EP&Dee no 1

EP&DeeDESIGN & MANUFACTURING JANUARY, 2014 ISSUE NO. 1, VOL. 12

E L E C T R O N I C S P R O D U C T S & D E S I G N E A S T E R N E U R O P E

THE EAST EUROPEAN RESOURCEFOR EMBEDDED APPLICATIONS

EP&Dee | January, 2014 | www.epd-ee.eu2

Table of Contents

JANUARY 2014

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EP&Dee is offering you the chance to win a MicrochipAccessory Development Starter Kit for Android™, enablingaccessory development for Google’s Android platform.The Microchip PIC24F Accessory Development Start Kit forAndroid™ is a standalone board used for evaluating anddeveloping electronic accessories for Google’s Androidoperating system for smartphones and tablets.Specifically, Android versions 2.3.4 and 3.1 and laterinclude a new framework that allows apps to communicatedirectly with an accessory connected to a smartphone ortablet, via USB. The kits consist of a development boardand a software library, available via free download fromhttp://www.microchip.com/get/522D, which enable thefast and easy development of Android smartphone andtablet accessories based on Microchip’s large portfolio of16-bit and 32-bit PIC® microcontrollers.

This starter kit bundles five major components including16-bit PIC24F Development Board, PICkit 3 In-CircuitDebugger (PG164130), RJ-11 to ICSP Adapter(AC164110), 9V Power Supply (AC002014) and RoyaltyFree, No Fee Licensed Software Library.

Win a MicrochipAccessory

Development StarterKit for Android

For your chance to win a Microchip AccessoryDevelopment Starter Kit for Android, visit :

http://www.microchip-comps.com/epdee-android14and enter your details in the entry form.

DESIGN FEATURES

8 Aurocon COMPEC prezents RS Toolbox

10 Review of 2013 and a glimpse of 2014The electronics distribution industry has always been one of high competition, executed with an unrelenting pace. That’s not changed, and neither has the traditional bias towards business models designed around the three key areas of availability, speed and price. But faced with increasing pressures, we’re seeing engineers demanding more, and our industry has to respond.

12 How the Internet of Things Is Revolutionizing HealthcareIn the Internet of Things (IoT), devices gather and share information directly with each other and the cloud, making it possible to collect, record and analyze new data streams faster and more accurately.That suggests all sorts of interesting possibilities across a range of industries: cars that sense wear and tear and self-schedule maintenance or trains that dynamically calculate and report projected arrival times to waiting passengers.

18 Power Interface Module Saves Valuable Board Space and Reduces Time-to-MarketA comparison of alternative on-board power solutions is rarely at the top of the agenda for a board designer. Often designers will use a previous solution because all available resources and time must be spent on the functionality of the system design

22 New Trends in Medical Portable Systems and TelehealthWith an aging population, the rise of chronic diseases and the need to develop a healthcare infrastructurein emerging countries, there is a strong need to transform the care that we receive today.

26 An Analog Front-End for Blood Pressure MonitorsBlood pressure monitors are no longer medical tools found only in hospitals and doctor’s offices. Automatic blood pressure monitoring is increasingly used at home. Home units are used not only by people who suffer from hypertension and need to track their blood pressure but also by people who want to monitor their health and get readings that are not affected by the anxiety or stress of a doctor or hospital visit.

28 The C8051 Core: A Compute Engine with an Embedded Mixed-Signal TwistA multitude of architectural variations exist today including the Silicon Labs MCU version, which has evolved into a pipelined complex instruction set computing (CISC) device with Fetch/Decode/Execute pipe stages. This core is known as the CIP-51 as developed by Silicon Labs and sits at the heart of all its 8-bit mixed-signal MCUs.

32 Phase Noise Performance in Crystal Oscillators

38 Contrinex - Full-metal sensors, now also in the BASIC range

PRODUCT NEWS

Embedded Systems(p 4 - 7)(p 15, 25, 31, 35)

Active Components(p 40)

Passive Components(p 41 - 43)

357

254


Microchip’s low-power sensorhub makes sensor fusion easy

Partnered with leading sensor manufacturers for

maximum flexibility

Microchip announces the SSC7102, a low-power, flexible and turnkey sensor hub thatmakes implementing sensor fusion easy andprovides an extremely large selection of sup-ported sensors. Microchip has partnereddirectly with multiple industry-leading sensormanufacturers and sensor-fusion specialists tocreate this solution, enabling faster time tomarket without the need for sensor-fusionexpertise. The SSC7102 is also extremely effi-cient. It consumes ~4 mA while running com-plex sensor-fusion algorithms, resulting inlonger battery life for Windows® 8.1 tablets,laptops, ultrabooks and smart phones.

Sensors can now be added to virtually any-thing, due to their small cost and size. IHSiSuppli predicts that more than 6 billionmotion sensors are expected to ship in mobilehandsets and tablets by 2016. As sensors con-tinue to surround us, system requirements aremoving from simple monitoring to providingcomplex information about our environmentand activities. Data from multiple sensors,which sense motion via accelerometers, mag-netometers and gyroscopes, as well as environ-mental factors such as light, temperature,humidity and pressure, needs to be incorpo-rated or “fused” in the system. Microchip’s low-power SSC7102 sensor hubruns these complex sensor-fusion algorithms,while providing maximum flexibility in an easy-to-implement solution.In developing the SSC7102 Microchip part-nered with industry-leading companies, such asBosch and Movea, to deliver an easy-to-use,Windows 8.1-certified HID-over-I2C™ solutionwith exceptionally low power consumption.Microchip’s SSC7102 sensor hub is available ina 6mm x 6mm body, BGA package. Samplesare available now and volume production isexpected by the end of this quarter.

MICROCHIP TECHNOLOGY www.microchip.com/get/9821

SpatialBuzz, an innovative cloud-based cus-tomer experience analytics and service mon-itoring platform for network operators, hasannounced that a second UK Mobile VirtualNetwork Operator (MVNO) has launched itsonline coverage checker, a compo-nent of SpatialBuzz’s cloud-basedcustomer experience management(CEM) software solution. This is thethird UK deployment for SpatialBuzz– the solution is already being usedsuccessfully by both Telefónica O2and Tesco Mobile.SpatialBuzz software provides cus-tomers with real-time access todetailed coverage maps for both 2Gand 3G as well as for 4G, meaning thatthey will be able to check whether 4Gcoverage is adequate in their areabefore making a decision to purchaseor upgrade to the new 4G service.SpatialBuzz harnesses the power ofcustomer experience analytics to

enable operators to better understandservice issues, by analysing in real timewhere customers and agents are perform-ing network status checks.SPATIALBUZZ www.spatialbuzz.com

Silicon Labs announced that Magellan, aleader of innovative GPS devices for vehi-cles, fitness, outdoor and mobile navigation,has chosen Silicon Labs’ EFM32™ GiantGecko microcontroller (MCU) as the ener-gy-friendly processing platform for theMagellan Echo smart sports watch. Namedas a CES Innovations 2014 Design andEngineering Award Honoree, the Echo isthe first “open” smart sportswatch platform that enablesapplication developers toaugment their apps to beviewed on and controlledfrom the wrist.In the emerging market ofwearables and appcessories,the award-winning MagellanEcho stands out for its inno-vative design. Its display andwatch face can be cus-tomized to reflect varioussports and fitness activitiesfrom running, biking, hiking to golfing whileoffering additional features such as the abili-ty to remotely control music and sports appsfrom a smartphone. Unlike other smart-watches, the Echo leverages the smart-phone’s integrated GPS and communicatesdirectly with Bluetooth Smart-enablediPhone and Android smartphones. Thisstreamlined design results in a lightweight

sports watch with exceptionally long batterylife that is far superior to competing devices.The 32-bit Giant Gecko MCU, based on theARM® Cortex®-M3 core, also plays a key rolein the sport watch’s energy efficiency,enabling the Echo to operate for up to 11months on a single CR2032 coin-cell battery.The Magellan Echo design team achievedtheir ultra-low energy goals by optimizing

the Giant Gecko MCU’s five different energymodes and leveraging the MCU’s low-ener-gy sensor interface (LESENSE) and peripher-al reflex system (PRS). These features enableenergy-friendly and autonomous peripher-als to handle timing and sensor control with-out involving the CPU. SILICON LABSwww.silabs.com

Silicon Labs Giant Gecko MCU Enables Echo Smart Sportswatch to Go the Distance

INDUSTRY NEWS EMBEDDED SYSTEMS

Second UK MVNO launches 4G coverage checkerpowered by SpatialBuzz

www.epd-ee.eu | January, 2014 | EP&Dee 5

Mouser Electronics, Inc. is nowstocking FDTI’s FT800 EmbeddedVideo Engine (EVE) integrated cir-cuit, which addresses the need foreasy-to-design, advanced forms ofhuman-machine interaction.The FTDI FT800 Embedded VideoEngine (EVE) available at MouserElectronics is a high quality graphicschip with 3-in-1 functionality forgraphical user interface (GUI)development. The FT800 com-bines display, audio, and touchoperations into a single chip, pro-viding an optimized solution thatreduces power, board area, bill ofmaterial (BOM) costs, and muchmore. With these advantages, engi-neers now have a complete solu-tion to easily create state-of-the-artinteractive displays. Targeting intel-ligent QVGA and WQVGA TFTdisplay panels, EVE's object-orient-ed approach renders displayimages in a line-by-line mannerwith resolution of 1/16th of a pixel,

eliminating the expense of tradi-tional frame buffer memory. The FT800 interfaces to the sys-tem microcontroller by a lowbandwidth serial interface, allow-ing for lower cost microcontrollersto be used in the design. The con-

troller's functionality sets newindustry benchmarks, supporting4-wire resistive touch sensing withbuilt-in intelligent touch detectionand an embedded audio proces-sor that allows midi-like sounds,combined with pulse code modu-lation (PCM) for audio playback. MOUSER www.mouser.comFTDI www.ftdichip.com

FTDI Embedded Video Engine (EVE)Now In Stock At Mouser

Visitors to stand 4-603 at thisyear’s Embedded World exhibi-tion in Nuremberg, Germany, canwin a Raspberry Pi by guessing thecode to the XJTAG safe.XJTAG returns toEmbedded World thisyear with its popular‘Crack the Safe’ competi-tion. Visitors can arrangea free trial and demon-stration of the XJTAGboundary scan system,as well as finding outwhy world leading com-panies select XJTAG.In an age where chip andboard geometries contin-ue to shrink, working at higherspeeds and greater densities, tradi-tional test technology often fallsshort. XJTAG boundary scan pro-vides a cost-effective, non-intrusivetest solution that pushes beyondthese limitations to improve testcoverage. The popular RaspberryPi exemplifies many of the issuesfaced in electronics testing today. ItsBGA packaging is akin to that usedin an increasing number of modernboards that make most pinsunreachable through physical

access. But the industry is far fromblind to this problem, with JTAGBoundary Scan technology grantingthe engineer enhanced digitalaccess to these difficult to reach

pins. XJTAG uses a simple 4-5 wirehardware interface to control andmonitor JTAG enabled devices.Combined with XJTAG’s userfriendly software, every feature isdesigned to make testing easier andfaster. The revolutionary systemsaves you time and money duringboard development by allowingearly creation of reconfigurable testscripts that can be used throughoutthe whole of production. X JTAGwww.xjtag.com

XJTAG returns for Embedded World 2014

At embedded world, Rutronik (Hall 1, booth 310 and 249),presents RFduino from RFdigital. This smallest stand-alone com-puter with integrated Bluetooth Low Energy, AD-converter andGPIO's is based on the nRF51822 Bluetooth system-chip fromNordic Semiconcductor. RFduino can be equipped with variousshields and is available at distributor Rutronik as of now. RFduino is thefirst Arduino-compatibleboard that cancommunicatewirelessly withBluetooth v4.0compatiblesmartphonesand tablets. Theboard includes a 2,4GHzBluetooth module, theRFD22301,which couldalso be used forbig productionseries after theprototypingwith RFduino.The board con-tains a 2,4GHztransceiver,which canchange overBluetooth LowEnergy, Gazelland ShockBurst,as well as a256kB Flash, a32-bit Cortex-MO core andI/O periphery.Rutronik exclu-sively offers aseries of differ-ently extensiveRFduinoDevelopmentKits in variousprice categories.As operatingsystem and radio stuck, a model of Arduino can be flashed orsoftware from Nordic Semiconductor can be used. Thanks to abroad range of shields (plug-in function expansion) a prototypecan quickly be put together, which can be transformed with little effort for large scale production.

RUTRONIK www.rutronik.com/2610138a.l

Embedded World: Rutronik showsBluetooth Low Energy capable

miniature computer



Mouser Supplies NewMaxim Integrated

MAX17503 DC-DC ConverterMouser Electronics, Inc. delivers the MaximMAX17503 Step-Down DC-DC converter, witha 60 volt maximum input voltage, and up to 2.5amps of output current. The MaximMAX17503 available from Mouser Electronicsis extremely flexible, operating over an inputvoltage range of 4.5V to 60V and deliveringoutput voltages from 0.92V to a maximum of90% of the input voltage. These wide rangesallow designers to reduce the number of DC-DC regulators in stock. Peak efficiency isgreater than 90%. A detailed datasheet pro-vides directions for choosing the proper exter-nal components for an application circuit'srequirements. Operational temperature isfrom -40°C to +125°C, with thermal shutdownkicking in at 165°C.

A robust internal protection mechanism pro-tects the device from high input voltages andshort-circuit conditions. Hiccup-mode protec-tion drops the output voltage to zero for ashort time and then resumes normal voltageoutput, useful for circuit protection from cur-rent spikes that can occur when fans or motorsare suddenly powered on.This DC-DC converter is ideal for applicationssuch as industrial power supplies, distributedsupply regulation, base station power supplies,wall transformer regulation, high-voltage sin-gle-board systems, and general purpose point-of-load solutions. The MAX17503 needs onlyeight external components, reducing the totalcost of design.With its broad product line and unsurpassedcustomer service, Mouser caters to designengineers and buyers by delivering What’sNext in advanced technologies. Mouser offerscustomers 20 global support locations andstocks the world’s widest selection of the latestsemiconductors and electronic componentsfor the newest design projects.

MOUSER ELECTRONICS www.mouser.comMAXIM INTEGRATED www.maximintegrated.com

Silicon Labs announced that it has expandedits family of 8-bit Si10xx wireless microcon-trollers (MCUs) with two new options opti-mized for both cost-sensitive and perform-ance-intensive designs. By combin-ing its ultra-low-power MCU tech-nology with its sub-GHz EZRadio®and EZRadioPRO® transceivers in asingle-chip solution, Silicon Labs hascreated new energy-friendly wire-less MCUs that achieve industry-leading RF performance with thelowest overall power consumptionin their class. Supporting worldwidefrequency bands from 142 to 1050MHz with low-power sleep and activemodes for extended battery life, the Si106xand Si108x wireless MCUs address the lowenergy and RF connectivity requirements ofhome automation, security and access con-trol, sensor networks, asset tracking andlong-range control applications for the

Internet of Things. The highest performanceand smallest wireless MCU solutions on themarket, the Si106x and Si108x devices inte-grate an energy-efficient 8051 MCU and a

sub-GHz RF transceiver into a 5 mm x 6 mmQFN package. This compact footprint makesthe Si106x/8x wireless MCUs an ideal fit forspace-constrained applications that requirewireless connectivity as well as ultra-lowpower for long battery life.SILICON LABS www.silabs.com/wirelessmcu

Rutronik Elektronische Bauelemente GmbHis presenting its portfolio of embeddedcomputing boards, displays, memory com-ponents, auto ID, wireless modules andintelligent sensors with maximum depth ofintegration for theembedded systems ofthe future (stands 1-310 und 1-249). Forthis reason, Rutronik istoday responding tothe requirements forthe future projectIndustrie 4.0 and theintegrated approachfor all networkedapplications.At its trade fairsstands, Rutronik isexhibiting the techno-logical foundation forthe Internet of Things and Services in allfunctional and practical details. Theseinclude a comprehensive portfolio of RISC-based board solutions with module solu-tions as well as single-board computersfrom various manufacturers. Highlights ofthe x86 segment are the industrial AMDembedded G-series 'eKabini', Intel's newAtom platform 'Bay Trail' and the 4th gener-ation Intel Core i technology. In the storage

area, Rutronik is exhibiting the new EM-MLC (Endurance Managed - Multi LevelCell) SD, microSD and SSD Flash memorycards, some with Lifetime monitoring tools,as well as MLC SSDs for the expanded tem-

perature range. Rutronik is introducing TFTdisplays with integrated projected-capaci-tive and resistive touchscreen technology aswell as without touchscreens in sizes up to19" from its new franchise partner DLCDisplay. Experienced product and applica-tion engineers will be available to providefair visitors with expert advice. RUTRONIKwww.rutronik.com

Rutronik at embedded world: Hall 1, stands 1-310 and 249Complete component portfolio offers maximum depth ofintegration for embedded systems


Silicon Labs Targets Internet of Things with Lowest Powerand Smallest Form Factor Wireless MCUs



For evaluation and test of the MSCNANORISC-AM335x family ofprocessor modules with TexasInstruments AM335x ARM proces-sor, MSC VertriebsGmbH offers theready-to-use MSCNANORISC-SK-MB2starter kit. The kitconsists of the versa-tile MSC nanoRISC-MB2 baseboard withpower supply, a 7”WVGA TFT displayand a 7” PCT touchpanel. A Debian Linuxoperating system installation on abootable SD card or downloadableor free is ensuring immediate oper-ation of the starter kit.Even though the carrier board MSCnanoRISC-MB2 used for the starterkit provides an input for resistive 4-wire touch panels, a controller forprojected capacitive touch (PCT)panels was added to the most

recent board revision. Thereforethe new version of the nanoRISC®starter kit comes with such a touchfunction for the 7-inch display,

enabling the userto follow the gen-eral trend to user-friendly iPhone-style user inter-faces which areincreasingly foundin industrial appli-cations. Along withthe starter kit, theuser can choosethe 70 x 50mm

nanoRISC® module from the MSCNANORISC-AM335x family fromMSC. These boards are based onthe Texas Instruments AM335xARM Cortex-A8 processor. ThenanoRISC® module with AM3352clocked at 300MHz offers a 1.7Wlow power consumption.MSC VERTRIEBSwww.mscembedded.com

Starter Kit for nanoRISC ProcessorModules with TI AM335x

The new Ericsson 3E seriesBMR463-25A is a third-generationdigital point-of-load (POL) regula-tor that features Dynamic LoopCompensation (DLC) and deliversa 25 percent increase inoutput current over the sec-ond-generation BMR463-20A, yet comes in a fullycompatible footprint. Theproduct features a full set ofPMBus commands enablingsystems architects to fullymonitor and dynamicallycontrol the energy deliv-ered to strategic components,such as processors, FPGAs, ASICsand others, down to a very lowand highly economical level.Embedding the latest technologyin terms of Dynamic LoopCompensation, the BMR463-25Aruns the DLC algorithm as defaulteach time the output is enabled.However, three more settings arealso available via the PMBus forsystems architects to choose themost appropriate method fortheir application with the DLC

algorithm run every second orevery minute or simply disabled.In addition to standard methods,designers can also use the LoopCompensation Tool featured in

the latest Ericsson Power Designersoftware to set their own loopcompensation profile to matchspecific application requirements.In addition, developed with highefficiency in mind, the BMR463-25A powertrain is composed ofthe latest MOSFET technology todeliver up to 95.2 percent effi-ciency at 3.3V output and up to89.4% at 1.0V when the outputload is at 50 percent.ERICSSON POWER MODULES www.ericsson.com/powermodules

Ericsson third-generation 25A digital point-of-load regulator embeds dynamic loop compensation

Microchip announces Version 3.30 of its MPLAB® Device Blocksfor Simulink®, which makes it easy to develop complex designsusing Microchip’s dsPIC30 and dsPIC33 digital signal controllers(DSCs). This software provides a set of user interfaces toMathWorks’ Simulink graphical environment for simulation andmodel-based design, where code for the application is generat-ed, compiled and loaded onto a target dsPIC® DSC in a single,one-click step. Updates to this version include multi-rate andinterrupt-capable device blocks, as well as a Free edition for upto seven I/O ports that eliminates the compile wait time foundon prior Free editions. Existing users can upgrade to the newPRO edition for free.

The need for energy efficiency is driving complex motor-controldesigns that utilize sensorless control technology and closed-loop algorithms. These sophisticated signal-processing applica-tions require both high-level maths abstraction and low-levelprogramming knowledge. The ability to easily design complexalgorithms using tools such as Simulink, instead of hand coding,speeds time to market. Microchip’s MPLAB Device Blocks forSimulink enable designers to go back and forth from simulationto real hardware test quickly, without the burden of low-levelprogramming tasks.Microchip’s Device Blocks provide complete, model-based con-trol of most dsPIC DSC on-chip peripherals for greater flexibilityand higher utilization, including digital I/Os, ADCs, PWMs,change notifications, output compares, input captures, quadra-ture encoder interfaces, interrupts and resets, as well as commu-nication interfaces such as I2C™, SPI and UARTs. Additionally,designers can monitor, tune and log their algorithms and appli-cations in real time, via a GUI. The Device Blocks are also simple to set-up and one configura-tion can be used across all dsPIC DSCs, which enables easy in-process design changes and seamless migration. Target configu-ration blocks include Master Block, Simulink Reset Config,Compiler Option and Data Sheet. The Device Blocks’ facility toinvoke dsPIC3X dedicated functions written in C, via a C func-tion-call block, allows designers to write less code by utilizingmany of Microchip’s numerous application, algorithm and oper-ation libraries directly from a Simulink model. The PRO edition (SW007023) is priced at $1495, and existingusers can upgrade for free.

MICROCHIP TECHNOLOGY www.microchip.com/get/W15M

Microchip updates MPLAB® DeviceBlocks for Simulink® with multi-rate and interrupt capabilities



RS TOOLBOX: FEATURES AND FUNCTIONS

RS Toolbox gives you access to a wealth of electronics refer-ence material and calculation tools. With this easy-to-use app you can:

Achieve greater accuracy with all the lookup tables andcalculation tools.

Design anytime and anywhere: perform complex calcu-lations on your smartphone.

Group into project: pull in calculation results, documents,and parts from multiple tools into a project.

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n The Toolbox App provides a set of electronics reference material and calculation tools.

n Greater reliability with all the design lookup tables and calculation tools you need in one place Calculation tools: include filter circuits, OpAmp, Ohm’s Law, voltage regulator and unit conversion formulae.

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n Group into projects: pull in group designs and calculations from multiple tools into one project

n Colour codes: include resistor, capacitor and inductor codesn Design anytime and anywhere: access your calculations,

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Aurocon COMPECprezents RS Toolbox

RS believe that engineers should be able to access design reference any time andanywhere. That's why we've created the FREE Toolbox App – so you can have thehandy tools you need, right in your pocket. Started with a set of useful ‘minitools’ inthe app and will be regularly adding more tools based on your feedback. The possi-bilities are endless so try RS Toolbox and let us know what you think! Download RSToolbox (for customers in all markets apart of North America, this App is related tothe RS Components product offer. You need to select your country before you cansee the download page).


One of those demands comes in the shapeof transparency. Across Farnell element 14we’ve been able to meet this through intro-ducing date and lot codes. These give cus-tomers the assurance of complete traceabil-ity. For the industry I think 2013 has beenone of listening and responding, and thosethat do that well, will come out stronger. ForFarnell element14, that’s about making surewe continue to place the customer at theheart of our proposition. On top of the coreoffering, new services have been developedincluding, packaging options for volumeproduction, price breaks for CEM customersand guarantees for moisture sensitive parts.Products can now be searched for andfound online by architecture, technologytype, application or end market.

In any highly competitive market the leaderssucceed through differentiation. And ours isno different. For us, that means making ourcustomers lives easier, such as our new PartsFinder Tool that allows customers to findour parts on any website and compare pric-ing and availability instantly. While throughEmbest, our design company based in

China, we are able to provide a range ofexclusive products such as development kitsand accessories. Additionally, through con-tinued investment this year we haveexpanded our range of development kitsinto one of the most comprehensive in theindustry.

Software leadsThe way the market now approaches designhas also changed, we’re now seeing moreand more designs initiated by software deci-sions with the hardware requirement builtaround it. Anticipating the importance soft-ware would have in the design cycle we haveexpanded availability to a significant num-ber of design tools from our Semiconductorpartners.

Adding the ARM franchise to our proposi-tion in 2013 was a critical development toallow us to continue to meet our customers’needs as well as our continued investment in

CadSoft which celebrated its 25th birthdaythis year.

Customer Loyalty – does it exist?Knowing your customers and getting repeatorders from them is no guarantee you’vetruly won the customer. It is just one of thehard lessons in business, and one that is rein-forced even more within our industry. As customers shop around more it’s impor-tant for businesses like ours to remain agile,adapting to change and ensuring ourproposition differentiates us from the com-petition. That’s why this year we have continued toinvest heavily in our drive to put the cus-tomer right at the heart of the organisation.

Review of 2013 anda glimpse of 2014The electronics distribution industry has always been one of high competition, exe-cuted with an unrelenting pace. That’s not changed, and neither has the traditionalbias towards business models designed around the three key areas of availability,speed and price. But faced with increasing pressures, we’re seeing engineersdemanding more, and our industry has to respond.

Author: Elaine Barnes, Head of Commercial Centres and Quoting Europe at Farnell element14



Our loyalty programme – The Power Circuit– has been tailored based on our customers’feedback so it rewards them in the way theywant. We have spent time listening to ourcustomers to improve all our touch points.

By listening we’ve got a program that trulydelivers, supporting our customers andtheir organisations to do better business.

Online Communities and the Power of PiIn a recent survey commissioned by CadSoftit was revealed that Peer-to-peer communi-ties are a key enabler of modern PCB designand in 2013 our Community element14.comgrew to over 200,000 members, showingthe continued value that engineers see inbeing able to share advice and experiences.The Raspberry Pi phenomenon has movedon, from an exciting new product to a suc-cessful one with the sales figures to back itup – earlier this year we announced that we

had manufactured our one millionth Pi inthe UK, a fantastic testament to both theproduct and UK manufacturing. We’ve alsobeen working closely with PiFace and GertVan Loo to bring to market some new acces-sory boards that open up even more poten-tial for the device. Through Embest we con-tinue to build strategic partnerships todevelop other exciting accessories.

A future of consolidationNext year I predict that we’ll start to see fur-ther consolidation in the distribution space,

as designers and engineers look to just onecompany to support them at every stage ofthe design process. Whether that’s by providing the right rangeof development kits and software or meet-ing the differing needs of volume produc-tion, the challenge for us and our competi-tors is continuing to deliver the high-servicepeople have come to expect, while alsounderstanding the challenges faced asdesigns progress through to manufacture. n

www.farnell.com



But nowhere does the IoT offer greaterpromise than in the field of healthcare,where its principles are already beingapplied to improve access to care,increase the quality of care and mostimportantly reduce the cost of care. At Freescale, we’re excited to see ourembedded technologies being used inapplications like telehealth systems thatdeliver care to people in remote loca-tions and monitoring systems that pro-vide a continuous stream of accuratedata for better care decisions.

As the technology for collecting, ana-lyzing and transmitting data in the IoTcontinues to mature, we’ll see more andmore exciting new IoT-driven health-care applications and systems emerge.Read on to learn what’s happening

now—and what’s on the horizon—forhealthcare in the age of the IoT.

There’s no shortage of predictionsabout how the Internet of Things (IoT)is going to revolutionize healthcare bydramatically lowering costs and improv-ing quality. But what we’re seeing atFreescale is that it’s already doing that.

Wireless sensor-based systems are atwork today, gathering patient medicaldata that was never before availablefor analysis and delivering care to peo-ple for whom care wasn’t previouslyaccessible. In these ways, IoT-drivensystems are making it possible to radi-cally reduce costs and improve healthby increasing the availability and quali-ty of care.

How theInternet ofThings IsRevolutionizingHealthcare

DESIGN EMBEDDED SYSTEMS

In the Internet of Things

(IoT), devices gather and

share information directly

with each other and the

cloud, making it possible to

collect, record and analyze

new data streams faster and

more accurately.

That suggests all sorts of

interesting possibilities

across a range of industries:

cars that sense wear and

tear and self-schedule

maintenance or trains that

dynamically calculate and

report projected arrival

times to waiting passengers.

Author: David Niewolny, Healthcare Segment Manager at Freescale Semiconductor



In this paper, we’ll explore in greater depththe role of the IoT in healthcare delivery,take a close look at the technological aspectsthat make it a reality and examine theopportunities and challenges the IoT posesfor healthcare today.

We’ll start with an introduction to the IoT—still a relatively new concept—but one witha growing number of practical applicationsacross many industries.

These topics are of vital interest toFreescale, where we develop and manufac-ture embedded technologies for usethroughout IoT-driven healthcare systems,including:

• Sensors that collect patient data• Microcontrollers that process, analyze

and wirelessly communicate the data• Microprocessors that enable rich

graphical user interfaces• Healthcare-specific gateways through

which sensor data is further analyzed and sent to the cloud

First Things First: Understanding the IoTIoT-related healthcare systems today arebased on the essential definition of the IoTas a network of devices that connect direct-ly with each other to capture and share vitaldata through a secure service layer (SSL)that connects to a central command andcontrol server in the cloud. Let’s begin witha closer look at what that entails and what itsuggests for the way people collect, recordand analyze data—not just in healthcare,but in virtually every industry today.The idea of devices connecting directly witheach other is, as the man who coined theterm Internet of Things puts it, “a big deal.”1As Kevin Ashton explained a decade afterfirst using the phrase at a business presenta-tion in 1999, “Today computers—andtherefore, the Internet—are almost whollydependent on human beings for informa-tion. The problem is, people have limited,time, attention and accuracy—all of whichmeans they are not very good at capturingdata about things in the real world.”1 Thesolution, he has always believed, is empow-ering devices to gather information on their

own, without human intervention.The emergence of the IoT, in which devicesconnect directly to data and to each other, isimportant for two reasons:

1. Advances in sensor and connectivity tech-nology are allowing devices to collect,record and analyze data that was not acces-sible before. In healthcare, this means beingable to collect patient data over time thatcan be used to help enable preventive care,allow prompt diagnosis of acute complica-tions and promote understanding of how atherapy (usually pharmacological) is helpingimprove a patient’s parameters.

2. The ability of devices to gather data ontheir own removes the limitations of human-entered data—automatically obtaining thedata doctors need, at the time and in theway they need it.The automation reduces the risk of error.Fewer errors can mean increased efficiency,lower costs and improvements in quality injust about any industry. But it’s of particularinterest/need in healthcare, where humanerror can literally be the difference betweenlife and death.

Re m o t e Pat i e n t M o n i t o r i n g


IoT Building Blocks Emerging EverywhereEven though only “1 percent of things areconnected today,”2 according to JosephBradley, general manager of CiscoConsulting Services, businesses across a vari-ety of industries are establishing the build-ing blocks of the IoT infrastructure. Here area few examples:

• Home and building automation: Digitalmarketer Lauren Fisher points to the NestLearning Thermostat, which takes dataabout the home environment and owners’temperature preferences and programsitself to operate efficiently within the con-text of that information.3

This technical framework provides energyproviders with the connectivity to bettermanage the energy grid.

• Automotive design and manufacturing:Mobile virtual network operator AlexBrisbourne describes how the automotiveindustry is increasingly designing automatedapplications into vehicles to provide mainte-nance monitoring, fuel and mileage man-agement, driver security and other capabili-

ties that cost little to integrate but have sig-nificant earning potential.4

The addition of a cloud-based server toanalyze the data and automatically act onit—automatically scheduling a maintenanceappointment at the appropriate time, forexample—would move this further in thedirection of the IoT.

• Public transportation/smart cities:Technology writer Martyn Casserly cites theLondon iBus system, which “…works withinformation from over 8,000 buses that arefitted with GPS capabilities alongside vari-ous other sensors which relay data about thevehicle’s location and current progress,”5 sobus stop signposts can display details of abus’s impending arrival.

IoT concepts have already been adopted inareas such as energy (e.g., smart lighting,smart grid) and industrial automation.According to a report in eWeek2 about aCisco conference call with journalists, “…asmore connections are made, the value tobusinesses and the global economy will onlygo up.” The eWeek story describes a Ciscovision that goes beyond the IoT to IoE, or

the Internet of Everything. This is what Ciscosees as a system of connections that includesnot only devices, but also people, data andprocesses—“…essentially whatever is con-nected to or crosses over the Internet.”Cisco expects the IoE to be worth $14.4 tril-lion to the global economy by 2020.But, that’s another story. Let’s get back to theIoT to take a look at how it’s being used inhealthcare today and explore how it’schanging healthcare for the better.

IoT in Action in HealthcareThe IoT plays a significant role in a broadrange of healthcare applications, from man-aging chronic diseases at one end of thespectrum to preventing disease at the other.Here are some examples of how its potentialis already playing out:

• Clinical care: Hospitalized patients whosephysiological status requires close attentioncan be constantly monitored using IoT-driv-en, noninvasive monitoring. This type ofsolution employs sensors to collect compre-hensive physiological information and usesgateways and the cloud to analyze and storethe information and then send the analyzed


H o m e H e a l t h H u b Re f e r e n c e P l atf o r m


data wirelessly to caregivers for furtheranalysis and review. It replaces the processof having a health professional come by atregular intervals to check the patient’s vitalsigns, instead providing a continuous auto-mated flow of information. In this way, itsimultaneously improves the quality of carethrough constant attention and lowers thecost of care by eliminating the need for acaregiver to actively engage in data collec-tion and analysis.An example of this type of system is theMasimo Radical-7®, a health monitor forclinical environments that collects patientdata and wirelessly transmits for ongoing dis-play or for notification purposes. The resultsprovide a complete, detailed picture ofpatient status for clinicians to review wherev-er they may be. The monitor incorporatesFreescale technology in the form of an i.MXapplications processor with enhancedgraphics capabilities that enables theextremely high-resolution display of infor-mation, as well as a touch-based user inter-face that makes the technology easy to use.

• Remote monitoring: There are people allover the world whose health may sufferbecause they don’t have ready access toeffective health monitoring. But small, pow-erful wireless solutions connected throughthe IoT are now making it possible for mon-itoring to come to these patients instead ofvice-versa. These solutions can be used tosecurely capture patient health data from avariety of sensors, apply complex algorithmsto analyze the data and then share itthrough wireless connectivity with medicalprofessionals who can make appropriatehealth recommendations.

As a result, patients with chronic diseasesmay be less likely to develop complications,and acute complications may be diagnosedearlier than they would be otherwise. Forexample, patients suffering from cardiovas-cular diseases who are being treated withdigitalis could be monitored around theclock to prevent drug intoxication.Arrhythmias that are randomly seen on anEKG could be easily detected, and EKG dataindicating heart hypoxemia could lead tofaster detection of cardiac issues. The datacollected may also enable a more preventiveapproach to healthcare by providing infor-mation for people to make healthier choices.An example of an enabling technology forremote monitoring is the Freescale HomeHealth Hub reference platform, which is

built on Freescale i.MX applications process-ing technology and tightly integrates keycapabilities—such as wireless connectivityand power management—in the telehealthgateway that enables collection and sharingof physiological information. The hub cap-tures patient data from a variety of sensorsand securely stores it in the cloud, where itcan be accessed by those engaged in thepatient’s care. Data aggregation devices likethis will soon become commonplace andwill not only collect healthcare data but alsomanage other sensor networks within thehome. Freescale’s second-generation gate-way manages data from smart energy, con-sumer electronics, home automation andsecurity systems—in addition to healthcare.

• Early intervention/prevention: Healthy,active people can also benefit from IoT-driv-en monitoring of their daily activities andwell-being. A senior living alone, for exam-ple, may want to have a monitoring devicethat can detect a fall or other interruption ineveryday activity and report it to emer-gency responders or family members. Forthat matter, an active athlete such as a hikeror biker could benefit from such a solutionat any age, particularly if it’s available as apiece of wearable technology.

Freescale technology has been incorporat-ed into some solutions of this type. TheSonamba daily monitoring solution,aimed at the senior population, uses strate-gically placed sensors to monitor daily activ-ities and report anomalies to care providersor family members via cell phone. Freescaleprovides applications processing andZigBee®-based wireless connectivity forSonamba. Freescale technology is alsoembedded in the Numera Libris mobilepersonal health gateway, which is designedto detect falls and provide the ability tomanage one’s health at home or away.

These are just a few examples of IoT-basedhealthcare solutions, and many more areemerging. But as one reporter has noted,“The real vision for the future is that thesevarious smaller applications will converge toform a whole … Imagine if you are a relativeof [a] patient who forgot their medicine. Youreceive the alert, are able to know their loca-tion, check their vital signs remotely to see ifthey are falling ill, then be informed by yourcar’s navigation system which hospital has themost free beds, the clearest traffic route toget there and even where you can park.” 5


Freescale Semiconductor is extending itsKinetis portfolio of microcontrollers toinclude Kinetis miniature (mini) MCUs, whichoffer massive design potential in a tiny indus-try leading package. Intelligent devices,especially in the Internet of Things (IoT) erawhere connectivity and portability is crucial,continue to grow in complexity while shrink-ing in physical size. Starting at 1.9 mm x 2mm, Kinetis mini MCUs use wafer-level chip-scale packaging (WL-CSP packaging) andmaintain the scalability and feature rich IPavailable across the entire Kinetis portfolio.

Freescale’s widely popular Kinetis KL02, theworld’s smallest ARM Powered MCU, isincluded in this category. With over 10 mil-lion units of Kinetis mini MCUs alreadyshipped, customers have even more Kinetisdevices to choose from depending on theirdesign needs. Leveraging WL-CSP packag-ing, Kinetis mini MCUs allow designers todramatically reduce the size of their boardsand products, while retaining the perform-ance and features of their end devices. Inaddition, space-constrained applicationsthat previously couldn’t incorporate anMCU now can be upgraded to becomesmart applications, adding a new tier ofdevices to the IoT ecosystem. Learn more about Kinetis mini MCUs atwww.freescale.com/KinetisMinisFREESCALE www.freescale.com

Freescale Presents ARMPowered® KinetisMiniature MCUs to DriveInnovation for NextGeneration IoT Devices


Enabling Technologies: Making the IoT in Healthcare PossibleThe successful use of the IoT in the preced-ing healthcare examples relies on severalenabling technologies. Without these, it would be impossible toachieve the usability, connectivity and capa-bilities required for applications in areassuch as health monitoring.Smart sensors, which combine a sensor anda microcontroller, make it possible to har-ness the power of the IoT for healthcare byaccurately measuring, monitoring and ana-lyzing a variety of health status indicators.These can include basic vital signs such asheart rate and blood pressure, as well as lev-els of glucose or oxygen saturation in theblood. Smart sensors can even be incorpo-rated into pill bottles and connected to thenetwork to indicate whether a patient hastaken a scheduled dose of medication. Forsmart sensors to work effectively, the micro-controller components must incorporateseveral essential capabilities:

• Low-power operation is essential tokeeping device footprint small and extend-ing battery life, characteristics that helpmake IoT devices as usable as possible.Freescale, which has long offered low-powerprocessing, is working now to enable com-pletely battery-free devices that utilizeenergy harvesting techniques through theuse of ultra-low-power DC-DC converters.

• Integrated precision-analog capabilitiesmake it possible for sensors to achieve highaccuracy at a low cost. Freescale offers thisenabling technology within microcontrollerswhich contain analog components, such ashigh-resolution analog-to-digital converters(ADCs) and low-power op-amps.

• Graphical user interfaces (GUIs) improveusability by enabling display devices to deliv-er a great deal of information in vivid detailand by making it easy to access that informa-tion. Freescale’s i.MX applications processorswith high graphics-processing performancesupport advanced GUI development.

Gateways are the information hubs that col-lect sensor data, analyze it and then commu-nicate it to the cloud via wide area network(WAN) technologies. Gateways can bedesigned for clinical or home settings; in thelatter, they may be part of larger connectivityresource that also manages energy, entertain-ment and other systems in the home.

The Freescale Home Health Hub referenceplatform includes a gateway component.Medical device designers can also use theplatform to create remote-access devicesfor remote monitoring.

Wireless networking removes the physi-cal limitations on networking imposed bytraditional wired solutions like Ethernet andUSB. Freescale offers microcontrollers thatsupport wireless connectivity for devicesbased on popular wireless standards such asBluetooth® and Bluetooth Low Energy (BLE)for personal area networks (PAN) used withpersonal devices and Wi-Fi® and Bluetoothfor local area networks (LAN) in clinics orhospitals. That leads us to a key challengefor the IoT in healthcare: standards.

Connectivity Standards: Enabling IoT Devices to Work TogetherStandards represent an inherent challengefor any environment in which a large num-ber of complex devices need to communi-cate with each other—which is exactly thecase for the IoT in healthcare. One analysthas described the “…greater standardiza-tion of communications protocols…”6 as crit-ical to advancing the adoption of the IoT.

Fortunately, standards organizations areworking now to create guidelines for wire-less communications between monitoringdevices and with care providers. TheContinua Health Alliance, of whichFreescale is a member, is a coalition ofhealthcare and technology companies thatwas founded in 2006 to establish guidelinesfor interoperable personal health solutions.

The organization has already published a setof specifications to help ensure interoper-ability. In the future, organizations that buy aContinua-certified device will have theassurance that it will connect with other cer-tified devices in IoT-driven applications.

Continua’s device standards are part of alarger standards environment that includesinformation technology standards estab-lished by the International Organization forStandardization (ISO) and engineering stan-dards set by the Institute of Electrical andElectronics Engineers (IEEE®).

In wireless technology, IEEE standards forLANs define Wi-Fi (IEEE 802.11) and ZigBee(IEEE 802.15.4) networks. Standards forPANs include Bluetooth and BLE, as well as

IEEE 802.15.4j and IEEE 802.15.6, which arethe IEEE standards associated with the bodyarea network (BAN). Standards for cellularnetworks include GSM/UMTS and CDMA.Proprietary wireless networks still playsomething of a role in healthcare environ-ments in general and IoT applications in par-ticular, but that role seems to be shrinking asthe industry continues to move toward stan-dards-based architectures.

IoT in Healthcare: The Time Is NowThe long-predicted IoT revolution in health-care is already underway, as the examples inthis paper make clear. And, those are justthe tip of the proverbial iceberg, as new usecases continue to emerge to address theurgent need for affordable, accessible care.Meanwhile, we are seeing the IoT buildingblocks of automation and machine-to-machine communication continue to beestablished, with the addition of the servicelayer completing the infrastructure.

Freescale is excited to be a part of this revo-lution by providing end-to-end processingand connectivity solutions for IoT-drivenhealthcare solutions, working toward estab-lishing standards for these solutions andaccelerating innovation for organizationseager to realize the benefits of the IoT inhealthcare. n

References1. Kevin Ashton, www.rfidjournal.com, June22, 20092. Quoted by Jeffrey Burt, “Cisco: Internet ofEverything Already Worth Billions in Profits,”www.eweek.com, June 23, 20133. Lauren Fisher, “The Internet of Things: InAction,” thenextweb.com, May 19, 20134. Alex Brisbourne, “The Internet of ThingsIsn’t as New as It Seems,” www.forbes.com,February 8, 2013.5. Martyn Casserly, “What Is ‘The Internet ofThings’? How Connected Devices Are Set toChange Our Lives,” www.pcadvisor.co.uk,May 29, 20136. Michael Chui, Markus Loffler and RogerRoberts, “The Internet of Things,” McKinseyQuarterly, March 2010

www.freescale.com




A standard power module is a component-like device produced in large quantities,100% tested and guaranteed to meet thespecification in the datasheet. A discretepower circuit consists of many componentsmounted on the printed circuit board (PCB)together with the main system electronics.There is no testing other than on the fin-ished assembled board.

A recent addition to the power moduleofferings on the market is the PIM (PowerInterface Module). An example PIM isshown in figure 1. A PIM typically contains input filtering andtransient suppression, inrush current protec-tion and hot swap functionality, hold-up andunder voltage shutdown, dual power feeds,monitoring, alarm and power managementbased on PMBus or I2C. The first release of aPIM was tailored for ATCA (Advanced

Power Interface ModuleSaves Valuable Board Spaceand Reduces Time-to-MarketA comparison of alternative on-board power solutions is rarely at the top of the agendafor a board designer. Often designers will use a previous solution because all availableresources and time must be spent on the functionality of the system design. However,time spent on the power solution will affect the cost, procurement and sourcing, andwill reduce the technical risks and redesign cost. Most importantly it will also have ahuge impact and pay-off in terms of reduced time-to-market and increased systempackaging density. The main alternatives are standard power modules and discretepower components. Decisions are often based only upon the hardware cost, neglectingmany of the other cost elements.

Author: Patrick Le Fèvre, Marketing and Communication Director at Ericsson Power Modules

Figure 1Ericsson’s Quarter-Brick

PIM4328PD with the PMBus digitalinterface used in ATCA and

embedded computing applications.



Telecommunications Computing Architecture)standard based open platforms to reducetime-to-market and save valuable boardspace; but the PIM concept and functionali-ty are actually a suitable fit for most boardsin information and communications technol-ogy (ICT) equipment. Today this functionality is often provided bydiscrete solutions, but this situation maychange due to the shift from proprietaryplatforms to more flexible and standard-based open platforms. There are a large variety of board-inputpower interface solutions. Some of them arevery simple and contain just a fuse and EMIfiltering. Others are more complex andsophisticated, while also including inrushcurrent protection and hot swap functional-ity, hold-up and under voltage shutdown,dual power feeds, monitoring, alarm, andpower management.

The power interface circuitry built with dis-crete components on the board is often aproprietary solution that is adapted for dif-ferent power system distribution architec-tures from ICT equipment manufacturers.There are standardization initiatives goingon, such as the ATCA, but proprietary solu-tions are the most common. There are several significant benefits ofusing a PIM instead of a discrete circuit solu-tion, including reduction of design time andcost, reduction procurement and sourcingcost, reduction of time-to market andreduced board space for the power inter-face functionality.

Circuit and System Design CostThis cost applies only to the discrete powerinterface circuit; as clearly internal circuitdesign is not required for the user of stan-dard power modules. The circuit designcost consists of the following items:

• Circuit design and layout• Determine component ratings• Specify component part numbers and

alternates• Build and test prototypes, including

thermal and EMC• Modify circuits as required• Documentation

The time and cost will of course differdepending on whether a basic design isalready available, or there is a requirementfor a completely new design. Design hoursspent and hardware cost is a function of thenumber of components and complexity of

the discrete power interface circuit. Theresult is also dependant on the skill of theelectrical designer. In fact, a skilled power design engineer isrequired to design a robust and cost-effec-tive power interface circuit.However, there will be a power systemdesign cost for both the discrete powerinterface circuit and for the standard PIMsolution. The power system design cost con-sists of the resources needed and costs forthe design of:

• DC distribution and decoupling• Thermal analysis and cooling• Safety and fusing• Controls and diagnostics

The power system design will be significant-ly simpler and faster when using the stan-dard PIM alternative, as there are muchmore advanced built-in functions and sup-port literature available.

Procurement and Sourcing CostThis is the resources and direct cost forprocuring all of the components required

for either solution, including vendor selec-tion and qualification, price negotiation,quality assurance, inventory control, etc. Forthe standard PIM alternative, there is usuallyonly one component to source, the power

interface module. Also, in this case the hours spent and directcost is a function of the number of compo-nents and complexity of the discrete powerinterface circuit.The discrete power components, as withany other power components, are typicallynot part of the system board manufacturers’system-functionality electronics bill-of-materials (BOM), and therefore require spe-cific skills and engineers to evaluate, qualifyand approve the components and the solu-tion in the specific application.

Time-To-Market CostThis extremely important item addressesthe technical risk and the fact that the firstdesign is not always the final one. Engineering changes and redesigns aresometimes needed when the solution doesnot perform as expected. New microprocessors and ASICs are oftendeveloped in parallel with the board designwith some uncertainty about the final circuitpower and supply voltage requirement forthe overall system.

As the focus is on the performance andfunctionality of the primary applicationelectronics, the final board power designcannot be finalized until testing and verifica-tion of the main system circuitry.

Figure 2 System board with a conventional power interface circuit built from discrete components.

Figure 3Using a micro-PIM moduleto save space on the systemboard.



This means that there is an apparent risk thatthe board power and interface circuitrymust be re-designed very late in the project,multiplying the design cost and time, caus-ing unexpected delays in the launch anddelivery of the new system board.Obviously, there is a larger risk for severedelays when using a discrete power inter-face solution, as the design is not as welldefined or proven and there are dependen-cies upon several components and vendors. Using a standard PIM solution can make thepower system available earlier and thus cap-ture additional sales.The time-to-market cost accounts for thelost revenue (and profit) due to the loss ofearly product sales if the product introduc-tion is delayed, impacted by the develop-ment schedule for the power solution. Notonly it is a loss on the number of sold prod-uct – but also being early or even better thefirst on the market may account for a largepart of the total revenue and profit as thereis less competition and thus a significanthigher market price. The time-to-marketcost can be a very appreciable number com-pared with some of the other costs underconsideration. With the very short productlifecycles today, this could very well be thedetermining factor for making a profit or not.

PCB CostThe cost of the area on the circuit boardoccupied by the PIM or the discrete powerinterface circuit consists of:

• Material cost for the PCB itself• Value of the PCB area to the system

designer

The value to the system board designer willbe quite variable. For some systems, withless crowded boards, this cost could be rel-atively low. For high-density systems withvery tight packaging, the system designermay want to minimize the amount of areaoccupied by power and power interfacefunctions to include additional system appli-cation circuitry. In this case, the system board designer andthe system manufacturer can assign a highernumber to this value, which will serve toimpose a cost penalty to the power solu-tions that have a lower area density. In practice this has become one of thebiggest challenges for ICT system manufac-turers and system providers. Availablespace is very limited in all locations andcome at a very high cost. Indoor and out-door applications require minimal floor

space and smallest possible equipmentdimensions. Another constraint is that mod-ern high-speed electronics require verysmall distances to minimize distortion bylead inductance and board capacitance.Certain functionality must therefore be builtinto the same PCB.PCBs are manufactured in certain standard-ized sizes and the equipment cabinet andshelves are designed for specific boardsizes. It is therefore not possible to increasethe board size in a given system or equip-ment building practice. The only solution isto minimize the size and number of compo-nents on the PCB. Thisdrives higher integrationand smaller and smallerdevice packages, but at thesame time higher function-ality requirements result inhigher pin count on eachmicroprocessor or ASICpackage. The result is veryexpensive board assem-blies, not only because ofexpensive system electron-ics, but also due to theextremely high number ofboard layers required forthe functionality. It is notunusual to find up to 30-40layers in advanced ICTboards. All together thismeans that board space isvery expensive in modern ICT equipmentand everything that is not part of the mainsystem electronics needed for the requiredfunctionality must be limited to an absoluteminimum in terms of board space.

Application ExamplesThe first example is a board with convention-al power interface circuitry (see figure 2).The power interface was designed a longtime ago and has been used on many differ-ent boards for many years because it works,and besides there is no skilled power designengineer available to improve it. Components are old and costly, and the cir-cuitry occupies a rather large area on theboard. There are also increased demands onsystem availability and requirements for hot-swap and the power interface must thereforebe redesigned and include alarm and powermanagement. A PIM will solve all these issuesat lower cost and significantly reduced boardspace. The second example (see figure 3)illustrates the board space that can be savedusing the newly designed sixteenth-brick-for-

mat PIM4006 micro-power-interface-module(see figure 4), which in addition to conven-tional input circuitry includes an I2C interface.This module has been developed to meetthe highest demands in system availabilityand robustness and also includes a digitalcommunication interface for system archi-tects to monitor the status of the applicationvia software. The use of the latest technolo-gy to decrease the amount of filtering hasresulted in significant board-space saving(on both sides of the board). The result is aPIM that occupies only one-third maximumof the area taken by the discrete design.

This space can be used for additional sys-tem processing capability while also simpli-fying power management and shorteningtime-to-market.The examples show that a PIM can save valu-able board space and cost. This is possibledue to an optimized design made by skilledand experienced power design engineers.The PIM utilizes smaller component packag-ing and advanced solutions, but still with areduced bill-of-materials. Power manage-ment and internal communication makes itpossible to reduce the hold-up timerequirement and thereby minimize therequired amount of capacitance. Standardization in power distribution forICT equipment will continue to meetdemands from telecom and datacom opera-tors for second sourcing and decreasedcost. New PIMs are being developed for dif-ferent power distribution standards andpower levels, as well as proprietary solu-tions, making them a viable choice in mostapplications. nwww.ericsson.com

Figure 4PIM4006 sixteenth-brick-format PIM

with digital communication bus.



Moving from a treatment based system to a prevention approach.In our current healthcare system the patientis not asked to take an active role. Most of ushave no knowledge about the human bodyor about the early signs of a disease. Takefor example, you can ask people about thebalance of their bank account but most ofthem will not be able to tell you what theirblood pressure or heart rate is. The out-come is that people usually react too lateand when they finally go to their doctor andhave a diagnosis and potentially the pre-scribed treatment is more expensive and hasmore physiological impact than if the dis-ease had been detected earlier.

The first step toward a prevention basedsystem is to educate people about theirown health and to provide them with thetools which allow them to take ownership oftheir health such as measurement devices tosimply assess their vital signs and thus detectthe early signs of a disease or use treatmentdevices like auto-injectors to self-adminis-trate their drugs. To make this possible,medical device manufacturers need to bringprofessional equipment into peoples’ hous-es and this brings with it several challenges.Such devices would have to be cost effec-

tive to make them accessible to the broadestaudience possible plus these devices willalso have to be portable which dictates thatthey are battery operated and naturallythey will have to communicate via wireless.

These devices must also be easy to use asthe target audience will no longer be theprofessionals so development of advanceduser interfaces, safety, security and high lev-els of automated operation will be the keyto success.

New technology for cost effective,portable and connected medicaldevicesThose new requirements for medical devicedesigners, cost effective, easy to use,portable and wireless connectivity wereuntil recently unattainable goals due tomany technological challenges, but recentadvances from semiconductors supplierslike Freescale using ARM® low powerprocessors to design advanced Kinetis®MCUs that use Cortex™-M4 and M0+

New Trends in MedicalPortable Systems andTelehealthWith an aging population, the rise of chronic diseases and the need to develop a health-care infrastructure in emerging countries, there is a strong need to transform the care thatwe receive today.

Authors: Adi Shieber, Yan Vainter, Freescale Semiconductor



processor cores are making this a realitytoday. The performances that these systemscan deliver make the requirements dis-cussed above achievable.

A perfect example is the blood glucosemonitor. This device usually has 5 or 6 dif-ferent modes of operation: standby while inyour pocket/bag, wake-up and wait for ablood drop to be applied on the test strip,measurement of the electrochemical reac-tion, processing of the samples, logging ofthe results, display of the data. To run all of these steps older processortechnology would have to be working at itsmaximum performance operating point forthe entire measurement cycle, except whenin standby, which would be a massive drainon a battery and therefore would not havemet the requirements for a portable device.Today however with the latest microcon-troller devices that integrates that process-ing system on a single chip resulting in lowpower systems can more than half the ener-gy used by the device and therefore candouble the period of time between batteryreplacements or recharge cycles.Helping to ensure a high level of safety andmaking the certification process easier arealso key advantages of an integrated solu-tion as the number of components in thesystem is reduced and the interactionbetween the different features are clearlydocumented.One of the one the biggest concerns formedical device companies is the productcertification process and to ensure that acomponent selected, used and certified in aproduct does not cease to be manufacturedduring the product lifetime. Freescale offersa formal 15 year longevity program to itsmedical customers, preventing an expensivere-certification of the product if a compo-nent goes out of production by a supplier.For Terms and Conditions and to obtain alist of available products please see:www.Freescale.com/productlongevity.

Case StudyA current and impressive example of whatthis advanced technology is enabling is theOmnipod® from Insulet, a revolutionary

tubeless insulin pump. Conventional pumptherapy includes an insulin pump, reservoir,an infusion set and tubing that connect theinsulin pump to the infusion set—keepingthe patient tethered to the pump 24/7. Therevolutionary OmniPod® design has onlytwo parts: a wearable pod that delivers the

insulin and a PDA-type device called aPersonal Diabetes Manager (PDM). The pod is worn for three days and thenreplaced with another pod. It holds 200units of rapid-acting insulin, which coversthe requirements of almost 95% of Type 1diabetes patients.

When it came time to find a silicon providerfor their design, Insulet searched for a part-ner who could do a custom chip. Insulet sawthat Freescale had the right microcontrollersto control size and cost for the disposablepods, and RF connectivity for the PDM andpod to communicate wirelessly.

Freescale worked with Insulet to design a cus-tom ASIC through a close collaboration. Thecustomized microcontroller design consumesvery little power and enables communicationbetween the PDM and the pod using an inte-grated 13.56 MHz radio. Through this tech-nology alliance, a product was developed

that meets the cost and reimbursement struc-ture for the marketplace, in a small, wirelessfull-featured device.

The next phase in utilising technology toreduce healthcare costs is to move from ahospital/doctor centric system to a decen-tralized approach in which people measuretheir vital signs by themselves. To address this issue we must first get allthese medical devices, both measurementand treatment, connected so the informa-tion can reach the doctor through secureddatabases without the need for the patientto be physically present.



Smart connected homes are the basis of thisfuture decentralized system where patientscan transmit vital health data from theirhome to the physician’s office and in turnreceive personalized health coaching tipsfrom the practitioner or smart knowledgebased information systems based in serverhubs that are collectively referred to as ‘thecloud.’ Furthermore, in smart connectedhomes networked devices and Telehealthsystems can act in pre-programmed ways if amedical problem were to occur within thehome of a patient, for example a familymember or the care centre, depending pre-set automatic alert levels will automaticallybe alerted should the situation warrant it.Home Telehealth systems are expected tobecome ubiquitous in smart connectedhomes and will generally consist of a centralhealth hub managing multiple biometricsdevices as well as security and assisted livingsensors. This will allow people with illnessesor disabilities to live within the comfort oftheir homes while retaining a high quality oflife. There is compelling evidence to supportthe value of remote monitoring for individu-als with chronic conditions, including:

• 35-56% reduction in mortality• 47% reduction in risk of hospitalization • 6 days reduction in length of hospital

admission • 65% reduction in office visits• 40-64% reduction in physician time for

checks and • 63% reduction in transport costs

(Cleland et al 2005; Lee R, Goldberg et al,2003; Scalvini S et al., 2001; Elsner et al, 2006;Van Ginneken et al 2006)

The next phase in introducing Telehealth iseffective delivery of a careplan to patientssuffering from chronic disease, homeTelehealth devices should focus on usersand services and make the underlying elec-tronic technology used in patient centreddevices as unobtrusive as possible. Patientshave to be comfortable and confident thatthey can trust the devices delivering theirhealthcare. The platform technologiesshould be flexible enough to accommodatefor device personalization based on diagno-sis and patient-led requirements and have auser interface that is simple and understand-able. The technology described aboveallows device manufacturers to developsuch user interfaces and make their finalproducts as user friendly as possible using a

reference platform. For connectivity theplatform features ethernet and WiFi™ toease internet connectivity to the cloud andUSB, Bluetooth® and ZigBee® to guaranteeinteroperability with biometric device con-nectivity that is compliant to the Continuaalliance guidelines.

Advanced security features are also provid-ed by the reference platform like authenti-cated startup, and hardware-based encryp-tion that will allow designers to implementdata privacy schemes and governed levels ofmedical data access. These embedded secu-rity features will also allow for simplified inte-gration of Telehealth platforms into medicalhealth networks. For example the HomeHealth Hub Reference Platform is being pre-integrated with Microsoft’s Healthvault cloudservice where authenticated and encryptedhome based medical measurement resultscan be transmitted and then monitored by atriage centre that would be alerted in real-time if a vital statistic moves outside previ-ously set limits. Future areas for improvements that can helpdeliver an efficient and cost effective health-care is the diagnosis of the patient’s illness.Today this process has already changed insome hospitals where nurses can use instru-ments to perform diagnostic analysis at thebed side saving time, money and making thepatient’s life more comfortable. The nextstep will be to deploy those devices at localclinics and the finally in people’s homes sothey can do a self-screening. The first of itskind in homes has been around for years:

pregnancy tests. The second is changing thelife of millions of diabetics: the blood glu-cose monitor. What’s coming next? TheFreescale medical team driven byDr.Fernandez (neurosurgeon and EE) isworking on a new generation of biochemicalsensors. This technology is based on Ion

Sensitive Field Effect Transistors (IsFETs) andthese sensors are then used to createImmunological sensitive FETs ImFETs, whichcan be used to detect not only pH, but alsoto detect antigens and antibodies of specif-ic pathogens that cause a wide array ofinfectious diseases.

Future PossibilitiesWearable devices like smart plasters to col-lect body temperature, respiration, ECG, aregetting really close but their size, weight,power consumption and price still need tobe lowered to bring more comfort to thepatients at an acceptable price. The latestadvances with highly integrated system on achip microcontroller and many types of con-nectivity are moving medical electronics for-ward at a rapid pace. Another exciting inno-vation is in energy harvesting from the heatof the body or from movement to deliverthe power needed to run these portablehealthcare devices continuously without anyneed for bulky batteries and this will movethe size and weight of such products intounobtrusive, wearable accessories. The industry we anticipate will be able todeliver such solutions in the next 5 years. nwww.freescale.com


Mouser Electronics, Inc. is nowstocking Intel’s high performancesolid state drives (SSDs) offeringimproved performance, increasedreliability, and lower operatingcosts over conventional harddrives. Intel® Solid-State Drives(SSDs) available from MouserElectronics are a high perform-ance hard drive alternative forboosting laptop and desktopPCs to the next level in per-formance and reliability. IntelSSDs are 50% faster, 60% moredurable, and use 20% lesspower compared to conven-tional computer hard drives.Improved performance, relia-bility, and battery life are onlythe start of the benefits of IntelSSDs. The 530 Series SSDs targetconsumer desktops and laptops,provide a small form factor, lowcost of operation, and low idlepower. These SSDs continue toevolve as new consumer platforms

emerge, not just for traditionaldesktops and laptops but also forUltrabooks™, tablets, and tomor-row's small form factor mobile sys-tems. Intel's DC S3500 Series arethe next generation of SSDs, target-ing data centers and combiningconsistently fast read/write per-

formance with the strong data pro-tection of leading edge 20nm Flashmemory technology.

MOUSER ELECTRONICSwww.mouser.com

Intel 20nm High Performance Solid-State Drives Now Available At Mouser

Silicon Labs introduced a high-performance bridge controllerthat offers a turnkey solution forbridging a universal serial bus(USB) host and a serial peripheralinterface (SPI) bus with driver sup-port for Windows®,OS X and Linux oper-ating systems. SiliconLabs’ new CP2130USB-to-SPI bridgecontroller providesindustry-leading datathroughput, excep-tional configurabilityand a high level ofmixed-signal integra-tion in a space-saving 4 mm x 4mm package. The CP2130 bridgecontroller is ideal for new designsor upgrading legacy designs toinclude USB for a wide range ofembedded applications includingUSB dongles, tablets, handheldcontrollers and testers, blood glu-cose monitors, docking stations,point-of-sale products, data log-ging modules and card readers.With the proliferation of USB inthe embedded world, developers

are looking for cost-effective solu-tions to help speed time to mar-ket, and Silicon Labs developedthe CP21xx bridge family with thisgoal in mind. The CP2130 bridgecontroller enables developers to

add USB functionality to theirapplications without requiringUSB software, firmware or hard-ware domain expertise typicallyrequired with more complex alter-natives. The CP2130 bridge con-troller rounds out Silicon Labs’popular CP21xx Smart Interfaceportfolio, adding SPI to the rosterof USB-to-UART, I2C/SMBus andI2S interface solutions. SILICON LABSwww.silabs.com/USB-Bridge

Silicon Labs Rounds Out Smart InterfacePortfolio with USB-to-SPI Bridge Chip


Sundance Multiprocessor Technology, a pioneer in scalable andmodular computing modules for embedded solutions, haslaunched the SMT166 dual-FPGA platform for R&D into theuse of large FPGAs for high-performance reconfigurable com-puting and large-scale embedded systems applications as wellas system-on-chip (SoC) simulation. At the same time, Sundancehas announced that the SMT166 has been chosen as the proto-typing platform for the European Union’s FP7 FlexTiles 3D SoCproject, placing it at the heart of leading research into self-adaptive, high-performance computing.Headed by Thales Research & Technology, The EU FP7FlexTiles project is focused on the challenge of leveraging mul-ticore technology todevelop energy-effi-cient, high-perform-ance compute sys-tems. The project willdefine and develop aprogrammable, het-erogeneous, many-core 3D SoC architec-ture. The many-corelayer, which will inte-

grate GPP and DSP cores, will be associated with an innovative,reconfigurable virtualization layer, featuring a self-adaptiveFPGA fabric in an interchangeable tiles concept; and a dedicat-ed tool-flow to improve programming efficiency, reduce theimpact on time-to-market and reduce the development costsby 20% to 50%. Sundance’s SMT166 will be used initially todevelop, validate and verify the tools to create the FlexTiles 3DSoC. Subsequently, users will be able to utilize the SMT166 asan R&D platform to innovate and prototype products based onthe FlexTiles 3D SoC. The SMT166, which can be integratedinto a standard 19 inch rack, is designed around two XilinxVirtex-6 FPGAs.SUNDANCE MULTIPROCESSOR TECHNOLOGY www.sundance.com

Sundance launches SMT166 dual-FPGA development platform; powersEU’s FP7 FlexTiles 3D SoC project

Sundance SMT166 block diagram

Sundance SMT166 dual-FPGA platform



How they workBlood pressure monitors use an inflatableair-bladder cuff and a pressure sensor tomeasure the air pressure in the cuff fromwhich the blood pressure in the artery canbe inferred. There are two numbers in ablood pressure reading, systolic and dias-tolic. A typical reading is 120/80 (systolicreading/diastolic reading). Many of today’sautomatic blood pressure monitors work byfirst inflating the cuff with enough pressureto prevent blood flow. The pressure is grad-ually released until the blood begins to flowmaking the artery pulsate - this is detectedas a small amplitude oscillation, at the heartrate, superimposed on the pressure reading.The measurement when the blood startsflowing is the measure of the maximum out-put pressure of the heart, the systolic read-ing. As pressure in the cuff is furtherreduced the amplitude of this oscillationreaches a maximum at the mean arterialpressure (MAP), which is when most bloodpressure monitors also measure heart rate.After this the amplitude of this oscillationreduces as the pressure continues to bereleased until the cuff no longer restricts theartery. The pressure at this point is the dias-tolic reading, when the heart is relaxed.

Basic solutionA typical block diagram overview of a bloodpressure monitor is shown below and a keyelement is the pressure sensor used to con-vert the pressure variations into an electricalsignal. This is commonly achieved with atransducer formed from metal foil straingauges bonded to a diaphragm. Pressureapplied to the diaphragm causes it to

deflect, which in turn physically deforms thefoil of the strain gauge and results in a pro-portional change in its resistance. AWheatstone bridge circuit converts thisresistance change to a differential voltagefor capture by the blood pressure monitor’sprocessor, via an analog-to-digital converter(ADC). As the output from the bridge is asmall differential signal riding on top of a big

An Analog Front-End forBlood Pressure MonitorsBlood pressure monitors are no longer medical tools found only in hospitals and doctor’soffices. Automatic blood pressure monitoring is increasingly used at home. Home unitsare used not only by people who suffer from hypertension and need to track their bloodpressure but also by people who want to monitor their health and get readings that arenot affected by the anxiety or stress of a doctor or hospital visit. In order to keep unitsaffordable for home use, system designers are looking for ways to maintain performanceunder stringent budgets.

Author: Debbie Brandenburg, Product Marketing Manager, High Performance Analog Products at Exar Corporation



common mode signal, an instrumentationamplifier is used to isolate and amplify thesignal acquired from the sensor. A secondamplifier provides additional gain alongwith band-pass filtering to remove anyunwanted signals, such as slow varying ACcomponents (due to movement of the cuff )and high frequency noise.

The processor at the heart of consumerblood pressure monitors is likely to be a rel-atively simple, low-cost microcontroller.More sophisticated units intended for pro-fessional use might employ a digital signalprocessor (DSP) and perhaps provide data-logging capabilities for longer term patientmonitoring. As a minimum, the processorwill need to provide the means for initiatingthe measurement process, acquiring thesensor data and converting this to meaning-ful blood pressure and heart rate readingsthat can be output to a display. These func-tions include controlling the pump thatpressurizes the cuff and the valve that regu-lates the gradual release of pressure.The user interface might comprise pushbut-ton switches and a simple liquid crystal dis-play (LCD) although touchscreen displaysare becoming more commonplace even inlow-cost equipment. Audio output is not anessential feature for most blood pressuremonitors but may provide a simple annunci-ator function to confirm correct operationand provide user feedback on the monitor-ing process. Data logging might be providedvia serial I/O ports such as RS-232 or USBbut could be enabled wirelessly using pro-tocols such as Bluetooth, Wi-Fi or ZigBee.

Front-end implementationEven the most basic of blood pressure mon-itors needs to deliver performance thatmeets recognized standards. The nature ofthe product also means that home usersexpect quality and reliability in an instru-ment that they can trust. But this doesn’tmean that designers have to cut corners orcompromise on requirement specificationsto achieve an affordable solution.As discussed earlier, it is the design of thefront end that determines correct operationof a blood pressure monitor, detecting theright moment to perform the measurementsand capturing the pressure readings accu-rately. Clearly the specification of the pres-sure sensor is important but readily avail-able, low-cost strain gauges, with preciselydefined characteristics, can be matched withequally precise resistors to form the

Wheatstone bridge circuit. With appropri-ate care this can be designed to balance outthe effects of temperature variation and cal-ibrated for initial accuracy What then becomes important is the speci-fication of the amplifiers and data converterthat follow. Exar’s high performance analogproduct line offers a number of productsthat are ideally suited to the requirementsof blood pressure monitors and offer a cost-effective solution. Firstly, its CLC1200 instru-mentation amplifier is perfect for picking upthe small signal generated when the balanceof the Wheatstone bridge is disturbed bythe slightest pressure variation sensed bythe strain gauge.The CLC1200 architecture uses three oper-ational amplifiers arranged in two stages:the differential amplifier stage provides ahigh input impedance, which avoids loadingthe Wheatstone bridge, while also rejectingthe large common mode signal from thebridge’s DC bias circuit; the differenceamplifier stage nulls the common mode sig-nal and converts the differential signal to asingle-ended output.Exar’s CLC1003 single channel, voltagefeedback amplifier provides all the neces-sary features of high gain-bandwidth, highslew rate, low noise and low distortion, toimplement any band-pass filtering and addi-

tional gain that might be required in buffer-ing the signal from the instrumentationamplifier and driving an ADC. It offers rail-to-rail I/O operation and extremely lowTHD (total harmonic distortion) of0.00005%. The final front-end component is the analogto digital converter itself. Here the keyrequirement is providing sufficient resolu-tion to both detect the low amplitude oscil-lations from the pressure sensor that denotethe systolic and diastolic measurementpoints, and to capture the mean pressurereading with the necessary accuracy. Theactual ADC resolution required for a givendesign of blood pressure monitor willdepend on a number of other design fac-tors. This ADC is typically a 16 to 24-bit100KSPS to 200KSPS Sigma Delta ADC.

The design of the analog front-end circuitused in blood pressure monitors and othermedical diagnostic instruments is critical andplays a major role in the instruments’ accura-cy and reliability. Exar offers several instru-mentation and precision amplifiers to helpsystem designers develop high-end hospitalgrade equipment as well as more cost sensi-tive home use models. n

www.exar.com

The CLC1200 converts the differential signal from the pressure sensor and produces a single-ended output. It offers a gain range of 1 to 10,000, which isaccurately adjusted using one external resistor. The CLC1200 offers a low inputoffset voltage of ±125μV that only varies 0.1μV/°C and features a gain error of0.1% at gains of 100. Its performance helps system designers of medical devices,like blood pressure monitors, maintain accuracy and minimize costs.


DESIGN MCUs

Benefits of the 8051 ArchitectureThe 8051 architecture is well suited as aCPU for today’s small-form-factor, feature-rich MCUs. This architecture enables theeasy addition of on-chip peripherals as wellas flexible I/O, thus enabling an easily exten-sible portfolio of 8-bit devices. A few capa-bilities have been added to the 8051 archi-tecture that impact backward compatibility;but backward compatibility will only beaffected if these capabilities are enabled.(Figure 1 shows the CIP-51 architecture.)

Figure 1 shows that the base architecture isalmost identical to the original 8051, thus

maintaining instruction-level compatibility.This controller can perform its computation-al function quite well even when comparedwith some of today’s more advanced CPUarchitectures. For example, most RISCmachines that are register-based will onlyallow arithmetic logic unit (ALU) operationson values stored in the register file. Thus, to“AND” two values together, the values firsthave to be moved to the register file beforethey can be operated on.

However, in the 8051 architecture, thisoperation can be performed on valuesstored in some of these peripheral registers

directly. This approach enables the con-troller to perform fast control functions.If the application needed to turn around anI/O port based on the polarity of anotherI/O pin or pins, this task could be performedwith a simple test or logical operation of thecontrolling I/O pin/bus and then a “write” tothe relevant port control logic to turn theport around.

With the 8051 architecture, these functionscan be done in two cycles, thus enabling fastcontrol response time. This kind of speedcan only be dreamed of in modern 16-bitand even 32-bit architectures with their mul-

The C8051 Core:A Compute Engine with anEmbedded Mixed-Signal TwistThe venerable Intel 8051 device is still alive and well today. The architecture hasbeen modernized to suit today’s process technologies and computational needs.These modern 8051-based microcontroller (MCU) architectures still manage tomaintain code compatibility with the original Intel devices, but to improve perform-ance, they have long sacrificed cycle accuracy. A multitude of architectural variations exist today including the Silicon Labs MCU ver-sion, which has evolved into a pipelined complex instruction set computing (CISC)device with Fetch/Decode/Execute pipe stages. This core is known as the CIP-51 asdeveloped by Silicon Labs and sits at the heart of all its 8-bit mixed-signal MCUs.

Author: Tom David, Principal Design Engineer, Microcontroller Products at Silicon Labs


DESIGN MCUs

titude of bus hierarchies and non-determin-istic event generation logic.Another common misconception of an 8-bitcontroller such as the 8051 is that its codedensity is poor in comparison to more mod-ern 16- and 32-bit architectures. There areof course some functions that don’t imple-ment well on 8-bit architectures such as a16-bit by 16-bit multiply. Operations likethis do expand on an 8-bit machine. Thecode density for this kind of operation canbe mitigated through the implementation ofa 16 by 16 hardware multiplier, for example. In general, control type applications thatdeal in byte-sized data do not suffer thisconsequence. In addition, because 8-bitmachines have very little overhead code,overall code density for control type func-tions are lower than equivalent functionsimplemented on non-8-bit machines.

An additional misconception of the 8051architecture is that interrupt servicing canbe slow and the need to store and restorestate can take time. The 8051 handles multi-ple threads via its 32-register banked regis-ter file. When an interrupt is taken and thestate of the register file has to be preserved,simply switching to a different bank enablesfast context switching. Of course, thisapproach does not preclude having to saveoff the accumulator and a few other relevantregisters.

The original 8051 architecture only sup-ported two interrupt priorities. This defini-tion worked well on devices with smallperipheral sets, but as peripherals sets havegrown, so has the need for a finer granulari-ty in interrupt handling.

The newer 8051 devices from Silicon Labs

support up to four interrupt priorities.Having a finer interrupt granularity allowsmore predictable real-time functioning in aperipheral-rich environment.

Another limitation of the 8051 core (andother 8-bit architectures) is that the totalcode space available is limited to 64Kbytes.Some of these 8-bit devices with a rich set ofperipherals will potentially use code stacksfar greater than the available 64K byteaddress map. To accommodate this need,Silicon Labs implemented an innovativecode banking technique in its 8051-basedMCUS that enables expansion of this space.This technique, when coupled with a “C”compiler that comprehends the feature,makes this space look seamless to the soft-ware writer, thus imposing no burden.

The 8051 architecture natively supportsonly 256 Special Function Registers (SFRs).This restriction imposes quite a burden onresource-rich devices. To alleviate this limi-tation, Silicon Labs introduced a pagingcapability to the SFR map. This feature sup-ports the use of much larger register spaces.Some of the larger 8-bit devices released bySilicon Labs use up to five pages. Most of these devices have at least twopages where one page is dedicated todebug control logic and cannot be accessedby the developer.

In a modern fetch, decode and executemachine, there is a great dependence onhaving a fast memory interface. This capabil-ity enables instruction fetches on everycycle. When implemented with flash memo-ry, this approach becomes challenging sinceflash access speeds generally can’t keep upwith the speed of the CPU. To alleviate thissituation, most 8-bit MCU vendors addinstruction prefetch buffers and/or caches.

Prefetch buffers enable defined executionduring straight line code execution, andwhen branching the only cycle penalty paidis equal to the depth of the prefetch buffer,which in most cases is just 2 bytes wideexcept in the case of Silicon Labs’ ultra-high-speed 100 MHz 8051-based MCUs wherethe buffers are four bytes wide.

A cache will create no looping penalty aslong as the loop fits in the cache, but if itmisses the cache, the miss penalty can injecta lot of indeterminism into the instructionstream. Figure 1 CIP-51 Architecture.


Thus, real-time responses could suffer.Instead of implementing a cache, SiliconLabs has implemented branch target buffersand prefetch buffers on some of its faster 8-bit devices.

Flash or non-volatile memory (NVM) securi-ty is another issue that arises with 8-bitMCUs. To address this issue, Silicon Labs has imple-mented multiple flash regions in its 8-bitMCUs that offer varying levels of protection.This technique allows MCU vendors to shipMCU products to their customers whomight need to program their software IPinto the MCUs while using the vendor’s soft-ware drivers and APIs.

State-of-the-Art 8051-Based MCU ExampleFigure 2 shows the C8051F850 MCU fromSilicon Labs, which is an example of a mod-ern MCU that uses the CIP-51 as its core.This 8-bit device is available in industry-standard small-footprint 16-, 20- and 24-pinpackages.The integration level available in the 8-bitMCU shown in Figure 2 is second to none

for its size and cost. The SAR-ADC is 10-bit/800 ks or 12bit/200 ks capable. Themixed-signal peripheral integration with thisdegree of performance is not found any-where else in the MCU market at this sizeand cost.

This functionality is enabled because thehigh-speed CIP-51 core can support thethroughput of these peripherals.

Also note that since this is a peripheral-richbut pin-limited device, Silicon Labs imple-mented a priority crossbar encoder thatallows any peripheral to access any pin.

This crossbar architecture provides flexibili-ty and ease of use and allows simpler PCBimplementations.

The heart of any system-on-chip (SoC)device is its CPU. If the CPU is inadequate,then the entire SoC performance suffers.Thus, building a compelling SoC with anabundance of high-performance peripher-als requires using a CPU capable of operat-ing on all the data generated by theseperipherals. This level of performance is not

commonly found in the 8-bit market.However, this is where the CIP-51 architec-ture outshines all other 8-bit cores.Since this CIP-51 core is still 8051 instructioncompliant, the ecosystem for developmenttools, software and drivers is very rich anddiverse, thus driving down developmentcost while keeping the quality of theembedded design relatively high.

ConclusionIn today’s ARM-oriented MCU develop-ment environment, 8-bit devices might lookold and a bit long in the tooth, but looks aredeceiving. When coupled with modernprocess technologies and advanced mixed-signal peripherals, 8-bit performance onmost control tasks can match or exceedmany other CPU architectures.

Coupled with modern, more capableperipherals, these 8-bit machines can offer acost-effective solution that might precludethe need to move to a higher bus-widthdevice, thus saving development time andmoney. n

www.silabs.com

Figure 2 C8051F850 MCU.

DESIGN MCUs


Exar Corporation introduced theXRP9710 and XRP9711 multi-out-put, synchronous step-down, pro-grammable power modules thatoffer the industry’s highest powerdensity and lowest profile at2.75mm with 5V-22V inputs. Bothdevices provide two fully integrat-ed regulators with MOSFETs,inductors, and internal input andoutput capacitors in a com-pact 12x12x2.75mm pack-age that support loads upto 6Amps each. The revo-lutionary XRP9711 alsooffers two controller out-puts that are each capableof driving loads up to30Amps, making it theindustry’s first module tooffer two fully integratedchannels and two con-troller outputs. The XRP9710 andXRP9711 are complete systempower solutions that enabletelemetry, reconfiguration and fast

time to market in a small footprintwithout sacrificing performance.The XRP9710 and XRP9711 joinExar’s PowerXR programmablepower management family utilizingaward winning digital power tech-nology and design tools. Thesenew power modules offer full con-trol via a SMBus compliant I2C inter-face allowing for advanced local-

and remote-reconfiguration, fullperformance monitoring andreporting, as well as fault handling. EXAR www.exar.com

Exar Enters Power Module MarketWith Breakthrough Devices

Exar Corporation announced twoground breaking low-dropout(LDO) regulators that support 2Aand 3A loads from a single lowvoltage supply with a maximumdropout voltage of 140mV. TheXRP6274 and XRP6275 ultra lowdropout voltage regulators canoperate with industrystandard low voltagerails of 1.1V to 2.5Vproviding a uniquesingle supply solutionfor convenient point-of-load voltage regu-lation. The new LDOsare targeted at a widerange of marketsincluding communica-tions, enterprise solutions, indus-trial systems and space con-strained consumer devices.Exar achieves the ultra low dropoutperformance of its XRP6274 andXRP6275 regulators withoutrequiring either an external biasvoltage or an internal chargepump, which can often generateunwanted noise and affect systemoperation. The new ultra LDO’suse a single supply and reduce

board layout complexity by avoid-ing the need to route a secondarybias rail to the LDO. The start up isguaranteed from an input voltageas low as 1.045V. The XRP6274/75devices provide output voltagesdown to 0.6V with an accuracy of0.5% using ceramic capacitors. In

addition, precision enable andpower good functions allow foreasy sequencing and control ofthese LDOs. The XRP6274 andXRP6275 are available now inRoHS compliant, green/halogenfree space-saving 10-pin 3x3mmDFN packages and are priced from$3.20 and $3.60 respectively in1000 piece quantities.EXARwww.exar.com

Exar Releases World’s Lowest Voltage SingleSupply LDOs With 140mV Dropout


Murata announced the D1U86G series of 86 mm wide, 460Watt front end power supplies from Murata Power Solutions.The D1U86G can achieve a high minimum conversion efficien-cy of 92 percent at 50 percent full load. With 1U form factor,these units measure only 86.0 x 196.9 x 39.9 mm, ideal forlength-limited applications and mid-plane design architectures.The unit’s high efficiency significantly lowers the host systemcooling requirements and also contributes to power savings incustomer applications.

The D1U86G series comprises two models, both providing a +12 VDC 460 Watt output with either “back to front” or “front toback” direction of airflow. The power factor corrected D1U86Gseries accommodates the universal AC input range from 90 to264 VAC. Forced air cooling is provided by an internal variablespeed fan. The series features a 0 to 50 degrees C operatingtemperature range, without any derating due to line input ortemperature.The D1U86G series features hot-swapping and hot plug capa-bility and droop current sharing for up to 8 supplies to be con-nected together.Safety features include output overvoltage, output overcurrent,and self-resetting overtemperature protection. PMBus™ man-agement and I2C interface with status indicators and boot load-ing are also available. An LED on the front panel indicates theoperational status of the power supply. The D1U86G seriesdesign utilizes a low component count resulting in high reliabil-ity (MTBF 635K hours).Typical applications for the D1U86G series include servers,storage sub-systems and data communications infrastructureequipment, workstations, storage devices, and other distrib-uted power systems.The D1U86G series complies with international safety stan-dards IEC/EN/CSA/UL/CB.

MURATA EUROPE www.murata.eu

Murata D1U86G AC-DC powersupply achieves 92% efficiencyat 50 percent full load


The definition of stability is fairly self-explanatory being the shift of frequencyover the operating temperature range. Forexample ±50ppm over -40 to +85C in thecase of a clock oscillator or ±50ppb in thecase of an OCXO (Oven Controlled CrystalOscillator). The phase noise performance(from which the jitter performance can bedefined) is the short term variation or fluc-tuation of the oscillator frequency within thefrequency domain. (See figure 1)

Effectively the lower the phase noise figurethe higher the performance of the oscillator.For example a figure of -170dBc/Hz at10kHz offset is a worse measurement than -175dBc/Hz at 10kHz offset.In terms of oscillator performance generallythe performance is defined by the familiesin which they are located and start withClock Oscillators (SPXOs), VoltageControlled Crystal Oscillators (VCXOs),through Temperature Compensated CrystalOscillators (TCXOs) and then onto OvenControlled Crystal Oscillators (OCXOs)which are the best in terms of overall per-formance including phase noise. We shallnow look at some aspects of OCXO designconsiderations which are particularly impor-tant when it comes down to achieving a lowphase noise performance.The basic design of the OCXO can be bro-ken down into a number of building blocks(see figure 2).

Phase Noise Performancein Crystal OscillatorsMany modern electronic systems rely on accurate timing in applications such astelecommunications base stations (both fixed as well as mobile) and ground basedand airborne based radar stations. Such applications require not only highly stablefrequencies but also a very low phase noise performance.

Figure 2

Figure 1

DESIGN OSCILLATORS


We shall therefore look at each of theseblocks in sequence and give some idea oftheir effect on the phase noise performanceof the oscillator. As is to be expected themost important component within theOCXO is of course the crystal.

Generally speaking, the crystal has the mosteffect close into the carrier that is up to anoffset of 10kHz. To take as an example IQD’srecently released IQOV-200F series (see fig-ure 3) of OCXO this has typical phase noisefigures at a nominal operating frequency of100MHz of -95dBc/Hz at 10Hz offset, -130dBc/Hz at 100Hz and -175dBc/Hz at10kHz offset. These figures are achieved bythe use of a 5th Overtone 100MHz crystalhoused in a HC43 style holder. As is nowusual in very high specification oscillators anSC-cut crystal (stress compensated) is usedwith a turnover temperature of around 87degrees C. Normally the crystal will be heldunder vacuum which has the effect ofimproving the long term ageing perform-ance of the unit, and as we shall see later onin this article the exact turnover tempera-ture of each individual crystal is catered forat the alignment stage. It should be notedthat by their very nature SC-cut crystals arerelatively thin in profile (only a few microns)and therefore need very careful handlingprior to being encapsulated since they arevery easy to break.

The method of mounting the crystal withinthe enclosure also needs to be consideredby the manufacturer since its mechanicalmovement can also have an adverse effecton phase noise performance. Do you forexample choose a two point mount or a fourpoint? Do you use a flexible or a non-flexi-ble adhesive to hold the crystal in place?These are all things that the manufacturerneeds to consider and most often need tobe thought about whilst taking into consid-eration the customer’s application.

It is well worth emphasising time and againthat high performance OCXO’s are mostoften a key component within a customer’ssystem so it is useful to establish a goodworking relationship with the manufactureryou intend to use in order for you to bothunderstand which parameters need themost careful consideration in the design andwhich do not. It helps to get the best per-formance out of your product after all!It is also helpful to use an oscillator manufac-turer who designs and manufacturers their

own crystal units since then of course thecrystal and its drive circuitry can be closelymatched for optimum performance.It is important that all frequency dependantcomponents are located as close as physical-ly possible to the crystal and its heating ele-ment in order to maintain a tight frequencystability and phase noise performance. Thiswill of course include the tuning capacitorsand any overtone selection circuit. It is alsoimportant to ensure that the holder of the

crystal is bonded to the actual substrate orprinted circuit board used so that the ther-mal management of the device is tightlycontrolled. This can be achieved by the useof a thermally conductive adhesive.

In respect of the heating element this willnormally comprise an operational amplifierdriving a power transistor. The input to theamplifier consists of a selective thermistor/resistor network, the values of which are cho-sen individually so that the precise turnovertemperature of each crystal is set. The powertransistor should be located as close as pos-sible to the crystal and located in such a wayas to minimise any temperature gradientsacross the crystal since this will give rise topoor stability and phase noise if it is not so.This part of the circuit can, as intimated ear-lier be used to set the individual turnovertemperature of the particular crystalemployed. Very simply every crystal has tobe matched to the drive circuit so as a conse-quence there is a series of “set up” proce-

dures involved in every device. This ofcourse takes some time to enact since theoscillator has to be allowed a finite time inorder to stabilize its frequency.

The circuit of the supply used to providethe power to all aspects of the oscillatormust of course use low noise components(as of course must the rest of the circuit) inorder to achieve optimal phase noise per-formance.

It is sensible to use a voltage regulator witha low drop out and one that you can adjustin order to make maximum use of the inputvoltage available. In effect by driving theoscillator part of the circuit as hard as possi-ble you can keep help to maximise thephase noise performance. This regulationpart of the circuit should, in the best designsbe followed by a filter circuit in order again,to minimise the potential for noise to find itsway through to the more sensitive parts ofthe circuit i.e. that of the oscillator circuititself! It goes without saying that in order toachieve maximum performance from thepackaged oscillator the input voltage sup-plied must ideally be as clean and as regulat-ed as possible. That effectively means as sta-ble as possible and with as minimal a voltageripple as can be achieved.

In terms of the output the best possible out-put design to go for from a low phase noiseperspective is for a high power Sine waveoutput into 50 Ohms.

Figure 3

DESIGN OSCILLATORS


This of course provides for a much cleaneroutput than say a HCMOS logic outputwhich, by its very nature inherently hasmany harmonics and therefore much “noise”contained within it.The final aspect of the circuit within theOCXO to be considered is the voltageadjustment circuitry. This is to allow for thefrequency shift of primarily, the crystal overtime. We mentioned earlier that the crystalunit is sealed under vacuum during thecourse of its manufacture. It is most impor-tant that extreme care is taken during theprocess of its manufacture since contamina-tion is its most problematic aspect. This is ofcourse mainly contamination from theatmosphere where it can deposit itself onthe crystal blank and affect the actual fre-quency of oscillation. Since it adds an extramass which slows the frequency down. Poorconstruction can also have an effect sinceany material left within the crystal can whichshould not be present will have a similardegrading effect.

A typical phase noise performance plotachievable from a high performance mod-ern OCXO design is shown in figure 4. Thislevel of performance illustrates again theneed for a close relationship between man-ufacturer and customer.No matter how much care is taken duringthe course of the manufacture of the crystal

there will always be an element of “ageing”.In order to minimise the effect, a qualityoscillator manufacturer will always carry outan element of pre-aging on the crystal priorto its fitment within the oscillator. This willoften involve an element of “passive ageing”whereby the crystal is stored at an elevatedtemperature (say 85 degrees C or 105degrees C) during the course of its construc-tion. It may also involve, powering the crys-tal up with an oscillator circuit before fittinginto the final OCXO since active ageing isalways preferable to passive but anything isbetter than nothing!Once the crystal has been fitted to the finaloscillator and the unit fully aligned and test-ed it will normally be placed in an ageingrack for a period of say 30 days duringwhich time its ageing or frequency perform-ance is monitored probably on an hourlybasis. This information will enable the man-ufacturer to predict its performance over aperiod of many years, it also enables themanufacturer to weed out any devices thathave an early life mortality rate which is notnormally a big issue.In the past, frequency adjustment was nor-mally carried out by mechanical means thatis by an internal capacitive or resistive trim-mer accessible through an access hole in thecan. This has the detrimental effect that theexternal enclosure is not able to be hermet-ically sealed. The usual method of frequen-

cy adjustment these days is by electronicmeans, that is by the use of applying anexternal voltage through a least oneVaractor diode. It is more usual, however touse two Varactors in order to achieve a highlevel of linearity. Care must again be taken intheir selection since a lot of these devicesare very “noisy” and can therefore havedetrimental effect on the ultimate highphase noise performance we are looking toachieve.Finally, consideration should be given to theinsulation used within the enclosurealthough as with the crystal element, thedevice itself is backfilled with dry nitrogenduring hermetically sealing it does appearthat the use of an internal insulation blanketcan have a positive influence on improvingthe phase noise performance of the oscilla-tor, although there is a lot more investigativework to be carried out in order to confirmthis!As can be appreciated the design of a highend OCXO is very involved and considera-tion has to be given to many factors, all ofwhich are interlinked when it comes to look-ing to achieve the minimum possible levelsof phase noise from the oscillator. The endresult of course, represents many years ofresearch and development into achievingthe best possible performance in order tomeet with the customer’s requirement. nwww.iqdfrequencyproducts.com

DESIGN OSCILLATORS

Figure 4


Murata announced the MEF1 seriesof 1 Watt regulated DC-DC con-verters from Murata PowerSolutions. Suitable for use in indus-trial, automation and instrumenta-tion applications, these tightly reg-ulated single outputconverters, rated tobetter than 1% of nomi-nal output voltage, arepackaged in a fullyencapsulated single-in-line through-hole for-mat occupying less than1.17 cm squared foot-print. The MEF1 con-verters are availablewith either 1kVDC or3kVDC input to output isolation,the latter model having anenhanced immunity to voltagetransients. Output voltage optionsare 3.3 or 5.0 VDC, with input volt-ages covering the popular nominal

inputs from 3.3 to 24 VDC.Compared to previously availablemodels, the MEF1 offers a 13%improvement in energy efficiency.Both the 3.3 VDC input and 3.3VDC output options can operate

over the full industrial temperaturerange of -40 to +85 degrees C with-out derating. Certification to theinternationally recognized safetystandard UL60950 is pending.MURATA EUROPE www.murata.eu

Murata MEF1 regulated DC-DC converter provides 3 kVDC isolation suits industrialautomation applications

A good oscilloscope should sim-plify how you work and shortenthe time it takes to find and debugproblems. The new WaveAce2000 series combines long memo-ry, a colour display, and extensivemeasurement capabilities,advanced triggering andexcellent connectivity allfeatures that greatlyimprove troubleshooting.The WaveAce 2000 seriesexceeds all the usualexpectations of a smallaffordable oscilloscope. Itoffers up to 1 Mpts/Ch (2Mpts interleaved) memo-ry; more memory results inlonger capture times showingmore waveform detail with eachtrigger. Saving and recalling wave-forms and setups from internalmemory will save valuable timeduring test and debug. TheWaveAce can save up to 20 wave-forms, 20 setups and two refer-ence waveforms to the internalmemory. The WaveAce also pro-vides a USB host port on the frontpanel for saving screen images,

waveforms and setups to a memo-ry stick. A rear panel USB deviceport allows for connection to a PCor PictBridge printer.With 32 automatic measurementparameters, the WaveAce simpli-

fies how measurements are made;the large 7” widescreen colour dis-play can show up to five measure-ments without crowding the wave-form display or show all 32 at oncewith the measurement dashboard.A wide range of advanced timingparameters provide insight to therelationship between signals ontwo different channels.AMPLICONwww.amplicon.com

Amplicon introduces a small portable and feature rich oscilloscope, the new WaveAce 2000


Murata announced the latest addition to the OKLP range of“Power Block” products from Murata Power Solutions. In addi-tion to the recently introduced 25A, Murata now offers theOKLP-X/35-W12-C, a 35A Power Block solution. This PowerBlock concept sits between a discrete Point-of-Load (PoL)design and that of a complete non-isolated buck convertermodule. The Power Block is essentially a non-isolated buck con-verter without the PWM controller. The OKLP-X/35-W12-Cpower block measures 25.4 x 12.7 x 11.1 mm and has a typicalefficiency rating of 94%. Input voltage is a nominal 12 VDC andcan accommodate the range of 7 to 13.2 VDC.

The Power Block design approach allows the power engineerto achieve the highest efficiency and maximum possible powerand current density while maintaining a high performance sys-tem at a lower cost when compared to a complete moduledesign approach. Murata’s Power Block provides a single pack-age solution that incorporates all of the power handling com-ponents, fully tested and characterized for thermal and dynam-ic performance. The Power Block design approach is ideal fortoday’s power-hungry FPGAs, ASICs, computing and IBA archi-tectures. Most analogue or digital PWM controllers can be usedwith the Power Block; however, the maximum benefits areachieved when coupled with ZMDI’s ZSPM1035 single-phasedigital PWM IC controller family.

The combination of ZMDI’s ZSPM1035 and the 35A MurataPower Block provides a ready, tested, and optimally preconfig-ured 35A point-of-load solution. Designers have access to a fulldownloadable construction kit that includes step-by-step instruc-tions and a software wizard. ZMDI’s Pink Power Designer™ GUIallows fast module configuration that speeds time-to-market. Thedigital control loop provides ultra-fast transient response, steady-state performance, stability, and design flexibility. Up to four dif-ferent output capacitor ranges can be supported by selecting thepreconfigured ZMDI controller. To support customers duringthe initial introduction of this product, Mouser Electronics as anauthorized distributor for both ZMDI and Murata PowerSolutions will be able to provide the ZMDI controllers, GUIinterface, Murata’s OKLP and Evaluation Boards.

MURATA EUROPE www.murata.eu

Murata launches 35A “Power Block”DC-DC converter module for FPGAand embedded applications

EP&Dee | January, 2014 | www.epd-ee.eu36Tel. +40 256-201346 • Mail [email protected] • Web www.oboyle.ro


n Optical sensorsn Sensors for logistic applicationsn Safety at work

n Optical Sensorsn Inductive Sensors

n Color Sensorsn True Color Sensors, Spectrometersn Gloss Sensors

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Sensor Instruments

n Linear Sensorsn Angle Sensorsn Tilt Sensors

n PLCsn Temperature Controllern Timer

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Harting

HTP

Intertec

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n Circular connectors M8; M12; M23n Cable and Connectors for Sensorsn Valve Connectorsn Distribution Blocks

n Heavy Duty Industrial Connectorsn Power and Data Transmission Connectors

AUTOMATION

Honeywell Sensing and Control’s newSS360PT and SS460P High SensitivityLatching Hall-Effect Sensor ICs with Built-inPull-up Resistors are high performance yeteconomical sensor ICs well-suited fordemanding, cost-sensitive high-volumeapplications, such as commuting brushlessDC motors used for medical equipmentand appliances as well as for flow-rate sens-ing, speed and RPM sensing, tachometers,counter pickups, motor and fan controls.The SS360PT/SS460P Hall-Effect sensorsprovide reliable switching points with a highmagnetic sensitivity of 30 Gauss typical, at25°C [77°F], and 55 Gauss maximum overthe full -40°C to 125°C [-40°F to 257°F]temperature range, allowing for the use ofsmaller magnets or a wider air gap. Thesesensor ICs do not use chopper stabilization

on the Hall element, providing a cleaneroutput signal and a faster latch responsetime when compared to competitive, chop-per-stabilized, high sensitivity Hall-effect

bipolar latching sensor ICs. Latching mag-netics make these sensors well-suited foraccurate speed sensing and RPM (revolu-tions per minute) measurement.The sub-miniature, SOT-23 surface mountpackage (SS360PT) allows for compactdesign with automated component place-ment. The small, leaded, flat TO-92-stylepackage (SS460P) allows for a compact PCboard layout design. Wide operating volt-age range of 3 Vdc to 24 Vdc provides forpotential use in a wide range of applica-tions. Built-in reverse voltage capabilityenhances the protection of the sensor andthe circuits, and the robust design allowsoperation up to 125°C [257°F].

HONEYWELL www.honeywellnow.com

Honeywell Launches High Sensitivity Latching Digital Hall-Effect Sensor Integrated Circuits


BASIC – Robust inductive sensors for the entry level

The Full Inox BASIC family closes the gap for applications that cannotdispense with a full-metal housing, but still need a cost-effective solu-tion. The BASIC line combines the robustness and long life of the FullInox family with the sensor properties of standard technology to offer acost-effective entry into the world of full-metal sensors.− Mechanically and chemically extremely robust− High quality ASIC sensor− Factor 1 on steel and aluminum− Corrosion resistant− IP68 and IP69K− Excellent temperature compensation− Vibration and shock-resistant

Advantages of the Contrinex ASIC

n Guaranteed operating distancesn Quick installation: lower tolerance values, easy setup with or without

IO-Linkn Excellent temperature compensationn Long life especially in environments with temperature changes and

vibrationsn Extended operating distances

Machine building

Machine tools impose harsh operating conditions on the sensors need-ed to control cutting, forming and joining processes that run continu-ously in many metalworking factories. Common hazards include cuttingfluid, cooling sprays, swarf particles and electromagnetic interference,making sensor selection particularly difficult where world-classperformance is essential.− Extreme robustness− No false switching caused by metal dust or chips− Cost-optimized solution

Mobile equipment

Repairing and servicing equipment on site can be difficult and costly atbest, and sometimes impossible. In these circumstances, robust, highlyreliable sensors are vital for continuous operation in environments thatmay be challenging in the extreme. Exposure to dirt and dust, impact,vibration, seawater, corrosive chemicals and extremes of temperatureand pressure are all part of a regular day’s work.− Mechanically and chemically extremely robust− Very long lifetime in applications subject to vibration and

temperature changes

FULL INOXBASIC

DURABLEAND COST-EFFECTIVE

Full-metal sensors, now also in the BASIC range


Automotive manufacturing industry

Today, sensors of all types are common in automotive factories aroundthe globe. Highly automated plants with demanding conformityrequirements rely heavily on sensor technology to maintain world-classquality standards, particularly where harsh processes such as welding,metal finishing and high-temperature coating are required.Manufacturing engineers working for automotive manufacturers andfor first- and second tier suppliers expect robust, reliable sensors thatdeliver accurate, repeatable results with minimal downtime.− Cost-optimized solution for the toughest applications− Same operating distance on steel and aluminum− No false switching caused by metal dust or chips

Full metal sensors in space-saving M8 sizeSave space, increase performance with new

weld- immune sensors in M8 sizeThe one-piece stainless steel construction (V2A/AISI 304) of ContrinexWeld-Immune sensors is the most robust on the market. The new M8housing size, in the same fullmetal construction, provides a logical exten-sion of the Weld-Immune range. For tasks within welding cells, Full Inoxsensors are now available in the most frequently demanded sizes: M8,M12 and M18. Virtually indestructible, the sensors permanently with-stand harsh welding environments that include electromagnetic fields,weld spatter, rough cleaning and knocks - now also in confined spaces.

Strong in welding cells− Resistant to electromagnetic fields of up to 40 millitesla− Extremely robust - downtime is minimized− Easy cleaning - even with harsh methods− No false switching due to metal dust or chips− High quality ASIC sensor− Excellent temperature compensation− Factor 1 on steel and aluminum− No additional protection required− Outstanding accuracy− Long operating distances

Advantages of the Contrinex ASICn Guaranteed operating distancesn Quick installation: lower tolerance values, easy setup with or without

IO-Linkn Excellent temperature compensationn Long life especially in environments with temperature changes and

vibrationsn Extended operating distances

Applications− Welding installations in general− Welding cells of automotive industry

Before cleaning After cleaning

FULL INOXWELD -IMMUNE M8

WELD-IMMUNE,SMALL AND ROBUST

Tel. +40 256-201346 • [email protected] • www.oboyle.ro

CUI Inc has launched a completerange of 3D models for their fullline-up of ac-dc power suppliesand dc-dc converters.The move allows engi-neers to configure,view, and download2D and 3D draw-ings in any ofthe majormechan-ical CADformats; signif-icantly simplifyingand speeding the devel-opment process. The modelsare available for free via the CUIwebsite, www.cui.com/resources/3d-models, and through CUI’sdistribution partners Digi-Keyand Future Electronics.

To eliminate unnecessary dataconversion costs and delays, CUIhas announced 3D models forformats including, but not limitedto, SolidWorks®, Pro/Engineer®,Autodesk Inventor®, andMechanical Desktop®.

The models can be droppeddirectly into a product’s design.The engineer can then check

com-patibili-

ty in just afew mouse

clicks, enablingthem to specify

embedded power sup-plies quicker and reduce the

design cycle.“We believe this service providesa valuable tool for our customers,especially as design cycles contin-ue to shorten and they are askedto do more with fewer resourcesat their disposal,” commentedCUI’s VP of Marketing, JeffSchnabel.CUI’s embedded power supplyline encompasses a broad selec-tion of ac-dc power supplies anddc-dc converters ranging from0.25 W to 2400 W. CUI www.cui.com

CUI Launches Complete Range of Free3D Power Supply Models

AVX Corporation, has intro-duced a series of integrated thinfilm (ITF), high directivity, direc-tional couplers for WiFi bands.Utilizing Land Grid Array (LGA)packaging technology, the minia-ture ITF couplers feature arugged, inherently low profileconstruction designed for reli-able automatic assembly andexhibit excellent high frequencyperformance across the WiFi fre-quency spectrum: 2,400-5,950MHz. Available in 0302,0402, and 0603 sizes, all of whichprovide identical electrical per-formance, the 3W couplers alsoexhibit high directivity (20dB),low parasitics, excellent solder-ability, improved heat dissipa-tion, and self-alignment duringreflow. AVX’s high directivitycouplers for WiFi bands are ratedfor -40°C to +85°C and featureRoHS-compliant, 100% tin termi-

nations that are compatible withautomatic soldering technolo-gies, including: reflow, wave sol-dering, vapor phase, and manual.Finished parts are 100% testedfor electrical parameters andvisual characteristics.

AVXwww.avx.com

AVX introduces integrated thin film, high directivitycoupler series for WiFi bands

XP Power today announced theJCE06 and JTE06 series of low costcompact 6 Watt DC-DC convert-ers aimed at a broad range ofmobile communications, industrialand transportation applications.Constructed in a plastic industrystandard 24-pin DIP through holemounting package, and measuring31.75 x 20.32 x 10.40 mm (1.25 x0.80 x 0.40 inches), the single anddual output units achieve a powerdensity of 15 Watts per cubic inchand an efficiency of up to 84%.Single output models are availablewith +3.3, +5, +12, +15 or +24VDC outputs. Duals provide ±3.3,±5, ±12, ±15 or ±24 VDC outputs.The JCE06 accommodates a wide2:1 input range and the JTE06series an ultra wide 4:1 inputrange. All models cover the popu-lar nominal input voltages of +12,+24 or +48 VDC. Input to outputisolation is 1,500 VDC across the

range. An optional 3,000 VDC iso-lation model is available to orderquoting suffix –H. A metal caseoption is also available by adding–M suffix to the part code at thetime of order.

The converters suit a wide rangeof operating environments in tem-peratures from -40 to + 100°C. XP POWER www.xppower.com

Advanced Power ElectronicsCorp. (USA), a leading Taiwanesemanufacturer of MOS powersemiconductors for DC-DCpower conversion applications,has introduced the APE1723-HF-3, a 200kHz 1APWM buck DC/DCconvertor with anadjustable outputvoltage range from0.745V to 24V. TheAPE1723-HF-3 candrive a 1A load with-out an external tran-sistor, saving consid-erable board realestate. Additionally,the APE1723-HF-3operates at a fixed switching fre-quency of 200 kHz, enabling sim-pler filter components to be usedin a design.The external shutdown functionof the APE1723-HF-3 is controlledwith logic level signals, putting thedevice into its low-power standbymode. A further feature is internalcompensation which providesfeedback control for excellent lineand load regulation, again withoutthe need for additional external

components. The device featuresthermal shutdown for protectionagainst damage in the event ofover-temperature operation andhas current limit protection andshort circuit protection to safe-

guard the output switch. Outputvoltage tolerance is guaranteed at±3% under specified input volt-age and output load conditions.The APE1723-HF-3 is RoHS-com-pliant and completely BFR/halo-gen-free to meet current REACHenvironmental requirements. It isavailable in either an SO-8 or a 5-lead SOT-23 package.

ADVANCED POWER ELECTRONICS www.a-powerusa.com

New APE1723-HF-3 Step-Down Buck DC/DC Converterfrom Advanced Power Electronics Corp.

XP Power release low cost 6 Watt DC-DC convertersin DIP-24 package


PRODUCT NEWS ACTIVE COMPONENTS


AVX Corporation, has introducedits new TMJ S1gma Series high-reliability SMD tantalum capaci-tors, which offer three levels ofnext-generation statistical screen-ing and process control enhance-ment for applications that requireboth exceedingly high reliabilityand extremely low DCleakage current(DCL). Twice as reli-able as basic commer-cial tantalum capaci-tors, the new TMJS1gma Series capaci-tors feature animpressively scantbaseline part failurerate of < 0.5% per 1,000 hours at85°C and rated volts. Availablewith DCL limits of 0.001CV (onselected codes) and 0.005CV,TMJ S1gma Series capacitors alsoexhibit the lowest DCL of anyexisting tantalum capacitor cur-rently on the market, makingthem ideal for a variety of avion-ics, medical, safety system, andlong-life battery operated circuitapplications, such as remote wire-less modules. Statistical screening

for the TMJ S1gma SMD tantalumcapacitor series is available inthree levels: S1gma Prime, S1gmaPremium, and S1gma Pro Custom.S1gma Prime uses three electricalscreenings to remove maverickparts from the distribution.S1gma Premium utilizes AVX’s

patented Q-Process in additionto the three S1gma Prime screen-ings to effectively identify andremove any components thatmay experience excessive para-metric shifts or instability in oper-ation; and S1gma Pro Custom canemploy one or both of the threeS1gma Prime and Q-Processscreening techniques to identifyand remove parts according tospecific custom parameters.AVX www.avx.com

New tantalum capacitors from AVX exhibit lowestavailable SMD tantalum DCL & twice the reliability ofbasic commercial tantalum capacitors

AVX Corporation, has doubledthe capacitance of its 0603Multilayer Organic Capacitor(MLOC) Series, extending thehighest-rated capacitance valuefrom 2.5pF to 5.1pF. Ideal forapplications including RF poweramplifiers, low noiseamplifiers, filter networks,and instrumentation,AVX’s 0603 MLO™ capaci-tors exhibit low ESR, highSRF, and high Q and arecapable of supporting fre-quencies well above 5GHz. Expansion matchedto PCBs for improved reli-ability, the series alsoexhibits low dielectricabsorption (0.0015%) andcapacitance tolerances astight as ±0.02pF. Rated for-55°C to +125°C and for 50V,250V, and 500V, AVX’s 0603MLO RF capacitor series utilizeswell-established, low-loss organic

polymer materials. Every pro-duction lot is 100% evaluated forcapacitance and proof voltage at2.5 UR and reliability data hasbeen verified via JEDEC, MilSpec, and IPC testing. Lead-freecompatible and RoHS compliant,

the series is packaged on 7”unmarked reels each containing3,000 pieces. AVX www.avx.com

AVX boosts 0603 MLOC Series Capacitance by 2X

AVX Corporation has expandedits Mini-TurboCap™ and RoHSCompliant Mini-TurboCap™Series with a new 25V rating andan extended capacitance range(up to 39μF) for its 50V parts.Now available in 25V, 50V, and100V, these state-of-the-art basemetal electrode (BME) capacitorseries exhibit extremely high volu-metric efficiency (CV) in additionto ultra low ESR and ESL in a com-pact footprint. Capable of con-serving considerable amounts ofcritical board space, both Mini-TurboCap Series are ideal for I/OEMI filtering in military and COTS+switch mode power supply appli-cations, industrial power convert-ers, radar systems, and aerospacepower electronics, among severalothers. Both comprised of X7Rdielectric materials, the Mini-TurboCap and RoHS Compliant

Mini-TurboCap Series feature anoperating temperature range of -55°C to +125°C. Capacitance val-ues for the series’ 25V partsextend up to 82μF; for 50V parts,

values extend to 39μF, and for100V parts they extend to 8.2μF.The two series have also been lifetested to 1,000 hours at 150% ofthe rated voltage and +125°C.AVX www.avx.com

AVX Corporation, announcesthat its high-reliability TES Serieslow ESR tantalum chip capacitorshave received full EuropeanSpace Agency (ESA) QPL (quali-fied part list) qualificationapproval in accordance with theEuropean Space ComponentsCoordination (ESCC) specifica-tion ESCC3012/004. Rated for 1-470μF and 6.3-50V, TES Seriestantalum SMD chip capacitorsoffer higher capacitance andlower ESR values than any existingESCC-qualified tantalum devicesdesigned for use in aerospaceapplications. Available in fiveminiature sizes spanning 3216-18to 7343-43 and in single and mul-tianode cases, the series also pro-vides design engineers with sev-eral downsizing options, enablingsignificant reductions in bothpayload and physical space,which are extremely beneficial inaerospace applications. Singleanode TES Series tantalumcapacitors are available in sizes3216-18 (A), 3528-21 (B), and6032-28 (C); vertical multianodeTES Series parts are available in7343-31 (D); and mirror multian-

ode TES Series parts, which fullyhalve ESR values, are available in7343-43 (E). The series is alsoavailable in two tolerances, ±10%and ±20%; with three screeninglevels: B (x-ray), C, and non-ER for

non-flight parts; and with threeESCC lot acceptance testing(LAT) levels. Produced in AVX’sESA-qualified manufacturing plantin Lanskroun, Czech Republic, TESSeries tantalum SMD chip capaci-tors feature SnPb terminationsand are supplied in bulk or on 4”or 7” tape and reel upon request.AVX www.avx.com

AVX’s low ESR tantalum chip capacitor series receivesfull European Space Agency QPL qualification approval

AVX expands Mini-TurboCap™ BME capacitor serieswith new 25V rating and extended capacitance rangefor 50V parts

PRODUCT NEWS PASSIVE COMPONENTS



AVX announces market intro-duction of the first space-level BME X7R MLCCsAVX Corporation, a leading manufacturer of passivecomponents and interconnect solutions, has announcedthe market introduction of the first space-level, basemetal electrode (BME), X7R dielectric MLCCs. Exhibitingcapacitance voltage (CV) capabilities superior to thoseof conventional precious metal electrode (PME) MLCCs,the new BME MLCCs provide higher capacitance valuesin significantly smaller cases sizes, reducing both boardspace and total component weight, which are especiallycritical in space applications, while maintaining the highreliability performance required by the space industry.The new surface mount, BME MLCCs also feature Sn/Pbplating with Flexiterm® terminations, which provide con-siderably enhanced resistance to mechanical stress byallowing for more than twice as much board flexure asstandard terminations.

Qualified on the European Space Association’s (ESA’s)European Preferred Parts List (EPPL II) under the criteriaof the European Space Components Coordination’s(ESCC’s) specification 3009, AVX’s new space-level BMEMLCCs are rated for 16-100V and 2.2nF to 8.2μF, areavailable in case sizes spanning 0603-1812, and, in addi-tion to space applications, are also ideal for use in arange of high-reliability aviation and military applica-tions. Moreover, these devices, included in a line expan-sion that incorporates case sizes 0402-2220, are alsocurrently being evaluated for approval on the ESCC’sQualified Parts List (QPL) qualification process. “AVX has a long history of developing robust, high-reli-ability components for the space industry, the demandsof which continue to grow even more stringent withregard to performance, size, safety, weight, and cost,”said Michael Conway, Product Marketing Manager atAVX. “Rising to these challenges, our leading edge,space-level, BME capacitors further complement ourexisting line of space capacitors, providing customerswith an extended range of trusted, high-reliability solu-tions for mission-critical applications.”AVX’s space-level, BME MLCCs are available in threecapacitance tolerances (±5%, ±10%, and ±20%) andwith three ESCC lot acceptance testing (LAT) levels.Lead time for the series is 14 weeks and pricing infor-mation and datasheets for individual part numbers areavailable upon request.

AVX www.avx.com

Vishay’s new low-profile, high-currentDale IHLP 1616 power inductorsenhance space and power savings inDC/DC converter applications and cannow be sourced through TTI Inc, theworld’s leading specialist distributor ofpassive, connector, electromechanicaland discrete components. The surface-mount Dale devices improve battery per-formance, help reduce size of portableand handheld electronic devices with lowlosses at frequencies up to 5MHz, lowDCR values, and have a height profile thatis 30% lower than in conventional solu-tions. Designed for DC/DC converter andenergy storage applications, the IHLP1616 series will be used to replace taller,larger, and/or lower-performing induc-tors, thus enabling lighter, thinner mobileand desktop computers, servers, cellphones, digital cameras, global position-ing systems, and other handheld elec-tronic products. The inductors are fully

RoHS compliant and 100% lead (Pb) free.Benefiting from low profiles (1.2mm and2.0mm), a shielded construction, andultra low buzz noise, the power inductorscan handle high transient current spikeswithout saturation. Technical details ofIHLP 1616 series devices include a high

frequency range of 100kHz up to5.0MHz, lowest DCR/μH values (0.047μHto 4.7μH) and an operating temperaturerange from -55°C up to +125°C.TTI www.ttieurope.com

Vishay’s low-profile and high-current Dale IHLP 1616 powerinductors saving space and power now available from TTI, Inc.

Panasonic’s new OS-CON™ andPOSCAP™ series polymer capaci-tors can now be ordered fromTTI, Inc., the world’s leading spe-cialist distributor of passive, con-nector, electromechanical anddiscrete components. Featuringvery low ESR values, a widecapacitance range and an extend-ed life span, the devicesare suitable for many dif-ferent applications, includ-ing automotive, industrialand telecommunications. OS-CON series aluminiumsolid capacitors benefitfrom a high conductivepolymer electrolyte mate-rial and excellent noisereduction capabilities andfrequency characteristics.The devices have a long lifespan and since the elec-trolyte is solid, the ESR haslittle change even at low tempera-tures. Technical details include avoltage range of 2VDC up to100VDC, a capacitance range of3.3μF up to 2700μF, an operatingtemperature range of -55˚C up to+125˚C, an endurance of up to

5000h at 105˚C and up to 2000hat 125˚C, ESR values down to5mΩ, a ripple current of up to7200mArms, and a height of4.5mm up to 13mm. POSCAPseries solid electrolytic chipcapacitors feature excellent per-formance for high frequencieswhile maintaining a low profile

and high capacitance. The devicesare also highly reliable and have ahigh heat resistance. The anode issintered tantalum and the cathodeis a highly conductive polymerTTIwww.ttieurope.com

New low ESR polymer capacitors from Panasonicsuit many different applications and are nowavailable from TTI, Inc.

AVX Corporation, has expandedits range of high reliability C0G(NP0) dielectric multilayer ceram-ic capacitors (MLCCs). Availablein case sizes spanning 01005 to2225, voltages up to 500V, andcapacitance tolerances as low as±0.1pF, AVX’s C0G (NP0) MLCCsprovide one of the most stablecapacitor dielectricsavailable in today’smarket, making themideal for resonant cir-cuit applicationsrequiring superior sta-bility or a precise tem-perature coefficient,such as: matching cir-cuits, handhelddevices, and GPS,among others. New values rangefrom 3.3nF in 0603 to 10nF in the0805 size. Additionally, a new200V product up to 100pF is also

now available in 0603. The mostpopular formation of the temper-ature-compensating EIA Class Iceramic materials, modern C0G(NP0) formulations exhibit thelowest losses and most stable volt-age and temperature characteris-tics of any ceramic capacitorapplication class. Additionally,

C0G (NP0) formulations do notexhibit any aging characteristics. AVX www.avx.com

AVX adds new capacitance values and voltageratings to its range of C0G (NP0) MLCCS

AVX Corporation, offers the low-est profile 0603 and 0805 multi-layer organic (MLO™) diplexersavailable in the global market.Compared to equivalent lowtemperature co-fired ceramic(LTCC) products,AVX’s 0603 and 0805MLO diplexers exhibitsuperior attenuation,low insertion losses,low parasitics, highheat dissipation, andexcellent solderability.Ideally suited for bandswitching in dual andmultiband systems,such as WiFi and WiMax(WLAN/BT); mobile telecommu-nications, including 3G and 4GLTE (WCDMA, CDMA, andGSM); and GPS, the 0603 and0805 MLO diplexers measure ascant 0.42mm (0.017”) and0.55mm (0.021”) in height,

respectively. Based on AVX’spatented multilayer organic highdensity interconnect technology,the 0603 and 0805 MLO diplex-ers employ high dielectric con-stant and low loss materials to

realize high Q passive printedelements, such as inductors andcapacitors in multilayer stack ups.Expansion-matched to PCBs, thedevices also provide improvedreliability compared to ceramicand silicon components.AVX www.avx.com

Yageo’s expanded AF series ofsulfur-resistant chip resistors cannow be ordered from TTI, Inc.,the world’s leading specialist dis-tributor of passive, connector,electromechani-cal and discretecomponents. Therecently intro-duced 4-pin, 2-resistor (0402 x 2)AF122 arrays and8-pin, 4-resistor(0402 x 4) AF124arrays help meetincreased marketd e m a n d s .Offering a stableand reliable per-formance in awide variety ofenvironments, including thosewith high level of sulfur, AF arrayssave space on the PCB and savetime in pick and place applica-tions. To improve the sulfurresistant capability, Yageo utilizesa special material in the innerelectrode with the alteration ofthe resistor structure.

AF series chip resistors meet therequirements of the ASTM-B-809-95 standard, 60°, 1,000hrs.The devices provide high stabili-ty and reliability in harsh environ-

ments and are ideal for use inapplications such as mining, com-munication base stations, indus-trial equipment controls, powersupplies, computing servers, con-sumer electronics, and DRAMmodules, HDD.TTIwww.ttieurope.com

Expanded range of sulphur-resistant chip resistorsfrom Yageo offers a stable and reliable performanceand is now available from TTI, Inc.

AVX offers the lowest profile 0603 and 0805 MLO™diplexers available in the global market



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