F3 Board for CAP3 - phys.hawaii.eduidlab/presentations/F3 Board for CAP3… · CAP3: 2.1cm x 0.3 cm...
Transcript of F3 Board for CAP3 - phys.hawaii.eduidlab/presentations/F3 Board for CAP3… · CAP3: 2.1cm x 0.3 cm...
F3 Board for CAP3
Project Talk for Physics 476 Fi nal Present ationMay 12th , 2005
J im K enned y
2Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation
Talk Overview
The B elle exp erim ent at KEK-B Fact ory.V ertex d etect or and the M onolit hic A ctiv e Pix el S ensor (MAPS) technol og y.C ontinu ou s Acqu isition Pix el (CAP): A series of sensors d ev elop ed in H aw aii.The 3rd CA P prot otyp e: CA P3.D ev elopment of a setup for C A P3 testi ng.Plans for the fu tu re & C onclu sion.
3Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation
The Belle detector at KEK-B
~1 km in diameter
Mt. Tsukuba
KEKB Belle
µ / KL detection14/15 lyr. RPC+Fe
Central Drift Chamber
Drift Chambersmall cell +He/C2H5
CsI(Tl) 16X0
Aerogel Cherenkov cnt.n=1.015~1.030
Silicon Vertex
TOF counter
SC solenoid1.5T
8 GeV e-
3.5 GeV e+
Belle detectorBelle detector KEK-B: A e+ e- collider to produce ‘B-mesons’
BELLE: The detector to study the production of ‘B-mesons’
4Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation
Principle of Vertex Detector
Primary interaction point
Production of secondary particles
Decay length
1) Decay length gives a hint at which particle was produced and when.
2) Need accuracy in our extrapolation from recorded hit → Need good hit resolution in layers of detector: small size of detection units, and not so much material
3-layer vertex detector
Error on hit reconstruction
Possible area of decay
5Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation
MAPS technologyPrinciple of MAPS
10µm
- Possibility to implement some electronics logicdirectly on the SI die.
- A very small thickness is achievable: the sensor can be ground down to the epilayer.
- No High Voltage needed.
6Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation
Correlated Double Sampling (CDS)
-Hit candidate!
Frame 1 - Frame 2 =
- Leakage currentCorrection
time
Vreset
∆VtypαIleak
∆VsigαQsignalIntegration time
tfr2tfr1
reset
GND
M1
M2
M3
et
Column
CollectionElectrode
M1
M2
M3
Bus Output
Reset
Collection Electrode
GND
7Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation
The CAP series:
928 x 128 pixels = 118,784
Active area
20.88 mm
~4.5M transistors !CAP1 & CAP2: First 2 prototype sensors developed in Hawaii: small size array, tests successful.
CAP3: 2.1cm x 0.3 cm ‘full-size’ prototype.
The F3 board to test the CAP3 sensor.
8Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation
System for CAP3
MC1 card
Serialized data out from the MC1 card and control signals to the MC1 card through RJ-45 connectors.
CAP3
F3
BE
MOBCADS
9Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation
Project Overview
Prot o ev al b oard and system for t he CAP3. M assiv e d at a transfer from S ensor.S end the d ata at hig h sp eed (LVDS).F3 alig nm ent w ith the b eam w ith a m ov ab le p latform.Prep are for a b eam test thi s J u ne at the KEK “B” fact ory.
10Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation
System Diagram
PixelData
Bias control
16 pairs of signalsper F3 board,6 F3 boards
PMTs
FPGA
F3
Motherboard
MC1card
Back-endboard
CPUsoftware
RAM
PixelData
PixelData~1.43 millions bits for
each entire readout
11Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation
ConclusionSystem integration near completion: tests of hardware, firmware developments (MC1 & BE control).First CAP3 data to be acquired soon.Base evaluation of system to be done in the laboratory.The time schedule is critical: Planning for a beam test with 6 boards in June at KEK test beam.
12Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation
BACKUP SLIDES
13Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation
Silicon Vertex Detector 1 & 2
SVD1 SVD2
• 3 layers → 4 layers
• 23º<θ<139º → 17º<θ<150º
• 1 MRad → >20 MRad
• Rbp = 2.0 cm → 1.5 cm
Better I.P. resolution
SVD1
Summer 2003
SVD2
14Jim Kennedy, May the 12th 2005, Physics 476 Final Presentation
Hybrid Pixels (CMS example)Pixel size: 150µm x 100µmBaseline for vertexing at LHC.
Complex rad-hard ROC, fast electronics (25ns bc), R&D on sensor, thick structure.
Ladders Modules Chips PixelsBarrel 92 752 ~12k ~50M
3 barrel layers / 2 disks: ‘grand total’: ~66M channels
> T.Rohe et al, ‘Charge collection properties of irradiated CMS Pixel Barrel Sensors’, RSSMDD oct 10-13 2004, Firenze, Italy
> M.B. ‘Design & Test of the CMS pixel readout chip’, NIM A 517 (2004) 349-359