FE electronic box
description
Transcript of FE electronic box
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FE electronic box
• Construction of end piece OT module
• Electronic components
• Mechanics
• Cooling
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End-piece Feed trough boards at dummy
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End piece
• The OT module exists out of two identical panels holding 64 straws.
• 2 Feed trough boards connecting HV and gnd over full width to outside world
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End-piece construction
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Feed-trough boards
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Electronic components
• Overview of boards
• Full or half module
• Stacking of boards
• HV and connector section
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Electronic components
• Feed-trough board 2x• HV-board 4x• ASD-board 8x• OTIS-board 4x• GOL-board 1x
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Full or half module
GOL/OTIS board design is made in such a manner that it can switch from left to right
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Stacking of boards
• 2 planes of 64 channels• 32 channel HV-boards• Each HV-board connects
2 ASD-boards• 2 ASD-boards connect L
or R OTIS • OTIS-board L and R
version• GOL-board connects 4
OTIS-boards front and back plane
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HV connector-section
• 4 HV-boards make an enclosure so HV is completely shielded from other electronic parts
• HV space contains 4 boards carrying 32 cap each that are integrated in the board
• HV-distribution inside
• One side HV is coming in other side is low voltage and couples to ASD board trough frame plate.
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Disconnected FE-box
• Fast replacement• FE-box is fully
decoupled from chamber
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Connected FE-box
• full HV-enclosure• Forces from gnd-
spring are not on chamber
• Gnd spring over full width
• 128 gnd contacts on each side
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Spaces for gas-pipes
Gas-pipes
OT-module has a free space on each side of 5 mm for gas pipes
FE-box can easily be removed
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FE box overview
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FE-box exploded view
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Frame 3D
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main mechanic parts
• One plate supports gol/aux boards
• 2 equal support plates on both sides, supporting HV-boards, ASD boards and Otis board.
• 2 extraction/insertion tools are implemented
• Guiding tip guarantees proper mating with chamber connector
A
C
B
D
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Box-enclosure
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Cooling
• Location of dissipating areas • Heat transport trough the frame• Heat transport from chips to frame• measurements
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Dissipating areas
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Frame sideview
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ASDBLR COOLING CONSTRUCTION
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ASDBLR AS TEMPERATURE SENSOR
~750mV~1.8mV/C
We use a dummy inputdiode as temperature sensor(Not callibrated yet)
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NTC 5K on Copper Surface Close to ASDBLR
Each board has a sensorConnection point
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OTIS NTC
NTC UNDER OTIS ON OPOSITE SIDE
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PACKAGED FRONT END COOLING TEST
The Front Ends of the Outer Tracker are closely packed, heat must be extracted with cooling wateralong the Aluminium cooling extension plate. For the test we use a cooling block with forced airSeveral sensors monitor heatup of components.
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Proto Outer Tracker Front-End Tests
27EFNI HK
35 C
Otis52 C
ASDBLR NTC on copper 42C
ASDBLRInput Diode43C
RESULTS AFTER SETTLING
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NTC GRAPH
K ohm
temp
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25
50
30
35
40
45
12 Hours
COOLING BASE
6321
RED ASDBLR NTC ON Copper Board SURFACE 42C
BASEPLATE THERMOMETER 35C
t=0 >power on
REMARKS:1.forced air cooling base with regulators, shifts 10C2.ASDBLR steps up 5C in 2 minutes, then settles to 7C above plate3. OTIS settles 17C above cooling flap part of baseplate
OTIS Copper NTC 52C
BLUE ASDBLR DIODE ~43CASDBLR
17C
8C
FIRST IMPRESSION FROM PAPER RECORDERS AFTER POWER SWITCH ON
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FIRST CONCLUSIONS
The ASDBLR has low temperature rise thanks to strong thermal coupling trough PCB Delta T=7 degrees C
The maximum delta T is 17 degrees C for the Otis chip
The regulators are mounted directly on the cooling plate , no internal sensor available, but adequate cooling is ok.