EP&Dee no 4 - May 2012

EP&DeeDESIGN & MANUFACTURING MAY, 2012 ISSUE NO. 4, VOL. 10

E L E C T R O N I C S P R O D U C T S & D E S I G N E A S T E R N E U R O P E

This technical note provides the mathematicscode and guidance for engineers implementinga tilt compensated electronic compass(eCompass). page 12

Microchip’s energy-measurementAnalogue Front End has two 24-bit ADCs with industry’s bestaccuracy, plus low power & high-speed modesMicrochip announces its next generation of ener-gy-measurement analogue front end (AFE), theMCP3911, which features two 24-bit, delta-sigmaADCs that operate at 3V with industry-leadingaccuracy of 94.5 dB SINAD and 106.5dB THD.

This provides better energy-meter and power-monitoring performance by accurately measuringfrom start-up to maximum current, and enablesfaster calibration during production. Four differ-ent power modes offer the flexibility of enablingeither extremely low-power designs, to 0.8mA perchannel, or designs for higher-speed signals andharmonic content. The extended temperaturerange allows operation from -40°C to +125°C.The MCP3911 features 2.7 to 3.6V analogue anddigital operation, which simplifies the interfaceby running off the same power rail as the micro-controller. An internal, low-temperature-coeffi-cient voltage reference, along with PGAs on eachchannel, further enables metering and monitor-ing designs.As the global energy-metering infrastructure isbeing upgraded and the power-monitoring mar-ket is growing, designers of energy-measurementand other signal-acquisition applications arelooking for ways to increase performance whilstlowering costs. Microchip is meeting these needswith the industry’s most accurate AFEs, whichreduce power consumption with their low-powermodes, and reduce costs by decreasing the num-ber of power rails and external components.

MICROCHIP TECHNOLOGYwww.microchip.com/get/XA2A

Implementing a tilt compensatedeCompass using accelerometerand magnetometer sensors

T H E E A S T E U R O P E A N J O U R N A L F O R E M B E D D E D A P P L I C A T I O N S

EP&Dee ⏐ May, 2012 ⏐ www.epd-ee.eu2

When I firstbegan workingwith fluiddynamics, I wasadvised thefield was asmuch an art asa science.Page 34

EAGLE Version 6 - Drawing a schematic Page 18

The ABM SE field robot representing Poland, wasequipped with WISDOM prototype georadar thathas been developed by French scientists. Page 4

Human perception is most strongly influenced bysight – which is why the spotlight is on visualisationin the most varied of applications. Page 10

COMMENTS INDUSTRY NEWS

3 Beyond the PC

INDUSTRY NEWS COMPANIES

4 Setting out to conquer Mars!

DESIGN MCUs

8 Freescale Announces Next Generation S08P 8-bit MCU SeriesIn the strong momentum after rolling out ARM® Cortext-M4 based high-end 32-bit MCU, Freescale announced recently its next generation S08P 8-bit MCU series, with high robustness, cost-effectiveness, ease-of-use, compatibility and scalability, to address the broad market needs in home appliance, power conversion, motor control and many other industrial and consumer applications.

DESIGN DISPLAY

10 Family Concept Solution for variable visualisationsHuman perception is most strongly influenced by sight – which is why thespotlight is on visualisation in the most varied of applications. Currently, the development of new technologies is accelerating with brilliant colours and sharp, focused images increasingly becoming a sales criterion.

DESIGN EMBEDDED

12 Implementing a tilt compensated eCompass using accelerometer and magnetometer sensorsThis technical note provides the mathematics code and guidance for engineers implementing a tilt-compensated electronic compass (eCompass).

INDUSTRY NEWS EMBEDDED SYSTEMS

PCB-DESIGN TRAINING

18 EAGLE Version 6 - Drawing a schematicLast time we started with the schematic. The ADD command places components. At the bottom of the ADD dialog you will find the Search line. There you can enter the name of the part, for example: LM555. If you want to make the search more flexible use placeholders like * and ?. For example: *555*. This gives more results.

INDUSTRY NEWS DISPLAY

INDUSTRY NEWS LIGHTING

INDUSTRY NEWS ACTIVE COMPONENTS

INDUSTRY NEWS PASSIVE COMPONENTS

INDUSTRY NEWS SMT

DESIGN SENSORS

34 Keys to successful gas flow measurementWhen I first began working with fluid dynamics, I was advised the field was as much an art as a science. Working to improve the efficiency of industrial pollution control equipment through better flow distribution, we studied field test data, developed solutions, built scaled models to test them, and then often held our breath when it came time to see if they scaled up properly.

INDUSTRY NEWS SENSORS

INDUSTRY NEWS CONNECTORS

36 ODU Single contacts

37 Morek splice terminals in TME range of productsTrade reliability, soundness of every action, speed and flexibility are the motto of Morek company. Morek operates in the territory of Lithuania, Latvia and Estonia. It manufactures automatic and electrical engineering subassemblies. The products offered by Morek Group are also available in Poland – in TME range of products. The assortment includes, among others: terminals and splice terminals.

Table of Contents

MAY 2012

Beyond the PCMobile gadgets are overshadowing the personal computer; theirimpact will be far reaching. It appears safe to conclude that themerger between computer and phone is in full swing. The smartphone (or iPhone) is an upgraded traditional phone, a first steptowards the computer end of the scale. The tablet is basically aslimmed down higher mobility computer, a first step towards thephone end of the scale. We look forward to the day when the twotrains will “meet in the middle.” This revolution is mobile and marks a turning point in the world ofpersonal technology. For around three decades PCs in variousforms have been people’s main computing devices. Indeed, theywere the first machines truly to democratize the computing power,boosting personal productivity and giving people access, via theInternet, to a host of services from their homes and offices. Nowthe rise of smart phones and tablet computers threatens to erodePC’s dominance, prompting talk that a “post-PC” era is finallydowning.Over the last decade, the consumer market has become a hotbedof innovation in its own right. According to a prominent entrepre-neur, the polarity has reversed in the technology industry. Manyexciting developments in information technology (IT) are appear-ing in the hands of consumer first and only then making their wayinto other areas, a trend that is referred to as the “consumarization”of IT. We are witnessing live the transformation of the “military-industrial” into a “consumer-industrial” complex.The “post-PC” shift is not only techtonic but also tectonic, with farreaching implications for the entire society. The combination ofnew devices with pervasive connectivity and plentiful on-line con-tents is raising citizens’ expectations of what personal technologycan achieve. In addition, it is leading them to bring their owndevices into the workplace, where some of the technology they areexpected to use now seems antediluvian by comparison. This trendis challenging companies to rethink their IT departments’ strategies. The burgeoning global market for smart personal technology isalso inspiring an outpouring of entrepreneurial energy that isexpected to create many more remarkable products. And it isencouraging organizations of all kinds to adapt innovations formthe consumer worlds to their own ends. Companies are setting upon-line apps stores for their employees; hospitals are handing outspecially modified smart phones for nurses; soldiers are trying outtablet computers to control drones and experimenting with “bat-tlefield apps.” Many more such opportunities are likely to emergeass the technological and economic forces behind this popularcomputing revolution gather steam. (inspired and adapted fromThe Economist) nRadu Andrei

www.epd-ee.eu ⏐ May, 2012 ⏐ EP&Dee 3


INDUSTRY NEWS

COMPANIES

CML Microcircuits has released anew digital voice scrambler. The CMX7011 is a flexible, halfduplex, digital voice processorspecifically designed to imple-ment a digital voice scrambler foruse with conventional radio com-munication systems including ana-logue professional mobile radio,wireless dooraccess and gateentry systems.The need forsecure voicecommunicationhas become animportantrequirement forwireless commu-nication. Withnew communica-tion systems moving towards thedigital domain which inherentlyprovides voice security, the wide-ly-used legacy analogue systemsare being left behind. A numberof analogue voice privacy systemsare available today, based on fre-quency inversion techniques thatprovide a level of security. Inmany applications higher levels ofvoice security are required whilstremaining on lower-cost, widelyavailable analogue radio systems.

Digital scrambling is the answer,providing the highest level ofvoice security and the advantageof digital voice. The CMX7011provides the solution with anembedded state-of-the-art, low-cost, low-bit rate Vocoder com-bined with a robust audio-bandvoice data modem.

The device allows simple imple-mentation and configuration with-in existing designs and is intendedto be added to a radio via anaccessory port or ‘feature socket’.The CMX7011 offers good quali-ty speech and, using the internaldigital scrambling algorithm, sig-nificantly higher levels of securityare achieved.

CML MICROCIRCUITSwww.cmlmicro.com

Digital Voice Processor CMX7011

Silicon intellectual property (IP)provider Evatronix SA hasannounced the release of thefirst member of its PANTA highperformance display controllercore family. Developed usingARM technology the PANTADP20 is targeted specifically athigh-end mobile/portable prod-ucts, like smartphones and tabletPCs, with ultra-low power con-sumption that does not sacrificeprocessing performance.The PANTA DP20 off-loads thegeneral purpose central process-ing units (CPUs) from power-consuming video processingtasks, like composition of up to 3graphics or video layers, YUV toRGB conversion, alpha-blendingand gamma correction. It sup-ports a variety of display stan-dards and features programma-ble resolutions of up to8191×8191 pixels. The proces-sor’s output pixel interface, withHSYNC, VSYNC and blanking

signals, is compatible with HDMI(also 3D) and MIPI DPI interfaces.A plethora of RGB and YUVpixel formats are supported, aswell as progressive/interlacedvideo input.

The processor features supportthe advanced AMBA® 4 AXI4system bus protocol, whichincreases performance and low-ers data transfer latency withinthe application.

EVATRONIXwww.evatronix.com/ip

Evatronix Launches Display Processorbased on Latest ARM Security Technology

Setting out to conquer Mars!

TME has always supportednew technologies and isobserving their develop-ment with unremittinginterest. We have alreadysponsored Scarabeus,Martian robot and its crea -tors – Warsaw TechnicalUniversity students andmembers of Mars SocietyPoland, who, as the onlyrepresentatives of Europe,qualified for the interna-tional competition ofMartian field robots orga -nized by Rover ChallengeUniversity 2009. The competition took placeon a dessert in Utah, USA. That is why, we did nothesitate a single momentwhen Toruń technologicalstartup, ABM SpaceEducation gathering MikołajKopernik University PhDstudents, asked us to support their expedition toDachstein mountains,Austria, where Martial fieldrobots test were held fromApril 17 to May 12, 2012.The tests were conducted inthree carefully selected loca-tions in Ice and Mammothcaves of the UNESCO pro-tected natural reserve. Theorganizer of the event wasAustrian Space Forum, anorganization running a long-term Mars, planets andextreme environmentsexploration R&D program.The tests, apart from thePolish team, was attended by9 other teams from Austria,France and USA.

The ABM SE (MagmaWhite) field robot representing Poland, wasequipped with WISDOMprototype georadar that hasbeen developed by Frenchscientists. This mechanism isdesigned specifically forEXOMARS field robot to beused during the ESA Martianmission scheduled for 2018.The radar is undergoingtests in various placesaround the whole world – socalled Martian analogues,where full simulation of con-ditions present on the Mars. Participation in the missionconstitutes a unique oppor-tunity to gain a lot of inter-esting information, establishrelationships with otherenthusiasts. It is also a greatopportunity to encounterstate of the art technology,present one’s own equip-ment and share experiences.During the tests, a numberof experiments and tests ofthe latest version of Auoda.Xspacesuit were conducted.Furthermore, connectionand remote control methodswere tested. The testedWISDOM technology mightturn out to be very useful inMartian conditions, but alsoin the non-space research.The whole mission wasbroadcast via the Internet.TME is one of the Dachsteinmission sponsors.

TRANSFER MULTISORT ELEKTRONIKwww.tme.eu


Computerized devices such aswhite goods, office equipmentand industrial controls could soonpresent users with rich graphicalfeatures such as animations andwidgets, as seen in smartphones,thanks to new technologyfromSTMicroelectronics.Gadgets such as smartphones andmedia players havebecome increasinglyattractive, dynamicand easier to usethan other electronicproducts in thekitchen or workplace.One reason for this isadvanced Object-OrientedProgramming (OOP)software-design envi-ronments, such as Java; the mobileindustry is using Java, while micro-controller systems mainly use tra-ditional structured programminglanguages such as C. In particular,Java simplifies building graphicaluser interfaces, which by natureare object-oriented using featuressuch as hierarchies of widgets.

The MicroEJ SoftwareDevelopment Kit can be regardedas the world’s first professional-quality tool-set enabling embed-ded system designers to leverageJava Object-OrientedProgramming (OOP). MicroEJprovides extended features tocreate, simulate, test and deploy

Java applications in embeddedsystems. Support for GraphicalUser Interface (GUI) developmentincludes a widget library, designtools including storyboarding,and tools for customizing fonts.

STMICROELECTRONICSwww.st.com

STMicroelectronics and IS2T Perfect JavaPlatform for STM32, Bringing IntuitiveDesign to Everyday Electronic Equipment

As a result of the very early andclose cooperation with InfineonTechnologies and several key cus-tomers, PLS now presents the firstoptimized test and debug solu-tion, the Universal Debug Engine(UDE) 3.3, for the new multi-core architecture of the 32-bit microcontroller familyAURIX. The first AURIXarchitecture based micro-controller (MCU), part num-ber TC275T, contains threeTriCore processor cores(version 1.6). Two of theseare optimized for maximumperformance (high-performanceTriCore CPU 1.6P) and can exe-cute up to three instructions inone cycle at a maximum clock fre-quency of 200MHz. With thethird core, a high-efficiencyTriCore CPU 1.6P, lowest possi-ble power consumption and anefficient data exchange with theperipherals are the most impor-

tant factors. It can execute a maxi-mum of one instruction per cycleand is currently clocked at a maxi-mum of 200MHz. The UDE 3.3allows management and controlof the various TriCore-CPUs with-

in one user interface. This is sup-ported by a flexible multicoreprogram loader that enables theloading of program code anddata as well as symbol informa-tion separately for each core.

PLS PROGRAMMIERBARELOGIK & SYSTEMEwww.pls mc.com

With the UDE 3.3, PLS presents the firstoptimized test and debug solution for thenew AURIX™ 32-bit multi-core MCUs

Maxim Integrated Products, Inc.(NASDAQ: MXIM) announces areference design to protectXilinx® Spartan®-6 field-program-mable gate arrays (FPGAs). Thereference design comprises freesecurity softwarefrom Maxim orXilinx and theMaxim®DS28E01-100, a1-Wire® securememory device.Operating overa single pin, thebuilt-in challenge-and-responseSHA-1 authentication scheme inthe DS28E01-100 prevents unau-thorized product builds and safe-guards FPGA IP. The referencedesign allows manufacturers toremotely turn on fee-based soft-ware-controlled featureupgrades, without physicallyaltering the installed hardware.

The security scheme requiressecret keys to be loaded in theFPGA and the 1-Wire securememory. Maxim’s reference coreseamlessly overlays on theSpartan-6 device; utilizes less

than 5% of the logic cellresources and eases the loadingof secret keys into the FPGA.Maxim can also preprogram* theDS28E01-100 with customer-specified keys prior to delivery.

MAXIM INTEGRATEDPRODUCTSwww.maxim-ic.com

Maxim’s Security Reference Design enableslicensing control and secure Feature-SetUpgrades for Spartan-6 FPGA-Based Designs

Ericsson has announced an exten-sion to its 3E Gold Design Kit withthe launch of two new develop-ment board kits. Launched inJune 2011, the 3E Gold EditionDesign Kit has been widely usedby board and system architectsand enables the easy implemen-tation of Ericsson’sAdvanced BusConverters – theBMR453 andBMR454 – andthe company’s 3EPMBus-compliantPoint-of-LoadDC-DC regulators– the BMR462,BMR463 andBMR464.Developed forsystem-levelpower design, the newROA1285068 and ROA12850773E design kits enable systemsarchitects to develop not only theexact power architecturerequired for their final applica-tion, but also to configure andmonitor every single componentto optimize performance andreduce energy consumption. The

two new board kits can also beinterconnected with other 3E kitssuch as the ROA1283835 and theROA1283836 and can be used asstand-alone kits for smaller sys-tems or educational purposes.For easy control, monitoring andprogramming of the target 3E

Point-of-Load DC-DC convert-ers, the two boards are PMBuscompliant and can be connectedvia Ericsson’s KEP91017 USB-to-PMBus adaptor to a personalcomputer running the 3E GoldEdition software package.

ERICSSON POWER MODULES www.ericsson.com/powermodules

Ericsson Extends 3E Gold Design Kit withNew Development Boards

INDUSTRY NEWS

EMBEDDED SYSTEMS


Algotronix Ltd., Edinburgh, UK announcesthat it is shipping MACsec cores that areused to secure data on Ethernet links at upto 10 Gbps.The Media Access Control Security(MACsec) products comply with the require-ments of IEEE 802.1AE. They are available asintellectual property cores for FPGAs or SoCtechnology to cover the needs of gigabitEthernet for 1GbE and 10GbE throughputs.The architectural design allows 10Gbps tobe achieved in readily available 40-nm or 28-nm FPGAs, while the 1G data rate productcan use lower cost families.The design has been carefully crafted to sup-port both jumbo frames and minimum sizepackets with a key change on every packet,which represents the worst case situation forthe system. The cores support both 128-bitencryption keys as well as the newly stan-dardised 256-bit keys used for enhancedsecurity in applications such as MetropolitanArea Networks.“The MACsec cores evolved from our popularAES-GCM encryption cores, as they add theextensive logic required to perform the valida-tion, statistics and Connectivity Associations.We have seen an upsurge in enquiries for theMACsec products, even before they are pub-licly announced”, said Tom Kean, AlgotronixManaging Director. “These early customersoperate in markets as diverse as military, com-munications and test equipment. Our ability tohit the performance requirements in existingFPGAs is a testament to the effi-ciency of the architecture”.MACsec provides confidentialityand authentication in the linklayer (layer 2) and preventseavesdropping and so-called“man-in-the-middle” attacks,because it detects any alterationor replay of frames. This differsfrom other schemes, such asIPsec, which are set up as anend-to-end session basedencryption at layers 3/4.MACsec does not compete withIPsec, and should be consideredas a complementary cyber secu-rity technology. MACsec isagnostic to the Ethernet traffictype, and with the introductionof these cores can be easilyadded to systems to provide anadditional layer of protection toa network.Enterprise customers can adoptMACsec to provide protectionbehind their fire wall. Systemadministrators can authorise ports to com-municate in a secure fashion, and can detectmisuse such as attempted Denial of Service

(DOS).Data Center and Cloud-based systems canbenefit from the confidentiality and datasource authentication offered by MACsec.Commenting on the new products, PaulDillien, a consultant from High TechMarketing in the UK said, “There is a rapidlygrowing awareness of the emerging MACsecstandard. Telecoms links and data centers willmost probably focus on the 10Gbps product,with the 1G version being the target for enter-prise and military customers”.Each MACsec core can support a range ofpopular FPGA families. The IP is supplied assource code with a very extensive verifica-tion testbench. Customers can select fromvarious modes and parameterise the per-formance to match their needs. All AESproducts are built around cores that areNIST certified for compliance. Applying thecores to ASIC technology provides a route tolower power and even higher performance.The cores comply with the full specification,however customers who do not need all thefeatures can be provided with a sub-set tosave resources. Algotronix can also quote forbespoke cores with additional capabilities.MACsec typically works in conjunction withIEEE 801.1X-2010 which provides the securekey distribution around the network.The 1G and 10G MACsec cores are shippingnow, and the architecture is designed toscale to 40G and 100G for future productreleases.

ALGOTRONIXwww.algotronix-store.com

Algotronix releases MACsec product to secureEthernet links at up to 10 Gbps

INDUSTRY NEWS

EMBEDDED SYSTEMS

– Innovasic is pleased to announce thatAdvantech has selected the Innovasic RapIDPlatform solution with the fido1100Communication Controller to provideProfinet Class B connectivity in their newADAM-6100PN series of real-time ProfinetI/O modules for factory automation.

The RapIDPlatform is acomplete, royal-ty-free designthat providesPROFINET andEtherNet/IP con-nectivity for fac-tory automationapplications.

The RapID Platform product line includesuniversal gateway modules, network inter-face modules and a complete developersolution.

INNOVASIC www.innovasic.com

Advantech selectsInnovasic’s RapID Platformfor Profinet I/O Modules

Atollic announced the opening of AtollicTrueSTORE, a simple, user-friendly servicefor the discovery and distribution ofembedded systems example projects viathe internet. Atollic TrueSTORE is a reposi-tory of hundreds of free example projectsthat are available to suit many differentmicrocontroller-based evaluation boards.

Atollic TrueSTUDIO users will be able toquickly find the latest set of available proj-ects on the Atollic TrueSTORE server, anddownload them into the active AtollicTrueSTUDIO® workspace with just a singlemouse-click. This greatly simplifies thedevelopment process and allows embed-ded designers to quickly select a desiredproject template and have it running on target hardware within minutes.

ATOLLIC www.atollic.com

Atollic introducesTrueSTORE for one-clickinternet download ofexample projects


This new series inherits the industrial proven,high-efficient and reliable S08 core architec-ture with optimization to further reducepower consumption. It adopts mature auto-motive grade advanced process technologywhich has already been long-time provenwith mass silicon shipment for automotiveproduct designs. It takes enhanced chip-leveldesign approach to meet the industrial-lead-ing performance on EMC & ESD immunity. Ithelps to achieve low system-level EMI withon-chip internal clock source and frequencymultiplier, plus programmable drive-strengthand slew-rate control. It fully complies with IEC-60730 safetyrequirement, including independent watch-dog clock source, windowed watch-dog clearing, chip reset signal output, as well ashaving hardware CRC engine.Apart from adopting new process to lowerthe silicon manufacturing cost, S08P seriesalso integrates abundant peripherals to helpcustomers minimize the system BOM cost. It has high accuracy internal clock source (lessthan 1.5% deviation across entire tempera-ture and voltage range) which can help tosave both cost and PCB area by eliminatingexternal crystal clock source for most of thedesigns; 12-bit high resolution ADC canensure accurate signal measurement with low-cost simplified external signal conditioningcircuitry; TSI (Touch Sensing Interface)enables easy implementation for human-machine touch control without the need ofany extra components; On-chip EEPROM cansave external data storage chip when applica-

tion needs frequent small amount of dataupdate and storage; other features such as 6-channel PWM in 3-phase complementary-pair output with dead-time insertion simpli-fies motor control or power conversion appli-cation, communication modules including SPI,I2C & SCI provide flexible inner-board orinter-board data connection, multiple timermodules allow adequate timing control forvarious application tasks, RTC (Real TimeCounter) module provides a periodic wake-up scheme after MCU gets into low-powerstop mode. Besides, it can also implementreal-time calendaring function with simplefirmware coding.Taking the advantage of consistent S08 corearchitecture, the whole S08P series can reuse

all the existing S08 hardware and softwaredevelopment tool chain broadly available,including vast 3rd party ecosystem, thusgreatly reduces the investment for projectdevelopment. All Freescale existing customerscan easily port their legacy and proven S08code library onto this new platform.

Freescale’s CodeWarrior IDE as the standarddevelopment platform fully supports newS08P code development. It’s based on open-source Eclipse environment, bundled withsource code editor, C-complier, source-codelevel debugger interface, as well asProcessorExpert, a professional automaticcode generating tool helps to initialize thecode project through a few clicks.

DESIGN

MCUs

Freescale Announces Next Generation S08P 8-bit MCU Series

In the strong momentum after rolling out ARM® Cortext-M4 based high-end 32-bitMCU, Freescale announced recently its next generation S08P 8-bit MCU series, withhigh robustness, cost-effectiveness, ease-of-use, compatibility and scalability, toaddress the broad market needs in home appliance, power conversion, motor controland many other industrial and consumer applications.

S08P series feature block diagram


More importantly, it offers full-featured freeC-Complier supporting entire S08P seriescode development. BDM hardware debuggerworks seamlessly with CodeWarrior IDE whichenables simple, low cost yet high efficiency

interactive code debug and development. Inaddition, there’s open-source OSBDM toolavailable with intrinsic support fromCodeWarrior. It can be DIY’ed with all thedesign material downloadable from the web.

S08P series consists of three classes: full-fea-tured touch-sensing enabled S08PT class, full-featured without touch-sensing S08PA class,and feature-lite cost competitive S08PL class.All three classes are pin-to-pin compatible onthe same package option, despite some dif-ferences on peripheral feature-sets and per-formance. In this series from the smallest 2KBFlash in 8-pin package to the biggest 60KFlash in 64-pin package, all of them are com-patible in core, peripheral functions andpinout on particular package. Customers canpick a most suitable part to start with theirproduct design and keep the freedom ofswitching to other class parts without theneed of any hardware modification.S08P has been sampled from Q4 2011 forthose early adopters. Mass production beginsin Q2 2012. Suggested resale price in 10,000volume starts from $0.35 for low-end 2K/8-pin S08PL2, up to $1.26 for 60K/64-pinS08PT60. n

For getting more product info on S08P series,please visit product specific page onFreescale web site: www.freescale.com/S08P

www.freescale.com

DESIGN

MCUs

eDevice introduced HealthGO, a completetechnology platform for Remote PatientMonitoring based on FreescaleSemiconductor’s Home Health Hub (HHH)reference platform.

HealthGO is a Remote Patient Monitoringtechnology platform designed for medicaldevice and healthcare monitoring companiesseeking to quickly roll‐out an end‐to‐endinnovative, customized and reliable solution.HealthGO‐based telehealth solutions increasepatient quality of life and quality of carethrough accurate and focused medicalhome‐based monitoring.

The need for connected healthcare is grow-ing and the increase in life expectancy, thecost of the chronic diseases and the financialpressure on the healthcare system will furtheraccelerate this growth. At the end of 2011,according to Berg Insight, only 2.2 million

patients worldwide were using a home moni-toring service based on equipment with inte-grated connectivity, while more than 200 million people in the EU and the US sufferfrom one or several diseases where homemonitoring can become a treatment option.The number of home monitoring systemswith cellular connectivity integrated is pro-jected to grow at a CAGR of 34.6 percentduring the next 5 years. With the HHH and its team of applicationspecific experts, eDevice has built a range of“universal medical gateways”. The HealthGOwill be branded and marketed by home monitoring companies, whosequality and regulatory con-straints are very important.Internally specifying,designing, developingand testing the hard-ware products woulddrain an importantpart of theirfinancialresourcesandskilledstaff.eDevice allowsthem to focus ontheir core business andoffers them the possibility tolaunch a complete solution with-out going through the long, expensive, and

risky process of creating a new monitor. The HealthGO monitors are complete andcustomizable. They come with vital sign moni-toring, USB and Bluetooth peripheral inter-faces, embedded Blood Pressure monitor(optional on HealthGO+), touch‐screen,embedded microphone and speaker, diseasemanagement possibilities, capability to dis-play information, messages, weather or heatheducation tutorials. Both the firmware and thehardware of the HealthGO are customizableby the client. An API is available for in‐housedevelopment of the client applications andgraphical user interface and the casing can bemodified to fit client requirements.

The HealthGo is part ofeDevice’s complete remote

monitoring offer, whichalso includes Worldwide

Cellular Connectivityand Services &

Logistics Portal.

FREESCALE SEMICONDUCTOR www.freescale.comeDEVICE www.edevice.com

eDevice Announces the HealthGO Monitor, Built on Freescale’s Home Health Hub Reference Platform;HealthGO is the Industry’s First Fully Customizable Technology Platform for Remote Patient Monitoring

10

Two contrary approaches can be used toachieve this: The first is platform-independentand therefore extremely flexible. Displays specially developed for this are configured forthe same expanded temperature range andthe same power supply across all displays.

Thanks to the standardised interface, theseare therefore both pin and electrically com-patible and the customer has the choice

whether to replace or expand each displaydiagonal with another from the same series.And to do this: Simply reconnect and it's alldone, no other hardware changes arerequired. The displays can equally be used forRGB applications as for MCU applications andcan be connected to practically any existingboard. A touchscreen as well as the appropri-ate controller as chip or finished hardware isalso available for each display.

Made-to-measure off the rackThe second approach follows the motto: “Plugand Play”. It comprises a turnkey solution con-sisting of a display plus a cable set speciallyadapted for the system, a control board aswell as the necessary software with timingparameters for the display. Such a kit solution can also be configured tosupport a number of wireless technologies,e.g. WLAN for network connectivity, RFID for

EP&Dee ⏐ May, 2012 ⏐ www.epd-ee.eu

Human perception is most strongly influenced by sight – which is why the spotlight is on visualisation in the most varied of applications. Currently, the development ofnew technologies is accelerating with brilliant colours and sharp, focused imagesincreasingly becoming a sales criterion. Suppliers are therefore faced with the challenge of equipping their existing applications with state-of-the-art displays. Low costs and short development times are therefore a must. A family concept withturnkey kit solutions fulfils both the technological and commercial requirements.

Family Concept Solution forvariable visualisations

Display-Kit

DESIGN

DISPLAY

11

access control or identification applications,Bluetooth or proprietary wireless sticks, GSMor GPS. Not only do companies save on theirown development, something which is alwaysan important argument when low volumes areinvolved, but they also benefit from anextremely short time until market readiness.

“We have preconfigured solutions at handwhich we have evaluated based on many cus-tomer enquiries and our experience,” explainsTobias Zilly, Technical Support Engineer forDisplays & Boards at Rutronik.

“Despite this, we consult extensively with thecustomer at the beginning of each project inorder to fulfil the individual requirements ofeach application. Often only minor adjustmentsare required, allowing us to keep the develop-ment time very short.”

In this way, investment in evaluation, develop-ment, the test phase and development ofprototypes is as low as possible. However, toensure that this is not at the expense of quality, Rutronik concentrates on high-qualitycomponents from selected manufacturers. Inaddition, the engineers check all data sheetsto ensure that all individual components areoptimally coordinated with each other.Market-specific factors are also incorporated,e.g. the required certifications.

“However, in addition to technical data, otherfactors such as manufacturing quality, deliveryreliability of the manufacturer, its product strat-egy or availability also play a role in the selec-tion of components. Our wide experiencegained from many customer projects has stoodus in good stead in this respect,” says Displays& Boards expert Zilly.

Full flexibilityFlexibility is one of the main advantages ofthis concept. Within a turnkey solution, sizesof 3.5“ to 7“ as well as RGB and MCU inter-faces can be realised. The MCU models mayreplace existing passive displays which nolonger achieve the desired performance. The optical performance is therefore signifi-cantly increased, but the proven control technology remains untouched. Even the transition to TFT displays will besmooth and cost-effective in this way. Smallersoftware adjustments to the existing applica-tion, such as the import of the display initiali-sation as well as its parameter transfer arequick and easy to implement. Different wireless technologies or perform-ance scaling of the control can also be han-dled in advance so that customers can con-centrate on other development priorities,such as the adaptation and programming ofsoftware or housing design.

‘All-inclusive’ kit solutions“Special requirements outside the small sizes of3.5“ to 7“ are fulfilled with turnkey display solu-

tions which function independently of the family concept,” explains Zilly. “These are also designed in accordance withthe ‘Plug and Play’ motto.“

For industrial customers, such a solution couldcomprise a Tianma 10.4“ displayTM104SDH03 LED and a D3003-S1 boardfrom Fujitsu. All the cables required for thisare adapted and specifically manufacturedaccording to the customer’s specifications.The display combines a 50,000-hour LEDbacklight lifetime with a converter integratedinto a piece of hardware. This eliminates theneed for separate mounting points for theconverter as well as the additional backlightcable required for this. The D3003-S1 boardin mITX format offers many approaches andconnectivity options for the greatest possiblecreative freedom. In addition to the opportu-nity to use MSATA flash memory fromApacer as the data carrier, the platform is fitted with a newest generation Atom proces-sor and an LVDS port. A riser card provideseven more expansion slots. The combinationof the Fujitsu board with the Tianma displaythus offers great flexibility with mid-rangeperformance and low energy consumption. If the performance requirements are higher,the Fujitsu D3003-S3 can be selected with adualcore Atom CPU.

“The broad portfolio comprising several manu-facturers guarantees that we can offer theappropriate hardware for every customer andevery application,” says Zilly.

Moreover, the customer can also select addi-tional components, for example one of thetouch variants from Hantouch, an additionalbar of RAM from Swissbit or a data carriersuitable for its application such as a hard disk,SSD, USB stick or CF card. Rutronik has storedsuch kits, e.g. for industrial and medical appli-cations, in a database-based system.

“Each individual one is tested and correspondsto the applicable industry standards. This givesthe opportunity to draw on many preconfig-ured solutions,” explains Zilly.“Most individual customer requirements can befulfilled cost-effectively, efficiently and quicklywith just minor adaptations.“

The data sheets for all the components arecross-checked to ensure that the individualcomponents are perfectly suited to eachother. Market-specific factors, such as compo-nent certifications, are also taken intoaccount. All this ensures that the customerreceives a perfectly customised turnkey solu-tion. Not only does this enable them to bene-fit from a shorter wait for market readinessbut also from planning reliability, flexibility ofdesign and concentration on purchasing. nwww.rutronik.com

www.epd-ee.eu ⏐ May, 2012 ⏐ EP&Dee

DESIGN

DISPLAY

Rutronik Elektronische BauelementeGmbH has now become MPE GarryGmbH's global distribution partner. As the only broadliner on a globalscale, Rutronik is marketing the entireproduct range of precision connectorsand circuit board connection systemsmanufactured by MPE Garry as well asthe network connection solutions of its subsidiary K+B GmbH with immediate effect.

The main market for the fittings, pinheaders and female headers, device plugsas well as customer-specific punchedparts or stamped bent parts is the indus-trial market. “Rutronik has a strong globalposition in the industrial market and hasestablished a great deal of expertise in theconnectors field,” explains Peter Fuchs,Product Manager at MPE Garry. “That is why we see Rutronik as the idealpartner with whom we can continue togrow and expand our customer base on aworldwide scale.”Kathrin Felten, Product Sales Managerfor connectors and cables at Rutronik,adds: “MPE Garry, just like its subsidiaryK+B, supply extremely reliable productsand customer-specific solutions with excellent cost-effectiveness. These represent a great potential that wewish to exploit together.”

New device connectors according toIEC-320 from K+BThe new series from K+B comprises net-work connector plugs according to IEC-320 with integrated overvoltage protection to provide a reliable shieldagainst voltage peaks. The device plugsare fitted with two device fuses, andoptionally with voltage selectors as wellas integrated single or double-pole mainsswitches. On the connection side theyhave plug contacts according to DIN46244 or soldered contacts. The snap-on assembly means that theycan be installed easily. There are standardversions for four different front panelthicknesses. As the connectors fit thesame assembly apertures as the versionswithout overvoltage protection, anupgrade is always possible without anysignificant effort.

RUTRONIKwww.rutronik.com

Rutronik now global distributor for MPE Garry


The eCompass uses a three axis accelerometerand three axis magnetometer. The accelerome-ter measures the components of the earth'sgravity and the magnetometer measures thecomponents of earth's magnetic field (the geo-magnetic field). Since both the accelerometerand magnetometer are fixed on the PrintedCircuit Board (PCB), their readings changeaccording to the orientation of the PCB.If the PCB remains flat, then the compass head-ing could be computed from the arctangent ofthe ratio of the two horizontal magnetic fieldcomponents. Since, in general, the PCB willhave an arbitrary orientation, the compassheading is a function of all three accelerometerreadings and all three magnetometer readings. The tilt compensated eCompass algorithm actu-ally calculates all three angles (pitch, roll, and yawor compass heading) that define the PCB orien-tation. The eCompass algorithms can thereforealso be used to create a 3 D Pointer with thepointing direction defined by the yaw and pitchangles. The accuracy of an eCompass is highlydependent on the calculation and subtraction insoftware of stray magnetic fields both within,and in the vicinity of, the magnetometer on thePCB. By convention, these fields are divided intothose that are fixed (termed Hard Iron effects)and those that are induced by the geomagneticfield (termed Soft Iron effects). Any zero field offset in the magnetometer isnormally included with the PCB’s Hard Ironeffects and is calibrated at the same time. This document describes a simple three ele-ment model to compensate for Hard Ironeffects. This three element model should sufficefor many situations. For convenience, theremainder of this document assumes that theeCompass will be implemented within amobile phone.

Coordinate System and Package Alignment This application note uses the industry stan-dard “NED” (North, East, Down) coordinatesystem to label axes on the mobile phone. The

x axis of the phone is the eCompass pointingdirection; the y axis points to the right and thez axis points downward (see Figure 1). A positive Yaw angle ψ is defined to be a clock-wise rotation about the positive z axis. Similarly,a positive pitch angle θ and positive roll angleφ are defined as clockwise rotations about thepositive y and positive x axes respectively.

It is crucial that the accelerometer and magne-tometer outputs are aligned with the phonecoordinate system. Different PCB layouts mayhave different orientations of the accelerome-ter and magnetometer packages and even thesame PCB may be mounted in different orien-tations within the final product. For example, in Figure 1, the accelerometer y-axis output Gy, is correctly aligned, but the x-axis Gx and z-axis Gz signals are inverted in sign.Also in Figure 1, the magnetometer output Bz iscorrect, but the y-axis signal should be set to Bxand the x-axis signal should be set to -By. Once the package rotations and reflections areapplied in software, a final check should bemade while watching the raw accelerometerand magnetometer data from the PCB: 1. Place the PCB flat on the table. The z-axisaccelerometer should read +1g and the x and yaxes negligible values. Invert the PCB so thatthe z axis points upwards and verify that the z-axis accelerometer now indicates -1g. Repeatwith the y-axis pointing downwards and thenupwards to check that the y axis reports 1g andthen reports -1g. Repeat once more with the x-

axis pointing downwards and then upwards tocheck that the x-axis reports 1g and then -1g. 2. The horizontal component of the geomag-netic field always points to the magnetic northpole. In the northern hemisphere, the verticalcomponent also points downward with theprecise angle, being dependent on location.When the PCB x-axis is pointed northward anddownward, it should be possible to find a max-imum value of the measured x component ofthe magnetic field. It should also be possible tofind a minimum value when the PCB is alignedin the reverse direction. Repeat the measure-ments with the PCB y- and z-axes aligned firstwith, and then against, the geomagnetic fieldwhich should result in maximum and minimumreadings in the y- and then z-axes.

Accelerometer and Magnetometer Outputsas a Function of Phone OrientationAny orientation of the phone can be modeled asresulting from rotations in yaw, pitch and the rollapplied to a starting position with the phone flatand pointing northwards. The accelerometer,Gr, and magnetometer, Br, readings in this start-ing reference position are (see Figure 2):

The acceleration due to gravity is g = 9.81 ms-². B is the geomagnetic field strength which variesover the earth's surface from a minimum of22μT over South America to a maximum of67μT south of Australia. δ is the angle of incli-nation of the geomagnetic field measured

This technical note provides the mathematics code andguidance for engineers implementing a tilt-compensatedelectronic compass (eCompass).

Implementing a tilt compensatedeCompass using accelerometerand magnetometer sensors

DESIGN

EMBEDDED

Figure 1

Figure 2

Eqn. 1 Eqn. 2

by Talat Ozyagcilar, Applications Engineer, Freescale Semiconductor


downwards from horizontal and varies overthe earth's surface from -90° at the south mag-netic pole, through zero near the equator to+90° at the north magnetic pole. Detailed geo-magnetic field maps are available from theWorld Data Center for Geomagnetism athttp://wdc.kugi.kyoto-u.ac.jp/igrf/There is no requirement to know the details ofthe geomagnetic field strength nor inclinationangle in order for the eCompass software tofunction. The magnetic field strength B andthe inclination angle δ, cancel in the angle cal-culations (see Equations 20, 21 and 22). The phone accelerometer, Gp, and magne-tometer, Bp, readings measured after the threerotations Rz(ψ) then Ry(θ) and finally Rx(φ) aredescribed by the equations:

The three rotation matrices referred to inEquations 3 and 4 are:

Equation 3 assumes that the phone is not under-going any linear acceleration and that theaccelerometer signal Gp is a function of gravityand the phone orientation only. A tilt-compen-sated eCompass will give erroneous readings ifit is subjected to any linear acceleration. Equation 4 ignores any stray magnetic fieldsfrom Hard and Soft Iron effects. The standardway of modeling the Hard Iron effect is as anadditive magnetic vector, V, which rotates withthe phone PCB and is therefore independentof phone orientation. Since any magnetometersensor zero flux offset is also independent ofphone orientation, it simply adds to the PCBHard Iron component and is calibrated andremoved at the same time. Equation 4 then becomes:

where Vx, Vy, and Vz, are the components ofthe Hard Iron vector. Equation 8 does notmodel Soft Iron effects.

Tilt-Compensation AlgorithmThe tilt-compensated eCompass algorithmfirst calculates the roll and pitch angles φ and θfrom the accelerometer reading by pre-multi-

plying Equation 3 by the inverse roll and pitchrotation matrices giving:

where the vector contains the three compo-nents of gravity measured by the accelerometer. Expanding Equation 9 gives:

The y component of Equation 11 defines theroll angle φ as:

(Eqn. 12)

The x componentof Equation 11 givesthe pitch angle θ as:

With the angles φ and θ known from theaccelerometer, the magnetometer reading canbe de-rotated to correct for the phone orien-tation using Equation 5:

The vector represent the components of themagnetometer sensor after correcting for theHard Iron offset and after de-rotating to theflat plane where θ = φ = 0. The x and y components of Equation 19 give:

Equation 22 allows a solution for the yaw angleψ where ψ is computed relative to magneticnorth. The yaw angle ψ is therefore therequired tilt-compensated eCompass heading. Since Equations 13, 15 and 22 have an infinitenumber of solutions at multiples of 360°, it isstandard convention to restrict the solutions forroll, pitch and yaw to the range -180° to 180°.

A further constraint is imposed on the pitchangle to limit it to the range -90° to 90°. Thisensures only one unique solution exists for thecompass, pitch and roll angles for any phoneorientation. Equations 13 and 22 are thereforecomputed with a software ATAN2 function(with output angle range -180° to 180°) andEquation 15 is computed with a software ATANfunction (with output angle range -90° to 90°).

Estimation of the Hard Iron Offset VEquation 22 assumes knowledge of the HardIron offset V, which is a fixed magnetic offsetadding to the true magnetometer sensor out-put. The Hard Iron offset is the sum of anyintrinsic zero field offset within the magne-tometer sensor itself plus permanent magnet-ic fields within the PCB generated by magnet-ized ferromagnetic materials. It is quite normalfor the Hard Iron offset to greatly exceed thegeomagnetic field. Therefore, an accurateHard Iron estimation and subtraction arerequired to avoid Equation 22 jamming andreturning compass angles within a limitedrange only. It is common practice for magne-tometer sensors to be supplied without zerofield offset calibration since the standard HardIron estimation algorithms will compute thesum of both the magnetometer sensor zerofield offset and the PCB Hard Iron offset. In the absence of any Hard Iron effects, thelocus of the magnetometer output under arbi-trary phone orientation changes lies on thesurface of a sphere in the space of Bpx, Bpyand Bpz with a radius equal to the magnitudeof the geomagnetic field B. In the presence ofHard Iron effects, the locus of the magneticmeasurements is simply displaced by the HardIron vector V so that the origin of the sphere isequal to the Hard Iron offset Vx, Vy and Vz.The Hard Iron Offset can then be simply com-puted by monitoring the minimum and maxi-mum values of the x, y, and z components ofthe magnetometer readings and estimatingthe Hard Iron offset components by:

The minimum and maximum magnetometerreadings can either i) be measured and theHard Iron offset computed and stored at fac-tory calibration time or ii) be tracked on the flyusing the random orientations of the phone tocontinuously self-calibrate the phone.

SOFTWARE IMPLEMENTATIONThe reference C# code uses integer operandsonly and makes no calls to any external mathe-matical libraries. Custom functions are provid-ed in this document for all the trigonometricand numerical calculations required. It is pro-vided in the Application Note AN4248 fromFreescale Semiconductor and can be found atwww.element14.com/freescale n

DESIGN

EMBEDDED


INDUSTRY NEWS

EMBEDDED SYSTEMS

Murata Power Solutionsannounced the introduction ofthe UWE series of highly efficient100 – 120 Watt open frame iso-lated DOSA-compatible eighth-brick DC/DC convert-ers. Using the indus-try standard through-hole package, meas-uring 58.42 × 22.86 ×9.91mm (2.3 × 0.9 ×0.39 inches), the sin-gle output units offerthe nominal outputsof 3.3, 5 or 12VDC.Providing an efficien-cy of typically 91.5% means thatfor most applications no forcedairflow is required. Suitingembedded computing applica-tions and instrumentation subsys-tems, the converters accommo-date an ultra-wide 4:1 input volt-age range from 18 to 75VDCaround a nominal 48 VDC. Lineregulation is kept within ±0.25%Vout and load regulation is maxi-mum ±0.2% Vout across the com-plete range. On-board remotesense inputs compensate for line

voltage errors at high output cur-rents. A trim function providesthe ability to adjust outputs±10% of nominal output voltagein order to compensate for line

losses. A remote on/off input,negative or positive, provides theability to remotely control theconverter such as required toschedule load startup. The UWEseries can operate from –40°C to+85°C. Protection featuresinclude input under voltage, out-put short circuit, over current andover temperature.

MURATA POWERSOLUTIONS www.murata-ps.com

Highly efficient high current eighth-brickDC/DC converters suit high density embedded applications

DSM Computer's new Galaxy®G4-QM57 control cabinet PCintegrates the Intel® Core™ i5-520M processor clocked with2.4 GHz, and the Intel® QM57chipset. In addition to the stan-dard version, a higher-perform-ance model with the Intel®Core™ i7-620M (2.66GHz) and alower-cost system with the Intel®Celeron™ P4500 DualCore CPU are available asoptions. The fast, standard4GB DDR3 RAM mainmemory (800/1066MHz)can be expanded to amaximum capacity of 8GB.The robust Galaxy® G4-QM57 is designed spe-cially for the harsh indus-trial environment. Thanks to itscompact size of 149 × 260 ×280mm, the computer can beinstalled flexibly in a control cab-inet. To permit the fast access toall components, the drive bayand the connections are locatedon the front side of the industri-

al housing. Two 8-cm tempera-ture-controlled system fansensure the optimum ventilationof the housing, irrespective ofthe positioning of the controlcabinet. The operating tempera-ture range is 0° to +45°C. To expand the system with short,commercially-available supple-mentary modules, e.g. for CAN

bus and other fieldbus cards, orwith customer-specific controllercards, the control cabinet PCprovides three free PCI slots andone PCI Express™ ×1 slot.

DSM COMPUTER www.dsm-computer.com

High-performance box IPC with Intel® QM57chipset for installation in a control cabinet

MSC Vertriebs GmbH presentsthe first COM Express™ modulesbased on the 3rd generation Intel®Core™ processor family (formerlycodenamed ‘Ivy Bridge’). The 3rd

generation Intel Core processorfamily utilizes Intel’s advanced22nm process technology withthree-dimensional transistors forhigher performance at lowerpower. The new COM Expressmodules feature a further leapforward in computing power,graphics and video performancein comparison to modules basedon the previous generation Intelplatform. Important innovationsof this new product generationare lower power consumption athigher clock frequencies and animproved graphics and videoperformance. For the first time,the new Intel platform supportsDirectX 11. The first products ofthese module families areequipped with the quad-coreIntel® Core™ i7-3615QE processor

with 45W thermal dissipationpower (TDP) and the Intel® Core™i7-3612QE processor (35W TDP).

The quad-core processorsinclude support for Intel® 64architecture, Intel® VirtualizationTechnology, Intel® AdvancedVector Extensions and the Intel®Advanced Encryption Standard(AES). Thanks to the integrationof enhanced Intel® Turbo BoostTechnology, single cores can beover-clocked in order to increasethe performance.

MSC www.msc-ge.com

COM Express™ Modules with brand-new, quad-core 3rd Generation Intel® Core™ Processors

Murata Power Solutionsannounced the MVAB120 seriesof high efficiency, typically up to91%, open frame single output120Watt power supplies aimedat a broad range of telecom andindustrial applications.Measuring just 101.6 ×50.8 × 34.3mm (2 × 4 ×1.35 inches), the lowprofile units satisfy the1U height constraints ofthis industry standardfootprint. The high efficiencydesign of the MVAB120ensures that waste heatis kept to a minimumand the units are capable ofdelivering up to 75W using con-vection cooling only. Just 250LFM forced airflow is requiredfor the supply to operate at the120W full load output. The series comprises three sin-gle output models covering thenominal outputs of 12, 24 or 48VDC. Accommodating the fulluniversal range of input voltages,from 90 - 264 VAC and 120 –300VDC, the MVAB120 also

meets the EU PFC directive foractive power factor correction.Safety approvals include theinternationally recognizedUL/EN/IEC 60950-1:2005 2nd

edition standard for IT and com-mercial equipment. The units

also comply with IEC/EN 61000Class A and EN55022 Class Bstandards for emissions andimmunity. Suiting most operatingenvironments, the MVAB120series can deliver full load from -10 to + 50°C, and is capable ofstart-up from temperatures aslow as -20°C.

MURATA POWERSOLUTIONS www.murata-ps.com

Murata Power Solutions launches highlyefficient compact 1U open frame 120 WAC/DC power supply

16 EP&Dee ⏐ May, 2012 ⏐ www.epd-ee.eu

XP Power announced the CCB250series of highly efficient singleoutput 250 Watt AC-DC powersupplies aimed at a broad rangeof industrial and medical applica-tions. With an operating efficiencyof up to 95%, the convectioncooled CCB250 series generatesvery little waste heat and doesnot require any forced air cooling.The series achieves an absoluteminimum efficiency of 90% with a90 VAC input at full load.Meeting the stringent demands ofthe latest IEC60601-1 3rd editionmedical safety standards, theCCB250 complies with 2 × MOPP(Means Of Patient Protection) andoffers the complete risk manage-ment files, thus removing the bur-den and expense typically placedon the end product designer inachieving product compliance.The series operates from an ultrawide input range of 80 –275VAC, in an ambient of –20°Cto + 70°C, with no derating until +

50°C. In addition to being able tocontinuously deliver the maxi-mum output of 250W, theCCB250 has a peak power capa-bility of up to 300 W for a maxi-mum of 500 ms. This allows thedelivery of a short-term highercurrent, such as for startingmotors, without engineers need-ing to incur the additional costs orspace required for a higher ratedunit. Measuring just 101.6 × 152.4× 38.1mm (4 × 6 × 1.5 inches), theopen frame CCB250 series fitsinto a 1U space.

XP POWER www.xppower.com

XP Power unveils 95% efficient 250 Watt convection cooled power supply with 3rd

edition medical and industrial approvals

IAR Systems® introduces version1.20 of the high-performingdevelopment toolsuite IAREmbedded Workbench® for RL78.The new version brings highlyefficient speed optimizations. IAREmbedded Workbench is a fullset of development tools forbuilding and debugging embed-ded applications. It includes aproject manager, editor, compiler,assembler, linker, debugger, andlibrary tools in a user-friendlyintegrated development environ-ment. Thanks to the longstandingand solid relationship betweenIAR Systems and RenesasElectronics, IAREmbeddedWorkbench for RL78was the first set ofdevelopment tools tobe made available forthe RL78 family. Fromstart, the compilerhas created verycompact code, forexample by usingintelligent linking andmaking full use of the hardwaremultiplier/divider for faster arith-

metic. This makes the executionrun faster and allows the micro-controller to enter one of its low-power modes after fewer clockcycles. Because the RL78 family isspecifically designed for use inlow-power applications, thepower-saving contribution fromhaving highly optimized code isextremely valuable. Version 1.20of IAR Embedded Workbench forRL78 brings even more improvedoptimizations. The code generat-ed for integer arithmetic andfloating-point operations is nowseveral times faster compared tothe previous version.

IAR SYSTEMS www.iar.com

IAR Systems delivers even faster code forRenesas RL78 applications

MSC now offers 12 new high-performance RX631 microcon-trollers (MCUs) in 64- and 48-pin packages from RenesasElectronics. The new devices areparticularly suited for compactand cost-sensitive industrial andconsumer applications.The MCUs are provided with256KB, 384KB or 512KB flashmemory and achieve up to 165DMIPS processing power at100MHz operation. At the sametime, the new MCUs offer users awide range of communication,timer and analog peripheralsincluding USB 2.0 full-speedchannel (Host, Device and OTG),CAN interface, 12 A/D converterchannels, a 10-bit D/A converterand a real-time clock (RTC).Furthermore, the RX631 deriva-tives that come in a 64-pin LQFPpackage, provide a six-channelmulti-function timer pulse unit 2(MTU2) with complementary six-phase PWM, a six-channel timerpulse unit (TPU), a four-channelcompare match timer (CMT), a

four-channel timer (TMR) anddual watchdog timers. TheRX631 derivatives also featurenumerous serial data communica-tion channels, six SCI, two SPI,and one I2C. Four channels ofDMA and a Data TransferController make it easy to handletransfers with peripherals andensure efficient use of the CPU.

MSCwww.msc-ge.com

12 new RX631 MCUs in 48 and 64 pin packages

Kontron announced a new COMExpress Starterkit with the indus-trial grade (E2) Carrier BoardKontron COM Express ReferenceCarrier-i Type10 for ultra smalland rugged applications based onCOM Express mini Computer-on-Modules with pin-out Type 10.The Kontron COMe StarterkitRef. Carrier T10 is specificallyconfigured to make evalu-ation and development ofsmall form factor andmobile applications easy,even for the extendedtemperature range (-40°Cto +85°C). For an individ-ual Starterkit, only theCOMe-mini module andthe suitable cooling solu-tion have to be selectedto immediately start thedevelopment, while allother components are prein-stalled. In addition to the mini-sized (120mm × 120mm) COMExpress Reference Carrier-i Type10, the Starterkit includes a 7"WVGA touch panel, cables andPSU. The kit is compatible with all

COM Express mini Type 10 mo -dules and it unleashes its fullpotential when used with industri-al grade COMs such as theKontron COMe-mTT10 to deve -lop by-design rugged applications.The Starterkit minimizes develop-ment time and cost by featuringthe enhanced interface range ofthe COM Express Type 10 pin-

out including new digital videointerfaces (DDI) as well as a CANBus and COM ports on an ultracompact footprint.

KONTRON www.kontron.com

New Starterkit for ultra small and ruggedapplications with COM Express mini Type 10 Computer-on-Modules

INDUSTRY NEWS

EMBEDDED SYSTEMS


Kontron announced the supportof the quad-core 3rd generationIntel Core i7-3615QE (4×2.3GHz,6MB L2 cache) and i7-3612QE(4×2.1GHz, 6MB L2 cache) proces-sors on seven embedded comput-ing platforms,to match themarketdemands forever increas-ing powersavings andperformancegains. Theseare the firstboards andmodules tofeature theincreased computing power,graphics performance, long-termavailability and energy efficiency ofthe new transistor technology fromIntel. Available in COM Expressbasic, Flex-ATX, Mini-ITX,AdvancedMC, 3U and 6UCompactPCI as well as 3U VPX,Kontron gives OEMs a jump-startin developing a broad range ofleading-edge compute- andgraphics-intensive applications. Based on Intel's innovative 22-nanometer (nm) 3-D tri-gate tran-

sistor technology, the 3rd genera-tion Intel Core i7 processor-based boards provide up to 20%enhanced computing power andup to 40% increased perform-ance per watt compared to

designs based on the 2nd genera-tion Intel Core processors. Thismeets and exceeds the require-ment for improved size, weightand power (SWaP) of embeddeddesigns and enables designers toutilize the power of the latestquad-core Intel processors forthe first time on small form fac-tors such as COM Express,AdvancedMC and 3U VPX.

KONTRON www.kontron.com

Kontron brings benefits of quad-core 3rd

generation Intel Core i7 processor technology to the embedded space

As a result of the early and closecooperation with Freescale andSTMicroelectronics, PLSProgrammierbare Logik &Systeme, as authorized tool part-ner, now offers Version 3.3of its Universal DebugEngine (UDE). The UDE 3.3is a sophisticated and proventest and debug solution forthe new Freescale MPC57xxfamily of Qorivva automo-tive multicore microcon-trollers (MCUs) and theSTMicroelectronics SPC57xfamily MCUs.The UDE 3.3, which is not onlysuitable for the development andtest phases but also for futurefield maintenance work, allowsusers, among other things, man-agement and control of the threeintegrated Power Architecture

e200 cores within one user inter-face. Individual cores or theentire device can be selected asdebug target. This is supportedby a flexible multicore program

loader that enables the loadingof program code and data as wellas symbol information separatelyfor each core.

PLS PROGRAMIERBARE LOGIK& SYSTEME www.pls mc.com

Universal Debug Engine 3.3 now also avail-able for Freescale MPC57×× andSTMicroelectronics SPC57× families of MCUs

INDUSTRY NEWS

EMBEDDED SYSTEMS

Silicon Laboratories Inc. intro-duced a single-port Power overEthernet (PoE) controller thatbrings economical “plug-and-play” simplicity to embeddedpower sourcing equipment (PSE)designs. The new Si3462 con-troller eases the development ofPSE endpoints such as residentialgateways, set-top boxes, fiber-optic media convert-ers, and surveillanceand security systemsthat connect to a widevariety of powereddevices including VoIPphones, security cam-eras, keypads, networkattached storage andWiFi access points.With the rising popularity of thehigher power IEEE 802.3at PoE+standard and the need to sup-port PD applications that con-sume up to 30 watts, developersrequire PSE controllers that offerflexible power measurement andmonitoring capabilities, stan-dards-compliance and no inter-

operability hassles. The Si3462controller is a complete, cost-effective single-port PoE andPoE+ PSE solution. Whendeployed with the newClassification Optional Mode,the Si3462 eliminates the needfor up to 10 discrete compo-nents, reducing the total BOMcost for embedded PSE to as lit-

tle as $1.60 (USD). In this mode,the Si3462 controller determineswhen a valid PD is connected atthe other end of the cable andimmediately applies a predeter-mined amount of power.

SILICON LABORATORIESwww.silabs.com

Silicon Labs Simplifies Power over EthernetDeployment for Residential Gateways andsurveillance Systems

Electronic Assembly can supply adata logger to monitor andrecord ambient temperature, rela-tive humidity and dew point. TheEA SYLOG-USB-2 is ideal forapplications in the pharmaceuticaland food industry, transportationand logistics and general labora-tory use. The device can simplybe inserted into a PC USBport for fast, uncomplicat-ed analysis of the datawhich has been logged.Drivers for current versionsof Windows are provided.The EA SYLOG-USB-2 cap-tures temperature and rel-ative humidity data simulta-neously and can store upto 16,382 readings. It also calcu-lates the dew point for each read-ing. The data logging intervals canbe in the range between 10 sec-onds and 12 hours and are userselectable. The date and timewhen logging starts can also bepre-programmed. Software issupplied for displaying the resultson the computer screen in graph-

ics format. The graphs can alsobe formatted for printing. Thedata can be converted into a vari-ety of standard formats andexported for further processing.Colored LED indicators displaythe current device status. TheLEDs also indicate whether pre-set minimum or maximum tem-

perature thresholds have beenexceeded, which is important toverify the integrity of the coolingchain in the food and pharma-ceutical industries. The data log-ger has an operating temperaturerange of -35°C to +80°C.

ELECTRONIC ASSEMBLY www.lcd-module.com

Data logger for temperature, relativehumidity and dew point


TRAINING

PCB-Design

Last time we started with the schematic. The ADD command places components. At the bottom of the ADD dialog you will find the Search line. There you can enter thename of the part, for example: LM555. If you want to make the search more flexible useplaceholders like * and ?. For example: *555*. This gives more results.

I would like to mention two important things you should keep in mindbefore you start: 1. The default grid setting in schematics is 0.1 inch!

Please keep this set-ting. All EAGLEsche matic symbols inall libraries are basedon this grid. Of course, you areallowed to set it to

millimetre (2.54mm), but you should not change the grid size.

2. Click the DISPLAY icon and switch on layer 93, Pins. So you can seeexactly where the pins of a symbol have to be connected with a net.Located on the left hand side of the schematic editor there is the icontoolbar. Hovering over one of the icons with the mouse shows its nameand functionality in the status bar. Simply explore the icons. If you arenot sure what you can do with a certain command, look into the helpfunction. Press F1 and there you are.

An interesting command is SMASH. It releases name and value textfrom the symbol in order to move it or change its layer or size. By the way: For fine adjusting a text, press the Alt key when you aremoving a text. Alt activates the alternative grid that can have any sizewhich is set in the GRID dialog. This can also be used with other commandslike LABEL that places the net name or a cross reference.

The final step in creating a schematic should be the Electrical RuleCheck. The result of this check is presented in the Errors window. Click onto the error and warning messages and EAGLE shows you whereto look in the drawing.

Please read the messages carefully and decide what to do. In some casesyou will recognize that the message is okay for you. So simply Approve it.

Next part will introduce the Design Link interface which offers accessto more than 400.000 components. n

www.farnell.com

EAGLE Version 6Drawing a schematic


An innovative handheld 3D imag-ing system for use in medicalapplications has been developedwith the support of Digia, QtCommercial. The Eykona® WoundMeasurement System, created byEykona Technologies, providesclinicians with an objective andrepeatable measure of the vol-ume of wounds, allowing com-parison and monitoring of thehealing process. Qt Commercialassisted Eykona in significantlyreducing the project completiontime. Qt is an established userinterface (UI) and cross-platformapplication framework used inthe automotive, medical, aero-space and industrial automationindustries, among many others.Digia, Qt Commercial is a pioneerin the commercial development,support, services and exclusivelicensor of Qt for desktop andembedded development.Eykona identified an unmet needfor the accurate measurementand clinical characterisation ofhard-to-heal wounds such as dia-betic and pressure ulcers. Existingtechniques estimated the volume

of wounds – the change of whichis an important indicator of thehealing process – by multiplyingan area estimate with a depthmeasurement obtained from aprobe. This method is both inac-curate and difficult to replicate.Eykona used patented technolo-gy, based on research at theUniversity of Oxford, to developa handheld imaging system thatproduces a full colour 3D modelof a wound that can be stored inthe patient’s treatment recordand shared to enable remoteassessment.

DIGIA, QT COMMERCIALwww.digia.com

Handheld 3D imaging system for medicalapplications relies on Qt Commercial

Data Display Solution - trend-setting German supplier of TFTdisplays and system solutions forindustrial and multimedia appli-cations - introduces a new prod-uct line of assembly monitors.The two new series of monitors,"KioskLine" and"PerformanceLine", present anutmost modular platform forprofessional touch applications. The PerformanceLine is charac-terized by its robust construc-tion, and it is optionally availablewith an IP65 protected frontpanel. The industrial PC plat-form is aligned for a very longavailability. Data Display withits KioskLine fulfills the needsof mass markets like POS aswell as demanding store fit-tings (Shop-eMedia) with indi-vidual design and functionali-ty. With respect to the frontline for both product variants,different touch technologiescan be chosen, for example resis-tive and P-CAP sensors for 1, 2

and 10 finger operation as wellas a coated safety glass. A vari-ety of different control solutions,reaching from the captive indus-trial graphics card with VGA,DVI/HDMI and DisplayPortinterface or media player withLAN to an integrated high per-formance PC, are provided. Theassembly monitors will be avail-able with display sizes from10.4" to 24" from summer 2012.The products are designed andproduced in Germany.

DATA DISPLAY SOLUTION www.dd-solution.de

New Monitor Assembly Series forIndustrial Applications

Dawar’s new Multi-TouchProjected Capacitive Touch(PCT) Screen technology pro-vides the optimum combinationof functionality, sensitivity andadvanced optics in an all-glasssolution ideal for medical, instru-mentation and industrial applica-tions. Dawar’s new multi-touch PCT screens present-ly support four simultane-ous touch points with fullgesture support – tap, flick,pinch, click, expand androtate. Input is effortlesswith finger, glove or con-ductive stylus. Dawar’s PCTsystem provides optics with90% light transmission,clarity of ≥ 97%, a rapidresponse, and excellent accuracy(no linearity calibrationrequired). The rugged all-glassconstruction delivers exceptionalsurface durability of ≥ 9H pencilhardness and dependable per-formance over a wide operatingtemperature range. Made in theU.S.A. with full U.S.-based engi-neering support, the new PCT

screens are available in a rangeof standard sizes – 4.3” to 24”diagonal for controller boardsolutions and 4.3” to 17” diago-nal for Chip-on-Flex. Dawaroffers screens in both standard(4:3) and wide aspect ratios, andcan provide custom features

such as a decorative front lensfor the popular tablet PC look.All are Windows 7 HID compli-ant – with drivers available formost other operating systems –and support multiple interfaces(USB, RS232 and I2C).

DAWAR TECHNOLOGIESwww.dawar.com

New DAWAR Multi-Touch projectedCapacitive Touch Screens combine advancedfeatures set with Rugged Durability

The Kyocera Group includesover 200 companies worldwidethat manufacture a wide rangeof products including industrialceramic materials, semiconduc-tor components, automotivecomponents, communicationsequipment and liquid crystaldisplays (LCDs).With the acquisitionof Optrex and forma-tion of KyoceraDisplay Corporation,Kyocera will expandits LCD productofferings and manu-facturing capabilitiesfor automotive andindustrial applications.Kyocera offers a wide range ofactive matrix TFT LCD panels insizes from 3.5 to 12.1 inchesdiagonal and resolutions fromQVGA to SVGA. Optrex, found-ed in 1976, has been focused onsmall and medium size LCDs in

the automotive and industrialmarket sectors, offering a rangeof active matrix TFT and mono-chrome graphic and characterLCDs. Kyocera’s Gen 3 TFT LCDfabrication facility producesstate-of-the-art polysilicon andamorphous silicon panels.

Kyocera Display Corporation willcomplement their high-volumefront-end array productioncapability with Optrex’s back-end modularization capabilities.

KYOCERA CORPORATION http://global.kyocera.com

Kyocera Corporation acquires LCDManufacturer OPTREX to create KyoceraDisplay Corporation

INDUSTRY NEWS

DISPLAY


The new Soleriq series, the firstchip-on-board LED fromOSRAM Opto Semiconductors,achieves a luminous flux of 1500lm to 4500 lm even at highapplication tempera-tures. This makesthem ideal for down-lights with high performancerequirements. The Soleriq E is nowavailable at Rutronikin two versions. Downlights providehigh-quality back-ground lighting, e.g.in shopping malls, offices, indus-trial buildings and high-end resi-dential premises. With a lumi-nous flux of 1500 lm to 4500 lm,only one LED of the new Soleriqseries is needed to give such aluminaire enough light. Thismakes designing luminairesmuch easier because only onecomponent has to be integratedinstead of lots of LEDs. The indi-vidual chips of a Soleriq E are allunder the conversion layer

(chip-on-board), giving theimpression of a homogeneouslight emitting surface. Thisensures a uniform color and lightappearance in the luminaire and

even coupling into external light-guiding optics is very simple.The light generated can be usedwith much lower optical losses,which in turn makes the LEDlamps and luminaires more effi-cient. The Soleriq E is availablein two versions, covering theentire color spectrum from 2700to 6500K.


Rutronik: Soleriq E LED from OSRAM OptoSemiconductors offers up to 4500 lm evenat high application temperatures

Expanding Everlight'sLighting Series component port-folio, EVERLIGHT Electronics,one of the world's leading com-panies in LED Lighting intro-duces a brand new high power,high brightness LEDpackage, the "Shwo D"Series - our new power-ful, bright and economic(superb $/lm) LED seriesin a compact ceramicpackage. The Shwo Dseries is a surface-mounthigh-power device fea-turing high brightnesscombined with a com-pact size (3.5x3.5x0.58mm) thatis suitable for all kinds of lightingapplications such as general illu-mination, flash, spot, signal,industrial and commercial light-ing. With standard operatingcurrent of 350mA, the Shwo Dfamily can be driven at 1 watt.The minimum luminous flux (lm)of the 1W Shwo D can be up to110 lm at 6500K(CCT) or 80 lm

at 3000K(CCT) when driven at350mA of current.The thermal pad of this device iselectrically isolated providingconvenience in thermal and elec-trical design. The Shwo D series

also has the advantage of lowthermal resistance. It is one ofthe most promising devices inEverlight's high power LightingSeries product offering and isready to face the challenges oftoday's Solid-State Lightingrequirements.

EVERLIGHT ELECTRONICS www.everlight.com

Everlight Introduces the Brand New Shwo DLED Lighting Series

Adding to the performance andpopularity of Everlight’s 6.4Wand 8W Chip-on-Board (COB)LED series, one of the highest CRIand highest efficiency COBs onthe market, Everlight ElectronicsCo., Ltd. announces the brandnew and smaller C52 COB LEDseries which is perfectly suitablefor directional and decorativeapplications such as MR lampsand P35 bulbs at LIGHTFAIRInternational 2012 in LasVegas/USA. For these types ofapplications, an LED light sourcemust exhibit compact size, highefficiency, sufficient lumen out-put, high CRI, high color unifor-mity, and proper light distribu-tion to maintain a comfortableand uniform lighting environment– all at consumer acceptableprices. With its new C52 COBSeries, Everlight Electronics hascreated the other ideal LED toaddress major challenges posedwhen designing a retrofit like MR,

GU or candelabra type: minimumefficiency requirements, thermalmanagement in limited space,and complexity of design.

Everlight’s COB series is a 3.7Wmulti chip, ceramic substratebased LED that boasts a low ther-mal resistance (Rth <1.8°C/W)and superior efficacy of 100lm/Wat 3000K CCT and high CRI(>80Ra). ). It will be available notonly in ANSI 3000K CCT but inall Energy Star / ANSI color tem-perature ranges.

EVERLIGHT ELECTRONICS www.everlight.com

Everlight Electronics Announces New C52COB LED Series

Global Lighting Technologies(GLT) Inc. has utilized itsadvanced LED-based edge light-ing technology in conjunctionwith Advanced Thermal Devices’(ATD) Loop Heat Pipe heat dissi-pation technology to develop anew high brightnessluminaire for use inhigh bay recessedceiling light applica-tions. The new ceil-ing light, ATD Model# SL-300-C7-NW,offers 17,000 usablelumens at a ratedpower of 300W anda color temperatureof 4,000-5,000K. Slim and light-weight for a luminaire of itspower and performance, it isideal for a range of indoor appli-cations such as theaters, auditori-ums, convention centers, largeopen office spaces, parkinggarages and warehouses.The luminaire measures 600 ×600 × 115mm (23.6 × 23.6 × 4.5inches) and weighs 17Kg (37lbs.),including adapter, and is water-proof. For illumination, it incor-

porates a light guide plate (LGP)from Global LightingTechnologies edge-lit by highbrightness LEDs spaced alongthe edge of the LGP, which isonly 5mm (0.196 inches) thick,contributing to the slim profile,

light weight and modularity ofthis easy-to-install unit. LHP cancircularly transport waste heatand dissipate it to the surround-ing environment by natural con-vection without extra power,effectively solving thermal prob-lems and extending the lifetimeof the LEDs.

GLOBAL LIGHTINGTECHNOLOGIES www.glthome.com

GLT and ATD develop 2 × 2 Foot High BayCeiling Light with 17,000 Lumens Brightness at 300W with advanced thermal management

INDUSTRY NEWS

LIGHTING


Microchip Technology Inc. andRutronik enhanced their existingfranchise agreement into theGreater China region (China,Taiwan and Hong Kong). Rutroniknow supplies its customers withthe entire Microchip productportfolio all over the globe tooutsourced manufacturing loca-tions or external assembly compa-nies. As previously offered inEurope, Rutronik now providesdesign-in support on site and cus-tomized logistics solutions also inthe new franchise regions.Microchip is placed as anotherstrategic manufacturer supportingRutronik’s global activities.For two decades now both com-panies have co-operated closelyand successfully with joint prod-uct, segment, and franchise strate-gies. Rutronik now takes the fifthposition in the worldwideMicrochip network. Microchip isone of Rutronik's most importantmanufacturers with a large sharein the microcontroller sales of thedistributor. Besides the 8, 16 and32-bit microcontrollers and DSC(Digital Signal Controller) solu-

tions, the focal products are ana-log components as well as serialand flash memories and specialwireless solutions. Microchipproducts are predominantly tar-geted at Rutronik's focal markets -Industrial, Automotive, Energy,Medical, Home Appliance andLighting. “By this wide portfolio ofinnovative products preciselyaddressing our most importantmarkets, Microchip is one of ourmost significant partners. By ourenhanced cooperation, our cus-tomers now benefit worldwidefrom theproductswith anexcellentprice/per-formanceratio, bestdesign-insupport,low system cost and short deliveryand development periods”, GerdFischer, Line Manager at Rutronikdescribes the situation.


Rutronik is Microchip's global partner

International Rectifier haslaunched an extensive portfolioof devices featuring IR’s latestlow-voltage HEXFET® MOSFETsilicon in a TSOP-6 package forlow power applications includ-ing load switch, charge and dis-charge switches forbattery protectionand inverter switches.Featuring very lowon-state resistance(RDS(on)) to signifi-cantly cut conduc-tion losses, the newpower MOSFETs areavailable as 20V and30V devices in N-and P-Channel con-figurations with amaximum gate drivefrom 12Vgs to 20Vgs. IR’s newportfolio of power MOSFETs ina TSOP-6 package complementthe company’s existing deviceshoused in SOT-23 and SO-8packages to provide customers

more flexibility in designing theirsystems. As a result of the lowRDS(on) of this platform, thesedevices can be used to replaceMOSFETs in larger packages tosave board space and reducesystem cost.

All of the new devices are MSL1and RoHS compliant containingno lead, bromide or halogen.

INTERNATIONAL RECTIFIERwww.irf.com

IR’s Family of TSOP-6 HEXFET® MOSFETsOffer Cost-Effective, Flexible Solution forLow Power Applications

Mitsubishi Electric is introducingits 6th generation Mega PowerDual (MPD) Insulated GateBipolar Transistor (IGBT) mod-ules. The modules, which are foruse in power converters such aslarge-capacity photovoltaic andwind power generation systems,are also suitable for other high-power applications e.g. in theareas of UninterruptiblePower Supply (UPS) sys-tems and AC motor control.The new modules’ 6thgeneration Carrier-StoredTrench-gate BipolarTransistor (CSTBT)reduces collector-emittersaturation voltage byapproximately 15% com-pared to the MPD modules ofthe 5th generation and the gatecapacitance by 30% to 50%.Furthermore, the maximum junc-tion temperature is raised to175°C. The new 6th generationMPD IGBT modules are compati-

ble to the 5th generation IGBTmodules in terms of dimensions,shape and pin configuration.Isolation voltage is now raised to4000V. Modules of the newseries are available asCM900DUC-24S (1200V/900A),CM1400DUC-24S(1200V/1400A) andCM1000DUC-34SA

(1700V/1000A). The new IGBT series is fullyRoHS compliant.

MITSUBISHI ELECTRICEUROPEwww.mitsubishichips.eu

6th Generation Mega Power Dual IGBTModules by Mitsubishi Electric

Silicon Laboratories Inc. intro-duced a web-based IsolatorPower Consumption Calculatorthat streamlines the process ofassessing system power budgetsfor applications requiring digitalisolation. The free online utilityenables developers todefine basic informa-tion about their isola-tion set-up and thencalculate the powerconsumption in a mat-ter of minutes.The power consump-tion calculator is espe-cially helpful forpower-sensitive andthermally constraineddesigns in small enclo-sures such as industri-al process controlmodules or programmable logiccontrollers. In these and similardesigns, the developer mustunderstand the power consump-tion of every component in thesystem including the digital isolator. The calculator is intuitively easyto use. The user simply selectsthe settings that match the

design such as total number ofchannels, VDD supply voltageand individual channel parame-ters, and then clicks “Get Results”to obtain detailed power andcurrent data.Without access to such a tool,

the developer would need toextrapolate power specificationsfrom data sheets or conductextensive calculations and thenguess at some of the isolationparameters.

SILICON LABORATORIESwww.silabs.com

Silicon Labs Online Power ConsumptionCalculator Simplifies Isolation ProductSelection and System Design

INDUSTRY NEWS

ACTIVE COMPONENTS


Avago Technologies, announcedthe ACPL-M21L/021L/024L/W21L/K24L optocoupler family .These optocouplers consumeless power as compared to othersimilar 5MBd optocouplers inthe market. The ACPL-×2×Loptocouplers are designed tomeet customer needs for lowerpower,higher isolation voltage,and better common-mode rejec-tion (CMR) performance, thanksto the excellent performance ofthe new LED and detector ICdesign. Avago Technologies’ dig-ital optocouplers are used in awide variety of isolation applica-tions ranging from power supplyand motor control circuits todata communications and digitallogic interface circuits. The newACPL-×2×L 5MBd digital opto-couplers require minimum LEDdrive current of 1.6mA, anddetector IC power consumptionof less than 1.1mA. The detectorIC contains a CMOS output

stage with glitch-free outputduring power-up and power-down, and optical receiver inputstage with built-in Schmitt trig-ger that provides logic-compati-ble waveforms, eliminating theneed for additional waveshap-ing. An internal shield also guar-antees high common-moderejection (CMR) of minimum25kV/μs at 1000V common-mode voltage. ACPL-×2×L opto-couplers operate at 3.3V/5V

power supply with guaranteedAC and DC performance froman extended temperature rangeof –40°C to +105°C.

AVAGO TECHNOLOGIESwww.avagotech.com

Avago Technologies Announces IndustryLowest Operating Power 5MBd DigitalOptocouplers

SemiSouth Laboratories, Inc., theleading manufacturer of siliconcarbide (SiC) transistor technolo-gy for high-power, high-efficiency,harsh-environment power man-agement and conversion applica-tions, is leading the world oncemore. After first releasing com-mercial 1200V trench JFETs in2008 - which are currently beingused in volume production bymany manufacturersof UPS, hi-rel pro -ducts, audio systemsand solar inverters -today SemiSouth isdelivering industry’sfirst 650 V silicon car-bide JFET power tran-sistors. The fastswitching speeds,large current handlingcapability combinedwith the superior thermal proper-ties of SiC makes these devicesideal candidates for power elec-tronic applications. They employvertical trench JFET structures,which allow for industry-leadingon-resistance per unit area, asmuch as five to ten times lower

than competing technologies. The 650V/55mΩ SJDA065R055SiC JFETs – like many SemiSouthdevices – feature a positive tem-perature coefficient for ease ofparalleling and extremely fastswitching with no "tail" current at150°C. RDS(on) typical for thesenew voltage-controlled devices is0.044Ω, which also exhibit a lowgate charge and low intrinsic

capacitance. Typical applicationsfor these TO-220-packageddevices are solar inverters, SMPS,PFC circuits, induction heating,UPS and motor drives.

SEMISOUTH LABORATORIES www.semisouth.com

SemiSouth first to sample 650V 55mΩ SiC JFETs

CML Microcircuits has released aFunction Image Update for thehigh-performance CMX7164Multi Mode Modem.Function Image 7164FI-1.x addsthe use of GMSK/GFSK modula-tion and is the latest in aroadmap of function enhance-ments available through CML’sFirmASIC component technolo-gy. These updates are designedto add to thedevice’s func-tions and fea-tures, increasingits flexibility andfacilitating in-the-field upgrades.The incorpora-tion of FirmASICtechnologyallows the prod-uct's functionand feature set to be easily con-figured via special FunctionImage™ data files. These areuploaded during device initiali-sation, either automatically froman external serial memory or via

a host microcontroller over thebuilt-in C-BUS serial interface. The 7164FI-1.x supportsGMSK/GFSK modulation withBT=0.5, 0.3, 0.27 or 0.25 and upto 20kbps, zero IF (I/Q) Rx andtwo-point modulation or I/Qmodulation Tx. Flexible bit ratessupport a wide range of applica-tions requiring a selectable flexi-ble bit rate and robustness.

The GMSK/GFSK data is over-aircompatible with the FX/MX909Band the CMX7143FI-1.x.

CML MICROCIRCUITSwww.cmlmicro.com

GMSK/GFSK Modulation Added to CMX7164

International Rectifier introduceda highly innovative 600V automo-tive grade IGBT platform,COOLiRIGBT™ for use in a widerange of fast switching applica-tions for electric (EV) and hybridelectric vehicles (HEV) includingon-board DC-DC converters,motor drives, and battery charg-ers. The new Gen. 1COOLiRIGBT™ devicesare capable of operatingat the same fast switchingspeeds as MOSFETs whileoffering higher efficiencyat high current levels. Thefirst generationCOOLiRIGBT™ devicescover a broad currentrange and offer aminimum short circuitrating of 5μs, low Vce(on)and positive Vce(on) temperaturecoefficient. Additional featurescommon to the family includesquare reverse bias safe operatingarea (SRBSOA) and maximumjunction temperature of 175°C.COOLiRIGBT™ also providesdesigners with the flexibility of

selecting a diode with optimizedperformance for the application.The AUIRGC655A1N0 is opti-mized for main electric andhybrid vehicle inverters and largemotor drives while theAUIRGC65A20N0 andAUIRGC65G20N0 are targetedfor power supply and high switch-ing frequency applications.

The new devices are all environ-mentally friendly and assembledwith IR’s automotive grade bill ofmaterials which are lead-free andRoHS compliant.


IR Introduces Ultra-fast Switching, Rugged600V High Frequency IGBTs for AutomotivePower Supply Applications

INDUSTRY NEWS

ACTIVE COMPONENTS


International Rectifier haslaunched the automotive quali-fied AUIRS2334S 600V IC for 3-phase inverterized motor driveapplications such as high-voltagecompressors (HVAC) and fans.The AUIRS2334S fea-tures an advancedinput filter to improvethe input/output pulsesymmetry of the signalsprocessed by thedevice. Other key fea-tures include integratedfixed deadtime protec-tion circuitry, shoot-through protection cir-cuitry and under-volt-age lockout protectionon both the VCC low-side and allVBS high-side floating power sup-plies. The new device is also fullycharacterized for negative tran-sients on the switching node(NTSOA) that may occur duringnormal operation and protectionmode. With its compact package,high level of integration and com-prehensive set of protection fea-tures, the AUIRS2334S offers asmaller, robust solution for 3-phase inverterized motor driveapplications used in vehicles com-

pared to alternative solutions thatuse three half bridge drivers.Proprietary HVIC and latchimmune CMOS technologyenables ruggedized monolithicconstruction. Logic inputs are

compatible with CMOS or LSTTLoutputs, down to 3.3V. The out-put drivers feature a high pulsecurrent buffer stage designed forminimum driver cross-conduction.Propagation delays are matchedto simplify use in high frequencyapplications. The floating channelcan be used to drive N-channelpower MOSFETs or IGBTs in thehigh side configuration up to 600V.


IR Introduces Automotive QualifiedAUIRS2334S 600V IC for 3-PhaseInverterized Motor Drive Applications

SemiSouth Laboratories, Inc. hasannounced a new 1700V/1400mΩ silicon carbide JFETwhich simplifies start up circuitdesign in 3-phase auxiliary powersupplies. Traditional solu-tions either use an HV bleedresistor which results in aslow start-up at low linevoltages and a high quies-cent power loss, or areMOSFET-based whichnecessitate overload protec-tion and can suffer fromhigh power losses in theMOSFET under fault conditione.g. short circuit. ExplainsApplications Engineer, NigelSpringett: “By using a depletionmode JFET, designers can achievea fast start-up using no extra com-ponents. Our JFETs need no extraheat sink for this application.”

The SJDT170R1400 will come ina newly developed SMD D2PAK-7L package in order to simplifyPCB layout and optimize switch-ing performance due to lower

inductance. This package willhave a high creepage distance of6.85mm in order to support1700V applications and is sizedof 16×10×4.4mm.

SEMISOUTH LABORATORIES www.semisouth.com

SemiSouth announces new 1700V/1400mΩSiC JFETs which simplify fast start-up of 3-phase power supplies

INDUSTRY NEWS

ACTIVE COMPONENTS

International Rectifier, IR® intro-duced a family of highly integrat-ed, ultra-compact, patent pend-ing μIPM™ power modules forhigh efficiency appliance and lightindustrial applications includingcompressor drives for refrigera-tion, pumps for heatingand water circulation, air-conditioning fans, dish-washers, and automationsystems. By utilizing aninnovative packagingsolution, the μIPM familydelivers a new benchmarkin device size, offering upto a 60 percent smallerfootprint than existing 3-phase motor controlpower ICs. Available in an ultra-compact 12×12×0.9mm PQFNpackage, the μIPM family compris-es a series of fully integrated 3-phase surface-mount motor con-trol circuit solutions. The newapproach pioneered by IR for thismarket segment utilizes PCB cop-

per traces to dissipate heat fromthe module, providing cost sav-ings through a smaller packagedesign and even eliminating theneed for an external heat sink. Byusing standard packaging QFNtechnology, assembly is simplified

by eliminating through-hole sec-ond pass assembly and improvingthermal performance comparedto traditional dual-in-line modulesolutions.


IR’s μIPM™ power modules deliver up to60% smaller footprint, high efficiency, costeffective motor control solution for appli-ances and light industrial applications

Rutronik distributes the newFastrax IT530 GPS module featur-ing decreased power drain andreduced time to first fix inportable, battery-operateddevices. The Fastrax IT530 is anultra-low power consuming andsuper-sensitive OEM GPS modulein a tiny form factor. Made avail-able through distributorRutronik, the device solves acritically important issue inlocation-aware, battery-pow-ered consumer products:ensuring a very fast time tofirst fix (TTFF) without sacrific-ing battery life. Its sensitivityof -149dBm in acquisition, -165dBm in navigation andpower consumption of just35mW at 3.3V are ideally suitedto battery-operated devices.Measuring 9.6 × 9.6 × 1.85mmand weighing 0.4g, the modulehas an identical footprint as thepopular Fastrax IT430. The new power-saving modeAlwaysLocate™ prolongs batterylife by controlling receiver power

modes and maintaining locationinformation. Depending on theenvironment and motion, themodule adaptively adjusts its na -vigation activity to balance posi-tioning accuracy, fix rate andpower consumption. TheEmbedded Assist System (EASY™)reduces warm-start TTFF by up

to 90% with assisting ephemerisdata stored internally for up tothree days. Additionally, the serv-er-assisted EPO™ file transferextends the external A-GPS ser -vice to a maximum of 14 days.


Fastrax IT530 GPS module available fromRutronik now


Vishay Precision Group, Inc.announced that its Vishay FoilResistors division (VFR) is nowoffering a wide variety of resis-tors built on Bulk Metal® Z- andZ1-Foil technologyfor high reliabilityand stability in high-temperature applica-tions and harsh envi-ronments. Z- and Z1-Foil foil resistors areavailable in a varietyof configurations.Devices such as theVCS1625Z,VCS1625P, CSM2512, andCSM3637 offer four-terminalKelvin connections for high relia-bility and accurate current meas-urement, and the FRSH andVSMP series feature wraparoundterminations to ensure safe han-dling during the manufacturingprocess, as well as to provide sta-bility during repetitive thermalcycling. The flexible terminations

of the SMR1DZ and SMR3DZensure minimal stress transfer-ence from the PCB due to differ-ences in linear CTE (coefficient ofthermal expansion) while the her-

metically sealed packages of theVHP100 and PRND series elimi-nate the ingress of moisture andoxygen. For hybrid circuits, theHTHG is connected with goldwire bonding while the HTHA issuitable for aluminum wire bond-ing technology.

VISHAY INTERTECHNOLOGYwww.vishay.com

VPG offers precision resistors with operatingtemperature over +175°C and Load LifeStability of 0.005% for High-TemperatureEnergy and Transportation Applications

AVX Corporation has more thandoubled the volumetric efficiencyof its tantalum technology,enabling latest versions of itsTACmicrochip® capacitor todeliver 15μF/4V and 10μF/6Vfrom a 0402 chip. The CV per-formance of these TLC seriesdevices is even greater thanceramic MLCC devices using theX5R dielectric. The designof the TACmicrochip®capacitor series eliminatesthe need for molded plasticfrom the packaging –required in traditionaldesigns - allowing muchgreater capacitance to besqueezed into a given pack-age. This has increased thevolumetric efficiency fromless than 15% to approaching50% - making them applicable fora much wider range of uses.High CV 15μF/4V, 10μF/6V TLCparts suit miniature applicationsuch as hearing aids, ultra-thin

smart phones and tablet PCs. TBC capacitors are available tothree specifications: the conser-vative military standard CWR15,ranging from 0.47μF to 68μF;COTS-Plus devices which can besupplied tested to customizedparameters; and SRC9000devices - specially dedicated tosatellites and space systems –

which are subjected to specialpost-assembly tests to assure thehighest quality levels.

AVXwww.avx.com

Tantalum chip capacitors from AVX nowdeliver higher CV than X5R dielectricceramic devices

Vishay Intertechnology, Inc. intro-duced the first devices in its next-generation TrenchFET® Gen IVfamily of 30 V n-channel powerMOSFETs. Utilizing a new high-density design, the SiRA00DP,SiRA02DP, SiRA04DP, andSiSA04DN offer industry-low on-resistance down to 1.35mΩ at4.5V and low Millercharge, Qgd, down to1.8nC in thePowerPAK® SO-8 and1212-8 packages. Thenew Vishay SiliconixTrenchFET IV powerMOSFETs incorporatetechnologicalimprovements in sili-con design, wafer pro-cessing, and device packaging todeliver a number of benefits todesigners of today's power elec-tronics systems. With a reductionin on-resistance times silicon areaof over 60 % compared with pre-

vious-generation devices, theSiRA00DP is able to demonstrateextremely low RDS(on) values of1.0mΩ at 10V and an industry-best 1.35mΩ at 4.5V. TrenchFET Gen IV MOSFETs offera new structure that utilizes a veryhigh-density design without sig-nificantly increasing the gate

charge, overcoming a problemoften associated with high cellcount devices.


Next-Generation TrenchFET® Gen IV 30V N-Channel Power MOSFETs feature On-Resistance down to 1.0mΩ at 10V and1.35mΩ at 4.5V

An inductance swing of 2:1 fromzero to maximum current and ahigh volt-seconds-current-product at temperatures up to+130°C characterises of the 98Tseries high power toroidalinductors from YDSthat are available atMSC VertriebsGmbH. In addition to stan-dard models withinductance valuesbetween 14μH and335μH customerspecific inductorsare available. The98T series inductorsare suited for allkinds of switchedpower circuits, i. e.switching powersupplies in all circuittopologies as well asfor filter circuits. The cost effective semi encapsu-lated design supports space saving vertical mount. All 98T series models are speci-fied for an operating tempera-

ture range up to +130°C.Depending on the model themaximum current ranges from3.6A to 17A. Depending on thecore size the energy storagecapability is specified between

700μJ and 6030μJ. The 98Tseries of high current inductorsis recognised by UL1950.

MSC VERTRIEBSwww.msc-ge.com

98T Series – High Currents Inductors arerecognised by UL60950-1

INDUSTRY NEWS

PASSIVE COMPONENTS


INDUSTRY NEWS

PASSIVE COMPONENTS

Crystek's CVCO55CCQ-3200-3200 VCO (Voltage ControlledOscillator) operates at 3200MHz with a control voltagerange of 0.5V~4.5V. This VCOfeatures a typical phase noise of-115 dBc/Hz @ 10KHz offsetand has excellent linearity.Output power is typically +6dBm. Engineered and manufac-tured in the USA, the modelCVCO55CCQ-3200-3200 ispackaged in the industry-stan-dard 0.5-in. × 0.5-in. SMD pack-age. Input voltage is 6V, with atyp. current consumption of27mA. Pulling and Pushing areminimized to 0.3MHz and

0.1MHz/V, respectively. Secondharmonic suppression is -12dBctypical. The CVCO55CCQ-3200-3200 is ideal for use inapplications such as digital radioequipment, fixed wireless access,satellite communications sys-tems, and base stations.

CRYSTEKwww.crystek.com

New 3200MHz VCOFrom Crystek Corporation

Vishay Intertechnology, Inc.introduced four new engineeringdesign kits for its AEC-Q200-qualified D/CRCW e3 thick filmchip resistors. Designed to helpengineers select the perfect resis-tor for theirapplications, thekits offer thecommercial-off-the-shelf devicesin 0402, 0603,0805, and 1206case sizes and awide variety ofresistance values,convenientlytaped in stripsand individually labeled andpackaged. The four design kitsreleased today feature E96 seriesresistance values from 10Ω to1MΩ (every fourth value) — inaddition to a 0Ω jumper — for122 different values each. Theresistors provide tolerance of ±1%, TCR of ± 100ppm/K, power

dissipation (P70) from 0.063W to0.25W, and limiting element volt-age from 50V to 200V. The D/CRCW e3 thick film chipresistors are ideal for automotive,industrial equipment, telecom

infrastructure, consumer, andcomputer applications. The devices are compliant toRoHS Directive 2011/65/EU andhalogen-free according to the IEC61249-2-21 definition.


Vishay Intertechnology Releases Four NewEngineering Design Kits for D/CRCW e3Thick Film Chip Resistors

Integrated Device Technology,Inc., the Analog and DigitalCompany™ delivering essentialmixed-signal semiconductor solu-tions, today announced theworld’s first CrystalFree™ piezo-electric MEMS (pMEMS™) LVDS /LVPECL oscillators for high-per-formance communications, con-sumer, cloud, andindustrial applica-tions. IDT’s new oscil-lators operate withsubstantially less thanone picosecond ofphase jitter in com-pact industry-stan-dard packaging, mak-ing them an idealreplacement for tra-ditional six-pin crystaloscillators (XOs).The IDT 4M series high-perform-ance LVDS / LVPECL oscillatorsleverage IDT’s patentedCrystalFree pMEMS resonatortechnology, enabling IDT to rap-idly factory-program the desiredoutput frequency without the

need to fine-tune expensive crys-tals. In addition, because thenominal resonator frequency ofpMEMS is much higher thanquartz crystal, 4M oscillators areable to achieve higher frequen-cies at lower cost without sacrific-ing critical performance. The 4Mseries is the first of a broad port-

folio of MEMS-based devicesfrom IDT that will provide cus-tomers with convenient, accurate,low-jitter timing references.

IDTwww.idt.com

IDT Introduces World’s First PiezoelectricMEMS Oscillators for High-performanceApplications

Crystek's CVCO55CC-2558-2575 VCO (Voltage ControlledOscillator) operates from 2558MHz to 2575MHz with a controlvoltage range of 0.3V~4.7V. This VCO features a typicalphase noise of -120dBc/Hz @10KHz offset and has excellentlinearity. Output power is typi-cally +8dBm. Engineered andmanufactured in the USA, themodel CVCO55CC-2558-2575is packaged in the industry-stan-dard 0.5-in. x 0.5-in. SMD pack-age. Input voltage is 8V, with amax. current consumption of29mA. Pulling and Pushing areminimized to 2.0MHz and

0.2MHz/V, respectively. Secondharmonic suppression is -15 dBctypical. The CVCO55CC-2558-2575 is ideal for use in applica-tions such as digital radio equip-ment, fixed wireless access, satel-lite communications systems, andbase stations.

CRYSTEKwww.crystek.com

New 2558-2575MHz VCOFrom Crystek Corporation

MSC now offers the FTR80361,a 122.400 MHz fundamentalmode monolithic crystal filter,from Precision Devices (PDI).The FTR80361 filter featuresinsertion loss of 3dB maximum,spurious response of 70dB mini-mum and increased bandwidthof up to 200kHz. The deviceis provided with a terminat-ing impedance (input/output)of 50ohms. Pass bandwidth isa minimum of ±35kHz at 3dB,with passband ripple 1.0dBmaximum. Stop bandwidth isa maximum of ±768kHz at70dB and ±350kHz at 60dB.To save board space in compactapplications, this new crystal fil-

ter is housed in a small 25.1mm× 10.0mm × 15.00mm package.A new SMD version is scheduledto be available in Fall 2012. Thewide operating temperaturerange of -40°C to +85°C makesthe FTR80361 suitable for use inharsh industrial environments.

MSC VERTRIEBSwww.msc-ge.com

122.400MHz crystal filter with only 3dBinsertion loss


Vishay Intertechnology Launches InfraredReceivers for Universal Infrared 3D TVShutter Eyewear

Rutronik announces newWiseMote™ Wi-Fi devices fromRedpine Signals for RTLS andsensor network applicationsoperating in 2.4 and 5GHz bands,providing enterprise security andimproved battery life. The WiseMote™ WM1-20(2.4GHz) and WM1-50(2.4/5GHz)802.11n fromRedpine Signalswork with anythird-party hard-ware and soft-ware RTLS infra-structure. Theiradvanced featuresinclude enterprisesecurity and sin-gle stream 802.11n, thereforemaking them ideal for deploy-ment in enterprise environments.Operation in the 5GHz bandprovides for close adherence todesigned battery life comparedto crowded 2.4 GHz channels.The devices can be programmedto operate in a variety of modes,

supporting multiple locationtracking and update mechanisms.In Cisco Compatible Extensions(CCX) mode, they offer CiscoCCX compliant beaconing withconfigurable patterns, telemetryand alarm notifications. In Wi-Fiassociated mode, they periodical-ly connect to access points, com-

municating sensor and channeldata to a server. In other beacon-ing modes, the devices supportstandard Wi-Fi clients with simpletag identification software tolocate and identify assets.


Rutronik introduces Redpine Signals‘ new5 GHz Wi-Fi RTLS tags

Vishay Intertechnology, Inc.released the first devices in itsnext-generation D Series of high-voltage power MOSFETs. Thenew 400 V, 500 V, and 600 V n-channel devicescombine low spe-cific on-resistancewith ultra-lowgate charge andcurrents from 3 Ato 36 A in a widerange of pack-ages. Based on a newhigh-voltagestripe technology,the D SeriesMOSFETsreleased today enable new lev-els of efficiency and power den-sity. The devices' stripe design— with a smaller die size andterminations — lowers the totalgate charge by 50 % compared

with previous-generation solu-tions while increasing switchingspeed and reducing on-resist-ance and input capacitance. The 400 V, 500 V, and 600 V

devices feature on-resistancedown to 0.17 Ω, 0.13 Ω, and0.34 Ω, respectively.


Next-Generation 400V, 500V, and 600VVishay Siliconix N-Channel Power MOSFETsoffer Ultra-Low On-Resistance down to0.130Ω, FOM down to 7.65Ω-nC, andCurrents from 3A to 36A

Omron Electronic ComponentsEurope has made 2D and 3DCAD drawings for the over-whelming majority of its electro-mechanical solid state relays andswitches as well as its connectorsand sensors available for instantdownload online.The drawings arepublished on theportal run byTraceparts, a lead-ing CAD softwarecompany with near-ly a million regis-tered users and adatabase of millionsof parts includingelectronic components. They can be downloaded athttp://www.tracepartsonline.net/ws/omron/index.aspx.Commenting, Mark Jones, COOof Omron ElectronicComponents Europe, said, "Now,customers can quickly find a 2D or3D CAD drawing of the Omroncomponent they need for theirdesign, and download it instantly in

native formats for popular CADsystems or industry standard CADformats. This will enable engineersto design PCB layouts much quick-er and more efficiently.Technical specifications anddatasheets are already available onthe Omron website."

By registering on the Tracepartswebsite, Omron customers canreadily search the catalogue ofOmron components, view thecomponents and configure themto suit their specific requirementsthen download a 2D or 3D CADmodel in their preferred format.

OMRONhttp://components.omron.eu

Omron offers downloadable 3D CADDrawings for full electronic component range

INDUSTRY NEWS

PASSIVE COMPONENTS

Vishay Intertechnology, Inc. isbroadening its optoelectronicsportfolio with the release of twoinfrared (IR) receivers developedspecifically for universal 3D TVglasses. The majority of LCD 3Dtelevisions sold today use activeshutter glasses to separate theimages intended for the left andright eye. Despite efforts to stan-dardize the technology used tosynchronize the 3D TVs with theircorresponding active shutterglasses, the industry is far fromthis goal, and there exists a largenumber of incompatibleIR and RF protocols fromvarious manufacturers.The lack of a standardhas led to the develop-ment of a market for uni-versal 3D TV eyewearcapable of functioningwith any 3D TV usingactive eyewear technolo-gy. The new TSMP6000and TSMP77000 are surface-mount IR receivers designed to

receive any infrared signal usedfor 3D TV synchronization, andthis capability simplifies thedesign of universal 3D TV eye-wear. The TSMP6000 andTSMP77000 integrate a photodi-ode, amplifier, and signal condi-tioning IC into a single tiny pack-age that helps minimize theweight of 3D glasses, and theirultra-low current consumptionmaximizes the battery life. TheTSMP6000 and TSMP77000 aresurface-mount devices that can bemounted in a side or top view.



Vishay Intertechnology, Inc.released a new power thick filmresistor that is the industry's firstresistor in the compact57mm by 60mm pack-age to offer a powerrating of 1100W at aheat sink temperatureof + 25°C. TheLPS1100 offers high-temperature deratingperformance and abroad range of resist-ance values. TheLPS1100 thick film resistor is non-inductive (< 0.1μH) and providesa resistance range from 1Ω to1.3kΩ. Designed for easy mount-ing to a heat sink, the device's

compact footprint, low 25mmprofile, and low weight of 79grams save valuable space to help

designers reduce the size of theirend products.


Vishay Intertechnology releases industry'sfirst Power Thick Film Resistor to offerPower Rating of 1100W in compact 57mmby 60mm Footprint

Electronic Concepts, which hasits corporate headquarters inEatontown, New Jersey, wasfounded in 1969. The compa-ny’s asset base is unique in theelectronics industry: verticallyintegrated manufacturing, state-of-the-art automated produc-tion lines and a wealth of engi-neering experience. The com-pany has everything it takes toproduce capacitors which setthe standard in the industry.Electronic Concepts is the rec-ognized leader in the designand manufacture of filmcapacitors. The company mar-kets a broad range of standardproduct lines ranging fromsmall chip-size capacitors tolarge building blocks which aremanufactured in the US and at

the Oughterard plant in Ireland,where production got underwayin 1981. Basing production intwo plants ensures security ofsupply, and the company canguarantee throughput times of10 - 12 weeks. Prototypes canbe supplied within 4 - 6 weeks.

ELECTRONIC CONCEPTSEUROPEwww.electronicconcepts.ie

The leader in film capacitors – endless innovation

INDUSTRY NEWS

PASSIVE COMPONENTS

Vishay Intertechnology, Inc. introduced a newseries of AEC-Q200-qualified, dual-in-linethin film resistor networks. The NOMCAseries features low absolute TCR of ±25ppm/°C, TCR tracking of 5 ppm/°C, tightratio tolerances to ± 0.05%, and excellentlong-term ratio stability of 0.05% after 1,000hours at + 125°C. For improved ESD andmoisture protection, the resistor networks areconstructed with self-passivating tantalumnitride resistor film on a high-purity aluminaor ceramic substrate.Featuring a rugged, molded 50 mil pitch con-struction, the NOMCA thin film resistor net-works offer 7 or 8 isolated resistors of equal

value in compact, narrow (0.150in.) 14- or 16-pin SOIC packages, in accordance with JEDEC

MS-012 variations AB and AC. Each resistoroffers a wide resistance range of 1kΩ to50kΩ and a typical power rating of 100mW.The integrated construction of NOMCAresistor networks allows for higher precisionover discrete SMT chips, making the devicesideal for precision voltage dividers, op amps,and battery management applications. Typical end products will include automotive,telecommunications, industrial, process con-trol, and medical equipment. Samples of theNOMCA resistor networks are available now.


Vishay Intertechnology Introduces New AEC-Q200-Qualified, Dual-in-Line Thin FilmResistor Networks in 14- or 16-Pin SOIC Packages

Vishay Intertechnology, Inc. released anew high-voltage, ultrafast surface-mount avalanche rectifier in the plasticDO-214AC package. The BYG23Tcombines a low 1.98mm profile withextremely high reverse voltage of1,300V and fast 75ns reverse recoverytime. The rectifier released today isoptimized for high-voltage, high-fre-quency rectification in switchmodepower supplies (SMPS), HID ignitiondrives, and industrial ballasts. TheBYG23T features low typical reversecurrent of 2.9μA at + 125°C, 5mJ pulseenergy in avalanche mode, forwardcurrent of 1.0A, and forward voltage of

1.39V at 1A and + 125°C. Ideal for automated placement, theBYG23T offers a rugged maximumoperating junction temperature of +150°C and an MSL moisture sensitivi-ty level of 1, per J-STD-020, LF maxi-mum peak of + 260°C. The device iscompliant to RoHS Directive2011/65/EU and WEEE 2002/96/EC,and it is halogen-free according toIEC 61249-2-21. Samples and production quantities ofthe BYG23T are available now.


Vishay Intertechnology releases High-Voltage, Ultrafast SMD Avalanche Rectifier inLow-Profile DO-214AC Package

INDUSTRY NEWS

SMT


ePlace 4.0 is the most moderngraphical user-machine interfacefrom Essemtec. Currently, variousSMD placement machines arecompatible with ePlace, includingParaquda and Cobra.ePlace 4.0 uses Windows 7/64 bitas its operating system. Windows7 is replacing Windows XP moreoften in business applications andmachine controlsbecause 64-bit com-puters can calculatehighly accurate num-bers and measure-ments faster.Operators can profitfrom quicker screendisplays and fastercalculations of com-plex simulations andoptimizations. TheWindows 7 operating system sim-plifies the integration of the pick-and-place machine in a compa-ny’s network. The fact that ePlace4.0 now works with an SQL data-base further eases the integration.The user can chose between MS-SQL, MySQL and PostgreSQL. Inthe past, ePlace used a highly effi-cient XML database, whichremains available with the 4.0release. However, data now canbe exported from XML to an SQLdatabase and vice versa via a sim-ple mouse click. ePlace 4.0 is as

easy to understand as previousversions because the user inter-face appearance remainsunchanged. However, user helphas been expanded with numer-ous additional documents andprocess information. Manydetails of ePlace have beenadapted to customers’ growingneeds. For example, components

with no visible leads such asBGAs now can be shown frombottom-up alternatively. In con-junction of ePlace with the pick-and-place machine, the vacuumdetection of the placement headhas been optimized. The vacuumgenerator is now stabilized intighter limits. As such, pick-uperrors can be detected quickerand more reliably for even thesmallest components.

ESSEMTECwww.essemtec.com

MARTIN presented its Mini-Oven Reball/Solder Bumpingunit at the last SMTA TorontoExpo & Tech Forum, at theCrowne PlazaToronto AirportHotel inOntario,Canada.The MINIOVEN04 provides areflow environ-ment in a com-pact, standaloneunit and is idealfor pre-bump-ing QFNs andreballing BGAsand CSPs. Theefficient hot gas circulationensures optimal heating of thecomponent and a controlledreflow process. The unit offersprogrammable modes and will

accommodate up to 99 profiles,with the ability to edit individualprofiles and fine tune parame-ters. A gas connection is avail-

able for processing gases, suchas nitrogen, argon and formic.

MARTINwww.bgarework.com

MARTIN demonstrated Mini-OvenReball/Solder Bumping Unit at theSMTA Toronto Expo and Tech Forum

With its software, Viscom offersmany useful additional featuresto make using AOI/AXI inspec-tion systems in electronics manu-facturing faster and more con-venient. With the new SoftwareRelease 7.45, Viscom has againadded additional features.Highlights include improvedcomponent body detectionfor SOTs, the new color ringinspection capability forresistor values, further sim-plified optical characterrecognition (TopOCR), andsolder ball inspection. SIRelease 7.45 offers new fea-tures to provide even moreimprovements to increasesystem performance and relievethe operator. One example isimproved component bodydetection for SOTs. Viscom hasdeveloped a new algorithm forthis task and optimized it inactual manufacturing runs involv-ing high piece counts. With thisnew inspection process, reliabledefect detection and reducedfalse alarm rates can be attained.For the color ring inspection, anew analysis process based on

color images from the 8M cam-era technology is now available.This process ensures that colorring inspection for Melf andTHT components is fast and reli-able. Another new useful func-tion is solder ball inspection. Inaddition to the familiar variants

of inspection window generationfrom GenCad or Gerber data,this function is now available as acomponent of the Viscom SIsoftware release.Viscom now offers an improvedoptical character recognition(OCR) software. OCR hasbecome a standard procedureon components.

VISCOMwww.viscom.de

Viscom Introduces New AOI Featureswith SI Software Release 7.45

Rochester Institute of Technologyhas partnered with equipmentsupplier MARTIN to utilize aMARTIN Expert 10.6 ReworkStation and Mini-Oven unit in itsCenter for ElectronicsManufacturing and Assembly(CEMA) located in Rochester,NY. The systems will be on handto support CEMA in many ways,including hands-on educationfor students, industry workforcetraining, support of studentprojects and applied research.The center also will provideMARTIN the opportunity toshowcase its equipment to manylocal and regional electronicspackaging companies, and toconduct investigations to exploreits suitability for customer appli-cations. The Expert 10.6 system

is capable of precision rework ofSMDs, sockets and connectors, aswell as residual solder removaland dispensing of fluxes and sol-der pastes. The hybrid platformcombines both infrared and con-

vection heating technologies toachieve outstanding board tem-perature uniformity.

MARTINwww.bgarework.com

Rochester Institute of TechnologyPartners with MARTIN to ProvideRework Training & Research

Essemtec’s ePlace 4.0: A Quantum Leap


INDUSTRY NEWS

SMT

Everett Charles Technologies(ECT) introduces the new A7CfFlying Probe Test System fromatg-LM. The double-sided testsystem features four probes ontop and four additional probeson the bottom.The test platform first wasunveiled at the CPCAshow in Shanghai withpositive feedback. “TheA7 is atg-LM’s latestinnovation in high-per-formance, high accuracyflying probe,” said KlausKoziol, atg LM’sDirector of Sales NorthAmerica.The high-speed A7performs up to140measurements per second or upto 8400 per minute, dependingon the product under test andtest method. The platform fea-tures a large test area of 20×24",and can inspect pad sizes downto 2 mil (1.3 mil with micro nee-

dle) and pitches down to 4 mil(3 mil with micro needle).The universal shuttle systemoffers a clamp and tension modefor testing flexible and rigidboards. In addition to providinghigh-speed Kelvin 4-wire measu -rement, the A7 features direct

linear drives and a carbon fiberZ-axis for extreme accuracy andspeed.

EVERETT CHARLESTECHNOLOGIES www.ectinfo.com

ECT Introduces A7 Flying Probe TestSystem from atg-LM

Nordson DAGE, a division ofNordson Corporation will exhibitits 4000Plus Bondtester PadCratering Inspection System atthe upcoming ElectronicComponents and TechnologyConference (ECTC), scheduledto take place May 29-June 1,2012 at the Sheraton San DiegoHotel and Marina in California.The new Nordson DAGE4000Plus Hot Bump Pull/Hot PinPull system is a unique patentedtechnique for attaching a testprobe to solder bumps or solderpaste in order to perform a hotbump pull test. The industryunique solution conforms to IPC-9708 as well as JEITA ET-7407Atest standards for the detectionof pad cratering for surfacemount and printed circuit boardassemblies. It is fully integratedinto a single load cartridge on astandard 4000Plus system.Heating and cooling stages and apin clamping mechanism are inte-grated into the single load car-tridge. The 4000Plus Bondtesterrepresents the new industry stan-

dard in bond testing with unsur-passed data accuracy andrepeatability. Nordson DAGEbond test technology meets therequirements of emerging testapplications including ribbonpull, pad cratering using hot pinpull, bend and fatigue testing.The 4000Plus bondtester usesthe next-generation Paragon™software providing semiautomat-ic test routines, automatic GR&Rcalculation, unique databasesearch engine wizard and superi-or data reporting.

NORDSON DAGEwww.nordsondage.com

Nordson DAGE to Exhibit Hot BumpPull/Hot Pin Pull Technology at ECTC San Diego

Blakell Europlacer Ltd., a manufac-turer of market-leading flexibleSMT placement machines, intro-duces the newest addition to itsrange of distribution products —Aleader Automatic OpticalInspection.The Aleader AOI range includesboth on- and offline systems thatuse 3-D topography and facerecognition algorithms to result insystems that are easy to program,provide extremely low false callrates (typically less than four falsecalls per 1000 devices tested)and are competitively priced.Blakell Europlacer’s UK GeneralSales Manager Andy Jonesexplains why he felt that Aleaderwas the right system to add to itsother SMT assembly equipmentportfolio: “We have been sellingAOI systems for a period of timeand have been very successful.However it has become clear thatdue to the nature of the UK mar-ket, many manufacturers are look-ing for a system that can be adapt-

ed quickly to reflect the changingnature of their business.”Headquartered in Israel, AleaderEurope is the European distribu-tor for AOI systems and, in theglobal territories that have estab-lished distribution networks, salesof Aleader AOI systems are flour-

ishing. Aleader already hasinstalled more than 30 systems inthe Israeli market.

BLAKELL EUROPLACER www.europlacer.com

Blakell Europlacer Expands DistributionRange to Include Leading AOI Provider

With its ASM iHawk XpressOpto, ASM Pacific Technology,the global leader in backendsolutions, presents a completelynew wire bonder. Thanks to itsimproved transport, the ASMiHawk Xpress can handle leadframes that are up to 100 mmwide. Its bonding accuracy wasimproved to 3 μm, and ASM'sGoCU technology enables it tooperate faster with lower-costcopper wire than with gold wire.These features make the ASMiHawk Xpress particularly inter-esting for European componentmanufacturers looking for amore flexible and precise wirebonding solution for their devel-opment activities as well as fortheir prototype and small-lotproduction. In addition, the newand unique Auto Wire RethreadSystem of the ASM iHawk Xpressensures that the bonding wire isclamped in place and automati-cally rethreaded after a break.This minimizes the downtimeand improves the productivity ofthe application. With its iHawk

Xpress, ASMPT celebrated twopremieres at once at the SMTHybrid Packaging 2012: After itsintegration into the ASMAssembly Systems organization,the European ASMPT organiza-tion presented its packagingsolutions for the first time at theSIPLACE booth next to theSIPLACE placement solutions.

ASM ASSEMBLY SYSTEMSwww.siplace.com

ASM iHawk Xpress Opto Wire Bonder: Faster, wider, and more precise

BPM Microsystems demonstrat-ed its new in-system device pro-gramming solution at the lastSMT Hybrid PackagingExhibition, May 8 - 10, 2012at the Exhibition CentreNuremberg in Germany.The new 2800ISP ParallelIn-System DeviceProgrammer offers theunmatched performanceand flexibility of 8thGeneration site technology. With a custom-designed test fixture, operators can easily pro-gram flash, microcontrollers andother device technologies on-board after reflow.The semi-automated design ofthe 2800ISP uses a pneumaticfixture with built-in safety features to actuate the pressure

plate. Once actuated, the circuitboard makes contact with highquality pogo pins that arespecifically engineered to

achieve exceptional signalintegrity. Ideal for medium andhigh-volume production, the2800ISP is configurable and canprogram up to 16 devices inparallel.

BPM MICROSYSTEMSwww.bpmmicro.com

BPM Microsystems demonstrated a newsolution for In-System DeviceProgramming at the 2012 SMT HybridPackaging Exhibition

Whether you are dealing withairplanes, trucks or SMT place-ment machines – good mainte-nance preserves value anddirectly affects your quality, pro-ductivity and the bottom line.To explain how maintenanceprocesses for SMT lines can beoptimized, managed and easilyintegrated into the productionflow, the SIPLACE teamrecently published aninformative brochure forelectronics manufactur-ers. "SIPLACE-Insights:Maintenance" explainshow the maintenanceintervals for placementmachines and their sub-systems can be organ-ized with great flexibilityand based on therespective factory'scapacity utilization. Italso explains the avail-able concepts, tools andservices and covers lesswell-known topics suchas certifications and howthey can be used toimprove customer loyal-ty. And for those who believethat maintenance is nothing but

a necessary evil, a case studyquantifies the impact of opti-mized maintenance on line pro-ductivity and quality, i.e. theconcrete "return on mainte-nance". Interested electronicsproducers can order "SMT-Insights: Maintenance" and otherbrochures from the SIPLACESMT-Insights series at no charge.


SIPLACE SMT-Insights Whitepaper:Maintenance

INDUSTRY NEWS

SMT

32 EP&Dee ⏐ May, 2012 ⏐ www.epd-ee.eu

Practical Components Inc. hasintroduced a display case contain-ing a sampling of components.The display case includes compo-nents ranging from the latest inhigh technology (01005s, PoPs,CVBGAs and flip chips) to stan-dard SMT packages (PBGAs,MLFs, QFPs and TSOPs). The dis-play case is equivalent to a CDcase for portability. The case iseducational, providing a quick,portable show-and-tell represen-tation for students, coworkers,customers and vendors. This dis-play case contains the follow-ing sample components:• PoP Top Package on Package • PSvfBGA Bottom Packageon Package • CVBGA Very ThinChipArray®• PBGA Plastic Ball GridArray• QFP Quad Flat Pack• LQFP Low-Profile Quad Flat Pack

• MLF® MicroLeadFrame• QFPQFN Open-Molded QuadFlat Pack No Leads• TSOP Type I• Flip Chip• 01005 Chip Resistor• 0201 Chip Resistor• 0402 Chip Resistor• 0603 Chip Resistor• 0805 Chip Resistor• 1206 Chip Resistor• SOT23 Transistor• SOD80 Diode• TO18 Through-Hole Transistor• 1/4 Watt Axial Leaded Resistor

PRACTICAL COMPONENTS www.practicalcomponents.com

Practical Components DummyComponents Display Case BringsTraining and Presentations to Life

Cognex Corporation, the world’sleading supplier of machinevision systems, today announcedthe release of the CognexExplorer™ control center. Thisunique utility displays a graphicalview of all Cognex vision systems,ID readers and visualization sys-tems connected to the network. Italso incorporates pow-erful maintenance toolsfor backing up, restor-ing or cloning systems,carrying out firmwareupgrades, and muchmore. Cognex Explorerwas designed for con-trol, production andmaintenance engineerswho will find the intu-itive point-and-clickinterface easy to usewithout any trainingrequired. The new control centeroffers the ability to:• Display the identity, type andstatus of all Ethernet-connectedIn-Sight® vision systems, DataMan®ID readers and VisionView® dis-play devices on the network• View device settings including

IP addresses, firmware/softwareversions, etc.• Execute firmware updates• Backup and restore multiple sys-tems simultaneously • Clone systems when addingmore systems to the network• Add licenses for VisionViewThe Cognex Explorer control cen-

ter is available now and is free ofcharge to all Cognex customers.To download the utility or formore information, please visitwww.cognex.com/explorer

COGNEXwww.cognex.com

New Control Center for all Cognex VisionSystems and Industrial ID Products

Since 1997, UVAX Concepts fromValencia/Spain, acts as a globally successfulmanufacturer of electronic products. UVAXConcepts´ know-how in design of state ofthe art electronic circuits, devices and sys-tems, as well as its excellent expertise as anEMS provider, is well known within theinternational electronic industry. For UVAX,as well as for its customers, maximum flexi-bility is one of the most important topics.Therefore, UVAX Concepts has decided toinvest in a SIPLACE SX platform, whichoffers an impressive amount of flexibility,from the machine’s Capacity-on-Demandlayout to the revolutionary SIPLACEMultiStar placement head. The MultiStarboasts a component range from 01005 to50mm×40mm, besides extreme versatility,and most important for UVAX products,making sure today’s highest quality stan-dards are met as well.For more than twenty years, UVAXConcepts has been manufacturing anddeployed highest quality electronic prod-ucts successfully all over the world. Thecompany’s services include engineeringsupport and design of integrated circuits,electronic systems, and control equipment,

helping customers at the prototype stage,as well as manufacturing small and largeproduction runs. UVAX customers are allover the globe, from the USA to Malaysia,Indonesia, Germany, France, Switzerland,Australia, … .

With the purchase of the SIPLACE SX,UVAX expects further acceleration of itsimplementation of the company’s newSmart Cities product line, which is gettingmomentum and more demand by the day.


Maximum flexibility for diverse productionsUVAX Concepts chooses SIPLACE SX

The Balver Zinn/Cobar Group introducesTempotac (120-TEM), its newest next-generationtacky flux. Tempotac (385-TEM) is a well-estab-lished product within Cobar’s product portfolioand features the basic ingredients of a solderpaste flux including various activators. With theintroduction of lead-free solders that includehigher process temperatures, a new product hasbeen introduced — 120-TEM. This product canwithstand higher temperatures and is available ina blue color for inspection purposes whenrequired. Tempotac is a remarkably versatilematerial that can be used in an array of reworkapplications including:• Reballing — where availability of BGAs withlead-free spheres is limited, replacelead-free spheres with SnPbspheres before mounting (e.g. mili-tary, aerospace, medical, etc.) • Repair Applications — removeand replace BGAs • BGA Placement — Tempotac canbe used instead of solder paste• Bridging — Removes bridges inQFP rework.

BALVER ZINN/COBAR GROUPwww.balverzinn.com

Cobar launches newest TackyFlux for Lead-Free Solders

INDUSTRY NEWS

SMT


When I first began working with fluid dynamics, I was advised the field was as much an art as a science. Working to improve the efficiency of industrial pollution controlequipment through better flow distribution, we studied field test data, developedsolutions, built scaled models to test them, and then often held our breath when itcame time to see if they scaled up properly. Fluid dynamic calculations often take onassumptions of idealized conditions, when the actual case may be far from it. Even after running highly complex computer modelling, engineers frequently findthemselves making final design adjustments to designs in their laboratory.

The behaviour of gas flow and achieving a sta-ble, accurate mass flow measurement is affect-ed by many factors. The composition of thegas will affect properties such as density andthermal conductivity. Environmental conditions like temperature,humidity and altitude play a part, as does themedium through which the flow is moving. The surface roughness of the tube/Mass flow sensors are often preferred to volu-metric sensors, as volume is dependent onpressure and temperature, while the mass canbe thought of as “how much” (not to imply thatmass flow sensors are completely immune tothese changes, particularly temperature). Going back to basic thermodynamics is theIdeal Gas Law (PV=nRT) - a prime example ofa formula assuming idealized conditions; atleast this one advertises itself as such. A quick refresher…

Pressure × Volume = Amount of Gas (moles) ×Universal Gas Constant × Absolute Temperature

Moles = Mass / Molar Mass. Molar mass is a gas-specific constant.

Rearranging and combining constants, Volume= Mass × Temperature/Pressure × Constant

Why are “mass flow” sensors then rated in LPM(Liters per Minute)? If you examine thedatasheets closely, you should find that theLPM readings are at a stated set of “standard”or “normalized” pressure and temperatureconditions. These standards will vary depend-ing on which organization was referenced(NIST, IUPAC…). 1 atm and 0°C are common-ly used. pipe/duct influences the resistancebetween the gas and the walls.

Selecting a mass flow sensor that is suitable tothe application can be a challenge, and mis-takes can be costly. In the paragraphs that fol-low, I will illustrate a number of factors ofwhich to be mindful. Some will be relevant toa variety of sensor types; others will focus onthermal based mass flow sensors.

Gas CompositionWhen selecting a flow sensor, the first thing wethink about is the appropriate flow range.Make sure to check which gas type the sensoris calibrated for, as gas composition will changethe output of many sensors. Air is the mostcommon, but not always the case. When usinga different gas, always contact the sensor man-ufacturer. Text book conversions don’t neces-sarily apply across the board for different sen-sor types. Gas density is certainly a factor, butfor temperature based mass flow sensors, ther-mal conductivity is also quite important.Omron, for instance, will provide alternateoutput curves for some gases (air vs. naturalgas vs. argon), but recommends a custom fac-tory calibration to achieve optimal results forother gases (ex: carbon dioxide and nitrogenoxides). If the gas composition will be chang-ing significantly, look for a sensor that isdesigned specifically for that condition, asmost cannot distinguish the differencebetween a change in density versus theamount of flow.

Turbulence and Pulsation in the Gas StreamTurbulence and/or pulsation in the gas streamcan result in unstable and inaccurate flowmeasurement. These issues can be addressedin the design of the flow path around the sen-

sor, however, some sensors are designed to bemore tolerant of these conditions. Several of Omron’s in line sensors aredesigned with a series of inlet screens (seeFigure 1) which act to smooth out turbulentflow and provide a very even flow across thediameter of the sensor. This results in a repre-sentative velocity moving over the MEMS chip.When using a sensor without a laminar flowstructure, incorporating sections of straightpipe upstream and downstream of the sensoris often recommended. The required length ofthis section can be calculated by using theReynolds number, however, some suggestapprox 10 diameters upstream and 5 diame-ters downstream.

Additionally, when screens are not used, somemanufacturers recommend a filter upstream ofthe sensor to protect the sensing element inparticulate laden environments. Pulsating flows, such as those from diaphragmpumps, can be addressed by a few methods.Outside of the sensor, a buffer tank upstream

DESIGN

SENSORS

Keys to successful gas flow measurement

by Donna Sandfox, Product Manager, Omron Electronic Components LLC

Figure 1

of the measurement device or anorifice down stream are twooptions. Within the sensor design,an orifice installed within the sensor(ex. Omron’s 70 200 LPM D6F01/02A2 model) may be sufficient.Flow sensors which incorporate aninternal bypass design have alsoshown to be less prone to pulsationissues. An internal bypass is where asmall amount of flow is pulled fromthe main flow path over the sensingelement, rather than the sensing ele-ment being located in the main flowpath of the sensor (watch forOmron’s D6F AB type to be

released soon). A similar solution isto use a smaller sensor in a bypass(see Figure 2). More details on thistype of set up are discussed below. The pulsation phenomenon is diffi-cult to model. Sometimes trial anderror is the only way to determinethe best approach for a particularsystem. In exceptionally difficult sit-uations, a combination of the abovemethods are sometimes required.

Sensor Characteristics It is also important to make sure thecharacteristics of the sensor arecompatible with the application.The response time of the sensor iscritical in a number of devices, andthis characteristic can vary signifi-cantly. Some manufacturers willmodify their timing constant uponrequest. Please note that a fasterresponse time may result in morenoise in the output signal. Some applications have a limit tothe pressure drop they can tolerate(ex. breathing circuits in medicaldevices). A sensor with minimalinternal restrictions, or using a smallsensor in a bypass configuration(see Figure 2) are two options.

Bypass Set upThe bypass set up involves moredesign work, however, a smaller andoften less expensive sensor can thenbe used. (Omron’s factory engi-neers offer design assistance utiliz-ing Computational Fluid Dynamicsmodeling software for customersinterested in this option.) Flow sensors in a “bypass configura-tion” are similar to using a differen-tial pressure sensor (an indirect flowmeasurement method); however,there are some technological differ-ences that should not be over-looked. In both instances, the sen-

sor is connect-ed to two ports,which are in -stalled on eitherside of an ori-fice creating apressure drop. In differentialpressure sens-ing, the diffe -rence in up-stream andd o w n s t re a mpressures ismeasured oneither side of adiaphragm. It’sa static system— the air does

not pass through the diaphragm. A mass flow sensor is a dynamic sys-tem, as the airflow continually pass-es through the sensor. The majorimplication of this difference is thatthe pressure drop of the “bypasssystem” will influence the output ofsome sensors, meaning that thetube lengths of the bypass need tobe controlled in the manufacturingprocess. In many applications this isnot an issue; however, it can be inthose such as HVAC control wheretubes are installed in the field. This problem can be avoided bythe use of High Impedance FlowSensors which have a very narrow,high velocity flow path.

While I’m sure I haven’t addressed allthe potential issues to consider whenselecting a flow sensor, I hope I’vehelped in the avoidance of somecommon pitfalls. If fluid dynamics isnot your area of expertise, don’t beafraid to ask for some assistance atwww.element14.com.n

DESIGN

SENSORS

www.element14.com

Plessey Semiconductors hasdesigned a heart rate monitordemonstration using its award-winning EPIC™ sensor technolo-gy, which is the same size as awristwatch and does notrequire a chest strap or secondsensor at the end of a cable thatcould be easily lost or dam-aged. This reference designshows that simple and effectivepersonal monitoring ofelectrocardiograph (ECG)signals can be as easy astaking a pulse measure-ment. The device strapsto the wrist with a sensorelectrode on the rear ofthe device in permanentcontact with the wrist andthe second electrode ison the front of the device.Touching this top electrodewith a finger from the oppositehand enables the device to col-lect the heart signals.Plessey has also designed a ver-sion to provide continuousheart monitoring. This devicestraps to the upper arm and has

two contacts on the inside ofthe strap. These are positionedsuch that the electrical cardiacsignals are out of phase to givea strong differential signal tonoise ratio so that unwantednoise artefacts from other mus-cles can be easily filtered out togive a detailed ECG trace. Sucha device would enable patientsto be monitored as they go

about their daily routine anddetect transient issues thatwould probably be missed dur-ing a short period of monitor-ing with the conventional sevenelectrodes and gel approach.

Plessey Semiconductors www.plesseysemiconductors.com

Plessey uses its EPIC sensor technologyto create a heart monitor in a wristwatch

Integrated Device Technology,Inc. (IDT®) announced a newfamily of precision temperaturesensors targeted at ultra-low-power solid state drive applica-tions. This new family of devicesminimizes power consumptionand optimizes bill-of-materials(BOM) costs while maintainingcompatibility with existing stan-dards for high-volume memorymodules. The IDTTS3000GB0A0 is a low-power,high-accuracy temperature sen-sor for enterprise server andstorage applications. It supportsa 1.8V power supply forreduced power consumptionand compatibility with the exist-ing supply voltage for SSDmemory modules, eliminatingthe need for additional voltageregulators. The device contin-ues the IDT tradition of indus-try-leading temperature accura-cy by exceeding the require-ments set forth by the Joint

Electron Device EngineeringCouncil ( JEDEC) JC42.4 specifi-cation for Grade B temperaturesensors over the temperaturerange of -20°C to +125°C.

An innovative analog-to-digitalconverter (ADC) enables pro-grammable resolution up to 12bits (0.0625°C) with industry-leading conversion time of lessthan 100 nanoseconds irrespec-tive of the resolution, dramati-cally improving the overall pre-cision of thermal control loopsacross temperature.

IDTwww.idt.com/go/TempSensor

IDT Introduces Low-power, High-accuracyTemperature Sensor for Solid State DiskDrives

INDUSTRY NEWS

SENSORS

Figure 2



Contact: Eng. Alina CibuEmail: alina.cibu@odurom.ro

www.odurom.ro

ODU ROM Manufacturing Str. Fundătura Lânii nr. 22, 550019 Sibiu, Romania

Tel: +40 (0) 269 206345; Fax: +40 (0) 269 221006

For general information visit: www.odu.de

ODU Single contactsINDUSTRY NEWS

CONNECTORS

The ODU ODU SpringtacTM contact is the ingenious invention of ODU’s founder Otto Dunkel:

• More than 100,000 mating cycles;• High current capability to 2,000A;• Low contact resistances;• Large number of independently cushioning

contact springs, for example, 40 at Ø 5mm;• Low insertion and withdrawal forces;• Extremely secure contacting;• High vibration resistance;• Long service life due to high-grade materials

and surfaces;• Many designs and connection types are

available or feasible.

• More than 10,000 mating cycles;• High current capability; • Low contact resistances;• Low insertion and withdrawal forces; • Secure contacting;• High vibration resistance;• Long service life due to high-grade materials and surfaces;• Many styles and connection technologies available or practicable;• Economical alternative.

• 5,000 mating cycles;• Smallest dimensions are posible; • High-grade materials and surfaces;• Many designs are feasible.

ApplicationAll contacts shown can be either used as stand-alone contacts or in connectors and intercconnect systems. The single contacts shown are used mainly for: Power Supplies, Power Distribution, Testing, Docking Systems, Industrial(heavy Duty) Connections, Grounding and Medical Connectors.

For further details please visit the company website - online catalog.http://www.odu.de/fileadmin/template/pdf/einzel/Einzelkontakte-engl.pdf

Together we can find the perfect solution!

ODU SpringtacTM contact

ODU Lamella contact

ODU slotted socket


Electrical engineering, power engineering,industrial automatics are the areas where thenecessity of connecting high-current powerleads is often required. The system of mount-ing equipment on a DIN bus, commonly usedin automatics, greatly facilitates installers’work, it has been tested against durabilityand comfort of work. At the same time, itensures very good after-market service of theused equipment. Damaged equipment canbe quickly replaced with a working one, andsuch replacement does not cause a longdown time, e.g. of a manufacturing line. As electricians say: “each equipment worksmore efficiently when it is connected to themains”. However, the problem is how to provide proper quality of such connection.The difficulty of this task increases propor-tionally with the increase of distributed currents intensity. One of the most reliablemethods of fast installation of connection elements includes usage of screw terminals.Different variations of such terminals are commonly used starting from electronics toindustrial automatics.

Morek universal terminalsMorek’s offer begins with a single way, univer-sal DIN bus-mounted terminals adapted foraluminum and copper conducts. They areavailable in several colour versions (grey, blueand yellow-green) with two or four terminals.Those elements have been divided into several groups depending on the number ofterminals and conduit intersections, which canbe attached to them. The conduit, in a clearway, influences the acceptable intensity of thecurrent that can flow through the terminal.Nevertheless, an essential parameter is themaximum operating voltage equal to 690V,the same for all groups of described sub-assemblies.

There is also a group of splice terminals witha double terminal. This group includes thefollowing: T021016, T021050, T021095,T021150 and T021240. The last three digitsinclude the information on the intersection ofthe conduit that can be attached to a termi-nal. This parameter together with permissiblecurrents are presented in the Table 1.

Depending on the conduit intersections, dif-ferent torque can be used. For example, incase of conduit intersection of 1,5 mm2, it isequal to 1,5Nm and respectively: 3,5Nm forconduits of 2,5...6 mm2 and 7Nm for conduits10...16 mm2.In TME range of products, there are alsoMorek 4-terminal splice terminals. Theirparameters are presented in the Table 2.

High current-carrying capacity deserves aspecial attention. In this case, depending on the conduit thick-ness, the use of diversified torque is recom-

mended. For example, in case of T022240splice terminals with the conduit intersectionof 150 ... 240mm2, it can be equal to as muchas 55Nm. All above described splice terminals do notrequire the mounting of side walls. They are mounted on the DIN bus by meansof specially designed snap locks, and if this is

necessary to use another method of mount-ing, two screws can be used instead. Fixingconduits to screw terminals depends on theterminal type and conduit intersection.Examples of the values are presented above. All offered splice terminals correspond to thepower engineering requirements. They havethe CE, UL1059 and SGS certificates, andcomply with the SFS 2663 norm.

Transfer Multisort Elektronik Sp. z [email protected]

Morek splice terminals inTME range of products

Terminal type Permissible area of the conduit intersection Current-carrying capacity[ mm2 ] [ A ]

T021016 1,5...16 82T021050 1,5...50 160T021095 6...95 245T021150 25...150 320T021240 35...240 425

Terminal type Permissible area of the conduit intersection Current-carrying capacity[ mm2 ] [ A ]

T022050 1,5...50 320T022095 6...95 490T022150 250...150 640T022240 35...240 850

Table 1. Conduit intersections and permissible current-carrying capacity of 2-terminal splice terminals.

Table 2. Conduit intersections and permissible current-carrying capacity of 4-terminal splice terminals.

Trade reliability, soundness of every action, speed and flexibility are the motto of Morek company. Morek operates inthe territory of Lithuania, Latvia and Estonia. It manufacturesautomatic and electrical engineering subassemblies. The products offered by Morek Group are also available inPoland – in TME range of products. The assortment includes,among others: terminals and splice terminals.

INDUSTRY NEWS

CONNECTORS


INDUSTRY NEWS

MISCELLANEOUS

O’BOYLE s.r.l.Tel.: +40 (0) 256-201346Fax: +40 (0) 256-221036

[email protected]

Electronical Ignition Sytems high frequency and high voltage > 20 000V• Circuit board assembly• Compact design• For unipolar or bipolar ignition• For one or two ignition points• Stringent individual quality-testing• Self-extinguishing potting and housing material

Ignition transformers from HAHN guarantee safe and stable ignitionof your gas-powered heating systems. Compact in design, they are ideal for use with printed circuitboards. Within our comprehensive Quality Management Systemwhich includes several interim checks, each component is subjectedto a final 100 % test. In this test, not only the characteristic data are checked but a high-voltage insulation test is carried out. The specially selected components are all subjected to a glow wire test according to DIN EN 60 335-1:2005.

Ignition transformers for safe and stable ignition of gas heating systems

WATER-PROOF HANDHELD DEVICE FOR PRESSURE MEASUREMENTSWITH EXTERNAL CHANGEABLE PROBES

Fair prices and high-qulity products havemade Greisinger GmbH a company to bereckoned with on the measuring devicessector, the company’s developingprocess has been steadily going upwardsfor the last 30 years. Globally operatingand well-known companies are nowamongst their regular customers. All Greisinger products are developedand produced in Germany as the onlyway to ensure the high-quality standardsof the products. The quality management system is certi-fied according to ISO 9001:2008 andadditionally for potentially explosiveatmospheres according to EN 13980:2002. Development, production andmarketing are certified according toDirective 94/9/CE since May 2003.Several products are already examinedand certified according to the Directive94/9/CE.

Features• Water-proof (device and plug-in connections);• Serial interface;• Data logger and alarm function;• Peak value detection (1000 measurements/s);• Leakage test;• Robust silicone protection cover;• Large double display;• Background ilumination.Application• industry and craft.• HVAC: heating, ventilation, air conditioning.• leakage test / pressure test.• chimney draft measurement: under pressure.• leakage test at buildings (i.e. 4 Pascal test).• measurements of gas and oil firings.• automobile trade.Available versions:GMH 5130: with connection for 1 sensor, without sensor.GMH 5150: with connection for 1 sensor, analog output

and data logger, without sensor.GMH 5155: with connections for 2 sensors, analog output

and data logger, without sensors.Accesories:GMSD...K51: pressure sensor for non-aggressive gases forover/under pressure, differetial and absolute pressure.MSD: stainless steel pressure sensor for air & aggressive gasesfor over/under pressure, differetial and absolute pressure.EBS 20M: software for long-term monitoring. GSOFT 3050: software for operation of logger devices.


O’BOYLE s.r.l.Tel.: +40 (0) 256-201346Fax: +40 (0) [email protected]

O’BOYLE s.r.l.Tel.: +40 (0) 256-201346Fax: +40 (0) [email protected]

WestecWestec represents the Italian challengein the market of Multipole Connectorsfor Industrial applications.

Westec products are certified from latest European and American labora-tories (EN 61984, VDE 0627, UL 1977,CSA: C22.2 No. 182.3, NEMA 250 1991UL50 Type 4,4x,12, DESINA,EUROMAP). We offer a wide range ofstandard products with a flexibledesign approach that allows us to manufacture special OEM solution oncustomers design.

These are a few of the advantages youget with our connectors:

•Westec is the only manufacturarer of connectors with 16 A for command and80 A for force on the same connector;

•Westec gaskets have the right shape and stronger NBR rubber with a better aging factor than competitors;

•Higher percentage of silver in the alloy of the connectors than other manufacturers.

O’BOYLE s.r.l.Tel.: +40 (0) 256-201346Fax: +40 (0) 256-221036

[email protected]

Eco Design – HAHN SolutionsTransformers fulfilling the new guidelines of “Energy using products” (EuP).The EuP Serie 2013 of HAHN is perfect for applications of the electric powersupply in electrical and electronic household and office equipment with “stand-by” and “off” conditions. Already today where a reduced power consumptionof P0 < 0,4 is required, the EuP Serie 2013 of HAHN will be a solution.


EUROSTANDARD PRESS 2000

Tel.: +40 31 805 9955

Fax: +40 31 805 9887

[email protected]

www.esp2000.ro

VAT Registration: RO3998003

Company number: J03/1371/1993

EP&Dee (Electronics Products & Design Eastern Europe) is published 8 times per year in

2012 by Euro Standard Press 2000 s.r.l.

It is a free to qualified electronics engineers and managers involved in engineering

decisions. Starting on 2010, this magazine is published only in digital format.

Copyright 2012 by Euro Standard Press 2000 s.r.l. All rights reserved.

© 2012 by Eurostandard Press 2000

EP&DeeSubscriptions:

office@epdee.eu

EP&DeeWeb page:

www.epdee.eu

Group Publisher DirectorGabriel Neagu

Managing DirectorIonela Ganea

AccountingIoana Paraschiv

AdvertisementIrina Ganea

WEBEugen Vărzaru

Contributing editorsRobert Berger Ross Bannatyne

ConsultingMarian BlejanBogdan GrămescuMihai Savu

Asian Reprezentative Taiwan Charles YangTel: +88643223633

[email protected]

W. L. Gore & Associates (Gore) has stepped upits efforts to help OEM customers maintainsound quality and protect sensitive electronicsin cell phones, laptop/tablet PCs, two-wayradios and other handheld and portable elec-tronic devices by creating a new business unit.GORE® Portable Electronic Vents will concen-trate on providing solutions to protect devicesfrom water, dust and dirt ingress while maintain-ing the integrity of sound transmission. GORE® Venting solutions for portable elec-tronics prevent contaminants from entering,while preserving sound transmission qualitythrough the use of high transmission materials

employing Gore’s uniqueePTFE (expanded polyte-traflouroethylene) tech-nology. These are availablein a variety of productforms for protection fromdust and splash as well as full immersion. Pre-cut adhesive vents and unique custom ventdesigns are also available. Benefits include:• minimal sound transmission loss due toacoustically transparent materials;• excellent dust and liquid barriers for indoorsand outdoor protection; • quick venting recovery after liquid immersion;

• robust adhesives to withstand challenging envi-ronments and adhere to different product surfaces;• low profiles for devices with limited space;• dust, splash and immersion protection thatmeets a range of IP standards up to IP68.

W. L. GORE & ASSOCIATESwww.gore.com

INDUSTRY NEWS

MISCELLANEOUS

ALPS ELECTRIC EUROPE GmbHoffers with the RD6R1A a high-precision, long-life resistiverotary sensor for position detec-tion in automotive applications.Available with three solder ter-minals, the compo-nent has dimensionsof 41.5mm × 16.0mm× 3.5mm (L × W × H).It features a hollowshaft structure of3.53mm in diameterand covers a rotation-al angle of 320degree. The totalresistance dependson individual specifi-cations. Its operating life is speci-fied of up to 200,000 cycles.The position sensor is rated fora power of 0.1W. Other techni-cal specifications of the RD6R1A

include a total resistive toleranceof ±20%, an absolute linearity of±2.2% (320°) and a rotationaltorque of 0.1Nm. Its operatingtemperature ranges from –40°Cto +85°C. The position sensor is

available in minimum packingunits of 1,800 pieces.

ALPS ELECTRIC www.alps.com

ALPS Offers Resistive 320° Rotary Sensorfor Position Detection in AutomotiveApplicationsOMC can now deliver a full range

of polymer fibre optic compo-nents and assemblies to ensurecost-effective, secure and interfer-ence-free data transmission.Ideally applicable in factories,machinery and other industrialapplications over distances rang-ing from a metre to 50 metres,polymer fibre has not found thewide acceptance it might havedone due to limited availability ofhigh quality, versatile connectorsand a general lack of expertise inassembling the connectors ontopolymer fibre. OMC addressesboth these challenges with itsown extensive component range,a thorough understanding ofpolymer fibre and a long-estab-lished excellence in producingcomplete data link assemblies.The emphasis with polymer fibrehas all too often been to lowerthe cost of a system rather thanexploit the technology’s majorbenefits of versatility, ruggednessand reliability. To address this,OMC’s connector range includes,in addition to well-designed, low-cost plastic moulded devices, a

wide range of industry standardconnector types such as SMA andST, produced in rugged all-metalhousings capable of providingreliable and consistent perform-ance in industrial and even harshor hazardous environments.

OMC’s optical transmitter andreceiver modules are activelyalignedto achieve optimal per-formance for any particular sys-tem, and the company can manu-facture their entire transmitterand receiver range to customer-specific requirements, attaininglaunch powers and sensitivitieswithin tightly-specified windows.

OMCwww.omc-uk.com

OMC offers complete package of polymerfibre cables, components and assemblies

New Gore Business Unit offers environmental protection for Portable Electronic Devices

EP&Dee no 4 - May 2012

Documents

Transcript of EP&Dee no 4 - May 2012