Explicit Connectors in Component Based Software Engineering for Distributed Embedded Systems
Embedded Component Technology Pioneering solutions · Embedded Component Technology – ECT...
Transcript of Embedded Component Technology Pioneering solutions · Embedded Component Technology – ECT...
Embedded Component TechnologyPioneering solutions
01.04.2014www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 Page 1
Your speakers today …
Embedded Component TechnologyPioneering solutions
Jürgen Wolf Michael MatthesResearch & Development WITTENSTEIN electronics GmbH
Arndt BärHost
01.04.2014www.we-online.com Embedded Component Technology – ECT Webinar V2014/1
[email protected]+49 7955 388807 - 152
[email protected]+49 7931 493-10384
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With around 1800 employees worldwide and sales of € 241 million in 2012/13,WITTENSTEIN AG enjoys an impeccable reputation for innovation, precision andexcellence in the field of mechatronic drive technology – not just in Germany butinternationally.
WITTENSTEIN AG – one with the future
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 Page 301.04.2014
The group comprises eight pacesetting Business Units with separate subsidiaries forservo gearheads, servo actuator systems, medical technology, miniature servo units,innovative gearing technology, rotary and linear actuator systems, nano-technology andelectronic and software components for drive technologies.
Through its 60 or so subsidiaries and agents in approximately 40 countries,WITTENSTEIN (www.wittenstein.de) is additionally represented in all the world's majortechnology and sales markets.
Embedded Component Technology – ECT
Motivation
ECT–µVia
ECT–Flip Chip
Components and Assembly
Active Implant with ECT
Design Requirements
Collaboration
Realization - EDA-Tools
Realization - PCB
ECT Reliability
Embedded Component Technology:Pioneering Solutions
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 Page 401.04.2014
Embedded Component Technology – ECT
Motivation
ECT–µVia
ECT–Flip Chip
Components and Assembly
Active Implant with ECT
Design Requirements
Collaboration
Realization - EDA-Tools
Realization - PCB
ECT Reliability
Embedded Component Technology:Pioneering Solutions
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 Page 501.04.2014
Embedded Component Technology – ECTAdvantages of „buried“ components?
Miniaturization
Performance/Function
Reliability
• Integrated shielding• Short signal paths• Protection against plagiarism
• Protected against influences• Secure Fixing• Thermal management
• Package replacement• Space savings of assembly
area on the outer layers
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 01.04.2014 Page 6
Embedded Component Technology – ECT
Motivation
ECT–µVia
ECT–Flip Chip
Components and Assembly
Active Implant with ECT
Design Requirements
Collaboration
Realization - EDA-Tools
Realization - PCB
ECT Reliability
Embedded Component Technology:Pioneering Solutions
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 Page 701.04.2014
Embedded Component Technology – ECTECT–µVia: Embedded active and passive devices
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 01.04.2014
ECT-µVia ManufacturingECT-µVia Manufacturing
Assembly(Gluing/Sintering/
Soldering)
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Assembly (NCA) onto Cu-Foil
Embedded Component Technology – ECTECT–µVia: Embedded active and passive devices
Sample:
Top view ofassembled foil
Capacitors withCu-Termination
Resistors withCu-Termination
ASIC as bare diewith NiPd-Metallisation
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 Page 901.04.2014
Embedded Component Technology – ECTECT–µVia: Embedded active and passive devices
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 01.04.2014
ECT-µVia ManufacturingECT-µVia Manufacturing
Assembly(Gluing/Sintering/
Soldering)
Multilayerpressing
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Embedded Component Technology – ECTECT–µVia: Embedded active and passive devices
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 01.04.2014
ECT-µVia ManufacturingECT-µVia Manufacturing
Assembly(Gluing/Sintering/
Soldering)
Multilayerpressing
Drilling ofvias and microvias
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Embedded Component Technology – ECTECT–µVia: Embedded active and passive devices
01.04.2014www.we-online.com Embedded Component Technology – ECT Webinar V2014/1
Non-plated microviaon embedded
Capacitor with Cu-termination
Length: 58,97 µm
Length: 21,96 µm
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Embedded Component Technology – ECTECT–µVia: Embedded active and passive devices
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 01.04.2014
ECT-µVia ManufacturingECT-µVia Manufacturing
Assembly(Gluing/Sintering/
Soldering)
Multilayerpressing
Drilling ofvias and microvias
Plating andstructuring
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Embedded Component Technology – ECTECT–µVia: Embedded active and passive devices
50 µm
200 µm
Top view embedded IC Microvia connection on top of IC pad
Cross section: embedded IC with microvia connections prior to Cu-structuring
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 01.04.2014 Page 14
Embedded Component Technology – ECT
Motivation
ECT–µVia
ECT–Flip Chip
Components and Assembly
Active Implant with ECT
Design Requirements
Collaboration
Realization - EDA-Tools
Realization - PCB
ECT Reliability
Embedded Component Technology:Pioneering Solutions
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 Page 1501.04.2014
Embedded Component Technology – ECTECT–Flip Chip: Embedded active devices
01.04.2014www.we-online.com Embedded Component Technology – ECT Webinar V2014/1
ECT-Flip Chip ManufacturingECT-Flip Chip Manufacturing
Core with Footprintfor Flip Chip
Assembly(Flip Chip – ACA)
Multilayerpressing
Remaining PCBprocesses
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Embedded Component Technology – ECTECT–Flip Chip: Embedded active devices
01.04.2014www.we-online.com Embedded Component Technology – ECT Webinar V2014/1
ECT-Flip Chip
„chip first /face down“
Embeddedbare die ASIC
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Embedded Component Technology – ECT
Motivation
ECT–µVia
ECT–Flip Chip
Components and Assembly
Active Implant with ECT
Design Requirements
Collaboration
Realization - EDA-Tools
Realization - PCB
ECT Reliability
Embedded Component Technology:Pioneering Solutions
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 Page 1801.04.2014
Embedded Component Technology – ECTAvailability of components
01.04.2014www.we-online.com Embedded Component Technology – ECT Webinar V2014/1
Passive Components with Cu-Termination
mounting form0402
thicknessesfrom
150 µmto
300 µm
CapacitorsResistors
Bare Die Silicon ICs with process compatible pads
Generallya customerprovision
ECT–Flip Chip Pads
• Wirebond Au Stud-Bumps
• Wafer-level Au-Bumps
ECT–µVia Pads
• Cu
• NiPd
330 µm330 µm
150 µm150 µm
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Embedded Component Technology – ECTPCB manufacturer and the assembly of components?
01.04.2014www.we-online.com Embedded Component Technology – ECT Webinar V2014/1
Paradigm shift
PCB manufacturerassembles
components tobe embedded
ESDStorage, stock and
logistics of components
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Embedded Component Technology – ECT
Motivation
ECT–µVia
ECT–Flip Chip
Components and Assembly
Active Implant with ECT
Design Requirements
Collaboration
Realization - EDA-Tools
Realization - PCB
ECT Reliability
Embedded Component Technology:Pioneering Solutions
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 Page 2101.04.2014
Development of a robust, reliable and highly available prototype
Active medical implant limited physical dimensions with complex structures
Connectors need to be eliminated due to space requirements
Critical EMC, due to RF-sources (wireless energy anddata transfer) onboard
Direct connection to different actuators and sensors
Development of a suitable test structure
Active Implant with ECTDesign requirements
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 01.04.2014 Page 22
Functional sample based on Multilayer Standard PCB
Active Implant with ECTPreliminary studies
SMT Assembly
Packagedversions ofASIC
Packagedversions ofASIC andµController
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 01.04.2014 Page 23
Functional sample based on Multilayer PCB with Cavity onto first innerlayer
Active Implant with ECTPreliminary studies
Assembly of Flip Chip-Components onto first innerlayer
ASIC
µController
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 01.04.2014 Page 24
Advantages of Embedded Components
Reduction in volume
Increase of robustness
Improvement in thermal performance due to optimized heat conduction
Active Implant with ECTDecision to use embedded components at Wittenstein
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 01.04.2014 Page 25
Embedded Component Technology – ECT
Motivation
ECT–µVia
ECT–Flip Chip
Components and Assembly
Active Implant with ECT
Design Requirements
Collaboration
Realization - EDA-Tools
Realization - PCB
ECT Reliability
Embedded Component Technology:Pioneering Solutions
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 Page 2601.04.2014
Embedded Component Technology – ECTCollaboration in the development
01.04.2014www.we-online.com Embedded Component Technology – ECT Webinar V2014/1
Very close collaborationis needed at a very early stagein concept and design phase
for the success
product idea
concept
design
draft
development
prototypes
optimisation
Serial production
Products usingECT
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Embedding of active and passive components:
Initial meeting – what are the options?
Active Implant with ECTCollaboration in the concept phase
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 01.04.2014 Page 28
Embedded Component Technology – ECT
Motivation
ECT–µVia
ECT–Flip Chip
Components and Assembly
Active Implant with ECT
Design Requirements
Collaboration
Realization - EDA-Tools
Realization - PCB
ECT Reliability
Embedded Component Technology:Pioneering Solutions
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 Page 2901.04.2014
Realization based on the example of „Cadence Allegro“
Active Implant with ECTRealization in EDA-Tools exemplified by Cadence Allegro
In the meantime, componentsmay be placed on any layer.
Special DRCs monitor andcontrol the requiredmanufacturing rules.
With old EDA-Tools it was onlypossible to place components ontop or bottom.
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 01.04.2014
into opencavities
ontoflex,
or embeddedon inner layers orin cores
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Layer definition
Layer defined as „embedded“
Assembly direction
– Body Down
– Body Up
Cut outs of next layers
– “Protruding”
– In adjacent layers
Contact type
– Direct
– Indirect
Active Implant with ECTRealization in EDA-Tools exemplified by Cadence Allegro
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 01.04.2014 Page 31
Placing of components
Quickplace
– Components are placedcoarsely onto predefinedlayers
– Manual fineadjustment
– Filter EmbeddedComponents
– Board Layer may be selectedif layer is marked as „embedded“
Active Implant with ECTRealization in EDA-Tools exemplified by Cadence Allegro
Embedded_Pla Optional
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 01.04.2014 Page 32
Placing of components
DFA Support
– Spacing rules and online DRC
– Spacing betweensingle components
• x-, y-direction
• z-direction
– S:E S:S E:E E:S
side-end
side-side
end-end
end-side
Active Implant with ECTRealization in EDA-Tools exemplified by Cadence Allegro
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 01.04.2014 Page 33
Placing of components
Placement Replication
– Supports groups(functional modules)of embedded andregular components
Active Implant with ECTRealization in EDA-Tools exemplified by Cadence Allegro
Embedded Components
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 01.04.2014 Page 34
Substrate Cavities
Closed Cavity
– Filled with resin
– Possible heights
• Between 2 Layers
• Across multiple layers
Open Cavity
– Open space in which componentswill be placed
– Possible depths
• Multiple layers
• Stair design at the edge
Active Implant with ECTRealization in EDA-Tools exemplified by Cadence Allegro
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 01.04.2014 Page 35
Manufacturing Output
Cross Section Chart
– Manufacturing Cross Section Chart
Drill Legend
– Support of Cavities
– Start:Stop Layer
– Number of components
Artwork Film Records
ODB++ Version 9.1
In the future: IPC 2581
Active Implant with ECTRealization in EDA-Tools exemplified by Cadence Allegro
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 01.04.2014 Page 36
Embedded Component Technology – ECT
Motivation
ECT–µVia
ECT–Flip Chip
Components and Assembly
Active Implant with ECT
Design Requirements
Collaboration
Realization - EDA-Tools
Realization – PCB
ECT Reliability
Embedded Component Technology:Pioneering Solutions
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 Page 3701.04.2014
Build-up of PCB
Buried Vias
ECT-µVia: embeddedresistors in two cores
40 µm isolation distanceon inner layers
ECT-Flip Chip
Microvias on topand bottom(HDI-build-up 1-2b-2b-1)
Rigid-Flex 1F-5Ri
Castellation holes
Active Implant with ECTImplementation of the design requirements
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 Page 3801.04.2014
Development of a robust an reliable prototype design
Realisation by the use of embedded components(Bare die ASIC and resistors)
Active Implant with ECTImplementation of the design requirements
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 01.04.2014 Page 39
Active medical implant with very limited available space
Implementation: Realization only possible trough complex Outlines
Virtual, three-dimensional design of the board
Active Implant with ECTImplementation of the design requirements
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Active Implant with ECTImplementation of the design requirements
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 01.04.2014 Page 41
Realization of rigid areas adapted to the contours
Realization of flexible areas suitable for the construction and for theflattening into a 2D-board for the assembly
3D designed board flattened for 2D assembly by the use of an assembly frame.
Active Implant with ECTImplementation of the design requirements
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 01.04.2014 Page 42
Used components
Bare Die ASIC with Au Stud-Bumps
Passive components
Active Implant with ECTImplementation of the design requirements
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 01.04.2014
EmbeddedASIC
Embeddedresistors
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Separable structures for programming, test and setting-up operation
Contact structures will be cut of after successful initial operation.
Cut-off surfaces are secured through potting in the product.
Active Implant with ECTImplementation of the design requirements
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 01.04.2014 Page 44
Simulated board in comparison with assembled board
Active Implant with ECTImplementation of the design requirements
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 01.04.2014 Page 45
Direct connection of different actuators and sensors
Realization: No further connectors by the use of castellation holes
Active Implant with ECTImplementation of the design requirements
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 01.04.2014 Page 46
Embedded Component Technology – ECT
Motivation
ECT–µVia
ECT–Flip Chip
Components and Assembly
Active Implant with ECT
Design Requirements
Collaboration
Realization - EDA-Tools
Realization - PCB
ECT Reliability
Embedded Component Technology:Pioneering Solutions
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 Page 4701.04.2014
5x solder process lead-free+
1000 cycles - 40 °C / + 125 °C+
lamination process+
5x solder process lead-free
no resistance change in daisy chain!
40 °C at 90 % rel. humidity climate exposure 200 / 500 / 1000h
125 °C heat treatment 200 / 500 / 1000h
Embedded Component Technology – ECTReliability – ECT–Flip Chip
+ 125 °C
- 40 °Ctime / cycles
15 min no cracks
no separation
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 Page 4801.04.2014
ECT-µVia temperature cycling
Embedded Component Technology – ECTReliability – ECT–µVia
0
2
4
6
8
10
12
14
16
18
20
500 1000 1500 2000 2500 3000
Cycles – End-Of-Life
Te
stp
oin
ts
Z6
Z5
Z4
Y6
Y5
Y4
X6
X5
X4
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 Page 4901.04.2014
Summary / Conclusion
Technologies available to embed
– active and
– passive components
Collaboration
– Hugh importance for success and
– Already starting in planning phase
Pre-serial samples finished
Series production in planning
Embedded Component Technology:Pioneering Solutions
www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 Page 5001.04.2014
Thank you for your attention!
01.04.2014www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 Page 51
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