1. www.smthelp.com Electronics Industry Market Drivers Specialized computing for Military/Industrial Consumer products for personal use Mass global adoption Evolution and growth over the past 50 years 2. www.smthelp.com Electronics Industry Market Drivers Increasing Product Diversity Reduced time-to-market requirements Expectation of more features, options and flexibility (no more one size fits all) New demands create new challenges for electronics manufacturers Increased Performance/Complexity Moores law: bandwidth, processing, memory 2000 CPU: 500MHz RAM: 128MB Storage: 30GB Bandwidth: 56K bps 2010 CPU: 1GHz RAM: 512MB Storage: 32GB Bandwidth: 3G Shortened Life-Cycles Contracted market window Increased new product introductions Abbreviated product lifetime 3. www.smthelp.com End Market Drivers Slowing Pace of Lithographic Shrinks Power Ubiquitous Information Access & Control Mobile Phone & Tablets Automotive LED Lighting Mega Trends Emerging Economy Middle Class Fine Pitch Flip Chip White Goods Energy Efficiency Server & Infrastructure Wafer Level Packaging Vertical Interconnects Security & Safety Growing End Markets Technology Solution Implications Rapidly increasing signal & power density: Increasing mlcc per die , reduced formfactor, Cu Pillar Drives hi-speed, accuracy Vertical Integration: embedded, POP, SIP, TSV,eWLB Drives convergence: TAP, AB, hi accuracy die place + MLCC 4. www.smthelp.com Semiconductor Packaging Industry Market Drivers Miniaturization Increasing Product Density Reduced feature sizes Smaller, Thinner Die 2.5D & 3D Packaging Economic Viability Consumer Market Hi Volume B2B Market Mid to Hi Volume High End market Aero / Mil / Med 2000 CPU: 500MHz RAM: 128MB Storage: 30GB Bandwidth: 56K bps 2010 CPU: 1GHz RAM: 512MB Storage: 32GB Bandwidth: 3G 0 500 1000 1500 2000 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 WaferStartsperWeek (300mm) Sub 55nm Node Market Growth >= 160nm 56 - 159nm < 55nm Source: VLSI, September 2011 Increased Performance/Complexity Moores law: bandwidth, processing, memory Combining Functionality in a package 5. www.smthelp.com Semiconductor Packaging Challenges Miniaturization Increasing Product Density Reduced feature sizes Hi Accuracy, Hi Mag, FOV, Low Force Smaller, Thinner Die Force control 2.5D & 3D Packaging Force control, multi p/ns New demands create new challenges for Semiconductor manufacturers Increased Performance/Complexity Accuracy Requirements Multi component inventory Multi component process Multi Component Assembly Chip 35 um Bump, 50 um Pitch Component Stacking Economic Viability Consumer Market Hi Speed, Large Working Area Assembly B2B Market Hi Speed, Quick Conversion Manufacturing High End market Hi Accuracy, Traceability 6. www.smthelp.com APAS Advantages Miniaturization Increasing Product Density Reduced feature sizes 10 um Accuracy, .2 MPP Camera, IL7 Low Force Head Smaller, Thinner Die Il7 Low Force Head 2.5D & 3D Packaging Increased Performance/Complexity +/- 10 um Accuracy T&R, Tray, Wafer Feeding Material Handling - Substrate, Leadframe, Carrier, Boat Multi Component Assembly Material Handling Chip 35 um Bump, 50 um Pitch Component Stacking Economic Viability Consumer Market Hi Speed Placement, Large Work Area B2B Market Hi speed placement, 5 minute Conversions High End market +/- 10 um Accuracy, Traceability 7. www.smthelp.com Market Evolution Driven by Consumer Globalization 8. www.smthelp.com Market Evolution Solutions Design to Manufacturing Process Support Globalized Factory SW Integration Efficient Multi-Function SMT In-Line Automation Efficiency Automation Flexibility OEE Optimized SMT Agile SMT Line Configurability