EMATA&HARI& - IES Institut d'Electronique fileVref Vref 50 Ω Line 0 µm Vref Vref Line 0.455 µm...

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E"MATA HARI Electromagne4c Analysis, Deciphering and Reverse Engineering of Integrated Circuits Laurent Chusseau, Rachid Omarouayache, Jérémy Raoult, Sylvie Jarrix, Philippe Maurine, Karim Tobich, Alexandre Boyer, Bertrand Vrignon, John Shepherd, ThanhEHa Le, Maël Berthier, Lionel Rivière, Bruno Robisson, AnneELise RiboIa IES (Montpellier), LIRMM (Montpellier), LAAS4CNRS (Toulouse), Freescale (Toulouse), Safran Morpho (Osny), CEA4LETI (Gardanne), ENSMSE (Gardanne)

Transcript of EMATA&HARI& - IES Institut d'Electronique fileVref Vref 50 Ω Line 0 µm Vref Vref Line 0.455 µm...

Page 1: EMATA&HARI& - IES Institut d'Electronique fileVref Vref 50 Ω Line 0 µm Vref Vref Line 0.455 µm Metal 2 connected to V ref On-chip sensors Analog pad connected to V ref Line 5.5

E"MATA&HARI&Electromagne4c&Analysis,&Deciphering&and&Reverse&Engineering&of&Integrated&Circuits&

Laurent(Chusseau,(Rachid(Omarouayache,(Jérémy(Raoult,(Sylvie(Jarrix,(Philippe(Maurine,(Karim(Tobich,(Alexandre(Boyer,(Bertrand(Vrignon,(John(Shepherd,(

ThanhEHa(Le,(Maël(Berthier,(Lionel(Rivière,(Bruno(Robisson,(AnneELise(RiboIa((

IES$(Montpellier),$LIRMM$(Montpellier),$LAAS4CNRS$(Toulouse),$Freescale$(Toulouse),$Safran$Morpho$(Osny),$CEA4LETI$(Gardanne),$ENSMSE$(Gardanne)$

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Context&&&Goals&•  Context&

–  Electronic(money(transacKons(–  Private(communicaKons(and/or(secret(data(exchange(–  Need(for(cerKfied(secure(IC(both(at(soQware(and(hardware(level(

•  State&of&the&art&

–  Cryptographic(aIacks(on(circuits(are(usually(managed(by(opKcal(injecKon(or(by(conducted(interference(injecKon((

–  ElectromagneKc(aIacks(have(just(been(proven(efficient(by(some(of(us((

•  Goals&

–  What(can(be(observed,(at(best,(in(an(integrated(circuit((IC)(by(EM(nearEfield(scan?(–  Why(and(how(EM(fault(injecKon(works?(–  What(are(the(pracKcal(and(theoreKcal(limits(of(EM(threats?(

•  Requirements&

–  Knowledge(of(crypto(circuits(at(hardware(level((LIRMM,(CEA,(Freescale,(Morpho)(–  Knowledge(of(crypto(circuits(at(soQware(level((Morpho,(LIRMM,(CEA)(–  ElectromagneKc(nearEfield(/(Probes:(design(and(realizaKon((IES,(LAAS,(Freescale)(–  Skill(in(logic(circuit(EMC((LAAS,(Freescale,(IES)(–  EM(aIacks((LIRMM,(CEA,(ENSMSE)(

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•  Probes(:(design,(fabricaKon(&(characterizaKon(–  OpKmized(new(probes(–  Dedicated(test(chips(–  EM(coupling(experiments(&(models(–  mmEwave(imagery(

•  EM(aIacks(on(circuits(–  EM(pla_orm(–  EM(fault(injecKon(in(AES(–  BitEset(&(bitEreset(–  Fault(propagaKon(modeling(

Summary&

Page 4: EMATA&HARI& - IES Institut d'Electronique fileVref Vref 50 Ω Line 0 µm Vref Vref Line 0.455 µm Metal 2 connected to V ref On-chip sensors Analog pad connected to V ref Line 5.5

Classical loop probe (diameter 2-5 mm) Pulse injection in probe

! Courant induction in lines

! Local power supply voltage change

or Local logic level change

! Fault !

Probe figure of merit - Spatial resolution - Injection efficiency

Substrate

Magnetic probes are more efficient than electric probes @ f≤1 GHz

How&an&EM&fault&occurs&?&

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Concentrate(magneKc(field(" beIer(resoluKon(Many(loops(with(a(thicker(wire(is(possible ((" beIer(efficiency(

Classical&open&loop&"&resolu4on&limit&is&≈&loop&∅&

SoluKon(:((add(a(ferrite(core(with(conical(shape!

Ferrite&rod&op4mized&probe&

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H(field(vs(the(distance(to(the(Kp(d(and(vs(number(of(turns(N$(Pulse(tR=3(ns,(tW=100(ns)(

&

H(fie

ld(amplitu

de((A

/m)(

H(fie

ld(amplitu

de((A

/m)(

Axis(X((mm)(Axis(X((mm)(

d(=(20(µm(d(=(50(µm(d(=(100(µm(d(=(200(µm(

0.5(mm(

12(turns(1(turn(

400(µm(

400(µm(

0.5(mm(

0( 1( 2( 3( 4( 5mm(

Realized&

Modeled&

Ferrite(rod(of(diameter(2(mm(• (SpaKal(resoluKon(≈400µm(close(to(the(Kp(• (SpaKal(resoluKon(does(not(depend(on(N$

Simula4on&of&ferrite&probes&

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#  Test(chip(designed(with(Freescale(0.25(µm(SMARTMOS(

#  Contains(various(interconnect(structures(with(high(frequency(on"chip&voltage&sensors&(OCS)&to(measure(local(voltage(fluctuaKons(induced(by(the(nearEfield(injecKon(

#  Mounted(in(CQFP64(package(with(a(removable(metallic(lid((

Wide(power(rails(

Power(rails(above(power(grid(and(logic(blocks(

Power(rails(above(analog(blocks(

Power(rail(above(logic(blocks(

OVS(

DieEtoEdie(bonding(between((50Ω(loads(

DieEtoEdie(bonding((between(buffers(

50Ω(lines(

Buses(OVS(

Chip#1&3mmx4.5m

m&

Chip#2&3mmx3mm&

PCB&control&card&

Dedicated&chips&for&probe&tes4ng&

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Vref

Vref

50 Ω Line 0 µm

Vref Vref

Line 0.455 µm

Metal 2 connected to VrefOn-chip sensors

Analog pad connected to Vref

Line 5.5 µm

Line 10 µm

50 Ω

50 Ω50 Ω

Vref

Vref

Vref

Vref

Vref

Vref

50 Ω

50 Ω

50 Ω

50 Ω

50 Ω

50 Ω

Line30µm

Vref Vref50 Ω 50 Ω

Line70µm

Vref Vref50 Ω 50 Ω

Line120µm

Vref Vref50 Ω 50 Ω

Line320µm

Bandgap Vref

On"chip&EM&measurements&

Targeted structure: set of 50Ω transmission lines with variable spacing •  Evaluate coupling between the

probe and the lines (injection) •  Evaluate spurious coupling

between the lines (injection)

Structure 1

CW injection on 50Ω transmission lines f=1.4(GHz,(PRF(=(43(dBm(

Scan(alKtude(=(400(µm,(Scan(step(=(50(µm(

#  Voltage(coupled(on(Struct1(lines(vs(probe(posiKon((

#  DisKnguish(two(lines(separated(by(more(than(100(µm(

!

≈ 300 µm

H

Struct1

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Probe-sample model •  Equivalent circuit model

extracted from S-parameters •  Coupling accounted by

mutual inductance vs $  frequency $  distance

On"chip&EM&measurements&Pulse injection on 50Ω transmission lines

×××××××××××××××××××××××××××××××××××××××××××××××××××××××××××××

×××××××××××××××××

××××××××××××××××××

××××××××××××××××××××××

×××××××××

××××××××××××××××××××××××××××××××××××××××××××××× ××××

××××××××××××

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Ferrite probe, 5.5 turns, f=10MHz, tR=tF≈10ns, tW=50ns, VPP=10V

•  Excellent behavior agreement •  True input pulse shape (overshoot) not accounted for

x x x x Measure Model

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60&GHz&near"field&imagery&

Plas4cs&and&ceramics&are&almost&transparent&to&mm"wave&$  InspecKon(of(ICs(through(the(package($  IdenKficaKon(of(area(of(interest(for(future(EM(

injecKon(

60 GHz Gunn diode + isolator + 10 dB coupler + Schottky detector

Piezo actuator

Probe and its reflection

60GHz WR15 tuner

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MetalizaKons(between(die(and(connecKng(pads(

Package&IC&imaged&with&open&waveguide&&"&spaKal(resoluKon(≈1(mm(

E"probe&@&60&GHz&

Resolu4on&limit&on&a&square&angle&@&h=5µm&

Spa4al&resolu4on&33&µm&i.e.&λ/150&

Both&should&be&merged…&s4ll&to&come&

mm(mm(

60&GHz&near"field&imagery&

die

We&are&able&to&inspect&through&the&package&

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� � � � � �

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Page 12: EMATA&HARI& - IES Institut d'Electronique fileVref Vref 50 Ω Line 0 µm Vref Vref Line 0.455 µm Metal 2 connected to V ref On-chip sensors Analog pad connected to V ref Line 5.5

•  Probes(:(design,(fabricaKon(&(characterizaKon(–  OpKmized(new(probes(–  Dedicated(test(chips(–  EM(coupling(experiments(&(models(–  mmEwave(imagery(

•  EM(aIacks(on(circuits(–  EM(pla_orm(–  EM(fault(injecKon(in(AES(–  BitEset(&(bitEreset(–  Fault(propagaKon(modeling(

Summary&

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•  Technical(datasheet(–  3(motorized(axes((stepsize(0.1(µm)(–  Faraday(cage(isolaKon(–  Flexible(probe(support(for(emirng(

or(receiving(probes(–  Modified(smartcard(reader((accept(

current(Side(Channel(AIack)(–  Oscilloscope(monitoring(and(PC(

controlled(

•  Suitable(for…(–  Mapping(in(EM(listening(mode(–  Pulse(injecKon((up(to(200V(peak)(

New&EM&acack&pladorm&

Page 14: EMATA&HARI& - IES Institut d'Electronique fileVref Vref 50 Ω Line 0 µm Vref Vref Line 0.455 µm Metal 2 connected to V ref On-chip sensors Analog pad connected to V ref Line 5.5

Problem&of&EM&acack&on&secure&ICs&

1.  Enhance EM injection $  improve spatial resolution $  improve EM power transfer to IC

2.  Enhance the capability of EM injection $  single-bit and multi-bit timing faults have been

demonstrated $  it is not enough for smartcards…

3.  Enhance the protection of future ICs and smartcards $  simulate fault propagation at hardware level $  help to define countermeasures

Figure of merit of the probe Impedance matching

Page 15: EMATA&HARI& - IES Institut d'Electronique fileVref Vref 50 Ω Line 0 µm Vref Vref Line 0.455 µm Metal 2 connected to V ref On-chip sensors Analog pad connected to V ref Line 5.5

Timing&faults&on&AES&

AES&mapped&into&FPGA&opera4ng&@&50MHz&&&100MHz&Acack&with&ferrite&probes&and&posi4ve&or&nega4ve&square&pulses&

$  PosiKve(pulses(are(more(efficient("(layout(dependent(?($  Fault(probability(depends(on(clock(frequency("(Kming(faults($  Compared(to(single(loop,(ferrite(probes(are(more(efficient((

�  strong(reducKon(of(pulse(intensity(needed(to(produce(the(fault(&EM&acack&enhanced&by&probe&op4miza4on&

Page 16: EMATA&HARI& - IES Institut d'Electronique fileVref Vref 50 Ω Line 0 µm Vref Vref Line 0.455 µm Metal 2 connected to V ref On-chip sensors Analog pad connected to V ref Line 5.5

SETUP2CK TTD2][Q1Q1][CK1 −−<>−+>− δ

Vdd"Gnd&

Vdd/2&

Effects&of&EM&injec4on&on&secure&circuits&

D1(

CK(

Q1(LOGIC&

Skew&δ&&

Data( D2( Q2(

Vdd&

Gnd&

CK1(

EM&coupling&

EM&coupling&

Moderate&intensity&

Page 17: EMATA&HARI& - IES Institut d'Electronique fileVref Vref 50 Ω Line 0 µm Vref Vref Line 0.455 µm Metal 2 connected to V ref On-chip sensors Analog pad connected to V ref Line 5.5

D1(

CK(

Q1(LOGIC&

Skew&δ&&

Data( D2( Q2(

Vdd&

Gnd&

CK1(

EM&coupling&

EM&coupling&

Effects&of&EM&injec4on&on&secure&circuits&

Vdd"Gnd&

Bit"set&or&bit"reset&!&

Inversion(

High&intensity&

Page 18: EMATA&HARI& - IES Institut d'Electronique fileVref Vref 50 Ω Line 0 µm Vref Vref Line 0.455 µm Metal 2 connected to V ref On-chip sensors Analog pad connected to V ref Line 5.5

DFF&0&to&7&

DFF&N"&7&to&N&

DFF&i+8&to&i+15&

Reset (On = 0)

Set (On = 1)

CLK

All bytes set to AA (‘10101010’) Read data in memory

CLK

CLK stopped ! Timing fault not allowed

EM Injection

Data_IN Data_OUT

Effects&of&EM&injec4on&on&secure&circuits&

Page 19: EMATA&HARI& - IES Institut d'Electronique fileVref Vref 50 Ω Line 0 µm Vref Vref Line 0.455 µm Metal 2 connected to V ref On-chip sensors Analog pad connected to V ref Line 5.5

$  Deterministic errors $  EM injection is strongly localized

Bit"set&and&bit"reset&on&secure&circuits&

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(Embedded&fault&simula4on&&

–  concept(•  Embbeded(funcKonality(which(is(

able(to(interrupt(the(program(execuKon(to(modify(the(context((variables,(addresses,(registers,(program(counter,….)((

–  Results(

•  Realized(Fault(Models:(InstrucKon(jump,(memory(modificaKon(

•  ApplicaKon(on(soQware(implementaKon(:(VulnerabiliKes(idenKcaKon(

EM&faults&modeling&

Page 21: EMATA&HARI& - IES Institut d'Electronique fileVref Vref 50 Ω Line 0 µm Vref Vref Line 0.455 µm Metal 2 connected to V ref On-chip sensors Analog pad connected to V ref Line 5.5

We(have(addressed(EM(aIacks(on(ICs:(($  EM(listening(of(ICs(is(wellEknown((not(invesKgated(here)($  EM(observaKon(of(ICs(

#  New(setup(@(60GHz(proposed($  EM(fault(injecKon(

#  Dedicated(opKmized(probes((ferrite,(mulKple(loops)(#  In4situ(probe(characterizaKon(owing(to(dedicated(testchips(#  QuanKtaKve(model(of(probeEcircuit(coupling(#  Timing(faults(observed(on(AES,(efficiency(improved(with(new(probes(#  BitEset(and(bitEreset(demonstrated(on(smartcards(#  Embedded(EM(fault(modeling(tool(

Expected(future(improvement(in(countermeasures(against(EM(aIacks(

Conclusion&

Page 22: EMATA&HARI& - IES Institut d'Electronique fileVref Vref 50 Ω Line 0 µm Vref Vref Line 0.455 µm Metal 2 connected to V ref On-chip sensors Analog pad connected to V ref Line 5.5

Thank(you(!(