60 80 100 120 140 1600.0
0.2
0.4
0.6
0.8
1.0
1.2
TA=25oC,V
G=4.5V
0.01 0.1 1 10 1000.01
0.1
1
10
Rds(
on) L
imit
1s
TA=25oC
10ms
300µs
1ms
100ms
DC
1E-4 1E-3 0.01 0.1 1 10 1001E-3
0.01
0.1
1
2
Mounted on 1in2 padR
θJA : 360 oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
Copyright ANPEC Electronics Corp.Rev. A.1 - Jun., 2007
www.anpec.com.tw5
APM1402AS
0 1 2 3 4 5 6 7 8 9 1050
100
150
200
250
300
350
400
ID=1.1A
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.550
100
150
200
250
300
350
400
VGS
=1.8V
VGS
=2.5V
VGS
=4.5V
RD
S(O
N) -
On
- Res
ista
nce
(mΩ
)
Drain-Source On Resistance
ID - Drain Current (A)
Tj - Junction Temperature (°C)
Gate Threshold Voltage
Nor
mal
ized
Thr
esho
ld V
olta
ge
VDS - Drain - Source Voltage (V)
ID -
Dra
in C
urre
nt (A
)
Output Characteristics
Drain-Source On Resistance
VGS - Gate - Source Voltage (V)
Typical Characteristics (Cont.)
0.0 0.5 1.0 1.5 2.0 2.5 3.00.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
2V
1.5V
VGS
=2.5,3,4,5,6,7,8,9,10V
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8IDS
=250µA
RD
S(O
N) -
On
- Res
ista
nce
(mΩ
)
Copyright ANPEC Electronics Corp.Rev. A.1 - Jun., 2007
www.anpec.com.tw6
APM1402AS
VDS - Drain - Source Voltage (V)
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
Tj - Junction Temperature (°C)
C -
Cap
acita
nce
(pF)
VSD - Source - Drain Voltage (V)
Source-Drain Diode Forward
IS -
Sou
rce
Cur
rent
(A)
Capacitance Gate Charge
QG - Gate Charge (nC)
VG
S -
Gat
e-so
urce
Vol
tage
(V
)
Typical Characteristics (Cont.)
-50 -25 0 25 50 75 100 125 1500.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
RON
@Tj = 25°C : 135mΩ
VGS
= 4.5V
IDS
= 1.1A
0.0 0.4 0.8 1.2 1.6 2.00.1
1
5
Tj=150oC
Tj=25oC
0 4 8 12 16 200
20
40
60
80
100
120
140
160
Frequency=1MHz
CrssCoss
Ciss
0.0 0.4 0.8 1.2 1.6 2.00.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0V
DS= 10V
IDS
= 1.1A
Copyright ANPEC Electronics Corp.Rev. A.1 - Jun., 2007
www.anpec.com.tw7
APM1402AS
Package Information
SC-70
0L
VIEW A
0.15
SEATING PLANEGAUGE PLANE
AA2
A1
e
D
EE1
SEE VIEW A
b c
e1
SYMBOL MIN. MAX.
1.10
0.00
0.08 0.25
0.10
A
A1
c
D
E
E1
e
e1
L
MILLIMETERS
b 0.15 0.30
0.65 BSC
SC-70
0.15 0.45
0.026 BSC
MIN. MAX.
INCHES
0.043
0.000
0.031 0.040
0.003 0.010
0.006 0.018
0.004
A2 0.80 1.00
0.006 0.012
1.30 BSC 0.051 BSC
1.25 BSC 0.049 BSC
2.10 BSC 0.083 BSC
2.00 BSC 0.079 BSC
0 0 ° 0 °8 ° 8 °
Copyright ANPEC Electronics Corp.Rev. A.1 - Jun., 2007
www.anpec.com.tw8
APM1402AS
Carrier Tape & Reel Dimensions
Devices Per Unit
Package Type Unit Quantity SC-70 Type & Reel 3000
H
T1
A
d
A
E1
AB
W
F
T
P0OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
Application A H T1 C d D W E1 F
178.0±2.00 50 MIN. 8.4+2.00 13.0+0.50 -0.20
1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05
P0 P1 P2 D0 D1 T A0 B0 K0 SC-70
4.0±0.10 4.0±0.10 2.0±0.05 1.5+0.10 1.0-0.00 0.6-0.40 2.4±0.20 2.4±0.20 1.2±0.20
(mm)
Copyright ANPEC Electronics Corp.Rev. A.1 - Jun., 2007
www.anpec.com.tw9
APM1402AS
Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles ESD MIL-STD-883D-3015.7 VHBM > 2KV, VMM > 200V Latch-Up JESD 78 10ms, 1tr > 100mA
Reflow Condition (IR/Convection or VPR Reflow)
Classification Reflow ProfilesProfile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.
Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts)
100°C 150°C
60-120 seconds
150°C 200°C
60-180 seconds
Time maintained above: - Temperature (TL) - Time (tL)
183°C 60-150 seconds
217°C 60-150 seconds
Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp)
10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Notes: All temperatures refer to topside of the package. Measured on the body surface.
Reliability Test Program
t 25 C to Peak
tp
Ramp-up
tL
Ramp-downts
Preheat
Tsmax
Tsmin
TL
TP
25
Tem
per
atur
e
Time
Critical ZoneTL to TP
°
Copyright ANPEC Electronics Corp.Rev. A.1 - Jun., 2007
www.anpec.com.tw10
APM1402AS
Table 2. Pb-free Process – Package Classification Reflow Temperatures Package Thickness Volume mm3
<350 Volume mm3
350-2000 Volume mm3
>2000 <1.6 mm 260 +0°C* 260 +0°C* 260 +0°C*
1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C* ≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C*
*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures Package Thickness Volume mm3
<350 Volume mm3
≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C
Classification Reflow Profiles (Cont.)
Customer Service
Anpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838Fax : 886-2-2917-3838
N-Channel Enhancement Mode MOSFET
Copyright ANPEC Electronics Corp.Rev. A.2 - May., 2009
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advisecustomers to obtain the latest version of relevant information to verify before placing orders.
APM1404AS
Features
Applications
• Power Management in Notebook Computer,
Portable Equipment and Battery Powered Systems
Pin Description
Ordering and Marking Information
N-Channel MOSFET
Top View of SC70-3
• 20V/1.5A,
RDS(ON)= 65mΩ(typ.) @ VGS= 4.5V RDS(ON)= 80mΩ(typ.) @ VGS= 2.5V RDS(ON)= 110mΩ(typ.) @ VGS= 1.8V
• Super High Dense Cell Design
• Reliable and Rugged
• Lead Free and Green Devices Available
(RoHS Compliant)
D
S
G
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirementsof IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” tomean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneousmaterial and total of Br and Cl does not exceed 1500ppm by weight).
APM1404A
Handling CodeTemperature RangePackage Code
Package Code S : SC70-3Operating Junction Temperature Range C : -55 to 150 oCHandling Code TR : Tape & ReelAssembly Material G : Halogen and Lead Free Device
APM1404A S : 04
Assembly Material
G
S
D
Copyright ANPEC Electronics Corp.Rev. A.2 - May., 2009
www.anpec.com.tw2
APM1404AS
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)
Electrical Characteristics (TA = 25°C unless otherwise noted)
Symbol Parameter Rating Unit
VDSS Drain-Source Voltage 20
VGSS Gate-Source Voltage ±12 V
ID* Continuous Drain Current 1.5
IDM* 300µs Pulsed Drain Current VGS=4.5V
6 A
IS* Diode Continuous Forward Current 0.5 A
TJ Maximum Junction Temperature 150
TSTG Storage Temperature Range -55 to 150 °C
TA=25°C 0.35 PD* Maximum Power Dissipation
TA=100°C 0.14 W
RθJA* Thermal Resistance-Junction to Ambient 360 °C/W
Note : *Surface Mounted on 1in2 pad area, t ≤ 10sec.
APM1404AS Symbol Parameter Test Conditions
Min. Typ. Max. Unit
Static Characteristics
BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA 20 - - V
VDS=16V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current
TJ=85°C - - 30 µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 0.5 0.7 1 V
IGSS Gate Leakage Current VGS=±10V, VDS=0V - - ±10 µA
VGS=4.5V, IDS=1.5A - 65 85
VGS=2.5V, IDS=1.2A - 80 110 RDS(ON) a Drain-Source On-State Resistance
VGS=1.8V, IDS=0.5A - 110 200
mΩ
Diode Characteristics
VSD a Diode Forward Voltage ISD=0.5A, VGS=0V - 0.8 1.3 V
trr Reverse Recovery Time - 12 - ns
qrr Reverse Recovery Charge ISD=1.5A, dlSD/dt=100A/µs
- 3 - nC
Copyright ANPEC Electronics Corp.Rev. A.2 - May., 2009
www.anpec.com.tw3
APM1404AS
Note a : Pulse test ; pulse width ≤300µs, duty cycle ≤ 2%.Note b : Guaranteed by design, not subject to production testing.
APM1404AS Symbol Parameter Test Conditions
Min. Typ. Max. Unit
Dynamic Characteristics b
RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 5.1 - Ω
Ciss Input Capacitance - 295 -
Coss Output Capacitance - 66 -
Crss Reverse Transfer Capacitance
VGS=0V, VDS=10V, Frequency=1.0MHz - 50 -
pF
td(ON) Turn-on Delay Time - 3 6
tr Turn-on Rise Time - 13 24
td(OFF) Turn-off Delay Time - 20 37
tf Turn-off Fall Time
VDD=10V, RL=10Ω, IDS=1A, VGEN=4.5V, RG=6Ω
- 3 6
ns
Gate Charge Characteristics b
Qg Total Gate Charge - 4.4 6.2
Qgs Gate-Source Charge - 0.5 -
Qgd Gate-Drain Charge
VDS=10V, VGS=4.5V, IDS=1.5A
- 1.4 -
nC
Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)
Copyright ANPEC Electronics Corp.Rev. A.2 - May., 2009
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APM1404AS
I D -
Dra
in C
urre
nt (
A)
Drain Current
Tj - Junction Temperature (°C)
Safe Operation Area
VDS - Drain - Source Voltage (V)
Thermal Transient Impedance
Square Wave Pulse Duration (sec)
Power Dissipation
Pto
t - P
ower
(W)
Tj - Junction Temperature (°C)
I D -
Dra
in C
urre
nt (A
)
Nor
mal
ized
Tra
nsie
nt T
herm
al R
esis
tanc
e
0 20 40 60 80 100 120 140 1600.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
TA=25oC
0 20 40 60 80 100 120 140 1600.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
TA=25oC,V
G=4.5V
1E-4 1E-3 0.01 0.1 1 10 1001E-3
0.01
0.1
1
2
Mounted on 1in2 padR
θJA : 360 oC/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
0.01 0.1 1 10 1000.01
0.1
1
10
Rds(
on) L
imit
1s
TA=25oC
10ms
300µs
1ms
100ms
DC
Typical Operating Characteristics
Copyright ANPEC Electronics Corp.Rev. A.2 - May., 2009
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APM1404AS
RD
S(O
N) -
On
- R
esis
tanc
e (m
Ω)
Drain-Source On Resistance
ID - Drain Current (A)
Tj - Junction Temperature (°C)
Gate Threshold Voltage
Nor
mal
ized
Thr
esho
ld V
olta
ge
VDS - Drain - Source Voltage (V)
I D -
Dra
in C
urre
nt (A
)
Output Characteristics
Drain-Source On Resistance
VGS - Gate - Source Voltage (V)
RD
S(O
N) -
On
- R
esis
tanc
e (m
Ω)
0.0 0.5 1.0 1.5 2.0 2.5 3.00
1
2
3
4
5
6
1.5V
VGS
=2,2.5,3,4,5,6,7,8,9,10V
-50 -25 0 25 50 75 100 125 1500.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8IDS
=250µA
1 2 3 4 5 6 7 8 9 1040
50
60
70
80
90
100
110
120
ID=1.5A
0 1 2 3 4 5 620
40
60
80
100
120
140
160
180
200
VGS
=1.8V
VGS
=2.5V
VGS
=4.5V
Typical Operating Characteristics (Cont.)
Copyright ANPEC Electronics Corp.Rev. A.2 - May., 2009
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APM1404AS
VDS - Drain - Source Voltage (V)
Drain-Source On Resistance
Nor
mal
ized
On
Res
ista
nce
Tj - Junction Temperature (°C)
C -
Cap
acita
nce
(pF)
VSD - Source - Drain Voltage (V)
Source-Drain Diode Forward
I S -
Sou
rce
Cur
rent
(A)
Capacitance Gate Charge
QG - Gate Charge (nC)
VG
S -
Gat
e-so
urce
Vol
tage
(V)
Typical Operating Characteristics (Cont.)
-50 -25 0 25 50 75 100 125 1500.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
RON
@Tj = 25°C : 65mΩ
VGS
= 4.5V
IDS
= 1.5A
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.60.1
1
6
Tj=150oC
Tj=25oC
0 4 8 12 16 200
50
100
150
200
250
300
350
400
450
500
Frequency=1MHz
CrssCoss
Ciss
0 1 2 3 4 50.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0V
DS= 10V
IDS
= 1.5A
Copyright ANPEC Electronics Corp.Rev. A.2 - May., 2009
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APM1404AS
Package Information
SC70-3
0L
VIEW A0.
15
SEATING PLANEGAUGE PLANE
AA2
A1
e
D
EE1
SEE VIEW A
b c
e1
Note: 1. Followed from JEDEC MO-223. 2. Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side.
SYMBOL MIN. MAX.
1.10
0.00
0.08 0.25
0.10
A
A1
c
D
E
E1
e
e1
L
MILLIMETERS
b 0.15 0.30
0.65 BSC
SC70-3
0.15 0.45
0.026 BSC
MIN. MAX.
INCHES
0.043
0.000
0.031 0.040
0.003 0.010
0.006 0.018
0.004
A2 0.80 1.00
0.006 0.012
1.30 BSC 0.051 BSC
0 0° 0 °8° 8°
1.90 2.20
2.00 2.40
1.15 1.35
0.075 0.087
0.045 0.053
0.079 0.095
0.80 0.031
Copyright ANPEC Electronics Corp.Rev. A.2 - May., 2009
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APM1404AS
Carrier Tape & Reel Dimensions
Application A H T1 C d D W E1 F
178.0±2.00 50 MIN. 8.4+2.00 13.0+0.50 -0.20
1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05
P0 P1 P2 D0 D1 T A0 B0 K0 SC70-3
4.0±0.10 4.0±0.10 2.0±0.05 1.5+0.10 1.0-0.00 0.6-0.40 2.4±0.20 2.4±0.20 1.2±0.20
(mm)
Devices Per Unit
Package Type Unit Quantity
SC70-3 Type & Reel 3000
H
T1
A
d
A
E1
AB
W
F
T
P0OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
Copyright ANPEC Electronics Corp.Rev. A.2 - May., 2009
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APM1404AS
Taping Direction Information
Classification Profile
SC70-3
USER DIRECTION OF FEED
Copyright ANPEC Electronics Corp.Rev. A.2 - May., 2009
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APM1404AS
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts)
100 °C 150 °C
60-120 seconds
150 °C 200 °C
60-120 seconds
Average ramp-up rate (Tsmax to TP) 3 °C/second max. 3°C/second max.
Liquidous temperature (TL) Time at liquidous (tL)
183 °C 60-150 seconds
217 °C 60-150 seconds
Peak package body Temperature (Tp)*
See Classification Temp in table 1 See Classification Temp in table 2
Time (tP)** within 5°C of the specified classification temperature (Tc)
20** seconds 30** seconds
Average ramp-down rate (Tp to Tsmax) 6 °C/second max. 6 °C/second max.
Time 25°C to peak temperature 6 minutes max. 8 minutes max.
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Classification Reflow Profiles
Table 2. Pb-free Process – Classification Temperatures (Tc)
Package Thickness
Volume mm3 <350
Volume mm3 350-2000
Volume mm3 >2000
<1.6 mm 260 °C 260 °C 260 °C 1.6 mm – 2.5 mm 260 °C 250 °C 245 °C
≥2.5 mm 250 °C 245 °C 245 °C
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc) Package
Thickness Volume mm3
<350 Volume mm3
≥350 <2.5 mm 235 °C 220 °C
≥2.5 mm 220 °C 220 °C
Reliability Test Program
Test item Method Description SOLDERABILITY JESD-22, B102 5 Sec, 245°C HOLT JESD-22, A108 1000 Hrs, Bias @ 125°C PCT JESD-22, A102 168 Hrs, 100%RH, 2atm, 121°C TCT JESD-22, A104 500 Cycles, -65°C~150°C
Copyright ANPEC Electronics Corp.Rev. A.2 - May., 2009
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APM1404AS
Customer Service
Anpec Electronics Corp.Head Office :
No.6, Dusing 1st Road, SBIP,Hsin-Chu, Taiwan, R.O.C.Tel : 886-3-5642000Fax : 886-3-5642050
Taipei Branch :2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,Sindain City, Taipei County 23146, TaiwanTel : 886-2-2910-3838
Fax : 886-2-2917-3838