Europe’s Research and Development efforts in support of ... · SP-DES Kapton Adhesive...

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Europe’s Research and Development efforts in support of its PV industry European Solar Technology Forum From Research to Industrial Application 30 November 2017

Transcript of Europe’s Research and Development efforts in support of ... · SP-DES Kapton Adhesive...

Page 1: Europe’s Research and Development efforts in support of ... · SP-DES Kapton Adhesive Light-curable Glue UV-curable Glue as edge sealant PSC Device Protective Glass 0 300 600 900

Europe’s Research and Development

efforts in support of its PV industry

European Solar Technology Forum

From Research to Industrial Application

30 November 2017

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Reduction of cost via improvement of

stability / WP10

Suren A. Gevorgyan, Technical University of Denmark

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Objectives

• To develop an “encapsulationless” organic or hybrid solar cell

• To build the methodology to screen materials and layers

combinations for enhanced stability

• To use that innovation as platform for an encapsulated long-lived

organic solar cell

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Web based database

Stable

Encapsulationless

Devices

Material

Screening

Barrier

Application

Final

Stability

Testing

Impact

Analyses

LCA

WP10 PARTNERS

Fraunhofer ISE DE

ECN NL

NPL UK

Imperial College UK

ENEA IT

DTU DK

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E-infrastructure: lifetime database

Lifetime distribution

4

Gevorgyan et al., Adv. Energy Mater. 2015, 1501208 Gevorgyan et al., Adv. Energy Mater. 2016, 6, 1600910

Challenges

Test conditions – ISOS guidelines

Lifetime marker – CHEETAH tool

Encapsulation – ISOS-e

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E-infrastructure: lifetime database

Lifetime calculation and prediction (Key exploitable result)

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Your data was successfully processed. Please review the results below.

Data viewer

Plot

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

50 100 150 200 250 300 350

100 200 300 400 500

E0 1.22

E80 0.97

Energy0 31.60

T0 0.36

T80 28.85

ES 0.80

ES80 0.63

EnergyS 53.07

TS 49.87

TS80 72.40

ESFit 0.80

ES80Fit 0.64

EnergySFit 51.27

TSFit 49.18

TS80Fit 69.30

Data table

Measured dataFiltered dataE0, T0E80, T80ES0, T80ES80, TS80

Measured dataFitted dataE0, T0E80, T80ES0, T80ES80Fit, TS80Fit

Fitted Curve

Filtered Curve

DOI:10.1002/smtd.201700285

PC

E (

%)

PC

E (

%)

TIME (HRS)

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Advanced characterization and metrics

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0.1

1

10

100

1000

dark light light + O2 light + H2O light + O2 +H2O

Life

tim

e (

ho

urs

)PCDTBT FSP1 PCE10

Devices characterised in precisely-controlled

environment – Key Exploitation Result 10

in situ characterisation suite:

• Electrical (I-V curve, impedance spectroscopy)

• Imaging

• Spectroscopy

Data analysis protocol reduces >1,000,000 data points

collected over ~3000 hours to a few key metricsResults

• 7 materials characterised in 5 different

environments

• Compared to encapsulated samples,

lifetimes are highly reproducible

• Differences between materials were

small compared to differences between

conditions

Life

tim

e (

ho

urs

)

Dark UV UV + O2 UV + H2OUV + H2O

+ O2

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Intrinsic versus extrinsic stability

Intrinsic

• Acceptors (NFA)

• Donors

• HTL

Extrinsic

• Adhesives

• Packaging

improvement

Alternative solutions

• Direct sputtering

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Motivation: Improving intrinsic stability →

Easing requirements for encapsulation →

Reducing cost

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Intrinsic stability

Fullerene free devices

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While LED, N2, 50oC Dark 85oC under N2

PCE = 9.5 %

PCE = 10.9 %

PCE = 3 - 4 %

Adv. Mater. 2017, 29, 1701156

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Intrinsic stability

Comparison of device stability for different polymers

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Indoor ISOS-L-2 light soaking tests of packaged devices

0

0.5

1

1.5

2

2.5

3

3.5

PET - Polymer/P3HT (Lifetime)

P3HT

0

0.5

1

1.5

2

2.5

3

3.5

UB with UVF - Polymer/P3HT (Lifetime)

P3HT

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Intrinsic stability

Hydrophilic HTLs reduce stability significantly (under ISOS-L-2 tests)

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Lifetime ratio of samples with thick and thin PEDOT:PSS

hole transport layers with different encapsulation

0

1

2

3

4

5

6

PET UB UBUV

T80th

in /

T8

0th

ick

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Intrinsic versus extrinsic stability

Comparison of device stability for different packaging (ISOS-L-2 tests)

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0

10

20

30

40

50

UB UBUV

T80barrier / T80PET

0

10

20

30

40

50

UB UBUV

TS80barrier / TS80PET

0

10

20

30

40

# o

f d

ata

poin

ts

TS80 (Days)

OPEN

PET

UB

UBUV

0

10

20

30

# o

f d

ata

poin

ts

T80 (Days)

OPEN

PET

UB

UBUV

Hours

4-5 4-4 4-3 4-2 0.25 1 4 16 64 256

Unstable

4-5 4-4 4-3 4-2 0.25 1 4 16 64 256

Literature

average

open

Literature

average

protected

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Extrinsic stability

Packaging procedures: Adhesives

Mixing silica gel with epoxy

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OPENEPOXY

EPOSEAL

0.3 617

Lifetime (hours)

Epoxy/PET

Eposeal/PET

Epoxy/Epoxy/PET

Eposeal/Epoxy/PET

32 5520

450

Lifetime (Seal/Open)

Stabilized lifetime of open devices

with protective adhesive layer

Ratio of lifetimes between sealed

samples and open samples

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Extrinsic stability

Packaging procedures: Electrodes and edges

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0

0.5

1

1.5

2

UBUV UBUV UBUV UBUV

T80soldering / T80snap

0

0.5

1

1.5

2

2.5

3

PET UB UBUV

T80Double / T80Single

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Extrinsic stability

13.000 hours (1.5 years) achieved

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75

80

85

90

95

100

105

0 100 200 300 400 500

PC

E (

A.U

.)

DAYS

PCE Voc Isc FF

75

80

85

90

95

100

105

0 100 200 300 400 500

PC

E (

A.U

.)

DAYS

Isc PCE Voc FF

• Thin PEDOT:PSS

• Tin plated copper bus bars with soldering wires

• Edge sealing

• Device structure:

UBUV/Ag grid/PEDOT:PSS/ZnO/PCDTBT:PCBM/PEDOT:PSS/Ag grid/UBUV

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Encapsulation protocols

Generally there is a large spread in lifetime data of identical

encapsulated samples. Challenges are:

• Packaging outline

• Materials

• Electrodes

• Edges

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ISOS-E-1 (Rigid) ISOS-E-2 (Flexible)

La

yo

ut Layout of

encapsulation • Size of rim

• Edge cleaning

• Size of rim

• Edge cleaning

Ma

teri

als

Barrier material

Adhesive

• Glass films

• Most commonly used

• Most commonly used

• Most commonly used

Ter

min

als

Extension

Connection

• Tin plated copper tape

• Cr(5nm)/Au(l00nm)

• Extension distance

• Soldering wire

• Silver epoxy glue

• Tin plated copper tape

• Cr(5nm)/Au(l00nm)

• Extension distance

• Soldering wire

• Silver epoxy glue

Sea

lin

g Protection of

terminals

Edge sealing

• Weatherproof sealants

• To be defined

• Weatherproof sealants

• To be defined

Rep

ort

ing

All parameters

affecting stability • To be defined • To be defined

ISOS-e pre-normative guidelines

are being currently prepared

CHEETAH WP10 consortium and

EERA are forming the core group

Total of 20 groups involved now

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Direct deposition of barrier layers

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ENEA – deposition of multilayer structure

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Direct deposition of barrier layers

0

0.5

1

1.5

2

2.5

PC

E (

%)

Time (days)

SiON/SiOx/SiON/SiOx/SiON

SiON/SiOx/SiON/SiOx/SiON

SiON 150 nm single layer

SiON 150 nm single layer

SiON 150 nm 5 layers a 30 nm

SiON 150 nm 5 layers a 30 nm

SiON 15 nm single layer

SiON 15 nm single layer

SiON 50 nm single layer

SiON 50 nm single layer

SiON 300 nm single layer

SiON 300 nm single layer

OPEN

OPEN

Hours

4-5 4-4 4-3 4-2 0.25 1 4 16 64 256

Unstable

Time (days)

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0

10

20

30

40

0.0009766 0.0039063 0.015625 0.0625 0.25 1 4 16 64 256

# o

f d

ata

poin

ts

TS80 (Days)

OPEN

PET

SPUTT

UBUV

0

10

20

30

# o

f d

ata

poin

ts

T80 (Days)

OPEN

PET

SPUTT

UBUV

Hours

4-5 4-4 4-3 4-2 0.25 1 4 16 64 256

Unstable

4-5 4-4 4-3 4-2 0.25 1 4 16 64 256

0

0.5

1

1.5

2

2.5

PC

E (

%)

Time (days)

SiON/SiOx/SiON/SiOx/SiON

SiON/SiOx/SiON/SiOx/SiON

SiON 150 nm single layer

SiON 150 nm single layer

SiON 150 nm 5 layers a 30 nm

SiON 150 nm 5 layers a 30 nm

SiON 15 nm single layer

SiON 15 nm single layer

SiON 50 nm single layer

SiON 50 nm single layer

SiON 300 nm single layer

SiON 300 nm single layer

OPEN

OPEN

Direct sputtering compared to foil packaging

Efficiency versus

lifetime for devices

with sputtered

protective layers

with different

thicknesses

Juelich – Direct sputtering of Si2N2O

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Summary and Significance for Industry

➢ e-Infrastructure (online tools, databases, big data)

Proved to ease and accelerate material research, device optimization

and data analyses. Pathway to INDUSTRY 4.0

➢ Advanced innovative test chamberProved to be highly efficient in distinguishing the weakest links in device

stability: Accelerates device lifetime optimization

➢ Improvement in intrinsic (moderate) and extrinsic

(good) stabilityHydrophilic materials reduction, adhesive enforcement, edge seal –

pathway to lifetime beyond several years

➢ Direct sputtering of barrier (Si2N2O)Simple thin layer overtook PET packaging. Potential to boost device

lifetime, if cost efficiency is proven

➢ ISOS-e pre-normative standardsEssential for novel technologies, reliable testing, learning the right way.

Right encapsulation especially is a key to optimizing lifetime18

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Thank you!

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Perovskites stability and up-scaling

Aldo Di Carlo

CHOSE – Centre for Hybrid and Organic Solar Energy

Dept. Elect. Eng. University of Rome Tor Vergata – Italy

[email protected]

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2008 2010 2012 2014 2016 2018

2

4

6

8

10

12

14

16

18

20

22

24

Effic

ien

cy (

%)

Year

Certified PSC

Certified OPV

Early stage PSC

Perovskite and CHEETAH

21

Project writing

Project negotiation

Project execution

22.7%

During the CHEETAH implementation and

execution the Perovskite solar cells

(PSCs) become one of the leading

technology for solution process PV

CH3NH3(+)

[HC(NH2)2]+

[Cs]+

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Encapsulation Strategy & Extrinsic Stability

F. Matteocci et al. NanoEnergy (2016) DOI: 10.1016/j.nanoen.2016.09.041

No effect of the sealing on the initial

PV performance

SP-DES

Kapton

Adhesive

Light-curable

Glue

UV-curable

Glue as edge

sealant

PSC Device

Protective

Glass

0 300 600 900 12000.0

0.2

0.4

0.6

0.8

1.0

No

rma

lize

d P

CE

Shelf Life Time (Hours)

Results on Large area cells (1cm2)

ISOS-D-1 Shelf life

MAPI perovskite used

Not encapsulated

Encapsulated

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Accelerated Life Time Tests

ISOS-D-1-2 High Temp

ISOS-D-3 95% Humidity

0 20 40 60 80 100 120

0.0

0.2

0.4

0.6

0.8

1.0

SP-DES

SP-D

Unsealed

No

rma

lize

d P

CE

(%

)

Time (hours)

ISOS-light soaking

Good sealing

No sealing

Bad sealing

F. Matteocci et al. NanoEnergy (2016) DOI: 10.1016/j.nanoen.2016.09.041

PSC with FTO/TiO2/MAPI/SPIRO-OMeTAD/Au is not intrinsically stable

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Improving stability: Mixed Perovskites

T. J. Jacobsson et al. Energy Environ. Sci., 2016,9, 1706-1724

In general, increasing the perovskite complexity is motivated by the need to improve stability by adding more inorganic elements and increasing the entropy of mixing, which can stabilize ordinarily unstable materials

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Mixed Perovskite: FA, Cs, Rb

Cs/FA mixtures suppress halide segregation. The Cs/MA/FA-based solar cells are more reproducible and thermally stable than MA/FA mixtures

D. P. McMeekin et al. Science (2016) 351, 151; M. Saliba et al. Science (2016), 354, 206

RbCsMAFA

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What about air exposure ?

S. Cacovich et al ChemSuChem 2016 DOI: 10.1002/cssc.201600913

Sealing was removed and a TEM

analyses performed on fresh and air

aged cells

200nm

TEM signal decrease of about 15% of signal intensity perovskite capping and m-TiO2

Iodine clearly diffuses in the HTL in the aged sample, whereas no migration of lead has been observed.

Bubble formation (40-50 nm). - presence of dopants in the HTL - to the use of chlorobenzene

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Mixed Perovskite + Inorganic HTL + Graphene

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The inorganic CuSCN HTL reacts with Au contact. A

thin layer of reduced Graphene Oxide (rGO) stabilize

the system

A. Arora et al. Science 28 Sep 2017: DOI: 10.1126/science.aam5655

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Gold Diffusion

S. Cacovich et al. Nanoscale, 2017, 9, 4700–4706

Light-soaking as well as temperature stress induce gold diffusion into the Perovskite

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Carbon based PSC

29G. Grancini et al. Nature Communications, 8, 15684 (2017)

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Scaling up: from perovskite cells to modules

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The progresses made in terms of efficiency and, with a minor extent, stability

pushed the development of large area modules.

Since the demonstration of the first module (Matteocci et al. 2014) a well

establish scaling-up activity is present in many research centers even if a

coordinated action is missing (CHEETAH 2.0 ?)

AIAPCE = Active Area Indexed

Aperture PCE

AIAPCE = PCEAPERTURE · Active Area

We compare the different modules

by defining the AIAPCE metric

Palma et al., IEEE Journal of Photovoltaics, 2017, 7 (6), 1674 - 1680

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2D materials and Perovskites for modules

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Module typeElectrical parameters

VOC (V) I (mA) FF (%) PCE(%) ΔPCE(%)

Ref 8.72 -112.8 59.4 11.6 -

mTiO2+G 8.23 -118.1 62.4 11.9 +3%

mTiO2/GOLi 8.46 -121.6 61.4 12.5 +8%

mTiO2+G/GOLi 8.6 -114.8 64.6 12.6 +9%

A. Agresti et al. ACS Energy Lett., 2017, 2 (1), pp 279–287

-120

-100

-80

-60

-40

-20

01 2 3 4 5 6 7 8 9

PCE = 12.6%

Voltage (V)

Cu

rren

t (m

A)

Ref. Module (A)

TiO2+G / Go-Li (D)

PCE = 11.6%

We exploited the Graphene Interface Engineering (GIE) to improve efficiency

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Thin film standards for laser patterning

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P3 P2 P1

387μm

44μm213μm25μm

5 cells module

(on 5x5 cm substrate)

Active Area: 14,52 cm2

Aperture Area: 15,28 cm2

Aperture Ratio: 95%

PCE = 9.5%

Aperture PCE = 9.03%

Palma et al., IEEE Journal of Photovoltaics, 2017, 7 (6), 1674 - 1680

P1: Nd:YVO4, λ=1064

nm, 15 ns pulsed laser

P2: Nd:YVO4, λ=355

nm, 10 ps pulsed laser

P3: Nd:YVO4, λ=355

nm, 10 ps pulsed laser

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Tandem:Perovskite/(Si, Perovskite, CIGS, OPV)

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Niraj N. Lal et al.

Adv. Energy Mater. 2017, 1602761

Based on the current state-of-the-art and the rapid recent progress, 30% Psk/Si is practically achievable for both the two- and four-terminal tandem configurations.

J. Werner et al Adv. Mater. Interfaces 2017, 1700731

Simple modelling under modest assumptions suggests Psk/Psk tandem

efficiencies above 30% are eminently achievable.

Niraj N. Lal et al. Adv. Energy Mater. 2017, 1602761

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Thank you!

Any questions for our experts?

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Feedback from industry

Q5: Single junction module vs Perovskite/silicon tandem, where to go ?

Q6: Silicon/Perovskite or Perovskite/Perovskite ?

Q7: Is a Lead content PV such as perovskite technology acceptable ?

Q8: Solution process vs vacum deposition, is it still an open question ?

Q9: Perovskite shows very good performance for low light applications

(indoor etc.). Is this an interesting application ? Which market ?

Q10: ALT stability is improving. Are field test required to introduce this

new tecnology ? How long?

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Q1: What is the need of industry in terms of e-infrastructures?

Q2: Where research should focus in terms of intrinsic and extrinsic

performance?

Q3: Are pre-normative guidelines for encapsulation useful (for industry)?

Q4: Is direct sputtering commercially viable technique?

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Feedback from the industry

- Do you think these CHEETAH innovations (will) matter?

- What do you think is important for short, medium and long term to

further mature these innovations?

- What do you think is important for short, medium and long term for

the industry to adopt these innovations?

- How could your company benefit from these innovations?

- Which markets do you want to address?

- What other innovations not investigated in Cheetah are important for

the industry on short, medium and/or long term?

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