Electronic Costing & Technology Experts · Exynos 8 will give the pros and the cons of the MCeP...

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Electronic Costing & Technology Experts

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June 2016 – Version 1 – Written by Stéphane ELISABETH

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mailto:[email protected]

Qualcomm Snapdragon 820 PoP

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Glossary1. Overview / Introduction 4

– Executive Summary

– Reverse Costing Methodology

2. Company Profile 7– Qualcomm

– Snapdragon 820 Chipset

– Snapdragon 820/810 vs. Exynos 7/8

3. Physical Analysis 14– Physical Analysis Methodology

– Samsung Galaxy S7 Teardown 16

– Exynos Die removal

– Snapdragon Die removal

– Snapdragon 820 Package-on-Package Analysis 23

– Snapdragon Package View, Dimensions & Marking

– Snapdragon Package Cross-Section

– Snapdragon MCeP Details cross-Section

– Exynos 8 Package-on-Package Analysis 36

– Exynos 8 Package View, Dimensions & Marking

– Exynos Package Cross-Section

– Package-on-Package Comparison 46

– Packages Comparison Overview

– Summary of physical Data

– Snapdragon Package Opening

– Exynos Package Opening

– Snapdragon 820 Die Analysis 51

– Snapdragon Die View, Dimensions & Marking

– Snapdragon Die Cross-Section

– Snapdragon Process Characteristics

– Exynos 8 Die Analysis 58

– Exynos Die View, Dimensions & Marking

– Exynos Die Cross-Section

– Exynos Die Process Characteristics

– Comparison with previous generation 65

– Exynos 7 vs. Exynos 8 PoP

– Snapdragon 810 vs. 820 PoP

– Exynos 7 vs. Exynos 8 Process

– Snapdragon 810 vs. 820 Process

4. Manufacturing Process Flow 72– Chip Fabrication Unit

– Packaging Fabrication Unit

– MCeP Reconstitution Flow

5. Cost Analysis 88– Synthesis of the cost analysis

– Main steps of economic analysis

– Yields Hypotheses

– Die Cost Analysis (Snapdragon/Exynos) 93

– Wafer Cost

– Die Cost

– Packaging Cost Analysis (Snapdragon/Exynos) 97

– Packaging Panel Cost

– Packaging Cost per process Steps

– Component Cost

– Snapdragon/Exynos Component Cost Comparison

6. Estimated Price Analysis 110– Manufacturer Financial Ratios

– Estimated Selling Price

Contact 113


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• This full reverse costing study has been conducted to provide insight on technology data,manufacturing cost and selling price of Samsung Galaxy S7 Application Processors, the QualcommSnapdragon 820 (MSM8996) and the Samsung Exynos 8 (Octa 8890).

• Located under the DRAM chip on the main board, the two processors are packaged using PoPtechnology. Depending on the region, the Galaxy S7 integrates the Exynos 8 with classic Package-on-Package (PoP) packaging or the Snapdragon 820, with Molded Core Embedded Package (MCeP)technology.

• The Qualcomm Snapdragon 820 is an embedded die package with Shinko’s packaging technology,using Copper Core Solder ball to replace the well-known Through Molded Via (TMV) technology. Inthe previous generation of the 800 series Qualcomm used Shinko’s MCeP packaging. In this report, wewill show the differences and the innovations of this package, including copper pillar flip-chip and acoreless substrate with embedded trace substrate technology. The detailed comparison with theExynos 8 will give the pros and the cons of the MCeP technology compared to standard PoP.

• Thanks to this MCeP process, Qualcomm is able to offer a very thin PoP with a high number of I/Opads. The result is a very cost-effective component that can compete with a standard PoP. The reportcompares the costs of the different approaches.

• This report also includes a technical comparison with the previous Qualcomm CPU, the Snapdragon810 and the previous Samsung CPU, the Exynos 7.


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• The Exynos processor is under theSDRAM chip in PoP mode (Package onPackage).

Exynos 8 & LPDDR4 SDRAM from Samsung

Samsung S7 Edge European Version Main Board view

Samsung S7 Edge European Version Main Board (Top view)

Samsung S7 Edge European Version Main Board (Bottom view)


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Samsung S7 US Version Main Board (Top view)

Samsung S7 US Version Main Board (Bottom view)

Samsung S7 US Version Main Board view

• The Snapdragon 820 Microprocessor isunder the DRAM chip in PoP mode(Package on Package).

Snapdragon 820 & LPDDR4 SDRAM from SK Hynix

Snapdragon 820 (MSM8996) vs. Exynos 8 (8890)

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Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimatescompleted by industry experts.

Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on themanufacturing cost (if all parameters are cumulated).

These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:

Electronic Costing & Technology Experts · Exynos 8 will give the pros and the cons of the MCeP...

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