Teaching Nanoelectronics Paolo Lugli Institute for Nanoelectronics Munich, Germany.
European funding opportunies in micro and nanoelectronics Overview and perspecves · 2017. 11....
Transcript of European funding opportunies in micro and nanoelectronics Overview and perspecves · 2017. 11....
Europeanfundingopportuni/esinmicroandnanoelectronics
Overviewandperspec/ves
EricFribourg-BlancCompe//veElectronicsIndustry
DGCONNECT
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Compe&&veelectronicsindustry
• Por4olio– Strategyonelectronics– Nanoelectronics,integratedsystems&TOLAE– ECSELJointUndertaking
• Role:(re)posi&onEuropeinthemapofcompu&ngandintegrateddevices
• ProjectmappingacrosstheCommissionsincethebeginningofFP7inmul&pleareas
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Horizon2020areas
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Horizon2020–electroniccomponents
Excellence in Science
Leadership in Enabling and
Industrial Technologies
(LEIT)
Societal Challenges
European Research Council (ERC) grants
Marie Slodowska-
Curie grants
Future and Emerging Technologies
collaborative projects
Electronic components
ENIAC/ECSEL Joint Undertaking
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Somegenerali&es
• Typesofproject– RIA–ResearchandInnova&onAc&ons– IA–Innova&onAc&ons– CSA–Coordina&onandSupportAc&ons
• Flagships– Graphene– HumanBrainProject– QuantumTechnologies–infinalprepara&on
• JointUndertakings– StartedunderFP7– Currently7JUs–>ECSELinDGCONNECT
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Micro-nanoelectronicsWhathasbeenfundedsofar–keyfigures
• 9yearsoffunding–2007-2015• ProgrammesFP7andH2020(2years),includingENIACandECSELJoint
Undertakings
• 7areasoffundingcoveringthefullspectrumofelectroniccomponenttechnologies
• 143projects• About2100par&cipa&ons• Totalcosts:3.6B€• EUcontribu&on:880M€
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FP7 ENIAC H2020 ECSEL
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Micro-nanoelectronicsvaluechain–Par&cipa&ons
Largecompanies37%
SMEs19%
RTOs20%
Universities24%
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ECSELJOINTUNDERTAKING
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ECSEL Joint Undertaking – objectives
• Contribute to the development of a strong and globally competitive electronics components and systems industry in the Union;
• Ensure the availability of electronic components and systems for key markets and for addressing societal challenges, aiming at keeping Europe at the forefront of technology development, bridging the gap between research and exploitation, strengthening innovation capabilities and creating economic and employment growth in the Union;
• Align strategies with Member States to attract private investment and contribute to the effectiveness of public support by avoiding an unnecessary duplication and fragmentation of efforts and by facilitating the participation of actors involved in research and innovation;
• Maintain and grow semiconductor and smart system manufacturing capability in Europe, including leadership in manufacturing equipment and materials processing;
• Secure and strengthen a commanding position in design and systems engineering including embedded technologies;
• Provide access of all stakeholders to a world-class infrastructure for the design and manufacture of electronic components and embedded/cyber-physical and smart systems; and
• Build a dynamic ecosystem involving Small and Medium-Sized Enterprises (SMEs), thereby strengthening existing clusters and nurturing the creation of new clusters in promising new areas.
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ECSEL Joint Undertaking
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ECSEL Strategic Agenda
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Projectsfunded
• StrongfocusonInnova&onAc&ons• ResearchandInnova&onAc&onsformaturingtechnologies
Evolu&on->LighthouseIni&a&ves• Fundingin2016:2projects
– Industry4.E– Mobility4.E
• Structuringac&onsforECSELtoreinforcethestrategicmid-termimpact
• Currentlyunderdiscussionabouttheprojectswhichcouldbesupportedin2017
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ECSEL–interimevalua&on
• ReportwellreceivedintheCommission
• ECSELrecognisedasastrategicinstrumenttosupportdigitalvaluechainsinEuropeinacoordinatedway
• Anumberofrecommenda&onsweremadetoimprovethefunc&oning– Developastrongerstrategyforelectroniccomponentsandsystems– Engagemoreproac&velytobringthesystemscommunityandactorsinthe
strategy– Improvetheprocessofmeasuringimpactandsuccessoftheinstrument– HarmoniseMemberStatepar&cipa&onrulesandreimbursementrates
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H2020LASTWORKPROGRAMME
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H2020–Lastworkprogramme
LEIT-ICTWP2018-20
• Unconven&onalNanoelectronics-– exploringthedevelopmentofpromisingbeyond-CMOSdevices
• LargeAreaElectronics-– enhancingmanufacturability,integra&onwithconven&onalelectronic
componentsandtake-upinapplica&ons
• ElectronicSmartSystems-– integra&ngsensing,actua&ng,advancedprocessingandwirelesstransmission
–newfunc&onali&es,miniaturisia&onandperformanceimprovement
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H2020–Lastcallonnanoelectronics
ICT-08-2019:Unconven/onalnanoelectronicsObjec&ve:accompanyenablingtechnologiesfortheadvancedCMOSandpreparetheroadbeyondCMOSExploratoryResearch
– Differen&a&ngfactorsfortheIndustry
RIA–ResearchandInnova/on(30M€–100%funding)(Demonstra/onincontrolledenvironmentatalimitedscale)– Energy-efficientcomputa&ondevicesbeyondthecurrentCMOSparadigm– Energy-efficientcomputa&oncircuitarchitectures– 3Dandcryogenicelectronics– Designforadvancednanoelectronicstechnologies
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Preparingforproposals
• Eachcallisunique– Everywordoftheworkprogrammecountsbutitisusuallyenoughtohookyour
proposal(s)onanumberofthem,notall– BewareofresubmissionsÄ Preferablyrestartfromfreshevenifkeepingthesamecoreconcept(s)
• Excellentproposal–some(non-binding)considera&ons– Withascoreof13.5(4.5oneachcriteriononaverage)andabove– Usuallytheminorshortcomingsfromoneevalua&onESRwillnotapplytoanother
call(uniquenessofthecalls)– Bewareofrankingrules(RIAs)
• Excellence• Impact• SMEbudget• Genderparity
• Finetuningofaproposalisessen&altoleavenoroomforshortcomings
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Furtherconsidera&ons
• Providedtheidea/conceptandimpactreasonablyfitwiththecall,thesewillnotbeareasonforlowscore
• Usualshortcomingswhichcanbeavoided– Insufficient/nottoorealis&cdescrip&onofimpact– Languagenotsufficientlyclear– Insufficientfocusoncoreac&vi&es/developments– Unbalancedconsor&um– Insufficientaken&ontorisks,management,dissemina&on
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IU.NETINFRAMEWORKPROGRAMMES
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IUNETinEUprogrammesonelectroniccomponentsandsystems
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Num
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• Coverage– NanoelectronicsandsmartsystemsprojectsunderFPcalls– JointUndertakings:ENIAC,ARTEMIS,ECSEL
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IUNET-Members
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ECSELH2020ARTEMISENIACFP7
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ECSELH2020ARTEMISENIACFP7
• Coverage– NanoelectronicsandsmartsystemsprojectsunderFPcalls– JointUndertakings:ENIAC,ARTEMIS,ECSEL
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IUNETinEUprogrammesonnanoelectronics
• Coverage– ICdesign,Nanoelectronics,BeyondCMOS&spintronics,RF&mm-wave
devices,Powerelectronics– BothunderFPandJUcalls
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ipation
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IUNET-Members
• Coverage– ICdesign,Nanoelectronics,BeyondCMOS&spintronics,RF&mm-wave
devices,Powerelectronics– BothunderFPandJUcalls
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ECSELH2020ARTEMISENIACFP7
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3.0
Millions€
ECSELH2020ARTEMISENIACFP7
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IUNETinEUprogrammesonnanoelectronicsandsmartsystems
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2007 2008 2009 2010 2011 2012 2013 2014 2015 2016
Millions€
Num
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fpartic
ipation
• Coverage– ICdesign,Nanoelectronics,BeyondCMOS&spintronics,RF&mm-wave
devices,Powerelectronics,Semiconductorequipment&processes– MNBSinvitro,MEMS,Packaging&heterogeneousintegra&on,Electric
vehicle,Clinical&healthcarepla4orms– BothunderFPandJUcalls
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IUNET-Members
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ECSELH2020ARTEMISENIACFP7
0.00.51.01.52.02.53.03.54.04.55.0
Millions€
ECSELH2020ARTEMISENIACFP7
• Coverage– ICdesign,Nanoelectronics,BeyondCMOS&spintronics,RF&mm-wave
devices,Powerelectronics,Semiconductorequipment&processes– MNBSinvitro,MEMS,Packaging&heterogeneousintegra&on,Electric
vehicle,Clinical&healthcarepla4orms– BothunderFPandJUcalls
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SMESASPARTNERSINPROJECTS
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Impactandexploita&on–SMEsaspartners
Nanoelectronics&ICdesign
Micro-Nano-BioSystems
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Impactandexploita&on–SMEsaspartners
RF&mm-wavedevices
Powerelectronics
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SMEsfromFP7tonow–4areas
• Perarea– 60to135SMEs
• Italy– 10par&cipa&ons– 8SMEsoverall
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SPECIFICPORTFOLIOMAPPING
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MNBS–mapping
• From2007to2015• Focusonsystemintegra&on
• 119projects– CONNECT2/3– RTD1/4– JUs8%
• 1365par&cipa&ons
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Micro-Nano-BioSystemsprojects–maps
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MNBS–EUcontribu&on
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FP7 ENIAC&ARTEMIS H2020 ECSEL
Millions€
Portabledevicesandsystems MNBSanalyticaldetectionplatformsPatient-centreddevicesandimaging Chipsmanufacturing
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Horizon2020–Alterna&vecompu&ng
Excellence in Science
Leadership in Enabling and
Industrial Technologies
(LEIT)
Societal Challenges
European Research Council (ERC) grants
Marie Slodowska-
Curie grants
Future and Emerging Technologies
collaborative projects
Electronic components
ENIAC/ECSEL Joint Undertaking
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Compu&ngbeyondcurrentnanoelectronics
• 10yearsoffunding–2007-2016• ProgrammesFP7andH2020
• 6dis&nctareasemerge
• 511projects• About1650par&cipa&ons• Totalcosts:950M€• EUcontribu&on:800M€
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FP7 H2020
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Category Coverage
Quantumcompu&ng Technologiestobuildqubitsandtransportinforma&onbetweenthem,includingalgorithmicandarchitecture
MolecularelectronicsSolid-stateinforma&onprocessingfunc&onsbuiltonorganicmoleculesincludingbiomolecules;molecularspintronics
Spintronics Spin-basedelectronicsandrelatedmaterials
2DmaterialsCarbon-basedandtransi&onmetaldichalcogenides,aswellaselectronicandspintronicfunc&onsbasedonthese
Extended&beyondCMOSNonmainstreamsemiconductortransistors,includingIII-Vmaterials,steep-slopedevices,singleelectrontransistors,etc.
Neuromorphiccompu&ng Hardwareimplementa&onofneuralnetworks,analogueanddigital,architecturesandapplica&ons
Areasofthepor4olio
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Typesofprojects
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Quantumcomputing
Molecularelectronics
Spintronics 2Dmaterials Extended&beyondCMOS
Neuromorphiccomputing
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Fundamentalresearch Collaborativefundamental Collaborativeapplied
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Par&cipants
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Quantumcomputing
Molecularelectronics
Spintronics 2Dmaterials Extended&beyondCMOS
Neuromorphiccomputing
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tsFundamentalresearch Collaborativefundamental Collaborativeapplied
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Funding
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Quantumcomputing
Molecularelectronics
Spintronics 2Dmaterials Extended&beyondCMOS
Neuromorphiccomputing
Millions€
Fundamentalresearch Collaborativefundamental Collaborativeapplied
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WhereinEurope?
FundamentalresearchCollabora/vefundamental
Collabora/veapplied
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WhereinEurope?
Quantumcompu/ngMolecularelectronics
Spintronics2Dmaterials
Extended&beyondCMOSNeuromorphiccompu/ng
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Typesofpar&cipants
0%
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Quantumcomputing
Molecularelectronics
Spintronics 2Dmaterials Extended&beyondCMOS
Neuromorphiccomputing
IND SME RES HES
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Countrycoverage
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Quantumcomputing Molecularelectronics Spintronics2Dmaterials Extended&beyondCMOS Neuromorphiccomputing
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Outlook
• Neuromorphiccompu&ngisprobablythemostmaturecontendertothecurrentnanoelectronicsasitreliesmostlyon– theexis&ngCMOStechnology– +ananaloguesynapsewhichs&llneedstobefullyintegrated
• Europecannotaffordtobelateontheindustrialisa&onofneuromorphiccompu&ng
• Coordina&onisneededto– Makesurethehardwaretechnologyroadblocksaretackledquickly– Stabiliseandreachaconsensusonanarchitectureefficientenoughforreal
lifechallenges,inpar&cularinIoT– Andarriveatdesignkitsfortheindustryandfablesscommuni&es
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Outlookandques&ons
• Extended&beyondCMOS– S&lllimitedinterestinEuropeanindustry– Whataretheprospects?
• Neuromorphic– Industrialisa&onhasbegunandfirstdevelopmentsdevelopfast– Growingnumberoffundedprojectsbuts&llcompara&velylimitedinputfrom
HumanBrainFlagship,especiallyonhardwareandconcretemodelsforrealworldapplica&ons
– WhereisindustryinEuropebeqnginthisarea?
• Quantumcompu&ng– Needfocus(especiallyonintegrated/solid-stateapproach)– AclearerroadmaptoensuretheFlagshipwilldeliveroutputforLEIT
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Outlookandques&ons
• 2Dmaterials– S&llratherfundamentalfield– Anumberofexperimentson2Dmaterialsforelectronicsbutalotof
technologicalhurdles
• Spintronics– Novisibilityonapplica&onsbeyondMRAM– Whatarethehurdles?Materials?Foundryservices?Designtools?
• Molecularelectronics– Whataretheissues?Whyaretheyblocking?– DNA-basedcompu&ngisalmostabsentfromEU-fundedprojects
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TOWARDSFP9
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TOWARDSFP9:KeyfindingsfromtheH2020INTERIMEVALUATION
EFFICIENCY
• ONTRACKTOBEMOREEFFICIENTTHANFP7– Administra&veexpenditurebelowthe5%legaltarget– Time-to-grant110daysfasterthanFP7
• NETWORKSAWIDERANGEOFSTAKEHOLDERS– Par&cipantsfromover130countries– 52%ofpar&cipantsarenewcomers;moreofthemcomefromEU-13(31.2%)
thanEU-15(19.7%)
• LARGE-SCALEOVERSUBSCRIPTION– Successrateonly11.6%(vs.18.4%inFP7)– ~EUR1.7billionspenttowriteunsuccessfulproposals
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TOWARDSFP9:KeyfindingsfromtheH2020INTERIMEVALUATION
EFFECTIVENESS-ECONOMICIMPACT• PRODUCINGINNOVATIONS&COMPETITIVENESS
– Moreprivatesectorpar/cipa/ons(33.2%)thanFP7– Fundedprojects~40%morelikelytobegrantedpatents;patentsareofhigher
commercialvaluethanotherpeers– 70%ofSMEsaimatnew-to-marketinnova/ons
• GENERATINGJOBS,GROWTH&INVESTMENTS– EveryeuroinvestedunderHorizon2020bringsanes&matedGDPincreaseof
6to8.5euros(EUR400toEUR600billionby2030)
• SUPPORTING&NETWORKINGBUSINESS&SMEs– 5,700organisa&onsfundedunderAccesstoRiskFinance– EUR13billionprivatefundsleveraged
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TowardsFP9–Indica&ve&metable
2017Jan Publicstakeholderconsulta&onfortheinterimevalua&on(withsomeforwardlookingques&ons)closedon15January
May Publica&onoftheStaffWorkingDocumentontheInterimEvalua&on(evalua&onresultsbasedonlegalbaserequirements&5mandatoryevalua&oncriteria)
June • AssessmentofHorizon2020implementa&oninviewofitsinterimevalua&onandtheFrameworkProgramme9proposalbytheEuropeanParliament(EP);
• ERACOpinionontheinterimevalua&onofH2020andinviewoftheprepara&onsofthenextFP
July • Publica&onofHighLevelGroupreportandstakeholderconferenceonHorizon2020InterimEvalua&on(3July)• InformalCompe&&venessCouncil,Tallinn
Q4 • H2020WorkProgramme2018-2020integra&ngmainfindingsfromtheInterimEvalua&on• Publica&onofCommissionCommunica&on:
• Overallconclusionsontheevalua&onresults;• Stateofimplementa&onoftheFP7ex-postHLEGrecommenda&ons;• ResponsetoHighLevelGrouprecommenda&ons;• MessagesonArt.185andArt.187ini&a&ves
2018Mid NextMFFCommissionproposal
CommissionproposaltabledforthenextFrameworkProgramme&accompanyingImpactAssessment
2019EuropeanParliamentelec&ons,appointmentofthenewCommission
2021Launchofthe9thFrameworkProgramme
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PREPARINGFORTHEFUTUREOFELECTRONICCOMPONENTSANDSYSTEMS
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Strategyonelectronics–Preparingforthefuture
• Workshopon27April2017• 26par&cipantsfromindustryandresearchcommunity• Objec&ves
1. facilita&ngtheupdateoftheEuropeanStrategyfortheElectronicsindustryandofECSEL,
2. wideningtheinvolvementandcommitmentinstrategicpartnershipswithactorsalongthevaluechainwiththeoverarchinggoalofarrivingatasafesupplyofsecureandenergyefficientelectroniccomponentsandsystemsinEurope.
• Mainmessages
– Theinterna&onalcontexthaschangedveryfastinthepastfewyears– ThereisaneedtorenewadialoguewiththeindustryinaformsimilartotheELG– Toaddresssovereigntyissues,themechanismofcer&fica&oncouldbeused– TheinvestmentsmadebytheRTOsisnecessarytokeeptheinnova&onecosystem
sustainable– Essen&altechnologies:Europeneedstoensurethestrategicdevelopmentsof
technologiesandthisgoesbeyondthesupportthroughexis&nginstrumentsbutshouldalsobeaddressedunderECSEL
– DigitalInnova&onHubsareac&onstocon&nueforsuppor&ngaccesstodigitaltechnologiesforSMEs
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EuropeanForumforElectronicComponentsandSystems
• Co-organisedeventtobringhighadded-valueandraiseittoencompasstherelevantvaluechains
• Dates:5-7December2017• Loca&on:Brussels
• TheCommissionwilltakethisopportunitytoproposeaneventwithCommissionerGabriel(invita&onbased)to– Ensureawarenessonthestrategicvalueofthesector– Discussthepossiblefollow-upontheIPCEI– Launchthenextstepsofthestrategyonelectronics
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Follow-upofECSELunderFP9–generalelements
• ECSELwellposi&onedintheLamyreport– Open,transparent– Focused(non-redundantinstrument)
• Generalobjec&vesforthefollow-upECSEL– Keepitstripar&testructurewithanobjec&vetoimproveitthrough
• Harmonisa&onofthefundingratesandoftheeligibilitycriteria;• Improvedtransparencyinfundingandunifiedrepor&ngmechanisms;• Mul&annualfinancialcommitmentsbythePar&cipa&ngStates;• Opera&onalisingAr&cle17.1(entrus&ngtheJUdirectlywiththepaymentofthe
na&onalcontribu&ons)– Bekerfocusonthestrategicambi&onsoftheJUtobecomeacentral
instrumentsuppor&ngtheEuropeanpoliciesonelectronics,HPC,cybersecurity,AI,etc.
• Consulta&onswithMemberStatesandIndustryAssocia&onsinvolvedinECSELwillstartquickly
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DGCONNECT(Communica/onsNetworks,ContentandTechnology):
hbp://ec.europa.eu/dgs/connect/index_en.htm
Horizon2020ontheweb:hbp://ec.europa.eu/research/horizon2020/index_en.cfm
ThankYou