FGH40N60
-
Upload
roger-follano -
Category
Documents
-
view
218 -
download
0
Transcript of FGH40N60
-
8/12/2019 FGH40N60
1/9
tm
t p
July 2008
Absolute Maximum Rat ings
Notes:1: Repetitive rating: Pulse width limited by max. junction temperature
Thermal Characteristics
Symbol Description Ratings UnitsVCES Collector to Emitter Voltage 600 V
VGES Gate to Emitter Voltage 20 V
ICCollector Current @ T C = 25
oC 80 A
Collector Current @ T C = 100oC 40 A
ICM (1) Pulsed Collector Current @ T C = 25oC 120 A
P DMaximum Power Dissipation @ T C = 25
oC 290 W
Maximum Power Dissipation @ T C = 100oC 116 W
TJ Operating Junction Temperature -55 to +150oC
Tstg Storage Temperature Range -55 to +150o
CTL
Maximum Lead Temp. for solderingPurposes, 1/8 from case for 5 seconds 300
oC
Symbol Parameter Typ. Max. UnitsRJC (IGBT) Thermal Resistance, Junction to Case - 0.43
oC /W
RJC (Diode) Thermal Resistance, Junction to Case - 1.45oC /W
RJA Thermal Resistance, Junction to Ambient - 40oC /W
G
E
CEC
G
COLLECTOR(FLANGE)
FGH40N60SFD600V, 40A Field Stop IGBT
Features High current capability Low saturation voltage: V CE(sat) =2.3V @ I C = 40A High input impedance Fast switching RoHS compliant
Appl ications Induction Heating, UPS, SMPS, PFC
General Descrip tionUsing Novel Field Stop IGBT Technology, Fairchilds new ses-ries of Field Stop IGBTs offer the optimum performance for Induction Heating, UPS, SMPS and PFC applications wherelow conduction and switching losses are essential.
-
8/12/2019 FGH40N60
2/9
t p
Package Marking and Ordering Information
Electrical Characteristics of the IGBT TC = 25C unless otherwise noted
Device Marking Device PackagePackaging
Type Qty per Tube
Max Qty
per BoxFGH40N60SFD FGH40N60SFDTU TO-247 Tube 30ea -
Symbol Parameter Test Conditions Min. Typ. Max. Units
Off Characteristics
BVCES Collector to Emitter Breakdown Voltage V GE = 0V, I C = 250 A 600 - - V
BVCESTJ
Temperature Coefficient of BreakdownVoltage
VGE = 0V, I C = 250 A - 0.6 - V/ oC
ICES Collector Cut-Off Current V CE = VCES , VGE = 0V - - 250 A
IGES G-E Leakage Current V GE = VGES , VCE = 0V - - 400 nA
On Characteristics
VGE(th) G-E Threshold Voltage I C = 250 A, V CE = VGE 4.0 5.0 6.5 V
VCE(sat) Collector to Emitter Saturation VoltageIC = 40A , VGE = 15V - 2.3 2.9 V
IC = 40A , VGE = 15V,TC = 125
oC - 2.5 - V
Dynamic Characteristics
C ies Input CapacitanceVCE = 30V , VGE = 0V,f = 1MHz
- 2110 - pF
Coes Output Capacitance - 200 - pF
C res Reverse Transfer Capacitance - 60 - pF
Switching Characteristics
td(on) Turn-On Delay Time
VCC = 400V, I C = 40A,RG = 10 , VGE = 15V,Inductive Load, T C = 25
oC
- 25 - ns
tr Rise Time - 42 - ns
td(off) Turn-Off Delay Time - 115 - ns
tf Fall Time - 27 54 ns
Eon Turn-On Switching Loss - 1.13 - mJ
Eoff Turn-Off Switching Loss - 0.31 - mJ
E ts Total Switching Loss - 1.44 - mJ
td(on) Turn-On Delay Time
VCC = 400V, I C = 40A,RG = 10 , VGE = 15V,Inductive Load, T C = 125
oC
- 24 - ns
tr Rise Time - 43 - ns
td(off) Turn-Off Delay Time - 120 - nstf Fall Time - 30 - ns
Eon Turn-On Switching Loss - 1.14 - mJ
Eoff Turn-Off Switching Loss - 0.48 - mJ
E ts Total Switching Loss - 1.62 - mJ
Qg Total Gate ChargeVCE = 400V, I C = 40A,VGE = 15V
- 120 - nC
Qge Gate to Emitter Charge - 14 - nC
Qgc Gate to Collector Charge - 58 - nC
-
8/12/2019 FGH40N60
3/9
t p
Electrical Characteristics of the Diode TC = 25C unless otherwise noted
Symbol Parameter Test Conditions Min. Typ. Max Units
VFM Diode Forward Voltage I F = 20ATC = 25
oC - 1.95 2.6V
TC = 125oC - 1.85 -
trr Diode Reverse Recovery Time
IES =20A, dI ES /dt = 200A/ s
TC = 25oC - 45 -
nsTC = 125
oC - 140 -
Q rr Diode Reverse Recovery ChargeTC = 25
oC - 75 - nCTC = 125
oC - 375 -
-
8/12/2019 FGH40N60
4/9
t p
Typical Performance Characteristics
Figure 1. Typical Output Characteristi cs Figure 2. Typical Output Characteristics
Figure 3. Typical Saturation Voltage Figure 4. Transfer Characteristi cs Characteristics
Figur e 5. Saturation Voltage vs. Case Figur e 6. Saturation Voltage vs. V GETemperature at Variant Current Level
0.0 1.5 3.0 4.5 6.0
0
20
40
60
80
100
120
20V
TC = 25oC
15V
12V
10V
VGE = 8V
C o
l l e c
t o r
C u r r e n
t , I C [ A ]
Collector-Emitter Voltage, V CE [V]0.0 1.5 3.0 4.5 6.0
0
20
40
60
80
100
12020V
TC = 125oC
15V12V
10V
VGE = 8V
C o
l l e c
t o r
C u r r e n
t , I C [ A ]
Collector-Emitter Voltage, V CE [V]
0 1 2 3 40
20
40
60
80Common Emitter VGE = 15V
TC = 25oC
TC = 125oC
C o
l l e c t o
r C u r r e n
t , I C [ A ]
Collector-Emitter Voltage, V CE [V]6 8 10 12 13
0
40
80
120Common Emitter VCE = 20V
TC = 25oC
TC = 125oC
C o
l l e c t o r
C u r r e n
t , I C [ A ]
Gate-Emitter Voltage,V GE [V]
4 8 12 16 200
4
8
12
16
20
IC = 20A
40A80A
Common Emitter
TC = -40oC
C o
l l e c
t o r -
E m
i t t e r
V o
l t a g e ,
V C E
[ V ]
Gate-Emitter Voltage, V GE [V]25 50 75 100 125
1.0
1.5
2.0
2.5
3.0
3.5
4.0
80A
40A
IC = 20A
Common Emitter VGE = 15V
C o
l l e c
t o r -
E m
i t t e r
V o
l t a g e ,
V C E
[ V ]
Collector-EmitterCase Temperature, T C [oC]
-
8/12/2019 FGH40N60
5/9
t p
Typical Performance Characteristics
Figure 7. Saturation Voltage vs. V GE Figure 8. Saturation Voltage vs. V GE
Figure 9. Capacitance Characteristic s Figure 10. Gate charge Characteristi cs
Figure 11. SOA Characteristi cs Figure 12. Turn-on Characteristic s vs.Gate Resistance
4 8 12 16 200
4
8
12
16
20
IC = 20A
40A 80A
Common Emitter
TC = 25oC
C o
l l e c
t o r -
E m
i t t e r
V o
l t a g e ,
V C E
[ V ]
Gate-Emitter Voltage, V GE [V]4 8 12 16 20
0
4
8
12
16
20
IC = 20A
40A80A
Common Emitter
TC = 125oC
C o
l l e c
t o r -
E m
i t t e r
V o
l t a g e ,
V C E
[ V
]
Gate-Emitter Voltage, V GE [V]
0.1 1 100
1000
2000
3000
4000
5000Common Emitter VGE = 0V, f = 1MHz
TC = 25oC
Crss
Coss
Ciss
C a p a c
i t a n c e
[ p F ]
Collector-Emitter Voltage, V CE [V]30 0 50 100 150
0
3
6
9
12
15Common Emitter
TC = 25oC
300V200V
Vcc = 100V
G a
t e - E m
i t t e r
V o
l t a g e ,
V G E
[ V ]
Gate Charge, Q g [nC]
0 10 20 30 40 5010
100
Common Emitter VCC = 400V, V GE = 15VIC = 40A
TC = 25oC
TC = 125oC
td(on)
tr
S w
i t c
h i n g
T i m e
[ n s
]
Gate Resist ance, R G [ ]
200
1 10 100 10000.01
0.1
1
10
100
1ms
10 ms
DCSingle Nonrepetitive
Pulse T C = 25oC
Curves must be deratedlinearly with increasein temperature
10 s
100 s
C o
l l e c
t o r
C u r r e n
t , I c
[ A ]
Collector-Emitter Voltage, V CE [V]
400
-
8/12/2019 FGH40N60
6/9
t p
Typical Performance Characteristics
Figure 13. Turn-off Characteristi cs vs. Figure 14. Turn-on Characteristi cs vs. Gate Resistance Collector Current
Figure 15. Turn-off Characteristic s vs. Figure 16. Switching Loss vs. Gate Resistance Collector Current
Figure 17. Switching Loss vs. Collector Current Figure 18. Turn off Switchin gSOA Characteristics
0 10 20 30 40 5010
100
1000
Common Emitter VCC = 400V, V GE = 15VIC = 40A
TC = 25oC
TC = 125oC
td(off)
tf
S w
i t c
h i n g
T i m e
[ n s
]
Gate Resist ance, R G [ ]
5500
20 40 60 8010
100
500Common Emitter VGE = 15V, R G = 10
TC = 25oC
TC = 125oC
tr
td(on)
S w
i t c
h i n g
T i m e
[ n s
]
Collector Current, I C [A]
20 40 60 8010
100
500Common Emitter VGE = 15V, R G = 10
TC = 25oC
TC = 125oC
td(off)
tf
S w
i t c
h i n g
T i m e
[ n s
]
Collector Current, I C [A]
0 10 20 30 40 500.3
1
10Common Emitter VCC = 400V, V GE = 15V
IC = 40A
TC = 25oC
TC = 125oC E on
Eoff
S w
i t c
h i n g
L o s s
[ m J ]
Gate Resist ance, R G [ ]
0.2
20 30 40 50 60 70 80
0.1
1
10
30Common Emitter V
GE = 15V, R
G = 10
TC = 25oC
TC = 125oC
Eon
Eoff
S w
i t c
h i n g
L o s s
[ m J ]
Collector Current, I C [A]
1 10 100 10001
10
100
Safe Operating Area
VGE = 15V, T C = 125oC
C o
l l e c
t o r
C u r r e n
t , I C [ A ]
Collector-Emitter Voltage, V CE [V]
200
-
8/12/2019 FGH40N60
7/9
t p
Typical Performance Characteristics
Figure 19. Forward Characteristi cs Figure 20. Typical Reverse Current vs. Reverse Voltage
Figur e 21. Stored Charge Figur e 22. Reverse Recovery Time
Figur e 23.Transient Thermal Impedance of IGBT
50 200 400 6000.01
0.1
1
10
100200
R e v e r s e
C u r r e n
t ,
I R [
A
]
Reverse Volt age, V R [V]
TJ = 125oC
TJ = 25oC
TJ = 75oC
0 1 2 3 40.2
1
10
80
TJ = 75oC
TJ = 25oC
TC = 25oC
TC = 75oC
TC = 125oC
TJ = 125oC
Forward Voltage, V F [V]
F o r w a r d
C u r r e n
t , I F [ A ]
5 10 20 30 4030
40
50
60
200A/ s
di/dt = 100A/ s
R e v e r s e R e c o v e r y
T i m e ,
t r r
[ n s
]
Forward Current, I F [A]5 10 20 30 40
20
40
60
80
100
200A/ s
di/dt = 100A/ s
S t o r e
d R e c o v e r y
C h a r g e ,
Q r r
[ n C ]
Forward Current, I F [A]
1E-5 1E-4 1E-3 0.01 0.1 11E-3
0.01
0.1
1
0.2
0.5
0.1
0.05
0.010.02
single pulse
T h e r m a
l R e s p o n s e
[ Z t h j c ]
Rectangular Pulse Duration [sec]
Duty Factor, D = t1/t2
Peak T j = Pdm x Zthjc + T C
t1
P DM
t2
-
8/12/2019 FGH40N60
8/9
t p
Mechanical Dimensions
TO-247AB (FKS PKG CODE 001)
Dimensions in Millimeters
-
8/12/2019 FGH40N60
9/9
Rev. I35
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidianries, and isnot intended to be an exhaustive list of all such trademarks.
* EZSWITCH and FlashWriter are trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMERFAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVERELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANYPRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTH ERS.THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILDS WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTYTHEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICYFAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THEEXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:1. Life support devices or systems are devices or systems which, (a) are
intended for surgical implant into the body or (b) support or sustain life,and (c) whose failure to perform when properly used in accordance withinstructions for use provided in the labeling, can be reasonablyexpected to result in a significant injury of the user.
2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to causethe failure of the life support device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONSDefinition of Terms
Build it NowCorePLUSCorePOWERCROSSVOLT CTLCurrent Transfer LogicEcoSPARK
EfficentMaxEZSWITCH *
Fairchild
Fairchild Semiconductor
FACT Quiet SeriesFACT
FAST
FastvCore
FlashWriter
*
FPSF-PFSFRFET
Global Power Resource SM
Green FPSGreen FPS e-SeriesGTOIntelliMAXISOPLANARMegaBuckMICROCOUPLERMicroFETMicroPakMillerDriveMotionMaxMotion-SPMOPTOLOGIC
OPTOPLANAR
PDP SPMPower-SPMPowerTrench
Programmable Active DroopQFET
QSQuiet SeriesRapidConfigureSaving our world, 1mW at a timeSmartMaxSMART STARTSPM
STEALTHSuperFETSuperSOT-3SuperSOT-6SuperSOT-8Sup re MOSSyncFET
The Power Franchise
TinyBoostTinyBuckTinyLogic
TINYOPTOTinyPowerTinyPWMTinyWire
UHC
Ultra FRFETUniFETVCXVisualMax
tm
tm
tm
Datasheet Identification Product Status Definition
Advance Information Formative / In Design Datasheet contains the design specifications for product development. Specificationsmay change in any manner without notice.
Preliminary First ProductionDatasheet contains preliminary data; supplementary data will be published at a laterdate. Fairchild Semiconductor reserves the right to make changes at any t ime withoutnotice to improve design.
No Ident if icat ion Needed Ful l Product ion Datasheet contains final specifications. Fairchild Semiconductor reserves the right tomake changes at any time without notice to improve the design.
Obsolete Not In Production Datasheet contains specifications on a product that is discontinued by FairchildSemiconductor. The datasheet is for reference information only.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporations Anti-Counterfeiting Policy. Farichilds Anti-Counterfeiting Policy is also stated on our external website,www.fairchildsemi.com, under Sales Support .
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failedapplication, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from theproliferation of counterfeit parts. Farichild strongly encourages customers to purchase Farichild parts either directly from Fairchild or from Authorized FairchildDistributors who are listed by country on our web page cited above. Products customers buy either from fairchild directly or from Authorized FairchildDistributors are genuine parts, have full traceability, meet Fairchilds quality standards for handing and storage and provide access to Farichilds full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address andwarranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Farichild iscommitted to committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorizeddistributors.